CN101640206A - 光电组件及其组装方法 - Google Patents

光电组件及其组装方法 Download PDF

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CN101640206A
CN101640206A CN200810178955A CN200810178955A CN101640206A CN 101640206 A CN101640206 A CN 101640206A CN 200810178955 A CN200810178955 A CN 200810178955A CN 200810178955 A CN200810178955 A CN 200810178955A CN 101640206 A CN101640206 A CN 101640206A
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image sensing
sensing chip
photoelectric subassembly
chip
multilayer board
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张嘉帅
庄承龙
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Tong Hsing Electronic Industries Ltd
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YINXIANG SCIENCE AND TECHNOLOGY Co Ltd
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Abstract

本发明公开了一种减少整体厚度的光电组件及其组装方法。所述光电组件包括所述图像感测芯片，以及具有用于容纳所述图像感测芯片的凹陷空间的多层印刷电路板，从而减少光电组件的整体厚度。光电组件进一步包括固定于多层印刷电路板上的镜座，用以保护该图像感测芯片，以及一组安装在所述镜座上的透镜，用以导通光线。

Description

光电组件及其组装方法
技术领域
本发明涉及一种光电组件及其组装方法，且特别涉及一种减少整体厚度的光电组件及其组装方法。
背景技术
近年来，图像感测芯片已广泛应用于电子产品以将光转换为电信号。其中图像传感器的应用项目包括了监视器、移动电话、扫描仪、数码相机等。
通常，这类光电模块固定在一块底板上，再被外壳所封装。外壳包含一个透明盖子以便于传感器接收光或其它形式的辐射能。此盖子可为平板玻璃或透镜，从而具备更多光学特性。底板与外壳通常由陶瓷材料制成，盖子则是玻璃或类似的透明物质，利用黏胶黏附于底板上。由于前述的材料与外壳形状的原因，造成这种封装技术成本过高或难以制造。另外，对能抵御极端环境的便携式电子装置的需求日益增长，也增加了设计者对耐久性以及尺寸的考虑。众所周知，光电模块可用来将光转换成电信号或将电信号转换成光，许多形式的光电模块应运而生。这些光电模块有许多的应用，特别是在监视器、移动电话、扫描仪、数码相机等方面，模块的价格根据应用特性与功能，从数百元至数千元不等。
当光电模块被接入一个电子系统中时，该电子系统通常具有许多固定于印刷电路板上的集成电路。每个集成电路包括了数个自封装外延导线。各集成电路的导线利用印刷电路板的电路相互连接，使得信号能在集成电路间传输，使该系统具有某些功能。现有技术的限制在于印刷电路板与光电模块组装时缺少灵活性。因为光电模块必须安装在印刷电路板上，这导致了在所述印刷电路板上完成安装操作时，若需要增加任何其它组件或调整已有组件的位置，都难以执行。此外，当所述装置要减少整体的厚度或尺寸时，安装在所述装置内的光电模块应减小。这时，光电模块的设计需求是使其组件的厚度减少以及缩减所述光电模块的组装空间。
参见图1。图1描述了现有技术中安装在印刷电路板12上的光电模块11。光电模块11及印刷电路板12的组装的整体厚度包含光电模块11的厚度TA与印刷电路板12的厚度TB。即便所述光电模块的设计使其组件的厚度减少及所述光电模块减小组装空间变为可行，所述整体厚度仍为光电模块11的厚度TA加上印刷电路板12的厚度TB。
参见图2。图2对应于另一现有技术，描述安装在印刷电路板12上的光电模块21。对比图2的光电模块21与图1的光电模块11，光电模块21的厚度TA′比光电模块11的厚度TA更薄。然而，图2的整体厚度仍为光电模块21的厚度TA′加上印刷电路板12的厚度TB。
虽然现有技术的多种组装方法在技术上可行，但在实际上则无法有效减小整体组件。同时根据现有技术，组件的整体厚度无法通过安装所述光电模块与特定厚度的印刷电路板而进一步减少。现有技术也尚未公开一种具有比光电模块厚度与印刷电路板厚度之和更小的整体厚度的光电模块与印刷电路板组件。因此，需要一种图像感测芯片的组件设计与组装方式，从而减少原组件的厚度与大小及克服印刷电路板上组件的安装操作中所缺乏的灵活性。
发明内容
本发明提出一种光电组件，包括图像感测芯片，及多层印刷电路板，该多层印刷电路板具有用于容纳所述图像感测芯片的凹陷空间，从而减少所述光电组件的整体厚度。
根据本发明所述的光电组件，进一步包括固定于所述多层印刷电路板上方的镜座，用于保护所述图像感测芯片，以及固定于所述镜座上的透镜，用于导通光线。
根据本发明所述的光电组件，其中所述图像感测芯片通过利用芯片直接封装(COB)、芯片级尺寸封装(CSP)、或表面组装技术(SMT)等方式而被布设在所述凹陷空间中。
根据本发明所述的光电组件，其中所述图像感测芯片具有多个接头，电连接到所述多层印刷电路板。
根据本发明所述的光电组件，其中所述图像感测芯片包括互补金属氧化物半导体(CMOS)图像传感器或电荷耦合器件(CCD)图像传感器。
本发明还提出了一种光电组件的组装方法，该方法的步骤包括a)提供具有用于容纳图像感测芯片的凹陷空间的多层印刷电路板，以及b)将所述图像感测芯片布设到所述多层印刷电路板上的凹陷空间中，从而减少所述光电组件的整体厚度。
根据本发明所述的光电组件的组装方法，其中所述步骤b)进一步包括步骤b1)电连接所述图像感测芯片与所述多层印刷电路板，b2)将镜座固定于所述多层印刷电路板上的图像感测芯片上方以保护所述图像感测芯片，以及b3)在所述镜座上安装一组透镜，以导通光线。
根据本发明所述的光电组件的组装方法，其中所述图像感测芯片通过利用芯片直接封装(COB)、芯片级尺寸封装(CSP)、或表面组装技术(SMT)等方式而被安装在所述凹陷空间中。
根据本发明所述的光电组件的组装方法，其中所述图像感测芯片通过多个接头电连接到所述多层印刷电路板。
根据本发明所述的光电组件的组装方法，其中所述图像感测芯片包括互补金属氧化物半导体(CMOS)图像传感器或电荷耦合器件(CCD)图像传感器。
附图说明
图1示出了现有技术中安装在印刷电路板上的光电模块；
图2示出了现有技术中安装在印刷电路板上的另一光电模块；
图3示出了根据本发明的第一种实施方式的光电组件；
图4示出了根据本发明的第二种实施方式的光电组件；
图5示出了根据本发明的第三种实施方式的光电组件；
图6示出了根据本发明的第四种实施方式的光电组件；以及
图7示出了根据本发明的第五种实施方式的光电组件。
主要组件符号说明
11光电模块        12印刷电路板
21光电模块        32多层印刷电路板
311图像感测芯片   312镜座
313透镜           321凹陷空间
42多层印刷电路板  411图像感测芯片
412镜座           413透镜
414连接导线       422凹陷空间
52多层印刷电路板  511图像感测芯片
512镜座           513透镜
522凹陷空间       62多层印刷电路板
611图像感测芯片   612镜座
613透镜           622陷空间
711图像感测芯片   712镜座
713透镜           714连接导线
72多层印刷电路板 721陷空间
722层板          723层板
724层板
具体实施方式
将在下列的实施方式中对本发明进行更具体的描述。值得注意的是下列本发明的实施方式中的描述仅用于描述和图示，发明本身并不局限于公开的型态与式样。
请参见图3，图3描述根据本发明所公开的第一种实施方式的光电组件。如图3所示，所述光电组件包括具有凹陷空间321的多层印刷电路板32及图像感测芯片311。所述凹陷空间321可容纳图像感测芯片311，从而减少所述光电组件的整体厚度。在这种实施方式中，所述图像感测芯片311与镜座312安装在多层印刷电路板32的凹陷空间321中。所述镜座312用于保护图像感测芯片311。此外，透镜313安装在镜座312上以通透光线。所述图像感测芯片311可为互补金属氧化物半导体(CMOS)图像传感器或电荷耦合器件(CCD)图像传感器。
所述图像感测芯片311可采用不同方式安装在凹陷空间321中，如芯片直接封装(COB)、芯片级尺寸封装(CSP)、或表面组装技术(SMT)等方式。
请参见图4。图4描述根据本发明所公开的第二种实施方式的光电组件。如图4所示，所述光电组件包括图像感测芯片411、用于保护图像感测芯片411的镜座412、具有用于容纳所述图像感测芯片411的凹陷空间422的多层印刷电路板42、以及安装在所述镜座412上用以导通光线的透镜413。不同于第一种实施方式，所述图像感测芯片411安装在凹陷空间422中，但镜座412安装在多层印刷电路板42外。由于所述图像感测芯片411是安装在凹陷空间422中，所以所述镜座412不需太厚或安装在较高处。因此，所述光电组件的整体厚度可以缩减。
在这种实施方式中，所述图像感测芯片411通过芯片直接封装(COB)方式安装在多层印刷电路板42的凹陷空间422中。图像感测芯片411通过连接导线414电连接到多层印刷电路板42。所述图像感测芯片可为互补金属氧化物半导体半(CMOS)图像传感器或电荷耦合器件(CCD)图像传感器。
请参见图5。图5描述根据本发明所公开的第三种实施方式的光电组件。如图5所示，所述光电组件包括图像感测芯片511、用于保护所述图像感测芯片511的镜座512、安装在所述镜座512上用以导通光线的透镜513、以及具有用于容纳所述图像感测芯片511的凹陷空间522的多层印刷电路板52。不同于第二种实施方式，本实施方式的图像感测芯片511是以表面组装技术(SMT)安装在多层印刷电路板52的凹陷空间522中的。因此，所述光电组件的整体厚度被缩减。
图6描述根据本发明所公开的第四种实施方式的光电组件。如图6所示，光电组件包括图像感测芯片611、用于保护所述图像感测芯片611的镜座612、安装在所述镜座612上用以导通光线的透镜613、及具有用于容纳所述图像感测芯片611的凹陷空间622的多层印刷电路板62。不同于上述实施方式，所述图像感测芯片611是覆晶芯片，利用芯片级尺寸封装(CSP)方式安装在所述凹陷空间622中。
请参见图7。图7描述根据本发明所公开的第三种实施方式的光电组件。如图7所示，所述光电组件至少包括图像感测芯片711、用于保护所述图像感测芯片711的镜座712、安装在镜座712上用以导通光线的透镜713、及具有用于容纳所述图像感测芯片711的凹陷空间721的多层印刷电路板72。在这种实施方式中，本发明中的多层印刷电路板72有3层层板722～724。所述图像感测芯片711利用芯片直接封装(COB)方式安装在凹陷空间721中的层板724上。同时，所述图像感测芯片711通过连接导线714电连接至层板723。另一方面，本发明的镜座712安装在层板722上，进一步节省材料成本并减少光电组件所占用的空间。
虽然本发明已在上文中以实施方式进行了公开，然而所述实施方式并非用以限定本发明。反之，任何本领域技术人员在不脱离本发明之精神和范围内，应当可进行适当的更动与润饰，因此本发明的保护范围应当以权利要求的内容为准。

Claims (10)

1.一种光电组件，该光电组件包括：
图像感测芯片；以及
多层印刷电路板，具有用于容纳所述图像感测芯片的凹陷空间，从而减少所述光电组件的整体厚度。
2.根据权利要求1所述的光电组件，该光电组件进一步包括：
镜座，固定于所述多层印刷电路板上方以保护所述图像感测芯片；以及
透镜，固定于所述镜座上以导通光线。
3.根据权利要求2所述的光电组件，其中所述图像感测芯片通过利用芯片直接封装、芯片级尺寸封装或表面组装技术的方式而被布设在所述凹陷空间中。
4.根据权利要求1所述的光电组件，其中所述图像感测芯片具有多个接头，电连接至所述多层印刷电路板。
5.根据权利要求1所述的光电组件，其中所述图像感测芯片包括互补金属氧化物半导体图像传感器或电荷耦合器件图像传感器。
6.一种光电组件的组装方法，该方法的步骤包括：
a)提供具有用于容纳图像感测芯片的凹陷空间的多层印刷电路板；以及
b)将所述图像感测芯片布设到所述多层印刷电路板上的凹陷空间中，从而减少所述光电组件的整体厚度。
7.根据权利要求6所述的组装方法，其中所述步骤b)进一步包括下列步骤：
b1)电连接所述图像感测芯片与所述多层印刷电路板；
b2)将镜座固定于所述多层印刷电路板上的图像感测芯片上方以保护所述图像感测芯片；以及
b3)在所述镜座上安装一组透镜以导通光线。
8.根据权利要求6所述的组装方法，其中所述图像感测芯片通过利用芯片直接封装、芯片级尺寸封装、或表面组装技术的方式而被布设在所述凹陷空间中。
9.根据权利要求7所述的组装方法，其中所述图像感测芯片通过多个接头电连接到所述多层印刷电路板。
10.根据权利要求6所述的组装方法，其中所述图像感测芯片包括互补金属氧化物半导体图像传感器或电荷耦合器件图像传感器。
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