JP2020136017A - Electrical connection member and solid-state device - Google Patents

Abstract

To provide an electrical connection member capable of performing a solder connection even if a solder connection part is coated with a black metal layer, and provide a solid-state device.SOLUTION: An electrical connection member 1a includes: a shell 2 which is a connector 1 as a metal member 2a; an insulation member 3 arranged inside of the shell 2; and a contact 4 held by the insulation member 3. In an inner surface 26 and an outer surface 27 of the shell 2, both a solder connection part 25 and a non-connection part 25a which is not used for the solder connection are coated by a lamination film 5 of a black metal layer 53. In the lamination film 5, a semiconductor connection metal layer 52 having an excellent solder property and the black metal layer are sequentially laminated. Therefore, since a solder is contacted to the semiconductor connection metal layer 52 via a braking part of the black metal layer generated by a thermal expansion at the solder connection, the solder connection in the solder connection part 25 can be performed.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electrical connection member to which electrical connection is made by solder, and a solid-state device.

In an electrical connection member that is electrically connected by solder, it is desirable to form a black plating layer because of the problem that the metallic color of the non-connection part that is not used for solder connection is conspicuous and that reflection occurs. May be In this case, the black plating layer is usually considered to have low solderability, and the black plating layer is not formed at the solder connection portion.

For example, when a connector used as a USB socket or the like is mounted on an electronic device, the metallic color of the inner surface of the shell that covers the contact is conspicuously impaired in appearance. A technique has been proposed in which a black plating layer is not formed on a portion of the shell where solder connection is performed (see Patent Document 1).

JP-A-2010-92786

However, in order to cover only the inner surface of the shell with the black plating layer, it is necessary to mask one surface of the metal plate constituting the shell during the plating process, which causes a problem that a great deal of time and effort is required.

In view of the above problems, an object of the present invention is to provide an electrical connection member and a solid-state device capable of performing solder connection even when the solder connection portion is covered with a black metal layer.

In order to solve the above problems, one aspect of the present invention is an electrical connecting member in which a solder connecting portion to be solder-connected and a non-connecting portion not used for solder connection are provided on a metal member. It is characterized in that at least a part of the connecting portion and the solder connecting portion are each covered with a laminated film in which a metal layer for solder connection containing tin or silver as a main component and a black metal layer are laminated in this order. ..

In the electrical connection member according to the present invention, since at least a part of the non-connection portion of the metal member and the solder connection portion are covered with a laminated film of a black metal layer, problems such as conspicuous metal color occur. It's hard to do. In this case, the solder connection portion is covered with a laminated film of black metal layers, and in the laminated film, a metal layer for solder connection containing tin or silver as a main component and a black metal layer are laminated in this order. Therefore, even if the solderability of the black metal layer is low, when the solder connection portion is soldered, the heat causes the metal layer for solder connection to expand and the black metal layer to break, and the solder is soldered from the broken portion. It is in contact with the connecting metal layer. Therefore, even when the solder connection portion is covered with the black metal layer, the solder connection can be performed at the solder connection portion.

In the present invention, the solder connection metal layer is a tin layer, and the black metal layer is an alloy layer of tin and nickel.

In the present invention, the portion of the laminated film covered with the solder connecting portion can adopt an embodiment in which the thickness of the solder connecting metal layer is thicker than that of the portion covered with the non-connecting portion. .. According to this aspect, when the solder connection portion is solder-connected, the metal layer for solder connection expands greatly due to the heat, so that the black metal layer is easily broken. Therefore, the solder comes into contact with the metal layer for solder connection from the broken portion of the black metal layer.

In the present invention, in the laminated film, the portion covered with the solder connecting portion can adopt an embodiment in which the thickness of the black metal layer is thinner than the portion covered with the non-connecting portion. According to such an aspect, when the connecting portion is solder-connected, the metal layer for solder connection is greatly expanded by the heat, so that the black metal layer is easily broken. Therefore, the solder comes into contact with the metal layer for solder connection from the broken portion of the black metal layer.

In the present invention, the portion of the laminated film covered with the solder connecting portion can adopt an embodiment in which the thickness of the solder connecting metal layer is equal to or larger than the thickness of the black metal layer. According to this aspect, when the solder connection portion is solder-connected, the metal layer for solder connection expands greatly due to the heat, so that the black metal layer is easily broken. Therefore, the solder comes into contact with the metal layer for solder connection from the broken portion of the black metal layer.

In the present invention, the solder connecting portion and the non-connecting portion may be provided on opposite surfaces of the metal member.

In a solid-state device in which an electrical connection member according to the present invention is connected to a wiring board, the solder that electrically connects the solder connection portion and the wiring board is the said of the laminated film coated on the solder connection portion. It is characterized in that it is in contact with the solder connection metal layer via a broken portion of the black metal layer.

In the present invention, since at least a part of the non-connecting portion of the metal member and the solder connecting portion are covered with a laminated film of a black metal layer, problems such as conspicuous metal color are unlikely to occur. In this case, the solder connection portion is covered with a laminated film of black metal layers, and in the laminated film, a metal layer for solder connection containing tin or silver as a main component and a black metal layer are laminated in this order. Therefore, even if the solderability of the black metal layer is low, when the solder connection portion is soldered, the heat causes the metal layer for solder connection to expand and the black metal layer to break, and the solder is soldered from the broken portion. It is in contact with the connecting metal layer. Therefore, even when the solder connection portion is covered with the black metal layer, the solder connection can be performed at the solder connection portion.

The perspective view which shows typically one aspect of the electric connection member to which this invention is applied. FIG. 5 is a cross-sectional view schematically showing the configuration of the electrical connection member shown in FIG. An explanatory view of a black metal layer or the like formed on a metal member of the electrical connection member shown in FIG. 1. An explanatory view schematically showing a state in which a solder connection portion of an electrical connection member shown in FIG. 1 is solder-connected to a wiring board. Explanatory drawing of the metal plate used for manufacturing the electrical connection member shown in FIG.

Embodiments of the present invention will be described with reference to the drawings. In explaining the embodiment of the present invention, the connector 1 will be exemplified as the "electrical connecting member 1a". Further, in the following description, the "metal member 2a" used for the electrical connection member 1a is the shell 2 of the connector 1.

[Embodiment 1]
(overall structure)
FIG. 1 is a perspective view schematically showing an aspect of the electrical connection member 1a to which the present invention is applied. FIG. 2 is a cross-sectional view schematically showing the configuration of the electrical connection member 1a shown in FIG.

The electrical connection member 1a shown in FIGS. 1 and 2 is a connector 1. Such a connector 1 is used as a USB socket or the like, and is used as an I / O connector for electronic devices such as notebook personal computers, desktop personal computers, and mobile terminals. The connector 1 has a shell 2 as a metal member 2a, an insulating member 3 arranged inside the shell 2, and a contact 4 held by the insulating member 3, and the insulating member 3 is a shell 2. It is fixed inside.

The shell 2 is formed in a substantially square tubular shape, and has two side plate portions 23, 24 connecting the top plate portion 21, the bottom plate portion 22 facing the top plate portion 21, and the bottom plate portion 22 and the top plate portion 21. And have. Therefore, when the mating connector (not shown) is attached through the opening 29 on the front side of the shell 2, the contact 4 comes into contact with the contact of the mating connector and is electrically connected. The shell 2 is formed in a tubular shape by punching or bending a single metal plate, and has a joint at the bottom plate portion 22.

The shell 2 has a plurality of solder connection portions 25 that are solder-connected to the wiring board 9, and the portions other than the solder connection portion 25 are non-connection portions 25a. The connector 1 and the wiring board 9 are a solid-state device 10a (connector mounting board 10) in which the solder connection portion 25 of the shell 2 is solder-connected to the ground pattern of the wiring board 9 and the electrical connection member 1a is mounted on the wiring board 9. ). Therefore, the shell 2 can shield the inside. Further, the rear end portion of the contact 4 is also solder-connected to the wiring board 9.

The solder connection portion 25 is, for example, a portion cut out so as to project from the bottom plate portion 22 and the side plate portions 23, 24 of the shell 2 on both sides in the width direction, and is surface-mounted on the ground pattern of the wiring board 9. In the case of such a configuration, the surface of the overhanging portion on the wiring board 9 side is the solder connecting portion 25, and the surface on the side opposite to the solder connecting portion 25 is the non-connecting portion 25a. The solder connection portion 25 may be provided at the bottom of the shell 2. Further, the solder connection portion 25 may be cut up downward from the bottom plate portion 22 and the side plate portions 23 and 24 and inserted into the through hole of the wiring board 9. In FIG. 1, solder connection portions 25 are provided at a total of two locations, but more solder connection portions 25 may be provided.

(Structure of black metal layer 53, etc.)
FIG. 3 is an explanatory view of a black metal layer 53 and the like formed on the metal member 2a of the electrical connection member 1a shown in FIG. In FIG. 3, in the connector 1 (electrical connecting member 1a), the shell 2 (metal member 2a) made of iron-based metal is plated, and the inner surface 26 and the outer surface 27 of the shell 2 are the solder connecting portion 25 and the solder connecting portion 25. Regardless of the non-connecting portion 25a, it is covered with a laminated film 5 in which a base metal layer 51, a solder connecting metal layer 52 containing tin or silver as a main component, and a black metal layer 53 are laminated in this order. Therefore, the solder connecting portion 25 is also covered with the laminated film 5 in which the base metal layer 51, the solder connecting metal layer 52, and the black metal layer 53 are laminated in this order. The black metal layer 53 is composed of a black tin-nickel alloy plating layer, a black zinc-nickel alloy plating layer, a black nickel plating layer, a black zinc plating layer, and the like, and is inferior in solderability to the solder connection metal layer 52.

In this embodiment, the shell 2 is made of SUS304, the base metal layer 51 is a nickel layer, the solder connection metal layer 52 is a tin layer, and the black metal layer 53 is a black plating made of an alloy layer of tin and nickel. It is a layer.

The thickness of the solder connection metal layer 52 is equal to or greater than the thickness of the black metal layer 53. For example, the base metal layer 51 is a nickel-plated layer having a thickness of 1 μm to 10 μm, and the solder connection metal layer 52 is a tin-plated layer having a thickness of 0.1 μm to 5.0 μm, and the black metal layer 53. Is a tin-nickel alloy plating layer having a thickness of 0.1 μm to 1.0 μm. In this embodiment, the laminated film 5 has the same film structure over the entire area of the shell 2.

(Solder connection between shell 2 and wiring board 9)
FIG. 4 is an explanatory diagram schematically showing how the solder connection portion 25 of the electrical connection member 1a shown in FIG. 1 is solder-connected to the wiring board 9. In the connector 1 (electrical connecting member 1a) of the present embodiment, since the inner surface 26 and the outer surface 27 of the shell 2 are each covered with the laminated film 5 of the black metal layer 53, the surface of the solder connecting portion 25 is also the surface. It is covered with a laminated film 5 of a black metal layer 53. Here, the black metal layer 53 has low solderability, but in the laminated film 5, the base metal layer 51, the metal layer 52 for solder connection containing tin as a main component, and the black metal layer 53 are laminated in this order. , The solder connection portion 25 of the shell 2 can be solder-connected to the wiring board 9.

The reason can be considered as follows from the observation results by an electron microscope or the like. When the solder connection portion 25 is solder-connected to the wiring board 9, in the first stage ST1 shown in FIG. 4, when the paste-like solder 6 is heated in contact with the surface of the laminated film 5, the solder in the second stage ST2 is soldered. The connecting metal layer 52 expands. Therefore, the black metal layer 53 is partially broken, and the molten solder 6 penetrates between the solder connecting metal layer 52 and the black metal layer 53 from the broken portion 530 of the black metal layer 53. As a result, in the third stage ST3 shown in FIG. 4, the solder 6 comes into contact with the solder connection metal layer 52, and alloying of the solder 6 and the solder connection metal layer 52 occurs. After that, in the fourth stage ST4 shown in FIG. 4, the solder 6 slips under the black metal layer 53. Therefore, even when the surface of the solder connection portion 25 is covered with the laminated film 5 of the black metal layer 53, the solder connection can be properly performed.

As described above, in the present embodiment, since the inner surface 26 and the outer surface 27 of the metal shell 2 are each covered with the laminated film 5 of the black metal layer 53, the shell 2 is mounted on an electronic device. No metallic color can be seen from the inner surface 26 of the. Further, since the outer surface 27 of the metal shell 2 is also covered with the laminated film 5 of the black metal layer 53, the metal color can be seen from the outer surface 27 of the shell 2 when mounted on an electronic device. Absent. The surface of the solder connection portion 25 is also covered with the laminated film 5 of the black metal layer 53. In the laminated film 5, the solder connecting metal layer 52 having excellent solderability and the black metal layer are laminated in this order. Therefore, even when the inner surface 26 and the outer surface 27 of the shell 2 are covered with the black metal layer 53, the solder connection can be performed at the solder connection portion 25.

(First example of manufacturing method of connector 1)
FIG. 5 is an explanatory view of a metal plate used for manufacturing the electrical connection member 1a shown in FIG. In the manufacturing process of the connector 1 of the present embodiment, in order to manufacture the shell 2, first, the first surface 200a and the second surface 200b of the metal plate 200 shown in FIG. 5 are plated, and the base metal layer 51 and the solder connection are connected. A laminated film 5 in which a metal layer 52 for use and a black metal layer 53 are laminated in this order is formed.

Next, the metal plate 200 on which the laminated film 5 is formed is subjected to a punching step, a bending step, and the like to manufacture the shell 2. After that, the insulating member 3 holding the contact 4 is fixed to the inside of the shell 2. When the punching step or the bending step is performed, a slit is formed around the solder connecting portion 25.

When such a manufacturing method is adopted, the inner surface 26 and the outer surface 27 of the shell 2 are covered with the laminated film 5, while the end surface 28 of the shell 2 is not covered with the laminated film 5.

(Second example of manufacturing method of connector 1)
In this example, the metal plate 200 shown in FIG. 5 is punched and bent to form a shell 2, and then the shell 2 is plated to form a base metal layer 51 and a solder connection metal layer 52. , And the black metal layer 53 are laminated in this order to form a laminated film 5. After that, the insulating member 3 holding the contact 4 is fixed to the inside of the shell 2. When the punching step or the bending step is performed, a slit is formed around the solder connecting portion 25.

When such a manufacturing method is adopted, the inner surface 26, the outer surface 27, and the end surface 28 of the shell 2 are covered with the laminated film 5, so that the metal color of the shell 2 cannot be seen when the connector 1 is mounted on an electronic device. Become.

(Third example of the manufacturing method of the connector 1)
In this example, the metal plate 200 shown in FIG. 5 is punched and then plated to form a laminated film 5 in which the base metal layer 51, the solder connection metal layer 52, and the black metal layer 53 are laminated in this order. To do. Next, the metal plate on which the laminated film 5 is formed is bent to manufacture the shell 2. After that, the insulating member 3 holding the contact 4 is fixed to the inside of the shell 2. When the punching step or the bending step is performed, a slit is formed around the solder connecting portion 25.

Even when such a manufacturing method is adopted, since the inner surface 26, the outer surface 27, and the end surface 28 of the shell 2 are covered with the laminated film 5, as in the second example, when the connector 1 is mounted on an electronic device, the shell 2 You will not be able to see the metallic color.

[Embodiment 2]
In the first embodiment, the configuration of the laminated film 5 is the same in the entire area of the shell 2, but in the present embodiment, the portion of the laminated film 5 covered with the solder connection portion 25 is the solder connection of the shell 2. The thickness of the solder connection metal layer 52 is thicker than that of the portion covered with the region other than the portion 25. According to this aspect, when the solder connection portion 25 is solder-connected, the solder connection metal layer 52 is greatly expanded by the heat, so that the black metal layer 53 is surely broken. Therefore, the solder 6 is surely brought into contact with the solder connecting metal layer 52 from the broken portion 530 of the black metal layer 53.

In such an embodiment, for example, when plating the solder connection metal layer 52, an insulating shielding member is arranged between the region other than the solder connection portion 25 of the shell 2 and the counter electrode in the electroplating bath. This can be achieved by forming a thick metal layer 52 for solder connection on the solder connection portion 25.

[Embodiment 3]
In the first embodiment, the configuration of the laminated film 5 is the same in the entire area of the shell 2, but in the present embodiment, the portion of the laminated film 5 covered with the solder connection portion 25 is the solder connection of the shell 2. The thickness of the black metal layer 53 is thinner than that of the portion covered with the region (non-connecting portion 25a) other than the portion 25. According to this aspect, when the solder connection portion 25 is solder-connected, the black metal layer 53 is surely broken when the solder connection metal layer 52 expands due to the heat. Therefore, the solder 6 is surely brought into contact with the solder connecting metal layer 52 from the broken portion 530 of the black metal layer 53.

In such an embodiment, for example, when plating the black metal layer 53, an insulating shielding member is arranged between the solder connecting portion 25 of the shell 2 and the counter electrode in the electroplating bath, and the solder connecting portion 25 is provided. This can be achieved by forming the black metal layer 53 thinly.

[Other Embodiments]
In the above embodiment, the connector 1 is illustrated as the electrical connection member 1a, but the present invention may be applied to an electrical connection member 1a other than the connector 1 such as a terminal. Further, the purpose of forming the black metal layer 53 is not limited to the appearance, but may be the purpose of preventing reflection.

1 ... Connector, 1a ... Electrical connection member, 2 ... Shell, 2a ... Metal member, 3 ... Insulation member, 4 ... Contact, 5 ... Laminated film, 6 ... Solder, 9 ... Wiring board, 10 ... Connector mounting board, 10a ... Solid device, 21 ... Top plate, 22 ... Bottom plate, 23, 24 ... Side plate, 25 ... Solder connection, 25a ... Non-connection, 26 ... Inner surface, 27 ... Outer surface, 28 ... End face, 29 ... Opening , 51 ... Underlayer metal layer, 52 ... Solder connection metal layer, 53 ... Black metal layer, 200 ... Metal plate, 200a ... First surface, 200b ... Second surface, 530 ... Broken part

Claims (7)

In an electrical connection member in which a solder connection portion to be solder-connected and a non-connection portion not used for solder connection are provided on a metal member.
The feature is that at least a part of the non-connecting portion and the solder connecting portion are each covered with a laminated film in which a metal layer for solder connection containing tin or silver as a main component and a black metal layer are laminated in this order. Electrical connection member. In the electrical connection member according to claim 1,
The metal layer for solder connection is a tin layer and
The black metal layer is an electrical connecting member characterized by being an alloy layer of tin and nickel. In the connector according to claim 1 or 2.
A portion of the laminated film covered with the solder connecting portion is an electrical connecting member characterized in that the thickness of the solder connecting metal layer is thicker than that of the portion covered with the non-connecting portion. In the electrical connection member according to any one of claims 1 to 3,
The portion of the laminated film covered with the solder connecting portion is an electrically connecting member characterized in that the thickness of the black metal layer is thinner than that of the portion covered with the non-connecting portion. In the electrical connection member according to any one of claims 1 to 4.
The portion of the laminated film covered with the solder connection portion is an electrical connection member characterized in that the thickness of the metal layer for solder connection is equal to or greater than the thickness of the black metal layer. In the electrical connection member according to any one of claims 1 to 5,
An electrical connecting member, wherein the solder connecting portion and the non-connecting portion are provided on surfaces of the metal member on opposite sides to each other. A solid-state device in which the electrical connection member according to any one of claims 1 to 6 is connected to a wiring board.
The solder that electrically connects the solder connection portion and the wiring board is in contact with the solder connection metal layer via a broken portion of the black metal layer of the laminated film coated on the solder connection portion. A solid device characterized by that.

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