CN101685839A - Semiconductor chip module - Google Patents
Semiconductor chip module Download PDFInfo
- Publication number
- CN101685839A CN101685839A CN200810161799A CN200810161799A CN101685839A CN 101685839 A CN101685839 A CN 101685839A CN 200810161799 A CN200810161799 A CN 200810161799A CN 200810161799 A CN200810161799 A CN 200810161799A CN 101685839 A CN101685839 A CN 101685839A
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- CN
- China
- Prior art keywords
- semiconductor chip
- optical element
- light
- semiconductor
- chip module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Led Device Packages (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a semiconductor chip module comprising a semiconductor element, an optical element and a support element, wherein the semiconductor element comprises a semiconductor chip and aheat radiation base connected with the semiconductor chip; the optical element is positioned above the semiconductor element, and the semiconductor chip absorbs or emits light rays through the opticalelement; the support element bears the optical element; the support element is provided with a passage for selectively containing the semiconductor element; and when the semiconductor element is contained in the passage, the semiconductor chip is aligned with the optical element.
Description
Technical field
The present invention relates to a kind of semiconductor chip module, particularly relate to a kind of semiconductor chip module of alternative dismounting semiconductor chip.
Background technology
Figure 1 shows that the structure of known concentrating solar battery module 1.Concentrating solar battery module 1 comprises optical element 13 and solar element 11.Solar element 11 comprises solar chip 111 and substrate 112.On solar chip 111,111 of solar chips are the electric energy generating with transform light energy to optical element 13 with light focusing.For light can be gathered on the solar chip 11 exactly, optical element 13 need preestablish with the relative position of solar chip 111, that is optical element 13 needs to aim at mutually with solar chip 111.Concentrating solar battery module 1 still has heat dissipation element 15, and carrying solar element 11, heat dissipation element 15 can be arranged the heat that the solar chip 111 that looses produces, and avoid module 1 overheated, and can't normal operation.
Yet, when having partly, damages known concentrating solar battery module 1, and when for example one of them of optical element 13 or solar element 11 damaged, the known practice can be removed the element of fixing on it and replace with new element.Because original position of aiming at has often gone to pot in the demolishing process, so the relative position of align optical components 13 and solar element 11 again when replacing, this is quite time-consuming, thereby causes many puzzlements.
Summary of the invention
In view of above problem, the invention provides a kind of channelled semiconductor chip module.The present invention utilizes the relative position of this path setting semiconductor chip and optical element, so, in substituting the semiconductor chip process, do not need to position again correction, can therefore save many times and hoisting module the convenience of changing is installed.
According to embodiment, the invention provides a kind of semiconductor chip module, comprise semiconductor element, have semiconductor chip and cooling base and connect this semiconductor chip; Optical element is positioned at this semiconductor chip top, and this semiconductor chip absorbs by this optical element or emission light; And support component, carrying this optical element, this support component has passage in order to optionally to take in this semiconductor element, and wherein when this semiconductor element was accommodated in this passage, this semiconductor chip was aimed at this optical element.
According to another embodiment, the invention provides a kind of semiconductor chip module, comprise semiconductor element, have semiconductor chip and cooling base and connect this semiconductor chip; Optical element is positioned at this semiconductor chip top, and this semiconductor chip absorbs by this optical element or emission light; And support component, carrying this optical element, this support component has passage in order to optionally to engage with semiconductor element, and the part of this semiconductor element is accommodated in this passage when engaging, and the semiconductor chip align optical components.
Below be described in detail feature of the present invention and advantage, its content is enough to make those skilled in the art to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claim and accompanying drawing, any persons skilled in the art can be understood purpose and the advantage that the present invention is correlated with easily.
More than about the explanation of the explanation of content of the present invention and following execution mode be in order to demonstration with explain principle of the present invention, be not in order to limit category of the present invention.
Description of drawings
Fig. 1 is the structure of known concentrating solar battery module.
Fig. 2 A and Fig. 2 B are the process schematic diagram that semiconductor element is accommodated in support component.
Fig. 2 C is the vertical view of semiconductor element.
Fig. 2 D is the end view of semiconductor element by the direction of arrow shown in Fig. 2 C.
Fig. 3 A and Fig. 3 B are the process schematic diagram that semiconductor element is accommodated in support component.
Fig. 3 C is the vertical view of semiconductor element.
Fig. 3 D is the end view of semiconductor element by the direction of arrow shown in Fig. 3 C.
Fig. 4 A and Fig. 4 B are the process schematic diagram that semiconductor element is accommodated in support component.
Fig. 4 C is the vertical view of semiconductor element.
Fig. 4 D is the end view of semiconductor element by the direction of arrow shown in Fig. 4 C.
Fig. 5 A and Fig. 5 B are the process schematic diagram that semiconductor element is accommodated in support component.
Fig. 6 is for showing the structural representation of semiconductor chip module semiconductor element of the present invention according to the 5th embodiment.
Description of reference numerals
1: concentrating solar battery module 11: solar element
111: solar chip 112: substrate
13: optical element 15: heat dissipation element
2: semiconductor chip module 21: semiconductor element
211: semiconductor chip 212: cooling base
212A: the 212B of first: second portion
213: box thread 214: connection gasket
23: optical element 231: lens
232: lens carrier 232a: reflecting surface
25: support component 251: inwall
252: passage 253: male thread
3: semiconductor chip module 31: semiconductor element
312: cooling base 312A: first
312B: second portion 312C: third part
314: brace 35: support component
4: semiconductor chip module 41: semiconductor element
412: cooling base 412A: first
412B: second portion 413: screw thread
414: brace 45: support component
5: semiconductor chip module 51: semiconductor element
511: semiconductor chip 512: cooling base
5121: base body 5123: outer ring structure
5125: annular groove 5127: male thread
53: optical element 531: lens
532: lens carrier 532a: reflecting surface
55: support component 552: passage
553: box thread 6: semiconductor chip module
61: semiconductor element 611: semiconductor chip
612: cooling base 614: look edge layer
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows.
Fig. 2 A-2D is for showing semiconductor chip module 2 structure charts of the present invention according to first embodiment.Semiconductor chip module 2 includes semiconductor element 21, optical element 23 and support component 25.Fig. 2 A and Fig. 2 B are the process schematic diagram that semiconductor element 21 is accommodated in support component 25.Fig. 2 C is the vertical view of semiconductor element 21.Fig. 2 D is the end view of semiconductor element 21 by the direction of arrow shown in Fig. 2 C.
Shown in Fig. 2 A-2D, semiconductor element 21 comprises the cooling base 212 of semiconductor chip 211 and bearing semiconductor chip 211.Semiconductor chip 211 can be any suitable semiconductor chip that encapsulates or do not encapsulate, as light-emitting diode, photovoltaic diode etc.Cooling base 212 comprises the 212A of first, second portion 212B (consulting Fig. 2 C).The 212A of first and second portion 212B are for being connected mutually insulated by connection gasket 214, and semiconductor chip 211 is arranged at the second portion 212B of cooling base 212.Connection gasket 214 can be any suitable insulation material, for example pottery or Teflon or the general used FR4 substrate of printed circuit board (PCB), the i.e. material that is composited by resin, glass and inorganic fillings.In present embodiment, cooling base 212 is arranged to cylindric.The outer surface of cooling base 212 is provided with box thread 213.Number and the profile that should note cooling base 212 can change on demand, and the present invention does not limit its number and shape.The semiconductor element 21 structures explanation of relevant this embodiment can see for details in TaiWan, China patent application 97135344.
Shown in Fig. 2 A-2B, optical element 23 is positioned at semiconductor chip 211 tops, and it comprises lens 231 and lens carrier 232 connects support component 25.Visual semiconductor chip 211 variations of the aspect of optical element 23 decide.In the example of photovoltaic diode as semiconductor chip 211, lens 231 can be a kind of condenser of similar convex lens, are used for focusing on the light of sun emission, and it preferably can be Fei Nieer lens (Fresnel Lens).In the example of light-emitting diode as semiconductor chip 211, lens 231 can be general transparent glasses lens, can protect light-emitting diode and the light of its generation is appeared.And, in this example, lens carrier 232 also comprise be coated with reflecting material reflecting surface 232a around light-emitting diode.Reflecting surface 232a uses so that the light that light-emitting diode is dispersed sends out towards the direction of lens 231.Should understand thus, when semiconductor chip 211 is a photovoltaic diode, during this photovoltaic diode align optical components 23, collector lens 231 will make light focusing on photovoltaic diode; When semiconductor chip 211 is a light-emitting diode, during this light-emitting diode align optical components 23, the rays pass through lens 231 that light-emitting diode produced sends out.
Shown in Fig. 2 A-2B, support component 25 is hollow tubular for another example, and it defines inwall 251, to form passage 252.Passage 252 sizes are decided by the size of semiconductor element 21.Inwall 251 forms male thread 253, can be corresponding to the box thread 213 of semiconductor element 21.Preferred, when semiconductor element 21 was accommodated in passage 252, by the thread locking structure, the cooling base 212 of semiconductor element 21 just can optionally engage with inwall 251.Should note semiconductor element 21 and the form that support component 25 engages, be not limited to thread locking, other any suitable structures are all in the scope of the invention.
From the above description as can be known in the semiconductor chip module 2 of first embodiment of the invention, semiconductor element 21 can optionally optionally be accommodated in the support component 25, and the male and female screw thread 213,253 by cooling base 212 and support component 25 inwalls 251 is fixed in the passage 252 of support component 25, shown in Fig. 2 B.When semiconductor element 21 is accommodated in the passage 252 of support component 25, because passage 252 has been set the relative position of semiconductor element 21 and optical element 23, so, 2 of semiconductor chip modules do not need to aim at again again, can save down many times and reduce many puzzlements.
It should be noted that, to expand with heat and contract with cold effect and make semiconductor element 21 and engaging of support component 25 present preferred condition in order to slow down, the two material of cooling base 212 and support component 25 can be respectively one adopt hardness big, one adopt the hardness materials with smaller to make.
Fig. 3 A-3D is for showing semiconductor chip module 3 structure charts of the present invention according to second embodiment.Fig. 3 A and Fig. 3 B are the process schematic diagram that semiconductor element 31 is accommodated in support component 35.Fig. 3 C is the vertical view of semiconductor element 31.Fig. 3 D is the end view of semiconductor element 31 by the direction of arrow shown in Fig. 3 C.The semiconductor chip module 3 of second embodiment and the first embodiment difference are, cooling base 312 comprises the 312A of first, second portion 312B and third part 312C, and wherein 312A of first and third part 312C are that the center is symmetrical arranged with second portion 312B.And the 312A of first is connected and mutually insulated by brace 314 with third part 312C with second portion 312B, second portion 312B.The semiconductor element 31 structures explanation of relevant this embodiment can see for details in TaiWan, China patent application 97135344.
Fig. 4 A-4D is for showing semiconductor chip module 4 structure charts of the present invention according to the 3rd embodiment.Fig. 4 A, 4B are the process schematic diagram that semiconductor element 41 is accommodated in support component 45.Fig. 4 C is the vertical view of semiconductor element 41.Fig. 4 D is the end view of semiconductor element 41 by the direction of arrow shown in Fig. 4 C.The 3rd embodiment and the second embodiment difference are that the 412A of first of cooling base 412 and second portion 412B are concentric circles, and second portion 412B is surrounded by the 412A of first.412A of first and second portion 412B are spaced from each other with insulation brace 414.Notice that in the present embodiment, the screw thread 413 around the cooling base 412 is arranged on the 412A of first, and also mutually insulated and semiconductor chip 411 also directly is contacted with on the second portion 412B of the 412A of first and second portion 412B.The semiconductor element 41 structures explanation of relevant this embodiment can see for details in TaiWan, China patent application 97135344.
Fig. 5 A-5B is for showing semiconductor chip module 5 structure charts of the present invention according to the 4th embodiment.Semiconductor chip module 5 includes semiconductor element 51, optical element 53 and support component 55.Fig. 5 A and Fig. 5 B are the process schematic diagram that semiconductor element 51 is accommodated in support component 55.
Shown in Fig. 5 A-5B, semiconductor element 51 comprises the cooling base 512 of semiconductor chip 511 and bearing semiconductor chip 511.The structure of semiconductor chip 511 can be with reference to each embodiment before.In present embodiment, cooling base 512 has annular groove 5125.Ring groove 5125 makes cooling base 512 divide into base body 5121 and outer ring structure 5123.Outer ring structure 5123 has inwall definition annular groove 5125, forms male thread 5127 on the inwall.
Shown in Fig. 5 A-5B, optical element 53 is positioned at semiconductor chip 511 tops, and it comprises lens 531 and lens carrier 532 connects support component 55.In the example of photovoltaic diode as semiconductor chip 511, lens 531 can be a kind of condenser of similar convex lens, are used for focusing on the light of sun emission, and it preferably can be the Fei Nieer lens.In the example of light-emitting diode as semiconductor chip 511, lens 531 can be general transparent glasses lens, can protect light-emitting diode and the light of its generation is appeared.And, as described above, lens carrier 532 also can comprise be coated with reflecting material reflecting surface 532a around light-emitting diode.Reflecting surface 532a uses so that the light that light-emitting diode is dispersed sends out towards the direction of lens 231.Should understand thus, when semiconductor chip 511 is a photovoltaic diode, when this photovoltaic diode is aimed at this optical element 53, collector lens 531 will make light focusing on photovoltaic diode; When semiconductor chip 511 is a light-emitting diode, during this light-emitting diode align optical components 53, the rays pass through lens 531 that light-emitting diode produced sends out.
Shown in Fig. 5 A-5B, support component 55 has passage 552 for another example.The outer surface of support component 55 forms box thread 553, can be corresponding to the male thread 5127 of semiconductor element 51.When semiconductor element 51 engaged with support component 55, base body 5121 was accommodated in 552 passages, and support component 55 then is accommodated in the annular groove 5125, and male thread 5127 can engage with box thread 553 and formed suitable binding this moment.
From the above description as can be known in the semiconductor chip module 5 of fourth embodiment of the invention, semiconductor element 51 can optionally optionally engage with support component 55.Semiconductor element 51 partly is accommodated in the passage 552 when engaging, and semiconductor chip 511 align optical components 53.
Fig. 6 is for showing the structural representation of semiconductor chip module 6 of the present invention according to the 5th embodiment.The 5th embodiment and the first embodiment difference are that semiconductor element 61 also comprises insulating barrier 614, are connected with cooling base 612 and semiconductor chip 611 is arranged on the insulating barrier 614.The semiconductor element 41 structures explanation of relevant this embodiment can see for details in TaiWan, China patent application 97135344.
Though the present invention discloses as above with aforesaid embodiment, so it is not in order to limit the present invention.Without departing from the spirit and scope of the present invention, change of doing and retouching all belong to scope of patent protection of the present invention.Please refer to appended claim about the protection range that the present invention defined.
Claims (13)
1. semiconductor chip module comprises:
Semiconductor element has semiconductor chip and cooling base and connects this semiconductor chip;
Optical element is positioned at this semiconductor chip top, and this semiconductor chip absorbs by this optical element or emission light; And
Support component carries this optical element, and this support component has passage in order to optionally to take in this semiconductor element, and wherein when this semiconductor element was accommodated in this passage, this semiconductor chip was aimed at this optical element.
2. semiconductor chip module as claimed in claim 1, wherein this semiconductor chip is a photovoltaic diode, and this optical element comprises condenser, and when this photovoltaic diode was aimed at this optical element, this condenser made light focusing on this photovoltaic diode.
3. semiconductor chip module as claimed in claim 1, wherein this semiconductor chip is a light-emitting diode, and this optical element comprises lens, and when this light-emitting diode was aimed at this optical element, the light that this light-emitting diode produced sent out by these lens.
4. semiconductor chip module as claimed in claim 3, wherein this optical element also comprises reflecting surface around this light-emitting diode, this reflecting surface with so that this light towards these lens.
5. semiconductor chip module as claimed in claim 1, wherein this support component definition inwall is to form this passage, and this inwall has male thread, and this cooling base has box thread to should male thread, when this semiconductor element was accommodated in this passage, this male thread engaged mutually with this box thread.
6. semiconductor chip module as claimed in claim 1, wherein this semiconductor element also comprises insulating barrier between this semiconductor chip and this cooling base.
7. semiconductor chip module comprises:
Semiconductor element has semiconductor chip and cooling base and connects this semiconductor chip;
Optical element is positioned at this semiconductor chip top, and this semiconductor chip absorbs by this optical element or emission light; And
Support component carries this optical element, and this support component has passage in order to optionally to engage with this semiconductor element, and the part of this semiconductor element is accommodated in this passage when engaging, and this semiconductor chip is aimed at this optical element.
8. semiconductor chip module as claimed in claim 7, wherein this semiconductor chip is a photovoltaic diode, and this optical element comprises condenser, and when this photovoltaic diode was aimed at this optical element, this condenser made light focusing on this photovoltaic diode.
9. semiconductor chip module as claimed in claim 7, wherein this semiconductor chip is a light-emitting diode, and this optical element comprises lens, and when this light-emitting diode was aimed at this optical element, the light that this light-emitting diode produced sent out by these lens.
10. semiconductor chip module as claimed in claim 9, wherein this optical element also comprises reflecting surface around this light-emitting diode, this reflecting surface with so that this light towards these lens.
11. semiconductor chip module as claimed in claim 7, wherein this cooling base has annular groove, and this ring groove makes this cooling base divide into base body and outer ring structure, and this base body is accommodated in this passage when engaging.
12. semiconductor chip module as claimed in claim 11, wherein should outer ring structure have inwall and define this annular groove, this inwall has male thread, and this support component has box thread to should male thread, when this base body is accommodated in this passage, this male thread engages mutually with this box thread.
13. semiconductor chip module as claimed in claim 7, wherein this cooling base has annular groove, and this support component is accommodated in this annular groove when engaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810161799A CN101685839A (en) | 2008-09-26 | 2008-09-26 | Semiconductor chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810161799A CN101685839A (en) | 2008-09-26 | 2008-09-26 | Semiconductor chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101685839A true CN101685839A (en) | 2010-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810161799A Pending CN101685839A (en) | 2008-09-26 | 2008-09-26 | Semiconductor chip module |
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| Country | Link |
|---|---|
| CN (1) | CN101685839A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106788230A (en) * | 2017-03-14 | 2017-05-31 | 成都聚合追阳科技有限公司 | Low-concentration photovoltaic bar section stair staggered shape radiating fin radiator |
-
2008
- 2008-09-26 CN CN200810161799A patent/CN101685839A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106788230A (en) * | 2017-03-14 | 2017-05-31 | 成都聚合追阳科技有限公司 | Low-concentration photovoltaic bar section stair staggered shape radiating fin radiator |
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Open date: 20100331 |