CN101710006B - Three-dimensional micro-force measuring device - Google Patents

Three-dimensional micro-force measuring device Download PDF

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CN101710006B
CN101710006B CN2009100232277A CN200910023227A CN101710006B CN 101710006 B CN101710006 B CN 101710006B CN 2009100232277 A CN2009100232277 A CN 2009100232277A CN 200910023227 A CN200910023227 A CN 200910023227A CN 101710006 B CN101710006 B CN 101710006B
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CN101710006A (en
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赵玉龙
王伟忠
林启敬
蒋庄德
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Xian Jiaotong University
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Abstract

The invention relates to a three-dimensional micro-force measuring device, which comprises a shock absorption platform 3, wherein an electric control three-dimensional displacement platform 1 and an object stage 2 are fixed on the shock absorption platform 3; a piezoelectric ceramic displacement platform 4 is fixed on a Z axis of the electric control three-dimensional displacement platform 1; a silicon micro three-dimensional micro-force sensor 6 is fixed on the piezoelectric ceramic displacement platform 4; a Wheatstone bridge 12 of the silicon micro three-dimensional micro-force sensor 6 outputs a voltage signal to an amplification operational circuit 13; and the voltage signal is amplified by the amplification operational circuit 13 and then is input in a digital display module 14. The three-dimensional micro-force measuring device can simultaneously measure muN level three-dimensional micro-force, and has the characteristics of high accuracy, high flexibility and good linearity.

Description

一种三维微力测量装置A three-dimensional micro-force measuring device

技术领域 technical field

本发明属于微力测试技术领域,特别涉及到一种基于压阻效应的三维微力硅微探针传感器的三维微力测量装置。The invention belongs to the technical field of micro-force testing, and in particular relates to a three-dimensional micro-force measuring device based on a piezoresistive effect-based three-dimensional micro-force silicon microprobe sensor.

背景技术 Background technique

近几年来,随着微机电系统(MEMS)技术的不断发展,越来越多的学者与研究机构开始对微观世界进行深入研究。为了更好地对微观物质进行操作和研究其力学特性,非常有必要开展三维微力测量技术的研究,特别是微牛顿(uN)级的三维微力测量和传感技术。在MEMS系统中微尺度构件力学性能的研究、机器人触觉系统中的微力测量与加载、微纳器件装配中的微力监测、生物技术、细胞操作以及微制造技术等领域中多需要三维微力的测量与控制,因此三维微力测量得到了世界各国的广泛关注,已经成为国内外研究的热点。但目前来看,绝大部分传统的三维力测量系统测力范围还限制在牛顿级别,缺少测量μN级作用力的能力;而基于MEMS微传感器的微力测量系统还相对较少,且虽然可以达到测量μN量级作用力的能力,但往往只能测量单维或二维微力。In recent years, with the continuous development of microelectromechanical systems (MEMS) technology, more and more scholars and research institutions have begun to conduct in-depth research on the microcosm. In order to better manipulate microscopic substances and study their mechanical properties, it is very necessary to carry out research on three-dimensional micro-force measurement technology, especially micro-Newton (uN) level three-dimensional micro-force measurement and sensing technology. The research on the mechanical properties of micro-scale components in MEMS systems, the measurement and loading of micro-forces in robot tactile systems, the micro-force monitoring in the assembly of micro-nano devices, biotechnology, cell manipulation, and micro-manufacturing technology require the measurement and measurement of three-dimensional micro-forces. Therefore, the three-dimensional micro-force measurement has attracted extensive attention from all over the world, and has become a research hotspot at home and abroad. But at present, most of the traditional three-dimensional force measurement systems are still limited to the Newton level, lacking the ability to measure μN-level force; and there are relatively few micro-force measurement systems based on MEMS microsensors, and although they can reach The ability to measure force on the order of μN, but often only one-dimensional or two-dimensional micro force can be measured.

发明内容 Contents of the invention

为了克服上述现有技术的缺陷,本发明的目的在于提出一种基于压阻效应的三维微力硅微探针传感器的三维微力测量装置,可以同时进行μN级三维微力的测量,具有精度声、灵敏度高、线形好的特点。In order to overcome the defects of the above-mentioned prior art, the object of the present invention is to propose a three-dimensional micro-force measuring device based on the piezoresistive effect of a three-dimensional micro-force silicon microprobe sensor, which can simultaneously measure the three-dimensional micro-force of μN level, and has high precision and high sensitivity. High, linear features.

为了实现上述目的,本发明采用的技术方案如下:In order to achieve the above object, the technical scheme adopted in the present invention is as follows:

一种三维微力测量装置,包括一减震平台3,在减震平台3上相距一定位置分别固定有电控三维位移平台1与载物台2,并将压电陶瓷位移平台4固定在电控三维位移平台1的Z轴上,硅微三维微力传感器6固定在压电陶瓷平台4上;硅微三维微力传感器6的探针10朝下;硅微三维微力传感器6的惠斯通电桥12将电压信号输出至放大运算电路13,电压信号经放大运算电路13放大后输入到数字显示模块14中。A three-dimensional micro-force measuring device, comprising a shock-absorbing platform 3, on which an electronically controlled three-dimensional displacement platform 1 and an object stage 2 are respectively fixed at a certain distance from each other, and a piezoelectric ceramic displacement platform 4 is fixed on the electronically controlled On the Z axis of the three-dimensional displacement platform 1, the silicon micro-three-dimensional micro-force sensor 6 is fixed on the piezoelectric ceramic platform 4; the probe 10 of the silicon-micro three-dimensional micro-force sensor 6 faces downward; the Wheatstone bridge 12 of the silicon micro-three-dimensional micro-force sensor 6 will The voltage signal is output to the amplification operation circuit 13 , and the voltage signal is amplified by the amplification operation circuit 13 and then input to the digital display module 14 .

电控三维微位移平台1由步进电机控制器,以及x、y、z三轴电控平移台构成,其最小分辨率可达1.25μm,主要功能是对位移平台的粗调。步进电机是一种将电脉冲信号转化为角位移的执行机构。当步进驱动器接收到一个脉冲信号,它就驱动步进电机按设定的方向转动一个固定的角度,它的旋转是以固定的角度一步一步运行的。可以通过控制脉冲个数来控制角位移量,带动电控平移台导轨转动,从而达到电控平移台准确定位的目的。The electronically controlled three-dimensional micro-displacement platform 1 is composed of a stepping motor controller and an electronically controlled three-axis translation platform of x, y, and z. Its minimum resolution can reach 1.25 μm, and its main function is to roughly adjust the displacement platform. A stepper motor is an actuator that converts electrical pulse signals into angular displacements. When the stepper driver receives a pulse signal, it drives the stepper motor to rotate a fixed angle in the set direction, and its rotation runs step by step at a fixed angle. The angular displacement can be controlled by controlling the number of pulses to drive the guide rail of the electronically controlled translation platform to rotate, so as to achieve the purpose of accurate positioning of the electronically controlled translation platform.

压电陶瓷位移平台4由压电控制器以及压电陶瓷精密平台组成,并通过支架5将压电陶瓷位移平台4固定在电控三维微位移平台1的z轴上。基于逆压电效应,通过对压电陶瓷施加电压,使其在指定方向产生变形,得到所需的微位移,理论分辨率可以达到1nm,主要功能是对位移平台的微调。The piezoelectric ceramic displacement platform 4 is composed of a piezoelectric controller and a piezoelectric ceramic precision platform, and the piezoelectric ceramic displacement platform 4 is fixed on the z-axis of the electronically controlled three-dimensional micro displacement platform 1 through a bracket 5 . Based on the inverse piezoelectric effect, by applying a voltage to the piezoelectric ceramics, it deforms in the specified direction to obtain the required micro-displacement. The theoretical resolution can reach 1nm. The main function is to fine-tune the displacement platform.

硅微三维微力传感器6的主要元件是基于压阻效应的三维微力硅微探针传感器。当X、Y或Z方向的作用力作用到传感器上时,传感器的弹性单元产生变形,从而引起制作在弹性单元上的压阻条发生形变,电阻发生变化,并通过惠斯通电桥转换成电压信号输出。该传感器具有高灵敏度,高线性度,高分辨率,高稳定性等优良特性,不但可以同时对三维力进行测量,而且分辨率可达uN级,是测量系统的核心元件。The main component of the silicon micro three-dimensional micro force sensor 6 is a three-dimensional micro force silicon micro probe sensor based on the piezoresistive effect. When the force in the X, Y or Z direction acts on the sensor, the elastic unit of the sensor is deformed, which causes the deformation of the piezoresistive strip made on the elastic unit, and the resistance changes, which is converted into a voltage through the Wheatstone bridge signal output. The sensor has excellent characteristics such as high sensitivity, high linearity, high resolution, and high stability. It can not only measure three-dimensional force at the same time, but also has a resolution of uN level. It is the core component of the measurement system.

为了测量传感器的输出电压并且输出准确的测量值,运用放大运算电路13、数字显示模块14组成信号调理与显示系统。放大运算电路13拟采用仪表放大器AD620,数字显示模块14由包括了A/D转换模块在内的三位半LED显示芯片ICL7106组成,显示待测微力值。In order to measure the output voltage of the sensor and output accurate measurement values, the signal conditioning and display system is composed of an amplification operation circuit 13 and a digital display module 14 . The amplification operation circuit 13 intends to adopt the instrument amplifier AD620, and the digital display module 14 is composed of a three-and-a-half-digit LED display chip ICL7106 including an A/D conversion module, and displays the micro force value to be measured.

探针10为石英光纤探针,探针尖直径小于60um。The probe 10 is a quartz fiber probe, and the diameter of the probe tip is less than 60um.

本发明采用基于步进电机的三维微位移电控台粗调与压电陶瓷微位移台微调相结合的方式,很好的控制了平台的定位及预载荷力,保证了测量的范围与精度;三维微力硅微探针传感器保证了系统对三维微力的高精度、高灵敏度、高线性的测量;利用运算放大器对传感器的输出电压信号进行分析放大,并通过数字显示模块直接显示测量得到的微力,记录方便简单;因此,总体来说本发明测量性能好,操作简单,记录方便,可广泛应用于微系统中三维微力的测量,促进微装配、微加工与生物细胞技术水平的提高,实现微系统的可靠使用。The present invention adopts the method of combining the rough adjustment of the three-dimensional micro-displacement electric control table based on the stepping motor and the fine-tuning of the piezoelectric ceramic micro-displacement table, which well controls the positioning and preload force of the platform, and ensures the measurement range and accuracy; The three-dimensional micro-force silicon microprobe sensor ensures the system's high-precision, high-sensitivity, and high-linear measurement of three-dimensional micro-force; the operational amplifier is used to analyze and amplify the output voltage signal of the sensor, and the measured micro-force is directly displayed through the digital display module. The recording is convenient and simple; therefore, generally speaking, the present invention has good measurement performance, simple operation, and convenient recording, and can be widely used in the measurement of three-dimensional micro-forces in microsystems to promote the improvement of microassembly, micromachining and biological cell technology, and realize microsystem reliable use.

附图说明 Description of drawings

图1是本发明的三维微力测量装置的结构示意图。Fig. 1 is a structural schematic diagram of the three-dimensional micro-force measuring device of the present invention.

图2是本发明的三维微力硅微探针传感器结构示意图。Fig. 2 is a structural schematic diagram of the three-dimensional microforce silicon microprobe sensor of the present invention.

图3是本发明的信号调理与显示系统的电路图。Fig. 3 is a circuit diagram of the signal conditioning and display system of the present invention.

图4是本发明的三维微力测量装置的工作原理示意图。Fig. 4 is a schematic diagram of the working principle of the three-dimensional micro-force measuring device of the present invention.

具体实施方式 Detailed ways

下面结合附图详细说明本发明的实施方式。Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

如图1所示,本发明包括一减震平台3,在减震平台3上相距一定位置分别固定有电控三维位移平台1与载物台2,并将压电陶瓷位移平台4通过支架5固定在电控三维位移平台1的Z轴上,硅微三维微力传感器6通过支杆7固定在压电陶瓷平台4上,硅微三维微力传感器6的探针10朝下。As shown in Fig. 1, the present invention comprises a shock-absorbing platform 3, on the shock-absorbing platform 3, the electronically controlled three-dimensional displacement platform 1 and the stage 2 are respectively fixed at a certain distance, and the piezoelectric ceramic displacement platform 4 is passed through the support 5 Fixed on the Z axis of the electronically controlled three-dimensional displacement platform 1, the silicon micro three-dimensional micro force sensor 6 is fixed on the piezoelectric ceramic platform 4 through the strut 7, and the probe 10 of the silicon micro three-dimensional micro force sensor 6 faces downward.

在测力过程中,首先通过电机控制器控制电控三维位移平台1上X、Y、Z三方向上的电机8发生转动,带动电控三维位移平台1移动对硅微三维微力传感器6位置进行初步调节,使其与载物台2上的待测物体充分接近,然后通过控制器控制压电陶瓷平台4对硅微三维微力传感器6位置进行细微调节,使探针10与待测物体接触,待测力通过探针10传递到硅微三维微力传感器6上,从而达到测力的目的。In the process of force measurement, firstly, the motor controller controls the rotation of the motor 8 in the three directions of X, Y, and Z on the electronically controlled three-dimensional displacement platform 1, and drives the electronically controlled three-dimensional displacement platform 1 to move to perform preliminary inspection on the position of the silicon micro three-dimensional micro force sensor 6. Adjust it so that it is sufficiently close to the object to be measured on the stage 2, and then finely adjust the position of the silicon micro three-dimensional micro force sensor 6 through the controller to control the piezoelectric ceramic platform 4, so that the probe 10 is in contact with the object to be measured. The force measurement is transmitted to the silicon micro three-dimensional micro force sensor 6 through the probe 10, so as to achieve the purpose of force measurement.

如图2所示,硅微三维微力传感器6包括一过载保护单元11,过载保护单元11上键合有弹性单元9,弹性单元9采用四单端固支梁支撑质量块的结构,利用体硅硅微工艺加工而成,四单端固支梁上利用离子注入技术在压阻系数最大晶向与最大应力区制作的敏感电阻组成惠斯通电桥,敏感电阻感应梁的变形并将其转换成电压信号输出;在弹性单元9的质量块中间通过黏贴剂固定有探针10,探针10为石英光纤探针,X、Y、Z方向的作用力通过该探针传递到弹性单元9的悬臂梁上,使悬臂梁产生变形。为了减小探针与被测物体的接触面积,提高传感器的灵敏度,用氢氟酸溶液对探针进行腐蚀使探针尖直径小于60um;过载保护单元11为玻璃基底,采用阳极键合技术与弹性单元9键合在一起,当作用力过大时,传感器的质量块与玻璃基底11接触,避免传感器遭到破坏。然后将硅微三维微力传感器6针尖朝下黏贴在支杆7上,支杆7的另一端固定在压电陶瓷微位移平台4上。As shown in Fig. 2, the silicon micro three-dimensional micro force sensor 6 includes an overload protection unit 11, and an elastic unit 9 is bonded to the overload protection unit 11. Processed by silicon micro-process, four single-ended fixed-supported beams are made of sensitive resistors in the maximum piezoresistive coefficient crystal direction and maximum stress area by ion implantation technology to form a Wheatstone bridge. The sensitive resistors sense the deformation of the beam and convert it into Voltage signal output; in the middle of the mass block of the elastic unit 9, a probe 10 is fixed by an adhesive. The probe 10 is a quartz fiber probe, and the force in the X, Y, and Z directions is transmitted to the elastic unit 9 through the probe. On the cantilever beam, the cantilever beam is deformed. In order to reduce the contact area between the probe and the measured object and improve the sensitivity of the sensor, the probe is corroded with hydrofluoric acid solution so that the diameter of the probe tip is less than 60um; the overload protection unit 11 is a glass substrate, using anodic bonding technology and The elastic units 9 are bonded together, and when the force is too large, the mass block of the sensor is in contact with the glass substrate 11 to prevent the sensor from being damaged. Then, the silicon micro three-dimensional micro force sensor 6 is pasted on the support rod 7 with the needle point facing down, and the other end of the support rod 7 is fixed on the piezoelectric ceramic micro-displacement platform 4 .

图3为微力测量装置的信号调理电路,主要包括惠斯通电桥12,放大运算电路13以及数字显示模块14。电压信号由惠斯通电桥12输出后,由于比较微弱,经放大运算电路13放大后输入到数字显示模块14中,通过LED显示待测微力值。本发明的放大运算电路13拟采用仪表放大器AD620,数字显示模块14由包括了A/D转换模块在内的三位半LED显示芯片ICL7106组成,显示待测微力值。FIG. 3 is a signal conditioning circuit of the micro-force measuring device, which mainly includes a Wheatstone bridge 12 , an amplification operation circuit 13 and a digital display module 14 . After the voltage signal is output by the Wheatstone bridge 12, because it is relatively weak, it is amplified by the amplification operation circuit 13 and then input to the digital display module 14, and the micro force value to be measured is displayed through the LED. The amplification operation circuit 13 of the present invention intends to adopt instrument amplifier AD620, and the digital display module 14 is composed of three and a half LED display chips ICL7106 including the A/D conversion module, and displays the micro force value to be measured.

如图4所示,本发明通过计算机控制器编写位移控制命令程序,对三维位移平台传输程序命令序列,控制三维位移平台按设定的位移方案做三个方向的移动,使固定在平台上的硅微三维微力传感器6的探针接触到载物台2上的待测物体达到对其施加作用力的目的,导致硅微三维微力传感器6弹性体变形,传感器敏感电阻发生变化,通过惠斯通电桥转化成电压信号输出,电压信号通过信号调理与显示电路显示出来。As shown in Figure 4, the present invention writes the displacement control command program through the computer controller, transmits the program command sequence to the three-dimensional displacement platform, and controls the three-dimensional displacement platform to move in three directions according to the displacement scheme set, so that the three-dimensional displacement platform is fixed on the platform. The probe of the silicon micro three-dimensional micro force sensor 6 touches the object to be measured on the stage 2 to apply force to it, which causes the elastic body of the silicon micro three-dimensional micro force sensor 6 to deform, and the sensitive resistance of the sensor changes. The bridge is converted into a voltage signal output, and the voltage signal is displayed through the signal conditioning and display circuit.

Claims (5)

1. three-dimensional micro-force measuring device; Comprise a damped platform (3); Going up apart at damped platform (3), certain position is fixed with automatically controlled three-D displacement platform (1) and objective table (2) respectively; It is characterized in that piezoelectric ceramics displacement platform (4) is fixed on through support (5) on the Z axle of automatically controlled three-D displacement platform (1), and the little three-dimensional micro-force sensor of silicon (6) is fixed on the piezoelectric ceramics platform (4) through pole (7); The Wheatstone bridge (12) of the little three-dimensional micro-force sensor of silicon (6) exports voltage signal to and amplifies computing circuit (13), and voltage signal is input in the digital display module (14) after computing circuit (13) amplifies through amplifying.
2. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that the probe (10) of the little three-dimensional micro-force sensor of silicon (6) down.
3. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that, amplify computing circuit (13) and intend employing instrument amplifier AD620.
4. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that digital display module (14) is made up of the three and half LED display chip ICL7106 that comprised the A/D modular converter.
5. according to the said three-dimensional micro-force measuring device of claim 2, it is characterized in that probe (10) is the silica fibre probe, the probe pinpoint diameter is less than 60um.
CN2009100232277A 2009-07-07 2009-07-07 Three-dimensional micro-force measuring device Expired - Fee Related CN101710006B (en)

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