CN101706619B - Structure for improving adhesive capacity of panel sealant and method thereof - Google Patents
Structure for improving adhesive capacity of panel sealant and method thereof Download PDFInfo
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- CN101706619B CN101706619B CN2009100389521A CN200910038952A CN101706619B CN 101706619 B CN101706619 B CN 101706619B CN 2009100389521 A CN2009100389521 A CN 2009100389521A CN 200910038952 A CN200910038952 A CN 200910038952A CN 101706619 B CN101706619 B CN 101706619B
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- horizontal width
- filter substrate
- common electrode
- thin film
- film transistor
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Abstract
The invention provides a structure for improving adhesive capacity of panel sealant and a method thereof. A color filter substrate is provided; a shading part (BM) comprising a plurality of sub-shading blocks is formed on the color filter substrate; and light transmitting holes are arranged among the sub-shading blocks. A thin film transistor substrate is provided; a common electrode line (Vcoommon line) is formed on the thin film transistor substrate; and a gate insulation layer (GI) and a protection layer (BP) are formed on the common electrode line sequentially, wherein the horizontal width of the common electrode line is more than that of each light transmitting hole. Sealant is arranged on the shading part; the light transmitting holes are filled with the sealant; and the color filter substrate and the thin film transistor substrate are assembled.
Description
[technical field]
The present invention is a kind of structure and method thereof that promotes adhesive capacity of panel sealant, particularly about a kind of light hole that in light shielding part, is provided with, and frame glue is located in the light hole, with promote frame glue and colored filter substrate contact area the structure and the method thereof of lifting adhesive capacity of panel sealant.
[background technology]
RA test item in the production run of panel, it includes a frame glue test (SLAS TEST), the purpose of this test is the tackness (adhesion) after sense colors filter sheet base plate (CF) and thin film transistor base plate (TFT) make up, because colored filter substrate and thin film transistor base plate utilize the frame gluing to close, combine and frame glue belongs to different material with colored filter substrate and thin film transistor base plate, just as the frame glue of arranging in pairs or groups bad be easy to generate and peel off (peeling).For avoiding product to make panel normally to show, generally all can regularly be SLAS TEST and meet the shipment specification to guarantee product frame glue intensity because of external force makes the breakage of frame glue cause liquid crystal to expose.For making product have better frame glue intensity, when doing panel designs, frame glue and different material contact area are strengthened, make frame glue strength-enhanced, to avoid producing peeling.
The panel frame glue design of prior art is respectively shown in Fig. 1～3.As shown in Figure 1, the below of colored filter substrate 2 includes frame glue 4 and light shielding part 6.Frame glue 4 is positioned at the edge of colored filter substrate 2 belows, because frame glue 4 directly contacts with colored filter substrate 2, so the speed of frame glue 4 when hardening comparatively fast and preferable degree of sticking together arranged.But, when cutting, panel cause the degree of sticking together of frame glue to reduce easily because frame glue 4 is the edge of being located at colored filter substrate 2.
As shown in Figure 2, the below of colored filter substrate 2 includes frame glue 4 and light shielding part 6.Frame glue 4 is positioned under the light shielding part 6, and owing to frame glue 4 contacts with light shielding part 6, so frame glue 4 has relatively poor degree of sticking together.And the problem of peeling arranged easily.
As shown in Figure 3, the below of colored filter substrate 2 includes frame glue 4 and light shielding part 6.Frame glue 4 part contact with colored filter substrate 2, and a part contacts with light shielding part 6, so has preferable tackness, the speed of frame glue 4 when hardening also very fast.With respect to prior art shown in Figure 1, also can reduce the problem of peeling.But, can not solve the problem of degree of the sticking together reduction that causes frame glue when panel cuts fully owing to still there is frame segment glue to be positioned at the edge of colored filter substrate 2.
For this reason, the present invention proposes a kind of structure and method thereof that promotes adhesive capacity of panel sealant, to address the above problem.
[summary of the invention]
Fundamental purpose of the present invention is providing a kind of structure and method thereof that promotes adhesive capacity of panel sealant, and it can have the speed and degree of sticking together of the sclerosis of frame glue concurrently, can effectively keep frame glue intensity and make it meet the shipment specification.
Another object of the present invention is providing a kind of structure and method thereof that promotes adhesive capacity of panel sealant, and it can effectively promote outside the degree of sticking together, and can also effectively avoid producing the problem of peeling in the prior art.
The invention provides a kind of structure and method thereof that promotes adhesive capacity of panel sealant, it provides colored filter substrate, forms a light shielding part (BM) of being made up of a plurality of sub-light shielding block on colored filter substrate, and has a light hole between each sub-light shielding block.Thin film transistor base plate is provided; on thin film transistor base plate, form common electrode cabling (Vcommon line); and on the common electrode cabling, form a gate insulation layer (GI) and a protective seam (BP) in regular turn; wherein the horizontal width of light hole be less than or equal to the common electrode cabling horizontal width 2/3, and the horizontal width of common electrode cabling is greater than more than the light hole horizontal width 2um.Wherein a kind of embodiment of above-mentioned design, the dual-side of the light hole width of 1um after above that stretch out respectively promptly equals the horizontal width of common electrode cabling.Frame glue is located on the light shielding part, and frame glue fills up light hole, and colored filter substrate and thin film transistor base plate group is upright.According to aforesaid way, it can effectively promote the structure of the lifting adhesive capacity of panel sealant that provides of the present invention and method thereof outside the degree of sticking together, can't produce the problem of peeling in the prior art, and can have the speed and degree of sticking together that frame glue hardens concurrently, can effectively keep frame glue intensity and make it meet the shipment specification.
[description of drawings]
Below in conjunction with drawings and Examples invention is further specified:
Fig. 1 is the synoptic diagram of the panel frame plastic structure of prior art;
Fig. 2 is the synoptic diagram of the panel frame plastic structure of another prior art;
Fig. 3 is the synoptic diagram of the panel frame plastic structure of another prior art;
Fig. 4 is the synoptic diagram of panel frame plastic structure of the present invention;
Fig. 5 is the synoptic diagram of hardened face sheet frame glue of the present invention;
Fig. 6 is the synoptic diagram of another hardened face sheet frame glue of the present invention;
Fig. 7 is an implementation step process flow diagram of the present invention.
[embodiment]
For describing the structure and the method thereof of lifting adhesive capacity of panel sealant of the present invention in detail, the structure of lifting adhesive capacity of panel sealant of the present invention at first is described, please refer to Fig. 4.The structure of lifting adhesive capacity of panel sealant of the present invention comprises a colored filter substrate 12 and a thin film transistor base plate 14.Colored filter substrate is provided with a light shielding part (BM).
Light shielding part is positioned at a side of colored filter substrate 12, and this side is between this thin film transistor base plate and colored filter substrate 12.Light shielding part is made up of a plurality of sub-light shielding block 18, between each sub-light shielding block 18 light hole 20 is arranged, and this light hole 20 is isolated adjacent two sub-light shielding block.
Thin film transistor base plate 14; form a common electrode cabling (Vcommon line) 24 on it; and form a gate insulation layer (GI) 26 and a protective seam (BP) 28 on this common electrode cabling 24 in regular turn, and the horizontal width A of common electrode cabling 24 is greater than the horizontal width B of light hole 20.
Wherein the ratio of the horizontal width A of the horizontal width B of light hole 20 and common electrode cabling 24 is rough is less than or equal to 2/3, and the horizontal width of common electrode cabling 24 is greater than more than the light hole 20 horizontal width 2um.Wherein a kind of embodiment of above-mentioned design, the dual-side of light hole 20 width C of 1um after above that stretch out respectively promptly equals the horizontal width A of common electrode cabling 24.Wherein, common electrode cabling 24 of the present invention can be formed by neodymium aluminium molybdenum alloy (Mo/Al/Nd), and the material of protective seam 28 is silicon nitride (SiNx).
According to said structure, go on to say the method for the present invention's lifting adhesive capacity of panel sealant, please in the lump with reference to Fig. 7.At first carry out step S12, one colored filter substrate is provided, on colored filter substrate, form a light shielding part (BM) of forming by a plurality of sub-light shielding block 18, and a light hole 20 is arranged between each sub-light shielding block, this light hole 20 is to use the minus light shield manufacture to form, and this light hole 20 is isolated two adjacent sub-light shielding block.
Continue and carry out step S14; one thin film transistor base plate 14 is provided; on thin film transistor base plate 14, form common electrode cabling 24 (Vcommon line); and on common electrode cabling 24, form a gate insulation layer 26 and a protective seam 28 in regular turn; wherein the ratio of the horizontal width A of the horizontal width B of light hole 20 and common electrode cabling 24 is rough is less than or equal to 2/3, and the horizontal width of common electrode cabling 24 is greater than more than the light hole 20 horizontal width 2um.Wherein a kind of embodiment of above-mentioned design, the dual-side of light hole 20 width C of 1um after above that stretch out respectively promptly equals the horizontal width A of common electrode cabling 24.Wherein, common electrode cabling 24 of the present invention can be formed by neodymium aluminium molybdenum alloy (Mo/Al/Nd), and the material of protective seam 28 is silicon nitride (SiNx).Then carry out step S16, frame glue 30 is located on the light shielding part, frame glue 30 is that light hole 20 is filled up, and colored filter substrate 12 and 14 groups of thin film transistor base plates is upright.
With 14 groups of colored filter substrate 12 and this thin film transistor base plates immediately, between thin film transistor base plate 14 and this colored filter substrate 12,, make that these frame glue 30 sclerosis are upright to finish group with a ultraviolet light (UV light) irradiation.The invention provides the mode of two kinds of irradiations; A kind of by the irradiation of colored filter substrate 12 tops, as Fig. 5, ultraviolet light passes light hole and makes that 30 sclerosis of frame glue are upright to finish group; Another kind of by the side-irradiation of colored filter substrate 12 with thin film transistor base plate 14, as Fig. 6, ultraviolet light makes that 30 sclerosis of frame glue are upright to finish group.The present invention is by being provided with light hole 20 in the light shielding part, and frame glue 30 is located in the light hole 20, to promote frame glue 30 and colored filter substrate 12 contacts area,, promote the tackness of frame glue 30 with this by promoting the contact area of frame glue 30 and colored filter substrate 12; Moreover the present invention is different from prior art must be provided with the mode that frame glue promotes tackness in colored filter substrate edge, and the present invention can promote tackness, and does not have prior art and be located at the problem that the face plate edge place produces PEELING because of frame glue.
The above person, it only is a preferred embodiment of the present invention, be not to be used for limiting scope of the invention process,, all should be included in the claim of the present invention so all equalizations of doing according to the described shape of the present patent application claim, structure, feature and spirit change and modify.
Claims (15)
1. structure that promotes adhesive capacity of panel sealant is characterized in that: comprises,
One colored filter substrate is provided with a light shielding part on it, this light shielding part is positioned at a side of this colored filter substrate, and this light shielding part is made up of a plurality of sub-light shielding block, between every adjacent two sub-light shielding block a light hole is arranged;
One thin film transistor base plate forms a common electrode cabling, and form a gate insulation layer and a protective seam in regular turn on this common electrode cabling on it, wherein the horizontal width of this common electrode cabling is corresponding with the horizontal width of this light hole; And
One frame glue is located on this light shielding part, and this frame glue fills up this light hole, and this colored filter substrate and this thin film transistor base plate group is upright.
2. the structure of lifting adhesive capacity of panel sealant according to claim 1 is characterized in that: the horizontal width of this common electrode cabling is greater than the horizontal width of this light hole.
3. the structure of lifting adhesive capacity of panel sealant according to claim 2 is characterized in that: the ratio of the horizontal width of the horizontal width of this light hole and this common electrode cabling is rough to be less than or equal to 2/3.
4. according to the structure of claim 2 or 3 described lifting adhesive capacity of panel sealant, it is characterized in that: the horizontal width of this common electrode cabling is greater than more than this light hole horizontal width 2um.
5. according to the structure of claim 2 or 3 described lifting adhesive capacity of panel sealant, it is characterized in that: the dual-side of this light hole width of 1um after above that stretch out respectively equals the horizontal width of this common electrode cabling.
6. the structure of lifting adhesive capacity of panel sealant according to claim 1, it is characterized in that: immediately this colored filter substrate and this thin film transistor base plate group, between this thin film transistor base plate and this colored filter substrate,, make that this frame glue sclerosis is upright to finish group with a UV-irradiation.
7. the structure of lifting adhesive capacity of panel sealant according to claim 1, it is characterized in that: immediately this colored filter substrate and this thin film transistor base plate group, direction irradiation in the another side of this colored filter substrate one ultraviolet light toward this thin film transistor base plate makes that this frame glue sclerosis is upright to finish group.
8. a method that promotes adhesive capacity of panel sealant comprises the following steps:
One colored filter substrate is provided, on this colored filter substrate, forms by a plurality of sub-light shielding block and one of forms light shielding part, and whenever between adjacent two sub-light shielding block a light hole is arranged;
One thin film transistor base plate is provided, on this thin film transistor base plate, form a common electrode cabling, and on this common electrode cabling, form a gate insulation layer and a protective seam in regular turn, wherein the horizontal width of this common electrode cabling is corresponding with the horizontal width of this light hole; And
One frame glue is located on this light shielding part, and this frame glue fills up this light hole, and this colored filter substrate and this thin film transistor base plate group is upright.
9. the method for lifting adhesive capacity of panel sealant according to claim 8 is characterized in that: the horizontal width of this common electrode cabling is greater than the horizontal width of this light hole.
10. the method for lifting adhesive capacity of panel sealant according to claim 8 is characterized in that: the ratio of the horizontal width of the horizontal width of this light hole and this common electrode cabling is rough to be less than or equal to 2/3.
11. according to Claim 8 or the method for 9 described lifting adhesive capacity of panel sealant, it is characterized in that: the horizontal width of this common electrode cabling is greater than more than this light hole horizontal width 2um.
12. according to Claim 8 or the method for 9 described lifting adhesive capacity of panel sealant, it is characterized in that: the dual-side of this light hole is the width after more than the extension 1um respectively, equals the horizontal width of this common electrode cabling.
13. the method for lifting adhesive capacity of panel sealant according to claim 8 is characterized in that: this light hole is to use the minus light shield manufacture to form.
14. the method for lifting adhesive capacity of panel sealant according to claim 8, it is characterized in that: immediately this colored filter substrate and this thin film transistor base plate group, between this thin film transistor base plate and this colored filter substrate,, make that this frame glue sclerosis is upright to finish group with a UV-irradiation.
15. the method for lifting adhesive capacity of panel sealant according to claim 8, it is characterized in that: immediately this colored filter substrate and this thin film transistor base plate group, direction irradiation in the another side of this colored filter substrate one ultraviolet light toward this thin film transistor base plate makes that this frame glue sclerosis is upright to finish group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100389521A CN101706619B (en) | 2009-04-24 | 2009-04-24 | Structure for improving adhesive capacity of panel sealant and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100389521A CN101706619B (en) | 2009-04-24 | 2009-04-24 | Structure for improving adhesive capacity of panel sealant and method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101706619A CN101706619A (en) | 2010-05-12 |
| CN101706619B true CN101706619B (en) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009100389521A Expired - Fee Related CN101706619B (en) | 2009-04-24 | 2009-04-24 | Structure for improving adhesive capacity of panel sealant and method thereof |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI454809B (en) * | 2011-06-24 | 2014-10-01 | Au Optronics Corp | Liquid crystal display panel |
| CN114815404B (en) * | 2022-05-07 | 2024-04-02 | 广州华星光电半导体显示技术有限公司 | Display panel, manufacturing method of display panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1721956A (en) * | 2004-07-16 | 2006-01-18 | 鸿富锦精密工业（深圳）有限公司 | Frame adhesive curing method and LCD panel manufacturing method |
| CN1797078A (en) * | 2004-12-30 | 2006-07-05 | 群康科技(深圳)有限公司 | LCD faceplate |
| CN101067699A (en) * | 2007-06-19 | 2007-11-07 | 友达光电股份有限公司 | Display panel and producing method thereof |
-
2009
- 2009-04-24 CN CN2009100389521A patent/CN101706619B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1721956A (en) * | 2004-07-16 | 2006-01-18 | 鸿富锦精密工业（深圳）有限公司 | Frame adhesive curing method and LCD panel manufacturing method |
| CN1797078A (en) * | 2004-12-30 | 2006-07-05 | 群康科技(深圳)有限公司 | LCD faceplate |
| CN101067699A (en) * | 2007-06-19 | 2007-11-07 | 友达光电股份有限公司 | Display panel and producing method thereof |
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| Publication number | Publication date |
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| CN101706619A (en) | 2010-05-12 |
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