CN101657554A - 钻地钻头中使用的多层金刚石砂粒包膜 - Google Patents

钻地钻头中使用的多层金刚石砂粒包膜 Download PDF

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CN101657554A
CN101657554A CN200880012185A CN200880012185A CN101657554A CN 101657554 A CN101657554 A CN 101657554A CN 200880012185 A CN200880012185 A CN 200880012185A CN 200880012185 A CN200880012185 A CN 200880012185A CN 101657554 A CN101657554 A CN 101657554A
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matrix binder
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E·E·麦克莱恩
D·E·斯科特
W·D·富勒
R·M·韦尔奇
J·W·伊森
M·R·斯基姆
V·J·布拉金
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Abstract

构造钻地孕镶金刚石钻头的方法包括给金刚石砂粒涂覆钨以形成覆钨金刚石颗粒的第一步骤。这些涂覆颗粒随后包覆在由有机生粘结剂材料固定的碳化物粉末层中。包封团粒随后与基体材料混合并放入模型中。基体材料包括基体粘结剂和磨粒。在大气压力下加热模型中的混合物以使基体粘结剂熔化并渗入包封团粒和磨粒。

Description

钻地钻头中使用的多层金刚石砂粒包膜
优先权声明
本申请要求提交于2007年2月23日、名称为″在钻地钻头中使用的多层金刚石砂粒包膜″的美国专利申请序列No.11/678,304的提交日期的优先权。
技术领域
本发明通常涉及钻地钻头,尤其涉及基体孕镶金刚石钻头。
背景技术
一种用于高磨蚀性钻进,例如硬砂岩的钻头称作孕镶金刚石钻头。典型地,这种钻头具有在模型中铸造而成的实心头部或冠部。冠部附接到钢杆上,所述钢杆具有用于附接到钻柱上的螺纹端部。冠部可以具有各种构造并且通常包括在模型中形成的支柱构件或刀翼状构件。用于钻井流体流动的通道将刀翼隔开。
一种制造这种钻头的方法称作高温、长时间渗透工艺。模型构造为钻头冠部的形状。金刚石颗粒或砂粒和基体材料混合并散布在模型中。现有技术工艺中的金刚石颗粒具有钨涂层。在现有技术中给金刚石颗粒涂覆钨的一种方法是化学气相淀积(CVD)方法。基体材料包括粘结剂金属(典型地,铜合金)和硬质磨粒(例如碳化钨)。
基体材料和覆钨金刚石颗粒在模型中加热对基体粘结剂金属来说足够的时间和温度以熔化并渗透到硬质颗粒和金刚石颗粒中。在冷却之后,粘结剂粘结金刚石和硬质磨粒。尽管这种方法和最终的钻头性能良好,但是金刚石颗粒具有聚结在一起的趋势,使金刚石密度在一些区域比其它区域高。在一些情况下,根据需要,金刚石可以彼此接触而非均匀分布。
发明内容
在本发明中,金刚石颗粒首先涂覆有钨以形成涂覆颗粒。该步骤通常由例如CVD工艺完成。随后,包膜层施加到涂覆颗粒上以形成包封团粒。包膜层材料可以是通过滚压方法机械施加的碳化物,例如碳化钨粉末。
包封团粒与基体材料混合并放入模型中。基体材料包括粘结剂金属,还包括硬质磨粒,例如碳化钨。随后,将模型加热到足够高的温度以使粘结剂金属熔化,渗透到包封金刚石团粒周围和其中。粘结剂金属渗透到包膜层的碳化物粉末中以与金刚石晶体上的钨涂层接触。包膜层材料在这个步骤期间不熔化,从而保持金刚石颗粒之间的间隙。加热优选地在大气压力下进行。
附图说明
图1是根据本发明构造的钻地钻头的透视图。
图2是用于孕镶到图1所示钻头冠部中的金刚石颗粒的示意图。
图3是涂覆钨之后的图2所示金刚石颗粒的示意图。
图4是包封在包膜材料中之后的图3所示涂覆金刚石颗粒的示意图。
图5是图1所示钻头冠部的切削结构部分的照相显微照片,显示了散布在基体材料中的图4所示包封团粒。
具体实施方式
参考图1,钻头11通常具有钢杆13,所述钢杆具有形成在其端部上的螺纹15,所述螺纹用于附接到钻柱上。孕镶金刚石冠部17形成在与螺纹15相对的钻杆13的端部上。冠部17可以具有各种构造。通常,冠部17具有形成在其中的多个刀翼19,每个刀翼沿着冠部17的圆柱形侧面延伸并且延伸到底部上的中心喉部区域上方。用于钻井流体和切屑回流的通道21使刀翼19彼此分离。在图1所示实施例中,刀翼19位于冠部17的底部上的部分被分成区段或支柱23。可选地,冠部17可以具有延伸至中心喷口区域的光滑、连续的刀翼19。
参考图2,冠部17的切削结构或刀翼19的材料孕镶有金刚石砂粒或颗粒25。优选地,每个金刚石颗粒25包括具有平坦切削面或侧面的立方体、八面体或立方八面体(cuboctahedral)形式的单晶体。金刚石25可以为天然或人工的,并且可以具有用于冠部17的传统尺寸,典型地为大约25目-35目或其它范围。
参考图3,每个金刚石25随后涂覆有钨以形成钨涂层27。钨涂层27优选地通过传统的化学气相淀积(CVD)工艺形成。钨涂层29是薄层,厚度约为5微米-10微米。
最终的涂覆金刚石颗粒29具有施加于其上的包膜层31,如图4所示。在优选实施例中,通过机械工艺施加包膜层31。包封金刚石的机械工艺众所周知。一种工艺典型地包括使碳化物粉末与有机粘结剂混合,将所述混合物挤压成短小的圆柱形状,其随后轧制成球并干燥。在一个实施例中,包膜层31的材料选自基本上由碳化钨、碳化钛和碳化硅组成的组合。最初,在包膜层31内没有粘结剂来固定碳化物颗粒;相反,细小的碳化物粉末通过生有机粘结剂固定在涂覆金刚石颗粒29周围。碳化物粉末粒远小于金刚石晶体25;例如,碳化物粉末的直径为1到10微米。最终的包封团粒33通常为球形并且具有在施加时可以改变的直径,但是典型地为100微米到1000微米。
包封团粒33随后与基体材料35(图5)混合并且放入成形为限定冠部17(图1)的模型部分中。为了便于将混合物分配到模型中,混合物可以包含粘合剂以便形成包封团粒33和基体材料35的糊剂。基体材料35可以是与形成孕镶金刚石钻头通常所用材料相同类型的材料。基体材料35包括金属粘结剂37,其典型地为铜合金,例如铜镍或铜锰黄铜或铜锰青铜。基体材料35还可以包括硬质磨粒例如碳化钨,即为烧结硬质磨粒、铸造硬质磨粒或粗晶体硬质磨粒。硬质磨粒可以具有各种形状,包括球形和不规则形状。在图5所示实例中,硬质磨粒包括破碎的烧结碳化钨团粒39以及球形铸造碳化钨团粒41。在本实例中,球形团粒41大于破碎的团粒39。磨粒可以具有许多变形。基体材料35中的硬质磨粒相对于包封金刚石团粒33的百分比可以根据应用而改变。
通常,包封金刚石团粒33只放置在模型的切削结构部分上,该部分是限定刀翼19(图1)的部分。模型中与冠部17的剩余部分(图1)相对应的部分只包含基体材料35。在一些应用中,与包封金刚石团粒33相混合的基体材料可不同于形成冠部17(图1)的非切削结构部分的基体材料。例如,金刚石25(图2)的密度可以足够大,使得与其混合的基体材料不需要任何附加的磨粒,例如碳化钨。在这种情况下,与包封金刚石团粒33混合的基体材料只具有基体粘结剂金属37。用于冠部17的非切削结构部分的基体材料具有基体粘结剂金属37和硬研磨颗粒,例如,碳化物团粒37、39。
模型可以具有固定装置,所述固定装置将钻头钻杆13(图1)固定成与基体材料35接触。模型连同钻杆13、基体材料35和包封金刚石团粒33一起放置到熔炉中,模型在所述熔炉中在大气压力下加热。选择时间和温度以使基体粘结剂37熔化并围绕包封团粒33和硬质磨粒39和41向下流动。粘结剂金属37渗透到包膜层31(图4)中并与钨涂层27接触,所述钨涂层防止粘结剂与金刚石晶体25接触。即使粘结剂金属37渗入包膜层31中,每个包封金刚石团粒33的总体形状也保持大体上相同。原本用于固定包膜层31的碳化物粉末和用于形成糊剂的任何粘合剂的生粘结剂将扩散。温度典型地为大约1800°F到2100°F。导致彻底渗入所需时间可以改变,但是为大约1.5到3小时。
随后,在冷却之后,冠部17(图1)将粘结到钻杆13上,刀翼19以放大方式显示,如图5所示。渗入包膜层31(图4)中的粘结剂金属37起到粘结剂作用,用于将包膜层31的碳化物粉末粘结到金刚石晶体25周围。粘结剂金属37还粘结包封团粒33和切削结构中的磨粒(如果使用的话)。包封团粒33保持分离,如图5所示,在其加热之前具有大体上相同的尺寸和形状。包封团粒33提供单个金刚石晶体25(图4)之间的希望间隙或间隔。钨涂层27避免基体粘结剂37与金刚石晶体25直接接触。
在操作期间,当钻头11旋转时,刀翼19与地层接合以磨掉地层而形成钻孔。基体材料35将磨损,最终使一部分包封金刚石团粒33松动并与冠部17脱离。然而,这种磨损过程使连续钻进表面之下的其它包封团粒33露出。
包封金刚石砂粒53可以根据添加包封材料的多少加工成各种直径。包膜层31的厚度决定最终孕镶材料中的金刚石体积或浓度百分比。包膜层31越薄,产品中的金刚石浓度越高,反之亦然,即使金刚石晶体25具有大致相同的尺寸。可以在同一产品中使用不同直径的包封团粒33的等级或层。例如,钻头11的冠部17在其轮廓范围内或者沿径向方向可以具有不同的金刚石浓度。通过提供不同直径的包封团粒33,刀翼19中的金刚石浓度可以改变,例如,从刀翼前部到后部。
本发明具有显著的优点。给金刚石涂覆多层(其中一层为保护钨层,另一层为间隙层)提供了用于形成孕镶金刚石钻头结构的有效手段。包膜层提供了希望的间隙,同时,钨层通过基体材料中的粘结剂防止对金刚石晶体的冲击。本发明提供了改进的金刚石砂粒分布,具有更大、更一致的平均自由路径。在孕镶区段上很少发生局部球化。金刚石砂粒具有增强的保持力,因为CVD工艺之后的长时间过滤工艺提高了粘结力。耐磨性可以定制或改进以适应特定应用。包膜层和钨涂层还可以防止热损伤。可以通过改变包膜层的厚度来改变钻头切削结构的延展性和耐磨性。
尽管只描述了本发明的一种形式,对本领域技术人员显而易见的是,本发明不限于此,在不脱离本发明范围的情况下可以进行各种改变。

Claims (18)

1.一种构造钻地孕镶金刚石切削结构的方法,包括:
(a)给金刚石颗粒涂覆钨,形成涂覆颗粒;
(b)给每个涂覆颗粒施加包膜层,形成包封团粒;
(c)将包封团粒和基体粘结剂材料放置在成形为界定切削结构的模型中;随后
(d)在大气压力下加热模型中的包封团粒和基体粘结剂材料一定时间和温度以使基体粘结剂材料在包封团粒周围熔化和渗透;随后
(e)冷却基体粘结剂材料和包封团粒,使基体粘结剂材料凝固并粘结包封团粒。
2.如权利要求1所述的方法,其中,通过化学气相淀积工艺执行步骤(a)。
3.如权利要求1所述的方法,其中,通过将由包膜层和有机生粘结剂材料组成的粉末机械附着到涂覆颗粒上执行步骤(b),所述生粘结剂在步骤(d)期间扩散。
4.如权利要求1所述的方法,其中,步骤(c)还包括将模型中的硬研磨基体颗粒与包封团粒和基体粘结剂材料混合。
5.如权利要求1所述的方法,其中,步骤(c)的基体粘结剂材料包括铜合金。
6.如权利要求1所述的方法,其中,步骤(b)包括将碳化物粉末粘附到每个涂覆颗粒周围。
7.如权利要求6所述的方法,其中,基体粘结剂材料在步骤(d)中渗透到包膜层中,并且当在步骤(e)中凝固时,将碳化物粉末粘结到涂覆颗粒周围。
8.如权利要求1所述的方法,其中,基体粘结剂材料在步骤(d)中渗透到包膜层中,但是通过钨涂层防止与金刚石颗粒接触。
9.一种构造钻地孕镶金刚石钻头的方法,包括:
(a)给金刚石颗粒涂覆钨,形成涂覆颗粒;
(b)用由有机生粘结剂材料保持的碳化物粉末包膜层机械包围每个涂覆颗粒,形成包封团粒;
(c)将包封团粒、基体粘结剂材料和磨粒放置在成形为界定钻头冠部的模型中;随后
(d)在大气压力下加热模型中的包封团粒、基体粘结剂材料和磨粒一定时间和温度以使基体粘结剂材料扩散生粘结剂材料并且熔化和渗透到包封团粒包膜层中和磨粒周围;随后
(e)冷却基体粘结剂材料、包封团粒和磨粒。
10.如权利要求9所述的方法,其中,通过化学气相淀积工艺执行步骤(a)。
11.如权利要求9所述的方法,其中,步骤(c)的基体粘结剂材料包括铜合金。
12.如权利要求9所述的方法,其中,包膜层的碳化物粉末包括选自基本上包含碳化钨、碳化钛和碳化硅的组合的材料。
13.如权利要求9所述的方法,其中,步骤(c)的磨粒包括碳化钨颗粒。
14.如权利要求9所述的方法,其中,包膜层在步骤(d)之后保持不连续。
15.钻头的钻地孕镶金刚石冠部,包括:基体粘结剂材料;和包埋在基体粘结剂材料中的金刚石颗粒,每个金刚石颗粒具有钨涂层和围绕所述钨涂层的包膜层。
16.如权利要求15所述的结构,其中,基体粘结剂材料包括铜合金。
17.如权利要求15所述的结构,其中,包膜层选自基本上由碳化钨、碳化钛和碳化硅构成的组合。
18.如权利要求15所述的结构,还包括包埋在基体粘结剂材料中的碳化钨颗粒。
CN200880012185A 2007-02-23 2008-02-21 钻地钻头中使用的多层金刚石砂粒包膜 Pending CN101657554A (zh)

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