CN101728151B - Field emission light source and manufacturing method thereof - Google Patents
Field emission light source and manufacturing method thereof Download PDFInfo
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- CN101728151B CN101728151B CN 200910239530 CN200910239530A CN101728151B CN 101728151 B CN101728151 B CN 101728151B CN 200910239530 CN200910239530 CN 200910239530 CN 200910239530 A CN200910239530 A CN 200910239530A CN 101728151 B CN101728151 B CN 101728151B
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Abstract
The invention relates to a field emission light source and a manufacturing method thereof. The manufacturing method of the field emission light source comprises a first step of preparing an anode plate applied to the field emission light source. The first step comprises the following steps of: manufacturing a glass plate by adopting glass; coating a layer of fluorescent powder on the manufactured glass plate; placing the glass plate coated with a fluorescent powder layer on a substrate, placing a barrier with adjustable height around the periphery of the glass plate and placing a steel plate above the barrier and the glass plate; and placing the mounted glass plate coated with the fluorescent powder layer, the steel plate, the barrier and a substrate together into a high temperature furnace to soften the glass plate and press the fluorescent powder into the inside of a surface layer of the glass plate through the steel plate. The fluorescent powder on the anode plate of the field emission light source manufactured by using the method is firmly adhered to the glass plate, and can not easily drop off when being attacked by large electron beams for a long time, and a dense and smooth aluminum film can be acquired with favorable luminous efficiency.
Description
Technical field
The present invention relates to the electric light source field, more particularly, relate to a kind of field emission light source and preparation method thereof.
Background technology
The electric light source industry is the focus that countries in the world are competitively studied always, in World Economics in occupation of important status.Present widely used light source is a glow discharge spot lamp, and the principle of this light source is that the inside with lamp charges into mercurous mist after vacuumizing, and utilizes the ultraviolet excitation light-emitting phosphor that gas discharge is luminous or gas discharge produces.Yet the pulse color break-up of glow discharge spot lamp causes people's visual fatigue easily, and the mercury pollution environment, and along with the progress of society with science and technology, the green light source of researching and developing energy-conservation environmental protection again substitutes conventional light source, becomes the important topic that various countries are competitively studied.
Field emission light source is a kind of green illumination light source, and it has the following advantages: energy savings, environmental protection (no mercury), start fast, caloric value is low, belong to cold light source, can make frivolous product or the like.As a kind of environmental protection lighting source, field emission light source has great potential.Electroluminescent is applied to display; Main advantage is that it is lightening and possesses the excellent properties of comparing mutually with CRT; The thin flat Field Emission Display operates mainly under the low-voltage and high-current condition, is different from the little electric current of high voltage of color picture tube (CRT), therefore; Also be faced with some problems, for example: do not have commercialization low-voltage phosphor (commercial at present fluorescent material mostly works in volts up to ten thousand) efficiently; Under the big electron beam bombardment, fluorescent material is prone to come off etc.
Electroluminescent is applied to the spacing that the illumination aspect can suitably strengthen negative electrode and anode, improves operating voltage, makes fluorescent material work under the Optimum Excitation condition, yet under big electron beam bombardment, fluorescent material is prone to come off; Existing solution is for the field emission light source that works under the high voltage, can be at phosphor surface vapor deposition layer of aluminum film, and its effect is: at first by the direct reflection of aluminium film the brightness of display is improved 70%～80%; Secondly,, can prevent the bombardment of ion pair phosphor powder layer and produce ion burn, and make the fluorescent material difficult drop-off because aluminium lamination is an equipotential surface.Thereby (＞5000V) the field emission light source under the condition is the smooth aluminum film of 800～1500 dusts at phosphor surface vapor deposition one layer thickness usually for working in high voltage.Before the AM aluminum metallization film, need on fluorescent material, form organic film in the middle of one deck, prevent on the one hand that aluminium from evapotranspiring to form black streaking in the fluorescent material, cause optical attenuation, can make the aluminium film form smooth minute surface on the other hand, increase reflectivity.Yet this organic film has residual after calcination, influences light efficiency, thereby and decomposes and to be prone to make the aluminium film to bubble to influence quality of forming film.
Summary of the invention
The technical problem that the present invention will solve is; To the existing shortcoming of above-mentioned existing field emission light source; Provide a kind of fluorescent material of field emission light source on glass plate, to adhere to firmly, difficult drop-off when big electronic beam current bombards for a long time, and; Can obtain fine and close and smooth aluminium film has luminous efficiency preferably.
Another technical problem that the present invention will solve is; To the existing shortcoming of the manufacture method of above-mentioned existing field emission light source; A kind of manufacture method of field emission light source is provided; Fluorescent material on the prepared field emission light source adheres on glass plate firmly, difficult drop-off when big electronic beam current bombards for a long time; And, can under the situation that does not apply organic membrane, form fine and close and smooth aluminium film, thereby make field emission light source obtain luminous efficiency preferably.
The present invention solves the technical scheme that the one of which technical problem adopted: a kind of manufacture method of field emission light source is provided, comprises, step S1: preparation is applicable to the positive plate of field emission light source, and said step S1 comprises the steps:
Step a: adopt glass to make glass plate;
Step b: on prepared glass plate, apply layer of fluorescent powder;
Step c: the above-mentioned glass plate that is coated with phosphor powder layer is placed on the substrate, around the periphery of glass plate, places height-adjustable barrier, above glass plate, place a steel plate then;
Steps d: above-mentioned mounted glass plate, steel plate, barrier and the substrate that is coated with phosphor powder layer put into high temperature furnace together; Be heated to 400～500 ℃ earlier; Insulation 25～35min makes that the organic substance in the fluorescent material fully decomposes, and is warming up to 500～560 ℃ again; Insulation 80～100min makes glass plate softening and through steel plate that the top layer that fluorescent material is pressed into glass plate is inner.
In the manufacture method of field emission light source of the present invention, said step S1 further comprises: step e: adopt the method for vacuum vapor plating to be coated with vapor deposition layer of aluminum film on the surface of phosphor powder layer at glass plate.
In the manufacture method of field emission light source of the present invention, in step e, the thickness of said aluminium film is 900～1100 dusts.
In the manufacture method of field emission light source of the present invention, in step a, the softening temperature of said glass is 450～800 ℃, and glass polishing, polishing are made flat glass plate;
In step b, said fluorescent material is the cathode-ray fluorescent powder, adopts the method for silk screen printing to apply, and the thickness of coating is 15～30 μ m;
In step c, said substrate is a metal substrate, and said barrier is installed on the metal substrate; Said steel plate is a corrosion resistant plate, and weight is 4～6kg.
In the manufacture method of field emission light source of the present invention, said glass plate contains one of phosphor powder layer and faces up, and said steel plate is pressed in the one side top that this glass plate contains phosphor powder layer; The length of said steel plate is greater than the length of said glass plate, and said barrier is installed on the metal substrate and is positioned at below, steel plate edge, and the height of barrier is lower than glass plate and goes up the whole height of phosphor powder layer.
In the manufacture method of field emission light source of the present invention, the manufacture method of said field emission light source also comprises the steps:
Step S2: preparation is applicable to the minus plate of field emission light source;
Step S3: between the minus plate of field emission light source and positive plate, insulation support body is installed; And the blast pipe be used to vacuumize is installed; With above-mentioned minus plate, positive plate, supporter and blast pipe adopt softening temperature be 380 ℃～400 ℃ low melting sealing frit be packaged into the field emission light source device and vacuumize, sealed-off, make the field emission light source finished product.
In the manufacture method of field emission light source of the present invention, in step S2, adopt the method for silk screen printing on ito glass, to apply the minus plate of one deck CNT as field emission light source;
In step S3, said insulation support body is the insulating ceramic film of high pressure resistant puncture; Said blast pipe adopts glass exhaust tube, is installed on the minus plate and with gas extraction system to be connected; The said vacuum degree that reaches that vacuumizes is 5 * 10
-4More than the Pa.
The present invention solves the technical scheme that its another technical problem adopts: a kind of field emission light source is provided; Comprise: positive plate, minus plate; Said positive plate comprises glass plate and is pressed into the inner fluorescent material in glass plate top layer through said method, said fluorescent material and the glass plate top layer formation compact film that combines together.
In field emission light source of the present invention, also be provided with an aluminum membranous layer on the said compact film.
In field emission light source of the present invention, said minus plate comprises the ito glass plate and is coated on the carbon nanotube layer on the ito glass plate.
In field emission light source of the present invention, said field emission light source also comprises the supporter of being located between said positive plate and the minus plate, is formed with the inner space between said positive plate and the minus plate, and said minus plate is provided with the glass exhaust tube that is used to vacuumize.
The beneficial effect that embodiment of the present invention is brought: the positive plate that adopts the manufacture method made of field emission light source of the present invention; Be the glass material of stable performance between its fluorescent powder grain; Strengthened the fastness of phosphor powder layer; Filled up gap between particles, reduced the discharge quantity in the residual gas and the work of field emission light source device between the fluorescent powder grain, can prevent that the aluminium that evapotranspires from penetrating into to produce black streaking in the phosphor powder layer; And the fluorescent material on the prepared field emission light source adheres on glass plate firmly, difficult drop-off when big electronic beam current bombards for a long time; Simultaneously, adopt above-mentioned manufacture method, fluorescent material merges the formation compact film each other with softening surface layer of glass, can form smooth rete behind the AM aluminum metallization film above that and does not need to apply earlier organic film, thereby make field emission light source obtain luminous efficiency preferably.
Description of drawings
To combine accompanying drawing and embodiment that the present invention is described further below, in the accompanying drawing:
Fig. 1 is the flow chart of the manufacture method of field emission light source of the present invention;
Fig. 2 is the flow chart of manufacture method of the field emission light source positive plate of step S1 among Fig. 1;
Fig. 3 is the structural representation of field emission light source of the present invention;
Fig. 4 A-4C is the sketch map of manufacturing process of the positive plate of the field emission light source among Fig. 3.
Embodiment
Consult Fig. 1 and Fig. 3, shown in Figure 1 is the flow chart of the manufacture method of field emission light source of the present invention, and shown in Figure 3 is the structural representation of the field emission light source of the present invention of made; The manufacture method of field emission light source of the present invention comprises the steps:
Step S1, preparation are applicable to the positive plate 100 of field emission light source; Consult Fig. 2 and Fig. 4 A-C, Fig. 2 is the flow chart of the manufacture method of field emission light source positive plate; Fig. 4 A-C is the manufacturing process sketch map of the positive plate of field emission light source, and wherein, Fig. 4 A is depicted as and on positive plate, applies a phosphor powder layer; Fig. 4 B is depicted as the sketch map of the producing device of positive plate; Fig. 4 C is depicted as the sketch map of the positive plate of the field emission light source of processing.Main improvements of the present invention are the manufacture method of the positive plate of field emission light source; Top layer through cathode-ray fluorescent powder 2 being pressed into low-melting glass plate 1 is inner; Make that fluorescent material 2 can be evenly and be deposited in closely in the top layer of glass plate 1, be integrally formed structure; This manufacture method specifically comprises the steps:
Step a, adopt low-melting glass to make glass plate 1, said low-melting glass should have very high light transmittance, very strong machinability, air impermeability and chemical stability, can well protect the fluorescent material that is scattered in its top layer not receive the influence of residual gas.What deserves to be mentioned is that the softening point of this low-melting glass should be higher than the sintering temperature of general low melting sealing frit, thereby do not influence the sealing-in of positive plate in the field emission light source device; Simultaneously, the softening point of this low-melting glass again must be lower, when glass reaches softening temperature fluorescent material is pressed into surface layer of glass, can not influence the thermal endurance of fluorescent material, causes the deterioration of fluorescent material performance.Thereby the constituent of this glass is arbitrarily, as long as its softening temperature is less than 800 ℃, preferred softening temperature is lower than 600 ℃ and be higher than 450 ℃ glass, and for example: employing is based on Na
2OZnOB
2O
3SiO
2The glass of forming.Then, glass is polished, is polished to flat glass plate, the thickness of glass plate can be selected according to the requirement of field emission light source device strength; Under the prerequisite that guarantees the field emission light source device strength, the thickness of glass plate is more little good more, to improve light emission rate.
Step b, consult Fig. 4 A, adopt the method for silk screen printing on prepared glass plate 1, to apply layer of fluorescent powder 2, said fluorescent material 2 is the cathode-ray fluorescent powder, and for example: (rouge and powder is Y can to select commercially available commercial fluorescent material-P22 fluorescent material for use
2O
2S:Eu, green powder are ZnS:Cu, Au, and Al, blue powder are ZnS:Ag, Cl), THICKNESS CONTROL is (15～30 μ m) about three fluorescent material particle diameters.
Step c, consult Fig. 4 B, the above-mentioned glass plate 1 that is coated with phosphor powder layer 2 is placed on the metal substrate 4, around the periphery of glass plate 1, place height-adjustable barrier 5, above glass plate 1, place a corrosion resistant plate 3 then; Wherein, said glass plate 1 contains one of phosphor powder layer 2 and faces up, and said corrosion resistant plate 3 is pressed in the one side top that this glass plate 1 contains phosphor powder layer 2; The length of said corrosion resistant plate 3 is greater than the length of said glass plate 1; Said barrier 5 is installed on the metal substrate 4 and is positioned at the below, edge of corrosion resistant plate 3; It is understandable that; The height of said barrier 5 is lower than glass plate 1 and goes up the height of phosphor powder layer 2 integral body; And its height can be regulated as required, the compression distance that its role is to control 3 pairs of glass plates 1 of corrosion resistant plate and go up phosphor powder layer 2, and the thickness of control glass after thermoplastic; The weight of said corrosion resistant plate 3 is 4～6kg, its role is to phosphor powder layer 2 is pressed into the inside, top layer of glass plate 1.
Steps d, above-mentioned glass plate 1, corrosion resistant plate 3, barrier 5, the substrate 4 that is coated with phosphor powder layer 2 put into high temperature furnace together; Be heated to 400 ℃～500 ℃ earlier; Insulation 25～35min makes that the organic substance in the fluorescent material fully decomposes, and is warming up to 500～560 ℃ again; Insulation 80～100min makes glass plate 1 softening and through corrosion resistant plate 3 that the top layer that fluorescent material is pressed into glass plate 1 is inner.
Step e, adopt the method for vacuum vapor plating to be coated with vapor deposition layer of aluminum film 7 on the surface of phosphor powder layer 2 at glass plate 1; The thickness of aluminium film 7 is 900～1100 dusts.This step can be passed through existing techniques in realizing, is optional step, and the positive plate of field emission light source also can directly be used for field emission light source when AM aluminum metallization film 7 not.
Step S2, preparation are applicable to the minus plate 110 of field emission light source; Adopt the method for silk screen printing on ito glass 8, to apply the minus plate of one deck CNT 9 as field emission light source; Ito glass is the glass that is coated with ITO; ITO (Indium Tin Oxides) is as the nano indium tin metal oxide; Have the good conductivity and the transparency, can cut off harmful electron radiation, ultraviolet ray and far infrared.
Step S3, insulation support body 10 is installed between the minus plate 110 of field emission light source and positive plate 100; And the blast pipe 11 be used to vacuumize is installed; With above-mentioned minus plate 110, positive plate 100, supporter 10 and blast pipe 11 adopt low melting sealing frits to be packaged into the field emission light source device and vacuumize, sealed-off, between minus plate 110 and positive plate 100, be applied with high direct voltage simultaneously.In this step, the insulating ceramic film that adopts high pressure resistant puncture is as supporter 10; Blast pipe 11 adopts glass exhaust tube, is installed on the minus plate 110 and with gas extraction system to be connected, and the inner space that target plate 110, positive plate 100 and supporter 10 form vacuumizes, and makes vacuum degree reach 5 * 10
-4More than the Pa; The softening temperature of the said low melting sealing frit that is used to encapsulate is 380 ℃～400 ℃, and when between minus plate 110 and positive plate 100, applying high direct voltage, field emission light source device 1 can be luminous.
Consult Fig. 3; Comprise through the prepared field emission light source of the manufacture method of above-mentioned field emission light source: positive plate 100, minus plate 110, be located at the supporter 10 between positive plate 100 and the minus plate 110; Said supporter 10 adopts insulating ceramic film; Be formed with inner space 120 between said positive plate 100 and the minus plate 110, said minus plate 110 is provided with the glass exhaust tube 11 that is used to vacuumize.Wherein, said positive plate 100 comprises glass plate 1 and is pressed into the inner fluorescent material 2 in glass plate 1 top layer that said fluorescent material 2 combines together with glass plate 1 top layer and forms compact film 6, also can be provided with an aluminum membranous layer 7 on the said compact film 6.Said minus plate then comprises ito glass plate 8 and is coated on the carbon nanotube layer 9 on the ito glass plate 8.During use, an end and the gas extraction system (not shown) of said glass exhaust tube 11 is connected, the other end is connected with inner space 120, and inner space 120 is vacuumized; Then, between said positive plate 100 and minus plate 110, be connected the power line 130 that is used to apply high direct voltage, when between minus plate 110 and positive plate 100, applying high direct voltage, field emission light source device 1 can be luminous.
Specify for example through embodiment 1～2 below:
Be illustrated in figure 3 as the profile of the embodiment of the invention 1.At first, preparation is applicable to the positive plate of field emission light source: utilize method for printing screen on glass plate 1, to apply the thick P22 three primary colors mixed fluorescent powder 2 of one deck 15 μ m, the glass plate 1 that will be printed on phosphor powder layer 2 is placed on the metal substrate 4, around the periphery of glass plate 1, places height-adjustable barrier 5; Put the smooth corrosion resistant plate of a surface clean 3 then on the top of glass plate 1, the about 4kg of weight puts into the glass plate that is coated with fluorescent material 21, corrosion resistant plate 3, barrier 5, substrate 4 in the high temperature furnace together; Be heated to 400 ℃ earlier; Be incubated 25 minutes, make organic substance in the fluorescent material fully divide and take off, be warming up to 500 ℃ again; Insulation 80min; Make glass softening and fluorescent material is pressed into surface layer of glass, last, adopt the method for vacuum vapor plating to be coated with vapor deposition layer of aluminum film 7 on the one side of phosphor powder layer at glass plate 1; Thickness is 1000 dusts, makes field emission light source positive plate 6; Then, on ito glass 8, adopt the method for silk screen printing to apply one deck CNT 9 as positive plate, the insulating ceramic film 10 that adopts high pressure resistant puncture punches on ito glass 8 and installation glass exhaust tube 11 as supporter; Adopt low melting sealing frit (softening temperature is 380 ℃) sealing-in to become the field emission light source device above-mentioned minus plate, positive plate, supporter and blast pipe again and vacuumize, make vacuum degree reach 6 * 10
-4Pa, between minus plate, positive plate, applying high direct voltage after the sealed-off can emit white light.
At first, preparation is applicable to the positive plate of field emission light source: utilize method for printing screen on glass plate, to apply the thick P22 three primary colors mixed fluorescent powder of one deck 30 μ m; The glass plate that will be printed on phosphor powder layer is placed on the metal substrate, around the periphery of glass plate, places height-adjustable barrier, puts the smooth corrosion resistant plate of a surface clean then on the top of glass plate; The about 6kg of weight; The glass plate that is coated with fluorescent material, corrosion resistant plate, barrier, substrate are put in the high temperature furnace together, be heated to 500 ℃ earlier, be incubated 35 minutes; Making organic substance in the fluorescent material fully divide takes off; Be warming up to 560 ℃ again, insulation 100min makes glass soften and fluorescent material is pressed into surface layer of glass and makes the field emission light source positive plate; Then, on ito glass, adopt the method for silk screen printing to apply one deck CNT as minus plate, the insulating ceramic film that adopts high pressure resistant puncture punches on ito glass and the installation glass exhaust tube as supporter; Adopt low melting sealing frit (softening temperature is 400 ℃) sealing-in to become the field emission light source device above-mentioned minus plate, positive plate, supporter and blast pipe again and vacuumize, make vacuum degree reach 5 * 10
-4Pa, between minus plate, positive plate, applying high direct voltage after the sealed-off can emit white light.
In sum; Adopt the positive plate of the manufacture method made of field emission light source of the present invention; Be the glass material of stable performance between its fluorescent powder grain, strengthened the fastness of phosphor powder layer, filled up gap between particles; Reduced the discharge quantity in the residual gas and the work of field emission light source device between the fluorescent powder grain; Can prevent that the aluminium that evapotranspires from penetrating into produces black streaking in the phosphor powder layer, and the fluorescent material on the prepared field emission light source adheres to firmly difficult drop-off when big electronic beam current bombards for a long time on glass plate; Simultaneously, adopt above-mentioned manufacture method, fluorescent material merges the formation compact film each other with softening surface layer of glass, can form smooth rete behind the AM aluminum metallization film above that and does not need to apply earlier organic film, thereby make field emission light source obtain luminous efficiency preferably.
The above; Be merely the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claim.
Claims (11)
1. the manufacture method of a field emission light source is characterized in that, comprises step S1: preparation is applicable to the positive plate of field emission light source, and said step S1 comprises the steps:
Step a: adopt glass to make glass plate;
Step b: on prepared glass plate, apply layer of fluorescent powder;
Step c: the above-mentioned glass plate that is coated with phosphor powder layer is placed on the substrate, around the periphery of glass plate, places height-adjustable barrier, above glass plate, place a steel plate then;
Steps d: above-mentioned mounted glass plate, steel plate, barrier and the substrate that is coated with phosphor powder layer put into high temperature furnace together; Be heated to 400～500 ℃ earlier; Insulation 25～35min makes that the organic substance in the fluorescent material fully decomposes, and is warming up to 500～560 ℃ again; Insulation 80～100min makes glass plate softening and through steel plate that the top layer that fluorescent material is pressed into glass plate is inner.
2. the manufacture method of field emission light source as claimed in claim 1 is characterized in that, said step S1 further comprises: step e: adopt the method for vacuum vapor plating to be coated with vapor deposition layer of aluminum film on the surface of phosphor powder layer at glass plate.
3. the manufacture method of field emission light source as claimed in claim 2 is characterized in that, in step e, the thickness of said aluminium film is 900～1100 dusts.
4. the manufacture method of field emission light source as claimed in claim 1 is characterized in that, in step a, the softening temperature of said glass is 450～800 ℃, and glass polishing, polishing are made flat glass plate;
In step b, said fluorescent material is the cathode-ray fluorescent powder, adopts the method for silk screen printing to apply, and the thickness of coating is 15～30 μ m;
In step c, said substrate is a metal substrate, and said barrier is installed on the metal substrate; Said steel plate is a corrosion resistant plate, and weight is 4～6kg.
5. like the manufacture method of any described field emission light source of claim 1-4, it is characterized in that said glass plate contains one of phosphor powder layer and faces up, said steel plate is pressed in the one side top that this glass plate contains phosphor powder layer; The length of said steel plate is greater than the length of said glass plate, and said barrier is installed on the metal substrate and is positioned at below, steel plate edge, and the height of barrier is lower than glass plate and goes up the whole height of phosphor powder layer.
6. like the manufacture method of any described field emission light source of claim 1-4, it is characterized in that the manufacture method of said field emission light source also comprises the steps:
Step S2: preparation is applicable to the minus plate of field emission light source;
Step S3: between the minus plate of field emission light source and positive plate, insulation support body is installed; And the blast pipe be used to vacuumize is installed; With above-mentioned minus plate, positive plate, supporter and blast pipe adopt softening temperature be 380 ℃～400 ℃ low melting sealing frit be packaged into the field emission light source device and vacuumize, sealed-off, make the field emission light source finished product.
7. the manufacture method of field emission light source as claimed in claim 6 is characterized in that, in step S2, adopts the method for silk screen printing on ito glass, to apply the minus plate of one deck CNT as field emission light source;
In step S3, said insulation support body is the insulating ceramic film of high pressure resistant puncture; Said blast pipe adopts glass exhaust tube, is installed on the minus plate and with gas extraction system to be connected; The said vacuum degree that reaches that vacuumizes is 5 * 10
-4More than the Pa.
8. field emission light source; Comprise: positive plate (100), minus plate (110); It is characterized in that; Said positive plate (100) comprises glass plate (1) and is pressed into the inner fluorescent material (2) in glass plate (1) top layer through the described method of claim 1 that said fluorescent material (2) combines together with glass plate (1) top layer and forms compact film (6).
9. field emission light source as claimed in claim 8 is characterized in that, also is provided with an aluminum membranous layer (7) on the said compact film (6).
10. field emission light source as claimed in claim 8 is characterized in that, said minus plate (110) comprises ito glass plate (8) and is coated on the carbon nanotube layer (9) on the ito glass plate (8).
11. like any described field emission light source of claim 8～10; It is characterized in that; Said field emission light source also comprises the supporter of being located between said positive plate (100) and the minus plate (110) (10); Be formed with inner space (120) between said positive plate (100) and the minus plate (110), said minus plate (110) is provided with the glass exhaust tube (11) that is used to vacuumize.
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| CN 200910239530 CN101728151B (en) | 2009-12-31 | 2009-12-31 | Field emission light source and manufacturing method thereof |
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| CN 200910239530 CN101728151B (en) | 2009-12-31 | 2009-12-31 | Field emission light source and manufacturing method thereof |
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| CN101728151B true CN101728151B (en) | 2012-01-04 |
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| JP5487362B2 (en) * | 2010-07-14 | 2014-05-07 | ▲海▼洋王照明科技股▲ふん▼有限公司 | How to create a fluorescent powder layer |
| US20140021500A1 (en) * | 2010-12-20 | 2014-01-23 | Ocean's King Lighting Science & Technology Co., Ltd. | Light emitting device and manufacturing method thereof |
| CN102299036A (en) * | 2011-07-18 | 2011-12-28 | 东南大学 | Array X-ray source based on field emission cold cathode |
| CN103426718B (en) * | 2013-03-25 | 2016-08-10 | 上海显恒光电科技股份有限公司 | Flat-panel radiating light source 3D print system and light source thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1463018A (en) * | 2002-05-28 | 2003-12-24 | 东元资讯股份有限公司 | Seat for fixing glass base plate |
| CN1630005A (en) * | 2003-12-18 | 2005-06-22 | 东元奈米应材股份有限公司 | Spraying liquid of fluorescent powder and spraying method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1463018A (en) * | 2002-05-28 | 2003-12-24 | 东元资讯股份有限公司 | Seat for fixing glass base plate |
| CN1630005A (en) * | 2003-12-18 | 2005-06-22 | 东元奈米应材股份有限公司 | Spraying liquid of fluorescent powder and spraying method thereof |
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