CN101693765B - Organic silicon perfusion resin and preparation method thereof - Google Patents
Organic silicon perfusion resin and preparation method thereof Download PDFInfo
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- CN101693765B CN101693765B CN200910044563XA CN200910044563A CN101693765B CN 101693765 B CN101693765 B CN 101693765B CN 200910044563X A CN200910044563X A CN 200910044563XA CN 200910044563 A CN200910044563 A CN 200910044563A CN 101693765 B CN101693765 B CN 101693765B
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- 229920005989 resin Polymers 0.000 title claims abstract description 38
- 239000011347 resin Substances 0.000 title claims abstract description 38
- 230000010412 perfusion Effects 0.000 title claims abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 13
- 239000010703 silicon Substances 0.000 title claims abstract description 13
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000178 monomer Substances 0.000 claims abstract description 34
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910000077 silane Inorganic materials 0.000 claims abstract description 23
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 11
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 11
- 230000007062 hydrolysis Effects 0.000 claims abstract description 9
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000006837 decompression Effects 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 238000001914 filtration Methods 0.000 claims abstract description 6
- 125000000962 organic group Chemical group 0.000 claims abstract description 6
- 238000005406 washing Methods 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 4
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims abstract description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 11
- 239000003463 adsorbent Substances 0.000 claims description 7
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 6
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 6
- 239000012141 concentrate Substances 0.000 claims description 5
- 238000005070 sampling Methods 0.000 claims description 5
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000002798 polar solvent Substances 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000005055 methyl trichlorosilane Substances 0.000 claims description 3
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims description 3
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 claims description 3
- 229960004418 trolamine Drugs 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 150000005826 halohydrocarbons Chemical class 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 125000004423 acyloxy group Chemical group 0.000 abstract description 4
- 125000003545 alkoxy group Chemical group 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 4
- 125000003118 aryl group Chemical group 0.000 abstract description 4
- 229910052801 chlorine Inorganic materials 0.000 abstract description 4
- 125000001309 chloro group Chemical group Cl* 0.000 abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 230000002745 absorbent Effects 0.000 abstract 1
- 239000002250 absorbent Substances 0.000 abstract 1
- 239000013256 coordination polymer Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 238000010992 reflux Methods 0.000 abstract 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000007858 starting material Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 150000001282 organosilanes Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- CRXNJSWBRJXDTE-UHFFFAOYSA-N Cl[SiH2]Cl.CC=C Chemical compound Cl[SiH2]Cl.CC=C CRXNJSWBRJXDTE-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- JEWCZPTVOYXPGG-UHFFFAOYSA-N ethenyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)C=C JEWCZPTVOYXPGG-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 2
- 239000005050 vinyl trichlorosilane Substances 0.000 description 2
- NJOPBCZQSPNWLW-UHFFFAOYSA-N C(C)O[SiH2]OCC.CC=C Chemical compound C(C)O[SiH2]OCC.CC=C NJOPBCZQSPNWLW-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
Landscapes
- Silicon Polymers (AREA)
Abstract
The invention relates to organic silicon perfusion resin and a preparation method thereof. The preparation method comprises the following steps: selecting at least one silane monomer expressed according to a structure formula RnSiX4-n as an initial material, wherein R is an organic group and can be alkyl, aryl or vinyl, X is a hydrolysable group and can be chlorine atom, alkoxy or acyloxy, n is equal to 0 or 1 and the initial material comprises a vinylsilane monomer or hydrogen-containing silane monomer; determining the proportion of the initial material according to a silicon resin R/Si value of 1.0-1.3, dropwise adding the initial material into a flask adding with water, weak-polarity solvent and HCl gas absorbent at 5-20 DEG C, carrying out hydrolysis reaction for 3-6 h, concentrating,separating a resin layer, carrying out reflux curing reaction at 80-120 DEG C for 2-5 h, washing with water, filtering, removing solvent for hydrolysis by decompression at 110-140 DEG C, and discharging when the cone-plate viscosity of the product is 1,500-3,000 CP at 60 DEG C. The organic silicon perfusion resin has no rapid heat release, does not generate bubble in the curing process and has higher heat resistance and excellent corona resistant performance.
Description
Technical field
The present invention relates to a kind of silicone resin and preparation method thereof, relate in particular to the group of a kind of Si-C=C of containing and two kinds of structures of Si-H, also include by R at least in its structure
nSiX
4-n(wherein R is an organic group, can be alkyl, aryl or vinyl; X is a hydrolysable group, can be chlorine atom, alkoxyl group or acyloxy etc.; N value 0 or 1) R that obtains of hydrolysis
nSiO
(4-n)/2Organic silicon perfusion resin of building stone and preparation method thereof belongs to the high molecular polymerization field.
Background technology
Perfusion resin is widely used in the perfusion and the encapsulation in fields such as electronic devices and components, semiconductor and IC and high-tension power transmission and transformation equipment, electrical equipment and electrical at present, is a kind of special type function material that integrates multiple functions such as insulation, protection against the tide, mildew-resistant, anticorrosion, fixing and isolation.Usually, perfusion resin should possess following characteristics: under teeming temperature, good mobility and less volatile matter are arranged; Quick solidifying, it is little to solidify post-shrinkage ratio, and has characteristics such as good electric, mechanics and materialization be stable.
Usually, factors such as the over-all properties of consideration perfusion resin and price are epoxy resin and Zylox system what extensively be used at present.Epoxy-resin systems no doubt has mechanical property high, and adhesiveproperties is excellent, and cure shrinkage is little; Good manufacturability, the handiness of formulating of recipe is bigger, electrical property and good chemical stability; But its heat-resisting and anti-corona performance is more general; The thermotolerance of curable epoxide thing is generally 120-150 ℃, has only the epoxy resin of heat resistant variety can reach 200 ℃ or higher, and the price of this type of epoxy is comparatively expensive; Another kind of system then also is a customary systems Zylox system, and its advantage is that temperature classification has a bigger raising than epoxy, but also has some shortcomings: relatively poor like adhesiveproperties, cured article intensity is lower.
Along with equipment such as current motor electrical equipment constantly develop towards the direction of miniaturized, lightweight and raising serviceability, pursuing the pouring material with high temperature classification and excellent comprehensive performance becomes first-selected direction.
Summary of the invention
The object of the invention is intended to relate to and propose a kind of preparation method of organic silicon perfusion resin, to present perfusion resin exist temperature classification on the low side and such as anti-corona poor performance, when solidifying heat release seriously is prone to blistered shortcoming and the solvent-free perfusion resin of a kind of organosilicon type of putting forward.
The present invention seeks to realize through following technical proposals:
It is by general structure R that selection has at least a kind of
nSiX
4-nThe silane monomer of expression is a starting raw material, and wherein R is an organic group, can be alkyl, aryl or vinyl; X is a hydrolysable group; Can be chlorine atom, alkoxyl group or acyloxy etc., n value 0 or 1, said starting raw material comprises vinyl silane monomer and silane containing hydrogen monomer; Above-mentioned starting raw material is 1.0～1.3 definite proportionings by silicone resin R/Si value; Under 5～20 ℃, slowly be added drop-wise in the water that is added with 2～5 times of starting raw material total moles, 1～3 times the flask of HCl adsorbent of weak polar solvent and 1～3 times, drip hydrolysis reaction and continue 3～6 hours, concentrate then; Separate resin layer; 80～120 ℃ of refluxed slaking reactions 2～5 hours, carry out washing filtering afterwards, 110～140 ℃ down decompression remove the solvent that is used for hydrolysis in advance; Regularly carry out the viscosity of sampling and measuring resin therebetween, when the discharging when 1500～3000CP (60 ℃) of product cone-plate viscosity.At least include the group of Si-C=C and two kinds of structures of Si-H in this perfusion resin, also include by R at least in its structure
nSiX
4-n(wherein R is an organic group, can be alkyl, aryl or vinyl; X is a hydrolysable group, can be chlorine atom, alkoxyl group or acyloxy etc.; N value 0 or 1) R that obtains of hydrolysis
nSiO
(4-n)/2Building stone.
Said R
nSiX
4-nMonomer is selected from tetraethoxy, butyl silicate, METHYL TRICHLORO SILANE, methyl trimethoxy (second) TMOS, phenyl front three (second) TMOS, vinyltriethoxysilane, vinyl three (b-methoxy ethoxy) silane etc.
Said vinyl silane monomer and silane containing hydrogen monomer are selected from dimethyl-vinyl Ethoxysilane, methyl ethylene diethoxy silane, vinyltriethoxysilane, vinyl three (b-methoxy ethoxy) silane, methyl ethylene dichlorosilane, vinyl trichloro silane, dimethyl dichlorosilane (DMCS), trichlorosilane, dimethylchlorosilane, a chlorosilane etc.
Said HCl adsorbent is a kind of or its mixture in pyridine, hexamethyldisilazane, the trolamine etc.
Said weak polar solvent is a kind of or its mixture in toluene, YLENE, naphthenic hydrocarbon, halohydrocarbon, the vinyl acetic monomer etc.
Organic silicon perfusion resin involved in the present invention belongs to solvent-free, fast curing system, and its curing need add in use and cause silico ethylene base and the platinum catalyst that contains addition reaction of hydrogen, so this perfusion resin system is two component systems.Appoint 100 parts of resins getting one of such scheme, add platinum catalyst and 0.01 part of platinum catalyst promotor V11 of 0.05 part, all can satisfy the fast solidified requirement of perfusion resin under 180 ℃ at 1～3 minute gel.
This perfusion resin has following characteristics: this product does not contain any organic solvent, and initial viscosity is higher, is difficult for when being used to pour into running off; This perfusion resin is the ability fast setting under platinum catalyst effect efficiently causes, the no very exothermic of reaction in solidification process, and no bubble produces, and is a kind of good pouring material.This perfusion resin also has following advantage: because organosilicon material has higher heat resistance and excellent anticorona performance, this resin can be used for the perfusion and the encapsulation in fields such as higher (200 grades) of temperature classification and anticorona performance requriements higher electronic devices and components, semiconductor and IC and high-tension power transmission and transformation equipment, electrical equipment and electrical.
Embodiment
Following examples are to further specify of the present invention, but the invention is not restricted to following embodiment.
Instance one:
Get tetraethoxy, dimethyl-vinyl Ethoxysilane, dimethyl dichlorosilane (DMCS), diphenyl dichlorosilane monomer, above-mentioned starting material are 1.0 definite proportionings by the R/Si value.Add the water of 2 times of initial silane monomer starting material total moles and be the raw-material 1.0 times toluene of initial silane monomer at flask, add the HCl adsorbent pyridine of 1 times of silane monomer formula for raw stock mole total amount.Under 5～20 ℃ of lower temperature, slowly be added drop-wise to an organosilane monomer in the flask with quick stirring, drip hydrolysis reaction and continue 3 hours, concentrate then; Separate resin layer; 80～120 ℃ of refluxed slaking reactions 2 hours, carry out washing filtering afterwards, 110～140 ℃ down decompression remove the solvent that is used for hydrolysis in advance; Regularly carry out the viscosity of sampling and measuring resin therebetween, when the discharging when 1500～3000CP (60 ℃) of product cone-plate viscosity.
Instance two:
Get vinyl trichloro silane, trimethylchloro-silicane silane, dimethyl dichlorosilane (DMCS), diphenyl dichlorosilane, a phenyl-trichloro-silicane monomer; Above-mentioned silane monomer starting material are 1.2 definite proportionings by the R/Si value; Add the water of 3.5 times of initial silane monomer starting material total moles and be the raw-material 1.8 times YLENE of initial silane monomer at flask, add the HCl adsorbent hexamethyldisilazane of 2.0 times of silane monomer formula for raw stock mole total amounts.Under 5～20 ℃ of lower temperature, slowly be added drop-wise to an organosilane monomer in the flask with quick stirring, drip hydrolysis reaction and continue 4 hours, concentrate then; Separate resin layer; 80～120 ℃ of refluxed slaking reactions 4 hours, carry out washing filtering afterwards, 110～140 ℃ down decompression remove the solvent that is used for hydrolysis in advance; Regularly carry out the viscosity of sampling and measuring resin therebetween, when the discharging when 1500～3000CP (60 ℃) of product cone-plate viscosity.
Instance three:
Get a phenyl-trichloro-silicane, methyl ethylene dichlorosilane, dimethylchlorosilane, diphenyl dichlorosilane, dimethyldichlorosilane(DMCS) monomer; Above-mentioned silane monomer starting material are 1.3 definite proportionings by the R/Si value; Add the water of 5 times of initial silane monomer starting material total moles and be raw-material 3 times toluene and the vinyl acetic monomer of initial silane monomer at flask, add the HCl adsorbent trolamine of 3 times of silane monomer formula for raw stock mole total amounts.Under 5～20 ℃ of lower temperature, slowly be added drop-wise to an organosilane monomer in the flask with quick stirring, drip hydrolysis reaction and continue 6 hours, concentrate then; Separate resin layer; 80～120 ℃ of refluxed slaking reactions 5 hours, carry out washing filtering afterwards, 110～140 ℃ down decompression remove the solvent that is used for hydrolysis in advance; Regularly carry out the viscosity of sampling and measuring resin therebetween, when the discharging when 1500～3000CP (60 ℃) of product cone-plate viscosity.
The above; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technician who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (4)
1. the preparation method of an organic silicon perfusion resin; It is characterized in that selecting to have at least a kind of is that the silane monomer of representing by general structure
is a starting raw material; Wherein R is an organic group; X is a hydrolysable group; N value 0 or 1, said starting raw material comprise vinyl silane monomer and silane containing hydrogen monomer; Above-mentioned starting raw material is 1.0～1.3 definite proportionings by silicone resin R/Si value; Under 5～20 ℃, slowly be added drop-wise in the water that is added with 2～5 times of starting raw material total moles, 1～3 times the flask of HCl adsorbent of weak polar solvent and 1～3 times, drip hydrolysis reaction and continue 3～6 hours, concentrate then; Separate resin layer; 80～120 ℃ of refluxed slaking reactions 2～5 hours, carry out washing filtering afterwards, 110～140 ℃ down decompression remove the solvent that is used for hydrolysis in advance; Regularly carry out the viscosity of sampling and measuring resin therebetween, when the discharging when 1500～3000CP (60 ℃) of product cone-plate viscosity;
Said
monomer is selected from tetraethoxy; Butyl silicate; METHYL TRICHLORO SILANE; Methyl trimethoxy (second) TMOS; Phenyl front three (second) TMOS; Vinyltriethoxysilane; Vinyl three (b-methoxy ethoxy) silane.
2. the preparation method of organic silicon perfusion resin according to claim 1 is characterized in that said HCl adsorbent is a kind of or its mixture in pyridine, hexamethyldisilazane, the trolamine.
3. the method for manufacture of organic silicon perfusion resin according to claim 2 is characterized in that said weak polar solvent is a kind of or its mixture in toluene, YLENE, naphthenic hydrocarbon, halohydrocarbon, the vinyl acetic monomer.
4. organic silicon perfusion resin according to the preparation method of claim 1 or 2 or 3 described organic silicon perfusion resins preparation; It is characterized in that including at least in this perfusion resin the group of
and
two kinds of structures; Also include at least in its structure by
, wherein R is an organic group; X is a hydrolysable group;
building stone that n value 0 or 1, hydrolysis obtain;
Said
monomer is selected from tetraethoxy; Butyl silicate; METHYL TRICHLORO SILANE; Methyl trimethoxy (second) TMOS; Phenyl front three (second) TMOS; Vinyltriethoxysilane; Vinyl three (b-methoxy ethoxy) silane.
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| CN200910044563XA CN101693765B (en) | 2009-10-19 | 2009-10-19 | Organic silicon perfusion resin and preparation method thereof |
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| CN200910044563XA CN101693765B (en) | 2009-10-19 | 2009-10-19 | Organic silicon perfusion resin and preparation method thereof |
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| CN101693765B true CN101693765B (en) | 2012-03-21 |
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| JP5739418B2 (en) * | 2010-06-11 | 2015-06-24 | 株式会社Adeka | Silicon-containing curable composition, cured product of silicon-containing curable composition, and lead frame substrate formed from silicon-containing curable composition |
| CN104497315B (en) * | 2014-12-05 | 2017-02-22 | 东莞兆舜有机硅科技股份有限公司 | Polydimethylsiloxane containing branch chains as well as preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335414B1 (en) * | 1999-03-12 | 2002-01-01 | Shin-Etsu Chemical Co., Ltd. | RTV organopolysiloxane compositions |
| CN101016446A (en) * | 2007-02-15 | 2007-08-15 | 东莞市贝特利新材料有限公司 | Organosilicon electronic encapsulation material |
| CN101126010A (en) * | 2007-08-08 | 2008-02-20 | 华南理工大学 | Bi-component silicon resin for sealing power-type LED and synthesis method thereof |
| CN101230197A (en) * | 2007-12-20 | 2008-07-30 | 宁波安迪光电科技有限公司 | Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
-
2009
- 2009-10-19 CN CN200910044563XA patent/CN101693765B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335414B1 (en) * | 1999-03-12 | 2002-01-01 | Shin-Etsu Chemical Co., Ltd. | RTV organopolysiloxane compositions |
| CN101016446A (en) * | 2007-02-15 | 2007-08-15 | 东莞市贝特利新材料有限公司 | Organosilicon electronic encapsulation material |
| CN101126010A (en) * | 2007-08-08 | 2008-02-20 | 华南理工大学 | Bi-component silicon resin for sealing power-type LED and synthesis method thereof |
| CN101230197A (en) * | 2007-12-20 | 2008-07-30 | 宁波安迪光电科技有限公司 | Organosilicon composition for manufacturing packaging gluewater of light-emitting diode |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平6-293862A 1994.10.21 |
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