CN101644891B - Positively photosensitive insulating resin composition and cured object obtained therefrom - Google Patents
Positively photosensitive insulating resin composition and cured object obtained therefrom Download PDFInfo
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- CN101644891B CN101644891B CN2009101659142A CN200910165914A CN101644891B CN 101644891 B CN101644891 B CN 101644891B CN 2009101659142 A CN2009101659142 A CN 2009101659142A CN 200910165914 A CN200910165914 A CN 200910165914A CN 101644891 B CN101644891 B CN 101644891B
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Abstract
The positively photosensitive insulating resin composition at least includes an alkali soluble resin (A) having a phenolic hydroxyl group, a compound (B) having a quinone diazide group, crosslinked fine particles (C), a compound (C) having at least two alkyletherified amino groups in the molecule, and a solvent (F). the positive photosensitive insulating resin composition has excellent resolution, electric insulating property and thermal shock resistance. The cured product of the invention is obtained by curing the above positive photosensitive insulating resin composition and has preferable adhesion property.
Description
The application is that international application no is PCT/JP 03/00260; International filing date be the PCT international application on January 15th, 2003 get into China national after the stage application number be 03800281.7, denomination of invention is divided an application for the application for a patent for invention of " positive photosensitive insulating resin composition and cured product thereof ".
Technical field
The present invention relates to eurymeric (positive) photosensitive insulating resin composition that is used for producing interlayer insulation film (passivating film), surface protection film (diaphragm) or is used for the products such as insulation film of high-density installation plate.More specifically, the present invention relates to solidify the positive photosensitive insulating resin composition of the product that obtains splendid electrical insulation capability, heat shocks performance and bond properties as the resist that the tunica propria of fine resolution is arranged; The present invention also relates to the cured product that obtains from said composition.
Technical background
There is the polyimide resin of splendid thermotolerance and mechanical property to be widely used in the production of interlayer insulation film and surface protection film of semiconductor element of electronic equipment.In order to improve productive rate and the precision that forms said film, carried out many researchs to give polyimide resin good photonasty, that is to say the photosensitive polyimide resin.For example, the existing practical application of negative-type photosensitive polyimide resin.Said negative-type photosensitive polyimide resin prepares through in polyimide precursor, introducing photocrosslinkable group through ester bond or ionic link.About the positive type photosensitive polyimide resin, in JP-A-5 (1993)-5996 and JP-A-2000-98601, disclosed the composition that comprises polyimide precursor and o-quinone two triazo-compounds.But negative electricity type photosensitive polyimide resin has problem on resolution and film forming, on the thermotolerance of positive type photosensitive polyimide resin, electrical insulation capability and the cohesive to substrate problem is arranged.Although there are other many patented claims this area, those patented claims are not met the satisfactory solution that is tending towards high integration, the requirement of little thickness semiconductor element.In addition, these resin combinations also have shortcoming, and for example curing causes thickness to reduce (volumetric contraction) and comprises multistage baking and environment control.Because these problems, existing people points out that it is disadvantageous that these resin combinations are used for commercial production.
Summary of the invention
The object of the invention is to solve foregoing problems of the prior art.Therefore, the purpose of this invention is to provide has fine resolution, can solidify and obtain splendid performance, like the positive photosensitive insulating resin composition of the product of electrical insulating property, heat shocks property and bond properties.Said cured product is suitable to be applied in the parts such as interlayer insulation film, surface protection film of semiconductor element.
Another object of the present invention is to provide by above-mentioned composition solidifies the cured product that obtains.
The present inventor conscientiously studies to address the above problem.The result has found to have the positive photosensitive insulating resin composition of splendid performance.
First kind of positive photosensitive insulating resin composition of the present invention comprises:
(A) alkali soluble resins of phenolic hydroxy group,
(B) contain the compound of quinone diazido,
(C) crosslinked fine grained,
(D) per molecule contain at least two alkyl etherificates amino compound and
(F) solvent.
Said first kind of resin combination has the resin (A) of phenolic hydroxyl group in 100 weight portion alkali solubilities, should contain following material:
The 10-50 weight portion contain quinone diazido compound (B),
The crosslinked fine grained (C) of 1-50 weight portion and
The per molecule of 1-100 weight portion contains the compound (D) of the amino of two alkyl etherificates at least.
Second kind of positive photosensitive insulating resin composition of the present invention comprises:
(A) alkali soluble resins of phenolic hydroxy group,
(B) contain the compound of quinone diazido,
(C) crosslinked fine grained,
(D) per molecule contains the compound of the amino of two alkyl etherificates at least,
(E) hot acid agent and
(F) solvent.
Said second kind of resin combination has the resin (A) of phenolic hydroxyl group in 100 weight portion alkali solubilities, should contain following material:
The 10-50 weight portion contain quinone diazido compound (B),
The crosslinked fine grained (C) of 1-50 weight portion,
The per molecule of 1-100 weight portion contain at least the amino of two alkyl etherificates compound (D) and
0.1-10 the hot acid agent (E) of weight portion.
In these resin combinations, the mean grain size of crosslinked fine grained (C) is preferably at 30-50nm.
Cured product of the present invention can obtain through solidifying these positive photosensitive insulating resin compositions.
Description of drawings
Fig. 1 is the sectional view that is used to test the assess sample of heat shocks performance.
Fig. 2 is the vertical view of assess sample shown in Figure 1.
In these figure:
1 estimates substrate
2 substrates
3 Copper Foils
Embodiment
Hereinafter will be described in detail said positive photosensitive insulating resin composition and cured product thereof.
< positive photosensitive insulating resin composition >
First kind of resin combination comprises:
(A) alkali soluble resins of phenolic hydroxy group,
(B) contain the compound of quinone diazido,
(C) crosslinked fine grained,
(D) per molecule contain at least two alkyl etherificates amino compound and
(F) solvent.
Second kind of resin combination comprises:
(A) alkali soluble resins of phenolic hydroxy group,
(B) contain the compound of quinone diazido,
(C) crosslinked fine grained,
(D) per molecule contains the compound of the amino of two alkylether radicalsization at least,
(E) hot acid agent and
(F) solvent.
These compositions can randomly comprise another kind of adjuvant, for example epoxy compound, bonding agent and equal paint.
(A) alkali soluble resins of phenolic hydroxy group
The alkali soluble resins (A) (hereinafter being called " phenolics (A) ") of the phenolic hydroxy group that the present invention uses is preferably novolac resin but is not limited to novolac resin.Said novolac resin can obtain through condensation phenol and aldehyde in the presence of catalyzer.
The phenol that can adopt comprises phenol, orthoresol, metacresol, paracresol, o-ethyl phenol, m-ethylphenol, paraethyl phenol, adjacent butylphenol, a butylphenol, p-butylphenol, 2,3-xylenols, 2,4-xylenols, 2,5-xylenols, 2; 6-xylenols, 3,4-xylenols, 3,5-xylenols, 2,3; 5-pseudocuminol, 3,4,5-pseudocuminol, catechol, resorcinol, 1; 2,3-benzenetriol, alpha-Naphthol and betanaphthol.
Exemplary aldehydes comprises formaldehyde, paraformaldehyde, acetaldehyde and benzaldehyde.The object lesson of said novolac resin comprises phenol/formaldehyde condensation novolac resin, cresol/formaldehyde condensation novolac resin and phenol-naphthols/formaldehyde condensation novolac resin.
Except novolac resin, said phenolics (A) comprises polyhydroxy styrene and multipolymer, phenol/xylyleneglycol condensation resin, cresols/xylyleneglycol condensation resin and phenol/bicyclopentadiene condensation resin.
Among the present invention, except above-mentioned phenolics (A), low-molecular-weight phenolic compounds (hereinafter being called " phenolic compounds (a) ") ability and above-mentioned phenolics (A) use together.Exemplary phenolic compounds (a) comprises 4,4-dihydroxy diphenyl methane, 4,4-dihydroxydiphenyl ether, three (4-hydroxy phenyl) methane, 1; Two (4-aminomethyl phenyl)-1-diphenylphosphino ethane, three (4-hydroxy phenyl) ethane, 1 of 1-, two [1-(4-the hydroxy phenyl)-1-Methylethyl] benzene, 1 of 3-, two [1-(4-the hydroxy phenyl)-1-Methylethyl] benzene, 4 of 4-; Two [1-(4-hydroxy phenyl)-1-Methylethyl]-1 of 6-; 3-dihydroxy benzenes, 1, and two (4-the hydroxy phenyl)-1-of 1-[4-{1-(4-hydroxy phenyl)-1-Methylethyl } phenyl] ethane and 1,1; 2,2-four (4-hydroxy phenyl) ethane.Said phenolic compounds (a) content is preferably 0-40 weight % in the total amount of phenolics (A) and phenolic compounds (a), is more preferably 0-30 weight %, preferably 5-20 weight %.
Consider resolution, heat shocks performance and the thermotolerance of the dielectric film that finally obtains, the weight-average molecular weight of phenolics (A) is wanted to be at least 2000, is more preferably 2000 to about 20000.
Said resin combination should comprise the 30-90 weight % that accounts for the amount of composition that does not contain solvent (F), is more preferably 30-80 weight %, preferably the phenolics of 40-70 weight % (A) (and phenolic compounds (a) of combination use).When the content of phenolics (A) was in above-mentioned scope, said resin combination can be formed on the film that enough development property are arranged in the alkaline aqueous solution.
(B) contain the compound of quinone diazido
The compound that contains the quinone diazido (B) (hereinafter being called " quinone di-azido compound (B) ") that the present invention uses is by 1; 2-naphthoquinones diazido-4-sulfonic acid or 1,2-naphthoquinones diazido-5-sulfonic acid and contain the ester that forms between the compound of a phenolic hydroxyl group at least.The said compound that contains a phenolic hydroxyl group at least has no particular limits, and preferably this compound has the structure with following arbitrary chemical formulation:
X wherein
1-X
10Represent hydrogen atom respectively, contain the alkyl of 1-4 carbon atom, the alkoxy that contains 1-4 carbon atom or hydroxyl, still, condition is X
1-X
5In at least one is a hydroxyl; A is singly-bound, O, S, CH
2, C (CH
3)
2, C (CF
3)
2, C=O or SO
2
X wherein
11-X
24Definition and X
1-X
10Identical, they can be identical or different, and still, condition is X
11-X
15In at least one is a hydroxyl; R
1-R
4Represent hydrogen atom respectively or contain the alkyl of 1-4 carbon atom;
X wherein
25-X
39Definition and X
1-X
10Identical, they can be identical or different, and still, condition is X
25-X
29In at least one is a hydroxyl, X
30-X
34In at least one is a hydroxyl; R
5Expression hydrogen atom or contain the alkyl of 1-4 carbon atom;
X wherein
40-X
58Definition and X
1-X
10Identical, they can be identical or different, and still, condition is X
40-X
44In at least one is a hydroxyl, X
45-X
49In at least one is a hydroxyl, X
50-X
54In at least one is a hydroxyl; R
6-R
8Represent hydrogen atom respectively or contain the alkyl of 1-4 carbon atom;
X wherein
59-X
72Definition and X
1-X
10Identical, they can be identical or different, and still, condition is X
59-X
62In at least one is a hydroxyl, X
63-X
67In at least one is a hydroxyl.
The example of quinone diazido compound (B) comprises 1,2-naphthoquinones diazido-4-sulfonic acid or 1,2-naphthoquinones diazido-5-sulfonic acid and 4,4-dihydroxy diphenyl methane, 4; 4-dihydroxydiphenyl ether, 2,3,4-trihydroxybenzophenone, 2,3; 4,4-tetrahydroxybenzophenone, 2,3; 4,2,4-pentahydroxybenzophenone, three (4-hydroxy phenyl) methane, three (4-hydroxy phenyl) ethane, 1; Two (4-the hydroxy phenyl)-1-diphenylphosphino ethanes, 1 of 1-, two [1-(4-the hydroxy phenyl)-1-Methylethyl] benzene, 1 of 3-, two [1-(4-the hydroxy phenyl)-1-Methylethyl] benzene, 4 of 4-; Two [1-(4-hydroxy phenyl)-1-Methylethyl]-1 of 6-, 3-dihydroxy benzenes and 1, the ester that two (4-the hydroxy phenyl)-1-of 1-[4-{1-(4-hydroxy phenyl)-1-Methylethyl } phenyl] ethane forms.
Said resin combination should comprise with 100 weight portion phenolics (A) (perhaps when when combination, the total amount of phenolics (A) and phenolic compounds (a)) 10-50 weight portion, is more preferably the quinone diazido compound (B) of 15-30 weight portion.Above-mentioned the percent retention of unexposed area will reduce on the film down in limited time when the content of quinone diazido compound (B) is lower than, and also can't accurately obtain the image that designs with pattern mask.When the content of quinone diazido compound (B) surpasses above-mentioned going up in limited time, figure may variation, and said composition may bubble in solidification process.
(C) crosslinked fine grained
Said crosslinked fine grained (C) can be any particle, and condition is that the polymer Tg that constitutes particle is not higher than 0 ℃ polymer beads.The suitable crosslinkable monomer (hereinafter being called " crosslinkable monomers ") through containing at least two unsaturated polymerizable groups of said crosslinked fine grained (C) gets with one or more selected different monomer (hereinafter being called " different monomers ") copolymerization, and the Tg of crosslinked fine grained (C) multipolymer of generation is lower than 0 ℃.Said different monomers preferably also contains functional group except that containing polymerizable groups, for example carboxyl, epoxy radicals, amino, NCO or hydroxyl, and the Tg of crosslinked fine grained (C) multipolymer of generation is not higher than 0 ℃.
Exemplary crosslinkable monomers includes the compound of a plurality of polymerizable unsaturated groups, for example divinylbenzene, diallyl phthalate, two (methyl) acrylic acid second diester, two (methyl) acrylic acid propylene diester, trimethylolpropane tris (methyl) acrylic ester, three (methyl) acrylic acid Ji Wusi ester, polyglycol two (methyl) acrylic ester and polypropylene glycol two (methyl) acrylic ester.Wherein, divinylbenzene is preferable.
When preparing crosslinked fine grained (C), the crosslinkable monomers consumption is preferably 1-20 weight % in all monomer total amounts of wanting copolymerization, is more preferably 2-10 weight %.
The instance of said different monomers comprises:
Diolefin compound is butadiene, isoprene, dimethyl butadiene, chlorbutadiene and 1,3-pentadiene for example;
Unsaturated nitrile compound is (methyl) vinyl cyanide, α-Lv Daibingxijing, alpha-chloro methacrylonitrile, α-methoxy acrylonitrile, α-ethoxy propylene nitrile, nitrile butenoate, nitrile cinnamate, dintrile itaconate, dintrile maleate and dintrile fumarate for example;
Unsaturated amides is (methyl) acrylic amide, N for example; N '-methylene two (methyl) acrylic amide, N; N '-ethylene (methyl) acrylic amide, N; N '-hexa-methylene two (methyl) acrylic amide, N-methylol (methyl) acrylic amide, N-(2-hydroxyethyl) (methyl) acrylic amide, N, N '-two (2-hydroxyethyl) (methyl) acrylic amide, crotonamide and cinnamamide;
(methyl) acrylic ester is (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) Hexyl 2-propenoate, (methyl) acrylic acid dodecane ester, polyethylene glycol groups (methyl) acrylic ester and polypropylene glycol (methyl) acrylic ester for example;
Aromatic ethenyl compound is styrene, AMS, O-methoxy styrene, para hydroxybenzene ethene and to isopropenyl phenol for example;
By the diglycidyl ether of bisphenol-A, the diglycidyl ether of monoethylene glycol etc. and (methyl) acrylic acid, (methyl) hydroxyalkyl acrylate, etc. (methyl) acrylic acid epoxy ester of obtaining of reaction; With polyurethane (methyl) acrylic ester that obtains by (methyl) hydroxyalkyl acrylate and polyisocyanates reaction;
The unsaturated compound that epoxide group arranged is (methyl) glycidyl acrylate and (methyl) allyl glycidyl ether for example;
The unsaturated acid compound is (methyl) acrylic acid, itaconic acid, β-(methyl) acrylyl oxy-ethyl succinate, β-(methyl) acrylyl oxy-ethyl maleate, β-(methyl) acrylyl oxy-ethyl phthalic ester, β-(methyl) acrylyl oxy-ethyl hexahydro-phthalic acid ester for example;
Contain amino unsaturated compound for example dimethylamino (methyl) acrylic ester and lignocaine (methyl) acrylic ester;
The unsaturated compound that contains acylamino-is (methyl) acrylic amide and dimethyl (methyl) acrylic amide for example; With
The unsaturated compound of hydroxyl is (methyl) hydroxy-ethyl acrylate, (methyl) acrylic acid and hydroxypropyl acrylate and (methyl) acrylic acid hydroxy butyl ester for example.
In these different monomers, should use butadiene, isoprene, (methyl) vinyl cyanide, (methyl) acrylic acid, styrene alkane ester, para hydroxybenzene ethene, to isopropenyl phenol, (methyl) acrylic acid shrink sweet ester, (methyl) acrylic acid, (methyl) hydroxyalkyl acrylate etc.
As different monomers, preferably use a kind of diolefin compound, particularly butadiene at least.The said diolefin compound consumption of all monomer total amounts in copolymerization is preferably 20-80 weight %, is preferably 30-70 weight %.
When diolefin compound when for example butadiene carries out copolymerization with the aforementioned proportion that accounts for all monomer total amounts, can obtain said crosslinked fine grained (C) with the soft fine grained of rubber-like.In addition, the amount of the above-mentioned different monomers cured film that will cause finally obtaining has fabulous crack resistance and permanance.
The mean grain size of crosslinked fine grained (C) is preferably 30-500nm, is more preferably 40-200nm, preferably 50-120nm.Can control the diameter of crosslinked fine grained (C) through arbitrary method.For example at particle (C) when synthesizing through emulsion polymerization, particle diameter can be controlled to regulate the number that forms capsule in the emulsion polymerization process through the amount of regulating emulsifying agent, but is not limited to the method.
Said crosslinked fine grained (C) consumption is counted with 100 weight portion phenolics (A) (perhaps when combination is used, the total amount of phenolics (A) and phenolic compounds (a)) and is preferably the 1-50 weight portion, is more preferably the 5-30 weight portion.When the content of said crosslinked fine grained (C) be lower than above-mentioned down in limited time, the heat shocks poor performance of the cured film that finally obtains.And content surpasses the above-mentioned upper limit and possibly cause cured film resolution and thermotolerance to reduce, the particle that also possibly cause obtaining and the compatibility and dispersed reduction of other component.
(D) per molecule contains the compound (hardening agent) of the amino of two alkyl etherificates at least
The compound (D) (hereinafter being called " hardening agent (D) ") that said per molecule contains two amino of alkyl etherificate at least and the reaction of phenolics (A) in as crosslinking chemical (hardening agent).The instance of hardening agent (D) comprise nitrogen-containing compound for example all or part active methylol by (many) methylolations melamine of alkyl etherificate, (many) methylolations glycoluril, (many) methylolations benzoguanamine and (many) methylolations urea.Exemplary alkyl comprises methyl, ethyl, butyl and their potpourri.Said hardening agent can comprise the oligomer composition that the part of nitrogen-containing compound obtains from condensation.Such hardening agent example comprises hexamethoxy methyl melamine, six butoxymethyl melamines, tetramethoxy methylate glycoluril and four butoxymethyl glycolurils.These hardening agent (D) can use separately, also can be with two kinds or two or more combination use.
Said hardening agent (D) consumption is counted with 100 weight portion phenolics (A) (perhaps when combination is used, the total amount of phenolics (A) and phenolic compounds (a)), is preferably the 1-100 weight portion, is more preferably the 5-50 weight portion.Above-mentioned curing can't fully be carried out down in limited time when the content of said hardening agent (D) is lower than, and the electrical insulation capability of the cured product that obtains is relatively poor.And content possibly cause composition performance and thermotolerance to reduce above the above-mentioned upper limit.
(E) hot acid agent
The said hot acid agent (E) (hereinafter being called " acid producing agent (E) ") that the present invention uses can be arbitrary at preference temperature 50-250 ℃ of acidic compound down for example; The example comprises sulfonium salt, diazo salt, halide-containing and sulfonate compound, but is not limited to these compounds.Said acid producing agent quickens the alkyl ether groups of hardening agent (D) and the reaction between the phenolics (A) as catalyzer.
The instance of said acid producing agent (E) comprises hexafluoro-antimonic acid benzyl aminomethyl phenyl sulfonium; Hexafluorophosphoric acid benzyl aminomethyl phenyl sulfonium; Tetrafluoro boric acid benzyl aminomethyl phenyl sulfonium; TFMS benzyl aminomethyl phenyl sulfonium; Hexafluoro-antimonic acid benzyl (4-hydroxyphenyl) methyl sulfonium; Hexafluorophosphoric acid benzyl (4-hydroxyphenyl) methyl sulfonium; Tetrafluoro boric acid benzyl (4-hydroxyphenyl) methyl sulfonium; TFMS benzyl (4-hydroxyphenyl) methyl sulfonium; Hexafluoro-antimonic acid benzene diazonium; Hexafluorophosphoric acid benzene diazonium; Tetrafluoro boric acid benzene diazonium; TFMS benzene diazonium; Hexafluoro-antimonic acid naphthalene diazonium and TFMS naphthalene diazonium.
Said acid producing agent (E) consumption is counted with 100 weight portion phenolics (A) (perhaps when combination is used, the total amount of phenolics (A) and phenolic compounds (a)), is preferably the 0.1-10 weight portion, is more preferably the 0.5-5 weight portion.When the content of said acid producing agent (E) be lower than above-mentioned down in limited time, the cured product poor solvent resistance that finally obtains.And content possibly cause electrical insulating property to reduce above the above-mentioned upper limit.
(F) solvent
Said solvent (F) is joined in the resin combination to strengthen the viscosity or the storage stability of processing characteristics or control combination thing.The instance of solvent (F) includes, but are not limited to ethylene glycol monoalkyl ether acetate for example monoethylene glycol monomethyl ether acetate, ethylene glycol monomethyl ether acetate;
Propylene-glycol monoalky lether is propylene glycol monomethyl ether, propylene glycol list ethylether, propylene glycol list propyl ether and propylene glycol single-butyl ether for example;
The propylene glycol dialkyl ether is propylene glycol dimethyl ether, propylene glycol Anaesthetie Ether, propylene glycol dipropyl ether and propylene glycol dibutyl ethers for example;
The propylene-glycol monoalky lether acetic acid esters is propylene glycol monomethyl ether, propylene glycol list ethylether acetic acid esters, propylene glycol list propyl ether acetic acid esters and propylene glycol single-butyl ether acetic acid esters for example;
Cellosolve is ethyl cellosolve and butyl cellosolve for example;
Carbitol is BC for example;
Lactate is methyl lactate, ethyl lactate, lactic acid n-propyl ester and isopropyl lactate for example;
Alphatic carboxylic acid ester is ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, isopropyl propionate, n-butyl propionate and isobutyl propionate for example;
Other ester is 3-methoxypropionic acid methyl esters, 3-methoxy propyl acetoacetic ester, 3-ethoxy-propionic acid methyl esters, 3-ethoxyl ethyl propionate, methyl pyruvate and ethyl pyruvate for example;
Aromatic hydrocarbon is toluene and xylene for example;
Ketone is 2-heptanone, 3-heptanone, 4-heptanone and cyclohexanone for example;
Acid amides is N for example, dinethylformamide, N-methylacetamide, DMAC N,N, N-Methyl pyrrolidone; With
Lactone is gamma-butyrolacton for example.
These solvents (F) can use separately or use with two kinds of perhaps two or more combinations.
(G) other adjuvant
Above-mentioned resin combination also can comprise other adjuvant, for example epoxy compound, bonding agent and equal paint.Exemplary epoxy compound comprises phenolic resin varnish, bisphenol epoxy, cycloaliphatic epoxy resin and aliphatic epoxy resin.These adjuvants use in the scope of the characteristic formation of composition not being damaged.
< cured product >
First kind of positive photosensitive insulating resin composition comprises: phenolics (A), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D), solvent (F) and optional other adjuvant (G).This resin combination has fabulous resolution, and the cured product that is obtained by said resin combination has fabulous electrical insulating property, heat shocks performance and bond properties and cure shrinkage.
Second kind of positive photosensitive insulating resin composition comprises: phenolics (A), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D), acid producing agent (E), solvent (F) and optional other adjuvant (G).This resin combination has fabulous resolution, and the cured product that is obtained by said resin combination has fabulous electrical insulating property, heat shocks performance, bond properties and cure shrinkage and solvent resistance.
Therefore, these resin combinations are suitable to the interlayer insulation film of producing semiconductor element and the material of surface protection film.
Said resin combination is coated on the substrate, for example above on the silicon chip of existing wiring diagram, drying coated then resin combination makes evaporation such as solvent to form film.Afterwards, said film is made public through the photomask that required figure is arranged, the film after the exposure develops in alkaline developer.The result who develops is that the exposure area dissolving is removed, and obtains the film of required figure.In addition, the film heating to improve insulating property, can be made cured film like this.
Above-mentioned said resin combination is coated on the substrate and can realizes through dip-coating, spraying, coiling rod blade coating, roller coat, spin coating, curtain coating and similar approach.The thickness of film can be through solid concentration and the next suitably control of viscosity of selecting coating process and regulating composition.
The exemplary radiation thing that can be used for above-mentioned exposure comprises that low pressure mercury lamp, high-pressure sodium lamp, metal halide lamp, g-line went on foot ultraviolet ray, electron beam and laser beam that projection exposure machine and i-line stepping projection exposure machine send.Radiation dose suitably confirms according to the thickness of radiation source that uses or said resin film.Under the ultraviolet situation of high-pressure sodium lamp emission, dosage is approximately 1000-20000J/m
2, film thickness is 5-50 μ m.
Subsequently, the rete after the exposure places alkaline developer to develop, and dissolving, removal exposure area are to form required figure.Exemplary developing method comprises spray development, spray development, immersion development and stirring development.Developed usually under 20-40 ℃ about 1-10 minute.
The instance of alkaline developer comprises and contains about 1-10 weight % alkali compounds, the for example alkaline aqueous solution of NaOH, potassium hydroxide, ammoniacal liquor, tetramethylammonium hydroxide and choline.Said alkaline aqueous solution can with the suitable quantity of water solubleness organic solvent, for example methyl alcohol and ethanol or surfactant mix.The above-mentioned development with alkaline developer is afterwards washing and dry
Then the figure that forms is solidified through thermal treatment, the cured film that obtains like this could play dielectric film fully.Under second kind of composition situation, acid producing agent (E) is decomposed to form acid through thermal treatment.Because the catalysis of this acid, the reaction between hardening agent (D) and the phenolics (A) obtain quickening.The not special restriction of condition of cure, it depends on the purposes of cured product, for example film can heat 30 minutes to 10 hours under 100-250 ℃ and obtain solidifying.Thermal treatment also can be carried out through two stage mode, makes film fully solidify like this, has avoided the deformation of the figure of gained.For example, curing can be carried out by this way: the figure of phase one with gained heated 10 minutes to 2 hours down at 50-100 ℃, and subordinate phase heated 20 minutes to 8 hours down at 100-250 ℃.Under above-mentioned condition of cure, heating can be carried out in baking oven, IR bake and the similar heating arrangement of routine.
Commercial Application
Positive photosensitive insulating resin composition of the present invention has good resolution, can obtain having the cured product of fabulous electrical insulating property, heat shocks property and bond properties, particularly excellent insulation property and heat shocks property.
Embodiment
Below through following embodiment the present invention is described in detail, but be noted that the present invention never is limited to these embodiment.Hereinafter, " part " is only if having only explanation to refer to weight portion.
Be the explanation of the component used in embodiment and the Comparative Examples below.According to method given below the performance of the cured product that obtained by these instances is estimated.
< component >
Phenolics (A):
A-1: by metacresol and paracresol cresols linear phenol-aldehyde resin with 60/40 mol ratio (weight-average molecular weight according to polystyrene is 8700) preparation
A-2: by metacresol and paracresol cresols linear phenol-aldehyde resin with 50/50 mol ratio (weight-average molecular weight according to polystyrene is 7500) preparation
A-3: polyhydroxy styrene (trade name: MARUKA LYNCUR S-2P, available from MaruzenPetrochemical Co., Ltd.)
Phenolic compounds (a):
A-1:1, and two (4-the hydroxyphenyl)-1-of 1-[4-{1-(4-hydroxyphenyl)-1-Methylethyl } phenyl] ethane
Quinone di-azido compound (B):
B-1:1, and two (4-the hydroxyphenyl)-1-of 1-[4-{1-(4-hydroxyphenyl)-1-Methylethyl } phenyl] ethane and 1,2-naphthoquinones diazido-5-sulfonic acid is with the condensation product of molar average than 1/2.0 formation.
B-2:1, two (4-the hydroxyphenyl)-1-diphenylphosphino ethanes and 1 of 1-, 2-naphthoquinones diazido-5-sulfonic acid is with the condensation product of molar average than 1/1.5 formation.
Crosslinked fine grained (C):
C-1: butadiene/methacrylic acid hydroxy butyl ester/methacrylic acid/divinylbenzene=60/32/6/2 (weight %), mean grain size=65nm
Hardening agent (D):
D-1: (trade name: CYMEL300 is available from Mitsui Cytec, Ltd.) for the hexamethoxy methyl melamine
D-2: tetramethoxy methylates, and (trade name: CYMEL1174 is available from Mitsui Cytec, Ltd.) for glycoluril
Acid producing agent (E):
E-1: hexafluoro-antimonic acid benzyl (4-hydroxyphenyl) methyl sulfonium
E-2: hexafluorophosphoric acid benzyl (4-hydroxyphenyl) methyl sulfonium
Solvent (F):
F-1: ethyl lactate
The F-2:2-heptanone
Other adjuvant (G)
G-1: diglycol diglycidyl ether
G-2:SAN-AID SI-150 is (available from SANSHIN CHEMICAL IND.CO., Ltd.)
< evaluation method >
Resolution:
Said positive photosensitive insulating resin composition is spin-coated on 6 inches the silicon chip.The resin combination of the said coating of heating on 100 ℃ hot plate formed the thick homogeneous film of 10 μ m in 5 minutes.Said film is used from the ultraviolet ray of high-pressure sodium lamp emission through photomask carried out irradiation with calibrating device MA-150 (available from SussMicrotec).Dosage is 3000 and 10000J/m under the 350nm
2Between.Then the film after the exposure was immersed in 23 ℃ the tetramethylammonium hydroxide aqueous solution of 2.38 weight % 2 minutes and developed.Then film was formed figure in 1 minute with the ultrapure water washing.Minimum dimension according to the gained figure is estimated resolution.
Electrical insulation capability (specific insulation)
Said positive photosensitive insulating resin composition is coated on the SUS substrate.Resin combination 100 ℃ hot plate heating coatings formed the thick homogeneous film of 10 μ m in 5 minutes.With this film again in 170 ℃ convection oven heating obtained cured film in 2 hours.Said cured film was placed 121 ℃, 100% humidity, 2.1 atmospheric too power pot exercisers (ESPEC CORP.) 168 hours.Measure the specific insulation of interlayer before above-mentioned processing and after handling.The gained result is each other relatively to confirm resistive performance.
The heat shocks performance:
Said positive photosensitive insulating resin composition is coated on its heat shocks performance of test on the evaluation substrate 1.As illustrated in fig. 1 and 2, estimate substrate 1 and form by the figure of estimating substrate 2 and Copper Foil 3.Heat resin combination preparation in the 5 minutes assess sample of coating then at 100 ℃ hot plate.Assess sample thickness of resin film on the conductor of estimating substrate 1 is 10 μ m.This resinous coat was obtained cured film again in 2 hours in 170 ℃ convection oven.Assess sample is carried out the heat shocks test with heat shocks tester (ESPEC CORP.) subsequently.During test, with-55 ℃/30 minutes, 150 ℃/30 minutes be a circulation, repeat such circulation, crack or similar defective appear on cured film.The heat shocks performance is confirmed by the round-robin number of times.
Bond properties:
Said positive photosensitive insulating resin composition is coated on spraying SiO
2Silicon chip on.Processed the sample of the thick even resin film of 10 μ m in 5 minutes at the said resin combination of 100 ℃ hot plate heating coatings.With this film again in 170 ℃ convection oven heating obtained cured film in 2 hours.Then said cured film was placed 121 ℃, 100% humidity, 2.1 atmospheric pressure cooker testing devices (ESPEC CORP.) 168 hours.Test before above-mentioned processing and the bond properties after handling with drawing grid (bonding) method of testing according to JIS K5400.
Cure shrinkage:
Said positive photosensitive insulating resin composition is spin-coated on 6 inches the silicon chip.Processed the resin film sample of uniform thickness in 5 minutes at the resin combination of 100 ℃ hot plate heating coatings.Recording thickness of resin film in this stage is thickness (A).And then this film obtained cured film in 2 hours in 170 ℃ convection oven.The thickness that records cured film is thickness (B).Cure shrinkage passes through the following formula heating Calculation:
Cure shrinkage={ 1-(B)/(A) } * 100
Solvent resistance:
Said positive photosensitive insulating resin composition is spin-coated on 6 inches the silicon chip.Resin combination 100 ℃ hot plate heating coatings was processed the thick homogeneous film sample of 10 μ m in 5 minutes.Again this film is heated in 170 ℃ convection oven subsequently and obtained cured film in 2 hours.The cured film sample was soaked in 60 ℃ isopropyl alcohol 10 minutes.Under optical microscope, observe the surface of cured film then, press following its surface appearance of standard evaluation:
AA: the surface is perfect
BB: the surface bleaches or destroys
< first kind positive photosensitive insulating resin composition and cured product>thereof
< embodiment 1-5 >
Be dissolved in preparation resin combination in the solvent (F) to phenolics (A), phenolic compounds (a), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D) and other adjuvant (G) by the blending ratio shown in the table 1.Use the performance of said method testing tree oil/fat composition then, the result is as shown in table 2.
< Comparative Examples 1-4 >
Be dissolved in preparation resin combination in the solvent (F) to phenolics (A), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D) and other adjuvant (G) by the blending ratio shown in the table 1.Use the performance of said method testing tree oil/fat composition then, the result is as shown in table 2.
< second kind positive photosensitive insulating resin composition and cured product>thereof
< embodiment 6-10 >
Be dissolved in preparation resin combination in the solvent (F) to phenolics (A), phenolic compounds (a), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D) and acid producing agent (E) by the blending ratio shown in the table 3.With the performance of said method testing tree oil/fat composition, the result is as shown in table 4.
< Comparative Examples 5-9 >
Be dissolved in preparation resin combination in the solvent (F) to phenolics (A), quinone di-azido compound (B), crosslinked fine grained (C), hardening agent (D) and acid producing agent (E) by the blending ratio shown in the table 3.With the performance of said method testing tree oil/fat composition, the result is as shown in table 4.
Claims (4)
1. positive photosensitive insulating resin composition, said resin combination comprises:
(A) alkali soluble resins of phenolic hydroxy group, the weight-average molecular weight of this resin is at least 2000;
(B) contain the compound of quinone diazido,
(C) crosslinked fine grained, said crosslinked fine grained (C) consumption is counted the 1-50 weight portion with the alkali soluble resins (A) of 100 weight portion phenolic hydroxy groups;
(D) per molecule contains the compound of the amino of two alkyl etherificates at least, and this compound (D) consumption is counted the 1-100 weight portion with the alkali soluble resins (A) of 100 weight portion phenolic hydroxy groups;
(E) hot acid agent, said hot acid agent (E) consumption is counted the 0.1-10 weight portion with the alkali soluble resins (A) of 100 weight portion phenolic hydroxy groups; With
(F) solvent,
Wherein, said hot acid agent comprises hexafluoro-antimonic acid benzyl aminomethyl phenyl sulfonium, hexafluorophosphoric acid benzyl aminomethyl phenyl sulfonium, tetrafluoro boric acid benzyl aminomethyl phenyl sulfonium, TFMS benzyl aminomethyl phenyl sulfonium, hexafluoro-antimonic acid benzyl (4-hydroxyphenyl) methyl sulfonium, hexafluorophosphoric acid benzyl (4-hydroxyphenyl) methyl sulfonium, tetrafluoro boric acid benzyl (4-hydroxyphenyl) methyl sulfonium, TFMS benzyl (4-hydroxyphenyl) methyl sulfonium, hexafluoro-antimonic acid benzene diazonium, hexafluorophosphoric acid benzene diazonium, tetrafluoro boric acid benzene diazonium, TFMS benzene diazonium, hexafluoro-antimonic acid naphthalene diazonium and TFMS naphthalene diazonium.
2. the described resin combination of claim 1 is characterized in that, in the alkali soluble resins (A) of 100 weight portion phenolic hydroxy groups, said resin combination comprises following material:
The compound that contains the quinone diazido (B) of 10-50 weight portion,
The crosslinked fine grained (C) of 5-30 weight portion,
The per molecule of 5-50 weight portion contain at least the amino of two alkyl etherificates compound (D) and
0.5-5 the hot acid agent (E) of weight portion.
3. the resin combination described in the claim 1 is characterized in that, the mean grain size of said crosslinked fine grained (C) is 30-500nm.
4. cured product, it is solidified by the described positive photosensitive insulating resin composition of claim 1 and obtains.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002014307A JP3812654B2 (en) | 2002-01-23 | 2002-01-23 | Positive photosensitive insulating resin composition and cured product thereof |
| JP2002-14307 | 2002-01-23 | ||
| JP200214307 | 2002-01-23 | ||
| JP2002018390A JP3812655B2 (en) | 2002-01-28 | 2002-01-28 | Positive photosensitive insulating resin composition and cured product thereof |
| JP200218390 | 2002-01-28 | ||
| JP2002-18390 | 2002-01-28 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN038002817A Division CN1864099B (en) | 2002-01-23 | 2003-01-15 | Positively photosensitive insulating resin composition and cured object obtained therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101644891A CN101644891A (en) | 2010-02-10 |
| CN101644891B true CN101644891B (en) | 2012-06-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101659142A Expired - Lifetime CN101644891B (en) | 2002-01-23 | 2003-01-15 | Positively photosensitive insulating resin composition and cured object obtained therefrom |
| CN038002817A Expired - Lifetime CN1864099B (en) | 2002-01-23 | 2003-01-15 | Positively photosensitive insulating resin composition and cured object obtained therefrom |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN038002817A Expired - Lifetime CN1864099B (en) | 2002-01-23 | 2003-01-15 | Positively photosensitive insulating resin composition and cured object obtained therefrom |
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| JP (1) | JP3812654B2 (en) |
| CN (2) | CN101644891B (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4655882B2 (en) * | 2004-10-29 | 2011-03-23 | Ｊｓｒ株式会社 | Positive photosensitive insulating resin composition and cured product thereof |
| JP4692219B2 (en) * | 2004-10-29 | 2011-06-01 | Ｊｓｒ株式会社 | Positive photosensitive insulating resin composition and cured product thereof |
| JP2007052359A (en) * | 2005-08-19 | 2007-03-01 | Jsr Corp | Pattern forming method, its cured material, and circuit board |
| JP4640037B2 (en) * | 2005-08-22 | 2011-03-02 | Ｊｓｒ株式会社 | Positive photosensitive insulating resin composition and cured product thereof |
| KR100987785B1 (en) | 2006-04-13 | 2010-10-18 | 코오롱인더스트리 주식회사 | Method of manufacturing metal electrode |
| WO2007119949A1 (en) * | 2006-04-13 | 2007-10-25 | Kolon Industries, Inc | Composition for positive type photoresist and positive type photoresist film manufactured thereby |
| JP4765951B2 (en) * | 2007-02-08 | 2011-09-07 | Ｊｓｒ株式会社 | Large silicon wafer having insulating film and method for manufacturing the same |
| WO2008149730A1 (en) * | 2007-06-05 | 2008-12-11 | Nissan Chemical Industries, Ltd. | Positive photosensitive resin composition and polyhydroxyamide resin |
| JP5067028B2 (en) * | 2007-06-12 | 2012-11-07 | 日立化成工業株式会社 | Positive photosensitive resin composition, method for producing resist pattern, and electronic device |
| PT2221666E (en) | 2007-11-12 | 2013-10-31 | Hitachi Chemical Co Ltd | Positive-type photosensitive resin composition, method for production of resist pattern, and semiconductor device |
| WO2010026988A1 (en) | 2008-09-04 | 2010-03-11 | 日立化成工業株式会社 | Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component |
| KR101398754B1 (en) * | 2008-12-26 | 2014-05-27 | 히타치가세이가부시끼가이샤 | Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device |
| JP5498874B2 (en) | 2010-06-28 | 2014-05-21 | 東京応化工業株式会社 | Positive photosensitive resin composition |
| TWI481657B (en) | 2010-09-15 | 2015-04-21 | Asahi Kasei E Materials Corp | A phenol resin composition and a hardened embossed pattern, and a method for manufacturing the semiconductor |
| JP5968227B2 (en) | 2010-12-27 | 2016-08-10 | 旭化成株式会社 | Photosensitive resin composition for alkali development, cured relief pattern, and semiconductor device |
| JP5792548B2 (en) * | 2011-07-28 | 2015-10-14 | 東京応化工業株式会社 | Glass processing method |
| US9575410B2 (en) | 2011-12-09 | 2017-02-21 | Asahi Kasei E-Materials Corporation | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device |
| JP2013134346A (en) * | 2011-12-26 | 2013-07-08 | Hitachi Chemical Co Ltd | Photosensitive resin composition, manufacturing method of patterned cured film, semiconductor device, and electronic component |
| JP5263424B2 (en) * | 2012-04-05 | 2013-08-14 | 日立化成株式会社 | Positive photosensitive resin composition, method for producing resist pattern, and electronic device |
| JP6249333B2 (en) * | 2013-11-20 | 2017-12-20 | ナガセケムテックス株式会社 | Positive photosensitive resin composition |
| CN106796399B (en) * | 2014-10-02 | 2021-01-22 | 艾曲迪微系统股份有限公司 | Positive photosensitive resin composition, method for producing patterned cured film, cured product, interlayer insulating film, covercoat, surface protective film, and electronic component |
| JP6513596B2 (en) * | 2016-04-04 | 2019-05-15 | 日立化成株式会社 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN CURED FILM, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT |
| JP2018028690A (en) * | 2017-10-31 | 2018-02-22 | 日立化成株式会社 | Photosensitive resin composition, method for producing patterned cured film, semiconductor device and electronic component |
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| CN1199874A (en) * | 1997-02-18 | 1998-11-25 | 莫顿国际股份有限公司 | Positive-tone photoimageable crosslinkable coating |
| JP2001005175A (en) * | 1999-06-23 | 2001-01-12 | Victor Co Of Japan Ltd | Photoresist for information recoding medium |
| US6190833B1 (en) * | 1997-03-30 | 2001-02-20 | Jsr Corporation | Radiation-sensitive resin composition |
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| JPH07228611A (en) * | 1994-02-15 | 1995-08-29 | Japan Synthetic Rubber Co Ltd | Polymer emulsion |
| CN1224858A (en) * | 1998-01-30 | 1999-08-04 | 莫顿国际股份有限公司 | Positive-tone photoimageable crosslinkable coating |
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- 2002-01-23 JP JP2002014307A patent/JP3812654B2/en not_active Expired - Lifetime
-
2003
- 2003-01-15 CN CN2009101659142A patent/CN101644891B/en not_active Expired - Lifetime
- 2003-01-15 CN CN038002817A patent/CN1864099B/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1199874A (en) * | 1997-02-18 | 1998-11-25 | 莫顿国际股份有限公司 | Positive-tone photoimageable crosslinkable coating |
| US6190833B1 (en) * | 1997-03-30 | 2001-02-20 | Jsr Corporation | Radiation-sensitive resin composition |
| JP2001005175A (en) * | 1999-06-23 | 2001-01-12 | Victor Co Of Japan Ltd | Photoresist for information recoding medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1864099B (en) | 2010-06-16 |
| CN1864099A (en) | 2006-11-15 |
| JP3812654B2 (en) | 2006-08-23 |
| CN101644891A (en) | 2010-02-10 |
| JP2003215789A (en) | 2003-07-30 |
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