US9381726B2 - Method for packaging secondary optical element - Google Patents

Method for packaging secondary optical element Download PDF

Info

Publication number
US9381726B2
US9381726B2 US14/451,516 US201414451516A US9381726B2 US 9381726 B2 US9381726 B2 US 9381726B2 US 201414451516 A US201414451516 A US 201414451516A US 9381726 B2 US9381726 B2 US 9381726B2
Authority
US
United States
Prior art keywords
optical element
secondary optical
packaging
fixture
glue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US14/451,516
Other versions
US20160039190A1 (en
Inventor
Yueh-Mu Lee
Zun-Hao Shih
Yi-Ping Liang
Hwa-Yuh Shin
Hwen-Fen Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Nuclear Energy Research
Original Assignee
Institute of Nuclear Energy Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Nuclear Energy Research filed Critical Institute of Nuclear Energy Research
Priority to US14/451,516 priority Critical patent/US9381726B2/en
Assigned to ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH reassignment ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HONG, HWEN-FEN, LEE, YUEH-MU, LIANG, Yi-ping, SHIH, ZUN-HAO, SHIN, HWA-YUH
Publication of US20160039190A1 publication Critical patent/US20160039190A1/en
Application granted granted Critical
Publication of US9381726B2 publication Critical patent/US9381726B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/0543—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the refractive type, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

Definitions

  • the present invention relates generally to a method for packaging, and particularly to a method for packaging secondary optical element, which makes a fastener for the packaged product unnecessary by using an auxiliary fixture and a flip technique.
  • the fundamental operation method of solar power generation is to illuminate sunlight on the surface of solar cells.
  • concentrating solar cell modules which adopt a concentrating lens for concentrating a great deal of photovoltaic energy. These concentrating solar cell modules can shrink the size of solar cells and thus saving the materials of cells by increasing the concentrating multiple and using automatic production.
  • secondary optical elements such as spherical lenses
  • small-area solar cells in the concentrating solar cell modules for shrinking the concentrating light spot as well as increasing the angle tolerance of sunlight.
  • present method for fixing spherical lenses is difficult and complicated.
  • Current general secondary optical elements are components with high light perviousness and hardness, including metal materials or glass. If metals are adopted for fabricating secondary optical elements, screw fastening is required for installation, which consumes a substantial amount of labor and components such as screws.
  • glass materials while combining the secondary optical elements with the solar cell chips on the circuit board, the primary optical glue should be applied first for protecting the surfaces of solar cell chips and the thin metal conductive wires.
  • Mass production of secondary optical elements is usually performed by using molds. While forming using a mold, some part of a secondary optical element should be provided for thimble contact, so that the formed secondary optical element can be pushed out of the mold by a thimble. Nonetheless, if the thimble contacts directly the optical region of the secondary optical element, namely, the region responsible for the optical function of the secondary optical element, the shape of the optical region will be destroyed, resulting in damages of the secondary optical element. Accordingly, an additional block is provided for thimble contact. Unfortunately, this additional block makes the general fixture not applicable to the secondary optical element.
  • An objective of the present invention is to provide a method for packaging secondary optical element, which requires no additional fastener for fixing a packaged secondary optical element. Only the optical glue is required for jointing.
  • Another objective of the present invention is to provide a method for packaging secondary optical element, which can be applied extensively to packaging optoelectric devices such as solar cells or light-emitting diodes.
  • the present invention discloses a method for packaging secondary optical element, which packages a secondary optical element above an optoelectric device.
  • the optoelectric device is fixed on a substrate and covered by hardened first optical glue.
  • the method comprises steps of: positioning the secondary optical element using a fixture, a bottom surface of the secondary optical element facing up, and the bottom surface covered by hardened second optical glue; flipping the substrate vertically to turn the optoelectric device facing down and enable the first optical glue to contact the second optical glue; flipping the substrate and the fixture vertically to lower the secondary optical element towards the direction of the optoelectric device; and hardening the second optical glue.
  • FIG. 1 shows a structural schematic diagram of fixing a solar cell on a substrate and covered by hardened first optical glue according to a preferred embodiment of the present invention
  • FIG. 2 shows a structural schematic diagram of the secondary optical element having a lug according to a preferred embodiment of the present invention
  • FIG. 3 shows a structural schematic diagram of the secondary optical element having an optical region and a non-optical region according to a preferred embodiment of the present invention
  • FIG. 4 shows a process step of inserting the secondary optical element into the positioning hole of a fixture according to a preferred embodiment of the present invention
  • FIG. 5 shows a process step of moving the substrate downwards to make the first optical glue contact the second optical glue according to a preferred embodiment of the present invention
  • FIG. 6 shows a process step in which the first optical glue has contacted the second optical glue according to a preferred embodiment of the present invention
  • FIG. 7 shows a structural schematic diagram of the vertically flipped substrate and the fixture according to a preferred embodiment of the present invention
  • FIG. 8 shows a structural schematic diagram of the hardened optical glue according to a preferred embodiment of the present invention.
  • FIG. 9 shows a structural schematic diagram after the fixture is removed according to a preferred embodiment of the present invention.
  • a secondary optical element is packaged above an optoelectric device such as a light-emitting diode or a solar cell.
  • an optoelectric device such as a light-emitting diode or a solar cell.
  • a solar cell is taken as an example. The steps that follow will undoubtedly be applied to a light-emitting diode as well.
  • a solar cell 12 is fixed on a substrate 10 and covered by hardened first optical glue 14 .
  • the material of the first optical glue 14 is high-transmissivity and insulating glue. It can be hardened by placing at room temperature, heating, or ultraviolet illumination. According to the present invention, before packaging the secondary optical element, the first optical glue 14 is already hardened for completing packaging of the solar cell 12 .
  • the packaged devices in addition to the solar cell 12 , also include the circuit structure 16 located between the solar cell 12 and the substrate 10 .
  • the circuit structure 16 can be a plurality of metal electrodes and gold wires.
  • the solar cell 12 and the circuit structure 16 are connected electrically, so that the electric power generated by the solar cell 12 can be transmitted outwards.
  • the secondary element 20 to be packages according to the present invention is a light-pervious hemisphere, sphere, or bullet-shaped member made of glass, quartz, plastics, acrylics, or glue. It includes a lug in its structure.
  • the main part of the secondary optical element 20 can be divided into an optical region 24 and anon-optical region 26 (the grid area in the figures).
  • the secondary optical element 20 owns the characteristics of a spherical lens.
  • the optical area 24 is bullet-shaped.
  • the front of the optical area 20 is a hemisphere 28 for collecting the photo energy focused by the concentrating lens, so that the area of the concentrated sunlight spot can be further shrunk in the concentrating solar cell module and thus increasing the angle tolerance of sunlight shift.
  • the non-optical area 26 is not situated on the main light path and does not provide the functions of concentrating photo energy and light path. Instead, it provides non-optical functions such as auxiliary positioning.
  • the structure of the lug 22 described above is located in the non-optical area 26 .
  • the non-optical area 26 is designed additionally. This non-optical area 26 shows the structural characteristics of the lug 22 .
  • the method for packaging according to the present invention is based on the devices and structural characteristics described above, and comprises the following steps:
  • the fixture 30 used in the present invention includes a positioning hole 32 (this is figure is used for showing the positioning hole of the fixture only).
  • the secondary optical element 20 is inserted in to the positioning hole 32 of the fixture 30 .
  • the diameter R 1 of the positioning hole 32 is not less than the inner diameter R 2 of the lug 22 of the secondary optical element 20 .
  • the preferred size is that R 1 is slightly greater than R 2 , so that the secondary optical element 20 will not shake laterally after being inserted into the positioning hole 32 but still be able to slide up and down.
  • the lug 22 of the secondary optical element 20 will be against a surface of the fixture 30 .
  • the substrate 10 is flipped vertically to make the solar cell 12 , which faces upwards originally, face downwards, and to make the first optical glue 14 move downwards to contact the second optical glue 36 .
  • the substrate 10 according to the present invention includes at least a mortise 18 .
  • the fixture 30 further includes at least a tenon 34 .
  • the tenons 34 joint the mortises 18 , respectively, and thus jointing the substrate 10 and the fixture 30 .
  • a space 40 is divided.
  • the mortises 34 are located on the frame 30 of the fixture 30 .
  • FIG. 6 shows a schematic diagram of the jointed substrate 10 and the fixture 30 . Because the first optical glue 14 is hardened, when the first optical glue 14 contacts the second optical glue 36 , the shape of the first optical glue 14 will not change. Nonetheless, because the second optical glue 36 is not hardened at this moment, it will be squeezed by the first optical glue 14 and flow along the surface of the first optical glue 14 .
  • the jointed substrate 10 and the fixture 30 are flipped simultaneously so that the lug 22 of the secondary optical element 20 is no longer against one surface of the fixture 30 . Instead, the lug 22 can fall naturally.
  • the secondary optical element 20 squeezes the second optical glue 36 and is lowered towards the direction of the solar cell 12 . As shown in FIG. 7 , the secondary optical element 20 is lowered to the surface of the hardened first optical glue 14 . Based on the design of the fixture 30 , the secondary optical element 20 is aligned above the solar cell 12 . Thereby, in the step S 30 , the secondary optical element 20 will be positioned above the solar cell 12 .
  • the second optical glue 36 is hardened by high-temperature baking or ultraviolet illumination for fixing the secondary optical element 20 above the solar cell 12 .
  • the hardened second optical glue 36 integrates with the earlierly-hardened first optical glue 14 and forming a complete optical glue block.
  • the fixture 30 is removed.
  • FIG. 9 shows a schematic diagram of the packaged the secondary optical element 20 after the fixture 30 is removed.
  • the secondary optical element 20 has the focusing effect of a spherical lens. Thereby, the incident sunlight can be focused by the secondary optical element 20 and concentrated on the surface of the solar cell 12 . In other words, together with the Fresnel lens and the secondary optical element 20 , the area of the concentrated sunlight spot can be further shrunk in the concentrating solar cell module and thus increasing the angle tolerance of sunlight shift.
  • the present invention discloses a method for packaging secondary optical element.
  • the secondary optical element By coating optical glue at two sites and hardening individually as well as using the technical characteristics of flipping the substrate and the fixture, the secondary optical element can fall naturally and be positioned above an optoelectric device such as a solar cell or a light-emitting diode.
  • the package quality of the finished product is excellent with high reliability and mass productivity.
  • the method for packaging secondary optical element according to the present invention truly provides practical values.
  • the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility.
  • the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape, structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The present invention relates to a method for packaging secondary optical element. By coating optical glue on the bottom surface of the secondary optical element and on the substrate and by hardening individually, as well as using the technical characteristics of flipping the substrate and the fixture, the secondary optical element can fall naturally and be positioned above an optoelectric device such as a solar cell or a light-emitting diode. No additional fastener is required for supporting the secondary optical element.

Description

FIELD OF THE INVENTION
The present invention relates generally to a method for packaging, and particularly to a method for packaging secondary optical element, which makes a fastener for the packaged product unnecessary by using an auxiliary fixture and a flip technique.
BACKGROUND OF THE INVENTION
The fundamental operation method of solar power generation is to illuminate sunlight on the surface of solar cells. Currently, in order to increase the power generating efficiency, there are concentrating solar cell modules, which adopt a concentrating lens for concentrating a great deal of photovoltaic energy. These concentrating solar cell modules can shrink the size of solar cells and thus saving the materials of cells by increasing the concentrating multiple and using automatic production.
In practice, secondary optical elements, such as spherical lenses, should be used together with small-area solar cells in the concentrating solar cell modules for shrinking the concentrating light spot as well as increasing the angle tolerance of sunlight. Nonetheless, the present method for fixing spherical lenses is difficult and complicated. Current general secondary optical elements are components with high light perviousness and hardness, including metal materials or glass. If metals are adopted for fabricating secondary optical elements, screw fastening is required for installation, which consumes a substantial amount of labor and components such as screws. On the other hand, if glass materials are adopted, while combining the secondary optical elements with the solar cell chips on the circuit board, the primary optical glue should be applied first for protecting the surfaces of solar cell chips and the thin metal conductive wires.
Mass production of secondary optical elements is usually performed by using molds. While forming using a mold, some part of a secondary optical element should be provided for thimble contact, so that the formed secondary optical element can be pushed out of the mold by a thimble. Nonetheless, if the thimble contacts directly the optical region of the secondary optical element, namely, the region responsible for the optical function of the secondary optical element, the shape of the optical region will be destroyed, resulting in damages of the secondary optical element. Accordingly, an additional block is provided for thimble contact. Unfortunately, this additional block makes the general fixture not applicable to the secondary optical element.
SUMMARY
An objective of the present invention is to provide a method for packaging secondary optical element, which requires no additional fastener for fixing a packaged secondary optical element. Only the optical glue is required for jointing.
Another objective of the present invention is to provide a method for packaging secondary optical element, which can be applied extensively to packaging optoelectric devices such as solar cells or light-emitting diodes.
In order to achieve the objectives described above, the present invention discloses a method for packaging secondary optical element, which packages a secondary optical element above an optoelectric device. The optoelectric device is fixed on a substrate and covered by hardened first optical glue. The method comprises steps of: positioning the secondary optical element using a fixture, a bottom surface of the secondary optical element facing up, and the bottom surface covered by hardened second optical glue; flipping the substrate vertically to turn the optoelectric device facing down and enable the first optical glue to contact the second optical glue; flipping the substrate and the fixture vertically to lower the secondary optical element towards the direction of the optoelectric device; and hardening the second optical glue.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a structural schematic diagram of fixing a solar cell on a substrate and covered by hardened first optical glue according to a preferred embodiment of the present invention;
FIG. 2 shows a structural schematic diagram of the secondary optical element having a lug according to a preferred embodiment of the present invention;
FIG. 3 shows a structural schematic diagram of the secondary optical element having an optical region and a non-optical region according to a preferred embodiment of the present invention;
FIG. 4 shows a process step of inserting the secondary optical element into the positioning hole of a fixture according to a preferred embodiment of the present invention;
FIG. 5 shows a process step of moving the substrate downwards to make the first optical glue contact the second optical glue according to a preferred embodiment of the present invention;
FIG. 6 shows a process step in which the first optical glue has contacted the second optical glue according to a preferred embodiment of the present invention;
FIG. 7 shows a structural schematic diagram of the vertically flipped substrate and the fixture according to a preferred embodiment of the present invention;
FIG. 8 shows a structural schematic diagram of the hardened optical glue according to a preferred embodiment of the present invention; and
FIG. 9 shows a structural schematic diagram after the fixture is removed according to a preferred embodiment of the present invention.
 DETAILED DESCRIPTION
In order to make the structure and characteristics as well as the effectiveness of the present invention to be further understood and recognized, the detailed description of the present invention is provided as follows along with embodiments and accompanying figures.
According to the method for packaging secondary optical element of the present invention, a secondary optical element is packaged above an optoelectric device such as a light-emitting diode or a solar cell. The difference is only on the different operational principles of the optoelectric devices and the direction by which the light passes through the secondary optical element. In the following embodiment of the present invention, a solar cell is taken as an example. The steps that follow will undoubtedly be applied to a light-emitting diode as well.
Please refer to FIG. 1 first. A solar cell 12 is fixed on a substrate 10 and covered by hardened first optical glue 14. The material of the first optical glue 14 is high-transmissivity and insulating glue. It can be hardened by placing at room temperature, heating, or ultraviolet illumination. According to the present invention, before packaging the secondary optical element, the first optical glue 14 is already hardened for completing packaging of the solar cell 12.
In the first optical glue 14, in addition to the solar cell 12, the packaged devices also include the circuit structure 16 located between the solar cell 12 and the substrate 10. The circuit structure 16 can be a plurality of metal electrodes and gold wires. The solar cell 12 and the circuit structure 16 are connected electrically, so that the electric power generated by the solar cell 12 can be transmitted outwards.
By using the first optical glue 14, the solar cell 12 and the circuit structure 16 are packaged on the substrate 10. On the other hand, a fixture is used for positioning the secondary optical element 20. Please refer to FIGS. 2 and 3. The secondary element 20 to be packages according to the present invention is a light-pervious hemisphere, sphere, or bullet-shaped member made of glass, quartz, plastics, acrylics, or glue. It includes a lug in its structure. The main part of the secondary optical element 20 can be divided into an optical region 24 and anon-optical region 26 (the grid area in the figures). Overall, the secondary optical element 20 owns the characteristics of a spherical lens. According to the present embodiment of the present invention, the optical area 24 is bullet-shaped. The front of the optical area 20 is a hemisphere 28 for collecting the photo energy focused by the concentrating lens, so that the area of the concentrated sunlight spot can be further shrunk in the concentrating solar cell module and thus increasing the angle tolerance of sunlight shift. On the other hand, the non-optical area 26 is not situated on the main light path and does not provide the functions of concentrating photo energy and light path. Instead, it provides non-optical functions such as auxiliary positioning.
Furthermore, the structure of the lug 22 described above is located in the non-optical area 26. In the rapid, mass, and low-cost production of the secondary optical elements 20, a region should be provided in mold forming for thimble pushing. Thereby, to avoid damages on the shapes of the optical elements by contacting thimbles on the optical area 24 directly, the non-optical area 26 is designed additionally. This non-optical area 26 shows the structural characteristics of the lug 22.
The method for packaging according to the present invention is based on the devices and structural characteristics described above, and comprises the following steps:
  • Step S10: Positioning the secondary optical element using a fixture, a bottom surface of the secondary optical element facing up, and the bottom surface covered by hardened second optical glue;
  • Step S20: Flipping the substrate vertically to turn the optoelectric device facing down and enable the first optical glue to contact the second optical glue;
  • Step S30: Flipping the substrate and the fixture vertically to lower the secondary optical element towards the direction of the optoelectric device;
  • Step S40: Hardening the second optical glue; and
  • Step S50: Removing the fixture.
Please refer to FIG. 4. The fixture 30 used in the present invention includes a positioning hole 32 (this is figure is used for showing the positioning hole of the fixture only). In the step S10, the secondary optical element 20 is inserted in to the positioning hole 32 of the fixture 30. The diameter R1 of the positioning hole 32 is not less than the inner diameter R2 of the lug 22 of the secondary optical element 20. The preferred size is that R1 is slightly greater than R2, so that the secondary optical element 20 will not shake laterally after being inserted into the positioning hole 32 but still be able to slide up and down. The lug 22 of the secondary optical element 20 will be against a surface of the fixture 30.
While positioning the secondary optical element 20 in the step, its bottom surface faces upwards. Thereby, the lug 22 moves downwards naturally and is against a surface of the fixture 30. Besides, the bottom surface 21 is not covered by unhardened second optical glue 36.
Next, in the step S20, the substrate 10 is flipped vertically to make the solar cell 12, which faces upwards originally, face downwards, and to make the first optical glue 14 move downwards to contact the second optical glue 36. Please refer to FIG. 5. The substrate 10 according to the present invention includes at least a mortise 18. The fixture 30 further includes at least a tenon 34. When the substrate 10 is flipped vertically in this step, the tenons 34 joint the mortises 18, respectively, and thus jointing the substrate 10 and the fixture 30. By using the vertical frame 38 of the fixture 30, a space 40 is divided. In addition, the mortises 34 are located on the frame 30 of the fixture 30.
FIG. 6 shows a schematic diagram of the jointed substrate 10 and the fixture 30. Because the first optical glue 14 is hardened, when the first optical glue 14 contacts the second optical glue 36, the shape of the first optical glue 14 will not change. Nonetheless, because the second optical glue 36 is not hardened at this moment, it will be squeezed by the first optical glue 14 and flow along the surface of the first optical glue 14.
In the step S30, the jointed substrate 10 and the fixture 30 are flipped simultaneously so that the lug 22 of the secondary optical element 20 is no longer against one surface of the fixture 30. Instead, the lug 22 can fall naturally. By taking advantage of its own weight, the secondary optical element 20 squeezes the second optical glue 36 and is lowered towards the direction of the solar cell 12. As shown in FIG. 7, the secondary optical element 20 is lowered to the surface of the hardened first optical glue 14. Based on the design of the fixture 30, the secondary optical element 20 is aligned above the solar cell 12. Thereby, in the step S30, the secondary optical element 20 will be positioned above the solar cell 12.
In the step S40, the second optical glue 36 is hardened by high-temperature baking or ultraviolet illumination for fixing the secondary optical element 20 above the solar cell 12. As shown in FIG. 8, the hardened second optical glue 36 integrates with the earlierly-hardened first optical glue 14 and forming a complete optical glue block. Finally, in the step S50, the fixture 30 is removed. FIG. 9 shows a schematic diagram of the packaged the secondary optical element 20 after the fixture 30 is removed. The secondary optical element 20 has the focusing effect of a spherical lens. Thereby, the incident sunlight can be focused by the secondary optical element 20 and concentrated on the surface of the solar cell 12. In other words, together with the Fresnel lens and the secondary optical element 20, the area of the concentrated sunlight spot can be further shrunk in the concentrating solar cell module and thus increasing the angle tolerance of sunlight shift.
To sum up, the present invention discloses a method for packaging secondary optical element. By coating optical glue at two sites and hardening individually as well as using the technical characteristics of flipping the substrate and the fixture, the secondary optical element can fall naturally and be positioned above an optoelectric device such as a solar cell or a light-emitting diode. The package quality of the finished product is excellent with high reliability and mass productivity. Thereby, the method for packaging secondary optical element according to the present invention truly provides practical values.
Accordingly, the present invention conforms to the legal requirements owing to its novelty, nonobviousness, and utility. However, the foregoing description is only embodiments of the present invention, not used to limit the scope and range of the present invention. Those equivalent changes or modifications made according to the shape, structure, feature, or spirit described in the claims of the present invention are included in the appended claims of the present invention.

Claims (14)

The invention claimed is:
1. A method for packaging secondary optical element, packaging a secondary element above an optoelectric device fixed on a substrate and covered by hardened first optical glue, and comprising steps of:
positioning said secondary optical element using a fixture, a bottom surface of said secondary optical element facing up, and the bottom surface covered by hardened second optical glue;
flipping said substrate vertically to turn said optoelectric device facing down and enable said first optical glue to contact said second optical glue;
flipping said substrate and said fixture vertically to lower said secondary optical element towards the direction of said optoelectric device; and
hardening said second optical glue.
2. The method for packaging secondary optical element of claim 1, wherein said optoelectric device is a solar cell or a light-emitting diode.
3. The method for packaging secondary optical element of claim 1, wherein a circuit structure is included between said optoelectric device and said substrate, and said optoelectric device is connected electrically with said circuit structure.
4. The method for packaging secondary optical element of claim 3, wherein said circuit structure includes at least a gold wire.
5. The method for packaging secondary optical element of claim 3, wherein said first optical glue further covers said circuit structure.
6. The method for packaging secondary optical element of claim 1, wherein said substrate includes at least a mortise.
7. The method for packaging secondary optical element of claim 6, wherein said fixture includes at least a tenon jointing said mortise in said step of flipping said substrate vertically to turn said optoelectric device facing down.
8. The method for packaging secondary optical element of claim 6, wherein said tenon is located on a frame of said fixture.
9. The method for packaging secondary optical element of claim 1, and further comprising a step of removing said fixture after said step of hardening said second optical glue.
10. The method for packaging secondary optical element of claim 1, wherein said secondary optical element includes a lug.
11. The method for packaging secondary optical element of claim 10, wherein said secondary optical element is inserted into a positioning hole of said secondary optical element with a diameter not less than the inner diameter of said lug in said step of positioning said secondary optical element using said fixture.
12. The method for packaging secondary optical element of claim 10, wherein said secondary optical element includes an optical region and a non-optical region situated on said lug.
13. The method for packaging secondary optical element of claim 1, wherein said secondary optical element has the characteristics of a spherical lens.
14. The method for packaging secondary optical element of claim 1, wherein said secondary optical element is lowered to the surface of said first optical glue in said step of flipping said substrate and said fixture vertically to lower said secondary optical element towards the direction of said optoelectric device.
US14/451,516 2014-08-05 2014-08-05 Method for packaging secondary optical element Expired - Fee Related US9381726B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/451,516 US9381726B2 (en) 2014-08-05 2014-08-05 Method for packaging secondary optical element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/451,516 US9381726B2 (en) 2014-08-05 2014-08-05 Method for packaging secondary optical element

Publications (2)

Publication Number Publication Date
US20160039190A1 US20160039190A1 (en) 2016-02-11
US9381726B2 true US9381726B2 (en) 2016-07-05

Family

ID=55266750

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/451,516 Expired - Fee Related US9381726B2 (en) 2014-08-05 2014-08-05 Method for packaging secondary optical element

Country Status (1)

Country Link
US (1) US9381726B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016011320B3 (en) * 2016-09-21 2017-08-24 Azur Space Solar Power Gmbh Lens, solar cell unit and joining method for a solar cell unit
CN107180886A (en) * 2017-03-29 2017-09-19 深圳市富友昌科技股份有限公司 Photovoltaic power generation apparatus and wearing electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130146120A1 (en) * 2011-12-09 2013-06-13 Semprius, Inc. High concentration photovoltaic modules and methods of fabricating the same
US20140048128A1 (en) * 2012-08-16 2014-02-20 Semprius, Inc. Surface mountable solar receiver with integrated through substrate interconnect and optical element cradle
US20150179854A1 (en) * 2013-12-19 2015-06-25 Atomic Energy Council - Institute Of Nuclear Energy Research Method of packaging ball lens of solar collector and structure thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130146120A1 (en) * 2011-12-09 2013-06-13 Semprius, Inc. High concentration photovoltaic modules and methods of fabricating the same
US20140048128A1 (en) * 2012-08-16 2014-02-20 Semprius, Inc. Surface mountable solar receiver with integrated through substrate interconnect and optical element cradle
US20150179854A1 (en) * 2013-12-19 2015-06-25 Atomic Energy Council - Institute Of Nuclear Energy Research Method of packaging ball lens of solar collector and structure thereof

Also Published As

Publication number Publication date
US20160039190A1 (en) 2016-02-11

Similar Documents

Publication Publication Date Title
WO2007130796A3 (en) Solar concentrating photovoltaic device with resilient cell package assembly
JP5013684B2 (en) Condensing lens, condensing lens structure, concentrating solar power generation device, and manufacturing method of condensing lens structure
US9381726B2 (en) Method for packaging secondary optical element
Ritou et al. Mechanical tolerances study through simulations and experimental characterization for a 1000X micro-concentrator CPV module
WO2006070425A1 (en) Integrated structural element for concentrating photovoltaic module
JPWO2012160994A1 (en) Concentrating solar cell and manufacturing method thereof
CN109087959B (en) Solar cell packaging structure
CN201623165U (en) Concentrating solar battery module and encapsulating protection device thereof
US20180108797A1 (en) Compound light-concentrating structure
US10090804B2 (en) Concentrator photovoltaic module and the alignment device and method thereof
WO2014037722A1 (en) Concentrated photovoltaic (cpv) cell module with secondary optical element and method of fabrication
WO2014037721A1 (en) Concentrated photovoltaic (cpv) cell arrangement, module and method of fabrication
KR101566854B1 (en) Light Converging Photovoltaic Module and Module Assembly Utilizing the Reflected Light of Slope
KR20130099797A (en) Solar cell with microlens array for condensing lights into the cell
CN201369335Y (en) Photovoltaic cell module
KR20120000592U (en) Cover of panel for focusing of solar cell
CN101820014B (en) Solar cell
TWI540746B (en) The method of packaging the secondary optical element
TWI540745B (en) A method of packaging a solar receiver with secondary optical elements
CN105811870A (en) Spiral fresnel concentrating photovoltaic module
TWI523250B (en) Method and structure of ball lens package for solar receiver
KR20130056110A (en) Solar cell module
CN202877677U (en) Downwards-pressing retaining device for infrared bonding of solar cells
TWI691161B (en) Solar cell module and method for assembling the same
CN211529968U (en) Deep ultraviolet LED device

Legal Events

Date Code Title Description
AS Assignment

Owner name: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERG

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, YUEH-MU;SHIH, ZUN-HAO;LIANG, YI-PING;AND OTHERS;REEL/FRAME:033463/0489

Effective date: 20140804

ZAAA Notice of allowance and fees due

Free format text: ORIGINAL CODE: NOA

ZAAB Notice of allowance mailed

Free format text: ORIGINAL CODE: MN/=.

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20240705