CN101730456A - Circuit board of communication product and manufacture method thereof - Google Patents
Circuit board of communication product and manufacture method thereof Download PDFInfo
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- CN101730456A CN101730456A CN200810167453A CN200810167453A CN101730456A CN 101730456 A CN101730456 A CN 101730456A CN 200810167453 A CN200810167453 A CN 200810167453A CN 200810167453 A CN200810167453 A CN 200810167453A CN 101730456 A CN101730456 A CN 101730456A
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Abstract
The invention relates to circuit board of communication product and manufacture method thereof. The circuit board is characterized by comprising a circuit board body. The surface of the circuit board body is provided with a power crystal, a solder mask, a plurality of first openings arranged on the solder mask at intervals and located around the power crystal and a plurality welding parts respectively exposed out of each first opening, and moreover, a shield can be provided; the shield comprises a shield body and a plurality of second openings arranged on the side surface of the shield body at equidistant spacing; the shield covers the surface of the circuit board body and is welded to each welding part by adopting a local spot welding mode.
Description
Technical field
The present invention relates to a kind of (shielding) technology of covering that suppresses to disturb with noise, refer to a kind of circuit board and method for making thereof of communication product especially.
Background technology
Under broadband network development and digital technology trend, such as Wi-Fi access station (AP), mobile phone, personal digital assistant (Personal Digital Assistant, PDA), notebook computer etc. has the communication product of transmission-receiving function, can provide more convenient, more efficient and more function and service.Simultaneously, when carrying out wireless telecommunications, there is the situation of the influence that is subjected to employed electromagnetic wave of other communication system or external noise.
For instance, when wireless product carries out the wireless transmission of data under high power state, very easily the nonlinear characteristic because of active member produces high-frequency harmonic, cause Electromagnetic Interference (Electro-MagneticInterference, EMI), various countries are to have formulated relevant laws and regulations for solving this problem, with to the input of the wireless product that is not inconsistent regulation and use and limited.In view of this, the design of wireless product and manufacturer when the control circuit of design wireless product, all need consider the requirement of relevant laws and regulations.And, because also can being subjected to the signal of external electromagnetic ripple, disturbs in the circuit of wireless product itself, for example radio frequency (RadioFrequency, RF) wireless signal, and the situation that generation can't be expected.
Therefore, how to suppress to disturb and noise, become personnel's headache problem endlessly of designing and developing, and also someone's technology of proposing to be correlated with to this, for example TaiWan, China patent announcement No. 521561 patent of invention, United States Patent (USP) announces the 6th, 689, and No. 670 cases and United States Patent (USP) announce the 6th, 528, No. 866 cases etc.
In the past, be cage to be set improve foregoing problems on circuit board.As shown in Figure 1, general circuit plate 2 is to adopt surface adhering technology (Surface Mount Technology, SMT) on circuit board body 20, weld cage 22 in full weldering mode, but make on the described circuit board body of described cage 22 cover caps 20 surfaces for example portion of element of wafer, make described circuit board 2 carry out reflow (Reflow-soldering) processing procedure afterwards again by tin stove (not shown).
Yet, this kind prior art is to adopt the mode of the full weldering of single-piece, also be, with described cage 22 whole welderings extremely on described circuit board body 20, after carrying out back welding process, if find described cage 22 under element the problem of inefficacy (fail) is arranged, then need to carry out tip-off and pull down described cage 22, to change corresponding elements.Thus, not only cause the difficult problem of maintenance, and easily damage or distortion are caused in the surface of described circuit board body 20, and the cage 22 after pulling down also is difficult to reclaim use, increases manufacturing cost relatively.
Simultaneously, because when described cage 22 is covered with to described circuit board body 20, be to cover the element of below is whole, effectively loss and produce the temperature difference of the heat that when welding, produces, cause gravestone effect (Tombstone effect), thereby make the component failure that is positioned at described cage 22.
In order to solve the disappearance of the full welding technology of aforementioned single-piece, the someone has proposed the full welding technology of two-piece type, also, as shown in Figure 2, is to use underframe 24 and loam cake 26 to replace the cage 22 of aforementioned single-piece.When assembling, be the first described underframe 24 of welding on circuit board body 20, circuit board 2 ' is by the tin stove after, just cover and connect described loam cake 26, with in conjunction with described loam cake 26 to described underframe 24.
Yet, use the required the number of components of the full welding technology of this kind two-piece type to increase, cost is higher; And, because need the described underframe 24 of welding earlier, cross the tin stove and carry out secondary operations at described loam cake 26 more afterwards, increase the assembling processing procedure so relatively.
Simultaneously, full welding technology of aforementioned single-piece and the full welding technology of two-piece type all need to use scolding tin to weld, and must be noted that to avoid welding overheated and problem damage circuit board body and last element thereof.
As from the foregoing, prior art has problems, therefore, how to propose a kind of circuit board and method for making thereof of communication product, and is to avoid disadvantages of the prior art, real in desiring most ardently the technical problem of solution at present.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, the object of the present invention is to provide a kind of circuit board and method for making thereof of communication product, to simplify processing procedure and maintenance procedure.
Another object of the present invention is to provide a kind of circuit board and method for making thereof of communication product, improve product percent of pass.
Reach other purposes for achieving the above object, the technical solution used in the present invention comprises:
A kind of circuit board is applied to communication product, it is characterized in that, comprising:
Circuit board body, surface are provided with the power crystal, refuse layer, are located at interval describedly to be refused layer and is positioned at plural number first opening and the outer respectively plural weld part that is exposed at each described first opening around the described power crystal; And
Cage, cover cap on described circuit board body, plural number second opening that comprises the cover body that is soldered to each described weld part and equidistantly be opened in described cover body side.
Reach other purposes for achieving the above object, the technical solution used in the present invention also comprises:
A kind of method for making of circuit board of communication product is characterized in that, may further comprise the steps:
One circuit board body is provided, and the surface of described circuit board body is provided with the power crystal, refuses layer, is located at interval describedly refuses layer and is positioned at plural number first opening and the outer respectively plural weld part that is exposed at each described first opening around the described power crystal;
Provide a cage, plural number second opening that described cage comprises cover body and equidistantly is opened in described cover body side;
With the surface of described cage cover cap at described circuit board body; And
Adopt local spot welding mode described cage is soldered to each described weld part.
Reach other purposes for achieving the above object, the technical solution used in the present invention also comprises:
A kind of circuit board is applied to communication product, it is characterized in that, comprising:
The circuit board body, the predetermined cover cap district that is provided with the power crystal and is used to contain described power crystal;
Refuse layer, be located on the described circuit board body, and be provided with plural opening in described predetermined cover cap district spaced around; And
The plural number weld part, outer respectively being exposed on each described opening.
Compared to prior art, the circuit board that the present invention's design can be carried out local spot welding so solves the uneven problem of the heat radiation that is produced when prior art is carried out surface adhering; And, based on the design of local spot welding, in the time must pulling down cage, also only need local tip-off, and can solve the puzzlement that prior art has little time tip-off.Therefore the present invention can simplify processing procedure and maintenance procedure.Simultaneously, when using technology of the present invention, can rely on opening or other radiating parts improve reflow temperature, make inner reflow temperature even, promote product percent of pass relatively.
Description of drawings
Fig. 1 is the existing schematic diagram that single-piece welds the circuit board of cage entirely that has;
Fig. 2 is the existing schematic diagram that two-piece type welds the circuit board of cage entirely that has;
Fig. 3 a to Fig. 3 e is the method for making schematic diagram of circuit board first embodiment of the present invention;
Fig. 4 is the schematic diagram of being drawn according to circuit board second embodiment of the present invention;
Fig. 5 a and Fig. 5 b are respectively schematic perspective view and the cutaway views of another embodiment of circuit board of the present invention.
Description of reference numerals: 1,1 ' circuit board; 11 circuit board bodies; 110 power crystal; 111 predetermined cover cap districts; 113 weld parts; 1131 soldering tin materials; 115 refuse layer; 1151 openings (first opening); 13 cages; 131 cover bodies; 133 second openings; 135 radiating parts; 2,2 ' circuit board; 20 circuit board bodies; 22 cages; 24 underframes; 26 loam cakes.
Embodiment
Below be to rely on particular specific embodiment explanation embodiments of the present invention, affiliated technical field technical staff can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
It should be noted, the circuit board of present embodiment and following other embodiment is to be applied to communication product, the employed circuit board of different communication products may have a little variation, the present invention disturbs (shielding) technology of covering with noise to improve to suppressing in the circuit board, so only describe at the part that is improved at this.
Seeing also Fig. 3 a to Fig. 3 e is the schematic diagram of drawing according to first embodiment of the invention, shown in Fig. 3 a, provide a substrate 10, described substrate 10 surfaces are formed with that to be provided with the power crystal (not shown, hold the back statement) and line layer 101, in described line layer 101, then be formed with plural weld part 113.Shown in Fig. 3 b, be to form on described line layer 101 surfaces to refuse layer 115 comprehensively; Then, shown in Fig. 3 c, can be (promptly in predetermined set cage part, predetermined cover cap district, hold the back statement), form plural opening 1151 (first opening) at interval at the described layer 115 of refusing, and each described opening 1151 can expose outside each described weld part 113 respectively; Afterwards, shown in Fig. 3 d, can above each described weld part 113, form soldering tin material 1131 respectively.
It should be noted, can amass soldering tin material 1131 with Shen on the described weld part 113 of described circuit board by means of for example mould printing technology (Stencil printing technology).For instance, template (all not shown) with a plurality of grids can be set, after described template is put described soldering tin material 1131, use for example roller rollback on described template to move, or with spray pattern (Spraying), make described soldering tin material 1131 via described grid, and be that described weld part 113 forms described soldering tin material 1131.
Certainly, present embodiment is just to form plural opening 1151 (first opening) before by the tin stove, for exposing outside each described weld part 113 respectively; But in other embodiments, also can for example revise the design of aforementioned template, and directly in aforesaid predetermined cover cap district, print out required layout (promptly, disposable formation is described refuses layer 115, be formed on described each described weld part 113 of refusing the plural opening 1151 (first opening) of layer 115 and being exposed at each described opening 1151 outward at interval), be not limited to person described in the present embodiment.
Shown in Fig. 3 e, present embodiment provides a kind of circuit board 1, and described circuit board 1 comprises: circuit board body 11 has predetermined cover cap district 111; Refuse layer 115, along the edge in described predetermined cover cap district 111 and be provided with, and be interval with plural opening (first opening) 1151; And plural weld part 113, outer respectively each described opening 1151 that is exposed at.In the present embodiment, can select to be provided with earlier the power crystal 110 shown in Fig. 3 e, but also can form each described weld part 113 and after the layer 115 described power crystal 110 is set again with described refusing, and the size in described predetermined cover cap district 111 is to contain described power crystal 110 at least, but not is confined to person described in the present embodiment.Simultaneously, described power crystal 110 can be wafer, and each described opening (first opening) 1151 then is positioned at around the described power crystal 110.
Described circuit board body 11 is to be provided with described predetermined cover cap district 111 on a surface, for cage is set.In the present embodiment, described circuit board body 11 is all rectangular with described predetermined cover cap district 111, but is not to limit the present invention with this.
Each described layer 115 of refusing is green enamelled coatings, and each 113 of described weld part can be for example weld pad (pad), then is respectively equipped with soldering tin material 1131 on each described weld part 113.In the present embodiment, each described weld part 113 can corresponding be located at the edge in described predetermined cover cap district 111, and is positioned at the corner in described predetermined cover cap district 111.Simultaneously, the described weld part 113 of each of present embodiment is separated by each described layer 115 of refusing, and therefore (holds the back statement) in conjunction with cage the time, only need carry out local spot welding.
It should be noted, in the present embodiment, described predetermined cover cap district 111 is rectangular, each described weld part 113 is positioned at the corner and the dual-side in described predetermined cover cap district 111, because viewpoint according to mechanics, stress can be concentrated corner, so the corner is more than other local next fragility, so at the corner and the dual-side in described predetermined cover cap district 111 corresponding weld part 113 is set; But also can change in other embodiments, the position that is provided with of the shape in described predetermined cover cap district 111 and each described weld part 113.In other words, each described weld part 113 also can be located at difform predetermined cover cap district 111 place of stress concentration phenomenon easily takes place, but not is limited to corner or specific side; And, though present embodiment is to be that example explains so that eight weld parts 113 to be set,, two or more weld parts 113 can carry out local spot welding person as long as being set in other embodiments, be not limited to present embodiment.
In the present embodiment, described circuit board 1 is the circuit board of unassembled cage still; Certainly, described circuit board also can be and has been assembled with the circuit board of cage to described circuit board body 11.
Seeing also Fig. 4 to Fig. 5 b is the schematic diagram of drawing according to second embodiment of the invention, as shown in Figure 4, and the cage 13 that the circuit board 1 ' of present embodiment comprises circuit board body 11 and is located at described circuit board body 11.Wherein, or similar elements identical with second embodiment is with identical or similar elements symbolic representation.
Described circuit board body 11 surfaces are provided with power crystal 110, refuse layer 115, are located at interval describedly refuses layer 115 and is positioned at plural number first opening 1151 (shown in Fig. 3 b of first embodiment) and the outer respectively plural weld part 113 that is exposed at each described first opening 1151 around the described power crystal.
Described cage 13 comprises the cover body 131 that is soldered to each described weld part 113, equidistantly is opened in plural number second opening 133 of described cover body 131 sides and the plural radiating part 135 that equidistantly is opened in described cover body 131 end faces.
In the present embodiment, described cover body 131 is that the cover body with for example rectangle is the example explanation, but is not limited to rectangle, and also can be other shape persons.The width of each described second opening 133 is more than or equal to the spacing of each described first opening 1151, and distance and open height that each described second opening is 133 can design according to the frequency computation part wavelength (being 26.5GHz to the maximum) of applied communication product.In general, be converted into the wavelength formula after, A/F just can prevent the high frequency noise of most electromagnetic interference (EMI) less than 1.2mm.
For instance, described cover body 131 sides aperture opening ratio that each described second opening 133 is set should satisfy following formula:
λ=v/f ... ... .. formula 1
Wherein, λ is the wavelength of interference signal, and v is the propagation velocity (meter per second) of interference signal, and f is the frequency (Hz) of interference signal.The EMI maximum of f is 26.5GHz, and v is 3 * 10
8During meter per second, then λ is 1.2mm, and this value just can be by EMI security regulations (Safety) requirement of various countries.
Simultaneously, for the RF mechanics of communication, employing wireless local-area network (WLAN) or super wideband (UltraWide Band, when UWB) communications protocol carries out communication, the value of f is generally 2.4GHz to 5GHz among the WLAN, the value of f then is generally 3GHz to 10GHz in the UWB system, therefore as long as lower powered UWB 2 frequencys multiplication above (that is about 1.2mm) have promptly satisfied the requirement of covering external noise.In addition, no matter linearity or non-linear effects, the value of f is that (Wireless Fidelity, WIFI) λ of 2.4GHz 10 frequencys multiplication (being 5 frequencys multiplication concerning WIFI 5GHz) also is enough to cover external noise in radio facsimile.
Hence one can see that, and the width of each described second opening is can be chosen in the scope of λ to 2 * λ.
Each 135 of described radiating part can be used for providing heat radiation, though present embodiment is corresponding each described second opening 133 end face of 12 radiating parts 135 at described cover body 131 is set respectively, but that should know described radiating part 135 is provided with that position, size and quantity are also non-to be confined to present embodiment, and also can omit each described radiating part 135.Simultaneously, the aperture opening ratio of each described radiating part 135 also can be calculated by above-mentioned formula 1, and in the scope of 1 λ to 2 λ, in this no longer repeat specification.
When desire is assembled described cage 13 to described circuit board body 11, can be as shown in Figure 4, aforesaid circuit board body 11 and cage 13 are provided, the surface of described circuit board body 11 is provided with and refuses layer 115, the interval is located at described plural number first opening 1151 of layer 115 and the outer respectively plural weld part 113 that is exposed at each described first opening 1151, plural number second opening 133 that 13 of described cages comprise cover body 131 and equidistantly are opened in described cover body 131 sides refused.
Afterwards, described cage 13 is located at the surface of described circuit board body 11.In the present embodiment, the surface of described circuit board body 11 is provided with described predetermined cover cap district 111, for contraposition described cage 13 is set.Certainly, the shape in described predetermined cover cap district 111 can change with the shape of described cage 13.
At last, adopt local spot welding mode described cage 13 is soldered to each described weld part 113.In this step, but application surface adhesion technology is carried out local spot welding at each described weld part 113, so that described cage 13 is fixed to described circuit board body 11.
Shown in Fig. 5 a and Fig. 5 b, in described circuit board 1 ', equidistant second opening 133 that is provided with can prevent that the RF noise from disturbing to described cage 13 in the side, and the wavelength of the height of each described second opening 133 and the applicable communication product of width is done the optimization adjustment.Simultaneously, the usefulness that second opening 133 of described cage 13 sides and radiating part 135 all can be used as heat radiation, it is even to improve inner reflow temperature, increases the production qualification rate.In addition, with described separately each the described weld part 113 of layer 115 of refusing, must not weld in the described circuit board body 11, outlet is convenient, heat radiation is good, maintenance is easy to purpose and reach comprehensively.
Moreover, in the time of need pulling down described cage 13, also only need the pad between the described cage 13 of local tip-off and each the described weld part 113, thus, technology of the present invention more or less freely enforcement on the one hand then can solve the problem that prior art has little time the pad between the described cage of comprehensive tip-off and each described weld part on the other hand.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.
Claims (14)
1. a circuit board is applied to communication product, it is characterized in that, comprising:
Circuit board body, surface are provided with the power crystal, refuse layer, are located at interval describedly to be refused layer and is positioned at plural number first opening and the outer respectively plural weld part that is exposed at each described first opening around the described power crystal; And
Cage, cover cap on described circuit board body, plural number second opening that comprises the cover body that is soldered to each described weld part and equidistantly be opened in described cover body side.
2. circuit board according to claim 1 is characterized in that: each described layer of refusing is green enamelled coating, and each described weld part is a weld pad.
3. circuit board according to claim 1 is characterized in that: each described weld part is corresponding to the corner of described cover body.
4. circuit board according to claim 1 is characterized in that: be respectively equipped with soldering tin material on each described weld part.
5. circuit board according to claim 1 is characterized in that: the width of each described second opening is between λ to 2 * λ, described λ=v/f, wherein λ is the wavelength of interference signal, v is the propagation velocity of interference signal, and f is the frequency of interference signal, and the maximum of f is 26.5GHz.
6. circuit board according to claim 1 is characterized in that: further equidistantly offer plural radiating part at described cover body end face.
7. circuit board according to claim 6 is characterized in that: the spacing of each described radiating part is between λ to 2 * λ, described λ=v/f, wherein λ is the wavelength of interference signal, v is the propagation velocity of interference signal, and f is the frequency of interference signal, and the maximum of f is 26.5GHz.
8. the method for making of the circuit board of a communication product is characterized in that, may further comprise the steps:
One circuit board body is provided, and the surface of described circuit board body is provided with the power crystal, refuses layer, is located at interval describedly refuses layer and is positioned at plural number first opening and the outer respectively plural weld part that is exposed at each described first opening around the described power crystal;
Provide a cage, plural number second opening that described cage comprises cover body and equidistantly is opened in described cover body side;
With the surface of described cage cover cap at described circuit board body; And
Adopt local spot welding mode described cage is soldered to each described weld part.
9. the method for making of the circuit board of communication product according to claim 8 is characterized in that: be to adopt the mould printing technology to form each described layer and each described weld part refused on the surface of described circuit board body.
10. the method for making of the circuit board of communication product according to claim 8, it is characterized in that: form each described weld part earlier on the surface of described circuit board body, form the described layer of refusing again, form each described first opening to expose each described weld part at the described layer of refusing afterwards.
11. the method for making of the circuit board of communication product according to claim 8 is characterized in that: be to adopt the surface adhering technology to carry out local spot welding, described cage is soldered to each described weld part.
12. a circuit board is applied to communication product, it is characterized in that, comprising:
The circuit board body, the predetermined cover cap district that is provided with the power crystal and is used to contain described power crystal;
Refuse layer, be located on the described circuit board body, and be provided with plural opening in described predetermined cover cap district spaced around; And
The plural number weld part, outer respectively being exposed on each described opening.
13. circuit board according to claim 12 is characterized in that: each described layer of refusing is green enamelled coating, and each described weld part is a weld pad.
14. circuit board according to claim 12 is characterized in that: be respectively equipped with soldering tin material on each described weld part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101674538A CN101730456B (en) | 2008-10-13 | 2008-10-13 | Circuit board of communication product and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101674538A CN101730456B (en) | 2008-10-13 | 2008-10-13 | Circuit board of communication product and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101730456A true CN101730456A (en) | 2010-06-09 |
| CN101730456B CN101730456B (en) | 2012-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101674538A Expired - Fee Related CN101730456B (en) | 2008-10-13 | 2008-10-13 | Circuit board of communication product and manufacture method thereof |
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| Country | Link |
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| CN (1) | CN101730456B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455463A (en) * | 2016-09-30 | 2017-02-22 | 奇酷互联网络科技（深圳）有限公司 | Shielding device, manufacturing method of shielding device and electronic equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2489554Y (en) * | 2001-07-11 | 2002-05-01 | 倚天资讯股份有限公司 | Antimagnetic shield device |
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2008
- 2008-10-13 CN CN2008101674538A patent/CN101730456B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455463A (en) * | 2016-09-30 | 2017-02-22 | 奇酷互联网络科技（深圳）有限公司 | Shielding device, manufacturing method of shielding device and electronic equipment |
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| Publication number | Publication date |
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| CN101730456B (en) | 2012-11-07 |
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Granted publication date: 20121107 Termination date: 20131013 |