CN101728668A - Connector with housing - Google Patents
Connector with housing Download PDFInfo
- Publication number
- CN101728668A CN101728668A CN200910179491A CN200910179491A CN101728668A CN 101728668 A CN101728668 A CN 101728668A CN 200910179491 A CN200910179491 A CN 200910179491A CN 200910179491 A CN200910179491 A CN 200910179491A CN 101728668 A CN101728668 A CN 101728668A
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- shell
- housing
- connecting portion
- substrate connecting
- good weldability
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Abstract
The present invention provides a connector with housing, which has appearance requested by the customer and excellent welding property. The connector (1) with housing is provided with an insulated housing (10), a contact member (20) which is equipped to the housing (10), and an outer metal housing (30) which is equipped to the housing (10) with a mode of covering the external surface of the housing (10). The outer housing (30) is provided with a board connection part (39) welded to a printed circuit board (PCB). The external surface of the outer housing (30) is provided with a good welding layer (30b). The inner surface of the outer housing (30) is provided with a black coating (30c).
Description
Technical field
The present invention relates to be with cage adapter, this band cage adapter possesses the metal shell (shell) of the outside of covering shell (housing).
Background technology
So far, as this band cage adapter, for example known have a connector shown in Fig. 7 (with reference to patent documentation 1).Fig. 7 is mounted in the stereogram of the existing band cage adapter on the circuit substrate.
At this, each contact 120 possesses and extends in the housing 110 and with the contact site (not shown) of corresponding contact (not shown) contact with to extend to housing 110 outer and be welded on substrate connecting portion 121 on the circuit substrate 140.Each contact 120 forms by punching with bending machining metallic plate (brass sheet).
In addition, shell 130 is bent into the cross section word of falling U shape in the mode of the top and side of covering shell 110 with metal rectangular flat and constitutes.130 pairs of bands of shell cage adapter 101 is given shielding properties.1 pair of substrate connecting portion 131,131 (only illustrating the substrate connecting portion 131 of a side among Fig. 7) extends from the lower edge portion of the both sides of shell 130.Each substrate connecting portion 131 insertion and breakthrough form are formed in the 1 pair of through hole 141,141 (only illustrating the through hole 141 of a side among Fig. 7) on the circuit substrate 140.Thus, carried out shell 130 and housing 110 location with respect to circuit substrate 140.Then, each substrate connecting portion 131 be welded on each through hole 141 near, thus, the band cage adapter 101 be fixed on the circuit substrate 140.
Fig. 8 is the sectional view of a part that cuts off the shell of band cage adapter as shown in Figure 7.As shown in Figure 8, shell 130 is by forming the nickel coating 133 as basalis on the surface of mother metal 132 made of iron, forms as the tin-nickel alloy layer 134 of surface-treated layer to constitute on the surface of nickel coating 133.Then, preferred tin-nickel alloy layer 134 is the above less than 100 weight % of 75 weight % by tin, and nickel is the tin-nickel alloy composition of the ratio of components of remainder.Thus, can form by having good weldability and having sufficient stable on heating alloy and implemented surface-treated shell 130.
Patent documentation 1: Japanese kokai publication hei 11-189835 communique
Summary of the invention
Yet the band cage adapter that possesses metal shell shown in Figure 7 is sometimes as the I/O connector of e-machines such as mobile phone, PDA (Personal Digital Assistant), notebook computer, desktop computer and use.
At this, if band cage adapter 101 shown in Figure 7 is carried on the e-machine as this I/O connector, the inner face that then generally is positioned at the shell 130 of connector fitting portion becomes the appreciable visible surface of client.
As previously mentioned, because shell 130 carried out surface treatment by the alloy with good weldability, thereby, when the substrate connecting portion 131 with shell 130 is welded in the through hole 141 of circuit substrate 140, can access sufficient bed knife.
Yet, be metallochrome owing to be present in the lip-deep tin-nickel alloy layer 134 of shell 130, for example be the color close with silver color, thereby, if will carry on the e-machine that integral body is black as I/O connector with cage adapter 101, the inner face that then is positioned at the shell 130 of connector fitting portion exposes as metallochrome, and is unsatisfactory in appearance.The not satisfied in appearance meaning is meant metallochrome that the inner face at the shell 130 that is positioned at the connector fitting portion exposes and to be applied to e-machine black on the whole inconsistent, does not meet client's requirement.
On the other hand, also the surperficial integral body that comprises inner face and outside of shell 130 might be made black and integrate, not damage aesthetic appearance with the e-machine of black.For the outward appearance of shell 130 is made black, exist various methods, as main method, can list: black plating 1) coating protection film, 2), 3) film formation etc.
Yet these methods all lose or reduce the weldability of shell 130.For example, on the coating protection film, there is not weldability.In addition, forming under the situation of black coating, the kind of the plating of black nickel, black zinc, black chromium etc. is for example arranged, yet no matter the weldability under which kind of situation is compared with the coating (for example, tin coating) of common silver color, weldability is significantly reduction all.In addition, under the situation that forms black coating,, for example, manage the tin layer is formed black nickel coating etc. in its surface as basalis in order to give weldability.But, in this case, do not reach the black of desired concentration conversely again, the infringement aesthetic appearance.Under the situation that forms black coating, the thick more then color of the thickness of black coating is black more, but the thick more then weldability of the thickness of black coating reduces more.Therefore, the tin layer is also being applied under the situation of black nickel coating in its surface as basalis, if for the black that obtains desired concentration the thickness of black nickel coating is thickeied, then weldability significantly reduces.
Therefore, the present invention proposes in order to address the above problem a little, and its purpose is, a kind of band cage adapter that possesses the outward appearance of customer requirement and the shell that weldability is taken into account is provided.
In order to reach above-mentioned purpose, the band cage adapter that claim 1 of the present invention relates to, possess insulating properties housing, be installed in the contact on this housing and be installed in metal shell on the described housing in the mode of the outside that covers described housing, this shell has the substrate connecting portion that is welded on the circuit substrate, wherein, be formed with good weldability layer in the outside of described shell, be formed with black coating at the inner face of described shell.
In addition, the band cage adapter that claim 2 among the present invention relates to is characterised in that, in the described band cage adapter of claim 1, the described substrate connecting portion of described shell forms in the described good weldability layer mode relative with described circuit substrate, described shell possesses the top upper plate portion that covers described housing, the 1 pair of side plate that covers the following lower board unit of described housing and cover the two sides of described housing, described substrate connecting portion extends from described lower board unit outward direction and is provided with, and becomes the outside of the described shell that is formed with described good weldability layer below the described substrate connecting portion.
And, the band cage adapter that claim 3 among the present invention relates to is characterised in that, in the described band cage adapter of claim 1, the substrate connecting portion of described shell forms in the described good weldability layer mode relative with described circuit substrate, described shell possesses the top upper plate portion that covers described housing, the 1 pair of side plate that covers the following lower board unit of described housing and cover the two sides of described housing, described substrate connecting portion is from described side plate downward direction and extends the cross section L font that the back inward direction extends, be cross section L font described substrate connecting portion below become the outside of the described shell that is formed with described good weldability layer.
In addition, the band cage adapter that the claim 4 among the present invention relates to is characterised in that in the described band cage adapter of claim 1, ways of connecting constitutes the described substrate connecting portion of described shell with the through hole that inserts described circuit substrate.
According to the band cage adapter that the claim 1 among the present invention relates to, owing to the inner face at shell is formed with black coating, thereby color is consistent with the situation that is applied with black at goods on the whole, and is suitable in appearance, can satisfy the outward appearance of customer requirement.In addition, owing to be formed with good weldability layer in the outside of shell, thereby when the substrate connecting portion suitable with outside shell the part (being formed with the part of good weldability layer) of shell when being welded on the circuit substrate, can be accessed the bed knife of abundance.Therefore, can provide the outward appearance of customer requirement and the band cage adapter that weldability is taken into account.
In addition, the band cage adapter that relates to according to the claim 2 among the present invention, in the described band cage adapter of claim 1, the substrate connecting portion of shell forms in the good weldability layer mode relative with circuit substrate, shell possesses the top upper plate portion of covering shell, 1 pair of side plate of the following lower board unit of covering shell and the two sides of covering shell, the substrate connecting portion extends setting from the lower board unit outward direction, become the outside of the shell that is formed with good weldability layer below the substrate connecting portion, thereby can make simply and have the shell that on the face that is formed with good weldability layer, is welded on the substrate connecting portion on the circuit substrate.
And, the band cage adapter that relates to according to the claim 3 among the present invention, in the described band cage adapter of claim 1, the substrate connecting portion of shell forms in the good weldability layer mode relative with circuit substrate, shell possesses the top upper plate portion of covering shell, 1 pair of side plate of the following lower board unit of covering shell and the two sides of covering shell, the substrate connecting portion is the cross section L font that extends back inward direction extension from the side plate downward direction, be cross section L font the substrate connecting portion below become the outside of the shell that is formed with good weldability layer, thereby can make simply and have the shell that on the face that is formed with good weldability layer, is welded on the substrate connecting portion on the circuit substrate.
In addition, the band cage adapter that relates to according to the claim 4 among the present invention, in the described band cage adapter of claim 1, ways of connecting constitutes the substrate connecting portion of shell with the through hole that inserts circuit substrate, thereby the substrate connecting portion can be inserted in the through hole of circuit substrate and weld.At this moment,, in the length range of abundance, weld, so, can access sufficient weld strength along the depth direction of through hole if on the part suitable substrate connecting portion (being formed with the part of good weldability layer) with outside shell.
Description of drawings
Fig. 1 is the stereogram of the 1st execution mode of the band cage adapter that the present invention relates to.
Fig. 2 has shown the band cage adapter of Fig. 1, (A) is vertical view, (B) is right view, (C) is front view, (D) is rearview.
Fig. 3 is the sectional view along the 3-3 line among Fig. 2 (C).
Fig. 4 is the amplification sectional view that cuts off the part of the upper plate portion that constitutes shell.
Fig. 5 is the stereogram that is used to make the metallic plate of shell.
Fig. 6 is the stereogram of a part of the 2nd execution mode of the band cage adapter that the present invention relates to.
Fig. 7 is mounted in the stereogram of the existing band cage adapter on the circuit substrate.
Fig. 8 is the sectional view of a part that cuts off the shell of band cage adapter as shown in Figure 7.
Symbol description
1: the band cage adapter
10: housing
20: contact
30: shell
30b: good weldability layer
30c: black coating
31: upper plate portion
32: lower board unit
33: side plate
39,39 ': the substrate connecting portion
PCB: circuit substrate
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 1 is the stereogram of the 1st execution mode of the band cage adapter that the present invention relates to.Fig. 2 has shown the band cage adapter of Fig. 1, (A) is vertical view, (B) is right view, (C) is front view, (D) is rearview.Fig. 3 is the sectional view along the 3-3 line among Fig. 2 (C).
In Fig. 1, band cage adapter (below, abbreviate connector as) 1 possess insulating properties housing 10, be installed in a plurality of contacts 20, metal shell 30 on the housing 10.Connector 1 is mounted on the circuit substrate PCB (with reference to Fig. 2 (C)), for example as the I/O connector of e-machines such as mobile phone, PDA (Personal Digital Assistant), notebook computer, desktop computer and use.
At this, housing 10 possesses the body 11 of the almost rectangular shape that extends more longways along left and right directions (left and right directions among Fig. 2 (C)), tabular the prolonging that extends to the place ahead (left Fig. 3) from body 11 portion 12.Housing 10 forms by the resin of shaping insulating properties.Below prolonging of housing 10 portion 12, be formed with a plurality of contact accepting grooves 13 of 1 row shape.
In addition, as shown in Figure 3, each contact 20 possesses fixed part 21 on the body 11 that is fixed on housing 10, extends to the contact site 22 in the place ahead, extends to the substrate connecting portion 23 at rear after being bent to the below, right angle from the rear end of fixed part 21 from fixed part 21.Each contact 20 forms by punching with the bending machining metallic plate.As shown in Figure 3, contact site 22 is housed in the contact accepting groove 13, and the leading section of contact site 22 is fixed on and prolongs in the portion 12.When not chimeric with the corresponding connector that shows among the figure, contact site 22 following be located at corresponding connector on corresponding contact contact.Be welded to the conductive welding spots (pad) on the circuit substrate PCB below the part that extends to the rear of substrate connecting portion 23.
And 30 pairs of connectors 1 of shell are given shielding properties, are installed on the housing 10 in the mode of the outside of covering shell 10.Shell 30 possesses upper plate portion 31, lower board unit 32 and 1 pair of side plate 33,33.The manufacture method of shell 30 is described in the back.The body 11 of upper plate portion 31 covering shells 10 and prolonging portion 12 above.The body 11 of lower board unit 32 covering shells 10 and prolonging portion 12 below.1 pair of side plate 33,33 connects the left and right edges of upper plate portion 31 and the left and right edges of lower board unit 32 respectively, and the body 11 of covering shell 10 and prolong the two sides that portion 12.In the left and right edges of the lower board unit 32 of shell 30, be provided with outward direction and extend the 1 pair of substrate connecting portion 39 that is provided with.Each substrate connecting portion 39 is cut off with the mode of extending near the outward direction left and right edges of the lower board unit 32 of shell 30 side plate 33 from shell 30.And, as described later, become the outside of the shell 30 that is formed with good weldability layer 30b below each substrate connecting portion 39.Be welded to below each substrate connecting portion 39 on the solder joint on the circuit substrate PCB, thus connector 1 be fixed on the circuit substrate PCB.
In addition, at the leading edge separately of upper plate portion 31, lower board unit 32 and 1 pair of side plate 33,33 of shell 30, be provided with the chimeric change that is used for making the corresponding connectors that does not show with figure and be easy to import guide portion 34,35,36,36. Importing guide portion 34,35,36,36 forms in the mode that the leading edge separately from upper plate portion 31, lower board unit 32 and 1 pair of side plate 33,33 extends to the place ahead and foreign side respectively.And backplate 38 extends downwards via 1 pair of plate 37,37 from the back edge of the upper plate portion 31 of shell 30.
Fig. 4 is the amplification sectional view that cuts off the part of the upper plate portion that constitutes shell.
At this, outside at shell 30, promptly, be formed with good weldability layer 30b in the outside of all formation portions that constitute shell 30 ( upper plate portion 31,32,1 pair of side plate 33 of lower board unit, substrate connecting portion 39, plate 37, backplate 38, importing guide portion 34,35,36).On the other hand,, promptly constitute the inner face of all formation portions of shell 30, be formed with black coating 30c at the inner face of shell 30.In Fig. 4, shown the state that the part of upper plate portion 31 is cut off, upper plate portion 31 is by constituting as the iron plate 30a of mother metal, the good weldability layer 30b that is formed at the outside (top) of iron plate 30a, the black coating 30c that is formed at the inner face (following) of iron plate 30a.Though show among the figure, the formation portion of the shell 30 beyond the upper plate portion 31 is similarly also by constituting as the iron plate 30a of mother metal, the good weldability layer 30b that is formed at the outside of iron plate 30a, the black coating 30c that is formed at the inner face of iron plate 30a.
In addition, as good weldability layer 30b, as long as weldability well, for example, can list tin coating, scolding tin coating, gold plate etc.
In addition, as black coating 30c,, for example, can list black chrome plating, black nickel coating, black zinc coating, black tin-nickel alloy layer, black zinc-nickel alloy coating, black chromium-nickel alloy coating etc. so long as the coating of black gets final product.
And about the suitable thickness of coating, good weldability layer 30b is 1～10 μ m under the situation of tin coating, and black coating 30c is 1～20 μ m.
Make this shell 30 as follows.Fig. 5 is the stereogram that is used to make the metallic plate of shell.
At first, as shown in Figure 5, be manufactured on the metallic plate 40 that forms black coating 40c on the surface of iron plate 40a and on the back side of iron plate 40a, form good weldability layer 40b.
Then, metallic plate 40 is punched the shape that becomes to be fit to shell 30 shapes.
Then, as shown in Figure 1, with black coating 40c (black coating 30c) at inner face, good weldability layer 40b (good weldability layer 30b) mode is outside carried out bending machining to the metal blank of being punched by metallic plate 40 (blank) (shell 30), engages two ends in seam (seam) portion 41 of the lower board unit 32 of shell 30.Thus, finish shell 30.
When making connector 1, on the housing 10 that a plurality of contacts 20 are installed, can become the inboard with the inner face of housing 30, the outside of housing 30 becomes the mode in the outside housing 30 is installed.
By below each substrate connecting portion 39 of shell 30, being welded on the solder joint on the circuit substrate PCB, and with on the solder joint that is welded on below the substrate connecting portion 23 of each contact 20 on the circuit substrate PCB, thereby the connector 1 that will so make is mounted on the circuit substrate PCB.
At this, be formed with good weldability layer 30b in the outside of housing 30, the substrate connecting portion 39 of housing 30 forms in the good weldability layer 30b mode relative with circuit substrate PCB.That is, owing to below substrate connecting portion 39, be formed with good weldability layer 30b, thereby when on the solder joint that substrate connecting portion 39 is welded on the circuit substrate PCB, can access the bed knife of abundance.
Be mounted on connector 1 on the circuit substrate PCB for example as the I/O connector of e-machines such as mobile phone, PDA, notebook computer, desktop computer and use, and be installed in the framework of above-mentioned e-machine.At this moment, the chimeric surface of connector 1 (front) becomes the appreciable visible surface of client.
In the connector 1 of present embodiment, owing to be formed with black coating 30c at the inner face of shell 30, thereby color is consistent with the situation that is applied with black at goods on the whole, suits in appearance, can satisfy the outward appearance of customer requirement.
In addition, even the weldability of the black coating 30c of the inner face of shell 30 is inadequate, owing to be formed with weldability layer 30b in the outside of shell 30, and the substrate connecting portion 39 of shell 30 forms in the good weldability layer 30b mode relative with circuit substrate PCB, thereby the bed knife when being welded on substrate connecting portion 39 on the solder joint on the circuit substrate PCB does not have problems.Therefore, the connector 1 of present embodiment can provide the outward appearance of customer requirement and the band cage adapter that weldability is taken into account.
Then, under the situation of black coating, in order to keep weldability, the control of its color is generally inadequate.As previously mentioned, under the situation that forms black coating, the thick more then color of the thickness of black coating is black more, but the thick more then weldability of the thickness of black coating reduces more.But in the present embodiment, the inner face of the shell 30 that black coating 30c is positioned at does not weld, thereby can increase the degree of freedom of color control.
In addition, in the present embodiment, the substrate connecting portion 39 of shell 30 extends setting from lower board unit 32 outward directions, become the outside of the shell 30 that is formed with good weldability layer below the substrate connecting portion 39, thereby can make simply and have the shell that the face that is positioned at good weldability layer 30b is welded to the substrate connecting portion on the circuit substrate PCB.
Below, the 2nd execution mode of the band cage adapter that explanation the present invention relates to reference to Fig. 6.Fig. 6 is the stereogram of a part of the 2nd execution mode of the band cage adapter that the present invention relates to.
Band cage adapter shown in Figure 6 (below, abbreviating connector as) 2 basic comprising is identical with band cage adapter 1 shown in Figure 1, but the method to set up difference of substrate connecting portion.Therefore, the method to set up of substrate connecting portion only is described, then omits explanation about other formation.
In Fig. 6, on 1 pair of side plate 33,33 (only illustrating a side among Fig. 6) of shell 30, be provided with 1 pair of substrate connecting portion 39 ', 39 '.Each substrate connecting portion 39 ' is cut off with the mode of extending near the downward direction lower limb of the side plate 33 of shell 30 lower board unit 32 from shell 30.Each substrate connecting portion 39 ' is the cross section L font that extends back inward direction extension near the downward direction lower limb of side plate 33.Then, be cross section L font each substrate connecting portion 39 ' below become the outside of the shell 30 that is formed with good weldability layer 30b.Be welded to below each substrate connecting portion 39 ' on the solder joint on the circuit substrate PCB, thus, connector 2 be fixed on the circuit substrate PCB.
In the connector 2 of the 2nd execution mode, substrate connecting portion 39 ' is the cross section L font that extends back inward direction extension from side plate 33 downward directions, be cross section L font substrate connecting portion 39 ' below become the outside of the shell 30 that is formed with good weldability layer 30b, thereby can make simply and have the shell that the face that is positioned at good weldability layer is welded to the substrate connecting portion on the circuit substrate.
In addition, identical with connector 1, connector 2 is formed with black coating 30c at the inner face of shell 30, thereby color is consistent with the situation that is applied with black at e-machine on the whole, and is suitable in appearance, can satisfy the outward appearance of customer requirement.
In addition, even the weldability of the black coating 30c of the inner face of shell 30 is inadequate, owing to be formed with weldability layer 30b in the outside of shell 30, and the substrate connecting portion 39 ' of shell 30 forms in the good weldability layer 30b mode relative with circuit substrate PCB, thereby the bed knife when being welded on substrate connecting portion 39 ' on the solder joint on the circuit substrate PCB does not have problems.Therefore, the connector 2 of present embodiment can provide the outward appearance of customer requirement and the band cage adapter that weldability is taken into account.
More than, embodiments of the present invention have been described, but the present invention is not limited to this, can carry out various changes, improvement.
For example, the method to set up of the substrate connecting portion of shell 30 is not limited to method to set up illustrated in figures 1 and 2, can be (as shown in Figure 7) the so-called DIP type that connects in the through hole (through hole) that inserts circuit substrate.In this case, on the part suitable substrate connecting portion (being formed with the part of black coating) with inner face shell, weldability reduces, if but on the part suitable substrate connecting portion (being formed with the part of good weldability layer) with outside shell, along the depth direction of through hole and in the length range of abundance, weld, so, can access sufficient weld strength.In addition, in this case, the substrate connecting portion of shell 30 does not form in the good weldability layer mode relative with circuit substrate.
Claims (4)
1. be with cage adapter for one kind, possess insulating properties housing, be installed in the contact on this housing and be installed in metal shell on the described housing in the mode of the outside that covers described housing, this shell has the substrate connecting portion that is welded on the circuit substrate, wherein
Be formed with good weldability layer in the outside of described shell, be formed with black coating at the inner face of described shell.
2. band cage adapter according to claim 1, it is characterized in that, the described substrate connecting portion of described shell forms in the described good weldability layer mode relative with described circuit substrate, described shell possesses the top upper plate portion that covers described housing, the following lower board unit that covers described housing and the 1 pair of side plate that covers the two sides of described housing, described substrate connecting portion extends from described lower board unit outward direction and is provided with, and becomes the outside of the described shell that is formed with described good weldability layer below the described substrate connecting portion.
3. band cage adapter according to claim 1, it is characterized in that, the substrate connecting portion of described shell forms in the described good weldability layer mode relative with described circuit substrate, described shell possesses the top upper plate portion that covers described housing, the 1 pair of side plate that covers the following lower board unit of described housing and cover the two sides of described housing, described substrate connecting portion is from described side plate downward direction and extends the cross section L font that the back inward direction extends, be cross section L font described substrate connecting portion below become the outside of the described shell that is formed with described good weldability layer.
4. band cage adapter according to claim 1 is characterized in that, ways of connecting constitutes the described substrate connecting portion of described shell with the through hole that inserts described circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008-263683 | 2008-10-10 | ||
| JP2008263683A JP5149762B2 (en) | 2008-10-10 | 2008-10-10 | Connector with shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101728668A true CN101728668A (en) | 2010-06-09 |
| CN101728668B CN101728668B (en) | 2013-07-24 |
Family
ID=42255307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910179491 Expired - Fee Related CN101728668B (en) | 2008-10-10 | 2009-10-09 | Connector with housing |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5149762B2 (en) |
| CN (1) | CN101728668B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104112920A (en) * | 2013-04-18 | 2014-10-22 | 日本压着端子制造株式会社 | Interface Connector |
| CN103633476B (en) * | 2012-10-04 | 2017-07-21 | 连展科技电子（昆山）有限公司 | Electric connector and its shell and connection interface of electronic device using the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5525332B2 (en) * | 2010-05-20 | 2014-06-18 | ホシデン株式会社 | Shield case, connector and electronic equipment |
| TWI508392B (en) | 2010-03-26 | 2015-11-11 | Hosiden Corp | Shields, connectors and electronic machines |
| KR101258546B1 (en) | 2011-11-23 | 2013-05-02 | 엘에스엠트론 주식회사 | Method for fabricating a receptacle connector improved in matching-characteristics |
| JP2020136017A (en) * | 2019-02-18 | 2020-08-31 | 大和電機工業株式会社 | Electrical connection member and solid-state device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11189835A (en) * | 1997-12-25 | 1999-07-13 | Jst Mfg Co Ltd | Tin-nickel alloy, and parts surface-treated with this alloy |
| CN2793982Y (en) * | 2005-04-13 | 2006-07-05 | 连展科技（深圳）有限公司 | Electric connector |
| CN101640327A (en) * | 2008-08-01 | 2010-02-03 | 和硕联合科技股份有限公司 | Electrical connector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2770241B2 (en) * | 1989-09-06 | 1998-06-25 | 日新製鋼株式会社 | Manufacturing method of conductive coated black plated steel sheet |
-
2008
- 2008-10-10 JP JP2008263683A patent/JP5149762B2/en not_active Expired - Fee Related
-
2009
- 2009-10-09 CN CN 200910179491 patent/CN101728668B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11189835A (en) * | 1997-12-25 | 1999-07-13 | Jst Mfg Co Ltd | Tin-nickel alloy, and parts surface-treated with this alloy |
| CN2793982Y (en) * | 2005-04-13 | 2006-07-05 | 连展科技（深圳）有限公司 | Electric connector |
| CN101640327A (en) * | 2008-08-01 | 2010-02-03 | 和硕联合科技股份有限公司 | Electrical connector |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633476B (en) * | 2012-10-04 | 2017-07-21 | 连展科技电子（昆山）有限公司 | Electric connector and its shell and connection interface of electronic device using the same |
| CN104112920A (en) * | 2013-04-18 | 2014-10-22 | 日本压着端子制造株式会社 | Interface Connector |
| US9343840B2 (en) | 2013-04-18 | 2016-05-17 | J.S.T. Mfg. Co., Ltd. | Interface connector |
| CN104112920B (en) * | 2013-04-18 | 2017-04-12 | 日本压着端子制造株式会社 | Interface Connector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010092786A (en) | 2010-04-22 |
| CN101728668B (en) | 2013-07-24 |
| JP5149762B2 (en) | 2013-02-20 |
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