CN101710006B - Three-dimensional micro-force measuring device - Google Patents
Three-dimensional micro-force measuring device Download PDFInfo
- Publication number
- CN101710006B CN101710006B CN2009100232277A CN200910023227A CN101710006B CN 101710006 B CN101710006 B CN 101710006B CN 2009100232277 A CN2009100232277 A CN 2009100232277A CN 200910023227 A CN200910023227 A CN 200910023227A CN 101710006 B CN101710006 B CN 101710006B
- Authority
- CN
- China
- Prior art keywords
- micro
- dimensional micro
- dimensional
- force
- measuring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000006073 displacement reaction Methods 0.000 claims abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 23
- 239000010703 silicon Substances 0.000 claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 239000000523 sample Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 230000003321 amplification Effects 0.000 abstract description 9
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 9
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 230000035939 shock Effects 0.000 abstract 2
- 238000005259 measurement Methods 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 7
- 238000011160 research Methods 0.000 description 5
- 230000003750 conditioning effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
Description
技术领域 technical field
本发明属于微力测试技术领域,特别涉及到一种基于压阻效应的三维微力硅微探针传感器的三维微力测量装置。The invention belongs to the technical field of micro-force testing, and in particular relates to a three-dimensional micro-force measuring device based on a piezoresistive effect-based three-dimensional micro-force silicon microprobe sensor.
背景技术 Background technique
近几年来,随着微机电系统(MEMS)技术的不断发展,越来越多的学者与研究机构开始对微观世界进行深入研究。为了更好地对微观物质进行操作和研究其力学特性,非常有必要开展三维微力测量技术的研究,特别是微牛顿(uN)级的三维微力测量和传感技术。在MEMS系统中微尺度构件力学性能的研究、机器人触觉系统中的微力测量与加载、微纳器件装配中的微力监测、生物技术、细胞操作以及微制造技术等领域中多需要三维微力的测量与控制,因此三维微力测量得到了世界各国的广泛关注,已经成为国内外研究的热点。但目前来看,绝大部分传统的三维力测量系统测力范围还限制在牛顿级别,缺少测量μN级作用力的能力;而基于MEMS微传感器的微力测量系统还相对较少,且虽然可以达到测量μN量级作用力的能力,但往往只能测量单维或二维微力。In recent years, with the continuous development of microelectromechanical systems (MEMS) technology, more and more scholars and research institutions have begun to conduct in-depth research on the microcosm. In order to better manipulate microscopic substances and study their mechanical properties, it is very necessary to carry out research on three-dimensional micro-force measurement technology, especially micro-Newton (uN) level three-dimensional micro-force measurement and sensing technology. The research on the mechanical properties of micro-scale components in MEMS systems, the measurement and loading of micro-forces in robot tactile systems, the micro-force monitoring in the assembly of micro-nano devices, biotechnology, cell manipulation, and micro-manufacturing technology require the measurement and measurement of three-dimensional micro-forces. Therefore, the three-dimensional micro-force measurement has attracted extensive attention from all over the world, and has become a research hotspot at home and abroad. But at present, most of the traditional three-dimensional force measurement systems are still limited to the Newton level, lacking the ability to measure μN-level force; and there are relatively few micro-force measurement systems based on MEMS microsensors, and although they can reach The ability to measure force on the order of μN, but often only one-dimensional or two-dimensional micro force can be measured.
发明内容 Contents of the invention
为了克服上述现有技术的缺陷,本发明的目的在于提出一种基于压阻效应的三维微力硅微探针传感器的三维微力测量装置,可以同时进行μN级三维微力的测量,具有精度声、灵敏度高、线形好的特点。In order to overcome the defects of the above-mentioned prior art, the object of the present invention is to propose a three-dimensional micro-force measuring device based on the piezoresistive effect of a three-dimensional micro-force silicon microprobe sensor, which can simultaneously measure the three-dimensional micro-force of μN level, and has high precision and high sensitivity. High, linear features.
为了实现上述目的,本发明采用的技术方案如下:In order to achieve the above object, the technical scheme adopted in the present invention is as follows:
一种三维微力测量装置,包括一减震平台3,在减震平台3上相距一定位置分别固定有电控三维位移平台1与载物台2,并将压电陶瓷位移平台4固定在电控三维位移平台1的Z轴上,硅微三维微力传感器6固定在压电陶瓷平台4上;硅微三维微力传感器6的探针10朝下;硅微三维微力传感器6的惠斯通电桥12将电压信号输出至放大运算电路13,电压信号经放大运算电路13放大后输入到数字显示模块14中。A three-dimensional micro-force measuring device, comprising a shock-absorbing platform 3, on which an electronically controlled three-dimensional displacement platform 1 and an object stage 2 are respectively fixed at a certain distance from each other, and a piezoelectric ceramic displacement platform 4 is fixed on the electronically controlled On the Z axis of the three-dimensional displacement platform 1, the silicon micro-three-dimensional micro-force sensor 6 is fixed on the piezoelectric ceramic platform 4; the
电控三维微位移平台1由步进电机控制器,以及x、y、z三轴电控平移台构成,其最小分辨率可达1.25μm,主要功能是对位移平台的粗调。步进电机是一种将电脉冲信号转化为角位移的执行机构。当步进驱动器接收到一个脉冲信号,它就驱动步进电机按设定的方向转动一个固定的角度,它的旋转是以固定的角度一步一步运行的。可以通过控制脉冲个数来控制角位移量,带动电控平移台导轨转动,从而达到电控平移台准确定位的目的。The electronically controlled three-dimensional micro-displacement platform 1 is composed of a stepping motor controller and an electronically controlled three-axis translation platform of x, y, and z. Its minimum resolution can reach 1.25 μm, and its main function is to roughly adjust the displacement platform. A stepper motor is an actuator that converts electrical pulse signals into angular displacements. When the stepper driver receives a pulse signal, it drives the stepper motor to rotate a fixed angle in the set direction, and its rotation runs step by step at a fixed angle. The angular displacement can be controlled by controlling the number of pulses to drive the guide rail of the electronically controlled translation platform to rotate, so as to achieve the purpose of accurate positioning of the electronically controlled translation platform.
压电陶瓷位移平台4由压电控制器以及压电陶瓷精密平台组成,并通过支架5将压电陶瓷位移平台4固定在电控三维微位移平台1的z轴上。基于逆压电效应,通过对压电陶瓷施加电压,使其在指定方向产生变形,得到所需的微位移,理论分辨率可以达到1nm,主要功能是对位移平台的微调。The piezoelectric ceramic displacement platform 4 is composed of a piezoelectric controller and a piezoelectric ceramic precision platform, and the piezoelectric ceramic displacement platform 4 is fixed on the z-axis of the electronically controlled three-dimensional micro displacement platform 1 through a bracket 5 . Based on the inverse piezoelectric effect, by applying a voltage to the piezoelectric ceramics, it deforms in the specified direction to obtain the required micro-displacement. The theoretical resolution can reach 1nm. The main function is to fine-tune the displacement platform.
硅微三维微力传感器6的主要元件是基于压阻效应的三维微力硅微探针传感器。当X、Y或Z方向的作用力作用到传感器上时,传感器的弹性单元产生变形,从而引起制作在弹性单元上的压阻条发生形变,电阻发生变化,并通过惠斯通电桥转换成电压信号输出。该传感器具有高灵敏度,高线性度,高分辨率,高稳定性等优良特性,不但可以同时对三维力进行测量,而且分辨率可达uN级,是测量系统的核心元件。The main component of the silicon micro three-dimensional micro force sensor 6 is a three-dimensional micro force silicon micro probe sensor based on the piezoresistive effect. When the force in the X, Y or Z direction acts on the sensor, the elastic unit of the sensor is deformed, which causes the deformation of the piezoresistive strip made on the elastic unit, and the resistance changes, which is converted into a voltage through the Wheatstone bridge signal output. The sensor has excellent characteristics such as high sensitivity, high linearity, high resolution, and high stability. It can not only measure three-dimensional force at the same time, but also has a resolution of uN level. It is the core component of the measurement system.
为了测量传感器的输出电压并且输出准确的测量值,运用放大运算电路13、数字显示模块14组成信号调理与显示系统。放大运算电路13拟采用仪表放大器AD620,数字显示模块14由包括了A/D转换模块在内的三位半LED显示芯片ICL7106组成,显示待测微力值。In order to measure the output voltage of the sensor and output accurate measurement values, the signal conditioning and display system is composed of an
探针10为石英光纤探针,探针尖直径小于60um。The
本发明采用基于步进电机的三维微位移电控台粗调与压电陶瓷微位移台微调相结合的方式,很好的控制了平台的定位及预载荷力,保证了测量的范围与精度;三维微力硅微探针传感器保证了系统对三维微力的高精度、高灵敏度、高线性的测量;利用运算放大器对传感器的输出电压信号进行分析放大,并通过数字显示模块直接显示测量得到的微力,记录方便简单;因此,总体来说本发明测量性能好,操作简单,记录方便,可广泛应用于微系统中三维微力的测量,促进微装配、微加工与生物细胞技术水平的提高,实现微系统的可靠使用。The present invention adopts the method of combining the rough adjustment of the three-dimensional micro-displacement electric control table based on the stepping motor and the fine-tuning of the piezoelectric ceramic micro-displacement table, which well controls the positioning and preload force of the platform, and ensures the measurement range and accuracy; The three-dimensional micro-force silicon microprobe sensor ensures the system's high-precision, high-sensitivity, and high-linear measurement of three-dimensional micro-force; the operational amplifier is used to analyze and amplify the output voltage signal of the sensor, and the measured micro-force is directly displayed through the digital display module. The recording is convenient and simple; therefore, generally speaking, the present invention has good measurement performance, simple operation, and convenient recording, and can be widely used in the measurement of three-dimensional micro-forces in microsystems to promote the improvement of microassembly, micromachining and biological cell technology, and realize microsystem reliable use.
附图说明 Description of drawings
图1是本发明的三维微力测量装置的结构示意图。Fig. 1 is a structural schematic diagram of the three-dimensional micro-force measuring device of the present invention.
图2是本发明的三维微力硅微探针传感器结构示意图。Fig. 2 is a structural schematic diagram of the three-dimensional microforce silicon microprobe sensor of the present invention.
图3是本发明的信号调理与显示系统的电路图。Fig. 3 is a circuit diagram of the signal conditioning and display system of the present invention.
图4是本发明的三维微力测量装置的工作原理示意图。Fig. 4 is a schematic diagram of the working principle of the three-dimensional micro-force measuring device of the present invention.
具体实施方式 Detailed ways
下面结合附图详细说明本发明的实施方式。Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
如图1所示,本发明包括一减震平台3,在减震平台3上相距一定位置分别固定有电控三维位移平台1与载物台2,并将压电陶瓷位移平台4通过支架5固定在电控三维位移平台1的Z轴上,硅微三维微力传感器6通过支杆7固定在压电陶瓷平台4上,硅微三维微力传感器6的探针10朝下。As shown in Fig. 1, the present invention comprises a shock-absorbing platform 3, on the shock-absorbing platform 3, the electronically controlled three-dimensional displacement platform 1 and the stage 2 are respectively fixed at a certain distance, and the piezoelectric ceramic displacement platform 4 is passed through the support 5 Fixed on the Z axis of the electronically controlled three-dimensional displacement platform 1, the silicon micro three-dimensional micro force sensor 6 is fixed on the piezoelectric ceramic platform 4 through the
在测力过程中,首先通过电机控制器控制电控三维位移平台1上X、Y、Z三方向上的电机8发生转动,带动电控三维位移平台1移动对硅微三维微力传感器6位置进行初步调节,使其与载物台2上的待测物体充分接近,然后通过控制器控制压电陶瓷平台4对硅微三维微力传感器6位置进行细微调节,使探针10与待测物体接触,待测力通过探针10传递到硅微三维微力传感器6上,从而达到测力的目的。In the process of force measurement, firstly, the motor controller controls the rotation of the motor 8 in the three directions of X, Y, and Z on the electronically controlled three-dimensional displacement platform 1, and drives the electronically controlled three-dimensional displacement platform 1 to move to perform preliminary inspection on the position of the silicon micro three-dimensional micro force sensor 6. Adjust it so that it is sufficiently close to the object to be measured on the stage 2, and then finely adjust the position of the silicon micro three-dimensional micro force sensor 6 through the controller to control the piezoelectric ceramic platform 4, so that the
如图2所示,硅微三维微力传感器6包括一过载保护单元11,过载保护单元11上键合有弹性单元9,弹性单元9采用四单端固支梁支撑质量块的结构,利用体硅硅微工艺加工而成,四单端固支梁上利用离子注入技术在压阻系数最大晶向与最大应力区制作的敏感电阻组成惠斯通电桥,敏感电阻感应梁的变形并将其转换成电压信号输出;在弹性单元9的质量块中间通过黏贴剂固定有探针10,探针10为石英光纤探针,X、Y、Z方向的作用力通过该探针传递到弹性单元9的悬臂梁上,使悬臂梁产生变形。为了减小探针与被测物体的接触面积,提高传感器的灵敏度,用氢氟酸溶液对探针进行腐蚀使探针尖直径小于60um;过载保护单元11为玻璃基底,采用阳极键合技术与弹性单元9键合在一起,当作用力过大时,传感器的质量块与玻璃基底11接触,避免传感器遭到破坏。然后将硅微三维微力传感器6针尖朝下黏贴在支杆7上,支杆7的另一端固定在压电陶瓷微位移平台4上。As shown in Fig. 2, the silicon micro three-dimensional micro force sensor 6 includes an
图3为微力测量装置的信号调理电路,主要包括惠斯通电桥12,放大运算电路13以及数字显示模块14。电压信号由惠斯通电桥12输出后,由于比较微弱,经放大运算电路13放大后输入到数字显示模块14中,通过LED显示待测微力值。本发明的放大运算电路13拟采用仪表放大器AD620,数字显示模块14由包括了A/D转换模块在内的三位半LED显示芯片ICL7106组成,显示待测微力值。FIG. 3 is a signal conditioning circuit of the micro-force measuring device, which mainly includes a Wheatstone
如图4所示,本发明通过计算机控制器编写位移控制命令程序,对三维位移平台传输程序命令序列,控制三维位移平台按设定的位移方案做三个方向的移动,使固定在平台上的硅微三维微力传感器6的探针接触到载物台2上的待测物体达到对其施加作用力的目的,导致硅微三维微力传感器6弹性体变形,传感器敏感电阻发生变化,通过惠斯通电桥转化成电压信号输出,电压信号通过信号调理与显示电路显示出来。As shown in Figure 4, the present invention writes the displacement control command program through the computer controller, transmits the program command sequence to the three-dimensional displacement platform, and controls the three-dimensional displacement platform to move in three directions according to the displacement scheme set, so that the three-dimensional displacement platform is fixed on the platform. The probe of the silicon micro three-dimensional micro force sensor 6 touches the object to be measured on the stage 2 to apply force to it, which causes the elastic body of the silicon micro three-dimensional micro force sensor 6 to deform, and the sensitive resistance of the sensor changes. The bridge is converted into a voltage signal output, and the voltage signal is displayed through the signal conditioning and display circuit.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100232277A CN101710006B (en) | 2009-07-07 | 2009-07-07 | Three-dimensional micro-force measuring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009100232277A CN101710006B (en) | 2009-07-07 | 2009-07-07 | Three-dimensional micro-force measuring device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101710006A CN101710006A (en) | 2010-05-19 |
CN101710006B true CN101710006B (en) | 2012-04-25 |
Family
ID=42402804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100232277A Expired - Fee Related CN101710006B (en) | 2009-07-07 | 2009-07-07 | Three-dimensional micro-force measuring device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101710006B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102374949A (en) * | 2010-08-10 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | Load testing machine |
CN102169035B (en) * | 2010-12-22 | 2012-06-27 | 中国科学院广州能源研究所 | Torsional high-accuracy micro-thrust measuring system |
CN102175361B (en) * | 2011-01-27 | 2014-07-23 | 西安交通大学 | Three-dimensional micro-force sensor capable of measuring sub micro Newton force and packaging method of three-dimensional micro-force sensor |
CN105628269B (en) * | 2015-12-25 | 2019-01-18 | 湖南师范大学 | A kind of micro- power and micro-displacement amplify sensor |
CN107471085B (en) * | 2017-09-17 | 2023-04-21 | 长春工业大学 | Six-dimensional force measuring device and method based on grinding and polishing of viscoelastic material |
CN112834091A (en) * | 2020-12-31 | 2021-05-25 | 苏州大学 | Micro-force sensor for micro-assembly and piezoelectric ceramic-driven micro-gripper |
CN113340476B (en) * | 2021-05-08 | 2023-10-27 | 昆山朗德森机电科技有限公司 | Two-dimensional decoupling moment touch sensor and MEMS preparation method |
CN115683423B (en) * | 2022-10-28 | 2024-09-27 | 刘業灿 | Device for monitoring mechanical properties of cells |
CN116182919B (en) * | 2023-04-23 | 2023-09-12 | 西北工业大学 | Triaxial high-temperature vibration sensor based on optical fiber F-P cavity and preparation method thereof |
CN118443184A (en) * | 2024-04-17 | 2024-08-06 | 中山大学 | Ultra-high precision weak force measurement system with vibration resistance and constant temperature |
-
2009
- 2009-07-07 CN CN2009100232277A patent/CN101710006B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101710006A (en) | 2010-05-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101710006B (en) | Three-dimensional micro-force measuring device | |
Shi et al. | A microgripper with a large magnification ratio and high structural stiffness based on a flexure-enabled mechanism | |
CN102768291B (en) | Piezoresistive monolithic integrated four-beam tri-axial accelerometer | |
CN101561334B (en) | Method for calibrating three-dimensional micro-touch force sensor | |
CN101308051A (en) | 3D microforce silicon microsensor | |
CN102288501A (en) | Precise nanoindentation test device | |
CN205449351U (en) | Small -size three -dimensional force transducer | |
CN107064561B (en) | Calibration device and calibration method for single-axis acceleration sensor | |
CN201976028U (en) | Self-testing piezoelectric drive platform with built-in strain gauge | |
CN109231152B (en) | Micro-clamp for measuring clamping force and clamping jaw displacement by using fiber Fabry-Perot interferometer | |
CN102998074A (en) | Device and method for testing vibration performance of basic translation flexible beam | |
Beyeler et al. | Design and calibration of a microfabricated 6-axis force-torque sensor for microrobotic applications | |
CN105929866A (en) | Hinge plate vibration control device based on multiple laser displacement sensor and method | |
Gao et al. | A high-resolution MEMS capacitive force sensor with bionic swallow comb arrays for ultralow multiphysics measurement | |
CN204374047U (en) | A kind of micro tribology measurement mechanism | |
CN103075951B (en) | Three-dimensional micro touch probe based on capacitive sensor array | |
Beutel et al. | Cell manipulation system based on a self-calibrating silicon micro force sensor providing capillary status monitoring | |
CN102353483A (en) | Device for detecting three-dimensional micro mechanical signal | |
CN203069578U (en) | Full-automatic collection liquid-plastic limit combined determination system | |
Jiang et al. | A cost effective multi-axis force sensor for large scale measurement: Design, modeling, and simulation | |
CN116930554A (en) | Speed sensor calibration system and calibration method for precision instrument vibration isolator | |
CN101813451A (en) | Array measuring head for micro-nano geometrical quantity measurement | |
CN106289624A (en) | A kind of oceanic turbulence sensor based on MEMS | |
Li et al. | Design, identification and control of a 2-degree of freedom flexure-based mechanism for micro/nano manipulation | |
Muntwyler et al. | Three-axis micro-force sensor with tunable force range and sub-micronewton measurement uncertainty |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120425 Termination date: 20140707 |
|
EXPY | Termination of patent right or utility model |