CN101653884A - High-temperature brazing filler metal - Google Patents
High-temperature brazing filler metal Download PDFInfo
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- CN101653884A CN101653884A CN200910304354A CN200910304354A CN101653884A CN 101653884 A CN101653884 A CN 101653884A CN 200910304354 A CN200910304354 A CN 200910304354A CN 200910304354 A CN200910304354 A CN 200910304354A CN 101653884 A CN101653884 A CN 101653884A
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Abstract
The invention discloses a high-temperature brazing filler metal, relating to a brazing filler metal. The invention solves the problem that joints obtained by using the prior brazing filler composite material have low shearing strength. The brazing filler metal comprises Ti or TiH2, Ni and Nb. When the high-temperature brazing filler material is used to braze C/SiC composite material and the brazing joint of the C/SiC composite material, room temperature three-point bending strength reaches 50MPa-71MPa, and the room temperature shearing strength of the brazing joint of the C/SiC composite material and metal reaches 90MPa-180MPa, moreover, the retention rate of the 800 DEG C high-temperature shearing strength of the brazing joint is more than 69% and the retention rate of the 800 DEG C high-temperature shearing strength is more than 42%. When the high-temperature brazing filler material is used to braze black lead and the joint of Nb, the room temperature shearing strength reaches 30MPa-60MPa.
Description
Technical field
The present invention relates to a kind of solder.
Background technology
The chemism of composite is low, conventional solder is difficult to wetting its surface, it is that active solder carries out active soldering to C/SiC composite and Ti alloy that existing method adopts Ag-Cu-Ti, the joint room temperature shearing strength of C/SiC composite after the gained soldering and Ti alloy is 84MPa～160MPa, 500 ℃ joint shearing strength is 51MPa～104MPa, the joint serviceability temperature that the method obtains is below 500 ℃, and Ag-Cu-Ti is that the serviceability temperature of active solder is 400 ℃～500 ℃.
Summary of the invention
Technical problem to be solved by this invention is to adopt the existing low problem of solder brazing composite gained joint shearing strength in order to solve, and a kind of high-temp solder is provided.
High-temp solder of the present invention is by mass percentage by 20%～60%Ti and TiH
2In a kind of, 30%～70%Ni and the Nb of surplus form; Wherein Ti or TiH
2Purity 〉=99.0%, the purity of Ni 〉=99.0%, the purity of Nb 〉=99.0%.
The room temperature three-point bending strength of using the soldered fitting of high-temp solder soldering C/SiC composite of the present invention and C/SiC composite is 50MPa～71MPa, the soldered fitting room temperature shearing strength of C/SiC composite and metal is 90MPa～180MPa, and 800 ℃ of high temperature shearing strength retention rates of soldered fitting are greater than 69%, 1000 ℃ high temperature shearing strength retention rate is greater than 42%, and the joint room temperature shearing strength of using high-temp solder soldering graphite of the present invention and Nb is 30MPa～68MPa.
The specific embodiment
Technical solution of the present invention is not limited to the following cited specific embodiment, also comprises any combination between each specific embodiment.
The specific embodiment one: high-temp solder is made up of the Nb of 20%～60%Ti, 30%～70%Ni and surplus by mass percentage in the present embodiment; The purity of Ti 〉=99.0% (quality) wherein, the purity of Ni 〉=99.0% (quality), pure 〉=99.0% (quality) of Nb.
The preparation method of high-temp solder is as follows in the present embodiment: one, the mixture of by mass percentage Nb of 20%～60%Ti, 30%～70%Ni and surplus being formed joins in the graphite crucible, is 1 * 10 at 1200 ℃～1400 ℃, vacuum then
-3Pa～5 * 10
-3To mixture vacuum melting 10min～120min, obtain alloy pig under the condition of Pa; Be that 0.04MPa～0.08MPa, melting current density are 150A/cm perhaps at argon pressure
2～250A/cm
2Condition under mixture is carried out electric arc melting in water jacketed copper crucible, and then carry out 0～5 remelting, obtain alloy pig; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.01mm～2mm, again foil surfaces carried out machine glazed finish, to the surface roughness of paillon foil be 6.4～12.5; Perhaps the alloy pig that step 1 the is obtained single roller of high vacuum of packing into gets rid of in the quartz glass tube of band machine, under 1200 ℃～1600 ℃ conditions, alloy pig is melted fully then, obtain alloy liquid, then in the volumetric concentration of argon gas greater than 99%, argon pressure is 0.01MPa～0.2MPa, nozzle to the distance of roll surface is that under the condition of 0.5mm～5mm alloy liquid to be adopted the nozzle gap width be that to be ejected into diameter be 450mm for the quartz ampoule of 3mm～5mm, the linear velocity of running roller is the copper roller surface of 1m/s～100m/s, obtain the paillon foil that thickness is 0.01mm～2mm, again foil surfaces is carried out machine glazed finish, surface roughness to paillon foil is 6.4～12.5, promptly gets high-temp solder.
High-temp solder in the present embodiment also can not carry out melting, directly adopts purity to satisfy the direct compound use of Ti paillon foil, Ni paillon foil and Nb paillon foil of above-mentioned requirements.
Method with the high-temp solder soldering in the present embodiment is as follows: mother metal, high-temp solder and the material to be connected that will remove surface and oil contaminant and oxide, order according to mother metal/high-temp solder/material to be connected is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa～1 * 10
-3Pa, programming rate with 2 ℃/min～100 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1050 ℃～1350 ℃ again, keep temperature 1min～120min of 1050 ℃～1350 ℃ then, cooling rate with 1 ℃/min～100 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to room temperature again, promptly finishes welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 100%～120%; Described mother metal is C/SiC composite, graphite, SiC pottery or C/C composite; Described material to be connected is Nb, TC4, Ti-50Al (atomic percent) alloy, Zr-2.5Nb alloy, GH3128 or C-103 niobium alloy.
The room temperature three-point bending strength of the soldered fitting of present embodiment gained C/SiC composite and C/SiC composite is 50MPa～71MPa, the soldered fitting room temperature shearing strength of C/SiC composite and metal is 90MPa～180MPa, and 800 ℃ of high temperature shearing strength retention rates of soldered fitting are greater than 69%, 1000 ℃ high temperature shearing strength retention rate is greater than 42%, and the joint room temperature shearing strength of graphite that present embodiment obtains and Nb is 30MPa～68MPa.
Used electric spark linear cutting machine is commercially available electric spark linear cutting machine in the present embodiment, to get rid of the band machine be that the single roller of HVDS-II high vacuum that Shenyang section of Chinese Academy of Sciences instrument is developed gets rid of the band machine to the single roller of used high vacuum in the present embodiment, and used vacuum hotpressing stove is the Centorr 6-1650-15T vacuum hotpressing stove that U.S. vacuum industry company produces in the present embodiment.
The specific embodiment two: what present embodiment and the specific embodiment one were different is that high-temp solder is made up of the Nb of 25%～55%Ti, 35%～65%Ni and surplus by mass percentage.Other is identical with the specific embodiment one.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 95MPa～170MPa.
The specific embodiment three: what present embodiment and the specific embodiment one were different is that high-temp solder is made up of the Nb of 30%～50%Ti, 40%～60%Ni and surplus by mass percentage.Other is identical with the specific embodiment one.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 92MPa～173MPa.
The specific embodiment four: what present embodiment and the specific embodiment one were different is that high-temp solder is made up of the Nb of 35%～45%Ti, 45%～55%Ni and surplus by mass percentage.Other is identical with the specific embodiment one.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 100MPa～150MPa.
The specific embodiment five: what present embodiment and the specific embodiment one were different is that high-temp solder is made up of the Nb of 40%Ti, 50%Ni and surplus by mass percentage.Other is identical with the specific embodiment one.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 100MPa～160MPa.
The specific embodiment six: high-temp solder is by mass percentage by 20%～60%TiH in the present embodiment
2, 30%～70%Ni and surplus Nb form; TiH wherein
2Purity 〉=99.0% (quality), the purity of Ni 〉=99.0% (quality), the purity of Nb 〉=99.0% (quality).
The preparation method of high-temp solder is as follows in the present embodiment: one, by mass percentage with 20%～60%TiH
2, the mixture formed of the Nb of 30%～70%Ni and surplus joins in the graphite crucible, is 1 * 10 at 1200 ℃～1400 ℃, vacuum then
-3Pa～5 * 10
-3To mixture vacuum melting 10min～120min, obtain alloy pig under the condition of Pa; Be that 0.04MPa～0.08MPa, melting current density are 150A/cm perhaps at argon pressure
2～250A/cm
2Condition under mixture is carried out electric arc melting in water jacketed copper crucible, and then carry out 0～5 remelting, obtain alloy pig; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.01mm～2mm, again foil surfaces carried out machine glazed finish, to the surface roughness of paillon foil be 6.4～12.5; Perhaps the alloy pig that step 1 the is obtained single roller of high vacuum of packing into gets rid of in the quartz glass tube of band machine, under 1200 ℃～1600 ℃ conditions, alloy pig is melted fully then, obtain alloy liquid, then in the volumetric concentration of argon gas greater than 99%, argon pressure is 0.01MPa～0.2MPa, nozzle to the distance of roll surface is that under the condition of 0.5mm～5mm alloy liquid to be adopted the nozzle gap width be that to be ejected into diameter be 450mm for the quartz ampoule of 3mm～5mm, the linear velocity of running roller is the copper roller surface of 1m/s～100m/s, obtain the paillon foil that thickness is 0.01mm～2mm, again foil surfaces is carried out machine glazed finish, surface roughness to paillon foil is 6.4～12.5, promptly gets high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: mother metal, high-temp solder and the material to be connected that will remove surface and oil contaminant and oxide, order according to mother metal/high-temp solder/material to be connected is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa～1 * 10
-3Pa, programming rate with 2 ℃/min～100 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1050 ℃～1350 ℃ again, keep temperature 1min～120min of 1050 ℃～1350 ℃ then, cooling rate with 1 ℃/min～100 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to room temperature again, promptly finishes welded welding; Wherein the area of solder paillon foil be material to be connected be connected the face area 100%～120%; Described mother metal is C/SiC composite, graphite, SiC pottery or C/C composite; Described material to be connected is Nb, TC4, Ti-50at.%Al (atomic percent) alloy, Zr-2.5Nb alloy, 6H3128 or C-103 niobium alloy.
The room temperature three-point bending strength of the soldered fitting of present embodiment gained C/SiC composite and C/SiC composite is 50MPa～71MPa, the soldered fitting room temperature shearing strength of C/SiC composite and metal reaches 90MPa～180MPa, and 800 ℃ of high temperature shearing strength retention rates of soldered fitting are greater than 69%, 1000 ℃ high temperature shearing strength retention rate is greater than 42%, and the joint room temperature shearing strength of graphite that present embodiment obtains and Nb is 30MPa～68MPa.
Used electric spark linear cutting machine is commercially available electric spark linear cutting machine in the present embodiment, to get rid of the band machine be that the single roller of HVDS-II high vacuum that Shenyang section of Chinese Academy of Sciences instrument is developed gets rid of the band machine to the single roller of used high vacuum in the present embodiment, and used vacuum hotpressing stove is the Centorr 6-1650-15T vacuum hotpressing stove that U.S. vacuum industry company produces in the present embodiment.
The specific embodiment seven: what present embodiment and the specific embodiment six were different is that high-temp solder is by mass percentage by 25%～55%TiH
2, 35%～65%Ni and surplus Nb form.Other is identical with the specific embodiment six.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 98MPa～156MPa.
The specific embodiment eight: what present embodiment and the specific embodiment six were different is that high-temp solder is by mass percentage by 30%～50%TiH
2, 40%～60%Ni and surplus Nb form.Other is identical with the specific embodiment six.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 102MPa～166MPa.
The specific embodiment nine: what present embodiment and the specific embodiment six were different is that high-temp solder is by mass percentage by 35%～45%TiH
2, 45%～55%Ni and surplus Nb form.Other is identical with the specific embodiment six.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 130MPa～172MPa.
The specific embodiment ten: what present embodiment and the specific embodiment six were different is that high-temp solder is by mass percentage by 40%TiH
2, 50%Ni and surplus Nb form.Other is identical with the specific embodiment six.
After tested, adopt the high-temp solder soldering of present embodiment gained, the room temperature shearing strength of the welding point of gained is 140MPa～180MPa.
The specific embodiment 11: high-temp solder is made by the Nb of 35%Ti, 38%Ni and surplus by mass percentage in the present embodiment.
The preparation method of high-temp solder is as follows: one, the mixture of by mass percentage Nb of 35%Ti, 38%Ni and surplus being formed joins in the graphite crucible, is 1 * 10 at 1300 ℃, vacuum then
-3To mixture vacuum melting 10min, obtain alloy pig under the condition of Pa; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.01mm, again foil surfaces carried out machine glazed finish, to the surface roughness of paillon foil be 6.4, promptly get high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: C/SiC composite, high-temp solder and the Nb that will remove surface and oil contaminant and oxide, order according to C/SiC composite/high-temp solder/Nb is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa, the programming rate with 2 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1240 ℃ again, keeps 1240 ℃ temperature 10min then, and the cooling rate with 1 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to room temperature again, promptly finishes welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 100%.
After tested, the room temperature shearing strength of present embodiment gained C/SiC composite and Nb joint reaches 158MPa, and the shearing strength in the time of 800 ℃ reaches 110MPa, and the shearing strength in the time of 1000 ℃ reaches 72MPa.
The specific embodiment 12: high-temp solder is made by the Nb of 28%～35%Ti, 36%～42%Ni and surplus by mass percentage in the present embodiment.
The preparation method of high-temp solder is as follows: one, the mixture of by mass percentage Nb of 28%～35%Ti, 36%～42%Ni and surplus being formed joins in the water jacketed copper crucible, is that 0.04MPa～0.08MPa, melting current density are 150A/cm at argon pressure then
2～250A/cm
2Condition under mixture is carried out melting, and then carry out 0～5 remelting, obtain alloy pig; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.4mm, again foil surfaces used the 600# sand papering, to the surface roughness of paillon foil be 6.4, promptly get high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: C/SiC composite, high-temp solder and the C-103 that will remove surface and oil contaminant and oxide, order according to C/SiC composite/high-temp solder/C-103 is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa, programming rate with 5 ℃/min～40 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1100 ℃～1320 ℃ again, keep temperature 5min～70min of 1100 ℃～1320 ℃ then, cooling rate with 3 ℃/min～50 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to 100 ℃～600 ℃ again, cool to room temperature then with the furnace, promptly finish welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 120%.
After tested, the joint room temperature shearing strength of the C/SiC composite of present embodiment gained and C-103 is up to 100MPa～150MPa, and the shearing strength in the time of 800 ℃ is 105MPa～128MPa, and the shearing strength in the time of 1000 ℃ is up to 72MPa～80MPa.
The specific embodiment 13: high-temp solder is that the thickness of the Ti paper tinsel of 0.02mm～0.15mm, Ni paper tinsel that 38%～48% thickness is 0.02mm～0.15mm and surplus is that the Nb paper tinsel of 0.02mm～0.15mm is made by 30%～36% thickness by mass percentage in the present embodiment.
The preparation method of high-temp solder is as follows in the present embodiment: be that the Ti paper tinsel of 0.02mm～0.15mm, Ni paper tinsel that 38%～48% thickness is 0.02mm～0.15mm and the thickness of surplus are the Nb paper tinsel of 0.02mm～0.15mm by mass percentage with 30%～36% thickness, carry out lamination and form composite insulating foil, wherein the Ti paper tinsel contacts Ni paper tinsel and Nb paper tinsel simultaneously, the Ni paper tinsel does not directly contact with the Nb paper tinsel, composite insulating foil is cut off into required size with scissors, both got the composite foil high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: C/SiC composite, composite foil high-temp solder and the Nb that will remove surface and oil contaminant and oxide, order according to C/SiC composite/composite foil high-temp solder/Nb is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa～1 * 10
-3Pa, programming rate with 5 ℃/min～50 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1060 ℃～1280 ℃ again, keep temperature 1min～60min of 1060 ℃～1280 ℃ then, cooling rate with 2 ℃/min～50 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to room temperature again, promptly finishes welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 100%～120%.
After tested, the room temperature shearing strength of C/SiC composite and Nb joint is 150MPa～180MPa, and the shearing strength in the time of 800 ℃ is 110MPa～128MPa, and the shearing strength in the time of 1000 ℃ is 70MPa～82MPa.
The specific embodiment 14: high-temp solder is made the Nb of 28%～35%Ti, 36%～42%Ni and surplus by mass percentage in the present embodiment.
The preparation method of high-temp solder is as follows in the present embodiment: one, the mixture of by mass percentage Nb of 28%～35%Ti, 36%～42%Ni and surplus being formed joins in the water jacketed copper crucible, is that 0.04MPa～0.08MPa, melting current density are 150A/cm at argon pressure then
2～250A/cm
2Condition under mixture is carried out melting, and then carry out 0～5 remelting, obtain alloy pig; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.4mm, again foil surfaces used the 600# sand papering, to the surface roughness of paillon foil be 6.4, promptly get high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: the graphite, high-temp solder and the Nb that remove surface and oil contaminant and oxide, order according to graphite/high-temp solder/Nb is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa, programming rate with 35 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1200 ℃ again, keeps 1200 ℃ temperature 60min then, and the cooling rate with 50 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to 300 ℃ again, cool to room temperature then with the furnace, promptly finish welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 120%.
After tested, the joint room temperature shearing strength of the graphite of present embodiment gained and Nb is 30MPa～68MPa.
The specific embodiment 15: high-temp solder is made 25%～35% Ti, 28%～37% Ni and the Nb of surplus by mass percentage in the present embodiment.
The preparation method of high-temp solder is as follows in the present embodiment: one, the mixture of by mass percentage Nb of 25%～35% Ti, 28%～37% Ni and surplus being formed joins in the water jacketed copper crucible, is that 0.06MPa, melting current density are 180A/cm at argon pressure then
2Condition under mixture is carried out melting, and then carry out 0～5 remelting, obtain alloy pig; Two, adopt electric spark linear cutting machine that alloy pig is cut into the paillon foil that thickness is 0.6mm～0.8mm, again foil surfaces used the 600# sand papering, to the surface roughness of paillon foil be 6.4, promptly get high-temp solder.
Method with the high-temp solder soldering in the present embodiment is as follows: C/SiC composite, high-temp solder and the C/SiC composite that will remove surface and oil contaminant and oxide, order according to C/SiC composite/high-temp solder/C/SiC composite is formed Welding Structure, again Welding Structure is put into vacuum hotpressing stove, being evacuated to vacuum is 1 * 10
-4Pa, programming rate with 20 ℃/min makes the temperature in the vacuum hotpressing stove rise to 1300 ℃ again, keeps 1300 ℃ temperature 45min then, and the cooling rate with 20 ℃/min makes the temperature in the vacuum hotpressing stove be cooled to 400 ℃ again, cool to room temperature then with the furnace, promptly finish welded welding; Wherein the area of high-temp solder be material to be connected be connected the face area 100%.
The soldered fitting room temperature three-point bending strength of the C/SiC composite of present embodiment gained and C/SiC composite is 50MPa～71MPa after tested.
Claims (10)
1. high-temp solder is characterized in that high-temp solder is made up of the Nb of 20%～60%Ti, 30%～70%Ni and surplus by mass percentage; The purity of Ti 〉=99.0% (quality) wherein, the purity of Ni 〉=99.0% (quality), the purity of Nb 〉=99.0% (quality).
2. high-temp solder according to claim 1 is characterized in that high-temp solder is made up of the Nb of 25%～55%Ti, 35%～65%Ni and surplus by mass percentage.
3. high-temp solder according to claim 1 is characterized in that high-temp solder is made up of the Nb of 30%～50%Ti, 40%～60%Ni and surplus by mass percentage.
4. high-temp solder according to claim 1 is characterized in that high-temp solder is made up of the Nb of 35%～45%Ti, 45%～55%Ni and surplus by mass percentage.
5. high-temp solder according to claim 1 is characterized in that high-temp solder is made up of the Nb of 40%Ti, 50%Ni and surplus by mass percentage.
6. high-temp solder is characterized in that high-temp solder is made up of the Nb of 20%～60%TiH2,30%～70%Ni and surplus by mass percentage; The purity of TiH2 〉=99.0% (quality) wherein, the purity of Ni 〉=99.0% (quality), the purity of Nb 〉=99.0% (quality).
7. high-temp solder according to claim 6 is characterized in that high-temp solder is made up of the Nb of 25%～55%TiH2,35%～65%Ni and surplus by mass percentage.
8. high-temp solder according to claim 6 is characterized in that high-temp solder is made up of the Nb of 30%～50%TiH2,40%～60%Ni and surplus by mass percentage.
9. high-temp solder according to claim 6 is characterized in that high-temp solder is made up of the Nb of 35%～45%TiH2,45%～55%Ni and surplus by mass percentage.
10. high-temp solder according to claim 6 is characterized in that high-temp solder is made up of the Nb of 40%TiH2,50%Ni and surplus by mass percentage.
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| US4957236A (en) * | 1988-06-17 | 1990-09-18 | Gte Products Corporation | Method of brazing parts of Ti-Al-Nb alloy |
| US4883640A (en) * | 1988-06-17 | 1989-11-28 | Gte Products Corporation | Titanium-niobium-nickel brazing alloy |
| CN100584801C (en) * | 2008-03-19 | 2010-01-27 | 哈尔滨工业大学 | Braze welding method of composite powder used for carbon/silicon carbide and niobium or niobium alloy |
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