CN101702397A - Wax bonding equipment of wafer - Google Patents
Wax bonding equipment of wafer Download PDFInfo
- Publication number
- CN101702397A CN101702397A CN200910175421A CN200910175421A CN101702397A CN 101702397 A CN101702397 A CN 101702397A CN 200910175421 A CN200910175421 A CN 200910175421A CN 200910175421 A CN200910175421 A CN 200910175421A CN 101702397 A CN101702397 A CN 101702397A
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- platform
- wafer
- bonding
- heating station
- guide rail
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Abstract
The invention relates to wax bonding equipment of a wafer, which comprises a bonding platform, a heating platform and a pressurization platform, wherein the heating platform and the pressurization platform are arranged on the bonding platform and are positioned on the same horizontal plane, the upper end of the pressurization platform is provided with a pressing device which comprises an air cylinder and a pressing disk, the pressing disk is fixed at the lower end of an air cylinder bar, a push delivery device comprising a handle, a push plate and a guide rail is arranged on the bonding platform, the push plate is arranged at the side end of the heating platform, the push plate and the handle are fixedly connected, the push plate is arranged on the heating platform and can slide on the guide rail, and the heating platform can be driven by pushing the handle to move on the bonding platform. The wax bonding platform pushes a heated slide glass disk and a heated wafer to the pressurization platform along the guide rail by a material push plate, thereby avoiding the manual direct contact and transportation of the wafer and reducing the damage of the wafer.
Description
Technical field
The present invention relates to a kind of Wax bonding equipment of wafer.
Background technology
At semicon industry, the semiconductor manufacturing factory merchant carries out with the heating and bonding two workbench that pressurize the bonding flow process of wafer wax mostly: the slide glass dish of waxing is after heating station is heated, wafer is gently invested on the softening wax, adding presents a theatrical performance as the last item on a programme cools off pressurization with manually it being transferred to then, at last wafer firmly is bonded on the loading dish, operational sequence is cumbersome, and wafer is very easily damaged in the process that two workbench carryings are shifted.
The utility model content
Technical problem to be solved by this invention provides a kind of convenience, simple, easy operating, can reduce the Wax bonding equipment of wafer to damage to wafers.
The present invention adopts following technical scheme:
The present invention includes bonding platform, be arranged on the heating station that is in same horizontal plane on the bonding platform and add and present a theatrical performance as the last item on a programme, the described upper end of presenting a theatrical performance as the last item on a programme that adds is provided with by cylinder and is fixed on the device for exerting that the platen of cylinder rod lower end constitutes, described heating station is by thermal insulation board, the platen formation that is arranged on the electric hot plate on the thermal insulation board and is arranged on the electric hot plate upper end, bonding platform is provided with by handle, the pusher that push pedal and guide rail constitute, described push pedal is arranged on an end of heating station, guide rail is arranged on the both sides of heating station, push pedal is fixedlyed connected with handle, push pedal is arranged on the heating station and can slides on guide rail, driving handle the slide glass dish on the heating station can be moved to add present a theatrical performance as the last item on a programme on.
The present invention adds to present a theatrical performance as the last item on a programme and is provided with the stop screw that is used for fixing slide glass dish position.
Beneficial effect of the present invention:
In a plurality of technological processes of wafer process, all need to carry out the bonding link of wax of wafer, slide glass dish after wax binding platform of the present invention utilizes push pedal to heat and wafer are pushed into to add along guide rail presents a theatrical performance as the last item on a programme, and has avoided artificial directly to the contact and the carrying of wafer, can reduce the damage to wafer.Easy operating of the present invention, and can usefully increase work efficiency.
Description of drawings
Accompanying drawing 1 is structural representation of the present invention;
Accompanying drawing 2 is plan structure schematic diagram of the present invention;
Accompanying drawing 3 is wafer heated condition schematic diagram of the present invention;
Accompanying drawing 4 pushes view for wafer of the present invention;
Accompanying drawing 5 is wafer pressurized state schematic diagram of the present invention.
In the accompanying drawings: 1 handle, 2 push pedals, 3 heating stations, 4 cylinders, 5 cylinder rods, 6 platens, 7 stop screws, 8 add present a theatrical performance as the last item on a programme, 9 platens, 10 electric hot plates, 11 guide rails, 12 thermal insulation boards, 13 slide glass dishes, 14 wafers, 15 bonding platforms.
Embodiment
1-5 is depicted as one embodiment of the present of invention as accompanying drawing, the invention provides a kind of wax binding platform that collects the heating of wafer and be pressurised into one.Binding platform of the present invention mainly by heating station 3, add present a theatrical performance as the last item on a programme 8, device for exerting and load plate pusher form.Shown in accompanying drawing 1,2, heating station 3 of the present invention is made up of electric hot plate 10 (stainless steel mica electric boiling plate), thermal insulation board 12 and platen 9; (simple linear guide rail K8RR16 MISUMI) forms pusher, and adding presents a theatrical performance as the last item on a programme is fixed with two stop screws 7 on 8, guarantees the accurate location of slide glass dish 13 by handle 1, push pedal 2 and guide rail 11; (CDA2G 63-200-Y7BW SMC) forms with the platen 6 that is fixed on cylinder rod 5 lower ends device for exerting by cylinder 4.Shown in accompanying drawing 3,4, use the present invention, the slide glass dish 13 that scribbles solid wax is positioned over carries out timing on the heating station 3 and heat, reach uniform temperature, treat that wax melts fully after, then each wafer 14 is sticked to slide glass dish 13 corresponding positions.Operating grip 13 is pushed into slide glass dish 13 cooling and adds and present a theatrical performance as the last item on a programme 8 along guide rail 11 from heating station by push pedal 2, play position-limiting action by stop screw 7, as shown in Figure 5, start cylinder 4 then and apply certain pressure downwards by platen 6, wafer 14 is bonded on the slide glass dish 13 the complete operation process.
Claims (2)
1. Wax bonding equipment of wafer, it is characterized in that it comprises bonding platform (15), be arranged on the heating station that is in same horizontal plane (3) on the bonding platform (15) and add present a theatrical performance as the last item on a programme (8), the described upper end that adds present a theatrical performance as the last item on a programme (8) is provided with by cylinder (4) and is fixed on the device for exerting that the platen (6) of cylinder rod (5) lower end constitutes, described heating station (3) is by thermal insulation board (12), platen (9) formation that is arranged on the electric hot plate (10) on the thermal insulation board (12) and is arranged on electric hot plate (10) upper end, bonding platform (15) is provided with by handle (1), the pusher that push pedal (2) and guide rail (11) constitute, described push pedal (2) is arranged on an end of heating station (3), guide rail (11) is arranged on the both sides of heating station (3), push pedal (2) is fixedlyed connected with handle (1), push pedal (2) is arranged on heating station (3) and goes up also and can go up slip at guide rail (11), and driving handle (1) can move to the slide glass dish (13) on the heating station (3) and add on present a theatrical performance as the last item on a programme (8).
2. Wax bonding equipment of wafer according to claim 1, it is characterized in that adding present a theatrical performance as the last item on a programme (8) be provided with the stop screw (7) that is used for fixing slide glass dish (13) position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101754217A CN101702397B (en) | 2009-11-16 | 2009-11-16 | Wax bonding equipment of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101754217A CN101702397B (en) | 2009-11-16 | 2009-11-16 | Wax bonding equipment of wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101702397A true CN101702397A (en) | 2010-05-05 |
| CN101702397B CN101702397B (en) | 2011-08-10 |
Family
ID=42157297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101754217A Expired - Fee Related CN101702397B (en) | 2009-11-16 | 2009-11-16 | Wax bonding equipment of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101702397B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707657A (en) * | 2012-05-17 | 2012-10-03 | 山东轻工业学院 | LED chip multi-station full-automatic waxing control system and method |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
| CN115070977A (en) * | 2022-08-16 | 2022-09-20 | 苏州燎塬半导体有限公司 | Wafer cutting system and method |
| CN117810156A (en) * | 2024-02-23 | 2024-04-02 | 中国电子科技集团公司第四十六研究所 | Wafer bonding method and wafer bonding device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311561A (en) * | 2003-04-03 | 2004-11-04 | Sumitomo Mitsubishi Silicon Corp | Wafer pasting method and wafer pasting device |
| JP2005051055A (en) * | 2003-07-29 | 2005-02-24 | Tokyo Electron Ltd | Lamination method and laminating device |
| CN201527964U (en) * | 2009-11-16 | 2010-07-14 | 中国电子科技集团公司第四十五研究所 | Wafer wax bonding device |
-
2009
- 2009-11-16 CN CN2009101754217A patent/CN101702397B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707657A (en) * | 2012-05-17 | 2012-10-03 | 山东轻工业学院 | LED chip multi-station full-automatic waxing control system and method |
| CN102707657B (en) * | 2012-05-17 | 2014-04-02 | 山东轻工业学院 | LED chip multi-station full-automatic waxing control system and method |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
| CN114505208B (en) * | 2022-04-19 | 2022-06-14 | 成都泰美克晶体技术有限公司 | Waxing machine for wafers |
| CN115070977A (en) * | 2022-08-16 | 2022-09-20 | 苏州燎塬半导体有限公司 | Wafer cutting system and method |
| CN115070977B (en) * | 2022-08-16 | 2022-12-30 | 苏州燎塬半导体有限公司 | Wafer cutting system and method |
| CN117810156A (en) * | 2024-02-23 | 2024-04-02 | 中国电子科技集团公司第四十六研究所 | Wafer bonding method and wafer bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101702397B (en) | 2011-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20161116 |