CN101693326A - Silver free copper-base brazing filler metal used for braze welding of stainless iron/copper/stainless steel - Google Patents
Silver free copper-base brazing filler metal used for braze welding of stainless iron/copper/stainless steel Download PDFInfo
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- CN101693326A CN101693326A CN200910193208A CN200910193208A CN101693326A CN 101693326 A CN101693326 A CN 101693326A CN 200910193208 A CN200910193208 A CN 200910193208A CN 200910193208 A CN200910193208 A CN 200910193208A CN 101693326 A CN101693326 A CN 101693326A
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Abstract
The invention relates to silver free copper-base brazing filler metal used for the braze welding of stainless iron/copper/stainless steel. The brazing filler metal comprises the following element components in percentage by weight: 5.0-7.0 P, 1.0-10 Sn, 0.1-2.0 Si, 0.1-1.0 Zr, 0.05-0.5 La and the balance of Cu. The silver free copper-base brazing filler metal is applied to the high frequency induction pressure braze welding for accomplishing the large area composite braze welding of dissimilar metal, such as stainless iron/copper/stainless steel, by one time, the welding seam shearing strength taub is higher than or equal to 100 MPa, the cost of the brazing filler metal is only one fifth to one fourth of Ag Cu Zn Sn or Ag Cu Zn Sn Cd, and the silver free copper-base brazing filler metal is applicable to the large-scale production of ferromagnetic double-bottom pans.
Description
Technical field
The present invention relates to a kind of silverless Cu-base soldering material that is used for soldering, particularly a kind of silverless Cu-base soldering material that is used for stainless iron/copper/stainless steel braze welding.
Background technology
Heterogenous metal brazing is used extensive day by day in recent years, for example, a kind of multiple bottom stainless steel pot of band ferromagnetism that is used for electromagnetic oven, at copper coin and one deck that the compound last layer in the bottom of pot plays equal heat effect ferromagnetic 430 corrosion resistant plates are arranged by method for welding, its production technology relates to the stainless large tracts of land composite brazing in 430 stainless steels (being commonly called as stainless iron)/copper/304, adopt the high-frequency pressure soldering processes once to finish stainless iron/copper/three kinds of compound brazing filler metals of dissimilar materials large tracts of land of stainless steel, 750～800 ℃ of brazing temperatures during soldering.Because three kinds of material physical chemistry character differ greatly, the difference of their thermal coefficient of expansion particularly, in the cooling procedure after welding, the amount of contraction of three kinds of materials is inconsistent and produce deformational stress.If weld strength is not enough to overcome deformational stress, will make weld cracking.The soldering of this series products need adopt AgCuZnSn or AgCuZnSnCd (silver content＞45%) money base powdered filler metal could obtain comparatively ideal soldering effect, and yield rate reaches more than 95%.Though AgCuZnSn or AgCuZnSnCd solder have welding temperature low (750～800 ℃), and be good to the mother metal wetability, weld strength height (τ
b〉=characteristics such as 100MPa) can be applicable to the soldering of of the same race or xenogenesis material in the multiple metal or alloy, as copper and copper alloy, carbon steel, stainless steel, carbide alloy or the like.But, because silver-base solder costs an arm and a leg, use to contain the healthy and contaminated environment of Cd solder grievous injury operating personnel, therefore, AgCuZnSn or AgCuZnSnCd solder are difficult to popularize use in multiple bottom stainless steel pot manufacturing industry.For this reason, it is 750～800 ℃ powdered filler metal that a kind of environmental protection, low cost, high-performance, brazing temperature are being sought always by domestic composite bottom boiler manufacturer, produces in batches to realize the multiple bottom stainless steel pot of ferromagnetism.
The P, the Sn that do not have in the silver-colored CuPSn brazing filler metal can reduce its fusion temperature significantly, and can make this brazing filler metal have good flowability and wetability, its brazing temperature is 750～800 ℃, close with the brazing temperature of AgCuZnSn or AgCuZnSnCd, but because this brazing filler metal contains elements such as P, Sn, can and Cu, Fe form compound between brittle metal, when being used for the compound soldering of soldering stainless iron/copper/stainless steel, though weld seam shear strength τ between copper and the stainless steel
b〉=100MPa, but the too low (τ of weld seam shear strength between stainless iron and the copper
b≤ 50MPa).
Summary of the invention
The object of the present invention is to provide 750～800 ℃ of a kind of brazing temperatures, the low-cost silverless Cu-base soldering material of alternative silver-base solder.
Solder of the present invention elemental composition by weight percentage comprises: P 5.0～7.0%, Sn1.0～10.0%, Si 0.1～2.0%, Zr 0.1～1.0% and La 0.05～0.5%, surplus is Cu.
Described silverless Cu-base soldering material contains Ni 1.0～5.0%.
Described silverless Cu-base soldering material contains B 0.05～0.5%.
Key technology of the present invention is by add an amount of Si, Zr and La etc. in the CuPSn matrix, perhaps can add Ni or/and B to improve solder performance, make solder both keep 750～800 ℃ brazing temperature, simultaneously good wetability and higher weld strength are arranged all on stainless iron, copper, stainless steel, particularly can make weld seam shear strength τ between stainless iron and the copper
b〉=100MPa.
The adding of elements Si, La, Zr etc. mainly plays active function, with base material, particularly with stainless iron, stainless steel surfaces generation interfacial reaction, strengthens the wettability and the interface binding ability of solder, thereby improves weld strength.Definite through testing, the addition of Si is 0.1～2.0% to be advisable.The addition of La, Zr is a trace, and La is 0.05～0.5%, Zr 0.1～1.0% is advisable, and the too high molten solder viscosity that then can make increases, and is unfavorable for that solder flows and sprawls, and makes the solderability variation, and weld strength descends.
The interpolation of Ni element can strengthen the mechanical property of solder, and it is spherical that the intermetallic compound pattern of P is become by band shape, reduces the fragility of solder, improves weld strength.Be advisable by testing definite Ni content 1.0～5.0%, not obvious less than 1.0% o'clock modifying function, greater than 5.0% o'clock, the mobile variation of solder.
The adding of B can further improve the flowability of solder, is more conducive to the raising of weld strength, and addition 0.05～0.5% is advisable, and addition should not be too high, otherwise solder embrittlement is increased.
The specific embodiment
The solder preparation method: press the solder ingredient composition, the Medium frequency induction melting, refining purifies, and adopts the aerosolization method that molten metal bath stream is atomized into drop, and the drop cooled and solidified becomes metal dust, powder is crossed 60 mesh sieves again, makes powdered filler metal.
Method for testing shear strength of the present invention is with reference to GB/T 11363-1989, the soldering mother metal is 304 stainless steel substrates, 430 stainless iron plates, be of a size of 80mm * 24mm * 2mm, and TP2 fine copper sheet, be of a size of 80mm * 24mm * 3mm, faying face is longitudinally polished with No. 400 carborundum papers, before the soldering, ultrasonic cleaner is put in test piece cleaned, remove impurity such as greasy dirt.The shear strength test is carried out on electronic universal stretching-machine (GP-TS2000/100KW), and draw speed is 1mm/min.
Embodiment 1
Solder composition: P 5.0%, Sn 1.0%, Si1.0%, Zr 0.1%, La 0.05%, surplus Cu.This composition solder is used for soldering stainless iron/copper, and the weld seam shear strength is 110.5MPa.Soldering stainless steel/copper, weld seam shear strength are 120.0MPa.
Embodiment 2
Solder composition: P 3.0%, Sn 7.0%, Si 2.0%, Zr 0.5%, La 0.1%, B 0.05%, surplus Cu.This composition solder is used for soldering stainless iron/copper, and the weld seam shear strength is 110.0MPa.Soldering stainless steel/copper, weld seam shear strength are 119.4MPa.
Embodiment 3
Solder composition: P 6.5%, Sn 10.0%, Si 1.5%, Zr 0.8%, La 0.3%, Ni 1.0%, B 0.3%, surplus Cu.This composition solder is used for soldering stainless iron/copper, and the weld seam shear strength is 108.0MPa.Soldering stainless steel/copper, weld seam shear strength are 118.0MPa.
Embodiment 4
Solder composition: P 7.0%, Sn 4.0%, Si 0.1%, Zr 0.5%, La 0.5%, Ni 5.0%, B 0.5%, surplus Cu.This composition solder is used for soldering stainless iron/copper, and the weld seam shear strength is 102.6MPa.Soldering stainless steel/copper, weld seam shear strength are 110.6MPa.
Silverless Cu-base soldering material of the present invention is applied to high frequency induced pressure braze and once finishes stainless iron/copper/stainless steel dissimilar metal large tracts of land composite brazing, weld seam shear strength τ
b〉=100MPa, solder cost are 1/5～1/4 of AgCuZnSn or AgCuZnSnCd only, are applicable to the large-scale production of ferromagnetism composite bottom boiler.
Claims (3)
1. silverless Cu-base soldering material that is used for stainless iron/copper/stainless steel braze welding, it is characterized in that elemental composition by weight percentage comprises: P 5.0～7.0%, Sn 1.0～10.0%, Si 0.1～2.0%, Zr0.1～1.0% and La 0.05～0.5%, surplus is Cu.
2. a silverless Cu-base soldering material that is used for stainless iron/copper/stainless steel braze welding is characterized in that described silverless Cu-base soldering material contains Ni 1.0～5.0%.
3. a silverless Cu-base soldering material that is used for stainless iron/copper/stainless steel braze welding is characterized in that described silverless Cu-base soldering material contains B 0.05～0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101932089A CN101693326B (en) | 2009-10-22 | 2009-10-22 | Silver free copper-base brazing filler metal used for braze welding of stainless iron/copper/stainless steel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101932089A CN101693326B (en) | 2009-10-22 | 2009-10-22 | Silver free copper-base brazing filler metal used for braze welding of stainless iron/copper/stainless steel |
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| Publication Number | Publication Date |
|---|---|
| CN101693326A true CN101693326A (en) | 2010-04-14 |
| CN101693326B CN101693326B (en) | 2011-07-20 |
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| CN2009101932089A Expired - Fee Related CN101693326B (en) | 2009-10-22 | 2009-10-22 | Silver free copper-base brazing filler metal used for braze welding of stainless iron/copper/stainless steel |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101890592A (en) * | 2010-07-19 | 2010-11-24 | 周炳刚 | Novel brazing material and manufacturing method thereof |
| CN102179642A (en) * | 2011-05-06 | 2011-09-14 | 郴州格瑞特焊业有限公司 | Copper-based brazing filler metal and preparation method thereof |
| CN102658443A (en) * | 2012-05-22 | 2012-09-12 | 江苏科技大学 | Brazing filler metal for brazing tungsten-copper alloy and stainless steel and brazing process |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN103008915A (en) * | 2012-12-27 | 2013-04-03 | 浙江信和科技股份有限公司 | Low-silver copper-based solder free of spillover phenomenon during weld period |
| CN103624415A (en) * | 2012-08-22 | 2014-03-12 | 北京有色金属研究总院 | Boron-containing stannum-based lead-free solder and manufacturing method thereof |
| CN104759781A (en) * | 2015-04-17 | 2015-07-08 | 郑州机械研究所 | Silver substitute copper phosphorus tin coating brazing alloy ring and preparation method thereof |
| CN105033500A (en) * | 2015-05-28 | 2015-11-11 | 浙江信和科技股份有限公司 | Silver-free brazing filler metal without overflow phenomenon during welding of copper and copper alloy and preparing method |
| CN105473275A (en) * | 2013-08-06 | 2016-04-06 | 山阳特殊制钢株式会社 | Cu-added Ni-Cr-Fe-based alloy brazing material |
| CN106392234A (en) * | 2016-11-10 | 2017-02-15 | 江苏科技大学 | Medium temperature multicomponent Cu-based solder for brazing copper and steel as well as preparation and brazing methods |
| CN106736025A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle temperature silverless Cu-base soldering material and preparation method thereof |
| CN106736024A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle silver-free copper-based soldering paste of temperature and preparation method thereof |
| CN112719693A (en) * | 2020-12-11 | 2021-04-30 | 哈尔滨工业大学 | Low-temperature magnetic glass solder, preparation method thereof and method for connecting ferrite by using low-temperature magnetic glass solder |
| CN113977132A (en) * | 2014-08-18 | 2022-01-28 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
-
2009
- 2009-10-22 CN CN2009101932089A patent/CN101693326B/en not_active Expired - Fee Related
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101890592A (en) * | 2010-07-19 | 2010-11-24 | 周炳刚 | Novel brazing material and manufacturing method thereof |
| CN102179642A (en) * | 2011-05-06 | 2011-09-14 | 郴州格瑞特焊业有限公司 | Copper-based brazing filler metal and preparation method thereof |
| CN102658443A (en) * | 2012-05-22 | 2012-09-12 | 江苏科技大学 | Brazing filler metal for brazing tungsten-copper alloy and stainless steel and brazing process |
| CN102658443B (en) * | 2012-05-22 | 2014-01-15 | 江苏科技大学 | Brazing filler metal for brazing tungsten-copper alloy and stainless steel and brazing process |
| CN103624415A (en) * | 2012-08-22 | 2014-03-12 | 北京有色金属研究总院 | Boron-containing stannum-based lead-free solder and manufacturing method thereof |
| CN102862003A (en) * | 2012-10-08 | 2013-01-09 | 佛山市泓实机械制造有限公司 | Silver-free copper based solder and preparation method thereof |
| CN103008915A (en) * | 2012-12-27 | 2013-04-03 | 浙江信和科技股份有限公司 | Low-silver copper-based solder free of spillover phenomenon during weld period |
| US10543571B2 (en) | 2013-08-06 | 2020-01-28 | Sanyo Special Steel Co., Ltd. | Cu-added Ni—Cr—Fe-based alloy brazing material |
| CN105473275A (en) * | 2013-08-06 | 2016-04-06 | 山阳特殊制钢株式会社 | Cu-added Ni-Cr-Fe-based alloy brazing material |
| CN110039221A (en) * | 2013-08-06 | 2019-07-23 | 山阳特殊制钢株式会社 | Ni-Cr-Fe based alloy solder added with Cu |
| CN113977132A (en) * | 2014-08-18 | 2022-01-28 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
| CN113977132B (en) * | 2014-08-18 | 2024-03-19 | （株）庆东One | Lead-free solder alloy composition and method for preparing lead-free solder alloy |
| CN104759781A (en) * | 2015-04-17 | 2015-07-08 | 郑州机械研究所 | Silver substitute copper phosphorus tin coating brazing alloy ring and preparation method thereof |
| CN105033500A (en) * | 2015-05-28 | 2015-11-11 | 浙江信和科技股份有限公司 | Silver-free brazing filler metal without overflow phenomenon during welding of copper and copper alloy and preparing method |
| CN105033500B (en) * | 2015-05-28 | 2018-01-05 | 浙江信和科技股份有限公司 | Silver-less solder and preparation method without excessive phenomenon when a kind of welding copper and copper alloy |
| CN106392234A (en) * | 2016-11-10 | 2017-02-15 | 江苏科技大学 | Medium temperature multicomponent Cu-based solder for brazing copper and steel as well as preparation and brazing methods |
| CN106736025A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle temperature silverless Cu-base soldering material and preparation method thereof |
| CN106736024A (en) * | 2016-12-15 | 2017-05-31 | 江门市盈盛焊接材料科技有限公司 | A kind of middle silver-free copper-based soldering paste of temperature and preparation method thereof |
| CN112719693A (en) * | 2020-12-11 | 2021-04-30 | 哈尔滨工业大学 | Low-temperature magnetic glass solder, preparation method thereof and method for connecting ferrite by using low-temperature magnetic glass solder |
| CN112719693B (en) * | 2020-12-11 | 2022-08-30 | 哈尔滨工业大学 | Low-temperature magnetic glass solder, preparation method thereof and method for connecting ferrite by using low-temperature magnetic glass solder |
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| CN101693326B (en) | 2011-07-20 |
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