CN101730457A - Circuit board with shielding hood and assembling method thereof - Google Patents

Circuit board with shielding hood and assembling method thereof Download PDF

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Publication number
CN101730457A
CN101730457A CN200810167458A CN200810167458A CN101730457A CN 101730457 A CN101730457 A CN 101730457A CN 200810167458 A CN200810167458 A CN 200810167458A CN 200810167458 A CN200810167458 A CN 200810167458A CN 101730457 A CN101730457 A CN 101730457A
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CN
China
Prior art keywords
location division
circuit board
cage
grounding parts
assemble method
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Pending
Application number
CN200810167458A
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Chinese (zh)
Inventor
黄仲绍
谢青峰
余仁焕
戴振文
陈国庆
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Askey Computer Corp
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Askey Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Askey Computer Corp filed Critical Askey Computer Corp
Priority to CN200810167458A priority Critical patent/CN101730457A/en
Publication of CN101730457A publication Critical patent/CN101730457A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a circuit board with a shielding hood and an assembling method thereof. The circuit board comprises a circuit board main body and the shielding hood which is arranged at the circuit board main body; the circuit board main body and the shielding hood have corresponding a plurality of first and second positioning parts; at least one side of each first positioning part is provided with an earthing part; the shielding hood can be hooded on a first surface of the circuit board main body; each second positioning part can pass through a second surface of the circuit board main body through each first positioning part; and the tail end of the each second positioning part is in compression joint with each earthing part to finish the assembly. The circuit board with the shielding hood can be welded without using a lower frame in the prior art or a soldering tin, thereby reducing the complexity of the assembly; and the tail end of the shielding hood can be contacted with the earthing part of the second surface of the circuit board main body so as to maintain a stable positioning effect.

Description

Circuit board and assemble method thereof with cage
Technical field
The present invention suppresses to disturb and (shielding) technology of covering of noise about a kind of, refers to a kind of circuit board and assemble method thereof with cage especially.
Background technology
Under wideband network development and digital technology trend, such as wireless network access station (AP), mobile phone, personal digital assistant (Personal Digital Assistant, PDA), notebook computer etc. has the wireless product of radio transmission-receiving function, can provide more convenient, more efficient and more function and service.Simultaneously, when carrying out wireless telecommunications, there is the situation of the influence that is subjected to employed electromagnetic wave of other wireless telecommunication system or external noise.
For instance, when wireless product carries out the wireless transmission of data under high power state, very easily the nonlinear characteristic because of active element produces high-frequency harmonic, cause electromagnetic interference (Electro-MagneticInterference, EMI), various countries are to have formulated relevant laws and regulations for solving this problem, with to the input of the wireless product that is not inconsistent regulation and use and limited.In view of this, the design of wireless product and manufacturer when the control circuit of design wireless product, all need consider the requirement of relevant laws and regulations.And, because also can being subjected to the signal of external electromagnetic ripple, disturbs in the circuit of wireless product itself, for example radio frequency (Radio Frequency, RF) wireless signal, and the situation that generation can't be expected.Therefore, how to suppress to disturb and noise, become personnel's headache problem endlessly of designing and developing.
In the past, be cage to be set improve foregoing problems on circuit board.As shown in Figure 1, general circuit plate 2 is to adopt surface adhering technology (Surface Mount Technology, SMT) on circuit board body 20, weld cage 22 in full weldering mode, but make on these circuit board body 20 surfaces of these cage 22 cover caps for example portion of element of chip, make this circuit board 2 carry out reflow (Reflow-soldering) processing procedure afterwards again by tin stove (not shown).
But, this kind prior art is to adopt the mode of the full weldering of single-piece, that is, with these cage 22 whole welderings extremely on this circuit board body 20, after carrying out back welding process, if find element under this cage 22 problem of inefficacy (fail) is arranged, then need to carry out tip-off and pull down this cage 22, to change corresponding elements.Thus, not only cause the difficult problem of maintenance, and easily damage or distortion are caused in the surface of this circuit board body 20, and the cage after pulling down also is difficult to reclaim use, increases manufacturing cost relatively.
In order to solve the disappearance of the full welding technology of aforementioned single-piece, the someone has proposed the full welding technology of two-piece type, that is, as shown in Figure 2, be to use underframe 24 and loam cake 26 to replace the cage of aforementioned single-piece.When assembling, be first this underframe 24 of welding on circuit board body 20, circuit board 2 ' is by the tin stove after, just cover and connect this loam cake 26, with in conjunction with this loam cake 26 to this underframe 24.
Yet, use the required the number of components of the full welding technology of this kind two-piece type to increase, cost is higher.Simultaneously, full welding technology of aforementioned single-piece and the full welding technology of two-piece type all need to use scolding tin to weld, and must be noted that to avoid welding overheated and problem damage circuit board body and last element thereof.
To this, the technology quasi-solution that the someone proposes the to be correlated with aforementioned disappearance of determining, for example Chinese patent is announced CN201063966Y number novel patent and U.S. Patent Publication 2008/0043453A1 application case.CN201063966Y number novel patent of China's Mainland patent announcement be with the cage cover cap to the entire circuit plate, and the terminal inside elastic arm of design is clamped the periphery of this circuit board; U.S. Patent Publication 2008/0043453A1 application case then comes the surface of cover cap local circuit plate with the cage that can pass circuit board, and the terminal outside interference structure of design fixes this cage to this circuit board.
Yet though the aforementioned patent technology need not to use scolding tin to weld, these buckling structures easily are out of shape because of high temperature in successive process, so can influence button and hold strength and cause cage to come off.
As from the foregoing, prior art has problems, hereat, how to propose a kind of circuit board and assemble method thereof with cage, and is to avoid disadvantages of the prior art, real in desiring most ardently the technical problem of solution at present.
Summary of the invention
In view of the shortcoming of above-mentioned prior art, a purpose of the present invention is to provide a kind of circuit board and assemble method thereof with cage, reduces the assembling complexity.
Another object of the present invention is to provide a kind of circuit board and assemble method thereof, so that maintenance with cage.
For reaching above-mentioned purpose and other purposes, the invention provides a kind of circuit board and assemble method thereof with cage, this circuit board with cage comprises: the circuit board body has first and second relative surface, runs through plural number first location division on this first and second surface and be located at this second surface respectively and be positioned at the respectively plural grounding parts of this at least one side in first location division; And cage, have respectively and correspondingly to pass respectively plural number second location division of this first location division, and this second location division terminal and be crimped to respectively this grounding parts respectively.
In the aforesaid circuit board, respectively this first location division is that (Plated Through Hole, PTH), respectively this grounding parts is ground mat (pad) to via.Simultaneously, respectively this second location division that this cage can comprise cover body and be positioned at this cover body edge and extend downwards, wherein, respectively this second position point is in the edge in the corner of this cover body.In addition, the length of this second location division adds the total length of this corresponding grounding parts smaller or equal to this first location division, and the quantity of this second location division is the quantity smaller or equal to this first location division, this second location division terminal smooth to this grounding parts.
The present invention provides a kind of assemble method with circuit board of cage again, this assemble method comprises: a circuit board body is provided, and this circuit board body comprises first and second relative surface, run through plural number first location division on this first and second surface and be located at this second surface respectively and be positioned at the respectively plural grounding parts of this at least one side in first location division; One cage is provided, and this cage comprises corresponding respectively respectively plural number second location division of this first location division; This cage is covered at this first surface, and respectively then can be via this first location division respectively and passes this second surface in this second location division; And make respectively the end of this second location division is bent to respectively this grounding parts of contact.
In aforesaid assemble method, can select curved respectively this second location division of guide, flattening respectively again, this second location division extremely contacts respectively this grounding parts; Perhaps can be directly this second location division be respectively flattened to contact this grounding parts respectively.Simultaneously, in abovementioned steps, can make the terminal smooth of this second location division respectively to this grounding parts.In addition, respectively this first location division can be for example via, and wherein, respectively this first location division is coated with and is selected from the wherein a kind of coating that comprises copper, tin, reaches group that nickel is formed.
Compared to prior art, the present invention designs the cage that end can pass the circuit board body, make cage be bonded to the circuit board body, and do not need to use underframe and need not use scolding tin and weld as prior art, reduce the assembling complexity by this, and the end of this cage can contact the grounding parts of the second surface that is positioned at the circuit board body, keeps firm locating effect.Simultaneously, when using technology of the present invention, need not to carry out the tip-off program and be the element on the replaceable circuit board, be convenient to maintenance relatively.
Description of drawings
Fig. 1 is the existing schematic diagram that single-piece welds the circuit board of cage entirely that has;
Fig. 2 is the existing schematic diagram that two-piece type welds the circuit board of cage entirely that has;
Fig. 3 is the decomposing schematic representation of circuit board one embodiment of the present invention;
Fig. 4 a is the schematic diagram behind the circuit board of assembly drawing 3;
Fig. 4 b is the posterior view for Fig. 4 a;
Fig. 4 c is the lateral plan for Fig. 4 a.
Description of reference numerals:
The 1-circuit board; 11-circuit board body; The 111-first surface; The 113-second surface; The 1131-recess; 115-first location division; The 117-grounding parts; The 13-cage; The 131-cover body; 133-second location division; The 135-opening; 2,2 '-circuit board; 20-circuit board body; The 22-cage; The 24-underframe; The 26-loam cake.
Embodiment
Below be by particular specific embodiment explanation embodiments of the present invention, have in the affiliated technical field know usually the knowledgeable can be disclosed by this specification within appearance understand other advantages of the present invention and effect easily.
See also Fig. 3 to Fig. 4 c, it is for complying with the have circuit board of cage and the schematic diagram that assemble method one embodiment is drawn thereof of the present invention, as shown in Figure 3, the circuit board 1 of the present embodiment cage 13 that comprises circuit board body 11 and be located at this circuit board body 11.
This circuit board body 11 has opposite first 111 and second surface 113, run through plural number first location division 115 of this first surface 111 and second surface 113 and be located at this second surface 113 respectively and be positioned at the respectively plural grounding parts 117 of these first location division, 115 at least one sides.In present embodiment, respectively this first location division 115 is through holes, preferable can be via (Plated Through Hole, PTH), and can be in respectively being coated with copper, tin, nickel or other equivalent coating in this first location division 115, to increase the ground connection effect.Respectively 117 of this grounding parts can be ground mat (pad), and respectively this grounding parts 117 is to be located at the hole wall side that this first location division 115 respectively is positioned at this second surface 113.In addition, shown in Fig. 4 b, respectively the shape of this grounding parts 117 can be identical or different, and for example can be T shape, but L shaped or other voltage supply connect the equivalent shapes of these cage 13 ends to this grounding parts, as long as the contact-making surface of these cage 13 terminal these second surfaces 113 of suitably contact can be provided, increase ground connection effect person by this, all be applicable to the present invention.
It should be noted, can be in the processing procedure of circuit board manufacturing form respectively this first location division 115 and this grounding parts 117 respectively in the lump, and can be any prior art with the technology of this grounding parts 117 respectively, so much more no longer to explain in this owing to form respectively this first location division 115.
This cage 13 is made of cover body 131, the opening 135 that is positioned at the edge of this cover body 131 and plural number second location division 133 of extending downwards and is located at these cover body 131 sides.In present embodiment, this cover body 131 is that the cover body with for example rectangle is the example explanation, but is not limited to rectangle, and also can be other shapes.Shown in Fig. 3 and Fig. 4 b, respectively this second location division 133 can be for example reference column, and correspondence is passed respectively this first location division 115 respectively.In this, respectively these cover body 131 edges are meant the edge in the corner that is positioned at this cover body 131, that is respectively the corner near this cover body 131 can corresponding be located in this second location division 133, and respectively the end of this second location division 133 is to be crimped to this grounding parts 117.In present embodiment, respectively the end of this second location division 133 (comprising the part of passing this second surface 133) is smooth to this grounding parts 117; Only, but also part is smooth in other embodiment, that is smooth fully ground connection effect is best, also can be grounded effect but part is smooth, so its smooth state is not only to exceed with the present embodiment those shown.
135 of this openings can be used for providing heat radiation, though present embodiment is four openings 135 to be set in the side of this cover body 131 respectively, that should know this opening 135 is provided with position, size, and the also non-present embodiment that is confined to of quantity.
Simultaneously, the length of this second location division 133 adds the total length of corresponding grounding parts 117 in the present embodiment less than this first location division 115, that is, this first location division 115 can be passed in this second location division 133, and protrude from outside this second surface 113, and the end of this second location division 133 still is positioned at the respectively scope of this grounding parts 117 after being crimped to this grounding parts 117; But in other embodiment, the length of this second location division 133 also can equal the total length that this first location division 115 adds corresponding grounding parts 117, but not is confined to person shown in the present embodiment.
When desire is assembled this cage 13 to this circuit board body 11, can be as shown in Figure 3, aforesaid circuit board body 11 and cage 13 are provided, this circuit board body 11 has opposite first 111 and second surface 113, run through plural number first location division 115 of this first surface 111 and second surface 113 and be located at this second surface 113 respectively and be positioned at the respectively plural grounding parts 117 of these first location division, 115 at least one sides, and 13 of this cages comprise corresponding respectively respectively plural number second location division 133 of this first location division 115.
In abovementioned steps, can select this cage 13 to this circuit board body 11 is individually fixed in a tool for stitching (not shown), the tool platform that is used to provide pressing to support, guiding can be provided this tool for stitching, and respectively this second location division 133 is to respectively the contraposition mechanism of this first location division 115 and the pressing structure (all not shown) that is used for evenly pressing down, and this tool platform can avoid twisting this circuit board body 11 in order to keep suitable pressing power.
Then, shown in Fig. 4 a, this cage 13 can be covered at this first surface 111, order respectively this second location division 133 is passed this second surface 113 via this first location division 115 respectively.In this step, can be directed to by this contraposition mechanism prior respectively this second location division 133 before pressing and desire crooked direction.
Afterwards, making respectively, the end of this second location division 133 is bent to the corresponding grounding parts 117 of contact.In present embodiment, the end of bent respectively this second location division 133 is to the corresponding grounding parts 117 of contact, shown in Fig. 4 b.In this, can will be respectively this second location division 133 prebend after suitable direction, utilize aforesaid even pressing structure to make respectively that this second location division 133 is smooth on the second surface 113 of this circuit board body 11, shown in Fig. 4 c.Simultaneously, for making pressing power uniformity, can use air pressure pressing or other equivalent way to substitute artificial pressing.
Will be appreciated that aforementioned tool for stitching needs the replaceable lower support tool for stitching structure that goes up because of each product construction is different, increase shared property by this.Simultaneously, though in the present embodiment quantity of this second location division 133 be to equal this first location division 115; But in other embodiment, the quantity of this second location division 133 also can be less than this first location division 115.Thus, the dimensions that also can be chosen in these circuit board body 11 corresponding different cages is provided with this first location division 115, that is different cages can be applicable on the identical circuit board, to increase shared property.
Moreover, in present embodiment curved respectively this second location division of guide, flatten the respectively grounding parts of extremely contact correspondence of this second location division again; But in other embodiment, also can be directly this second location division be respectively flattened to the corresponding grounding parts of contact, or adopt other modes respectively to pass respectively and flattened after this first location division in this second location division.
Above embodiment is illustrative principle of the present invention and effect thereof only, but not is used to limit the present invention.Have in the technical field under any and know that usually the knowledgeable all can be under spirit of the present invention and category, the foregoing description is modified and changed.Therefore, have in the technical field under such as and know that usually the knowledgeable modifies or changes not breaking away from all equivalences of being finished under disclosed spirit and the technological thought, must be contained by claim scope of the present invention.

Claims (14)

1. the circuit board with cage is characterized in that, comprising:
The circuit board body has first and second relative surface, runs through plural number first location division on this first and second surface and be located at this second surface respectively and be positioned at the respectively plural grounding parts of this at least one side in first location division; And
Cage has respectively and correspondingly to pass respectively plural number second location division of this first location division, and this second location division terminal and be crimped to corresponding grounding parts respectively.
2. circuit board according to claim 1 is characterized in that, this first location division is a via.
3. circuit board according to claim 1 is characterized in that this grounding parts is a ground mat.
4. circuit board according to claim 1 is characterized in that this cage comprises cover body, and respectively this second location division that is positioned at this cover body edge and extends downwards.
5. circuit board according to claim 4 is characterized in that, respectively this second position point is in the edge in the corner of this cover body.
6. circuit board according to claim 1 is characterized in that, the length of this second location division is less than or equal to the total length that this first location division adds this corresponding grounding parts.
7. circuit board according to claim 1 is characterized in that the quantity of this second location division is less than or equal to the quantity of this first location division.
8. circuit board according to claim 1 is characterized in that, this second location division terminal smooth to this grounding parts.
9. the assemble method with circuit board of cage is characterized in that, comprising:
One circuit board body is provided, and this circuit board body comprises first and second relative surface, runs through plural number first location division on this first and second surface, and is located at this second surface respectively and is positioned at the respectively plural grounding parts of this at least one side in first location division;
One cage is provided, and this cage comprises corresponding respectively respectively plural number second location division of this first location division;
This cage is covered at this first surface, and order respectively this second location division is passed this second surface via this first location division respectively; And
The order respectively end of this second location division is bent to the corresponding grounding parts of contact.
10. assemble method according to claim 9 is characterized in that, is curved respectively this second location division of guide, flattens the respectively grounding parts of extremely contact correspondence of this second location division again.
11. assemble method according to claim 9 is characterized in that, is that direct respectively this second location division flattens to the grounding parts of contact correspondence.
12. assemble method according to claim 9 is characterized in that, is make this second location division respectively terminal smooth to this grounding parts.
13. assemble method according to claim 9 is characterized in that, respectively this first location division is a via.
14. assemble method according to claim 13 is characterized in that, respectively this first location division is to be coated with to be selected from the wherein a kind of coating that comprises copper, tin, reaches group that nickel is formed.
CN200810167458A 2008-10-13 2008-10-13 Circuit board with shielding hood and assembling method thereof Pending CN101730457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200810167458A CN101730457A (en) 2008-10-13 2008-10-13 Circuit board with shielding hood and assembling method thereof

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Application Number Priority Date Filing Date Title
CN200810167458A CN101730457A (en) 2008-10-13 2008-10-13 Circuit board with shielding hood and assembling method thereof

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CN101730457A true CN101730457A (en) 2010-06-09

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103491752A (en) * 2012-06-07 2014-01-01 亚旭电脑股份有限公司 Electromagnetic wave shielding case and electronic device with same
CN111071902A (en) * 2018-10-19 2020-04-28 株式会社日立制作所 Elevator car and car bottom assembling method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US20040025334A1 (en) * 2002-08-06 2004-02-12 Ming Wen Method of securely fastening a shield to a circuit board
CN101170891A (en) * 2006-10-25 2008-04-30 鸿富锦精密工业(深圳)有限公司 Electronic device and its shielding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
US20040025334A1 (en) * 2002-08-06 2004-02-12 Ming Wen Method of securely fastening a shield to a circuit board
CN101170891A (en) * 2006-10-25 2008-04-30 鸿富锦精密工业(深圳)有限公司 Electronic device and its shielding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103491752A (en) * 2012-06-07 2014-01-01 亚旭电脑股份有限公司 Electromagnetic wave shielding case and electronic device with same
CN111071902A (en) * 2018-10-19 2020-04-28 株式会社日立制作所 Elevator car and car bottom assembling method
CN111071902B (en) * 2018-10-19 2021-11-19 株式会社日立制作所 Elevator car and car bottom assembling method

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