CN101710006B - Three-dimensional micro-force measuring device - Google Patents
Three-dimensional micro-force measuring device Download PDFInfo
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- CN101710006B CN101710006B CN2009100232277A CN200910023227A CN101710006B CN 101710006 B CN101710006 B CN 101710006B CN 2009100232277 A CN2009100232277 A CN 2009100232277A CN 200910023227 A CN200910023227 A CN 200910023227A CN 101710006 B CN101710006 B CN 101710006B
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Abstract
The invention relates to a three-dimensional micro-force measuring device, which comprises a shock absorption platform 3, wherein an electric control three-dimensional displacement platform 1 and an object stage 2 are fixed on the shock absorption platform 3; a piezoelectric ceramic displacement platform 4 is fixed on a Z axis of the electric control three-dimensional displacement platform 1; a silicon micro three-dimensional micro-force sensor 6 is fixed on the piezoelectric ceramic displacement platform 4; a Wheatstone bridge 12 of the silicon micro three-dimensional micro-force sensor 6 outputs a voltage signal to an amplification operational circuit 13; and the voltage signal is amplified by the amplification operational circuit 13 and then is input in a digital display module 14. The three-dimensional micro-force measuring device can simultaneously measure muN level three-dimensional micro-force, and has the characteristics of high accuracy, high flexibility and good linearity.
Description
Technical field
The invention belongs to little power technical field of measurement and test, specially refer to a kind of three-dimensional micro-force measuring device of the three-dimensional micro-force silicon microprobe sensor based on piezoresistive effect.
Background technology
In recent years, along with the continuous development of MEMS (MEMS) technology, more and more scholars and research institution began microworld is furtherd investigate.In order better microscopic species to be operated and studied its mechanical characteristic, be necessary very much to carry out the three-dimensional micro-force measurement Study on Technology, the three-dimensional micro-force measurement and the sensing technology of particularly little newton (uN) level.Need the measurement and the control of three-dimensional micro-force in the fields such as little power monitoring, biotechnology, cell manipulation and micro-fabrication technology in the research of microscale member mechanical property, the micro-force measurement in the tactile sensing device of robot system and loading in the MEMS system, the micro-nano device assembling more; Therefore three-dimensional micro-force measurement has obtained the extensive concern of countries in the world, has become the focus of domestic and international research.But at present, the traditional three-dimensional force measuring system dynamometry scope of the overwhelming majority is further limited in newton's rank, lacks the ability of measuring μ N level acting force; And also less relatively based on the micro-force measurement system of MEMS microsensor, though and can reach the ability of measuring μ N magnitude acting force, often can only measure one-dimensional or two-dimensional micro-force.
Summary of the invention
In order to overcome the defective of above-mentioned prior art; The objective of the invention is to propose a kind of three-dimensional micro-force measuring device of the three-dimensional micro-force silicon microprobe sensor based on piezoresistive effect; Can carry out the measurement of μ N level three-dimensional micro-force simultaneously, have precision sound, highly sensitive, linear good characteristics.
To achieve these goals, the technical scheme of the present invention's employing is following:
A kind of three-dimensional micro-force measuring device; Comprise a damped platform 3; On damped platform 3, be fixed with automatically controlled three-D displacement platform 1 and objective table 2 respectively at a distance of certain position; And piezoelectric ceramics displacement platform 4 is fixed on the Z axle of automatically controlled three-D displacement platform 1, the little three-dimensional micro-force sensor 6 of silicon is fixed on the piezoelectric ceramics platform 4; The probe 10 of the little three-dimensional micro-force sensor 6 of silicon down; The Wheatstone bridge 12 of the little three-dimensional micro-force sensor 6 of silicon exports voltage signal to and amplifies computing circuit 13, and voltage signal is input in the digital display module 14 after computing circuit 13 amplifies through amplifying.
Automatically controlled three-dimensional micro-displacement platform 1 is by controllor for step-by-step motor, and x, y, three electronic control translation stages of z constitute, and its minimum resolution can reach 1.25 μ m, and major function is the coarse adjustment to displacement platform.Stepper motor is a kind of topworks that electric impulse signal is converted into angular displacement.When step actuator receives a pulse signal, it rotates a fixing angle with regard to drive stepping motor by the direction of setting, and its rotation is to move step by step with fixing angle.Can come the pilot angle displacement through the gating pulse number, drive the electronic control translation stage guide rail and rotate, thereby reach the accurately purpose of location of electronic control translation stage.
Piezoelectric ceramics displacement platform 4 is made up of piezo controller and piezoelectric ceramics precision surface plate, and through support 5 piezoelectric ceramics displacement platform 4 is fixed on the z axle of automatically controlled three-dimensional micro-displacement platform 1.Based on inverse piezoelectric effect, through piezoelectric ceramics is applied voltage, make it produce distortion at assigned direction, obtain required micrometric displacement, theoretical resolution can reach 1nm, and major function is the fine setting to displacement platform.
The main element of the little three-dimensional micro-force sensor 6 of silicon is based on the three-dimensional micro-force silicon microprobe sensor of piezoresistive effect.When the acting force of X, Y or Z direction affacted on the sensor, the Flexible element of sensor produced distortion, thereby causes the pressure drag bar generation deformation that is produced on the Flexible element, and resistance changes, and converted voltage signal output to through Wheatstone bridge.This sensor has high sensitivity, high linearity, and high resolving power, good characteristics such as high stability not only can be measured three-dimensional force simultaneously, and resolution can reach the uN level, are the core parts of measuring system.
For the output voltage of survey sensor and export measured value accurately, computing circuit 13 is amplified in utilization, digital display module 14 is formed signal condition and display systems.Amplify computing circuit 13 and intend employing instrument amplifier AD620, digital display module 14 is made up of the three and half LED display chip ICL7106 that comprised the A/D modular converter, shows to treat micrometer power value.
The present invention adopts based on automatically controlled coarse adjustment of three-dimensional micrometric displacement of stepper motor and finely tunes the mode that combines with piezoelectric ceramics micrometric displacement platform, better controlled the location and the pre-load force of platform, guaranteed range for measuring and precision; Three-dimensional micro-force silicon microprobe sensor has guaranteed high precision, high sensitivity, the high linear measurement of system to three-dimensional micro-force; Utilize operational amplifier that the output voltage signal of sensor is analyzed amplification, and directly show the little power that measures, write down convenient and simple through digital display module; Therefore, measurement performance of the present invention on the whole is good, simple to operate, and record is convenient, can be widely used in the measurement of three-dimensional micro-force in the micro-system, promotes the raising of little assembling, little processing and biological cell technical merit, realizes the reliable use of micro-system.
Description of drawings
Fig. 1 is the structural representation of three-dimensional micro-force measuring device of the present invention.
Fig. 2 is a three-dimensional micro-force silicon microprobe sensor construction synoptic diagram of the present invention.
Fig. 3 is the circuit diagram of signal condition of the present invention and display system.
Fig. 4 is the principle of work synoptic diagram of three-dimensional micro-force measuring device of the present invention.
Embodiment
Specify embodiment of the present invention below in conjunction with accompanying drawing.
As shown in Figure 1; The present invention includes a damped platform 3; On damped platform 3, be fixed with automatically controlled three-D displacement platform 1 and objective table 2 respectively at a distance of certain position; And piezoelectric ceramics displacement platform 4 is fixed on through support 5 on the Z axle of automatically controlled three-D displacement platform 1, the little three-dimensional micro-force sensor 6 of silicon is fixed on the piezoelectric ceramics platform 4 through pole 7, and the probe 10 of the little three-dimensional micro-force sensor 6 of silicon is down.
In the dynamometry process; The motor 8 that at first makes progress through X, Y, Z three parts on the automatically controlled three-D displacement platform 1 of motor controller controls rotates; Driving automatically controlled three-D displacement platform 1 moves the little three-dimensional micro-force sensor of silicon 6 positions is tentatively regulated; Make the object under test on itself and the objective table 2 fully approaching, carry out fine adjustments through the little three-dimensional micro-force sensor of controller control 4 pairs of silicon of piezoelectric ceramics platform 6 positions then, probe 10 is contacted with object under test; Testing force is delivered on the little three-dimensional micro-force sensor 6 of silicon through probe 10, thereby reaches the purpose of dynamometry.
As shown in Figure 2; The little three-dimensional micro-force sensor 6 of silicon comprises an overload protection unit 11; The flexible unit 9 of bonding on the overload protection unit 11, Flexible element 9 adopt four single-ended clamped beams to support the structure of mass, utilize the little processes of body silicon silicon to form; Utilize ion implantation technique to form Wheatstone bridge at the sensitive resistance of maximum crystal orientation of piezoresistance coefficient and the making of maximum stress district on the four single-ended clamped beams, the distortion of sensitive resistance sense beam also converts thereof into voltage signal output; In the middle of the mass of Flexible element 9, be fixed with probe 10 through pasting agent, probe 10 is the silica fibre probe, and the acting force of X, Y, Z direction is delivered on the semi-girder of Flexible element 9 through this probe, makes semi-girder produce distortion.In order to reduce the contact area of probe and testee, improve the sensitivity of sensor, with hydrofluoric acid solution probe is corroded and make the probe pinpoint diameter less than 60um; Overload protection unit 11 is a substrate of glass, adopts the anode linkage technology to be bonded together with Flexible element 9, and when acting force was excessive, the mass of sensor contacted with substrate of glass 11, avoids sensor to be destroyed.Then little three-dimensional micro-force sensor 6 needle points of silicon are pasted down on pole 7, the other end of pole 7 is fixed on the piezoelectric ceramics micro-displacement platform 4.
Fig. 3 is the signal conditioning circuit of micro-force measuring apparatus, mainly comprises Wheatstone bridge 12, amplifies computing circuit 13 and digital display module 14.After voltage signal is exported by Wheatstone bridge 12, since fainter, be input in the digital display module 14 after computing circuit 13 amplifies through amplifying, show through LED and treat micrometer power value.Amplification computing circuit 13 of the present invention is intended and is adopted instrument amplifier AD620, and digital display module 14 is made up of the three and half LED display chip ICL7106 that comprised the A/D modular converter, shows to treat micrometer power value.
As shown in Figure 4; The present invention writes the displacement control command program through computer control; To three-D displacement platform transmission procedure command sequence, control three-D displacement platform is done moving of three directions by the displacement scheme of setting, and the object under test that the probe of the little three-dimensional micro-force sensor 6 of the silicon that is fixed on the platform is touched on the objective table 2 reaches the purpose that it is applied acting force; Cause the little three-dimensional micro-force sensor 6 elastic bodys distortion of silicon; Sensor sensing resistance changes, and changes into voltage signal output through Wheatstone bridge, and voltage signal shows through signal condition and display circuit.
Claims (5)
1. three-dimensional micro-force measuring device; Comprise a damped platform (3); Going up apart at damped platform (3), certain position is fixed with automatically controlled three-D displacement platform (1) and objective table (2) respectively; It is characterized in that piezoelectric ceramics displacement platform (4) is fixed on through support (5) on the Z axle of automatically controlled three-D displacement platform (1), and the little three-dimensional micro-force sensor of silicon (6) is fixed on the piezoelectric ceramics platform (4) through pole (7); The Wheatstone bridge (12) of the little three-dimensional micro-force sensor of silicon (6) exports voltage signal to and amplifies computing circuit (13), and voltage signal is input in the digital display module (14) after computing circuit (13) amplifies through amplifying.
2. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that the probe (10) of the little three-dimensional micro-force sensor of silicon (6) down.
3. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that, amplify computing circuit (13) and intend employing instrument amplifier AD620.
4. according to the said three-dimensional micro-force measuring device of claim 1, it is characterized in that digital display module (14) is made up of the three and half LED display chip ICL7106 that comprised the A/D modular converter.
5. according to the said three-dimensional micro-force measuring device of claim 2, it is characterized in that probe (10) is the silica fibre probe, the probe pinpoint diameter is less than 60um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100232277A CN101710006B (en) | 2009-07-07 | 2009-07-07 | Three-dimensional micro-force measuring device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100232277A CN101710006B (en) | 2009-07-07 | 2009-07-07 | Three-dimensional micro-force measuring device |
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| CN101710006A CN101710006A (en) | 2010-05-19 |
| CN101710006B true CN101710006B (en) | 2012-04-25 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102374949A (en) * | 2010-08-10 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Load testing machine |
| CN102169035B (en) * | 2010-12-22 | 2012-06-27 | 中国科学院广州能源研究所 | Torsional high-accuracy micro-thrust measuring system |
| CN102175361B (en) * | 2011-01-27 | 2014-07-23 | 西安交通大学 | Three-dimensional micro-force sensor capable of measuring sub micro Newton force and packaging method of three-dimensional micro-force sensor |
| CN105628269B (en) * | 2015-12-25 | 2019-01-18 | 湖南师范大学 | A kind of micro- power and micro-displacement amplify sensor |
| CN107471085B (en) * | 2017-09-17 | 2023-04-21 | 长春工业大学 | Six-dimensional force measuring device and method based on grinding and polishing of viscoelastic material |
| CN112834091A (en) * | 2020-12-31 | 2021-05-25 | 苏州大学 | Micro-force sensor for micro-assembly and piezoelectric ceramic driving micro-gripper |
| CN113340476B (en) * | 2021-05-08 | 2023-10-27 | 昆山朗德森机电科技有限公司 | Two-dimensional decoupling moment touch sensor and MEMS preparation method |
| CN115683423B (en) * | 2022-10-28 | 2024-09-27 | 刘業灿 | Device for monitoring mechanical properties of cells |
| CN116182919B (en) * | 2023-04-23 | 2023-09-12 | 西北工业大学 | Triaxial high-temperature vibration sensor based on optical fiber F-P cavity and preparation method thereof |
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