CN101639631B - Exposure apparatus, exposure method, and method for producing elements - Google Patents

Exposure apparatus, exposure method, and method for producing elements Download PDF

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Publication number
CN101639631B
CN101639631B CN2009101636954A CN200910163695A CN101639631B CN 101639631 B CN101639631 B CN 101639631B CN 2009101636954 A CN2009101636954 A CN 2009101636954A CN 200910163695 A CN200910163695 A CN 200910163695A CN 101639631 B CN101639631 B CN 101639631B
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liquid
substrate
exposure
optical system
exposure light
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CN101639631A (en
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长坂博之
奥山猛
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Nikon Corp
Nikon Engineering Co Ltd
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Nikon Corp
Nikon Engineering Co Ltd
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An exposure apparatus (EX) exposes a substrate (P) by irradiating the substrate (P) with exposure light (EL) via a liquid (LQ). The exposure apparatus (EX) is provided with an optical system (PL) and an end surface (T1) opposite to the substrate (P), to leading the exposure light (EL) radiating the substrate (P) to pass through; and a liquid immersion device (11, 21, and the like) for supplying the liquid (LQ) and recovering the liquid (LQ). The liquid immersion device has a plate part (172D) having a light path flat surface (75) arranged to surround the exposure light (EL) and arranged between the substrate (P) and the optical system end surface (T1) parallel opposite to the substrate (P); liquid is supplied to a space (G2) between the optical system end surface (T1) and the plate part (172D) from a supplying port (12), and the liquid supplied from the supplying port is recovered from a liquid recovering port (22), the recovering port (22) is arranged opposite to the substrate (P) at the position far away the exposure light (EL) relative to the flat surface (75). The present invention also discloses a nozzle member, an exposure method and an element producing method.

Description

Exposure device, exposure method and manufacturing method
The present invention is to be that June 9, application number in 2005 are 200580015635.8, denomination of invention is divided an application for " exposure device, exposure method and manufacturing method " a case the applying date.
Technical field
The present invention is about seeing through exposure device, exposure method and the manufacturing method that liquid makes base plate exposure.
Background technology
Semiconductor element or liquid crystal display cells, be through will be formed at pattern transfer on the mask on the photonasty substrate, be that so-called photoetching method is made.The employed exposure device of this lithography step has the mask microscope carrier and the baseplate carrier of supporting substrate that support mask, and meanwhile make mask microscope carrier and baseplate carrier mobile one by one through projection optical system with the pattern transfer of mask in substrate.In recent years, more highly integrated for the counter element pattern, and the expectation projection optical system has more high resolving power.The resolution of projection optical system is that employed exposure wavelength numerical aperture shorter or projection optical system more greatly then can improve more.Therefore, the employed exposure wavelength of exposure device shortens year by year, and the numerical aperture of projection optical system then increases gradually.Again, though at present the exposure wavelength of main flow is the 248nm of KrF PRK, the 193nm of the ArF PRK that wavelength is shorter is practicability gradually also.Again, when making public, depth of focus (DOF) also with the resolution no less important.Resolution R and depth of focus δ represent with following formula respectively.
R＝k 1·λ/NA…(1)
δ＝±k 2·λ/NA 2…(2)
Here, λ is an exposure wavelength, and NA is the numerical aperture of projection optical system, k 1, k 2For handling coefficient.Can know from (1) formula, (2) formula, in order to improve resolution R, and shorten exposure wavelength lambda, when increasing numerical aperture NA, depth of focus δ is narrowed down.
If depth of focus δ becomes narrow, promptly be difficult to make substrate surface consistent with the image planes of projection optical system, the not enough misgivings of focus nargin when carrying out exposure actions are arranged.Therefore, as the method that shortens exposure wavelength and expansion depth of focus in fact, for example existing a kind of International Publication immersion method that No. 99/49504 communique disclosed that proposes.This immersion method; Be to be full of below the projection optical system and to form liquid between substrate surface with liquid such as water or organic solvents to soak the zone; The essence wavelength that utilizes the exposure light in the liquid is that doubly (n is a liquid refractivity to aerial 1/n; Being generally about 1.2～1.6) this puts and improves resolution, and can depth of focus be amplified to n doubly.
In addition, like 1 announcement of above-mentioned patent documentation, while be to have a kind ofly to make mask and substrate be displaced into the direction of scanning synchronously, will be formed at the scanning exposure apparatus of the pattern exposure of mask in substrate.Scanning exposure apparatus is that purpose etc. is asked to sweep velocity more at a high speed with the productivity that improves element.Yet, make sweep velocity more during high speed, the state that promptly might be difficult to liquid is soaked the zone is maintained at desired state (size etc.), and then causes seeing through the exposure accuracy and the measuring accuracy deterioration of liquid.Therefore, also can the liquid of liquid be soaked zone maintenance even be asked to making sweep velocity more during high speed in desired state.
For example; When can't liquid being soaked zone maintenance when producing bubble or gap (Void) in desired state and in liquid; Exposure light through liquid promptly can't arrive on the substrate because of bubble or gap well, makes the bad situations such as pattern generating defective that are formed on the substrate.Again, while, might be difficult to fully reclaim the liquid that liquid soaks the zone because of the high speed of sweep velocity in the supply of carrying out liquid and recovery, when the last branch of substrate forms liquid and soaks the zone locally.When abundant withdrawal liquid, promptly can be for example form and adhere to trace (being so-called washmarking) even the situation after also liquid being adhered to during the non-water of liquid in following is called washmarking because of residuing in liquid gasification on the substrate.Washmarking might be brought influence to the photoresist on the substrate, and might cause the performance degradation of the element of producing because of this influence.Also might be difficult to liquid is soaked zone maintenance in desire size along with the more high speed of sweep velocity again.Also might flow out along with the liquid that causes liquid to soak the zone more at a high speed of sweep velocity again.
Summary of the invention
The present invention is because said circumstances, and its purpose is to provide and can liquid be soaked zone maintenance in desired state, carry out exposure device, the exposure method of exposure-processed and use the manufacturing method of this exposure device well.
For addressing the above problem, the present invention has adopted the following formation of the Fig. 1 to Figure 33 shown in the corresponding example.But, the symbol that comprises bracket that is additional to each key element only is the illustration of this key element, and and non-limiting each key element.
The 1st invention provides a kind of exposure device (EX) according to the present invention, is to see through liquid (LQ) exposure light (EL) is shone in substrate (P), so that substrate (P) exposure is characterized in that possessing: projection optical system (PL); And liquid dipping machine structure (11,21 etc.), supply fluid (LQ) and withdrawal liquid (LQ); Liquid dipping machine structure has the inclined-plane (2) that is inclination with surperficial subtend of substrate (P) and relative substrate surface, and the liquids recovery mouth (22) of liquid dipping machine structure is formed at inclined-plane (2).
According to the 1st invention of the present invention; Because the liquids recovery degree of lip-rounding of liquid dipping machine structure is formed in the inclined-plane with the substrate surface subtend; Therefore even make the liquid of the image planes side that is formed at projection optical system soak the zone when relatively moving with substrate; Also can suppress the amount of movement that liquid soaks the interface (liquid-gas interface) of regional liquid and its outer space, and suppress the bigger variation of interface shape.Therefore, can liquid be soaked regional state (size etc.) and be maintained at desired state.Can suppress the expansion that liquid soaks the zone again.
The 2nd invention provides a kind of exposure device (EX) according to the present invention, is to see through liquid (LQ) exposure light (EL) is shone on substrate (P), so that substrate (P) exposure is characterized in that possessing: projection optical system (PL); And liquid dipping machine structure (11,21 etc.), supply fluid (LQ) and withdrawal liquid (LQ); Liquid dipping machine structure has to form with the surperficial subtend of substrate (P) and with substrate (P) surface and roughly becomes parallel par (75); The par (75) of liquid dipping machine structure is configured to surround the view field (AR1) that exposure light (EL) is shone between image planes side end face of projection optical system (PL) (T1) and substrate (P); The liquid supply port (12) of liquid dipping machine structure, the view field (AR1) that relative exposure light (EL) is shone is disposed at the outside, par (75).
According to the 2nd invention of the present invention; Since can will be formed at little gap between substrate surface and par be formed near the view field and form and surround view field; Therefore not only can keep the required little liquid of ten minutes of covering view field and soak the zone; And since in the par arranged outside liquid supply port, therefore can prevent that gas from sneaking into to form in the liquid that liquid soaks the zone, with the liquid continuous light path that is full of exposure light.
The 3rd invention provides a kind of exposure device (EX) according to the present invention, is to see through liquid (LQ) exposure light (EL) is shone in substrate (P), so that substrate (P) exposure is characterized in that possessing: projection optical system (PL); And liquid dipping machine structure (11,21 etc.), supply fluid (LQ) and withdrawal liquid (LQ); Liquid dipping machine structure has: liquid supply port (12), be located at the 1st position and the supply fluid (LQ) in the optical path space outside of this exposure light (EL); And guide member (172D), guiding liquid, the liquid (LQ) that this liquid supply port (12) is supplied sees through the 2nd different position of the 1st position in this optical path space flow direction and this optical path space outside.
The 3rd invention according to the present invention; Because the liquid of supplying from the liquid supply port of the 1st position of being located at the exposure light optical path space outside; Be to flow to the 2nd different position of the 1st position with this optical path space outside through guide member; Therefore can suppress gas part (bubble) forms gas part (bubble) in the liquid of the optical path space that is full of exposure light improper situation generation, with liquid-retentive in desired state.
The 4th invention according to the present invention; A kind of exposure device (EX) is provided, and is to see through liquid (LQ) exposure light (EL) is shone in substrate (P), so that substrate (P) exposure; It is characterized in that; Possess: optical system (PL), have the end face (T1) with substrate (P) subtend, the exposure light (EL) that shines in substrate (P) is passed through; And liquid dipping machine structure (11,21 etc.), be supply fluid (LQ) and withdrawal liquid; This liquid dipping machine structure has board member (172D), this board member have with and the mode of the parallel subtend of substrate (P) be disposed between substrate (P) and the optical system end face (T1) and be configured to surround the tabular surface (75) of the light path of exposure light (EL); From supply opening (12) liquid (LQ) is supplied to the space (G2) between optical system end face (T1) and board member (172D); And see through liquids recovery mouth (22) and reclaim from the liquid of this supply opening supply, this recovery mouthful (22) is the position configuration one-tenth and substrate (P) subtend that more leaves exposure light (EL) light path at the tabular surface (75) than this board member.
The exposure device of the 4th invention according to the present invention; Form the encirclement exposure light owing to be formed at the tabular surface and the minim gap between substrate of board member; And further dispose the liquids recovery mouth, therefore can on substrate, keep the stabilizing solution of desired state and soak the zone in this tabular surface outside.Because liquid is supplied to the space between the end face of board member and optical system, so soaks the zone in the liquid of the light path that is formed on exposure light and be difficult to produce bubble or gap (Void) again.
Again, the 5th invention provides a kind of exposure device (EX) according to the present invention; Be to see through liquid (LQ) exposure light (EL) is shone in substrate (P); So that substrate (P) exposure is characterized in that possessing: optical component (LS1); Have the end face (T1) that contacts with liquid (P), and exposure light (EL) is passed through; And liquid dipping machine structure (11,21 etc.), be supply fluid (LQ) and withdrawal liquid (LQ); This liquid bath unit has and is configured to the parallel subtend of substrate (P) and surrounds the tabular surface (75) of the light path of exposure light (EL); And relatively exposure light (EL) light path, in tabular surface (75) outside inclined-plane that tilts of this tabular surface (2,2 ") relatively.
The exposure device of the 5th invention according to the present invention forms the encirclement exposure light owing to be formed at the tabular surface and the minim gap between substrate of board member, therefore can on substrate, keep the stabilizing solution of desired state and soak the zone.Again,, therefore can suppress the expansion of liquid, prevent that liquid from spilling etc. owing to form the inclined-plane in the outside of this tabular surface.
The 6th invention according to the present invention; A kind of exposure method is provided; Be to see through optical component (LS1) exposure light (EL) to be shone in substrate (P), so that substrate (P) exposure is characterized in that: be that substrate (P) is configured to end face (T1) subtend with optical component (LS1) with liquid (LQ); With liquid be supplied to the board member (172D) of the light path that is configured to surround exposure light (EL) between optical component end face (T1) and substrate (P) simultaneously, and optical component end face (T1) between space (G2), be full of with liquid between the another side and this substrate of space and this board member between optical component end face (T1) and the substrate (P); With with the parallel mode of the supply of this liquid from being configured to recovery mouth (22) withdrawal liquid (LQ) with substrate (P) subtend, form liquid with the part on substrate (P) and soak zone (AR2); A part that sees through on substrate forms the liquid (LQ) that liquid soaks zone (AR2), exposure light is shone in this substrate, so that substrate (P) exposure.
The exposure method of the 6th invention according to the present invention forms the encirclement exposure light owing to be formed at the tabular surface and the minim gap between substrate of board member, therefore can on substrate, keep the stabilizing solution of desired state and soak the zone.Because liquid is supplied to the space between the end face of board member and optical system, so soaks the zone in the liquid of the light path that is formed on exposure light and be difficult to produce bubble or gap again.
The 7th invents according to the present invention, provides the manufacturing method of the exposure device (EX) that uses the foregoing description.
Even the 7th invention because when making the sweep velocity high speed, also can be soaked zone maintenance under the state of desired state at the liquid with liquid according to the present invention, carries out exposure-processed well, therefore can with the high efficiency manufacturing have desired the element of performance.
According to the 8th invention of the present invention, a kind of nozzle member (70,70 ' of ring-type is provided; 70 "); be used for seeing through liquid (LQ) and will shine from the exposure light (EL) of optical system (PL) in substrate (P), with exposure device with this substrate (P) exposure this nozzle member (70,70 '; 70 ") be configured to surround this optical system (PL) leading section optical element (LS1) on every side; It is characterized in that possessing: board member (172D), have with and the mode of the parallel subtend of this substrate (P) be disposed between this substrate (P) and this optical system end face (T1) and be configured to surround the tabular surface (75) of the light path of this exposure light (EL); Supply opening (12) is supplied this liquid (LQ); And liquids recovery mouth (22), the light path of this exposure light (EL) is disposed at the position that the tabular surface (75) than this board member (172D) leaves and is configured to and this substrate (P) subtend relatively, is used for reclaiming the liquid (LQ) from this supply opening (12) supply.
According to the 9th invention of the present invention; A kind of exposure method is provided; Be to see through optical component (LS1) exposure light (EL) to be shone in substrate (P), so that this substrate (P) exposure is characterized in that with liquid (LQ); Comprise: (P) is configured to substrate, and between the end face (T1) of this optical component (LS1) and this substrate (P), is configured to surround the action of one side subtend of board member (172D) of the light path of this exposure light (EL); From a supply opening (12) supply fluid (LQ), so that liquid (LQ) is full of the action of light path of end face (T1) and this exposure light (EL) between this substrate (P) of this optical component (LS1); With the supply of this liquid (LQ) concurrently, from being configured to the action with recovery mouth (22) withdrawal liquid (LQ) of this substrate (P) subtend; The supply through carrying out this liquid (LQ) and the recovery of this liquid (LQ) see through the liquid (LQ) that the liquid that is formed on the last branch of this substrate (P) soaks zone (AR2) exposure light (EL) are shone on this substrate (P), so that the action of this substrate (P) exposure.
Description of drawings
Fig. 1 is the summary pie graph that shows the 1st example of exposure device of the present invention.
Fig. 2 is near the approximate three-dimensional map of nozzle member that shows the 1st example.
Fig. 3 is a stereographic map of observing the nozzle member of the 1st example from downside.
Fig. 4 is near the side cross-sectional, view of nozzle member that shows the 1st example.
Fig. 5 is the summary pie graph that shows an example of liquids recovery mechanism.
Fig. 6 is the synoptic diagram that is used for explaining the liquids recovery operating principle of liquids recovery mechanism.
Fig. 7 (a) and (b) be the synoptic diagram that is used for explaining the liquids recovery action of the 1st example.
It (b) is the synoptic diagram that shows the comparative example of liquids recovery action that Fig. 8 (a) reaches.
Fig. 9 is the synoptic diagram that shows the nozzle member of the 2nd example.
Figure 10 is the synoptic diagram that shows the nozzle member of the 3rd example.
Figure 11 is the synoptic diagram that shows the nozzle member of the 4th example.
Figure 12 is a stereographic map of observing the nozzle member of the 5th example from downside.
Figure 13 is near the approximate three-dimensional map of nozzle member that shows the 6th example.
Figure 14 is a stereographic map of observing the nozzle member of the 6th example from downside.
Figure 15 is near the side cross-sectional, view of nozzle member that shows the 6th example.
Figure 16 is the figure that is used for explaining the nozzle member effect of the 6th example.
Figure 17 is a stereographic map of observing the nozzle member of the 7th example from downside.
Figure 18 is near the side cross-sectional, view of nozzle member that shows the 7th example.
Figure 19 is near the approximate three-dimensional map of nozzle member that shows the 8th example.
Figure 20 is a stereographic map of observing the nozzle member of the 8th example from downside.
Figure 21 is near the side cross-sectional, view of nozzle member that shows the 8th example.
Figure 22 is near the side cross-sectional, view of nozzle member that shows the 8th example.
Figure 23 is the vertical view that shows the guide member of the 8th example.
Figure 24 is near the side cross-sectional, view of nozzle member that shows the 8th example.
Figure 25 is the vertical view that shows the guide member of the 9th example.
Figure 26 is the vertical view that shows the guide member of the 10th example.
Figure 27 is the vertical view that shows the guide member of the 11st example.
Figure 28 is the vertical view that shows the guide member of the 12nd example.
Figure 29 is the vertical view that shows the guide member of the 13rd example.
Figure 30 is the vertical view that shows the guide member of the 14th example.
Figure 31 is the vertical view that shows the guide member of the 15th example.
Figure 32 is the vertical view that shows the guide member of the 16th example.
Figure 33 is the process flow diagram that shows semiconductor element one manufacturing process example.
The main element symbol description
1 liquid dipping machine structure
2 inclined-planes
12 liquid supply ports
22 liquids recovery mouths
25 porous members
70,70 ', 70 " nozzle member
71D, 72D base plate (tabular component)
73 slot parts
73A, 74,74 ' peristome
75 tabular surfaces (par)
76 wall portions
The 130A exhausr port
135 suction devices (suction system)
The 140A liquid supply port
172D base plate (member, guide member)
181 the 1st guidance parts
181F, the 182F stream
182 the 2nd guidance parts
AR1 view field
AR2 liquid soaks the zone
The AX optical axis
The EL exposure light
The EX exposure device
G2 gap (space)
LQ liquid
The P substrate
The PL projection optical system
The T1 end face
Embodiment
Though below with reference to graphic explanation example of the present invention, the present invention is not limited to this.
The 1st example
Fig. 1 is the summary pie graph of the exposure device of this example of demonstration.Among Fig. 1, exposure device EX has: mask microscope carrier MST can keep mask M and mobile; Baseplate carrier PST can keep substrate P and mobile; Lamp optical system IL remains in the mask M of mask microscope carrier MST with exposure light EL illumination; Projection optical system PL will be with the pattern image projection of the mask M of exposure light EL illumination in the substrate P that remains on baseplate carrier PST; And control device CONT, plan as a whole the whole action of control exposure device EX.
The exposure device EX of this example is the liquid immersion exposure apparatus of a suitable immersion method, and it improves resolution and substantially amplify depth of focus in order to substantially to shorten exposure wavelength, and it possesses the liquid dipping machine structure 1 of supply fluid LQ and withdrawal liquid LQ.Liquid dipping machine structure 1 possesses the liquid organization of supply 10 and the liquids recovery mechanism 20 that liquid LQ that liquid organization of supply 10 is supplied reclaims that liquid LQ are supplied to the image planes side of projection optical system PL.Exposure device EX; At least the pattern image with mask M be needed on the substrate P during; At the last branch of substrate P that comprises the AR1 of view field of projection optical system PL (the liquid LQ that is supplied through liquid organization of supply 10 forms), form partly that the big and liquid little than substrate P soaks regional AR2 than the AR1 of view field.Particularly; Exposure device EX; Adopt a kind of local liquid to soak mode; It is in the optical element LS1 of the image planes side of projection optical system PL and be disposed at full of liquid LQ between the substrate P surface of this image planes side, and through making exposure light EL see through liquid LQ and the projection optical system PL between this projection optical system PL and substrate P and shining in substrate P through mask M, the pattern image projection exposure that makes mask M is in substrate P.Control device CONT be to use the both quantitative liquid LQ of liquid organization of supply 10 supplies to substrate P, and it was both quantitative to use liquids recovery mechanism 20 that the liquid LQ on the substrate P is reclaimed, and the local liquid that forms liquid LQ soaks regional AR2 on substrate P in view of the above.
In near the image planes side of projection optical system PL, particularly be near the optical element LS1 of image planes side end of projection optical system PL, dispose the nozzle member 70 after being specified in.Nozzle member 70 is an annular component, around it is arranged to surround projection optics element LS1 in substrate P (baseplate carrier PST) top.In this example, nozzle member 70 is for constituting the part of liquid dipping machine structure 1.
This example is to use scanning exposure apparatus (promptly scanning stepper) to explain as example as the situation of exposure device EX; This scanning exposure apparatus; Be to make on one side mask M and direction (in the other direction) the same moved further of substrate P toward the inequality each other of direction of scanning, one side will be formed at mask M pattern exposure in substrate P.Below in the explanation, will the direction consistent be made as with the optical axis AX of projection optical system PL Z-direction, will be in perpendicular to the plane of Z-direction mask M and the synchronization-moving direction of substrate P (direction of scanning) be made as X-direction, will be made as Y direction perpendicular to the direction (non-direction of scanning) of Z-direction and X-direction.To be made as θ X, θ Y and θ Z direction respectively around X axle, Y axle and the axial rotation of Z (inclination) direction again.
Exposure device EX possesses: be located at ground base BP and be located at the principal post frame 9 on this base BP.Be formed with outstanding to the inside upper lateral section portion 7 and lower lateral section portion 8 in principal post frame 9.Lamp optical system IL is the mask M that is supported by mask microscope carrier MST with exposure light EL illumination, and it is supported by the framework that is fixed in principal post frame 9 tops 3.
Lamp optical system IL has: exposure light source, make the illumination homogenization of the exposure light EL that penetrates from exposure light source optical integrator, make collector lens from the exposure light EL optically focused of optical integrator, relay lens system, the field of illumination on the formed mask M of exposure light EL set for the variable field-of-view grating of slit-shaped etc.Set field of illumination on the mask M is to throw light on the exposure light EL of homogeneous Illumination Distribution through lamp optical system IL.As the exposure light EL that penetrates from lamp optical system IL, for example use the bright line (g line, h line, i line) and the KrF PRK extreme ultraviolet lights (DUV light) such as (wavelength 248nm) that penetrate from mercury vapor lamp, or ArF PRK (wavelength 193nm) and F 2Laser (wavelength 157nm) equal vacuum ultraviolet light (VUV light) etc.This example is to use the ArF PRK.
In this example, use pure water to be used as liquid.Pure water not only can make also transmissive of ArF PRK, for example also can make bright line (g line, h line, i line) and extreme ultraviolet light (DUV light) transmissions such as (wavelength 248nm) of KrF PRK penetrated from mercury vapor lamp.
Mask microscope carrier MST can keep mask M and mobile.Mask microscope carrier MST keeps mask M through for example vacuum suction (or Electrostatic Absorption) mode.Below mask microscope carrier MST, be provided with the air bearing (air bearing) 85 of a plurality of non-contact bearings.Mask microscope carrier MST is supported in above the mask bed 4 (guiding face) with the noncontact mode through air bearing 85.In the central portion of mask microscope carrier MST and mask bed 4, be formed with the peristome MK1 that the pattern image that makes mask M is passed through respectively, MK2.Mask bed 4 sees through the upper lateral section portion 7 that antihunting device 86 is supported in principal post frame 9.Also promptly, mask microscope carrier MST sees through antihunting device 86 and mask bed 4 and is supported in principal post frame 9 (upper lateral section portion 7).Again,, mask bed 4 is separated in vibration with principal post frame 9, can make the vibration of principal post frame 9 can not be conveyed to the mask bed 4 that supports mask microscope carrier MST through antihunting device 86.
Mask microscope carrier MST; Through the mask microscope carrier drive unit MSTD that comprises linear motor etc. that driving control device CONT controlled; And can be under the state that keeps mask M; On mask bed 4 in the plane vertical with the optical axis AX of projection optical system PL, also be in the XY plane, carry out 2 dimensions and move and rotate on a little θ Z direction.Mask microscope carrier MST can be displaced into X-direction with the sweep velocity of appointment, and has the X-direction shift motion that mask M can cross the optical axis AX of projection optical system PL comprehensively at least.
On mask microscope carrier MST, be provided with the moving lens 81 that moves with mask microscope carrier MST.In position laser interferometer 82 is set with moving lens 81 subtends again.The 2 dimension direction positions of mask M on the mask microscope carrier MST and the rotation angle (looking the rotation angle that the situation difference also comprises θ X, θ Y direction sometimes) of θ Z direction are to measure with real-time mode through laser interferometer 82.The measurement result of laser interferometer 82 exports control device CONT to.Control device CONT, promptly the measurement result according to laser interferometer 82 drives mask microscope carrier drive unit MSTD, remains in the position control of the mask M of mask microscope carrier MST in view of the above.
Projection optical system PL is exposed to substrate P with set projection multiplying power β with the graphic pattern projection of mask M, is made up of a plurality of optical elements (comprising the optical element LS1 that is located at substrate P side leading section), and these optical elements support with lens barrel PK.In this example, projection optical system PL for example is 1/4,1/5 or 1/8 reduction system for projection multiplying power β.In addition, projection optical system PL such as also can be at any one of times system and amplification system.Again, projection optical system PL also can be the reflected refraction system that comprises refracting element and reflecting element, does not comprise the dioptric system of reflecting element, does not comprise any one of reflecting system of refracting element.Again, the optical element LS1 of the projection optical system PL leading section of this example exposes from lens barrel PK, and the liquid LQ that liquid soaks regional AR2 promptly is contacted with this optical element LS1.
Lens barrel PK periphery in keeping projection optical system PL is provided with bead PF, and projection optical system PL sees through this bead PF and is supported in lens barrel platform 5.Lens barrel platform 5 is supported in the lower lateral section portion 8 of principal post frame 9 through antihunting device 87.Also promptly, projection optical system PL sees through antihunting device 87 and lens barrel platform 5 and is supported in principal post frame 9 (lower lateral section portion 8).Again,, lens barrel platform 5 is separated with principal post frame 9 in vibration, can make the vibration of principal post frame 9 can not be conveyed to the lens barrel platform 5 of support projection optical system PL through antihunting device 87.
Baseplate carrier PST can support the substrate that keeps substrate P and keep tool PH and mobile, waits through for example vacuum suction mode to keep substrate P.Below baseplate carrier PST, be provided with the air bearing 88 of a plurality of non-contact bearings.Baseplate carrier PST is supported in above the substrate platform 6 (guiding face) with the noncontact mode through air bearing 88.Substrate platform 6 sees through antihunting device 89 and is supported on the base BP.Again,, substrate platform 6 is separated with principal post frame 9 and base BP (floor) in vibration, can make the vibration of base BP (floor) or principal post frame 9 can not be conveyed to the substrate platform 6 of supporting substrate microscope carrier PST through antihunting device 89.
Baseplate carrier PST; Through the baseplate carrier drive unit PSTD that comprises linear motor etc. that driving control device CONT controlled; And can see through substrate maintenance tool PH under the state of maintenance substrate P, carry out 2 dimensions in the XY plane on substrate platform 6 and move and rotate on a little θ Z direction.Further, baseplate carrier PST is also removable in Z-direction, θ directions X and θ Y direction.
On baseplate carrier PST, be provided with the moving lens 83 that moves relative to projection optical system PL with baseplate carrier PST.Be provided with laser interferometer 84 in position with moving lens 83 subtends again.Substrate P on the baseplate carrier PST is to measure with real-time mode through laser interferometer 84 in the position and the rotation angle of 2 dimension directions.Again, though not shown, exposure device EX possesses focus, leveling detection system, and it is supported in the surface position information of the substrate P of baseplate carrier PST in order to detection.As focus, leveling detection system, can adopt from tilted direction and will detect rayed in the oblique incidence mode on substrate P surface, also can adopt the mode etc. of static capacity type sensor.Focus, leveling detection system are to see through liquid LQ or through under the state of liquid LQ, detect positional information and the θ X of substrate P and the inclination information of θ Y direction of the Z-direction on substrate P surface.When being when not seeing through the focusing leveling detection system of the surface information that detects the substrate P surface under the state of liquid LQ, also at the surperficial surface information of the position probing substrate P of leaving projection optical system PL.Exposure device at the surperficial surface information of the position probing substrate P of leaving projection optical system PL; For example be disclosed in United States Patent (USP) the 6th; 674; No. 510, in the scope that the state decree of the appointment of border application case or selection is allowed home, quote the part of the record content of the document as this paper record.
The measurement result of laser interferometer 84 exports control device CONT to.The testing result of focus, leveling detection system also exports control device CONT to.Control device CONT; Testing result driving substrate microscope carrier drive unit PSTD according to focus, leveling detection system; Focal position and pitch angle through control basal plate P make the substrate P surface consistent with the image planes of projection optical system PL; And, carry out the X-direction of substrate P and the position control of Y direction according to the measurement result of laser interferometer 84.
Be provided with recess 90 in baseplate carrier PST, keep tool PH promptly to be disposed at recess 90 in order to the substrate that keeps substrate P.Again, top 91 among the baseplate carrier PST except recess 90, be one with remain in substrate and keep the tabular surface (par) of the roughly the same height in substrate P surface (high) of tool PH with one side.Again, in this example, moving lens 83 top also is arranged to top 91 high with one side for roughly with baseplate carrier PST.
Owing to will roughly be located at around the substrate P with the substrate P surface with one side high top 91; Therefore even when the fringe region of substrate P being carried out immersion exposure; Almost the section of not having is poor because in the outside, edge of substrate P; Therefore can liquid LQ be remained in the image planes side of projection optical system PL, form liquid well and soak regional AR1.Again; The edge part of substrate P and be located at tabular surface around this substrate P (above) though 91 the gap about 0.1～2mm is arranged; But the surface tension through liquid LQ makes liquid LQ can flow into this gap hardly; Even when making public near the periphery to substrate P, also can liquid LQ be remained under the projection optical system PL through top 91.
The liquid organization of supply 10 of liquid dipping machine structure 1, in order to liquid LQ is supplied to the image planes side of projection optical system PL, it possesses: can see the liquid supply department 11 of liquid LQ and the supply pipe 13 that the one of which end is connected in liquid supply department 11 off.The other end of supply pipe 13 is connected in nozzle member 70.In this example, liquid organization of supply 10 is supply pure water, and liquid supply department 11 possesses the register of Water Purifiers and adjustment liquid (pure water) the LQ temperature of being supplied etc.In addition, as long as can satisfy set condition of water quality, can Water Purifiers be located at exposure device EX yet, and be to use the Water Purifiers (force application apparatus) in the factory that disposes exposure device EX.Can the register of adjustment liquid (pure water) LQ temperature be located at exposure device EX yet, and use the equipment in the factory to substitute again.The action of liquid organization of supply 10 (liquid supply department 11) is to be controlled by control device CONT.Be formed on the substrate P for liquid being soaked regional AR2, liquid organization of supply 10 is under the control of control device CONT, and both quantitative liquid LQ is supplied on the substrate P that is configured in projection optical system PL image planes side.
Again, in supply pipe 13 ways, be provided with the flow controller 16 that is called mass flow controller, it delivers to the amount of liquid of the per unit time of projection optical system PL image planes side from liquid supply department 11 in order to control.The control of the liquid supply of flow controller 16 is that the instruction signal according to control device CONT carries out.
The liquids recovery mechanism 20 of liquid dipping machine structure 1, in order to the liquid LQ of the image planes side that reclaims projection optical system PL, it possesses liquids recovery portion 21 that can withdrawal liquid LQ and the recovery tube 23 that the one of which end is connected in liquids recovery portion 21.The other end of recovery tube 23 then is connected in nozzle member 70.Liquids recovery portion 21 for example possesses: the groove of vacuum pump equal vacuum system (suction device) and gas-liquid separator that the liquid LQ that is reclaimed is separated from the gas, the liquid LQ that reclaims in order to the collecting post etc.In addition, can vacuum system, gas-liquid separator, groove etc. all be located at exposure device EX yet, and use the equipment in the factory that disposes exposure device EX to substitute its at least a portion.The action of liquids recovery mechanism 20 (liquids recovery portion 21) is to be controlled by control device CONT.Be formed on the substrate P for liquid being soaked regional AR2, liquids recovery mechanism 20 is under the control of control device CONT, and the liquid LQ on the substrate P that liquid organization of supply 10 is supplied reclaims both quantitative.
Nozzle member 70 is kept tool 92 to keep by nozzle, and this nozzle keeps tool 92 to be connected in the lower lateral section portion 8 of principal post frame 9.See through nozzle keep tool 92 keep nozzle members 70 principal post frame 9, with the lens barrel platform 5 of the lens barrel PK that sees through bead PF support projection optical system PL, see through antihunting device 87 and in vibration, separate.In view of the above, can prevent to be conveyed to projection optical system PL in the vibration that nozzle member 70 produces.Again, see through nozzle keep tool 92 support nozzle members 70 principal post frame 9, with the substrate platform 6 of supporting substrate microscope carrier PST, see through antihunting device 89 and in vibration, separate.In view of the above, can prevent that the vibration that produces at nozzle member 70 from seeing through principal post frame 9 and base BP and being conveyed to baseplate carrier PST.Again, see through nozzle keep tool 92 support nozzle members 70 principal post frame 9, with the mask bed 4 that supports mask microscope carrier MST, see through antihunting device 86 and in vibration, separate.In view of the above, can prevent that the vibration that nozzle member 70 produces is conveyed to mask microscope carrier MST through principal post frame 9.
Secondly, with reference to Fig. 2,3 and 4 explanation liquid dipping machine structures 1 and constitute the nozzle member 70 of this liquid dipping machine structure 1 part.Fig. 2 is near the part of the approximate three-dimensional map the demonstration nozzle member 70 is blocked figure, Fig. 3 is side cross-sectional, view for stereographic map, the Fig. 4 that observes nozzle member 70 from downside.
Nozzle member 70 is disposed near the optical element LS1 of image planes side leading section of projection optical system PL, is a annular component around being configured to surround projection optical system PL in substrate P (baseplate carrier PST) top.Has the 70H of hole portion that can dispose projection optical system PL (optical element LS1) in nozzle member 70 central portions.Between the side of the optical element LS1 of the medial surface of the hole of nozzle member 70 70H of and projection optical system PL, be provided with the gap.This gap, be for the optical element LS1 and the nozzle member 70 that in vibration, separate projection optical system PL set.In view of the above, can prevent directly to be conveyed to projection optical system PL (optical element LS1) in the vibration that nozzle member 70 produces.
In addition, the 70H of the hole portion medial surface of nozzle member 70 has liquid repellency (water-repellancy) to liquid LQ, can suppress the gap that liquid infiltrates projection optical system PL side and nozzle member 70 medial surfaces.
Below nozzle member 70, be formed with in order to the liquid supply port 12 of supply fluid LQ and in order to the liquids recovery mouth 22 of withdrawal liquid LQ.In nozzle member 70 inside, be formed with supply stream 14 that is connected in liquid supply port 12 and the recovery stream 24 that connects liquids recovery mouth 22 again.Again, connect supply pipe 13 other ends, connect recovery tube 23 other ends in reclaiming stream 24 in supply stream 14.Liquid supply port 12, supply stream 14 and supply pipe 13 are the parts that constitute liquid organization of supply 10, and liquids recovery mouth 22, recovery stream 24 and recovery tube 23 are the parts that constitute liquids recovery mechanism 20.
Liquid supply port 12 is above by baseplate carrier PST substrate supported P, is arranged to and this substrate P surface subtend.Liquid supply port 12 and substrate P surface are across both set a distances.Liquid supply port 12 is configured to surround the AR1 of view field of the projection optical system PL that exposure light EL shone.In this example, liquid supply port 12 forms the narrow annular channel shape that surrounds the AR1 of view field below nozzle member 70.Again, in this example, the AR1 of view field is the rectangle of long side direction for setting for Y direction (non-direction of scanning).
Supply stream 14 possesses the buffering stream 14H of portion that its part is connected in the other end of supply pipe 13; With and the upper end be connected in the inclination stream 14S of portion that the buffering stream 14H of portion, bottom are connected in liquid supply port 12.The inclination stream 14S of portion has the shape of corresponding liquid supply port 12, and its cross section along the XY plane forms the narrow annular channel shape that surrounds optical element LS1.The inclination stream 14S of portion has and is disposed at its inboard corresponding angle of inclination, optical element LS1 side, looks it from side cross-sectional, form when the distance of the optical axis AX of itself and projection optical system PL longer then big more with the interval on substrate P surface.
The buffering stream 14H of portion is arranged at its outside with the mode of surrounding inclination stream portion 14S upper end, is one to form along the spatial portion of XY direction (horizontal direction) expansion.The buffering stream 14H of portion inboard (optical axis AX side) is connected with inclination stream portion 14S upper end, and its connecting portion is a crooked bight 17.Again, near its connecting portion (bending angle) 17, particularly be the zone, inboard (optical axis AX side) of the buffering stream 14H of portion, be provided with the dyke portion 15 that surrounds inclination stream portion 14S upper end that forms.Dyke portion 15, be arranged to from the buffer stream road portion 14H bottom surface past+the Z direction is outstanding.Through dyke portion 15, form and cushion the narrow 14N of narrow flow path portion of the 14H of stream portion.
In this example, nozzle member 70 is that the 1st member 71 and the 2nd member 72 are made up and form.1st, 2 members 71,72 for example can form through aluminium, titanium, stainless steel, duralumin (duralumin) or the two the alloy that contains at least in above-mentioned.
The 1st member 71; Have: side plate 71A, its outboard end are connected in the base plate 71D (with reference to Fig. 3) that top plate portion 71B, its upper end of both allocations on side plate 71A top are connected in the inclination board 71C of top plate portion 71B medial end and are connected in inclination board 71C bottom, and above-mentioned each board is engaged with each other and is integral.The 2nd member 72; Have: its outboard end is connected in the base plate 72D that top plate portion 72B, its upper end of the 1st member 71 upper ends are connected in the inclination board 72C of top plate portion 72B medial end and are connected in inclination board 72C bottom, and above-mentioned each board is engaged with each other and is integral.Again, the top plate portion 71B with the 1st member 71 forms the bottom surface of the buffering stream 14H of portion, below the top plate portion 72B of the 2nd member 72, forms the end face that cushions the stream 14H of portion.Again, the end face that form the bottom surface of the inclination stream 14S of portion with (towards the face of optical element LS1) above the inclination board 71C of the 1st member 71, (with the face of optical element 1 opposition side) forms the inclination stream 14S of portion below the inclination board 72C of the 2nd member 72.The inclination board 72C of the inclination board 71C of the 1st member 71 and the 2nd member 72 forms the mortar shape respectively.Form slit-shaped supply stream 14 through making up above-mentioned the 1st, the 2nd member 71,72.Again, the buffering stream 14H of the portion outside by the sealing of the side plate 71A upper area of the 1st member 71, is the side subtend with optical element LS1 above the inclination board 72C of the 2nd member 72.
Liquids recovery mouth 22 is above the substrate P that is supported in baseplate carrier PST, is arranged to and this substrate P surface subtend.Liquids recovery mouth 22 and substrate P surface are across both set a distances.Liquids recovery mouth 22 is AR1 of view field of relative projection optical system PL, is arranged at liquid supply port 12 outsides with the mode of leaving from liquid supply port 12, and forms encirclement liquid supply port 12 and the AR1 of view field.Particularly; Side plate 71A, top plate portion 71B and inclination board 71C through the 1st member 71; Form the spatial portion 24 under shed, the aforementioned peristome through spatial portion 24 forms liquids recovery mouth 22, and forms through aforesaid space portion 24 and to reclaim streams 24.Be connected with the other end of recovery tube 23 in a part that reclaims stream (spatial portion) 24 again.
Dispose the porous member 25 in a plurality of holes of tool that cover this liquids recovery mouth 22 in liquids recovery mouth 22.Porous member 25 is netted (mesh) member formations by a plurality of holes of tool.As porous member 25, for example can constitute through the reticular component that forms honeycomb pattern (constituting) by hexagonal a plurality of hole roughly.Porous member 25 forms lamellar, for example for having the thickness about 100 μ m.
Porous member 25 can impose the processing of punchinging through the board member to the base material (by stainless steel formations such as (for example SUS316)) that constitutes porous member and form.Again, also can be in a plurality of lamellar porous members 25 of liquids recovery mouth 22 overlay configuration.Also can impose and be used for suppressing impurity and be dissolved in the surface treatment of liquid LQ or impose the surface treatment that is used for improving lyophily porous member 25 again.As this kind surface treatment, be to have to make chromium oxide be attached to the processing of porous member 25, " GOLDEP " of for example refreshing steel loop border countermeasure incorporated company handles or " GOLDEP WHITE " handles.Through imposing this kind surface treatment, and the impurity that can prevent porous member 25 is dissolved in bad situation such as liquid LQ and produces.Also can impose above-mentioned surface treatment to nozzle member 70 (the 1st, the 2nd member 71,72) again.The material (titanium etc.) that in addition, also can use impurity more can not be dissolved in liquid LQ forms porous member 25.
Nozzle member 70 is for overlooking square shape.As shown in Figure 3, liquids recovery mouth 22, be below nozzle member 70, form surround A1R of view field and liquid supply port 12 overlook frame shape (" mouth " font).Dispose laminal porous member 25 in this recovery mouth 22 again.Between liquids recovery mouth 22 (porous member 25) and liquid supply port 12, dispose the base plate 71D of the 1st member 71 again.Liquid supply port 12 is between the base plate 72D of the base plate 71D of the 1st member 71 and the 2nd member 72, to form the slit of overlooking ring-type.
In the nozzle member 70, each of base plate 71D, 72D and the face (following) of substrate P subtend are for being parallel to the tabular surface on XY plane.Also promptly, base plate 71D, 72D that nozzle member 70 is possessed are to have to form with the substrate supported P of baseplate carrier PST institute surface (XY plane) subtend and below the almost parallel of substrate P surface.Again, high for roughly below base plate 72D below the base plate 71D in this example with one side, and and the gap that is disposed between the substrate P surface of baseplate carrier PST be minimum part.In view of the above, can liquid LQ be remained on below base plate 71D, the 72D well and between the substrate P, soaks regional AR1 to form liquid.Below in the explanation, will form, suitably and be called " tabular surface 75 " with substrate P surface subtend and below the base plate 71D of substrate P surface (XY plane) almost parallel, 72D (par).
Tabular surface 75 is the faces that are disposed in the nozzle member 70 near baseplate carrier PST institute substrate supported P position.And in this example; Because it is high for roughly below base plate 72D below the base plate 71D with one side; Therefore though with below the base plate 71D and be used as tabular surface 75 together below the base plate 72D; But also can be used as the liquids recovery mouth in the part configuration porous member 25 of configuration base plate 71D, at this moment, it is tabular surface 75 that the following of base plate 72D only arranged.
Porous member 25 has and following 2 of the substrate P subtend that is supported in baseplate carrier PST.Again, porous member 25 is that the mode that 2 pairs are supported in baseplate carrier PST below it substrate P surface (also being the XY plane) is inclination is located at liquids recovery mouth 22.Also promptly, be located at the porous member 25 of liquids recovery mouth 22, have inclined-plane (following) 2 with the substrate P surface subtend that is supported in baseplate carrier PST.Liquid LQ is recovered through the inclined-plane 2 of the porous member 25 that is disposed at liquids recovery mouth 22.Therefore, liquids recovery mouth 22 is formed at inclined-plane 2.In other words, in this example, the function of the whole performance in inclined-plane liquids recovery mouth 22.Again, liquids recovery mouth 22 owing to be to form to surround the AR1 of view field that exposure light EL is shone, therefore is disposed at the inclined-plane 2 of the porous member 25 of this liquids recovery mouth 22, forms and surrounds the AR1 of view field.
Form with the inclined-plane 2 of the porous member 25 of substrate P subtend, when the distance of the optical axis AX of itself and projection optical system PL (optical element LS1) longer then big more with the interval on substrate P surface.As shown in Figure 3, in this example, liquids recovery mouth 22 forms to overlook and is " mouth " font, and makes up 4 pieces of porous member 25A～25D and be disposed at this liquids recovery mouth 22.Wherein, the X-direction (direction of scanning) of the AR1 of view field is disposed at porous member 25A, the 25C of both sides respectively relatively, is configured to its surface and XZ plane and longer then big more with the interval on substrate P surface with the distance of optical axis AX.Again, the AR1 of view field is disposed at porous member 25B, the 25D of Y direction both sides respectively relatively, is configured to its surface and YZ plane and longer then big more with the interval on substrate P surface with the distance of optical axis AX.
Following 2 of the porous member 25 on XY plane pitch angle is behind the stickiness of consideration liquid LQ or the liquid LQ contact angle on substrate P surface etc., to be set between 3～20 degree relatively.In addition, in this example, this pitch angle is set in 7 degree.
Be connected in below the base plate 71D of inclination board 71C bottom of the 1st member 71 and side plate 71A bottom, be disposed in the roughly the same position of Z-direction (highly).Again, porous member 25, be below the inner edge portion and base plate 71D on its inclined-plane 2 (tabular surface 75) for roughly with high mode and below the inner edge portion and base plate 71D on inclined-plane 2 (tabular surface 75) continuous mode, be installed on the liquids recovery mouth 22 of nozzle member 70.Also promptly, tabular surface 75 is that inclined-plane 2 with porous member 25 forms continuously.Again, porous member 25 is configured to, when the distance of itself and optical axis AX longer then big more with the interval on substrate P surface.Again, the outer edge of 2 (porous members 25) outside in the inclined-plane is provided with a part of regional formed wall portion 76 by side plate 71A bottom.Wall portion 76 is arranged at its periphery with the mode of surrounding porous member 25 (inclined-plane 2), and its relative AR1 of view field is located at liquids recovery mouth 22 outsides, in order to suppress spilling of liquid LQ.
Forming the part of the base plate 72D of tabular surface 75, is to be disposed between the image planes side end face T1 and substrate P of optical element LS1 of projection optical system PL in Z-direction.Also promptly, the part of tabular surface 75 slips under following (end face) T1 of optical element LS1 of projection optical system PL.Again, the central portion at the base plate 72D that forms tabular surface 75 is formed with the peristome 74 that exposure light EL is passed through.Peristome 74 has the shape of the corresponding AR1 of view field, and in this example, forming with Y direction (non-direction of scanning) is the ellipticity of long side direction.Peristome 74 forms big than the AR1 of view field, the exposure light EL through projection optical system PL can not covered by base plate 72D, and can arrive on the substrate P.Also promptly, at least a portion of tabular surface 75 is in the position of the light path that does not hinder exposure light EL, under the end face T1 that is configured to surround the light path of exposure light EL and slip into projection optical system PL.In other words, at least a portion of tabular surface 75 is between the end face T1 of the image planes side of projection optical system PL and substrate P, to be configured to surround the AR1 of view field.Again, base plate 72D is to be that tabular surface 75 is configured to and substrate P surface subtend below it, and is arranged to not contact with following T1 and the substrate P of optical element LS1.In addition, the edge part 74E of peristome 74 is rectangular-shaped, or forms acute angle or circular-arc and all can.
Again, tabular surface 75 is disposed at the AR1 of view field and is disposed at 2 on the inclined-plane of the porous member 25 of liquids recovery mouth 22.Liquids recovery mouth 22 is that the relative AR1 of view field is in tabular surface 75 outsides and be configured to surround tabular surface 75.Also promptly, liquids recovery mouth 22 is to become to surround tabular surface in the position configuration of more leaving the exposure light light path than tabular surface 75.Again, liquid supply port 12, also the AR1 of view field is disposed at tabular surface 75 outsides relatively.Liquid supply port 12; Be located at 22 in the AR1 of view field and the liquids recovery mouth of projection optical system PL; In order to form the liquid LQ that liquid soaks regional AR2, be to see through 22 in the AR1 of view field and the liquids recovery mouth that liquid supply port 12 is provided to projection optical system PL.In addition, number, position and the shape of liquid supply port 12 and liquids recovery mouth 22, it is said to be not limited to this example, gets final product so long as can liquid be soaked the formation that regional AR2 is maintained at desired state.For example, liquids recovery mouth 22 also can be configured to not surround tabular surface 75.At this moment, also can be with liquids recovery mouth 22, only be located in nozzle member 70 following the set zone of the both sides, direction of scanning (directions X) of the AR1 of view field relatively or only be located at the set zone of the both sides, non-direction of scanning (Y direction) of the relative AR1 of view field.
As stated, tabular surface 75 is disposed between the following T1 and substrate P of optical element LS1, and the distance of the following T1 of substrate P surface and optical element LS1 is than the distance of substrate P surface with tabular surface 75.Also promptly, the following T1 of optical element LS1 is to be formed at the position high than tabular surface 75 (substrate P is for far away relatively).In this example, the following T1 of optical element LS1 and the distance of substrate P are about 3mm, and the distance of tabular surface 75 and substrate P is about 1mm.Again, tabular surface 75 is contacted with the liquid LQ that liquid soaks regional AR2, and the following T1 of optical element LS1 also is contacted with the liquid LQ that liquid soaks regional AR2.Also promptly, tabular surface 75 and below T1, for soaking the liquid contact surface that the liquid LQ of regional AR2 contacts with liquid.
The liquid contact surface T1 of the optical element LS1 of projection optical system PL has lyophily (water wettability).In this example, be that liquid contact surface T1 is imposed the lyophily processing, make the liquid contact surface T1 tool lyophily of optical element LS1 through this lyophily processing.Also tabular surface 75 is imposed the lyophily processing and has lyophily again.In addition, also can impose group liquefaction processing and make it have liquid repellency tabular surface 75 parts (for example, below the base plate 71D).Certainly, as stated, also can form the 1st member 71 and the 2nd member, make tabular surface 75 tool lyophilies with the lyophily material.
As using so that the lyophily processing of the set member tool lyophilies such as liquid contact surface T1 of optical element LS1 for example can be enumerated and make MgF 2, Al 2O 3, SiO 2The processing of adhering to Deng the lyophily material.Perhaps, because the liquid LQ of this example is the bigger water of polarity,, for example can form film, to give lyophily (water wettability) with the bigger molecular structure material of polarity that alcohol etc. has an OH base therefore as lyophily processing (hydrophilicity-imparting treatment).Again; Through forming optical element LS1, because the compatibility of these fluorites or quartzy and water is high, even therefore do not impose the lyophily processing with fluorite or quartz; Also can obtain good lyophily, and the liquid contact surface T1 of liquid LQ and optical element LS1 roughly is close to comprehensively.
Again; As making tabular surface 75 parts have the liquefaction processing of dialling of liquid repellency, for example can enumerate the processing that liquid repellency materials such as gathering tetrafluoroethylene fluorine series plastics materials such as (Teflon (registered trade marks)), oleic series resin material or silicon series plastics material is adhered to etc.Again; Through making top 91 of baseplate carrier PST have liquid repellency; In immersion exposure, flow out the substrate P outside (above 91 outsides) and can suppress liquid LQ, and behind immersion exposure also withdrawal liquid LQ sleekly, prevent that liquid LQ from residuing in top 91 bad situation.
For liquid LQ is supplied on the substrate P, control device CONT drives liquid supply department 11 liquid LQ is seen off from liquid supply department 11.The liquid LQ that sees off from liquid supply department 11 behind the supply pipe 13 of flowing through, promptly flows into the buffering stream 14H of portion in the supply stream 14 of nozzle member 70.The buffering stream 14H of portion is the spatial portion of along continuous straight runs expansion, and the mode that the liquid LQ that makes inflow cushion the stream 14H of portion expands with along continuous straight runs flows.Because the zone, inboard (optical axis AX side) at the stream downstream side that cushions the stream 14H of portion is formed with dyke portion 15, so liquid LQ can temporarily be stored in this expanding after 14 whole districts of buffering stream portion.Then, when liquid LQ is stored to both quantitatively above back (liquid level of liquid LQ be higher than the height of dyke portion 15 after) at the buffering stream 14H of portion, promptly through the 14N of the narrow flow path portion inflow inclination stream 14S of portion.Flow into the liquid LQ of the inclination stream 14S of portion, promptly flow to the below, and be supplied on the substrate P that is disposed at projection optical system PL image planes side through liquid supply port 12 along the inclination stream 14S of portion.Liquid supply port 12 is supplied to liquid LQ on the substrate P from the substrate P top.
So, through dyke portion 15 is set, make the liquid LQ that the 14H of portion flows out from the buffer stream road, the whole district roughly is supplied on the substrate P equably from liquid supply port 12 (mode to surround the AR1 of view field forms ring-type).Also be; If do not form dyke portion 15 (14N of narrow flow path portion); Flow in the flow of the liquid LQ of the inclination stream 14S of portion; Near the connecting portion of supply pipe 13 and the buffering stream 14H of portion zone can be many than other zone, therefore in the liquid supply port that forms ring-type 12 each position, and promptly can heterogeneity to the liquid supply on the substrate P.But; Because being set, the 14N of narrow flow path portion forms the buffering stream 14H of portion; Behind the liquid LQ when both be stored to quantitatively in this buffering stream 14H of portion more than; Just begin liquid is supplied to liquid supply port 12, therefore can be under the state of flow distribution that makes liquid supply port 12 each position or velocity flow profile homogeneous, LQ is supplied on the substrate P with liquid.Here; Near though entrapped air pockets such as when for example beginning to supply the easily crooked bight 17 of supply stream 14; But form the 14N of narrow flow path portion through dwindling near these crooked bight 17 supply streams 14; And the flow velocity that can make the liquid LQ that flows in the 14N of narrow flow path portion more at a high speed, through flowing of this liquid LQ at a high speed, can bubble be seen through liquid supply port 12 and be expelled to supply stream 14 outsides.Then, through after discharging bubble, carrying out the immersion exposure action, carry out exposure-processed and can under bubble-free state, soak regional AR2 in liquid.In addition, dyke portion 15, the end face that also can be arranged to the 14H of portion from the buffer stream road is past-and the Z direction is outstanding.Its emphasis will cushion the stream downstream that the narrow 14N of narrow flow path portion of the 14H of stream portion is located at the buffering stream 14H of portion as long as be.
In addition, also can part dyke portion 15 be made lower (higher).Through in dyke portion 15 the different zone of part height being set in advance, forming liquid and soak in the liquid of regional AR2 and can prevent when beginning supply fluid LQ that gas (bubble) residues in.Again, also can the buffering stream 14H of portion be divided into many streams, come the position of corresponding slit-shaped liquid supply port 12 to supply the liquid LQ of different amount.
Again, for reclaiming the liquid LQ on the substrate P, control device CONT drives liquids recovery portion 21.Through the liquids recovery portion 21 that driving has vacuum system, the liquid LQ on the substrate P promptly sees through the liquids recovery mouth 22 that disposes porous member 25 and flows into recovery stream 24.When recovery liquid soaked the liquid LQ of regional AR2, this liquid LQ was contacted with following (inclined-plane) 2 of porous member 25.Because liquids recovery mouth 22 (porous member 25) is to be arranged to and the substrate P subtend in the substrate P top, therefore is to reclaim the liquid LQ on the substrate P from the top.Flow into the liquid LQ that reclaims stream 24, behind the recovery tube 23 of flowing through, be recovered to liquids recovery portion 21.
Fig. 5 is the figure that shows liquids recovery portion 21 1 examples.Among Fig. 5, liquids recovery portion 21 possesses: accumulator tank 26 is connected in an end of recovery tube 23; Vacuum pump (vacuum system) 27 sees through pipe arrangement 27K and is connected in accumulator tank 26; Positive displacement pump (unwatering pump) 29 sees through pipe arrangement 29K and is connected in accumulator tank 26; And liquid level sensor (level sensor) 28, be located at accumulator tank 26 inboards.Recovery tube 23 1 ends are connected in accumulator tank 26 tops.Again, the one of which end is connected in the other end of the pipe arrangement 27K of vacuum pump 27, is connected in accumulator tank 26 tops.Again, the one of which end is connected in the other end of the pipe arrangement 29K of positive displacement pump 29, is connected in accumulator tank 26 bottoms.Through driving vacuum pump 27, and liquid LQ is reclaimed and is contained in accumulator tank 26 through the liquids recovery mouth 22 of nozzle member 70.Through driving positive displacement pump 29, the liquid LQ that will be contained in accumulator tank 26 sees through pipe arrangement 29K and is expelled to the outside.The action of vacuum pump 26 and positive displacement pump 29 is controlled device CONT control.Liquid level sensor 28 is measured the liquid level (water level) of the liquid LQ that is contained in accumulator tank 26, and the result exports control device CONT to its instrumentation.Control device CONT, according to the output of liquid sensor 28, the liquid level (water level) that the attractive force (draining power) of positive displacement pump 29 is adjusted to the liquid LQ that is contained in accumulator tank 26 is roughly necessarily.Control device CONT and since can will be contained in the liquid level (water level) of the liquid LQ of accumulator tank 26 be maintained at roughly necessarily, therefore can make the pressure stability in the accumulator tank 26.In view of the above, can make that to reclaim power (attractive force) through the liquid LQ of liquids recovery mouth 22 stable.In addition; In example shown in Figure 5; Tapping valve also can be set substitute positive displacement pump 29, and carry out the switching adjustment of tapping valve or the bore adjustment of escape hole etc., be maintained at roughly certain with liquid level with the liquid LQ in the accumulator tank 26 according to the output of liquid level sensor 28.
Recovery method one example of the liquids recovery mechanism 20 of this example then, is described.In addition, this example is that this recovery method is called the bubbling point method.Liquids recovery mechanism 20 is to use this bubbling point method only from reclaiming mouthful 22 withdrawal liquid LQ, and the vibration that can suppress in view of the above to cause because of liquids recovery produces.
Below, with reference to the liquids recovery operating principle of the liquids recovery mechanism 20 of this example of schematic view illustrating of Fig. 6.Recovery mouth 22 in liquids recovery mechanism 20 disposes porous member 25.As porous member, for example can use the lamellar reticular component that is formed with most holes.The bubbling point method is under the moistening state of porous member 25, the top and following pressure differential of porous member 25 is controlled to states established condition after satisfying, and comes from the hole of porous member 25 only withdrawal liquid LQ in view of the above.As the parameter of the condition of bubbling point method, can enumerate aperture, the porous member 25 and the contact angle (compatibility) of liquid LQ and the attractive force of liquids recovery portion 21 (pressure above the porous member 25) etc. of porous member 25.
Fig. 6 is the partial cross section enlarged drawing of porous member 25, is the concrete example that shows the liquids recovery of carrying out through porous member 25.Under porous member 25, dispose substrate P, between porous member 25 and substrate P, be formed with the gas space and fluid space.More specifically, between the 1st hole 25Ha of porous member 25 and substrate P, be formed with the gas space, between the 2nd hole 25Hb of porous member 25 and substrate P, then be formed with fluid space.This kind situation for example is the end generation of soaking regional AR2 at liquid.Perhaps, when liquid soaks the gap that forms liquid among the liquid LQ of regional AR2, also can produce this kind situation.On porous member 25, be formed with the stream space that forms recovery stream 24 parts again.
Among Fig. 6; The pressure (pressure below porous member 25H) in the 1st hole 25Ha of porous member 25 and the space between substrate P is made as Pa, the pressure (pressure on porous member 25) in the stream space on the porous member 25 is made as Pb, the aperture (diameter) of hole 25Ha, 25Hb is made as d, the contact angle of porous member 25 (hole 25H is inboard) and liquid LQ is made as θ, the surface tension of liquid LQ is made as γ, and meet
(4×γ×cosθ)/d≥(Pa-Pb)……(1A)
Condition the time, promptly as shown in Figure 6, even be formed with the gas space, can prevent that also the gas permeation hole 25Ha of porous member 25 lower side space from moving the upside space of (infiltration) to porous member 25 at the 1st hole 25Ha downside (substrate P side) of porous member 25.Also be; With the mode of the condition that satisfies above-mentioned formula (1A), make surface tension γ and the pressure Pa of contact angle θ, aperture d, liquid LQ, Pb reaches optimization; Can the interface of liquid LQ and gas be maintained in view of the above in the hole 25Ha of porous member 25, suppress gas and infiltrate from the 1st hole 25Ha.On the other hand, owing to be formed with fluid space, therefore can see through only withdrawal liquid LQ of the 2nd hole 25Hb at the 2nd hole 25Hb downside (substrate P side) of porous member 25.
In addition, in the condition of above-mentioned formula (1A), do not consider the hydrostatic pressing of the liquid LQ on the porous member 25 for simplified illustration.
Again; In this example; Liquids recovery mechanism 20; Be that diameter d, porous member 25 (medial surface of hole 25H) with the pressure Pa in the space under the porous member 25, hole 25H is made as necessarily with the contact angle θ of liquid LQ and the surface tension γ of liquid (pure water) LQ, come the attractive force of controlling liquid recoverer 21, the pressure in the stream space on the porous member 25 is adjusted to satisfies above-mentioned formula (1A).But; In above-mentioned formula (1A) and since when (Pb-Pb) more greatly, also be that ((4 * γ * cos θ)/d) big more is controlled to pressure P b more easily and satisfies above-mentioned formula (1A); So hole 25Ha, the diameter d of 25Hb and porous member 25 are preferably less as far as possible with the contact angle θ of liquid LQ.
Secondly, explain that the exposure device EX that makes the above-mentioned formation of apparatus is exposed to the pattern image of mask M the method for substrate P.
Control device CONT; Through both quantitative liquid LQ being supplied on the substrate P with liquid dipping machine structure 1 with liquid organization of supply 10 and liquids recovery mechanism 20; And the liquid LQ on the both quantitative substrate P is reclaimed, and the liquid of formation liquid LQ soaks regional AR2 on substrate P.The liquid LQ that liquid dipping machine structure 1 is supplied is to form in the last branch of the substrate P that contains the AR1 of view field is local that the big and liquid little than substrate P soaks regional AR2 than the AR1 of view field.
Again; Control device CONT; Be with 10 pairs of substrate P of liquid organization of supply on liquid LQ supply parallel; Carry out recovery with liquids recovery mechanism 20 to the liquid LQ on the substrate P, Yi Bian and make the baseplate carrier PST of supporting substrate P be displaced into X-direction (direction of scanning), Yi Bian see through liquid LQ and projection optical system PL between projection optical system PL and substrate P with the pattern image projection exposure of mask M on substrate P.
The exposure device EX of this example; Be to make mask M and substrate P one edge X-direction (direction of scanning) move on one side pattern image projection exposure with mask M in substrate P; When carrying out scan exposure; Be a part of pattern image of mask M to be seen through liquid soak liquid LQ and the projection optical system PL of regional AR2 and be projected in the AR1 of view field; And make substrate P and mask M with the moving synchronously of speed V edge-directions X (or+directions X), and move with speed β V (β is the projection multiplying power) edge+directions X (or-directions X) relative to the AR1 of view field.On substrate P, be set with a plurality of irradiation areas; Behind end exposure to an irradiation area; Move through the stepping of substrate P and to make a time irradiation area move to the scanning starting position; Afterwards, Yi Bian promptly in regular turn each irradiation area is carried out the scan exposure processing with step-scan mode one side moving substrate P.
In this example, porous member 25 relative substrate P surfaces are inclination, be one see through the porous member 25 be disposed at liquids recovery mouth 22 inclined-plane 2 formation of coming withdrawal liquid LQ, and liquid LQ sees through the liquids recovery mouth 22 that comprises inclined-plane 2 to be recovered.Again, tabular surface 75 (bottom surface sections 71D's is following) is continuous formation with inclined-plane 2.At this moment; When make from the A-stage shown in Fig. 7 (a) (soaking the state of regional AR2 at the liquid that is formed with liquid LQ between tabular surface 75 and substrate P) substrate P with set speed relative to liquid soak regional AR2 past+when set a distance is both moved in directions X scanning, promptly become the state shown in Fig. 7 (b).In the set state after the scanning shown in Fig. 7 (b) is moved, the liquid LQ that soaks regional AR2 in liquid promptly produces along the inclined-plane 2 and composition F2 that the composition F1 that moves toward oblique upper and along continuous straight runs move.At this moment, liquid soaks the liquid LQ of regional AR2 and interface (liquid-gas interface) the LG shape of its outer space is kept.Again, even the relative liquid of substrate P soaks regional AR2 high-speed mobile, the shape that also can suppress interface LG significantly changes.
Again, the distance between inclined-plane 2 and substrate P is greater than the distance between tabular surface 75 and substrate P.Also promptly, the space between inclined-plane 2 and substrate P is big than the space between tabular surface 75 and substrate P.In view of the above, can shorten in the distance L behind the moving substrate P, between the interface LG of the set state after scanning is moved shown in the interface LG ' of the A-stage shown in Fig. 7 (a) and Fig. 7 (b).In view of the above, can suppress the expansion that liquid soaks regional AR2, dwindle the size that liquid soaks regional AR2.
For example; Shown in Fig. 8 (a); When continuous formation tabular surface 75 below the porous member 25 that is disposed at liquids recovery mouth 22 2 ', make porous member 25 below 2 ' be not that relative substrate P is to tilt but when being almost parallel with the substrate P surface, in other words, though comprise following 2 ' liquids recovery mouth 22 and nonangular situation under; Make substrate P when liquid soaks regional AR2 and moves, still can keep the shape of interface LG.But, because following 2 ' do not have inclination, therefore only produce the composition F2 that along continuous straight runs moves, and almost produce the composition (F1) that moves toward the top in liquid LQ.At this moment, because interface LG moves the distance roughly the same with the amount of movement of substrate P, therefore the distance L between the interface LG of the interface LG ' of state and the set state after scanning is moved promptly becomes bigger value in the early stage, makes liquid soak regional AR2 and also increases thereupon.Thus; For also doing nozzle member 70 bigger, again, soak the size of regional AR2 for corresponding liquid to should bigger liquid soaking regional AR2; Also must the size of baseplate carrier PST itself or the shift motion of baseplate carrier PST be increased, cause the whole gigantism of exposure device EX.Again, liquid soaks the maximization of regional AR2, is along with substrate P is more at a high speed and more significantly to the sweep velocity that liquid soaks regional AR2.
Again; Shown in Fig. 8 (b); The section of setting is poor between tabular surface 75 and liquids recovery mouth 22 (below the porous member 25 2 '), in view of the above when will with following 2 ' and substrate P between distance make greater than between tabular surface 75 and substrate P apart from the time, in other words; Also promptly will with following 2 ' and substrate P between space when making greater than the space between tabular surface 75 and substrate P; Owing to produce the composition F1 ' that moves toward above at liquid LQ, therefore can distance L be set as less value, and can suppress the maximization that liquid soaks regional AR2.In addition and since tabular surface 75 with below a 2 ' section of being provided with poor, and tabular surface 75 and following 2 ' not formation continuously, so the shape of interface LG is easier to defeated and dispersed.When the shape of interface LG is defeated and dispersed, gas is got among the liquid LQ that liquid soaks regional AR2 and in liquid LQ, produces bad situation such as bubble.Again; When the words that for example section of having difference exists when making the high-velocity scanning of substrate P edge+directions X; Except meeting make the shape of interface LG defeated and dispersed, also can make composition F1 ' changes of moving big toward the top, make liquid soak regional AR2 by the liquid LQ thickness attenuation of+X regions; And under this state, make substrate P be displaced into-during directions X (reverse scanning), promptly probably produce the phenomenon that liquid LQ scatters.When this liquid that scatters (with reference to the symbol LQ ' among Fig. 8 (b)) when for example remaining on the substrate P, promptly produce because of this liquid LQ ' gasification forms on substrate P and adhere to trace bad situations such as (so-called washmarkings).Again, liquid LQ probably flows out to the substrate P outside, and produces surrounding member and machine gets rusty or bad situation such as electric leakage.Again, produce the possibility of aforementioned bad situation, can along with substrate P liquid is soaked regional AR2 sweep velocity high speed and improve.
In this example; Owing to form inclined-plane 2 continuously with tabular surface 75 (base plate 71D's is following); And with the recovery mouth 22 of liquid dipping machine structure 1 (liquids recovery mechanism 20); Be formed at the substrate P scope that the state decree of appointment or the selection of border application case is allowed home in; The record content of quoting the document is as the inclined-plane 2 of a part of surperficial subtend of this paper record, even therefore make the liquid of the image planes side that is formed at projection optical system PL soak regional AR2 and substrate P when relatively moving, also can suppress the displacement of interface LG that liquid soaks liquid LQ and its outer space of regional AR2; And keep the shape (dwindling the change in shape of interface LG) that liquid soaks regional AR2, size or the shape maintains that can liquid be soaked regional AR2 are in desired state.In view of the above, can prevent as in liquid LQ, producing bubble, failing complete withdrawal liquid or bad situations such as liquid outflow are arranged.In view of the above, also can seek the whole miniaturization of exposure device EX.
Again, when the high-velocity scanning substrate P, though the liquid LQ that the liquid LQ that probably makes liquid soak regional AR2 flows out to the outside or liquid soaks regional AR2 disperse to around because wall portion 76 is located at inclined-plane 2 peripheries, therefore can suppress spilling of liquid LQ.Also be; Through wall portion 76 being located at porous member 25 peripheries; And can be at the wall portion 76 inboard cushion spaces that form; Even therefore liquid LQ arrives the medial surface of wall portion 76, form liquid and soak the liquid LQ of regional AR2 owing to can therefore can prevent more positively that liquid LQ from leaking to wall portion 76 outsides at the cushion space intramedullary expansion of wall portion 76 inboards.
Again; Because the part (below the base plate 72D) of tabular surface 75 is to be disposed under the end face T1 of projection optical system PL with the mode of surrounding the AR1 of view field; Therefore being formed at the little gap between tabular surface 75 parts (below the base plate 72D) and substrate P surface, is near view field, to form to surround view field.In view of the above, even during high-speed mobile (scanning) substrate P, also can suppress gas and sneak into liquid and soak among the regional AR2 liquid LQ or bad situation such as liquid LQ outflow, and can seek the whole miniaturization of exposure device EX.Again; Owing to liquid supply port 12 is disposed at a part (below the base plate 72D) outside of tabular surface 75; Therefore can prevent that gas (bubble) from sneaking in order to form liquid soaks among the liquid LQ of regional AR2, even when desiring to make the substrate P high-speed mobile, also can continue to be full of with liquid the light path of exposure light EL.
The 2nd example
Secondly, with reference to Fig. 9 the 2nd example of the present invention is described., below in the explanation, give same-sign here, simplify or omit its explanation the component part identical or equal with above-mentioned example.In above-mentioned the 1st example; Though form inclined-plane 2 through lamellar porous member 25 relative substrate P are tilted to install; But also can be as shown in Figure 9; Below nozzle member 70, be provided with and the distance of the optical axis AX of exposure light EL is then longer and the substrate P surface between big more inclined-plane 2, interval ", again liquids recovery mouth 22 is formed at this inclined-plane 2 " both allocations (set zone) of a part.Also can porous member 25 be located at this liquids recovery mouth 22 again.At this moment, the inclined-plane 2 of nozzle member 70 " following 2 continuous with porous member 25, and inclined-plane 2 " with following 2 roughly high with one side.By the way, for example on inclined-plane 2 " and substrate P between when forming the interface LG of liquid LQ, can keep the shape of this interface LG, prevent bad situations such as bubble produces in liquid soaks the liquid LQ of regional AR2.Also can dwindle the size that liquid soaks regional AR2 again.
The 3rd example
Figure 10 is for showing the figure of the 3rd example of the present invention.Shown in figure 10, can form porous member 25 following 2 in, near the angle of inclination of the relative substrate P of the 1st regional 2A of optical axis AX, greater than the angle of inclination of the relative substrate P of the 2nd regional 2B in its outside.
The 4th example
Figure 11 is for showing the figure of the 4th example of the present invention.Shown in figure 11, can form porous member 25 following 2 in, near the angle of inclination of the relative substrate P of the 1st regional 2A of optical axis AX, less than the angle of inclination of the relative substrate P of the 2nd regional 2B in its outside.Also promptly, following 2 of porous member 25 must not be tabular surface, also can following 2 of porous member 25 be arranged to, when the distance of the optical axis AX of itself and exposure light EL longer then big more with the interval on substrate P surface.
The 5th example
Figure 12 is the figure that shows the 5th example of the present invention.Shown in figure 12, also can (below the porous member 25) form a plurality of tab member 150 on the inclined-plane below being formed at nozzle member 70.Tab member 150 in the side cross-sectional, view of Figure 12, is configured in the cushion space of following 2 and wall portion 76 inboards that are formed at porous member 25 for side-looking is general triangular.Again, tab member 150 is radial wall portion 76 medial surfaces that are installed in its long side direction toward the mode in the outside.Here, a plurality of tab member 150 and form spatial portion 150 of each tab member away from each other.So, through disposing a plurality of tab member 150 in this way,, therefore can promote the maintenance performance of the liquid LQ below the nozzle member 70 because it is long-pending to be increased in the liquid contact surface that is formed at the inclined-plane (below the porous member 25) below the nozzle member 70.In addition, a plurality of tab member 150 also can be uniformly-spaced being provided with, or also can be with the unequal interval setting.For example, with the interval that the relative AR1 of view field is disposed at the tab member 150 of X-direction both sides, set the interval that is disposed at the tab member 150 of Y direction both sides less than the relative AR1 of view field for.In addition, tab member 150 surfaces preferably have lyophily to liquid LQ.Again, tab member 150 also can be handled or " GOLDEP WHITE " handles and form through stainless steel (for example SUS316) being imposed " GOLDEP ", also can glass (quartz) waits to form.
The 6th example
Secondly, with reference to Figure 13,14,15 and Figure 16 the 6th example of the present invention is described.In addition, give common symbol, simplify or omit its explanation or kindred organization identical and member with above-mentioned each example.Figure 13 is that partial cross section figure, Figure 14 of showing near the approximate three-dimensional map the nozzle member 70 ' is that stereographic map, the Figure 15 that observes nozzle member 70 ' from downside is and the parallel plane side cross-sectional, view of YZ that Figure 16 is and the parallel plane side cross-sectional, view of XZ.
The nozzle member 70 ' of this example is combination the 1st member 171 and 172 formations of the 2nd member, integral body form overlook roughly rounded.The 1st member 171 has side plate 171A and thicker inclination board 171C, and side plate 171A upper end is connected with inclination board 171C upper end.On the other hand, the 2nd member 172 has inclination board 172C and the base plate 172D that is connected in inclination board 172C bottom.The inclination board 172C of the inclination board 171C of the 1st member 171 and the 2nd member 172 forms the mortar shape respectively, the inclination board 172C of the 2nd member 172, and the inclination board 171C that is disposed at the 1st member 171 is inboard.Again, the 1st member 171 and the 2nd member 172, the lateral surface 172S of inclination board 172C of medial surface 171T and the 2nd member 172 that is supported to the inclination board 171C of the 1st member 171 by not shown supporting mechanism is released state a little.Between the lateral surface 172S of the inclination board 172C of the medial surface 171T of the inclination board 171C of the 1st member 171 and the 2nd member 172, be provided with and overlook the slit-shaped slot part 73 that is circular again.In this example, the slit width G1 of slot part 73 sets for about 3mm.Again, in this example, slot part 73 forms the inclination of relative XY plane (substrate P surface) about 45 degree of tool.
It is inboard that optical element LS1 is disposed at the 70H of hole portion that forms with the inclination board 172C of the 2nd member 172, and the medial surface 172T of inclination board 172C that is disposed at optical element LS1 side and the 2nd member 172 of the 70H of this hole portion is a subtend.Again, the medial surface 172T of this inclination board 172C is to liquid LQ tool liquid repellency (water-repellancy), can suppress the gap between medial surface 172T that liquid LQ infiltrates projection optical system PL side and inclination board 172C (nozzle member 70 ').
The following 171R relative among the inclination board 171C of the 1st member 171 with substrate P, be one with the parallel plane tabular surface of XY.Again, among the base plate 172D of the 2nd member 172 with the following 172R of substrate P subtend, also be one with the parallel plane tabular surface of XY.Again; The following 171R of the inclination board 171C of the 1st member 171, with the following 172R of the inclination board 172C of the 2nd member 172 for roughly with the one side height; Form tabular surface 75 by the following 171R of these inclination boards 171C and the following 172R of base plate 172D; Be supported in substrate P surface (above the baseplate carrier PST) subtend of baseplate carrier PST in this tabular surface 75 and the nozzle member 70 ', and be one near the face on this substrate P surface (above the baseplate carrier PST).Be formed with the peristome 74 that exposure light EL is passed through at the base plate 172D central portion that forms tabular surface 75 again.Also promptly, tabular surface 75 forms and surrounds the AR1 of view field.
Shown in figure 15, form the part of the base plate 172D of tabular surface 75, be below Z-direction is disposed at the optical element LS1 of projection optical system PL between T1 and substrate P (baseplate carrier).Base plate 172D is arranged to not contact with following T1 and the substrate P (baseplate carrier PST) of optical element LS1.Be configured to the following T1 subtend of optical element LS1 above the base plate 172D and be roughly parallel to below the optical element LS1, be formed with both fixed gap (space) G2 in the end face T1 of projection optical system PL and between above the base plate 172D.
Be formed with spatial portion 24 in the 1st member 171 under shed, with above-mentioned the 1st example likewise, be formed with liquids recovery mouth 22 in the peristome of spatial portion 24, and make spatial portion 24 performances reclaim the function of streams.Again, the other end of recovery tube 23 is connected in a part that reclaims stream (spatial portion) 24.In liquids recovery mouth 22, dispose porous member 25 with the porous that covers this liquids recovery mouth 22.Porous member 25, have be supported in the substrate P of baseplate carrier PST relative following 2.With above-mentioned the 1st example likewise, porous member 25, be below it 2 be supported in baseplate carrier PST relatively the mode that tilts of substrate P surface (also being the XY plane) be located at liquids recovery mouth 22.The inclined-plane 2 of porous member 25 forms, and the interval when the distance of the optical axis AX of itself and projection optical system PL (optical element LS1) between then longer and substrate P surface is big more.Again; Shown in figure 15; Porous member 25, be following 171R (tabular surface 75) with the inner edge portion on its inclined-plane 2 and the 1st member 171 for roughly with high mode and with inclined-plane 2 inner edge portion and the continuous mode of following 171R (tabular surface 75), be installed on the liquids recovery mouth 22 of nozzle member 70 '.
Again, shown in figure 14, below nozzle member 70 ', liquids recovery mouth 22 forms encirclement peristome 74 (AR1 of view field), slot part 73 and overlooking of tabular surface 75 and is circular.Tabular surface 75 is disposed at 2 on the inclined-plane of peristome 74 (AR1 of view field) that exposure light EL is passed through and the porous member 25 that is configured in liquids recovery mouth 22.Liquids recovery mouth 22 is that opposed openings portion 74 (AR1 of view field) is in tabular surface 75 outsides and be configured to surround tabular surface 75.
As illustrated in the 5th example, (porous member 25 below) 2 is radial a plurality of tab member 150 that are provided with in the inclined-plane.Tab member 150 is the side-looking general triangular, is disposed at the cushion space of following 2 and wall portion 76 inboards that are formed on porous member 25.In this example, each tab member 150 thickness is about about 0.1mm, and is most individual along the Zhou Fangxiang configuration with the interval of 2 degree.
Shown in figure 13, in the medial surface 172T of the inclination board 172C of the 2nd member 172, the Y direction both sides of the AR1 of view field of projection optical system PL are formed with recess 14A respectively relatively.Recess 14A forms along the vergence direction of inclination board 172C, its and the side of optical element LS1 between form set clearance G 3 (with reference to Figure 15).Through being formed at the clearance G 3 between recess 14A and optical element LS1, and form supply stream 14 in order to supply fluid LQ in the image planes side of projection optical system PL again.The upper end of supply stream 14 sees through not shown supply pipe (supply stream) and is connected in liquid supply department 11; The bottom then is connected in the following T1 of projection optical system PL and gap (space) G2 between base plate 172D, is formed with the liquid supply port 12 that liquid LQ is supplied to clearance G 2 in its lower end.Again, liquid dipping machine structure 1 sees through the liquid supply port 12 of being located at stream 14 bottoms, will be supplied to the clearance G 2 between projection optical system PL and base plate 172D from the liquid LQ that liquid supply department 11 sees off.In this example, supply stream 14 forms the inclination that relative XY plane (substrate P surface) has about 45 degree.
In addition, also can above base plate 172D, be provided with concavo-convexly, be controlled at flow direction or flow rate of liquid above the base plate 172D.For example, for decision from liquid supply port 12 be supplied to base plate 172D above the liquid LQ of 172A flow to, also can the flap-like member be disposed at liquid supply port 12, or 172A is provided with flap-like projection portion above base plate 172D.At this moment, in order be under the state of the part of residual gas not to be full of the optical path space of the image planes side of projection optical system PL continuously, preferably according to experiment or Simulation result flows to liquid LQ and the flow velocity of liquid LQ reaches optimization with liquid.Again; At whole withdrawal liquid LQ and when forming non-liquid and soaking state roughly from the image planes side space of projection optical system PL; In order not make liquid LQ residue in the end face T1 etc. of optical element LS1, preferably according to experiment or Simulation result flows to liquid LQ and the flow velocity of liquid LQ reaches optimization.Perhaps, contain from the liquid holdup of the material of substrate P (photoresist etc.) stripping preferably according to experiment or Simulation result flows to liquid LQ and the flow velocity of liquid LQ reaches optimization in order not make.
Moreover the X-direction both sides of the relative AR1 of view field in the 2nd member 172 are formed with the inner slit-shaped through hole 130 of inclination board 172C that along inclined direction connects the 2nd member 172 respectively.Be formed at the opening of the bottom 130A of through hole 130, be connected in the following T1 of projection optical system PL and gap (space) G2 between base plate 172D, upper end 130B is then to being open into atmosphere.Can from the opening of bottom 130A above base plate 172D 172A, also promptly see liquid off along the direction that is parallel to substrate.
The slot part 73 that the 1st member 171 and the 2nd member are 172 is disposed at 2 on the inclined-plane of AR1 of view field that exposure light EL shone and liquids recovery mouth 22, forms and surrounds peristome 74 (AR1 of view field).Further, slot part 73 also forms and surrounds the following 172R that constitutes tabular surface 75 parts.In other words, the 172R outside disposes slot part 73 below formation tabular surface 75 parts.This slot part 73 has the peristome 73A that is configured to the subtend that (is supported in the substrate P of baseplate carrier PST) above the baseplate carrier PST.Also promptly, slot part 73 is to open lower side.Peristome 73A is located near the image planes of projection optical system PL, and slot part 73 is in its inner image planes gas communication on every side that sees through peristome 73A and projection optical system PL.
Again, slot part 73, except with the peristome 73A of substrate P (baseplate carrier PST) subtend, also have the peristome 73B that is used for to atmosphere opening.In this example, slot part 73, the end has the peristome 73B that is used for to atmosphere opening on it.In addition, be annular, also can only be formed at the part of slot part 73 upper ends though peristome 73B forms to overlook along slot part 73 upper ends.Again, be used for making the inside of slot part 73 and the upper end that the outside circulation flow path that circulates is not limited to slot part 73, also can be located at the optional position.For example, can form in the 1st member 171 parts and be used for making the Z-direction centre position (both allocations) of slot part 73 inside and the stream of slot part 73 outside circulations, see through this stream and make slot part 73 to atmosphere opening.
So; Have with the peristome 73A of substrate P (baseplate carrier PST) subtend and be used for slot part 73 to the peristome 73B of atmosphere opening owing to form, so the liquid LQ part between nozzle member 70 ' and substrate P (baseplate carrier PST) can be come in and gone out in slot part 73 inside.In view of the above, even the size of nozzle member 70 ' (diameter) is less, still can suppresses liquid LQ and flow out to liquids recovery mouth 22 outsides.
Again, shown in figure 15, be formed with the inside and the outside circulation flow path 131 that circulates that is used for making slot part 73 in the 1st member 171 parts, be connected with the suction device 132 that comprises vacuum system in this circulation flow path 131.Circulation flow path 131 and suction device 132 are to use in reclaiming liquid LQ between nozzle member 70 ' and substrate P (baseplate carrier PST) fully, also promptly reclaiming fully when forming liquid and soaking the liquid LQ of regional AR2, see through slot part 73 and reclaim this liquid LQ.
Secondly, liquid dipping machine structure 1 action of the nozzle member 70 ' that is provided with the above-mentioned structure of tool is described.For liquid LQ is supplied on the substrate P, control device CONT promptly drives liquid supply department 11 and comes to see liquid LQ off from liquid supply department 11.The liquid LQ that sees off from liquid supply department 11 promptly flows into supply stream 14 upper ends of nozzle member 70 ' behind the supply pipe of flowing through.Flow into the liquid LQ of supply stream 14 upper ends, promptly the vergence direction along inclination board 172C flows to the below, and is supplied to the end face T1 of projection optical system PL and the space G2 between base plate 172D from liquid supply port 12., before liquid LQ is supplied to space G2, being present in the gas part of space G2 here, is to be expelled to the outside through through hole 130 or peristome 74.In view of the above, can prevent that gas can be stayed the bad situation of space G2 when beginning space G2 supply fluid LQ, and prevent that gas part (bubble) from resulting from the bad situation among the liquid LQ.
The liquid LQ that is supplied to space G2 promptly sees through the space that peristome 74 flows between tabular surface 75 and substrate P (baseplate carrier PST) after being full of space G2.At this moment; Because liquids recovery mechanism 20 reclaims the liquid LQ on the substrate P both quantitative with the per unit time; Therefore by seeing through the liquid LQ that peristome 74 flows into the space between tabular surfaces 75 and substrate P (baseplate carrier PST), and on substrate P, form desire big or small liquid and soak regional AR2.
In addition, in this example, make the size of tabular surface 75 bigger, therefore can between substrate P (baseplate carrier PST) and nozzle member 70 ', keep liquid LQ well owing to dwindle the peristome 74 that exposure light EL passes through.
During substrate P is carried out immersion exposure etc. formation liquid soak regional AR2 during in, the driving of suction device 132 is closed and stopped to the circulation flow path 131 that is connected in slot part 73.In view of the above; Even make substrate (baseplate carrier PST) soak regional AR2 (form and coat the AR1 of view field) when moving relative to liquid; Liquid soaks the liquid LQ part of regional AR2 still can come in and go out in the slot part 73 to atmosphere opening, and can prevent the bad situations such as liquid LQ outflow that regional AR2 expansion is soaked in solution stopping or liquid soaks regional AR2.Also promptly, for example shown in Figure 16, through make substrate P past+directions X moves, and the liquid LQ that makes liquid soak regional AR2 also moves with the mobile and past+directions X of substrate P.At this moment, might+directions X past move because of liquid LQ make liquid soak regional AR2 past+directions X enlarges or liquid soaks regional AR2 liquid LQ trickle reclaims mouthful 22 outsides.Yet, owing to should therefore can suppress liquid and soak regional AR2 expansion or liquid LQ outflow etc. toward the slot part 73 (with reference to the arrow F3 among Figure 16) of a part enterings+X side of+liquid LQ that directions X moves.
Again; When the liquid LQ between nozzle member 70 ' and substrate P (baseplate carrier PST) being reclaimed fully when the immersion exposure of substrate P finishes etc.; The liquids recovery mouth 22 that control device CONT moved, also saw through liquids recovery mechanism 20 except the liquid supply of stop liquid organization of supply 10 carries out the liquids recovery action; And open the circulation flow path 131 that is connected in slot part 73 simultaneously; Drive suction device 132 and make the inner space of slot part 73 become negative pressure, and see through the liquids recovery action of the peristome 73A of slot part 73.So, through also using peristome 73A, and can positively reclaim the liquid LQ between nozzle member 70 ' and substrate P (baseplate carrier PST) with shorter time near substrate P (baseplate carrier PST).At this moment, to reclaim the size of peristome 73A of mouthful function little owing to be used for bringing into play liquid LQ to the peristome 73B of atmosphere opening, therefore can make slot part 73 reach enough negative pressure and come withdrawal liquid LQ.
Again; When seeing through slot part 73 withdrawal liquid LQ; Produce vibration though might flow into circulation flow path 131 with liquid LQ at nozzle member 70 ' because of the gas of slot part 73; But owing to see through the recovery of the liquid LQ that slot part 73 carries out, not when carrying out to ask the precision such as exposure actions of substrate P, to carry out, therefore can not have problems.
In addition; In this example; Though in order to form the recess 14A of supply stream 14, be that the relative AR1 of view field respectively establishes one (adding up to two) respectively in Y direction two examples, also can be at most AR1 of view field that locate to be arranged to surround the projection optical system PL that exposure light EL shone arbitrarily.Again, also can near recess 14A upper end, be provided with as the 1st example in the dyke portion 15 (buffering stream the 14H of portion) that explains.
The 7th example
Secondly, with reference to Figure 17 and 18 explanations the 7th example of the present invention.In addition, in this example, same or kindred organization and member are given common symbol, detailed with above-mentioned each example.Figure 17 is a stereographic map of observing nozzle member 70 ' from downside, and Figure 18 is a side cross-sectional, view.In Figure 17 and 18, differing from above-mentioned the 6th example part, be base plate 172D big or small less of the 2nd member 172, and base plate 172D major part is not disposed between the following T1 and substrate P (baseplate carrier PST) of projection optical system PL.Also promptly, being formed at the peristome 74 of base plate 172D, is roughly with the identical size of following T1 of projection optical system PL (optical element LS1) and form a lot of circular of the big AR1 of view field.Again, the following T1 major part of optical element LS1 is to expose with the mode of substrate P (baseplate carrier PST) subtend.Liquid LQ from liquid supply department 11 sees off sees through and is formed at the supply stream 14 between optical element LS1 side and recess 14A, is supplied to the following T1 of projection optical system PL and the space between substrate P (baseplate carrier PST).In this example; Though the area of tabular surface 75 becomes less; But compare with the 6th example,, make the part that is prone to delay gas become less owing to almost have no the space between the optical element LS1 of the 2nd member 172 and projection optical system PL; Therefore can prevent more positively that when beginning supply fluid LQ begins gas part (bubble) is created in the bad situation that forms among the liquid LQ that liquid soaks regional AR2.
In addition, in above-mentioned the 6th example and the 7th example, though be simplified illustration, and narration nozzle member 70 ' to be combination with the 1st member 171 and the 2nd member 172 constituted, in fact still making up has other several member to constitute.Certainly, also can constitute nozzle member 70 ' by a member.
Again; In above-mentioned the 6th example and the 7th example; Though when beginning supply fluid LQ, be to use the gas of through hole 130 discharge space G2, also can through hole 130 be connected in suction device (vacuum system), when beginning supply fluid LQ, force to discharge the gas of space G2.
Again; In above-mentioned the 6th example and the 7th example; The peristome 74 of base plate 172D; Be not limited to Figure 14 or shape shown in Figure 17, also can set under the not residual state of gas, even substrate P (baseplate carrier PST) moves still the optical path space that can liquid LQ be full of the image planes side of projection optical system PL continuously.
Again; In above-mentioned the 6th example and the 7th example; When reclaiming the liquid LQ of (optical path space of the image planes side of projection optical system PL) between nozzle member 70 ' and substrate P (baseplate carrier PST) fully; Except the liquids recovery action of having used liquids recovery mouth 22 or peristome 73A, also can add from the action of liquid supply port 12 blow gas.Because the gas that blows out from liquid supply port 12 is to blow T1 below the optical element LS1 of projection optical system PL leading section, therefore can remove the liquid LQ of attachment removal (residual) T1 below optical element LS1.The gas that blows out from liquid supply port 12; Can flow along following T1, make exposure light EL among the following T1 that is attached to optical element LS1 pass through side shifting (retreating) outside past this zone of liquid (drop) of regional (also promptly with the corresponding zone of the AR1 of view field of the following T1 of optical element LS1).In view of the above, remove the liquid LQ that exposure light EL among the following T1 that is attached to optical element LS1 passes through the zone.In addition, also can remove through the liquid LQ gasification (drying) that makes the following T1 that is attached to optical element LS1 with the gas of being jetted.See through from liquid supply port 12 and to comprise chemical filter, particle and remove the filtration unit (not shown) of filtrator and blow out peace and quiet gas.Again, use roughly is used as gas with roughly the same gas, the for example air (dry air) of the gas of the chamber interior that contains exposure device EX.The gas that in addition, also can use nitrogen (drying nitrogen) to be used as blowing out.
Again, when complete withdrawal liquid LQ, also can connect vacuum system being expelled to outside through hole 130 grades in order to the gas that will be present in space G2, and attract and withdrawal liquid LQ from the opening of the bottom 130A that is formed at through hole 130.
Also can be expelled to outside gas supply system such as connection such as through hole 130 grades in order to the gas that will be present in space G2, and see through these through hole 130 blow gas again.
In addition, in the 6th example and the 7th example, also can the liquid supply port 12 relative AR1 of view field be disposed at the X-direction both sides respectively, and from the both sides, direction of scanning supply fluid LQ.At this moment, the bottom 130A of through hole 130, for example be provided in a side of the relative AR1 of view field in the Y direction both sides etc., the position different with liquid supply port 12.
Again; In the 6th and the 7th example; Though recess 14A and the clearance G 3 between optical element LS1 side through inclination board 172C form supply stream 14; And make the function of this supply stream 14 bottoms performance liquid supply port 12, but the upper end 130B that also can connect through hole 130 makes the function of through hole 130 performance supply streams with liquid supply department 11, and makes the bottom 130A of through hole 130 bring into play the function of liquid supply port.Connect the upper end 130B and the liquid supply department 11 of through hole 130 and see through through hole 130 when coming supply fluid LQ; The recess 14A of inclination board 172C is not connected (function that space G3 does not bring into play the supply stream) with liquid supply department 11 with clearance G 3 between optical element LS1 side, and make liquid LQ3 upper end to atmosphere opening.Then, before the G2 supply fluid LQ of 130 pairs of spaces of through hole, the gas that is present in space G2 promptly sees through clearance G 3 and is expelled to the outside.So, even when seeing through through hole 130 and coming supply fluid LQ, can prevent that also when beginning space G2 supply fluid LQ gas from staying the bad situation of space G2, anti-terminating in produces gas part (bubble) among the liquid LQ.Again, under this situation, but also connection space G3 upper end and suction device (vacuum system) are forced to discharge the gas of space G2 when beginning supply fluid LQ.
Again, when seeing through through hole 130 and coming supply fluid LQ, the relative AR1 of view field of bottom 130A that can will bring into play the through hole 130 of liquid supply port function is disposed at Y direction two examples respectively, again from the both sides supply fluid LQ of non-direction of scanning.
The 8th example
Secondly, with reference to Figure 19,20,21 and 22 explanations the 8th example of the present invention.Figure 19 shows nozzle member 70 " near the part of the approximate three-dimensional map figure that decides what is right and what is wrong, Figure 20 observes nozzle member 70 from downside " stereographic map, Figure 21 is and the parallel plane side cross-sectional, view of YZ that Figure 22 is and the parallel plane side cross-sectional, view of XZ.Below in the explanation, to investing prosign, simple or omit its explanation with the identical or equal component part of above-mentioned example.
Nozzle member 70 " be combination the 1st member the 171, the 2nd member 172 and 173 formations of the 3rd member, integral body form overlook roughly rounded.The 1st member 171 has side plate 171A and thicker inclination board 171C.The 2nd member 172 has inclination board 172C and the base plate 172D that is connected in inclination board 172C bottom.The 3rd member 173 is connected in the upper end of the 1st member 171 and the 2nd member 172, is formed with the 173H of hole portion that is used for disposing optical element LS1 in the 3rd member 173 central portions.Optical element LS1, it is inboard to be disposed at the 70H of hole portion that the inclination board 172C with the 173H of hole portion of the 3rd member 173 and the 2nd member 172 forms, and is disposed at the medial surface 172T subtend of the inclination board 172C of inboard optical element side of the 70H of hole portion and the 2nd member 172.Between the lateral surface 172S of the inclination board 172C of the medial surface 171T of the inclination board 171C of the 1st member 171 and the 2nd member 172, be provided with and overlook the slit-shaped slot part 73 that is annular again.Slot part 73 forms the inclination that relative XY plane (substrate P surface) has about 45 degree.
Again; The following 172R of the following 171R of inclination board 171C through the 1st member 171 and the base plate 172D of the 2nd member 172 forms tabular surface 75, and this tabular surface is one at nozzle member 70 " in substrate P surface (above the baseplate carrier PST) subtend that is supported in baseplate carrier PST, near the face of this substrate P surface (baseplate carrier PST above).Tabular surface 75 forms and surrounds the AR1 of view field.
Forming the part of the base plate 172D of tabular surface 75, is below Z-direction is disposed at the optical element LS1 image planes side of projection optical system PL between T1 and substrate P (baseplate carrier PST).Base plate 172D is arranged to not contact with following T1 and the substrate P (baseplate carrier PST) of optical element LS1.Be configured to above the base plate 172D and the following T1 subtend of optical element LS1 and roughly parallel below optical element LS1, be formed with both fixed gap (space) G2 between above the end face T1 of projection optical system PL and base plate 172D.
Be formed with the spatial portion 24 that the stream function is reclaimed in performance in the 1st member 171, be formed with liquids recovery mouth 22 in the peristome of spatial portion 24.Liquids recovery mouth 22 is to form to overlook with the mode of surrounding peristome 74 (AR1 of view field), slot part 73 and tabular surface 75 to be circular.Be connected with the other end of recovery tube 23 in recovery stream (spatial portion) 24 parts.Dispose porous member 25 (having and the inclined-plane 2 that is supported in the substrate P subtend of baseplate carrier PST) in liquids recovery mouth 22.Porous member 25, be following 171R (tabular surface 75) with the inner edge portion on its inclined-plane 2 and the 1st member 171 for roughly with high mode and with inclined-plane 2 inner edge portion and the continuous mode of following 171R (tabular surface 75), be installed on liquids recovery mouth 22.In the inclined-plane 2, be radial a plurality of tab member 150 that are provided with.
The Y direction both sides of the relative AR1 of view field in the 2nd member 172 are formed with the inner slit-shaped through hole 130 of inclination board 172C that along inclined direction connects the 2nd member 172 respectively.Again, the upper end 140B of through hole 140 is to see through not shown supply pipe (supply stream) to be connected in liquid supply department 11, and bottom 140A promptly is connected in the following T1 of projection optical system PL and gap (space) G2 between base plate 172D.Also promptly, through hole 140 is brought into play the function of supply streams, is formed at the opening of the bottom 140A of this through hole 140, and performance is supplied to liquid LQ the function of the liquid supply port of clearance G 2.Again, liquid supply port 140A is located at the Y direction both sides of the AR1 of view field that exposure light EL shone respectively, and is located at both allocations (the 1st position) of the optical path space both sides of exposure light EL in the optical path space outside of exposure light EL.
Liquid dipping machine structure 1 sees through supply stream (through hole) 140, will be supplied to inner space (comprising gap (space) G2 between projection optical system PL and base plate 172D) from liquid supply port (bottom) 140A from the liquid LQ that liquid supply department 11 sees off.Supply stream 140 forms the inclination that relative XY plane (substrate P surface) has about 45 degree.In addition, be the flow direction of the liquid LQ of decision above liquid supply port 140A is supplied to base plate 172D, also can or flap-like projection portion be set on base plate 172D at liquid supply port 140A configuration flap-like member.
The X-direction both sides of the relative AR1 of view field in the 2nd member 172 are formed with the inner slit-shaped through hole 130 of inclination board 172C that along inclined direction connects the 2nd member 172 respectively.In above the 2nd member 172, set zone and 173 of the 3rd members of the upper end 130B of through hole 130 be formed with the gap.Again, the upper end 130B of through hole 130 is to atmosphere opening, and the bottom 130A of through hole 130 is connected in the following T1 of projection optical system PL and gap (space) G2 between base plate 172D.In view of the above, the gas of clearance G 2, the upper end 130B that can see through through hole 130 discharges (exhaust) to space outerpace.Also promptly, be formed at the opening of the bottom 130A of through hole 130, the exhausr port function of the gas of performance delivery space G2, through hole 130 is promptly brought into play the function of exhaust flow path.Again, exhausr port (bottom) 130A is with the gas of clearance G 2, also be that gas around the image planes of projection optical system PL is connected.Again, exhausr port 130A is located at the X-direction both sides of the AR1 of view field that exposure light EL shone respectively, and is located at both allocations (the 2nd position) of the optical path space both sides of exposure light EL in the optical path space outside of exposure light EL.
As stated, liquid supply port 140A is located at both allocations (the 1st position) in the optical path space outside of exposure light EL.Again, base plate 172D, also the performance guiding is from the mobile guide member function of liquid LQ of liquid supply port 140A supply.Base plate (guide member) 172D is configured to prevent that gas from staying among the liquid LQ of optical path space of exposure light EL.Also be; Base plate 172D is configured to make the liquid LQ from liquid supply port 140A (being located at the 1st position in the optical path space outside of exposure light EL) supply can see through the optical path space flow direction of exposure light EL and the 2nd different position of the 1st position in this optical path space outside.In addition, base plate 172D has the tabular surface (par) 75 with the substrate P subtend, with above-mentioned example likewise, also have the function that makes liquid LQ stably be full of the light path of exposure light EL.
Figure 23 is the vertical view of base plate (guide member) 172D.In this example, the 2nd position outside the optical path space of exposure light EL is provided with exhausr port 130A, and base plate 172D is configured to make the liquid LQ from liquid supply port 140A supply to flow to the 2nd position that is provided with exhausr port 130A.Guide member 172D makes liquid LQ flow with the mode that in the optical path space of exposure light EL, can not produce eddy current.Also promptly, base plate 172D has opening 74 ', and this opening 74 ' forms the liquid LQ that the 1st position (disposing liquid supply port 140A) is supplied can flow to the 2nd position that is provided with exhausr port 130A, in case terminate in the interior eddy current that produces of the optical path space of exposure light EL.
Base plate 172D has: the 1st guidance part 181 forms from the 1st position that is provided with liquid supply port 140A toward the flow direction of the optical path space (AR1 of view field) of exposure light EL; And the 2nd guidance part 182, be to form optical path space from exposure light EL toward the flow direction that is provided with the 2nd position of exhausr port 130A.Also be; Through the 1st guidance part 181; Formation makes liquid LQ flow to the stream 181F of the optical path space of exposure light EL from liquid supply port 140A, and through the 2nd guidance part 182, formation makes liquid LQ flow to the stream 182F of the 2nd position (exhausr port 130A) from the optical path space of exposure light EL.
Intersect with the 1st guidance part 181 stream 181F that forms and the stream 182F that forms with the 2nd guidance part 182.The stream 181F that forms with the 1st guidance part 181 roughly flows liquid LQ along Y direction, the stream 182F that forms with the 2nd guidance part 182 roughly flows liquid LQ along X-direction.Form to overlook through the 1st guidance part 181 and the 2nd guidance part 182 and roughly be criss-cross peristome 74 ' again.Peristome 74 ' is disposed at the image planes side of projection optical system PL, and it is arranged to make exposure light EL through forming the roughly substantial middle portion of criss-cross peristome 74 '.Also promptly, the optical path space of exposure light EL is the cross part that is set in stream 181F that forms with the 1st guidance part 181 and the stream 182F that forms with the 2nd guidance part 182.
In this example, be quadrature roughly with the 1st guidance part 181 stream 181F that forms and the stream 182F that forms with the 2nd guidance part 182.Again, the width D 1 of the stream 181F that forms with the 1st guidance part 181 is roughly the same with the width D 2 of the stream 182F that forms with the 2nd guidance part 182.Again, in this example, the connecting portion 190 of the 1st guidance part 181 and the 2nd guidance part 182 forms curve-like (circular-arc).
Liquid supply port 140A is that liquid LQ is supplied to inner space (comprising the following T1 of projection optical system PL and gap (space) G2 between base plate 172D).Be supplied to the liquid LQ of clearance G 2 from liquid supply port 140A; Flowed to the optical path space of exposure light EL by the guiding of the 1st guidance part 181, and through behind the optical path space of exposure light EL, promptly by the optical path space outside of the 2nd guidance part 182 directed stream to exposure light EL.Also promptly, the stream of liquid LQ is crossover location or near the bending it at the 1st guidance part 181 and the 2nd guidance part 182.Perhaps, the stream of liquid LQ is in optical path space or near bending it.Liquid dipping machine structure 1 is guided liquid LQ and it is flowed through the 1st, the 2nd guidance part 181,182 with base plate 172D, is suppressed at the interior eddy current that produces of optical path space of exposure light EL.In view of the above,, also can gas (bubble) be expelled to the 2nd position in the optical path space outside of exposure light EL in the optical path space of exposure light EL, prevent that gas (bubble) from staying the optical path space of exposure light EL through flowing of liquid LQ even gas (bubble) is arranged.
Shown in Figure 19,21 etc., the slot part 73 that the 1st member 171 and the 2nd member are 172 forms around the peristome 74 ' of the optical path space that comprises exposure light EL.Further, slot part 73 forms and also surrounds the following 172R that constitutes tabular surface 75 parts.Be formed with the peristome 73A that is configured to substrate P (baseplate carrier PST above) subtend in slot part 73 bottoms.Peristome 73A forms to overlook and roughly is circular.On the other hand, also be formed with in slot part 73 upper ends and overlook the peristome 73B that roughly is circular.In the inclination board 171C upper end of the 1st member 171, be formed with notch part 171K, form broad portion in slot part 73 upper ends through this notch part 171K with the part of the 2nd member 172 subtends again.Then, form space 73W in this broadness portion and 173 of the 3rd members.It is inboard that the peristome 73B of slot part 73 upper ends is disposed at space 73W, and the peristome 73A that is located near slot part 73 bottoms (the image planes side of projection optical system PL) sees through slot part 73 with space 73W and is connected.Also promptly, space 73W is the image planes gas communication on every side that sees through slot part 73 (peristome 73A) and projection optical system PL.
Again, shown in figure 21, be formed with the circulation flow path 131 ' that is connected with space 73W in the part of the 3rd member 173, this circulation flow path 131 ' sees through pipe arrangement 133 with the suction device that contains vacuum system 132 and is connected.Circulation flow path 131 ' and suction device 132 are to use in reclaiming nozzle member 70 fully " and substrate P (baseplate carrier PST) between liquid LQ the time, see through slot part 73 and reclaim this liquid LQ.
In the 3rd member 173, be formed with the inner and outside hole portion 134 of circulating of space 73W that makes with circulation flow path 131 ' different positions again.The diameter of hole portion 134 (size) is little than the diameter (size) of circulation flow path 131 ', and little far beyond peristome 73A.In this example, the diameter of hole portion 134 is about 1mm.Logical via portion 134 makes space 73W to atmosphere opening, and in view of the above, the gas (clearance G 2) around the image planes of projection optical system PL also sees through peristome 73A, slot part 73 and space 73W to atmosphere opening.In view of the above, nozzle member 70 " and substrate P (baseplate carrier PST) between a liquid LQ part can come in and go out in slot part 73 inside.In view of the above, even nozzle member 70 " size (diameter) less, also can suppress liquid LQ and flow out to liquids recovery mouth 22 outsides.
Secondly, the nozzle member 70 that is provided with the above-mentioned structure of tool be described " liquid dipping machine structure 1 move.For liquid LQ is supplied on the substrate P, control device CONT promptly drives liquid supply department 11 and comes to see liquid LQ off from liquid supply department 11.The liquid LQ that sees off from liquid supply department 11 promptly flows into nozzle member 70 behind the supply pipe of flowing through " the upper end 140B of supply stream 14.Flow into the liquid LQ of the upper end 140B of supply stream 14, promptly flow in supply stream 140, and be supplied to the end face T1 of projection optical system PL and the space G2 between base plate 172D from liquid supply port 140A., before liquid LQ is supplied to space G2, being present in the gas part of space G2 here, is to be expelled to the outside through through hole 130 or peristome 74 '.In view of the above, can prevent that gas can be stayed the bad situation of space G2 when beginning space G2 supply fluid LQ, and prevent that gas part (bubble) from resulting from the bad situation among the liquid LQ.Because the liquid LQ that sees off from liquid supply department 11 flows in slot part (supply stream) 140 inboards, therefore be under the state that can not apply strength, to be supplied to space G2 to optical element LS1 side etc. again.Because liquid LQ is not attached to optical element LS1 side,, also can suppress functional material is brought influence even when for example therefore being coated with set functional material in optical element LS1 side again.
The liquid LQ that is supplied to space G2 promptly sees through the space that peristome 74 ' flows between tabular surface 75 and substrate P (baseplate carrier PST) after being full of space G2.At this moment; Because liquids recovery mechanism 20 reclaims the liquid LQ on the substrate P both quantitative with the per unit time; Therefore by seeing through the liquid LQ that peristome 74 ' flows into the space between tabular surface 75 and substrate P (baseplate carrier PST), and on substrate P, form desire big or small liquid and soak regional AR2.
Because liquid LQ from liquid supply port 140A supply system space G2; Be and after flowing to the optical path space (AR1 of view field) of exposure light EL by the guiding of the 1st guiding element 181; Promptly flowed to the optical path space outside of exposure light EL by 182 guidings of the 2nd guiding element; Even therefore in liquid LQ, produce gas part (bubble), also can pass through flowing of liquid LQ, this bubble is expelled to the optical path space outside of exposure light EL.Because base plate 172D makes liquid LQ flow with the mode that can in the optical path space of exposure light EL, not produce eddy current, so can prevent that bubble from staying the optical path space of exposure light EL again.Again,, therefore be present in the gas part (bubble) among the liquid LQ, promptly see through exhausr port 130A and be expelled to the outside sleekly because base plate 172D makes liquid LQ flow towards exhausr port 130A.Again; Even there is gas part (bubble) to exist among the liquid LQ in the space between tabular surface 75 and substrate P (baseplate carrier PST); The liquid LQ in the space between tabular surface 75 and substrate P (baseplate carrier PST) still is recovered with gas part (bubble) through reclaiming mouth 22.
During substrate P is carried out immersion exposure etc. formation liquid soak regional AR2 during in, the driving of suction device 132 is closed and stopped to the circulation flow path 131 ' that is connected in slot part 73.In view of the above; Even make substrate (baseplate carrier PST) soak regional AR2 (form and coat the AR1 of view field) when moving relative to liquid; The liquid LQ part that liquid soaks regional AR2 still can be come in and gone out in passing through via portion 134 to the slot part 73 (with reference to the arrow F3 among Figure 22) of atmosphere opening, and can prevent that solution stopping soaks the bad situations such as liquid LQ outflow of regional AR2.
Again; When the immersion exposure of substrate P finishes etc. with nozzle member 70 " with substrate P (baseplate carrier PST) between liquid LQ when reclaiming fully; control device CONT is except the liquids recovery mouth 22 that sees through liquids recovery mechanism 20 carries out the liquids recovery action; and open the circulation flow path 131 ' that is connected in slot part 73 simultaneously, drives suction device 132 to make the inner space of slot part 73 become negative pressure, and the liquids recovery that sees through the peristome 73A of slot part 73 is moved.So, through also using peristome 73A, and can positively reclaim nozzle member 70 with shorter time near substrate P (baseplate carrier PST) " and substrate P (baseplate carrier PST) between liquid LQ.At this moment, to reclaim the size of peristome 73A of mouthful function little owing to be used for bringing into play liquid LQ to the hole of atmosphere opening portion 134, therefore can make slot part 73 reach enough negative pressure and come withdrawal liquid LQ.
Again, when reclaiming nozzle member 70 fully " and substrate P (baseplate carrier PST) between liquid LQ the time, except the liquids recovery action of using liquids recovery mouth 22 or peristome 73A, also can add from the action of liquid supply port 140 blow gas.
In addition, during formation liquid soaks regional AR2 during substrate P is carried out immersion exposure etc. in, so long as can keep the degree of the state (shape etc.) that liquid soaks regional AR2, also can open the circulation flow path 131 ' that is connected in slot part 73 and drive suction device 132.Through this mode, and can see through the bubble among the slot part 73 withdrawal liquid LQ.
Again, shown in figure 24, also can connect the upper end 130B and the suction device (suction system) 135 of through hole 130, and see through through hole 130 connection exhausr port 130A and suction devices 135.Again, also can drive suction device 135 and make through hole 130 inboards become negative pressure, force to discharge the gas of space G2 for example beginning to supply when being used for forming liquid and soaking the liquid LQ of regional AR2.Through this mode, can prevent that also gas from staying the bad situation of space G2 and producing, and anti-ly terminate in the bad situation that liquid LQ produces gas part (bubble) and produce.Also can when driving suction device 135, carry out immersion exposure, or in the immersion exposure of substrate P, stop the driving of suction device 135 substrate P again.
In addition, nozzle member 70 " though be to constitute, also can constitute by a member with the 1st, the 2nd, the 3rd member 171,172,173 3 members, or constitute by a plurality of members beyond three.
The 9th example
Figure 25 is the figure that shows the 9th example.The characteristic of this example is, the width D 1 of the stream 181F that the width D 2 of the stream 182F that forms with the 2nd guidance part 182 forms with the 1st guidance part 181 is little.In view of the above, can flow in the liquid LQ flow velocity of the stream 181F that forms with the 1st guidance part 181 relatively, improve the liquid LQ flow velocity that flows in the stream 182F that forms with the 2nd guidance part 182.In view of the above, liquid LQ that can be through high speed is expelled to the gas (bubble) of the optical path space of exposure light EL rapidly and sleekly the optical path space outside of exposure light EL.
The 10th example
Figure 26 is the figure that shows the 10th example.The characteristic of this example is; The width D 2 of the stream 182F that forms with the 2nd guidance part 182, the optical path space (upstream side of AR1 of view field or the 2nd guidance part 182) that forms from exposure light EL narrows down to the 2nd position that is provided with exhausr port 130A (or downstream of the 2nd guidance part 182) gradually.Even this kind formation; Also can flow in the liquid LQ flow velocity of the stream 181F that forms with the 1st guidance part 181 relatively; Improve the liquid LQ flow velocity that flows in the stream 182F that forms with the 2nd guidance part 182, and gas (bubble) is expelled to the optical path space outside of exposure light EL rapidly and sleekly.
The 11st example
Figure 27 is the figure that shows the 11st example.The characteristic of this example is that the connecting portion 190 of the 1st guidance part 181 and the 2nd guidance part 182 forms linearity, is formed with the bight in the 1st guidance part 181 and 182 of the 2nd guidance parts.Even this kind formation also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
The 12nd example
Figure 28 is the figure that shows the 12nd example.The characteristic of this example is; Near set zone among the stream 181F that forms with the 1st guidance part 181, the liquid supply port 140A (flow path width); Form from liquid supply port 140A narrow down gradually to the optical path space (AR1 of view field) of exposure light EL (from the upper reaches to downstream); Near set zone among the stream 182F that forms with the 2nd guidance part 182, the exhausr port 130A (flow path width) forms from exhausr port 130A narrow down gradually to the optical path space (AR1 of view field) of exposure light EL (from the upper reaches to downstream).Again, in this example, the 1st guidance part 181 roughly meets at right angles with the 2nd guidance part 182 and intersects.Even this kind formation also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
The 13rd example
Figure 29 is the figure that shows the 13rd example.The characteristic of this example is that liquid supply port 140A only is provided with one.Again, be quadrature roughly with the 1st guidance part 181 stream 181F that forms and the stream 182F that forms with the 2nd guidance part 182, peristome 74 ' forms to overlook and roughly is the T font.Even this kind formation also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
The 14th example
Figure 30 is the figure that shows the 14th example.The characteristic of this example is, with the 1st guidance part 181 stream 181F that forms and the stream 182F that forms with the 2nd guidance part 182 quadrature not, but with the set angular cross beyond 90 degree.Again; Liquid supply port 140A (the 1st position); Be located in the exterior lateral area of optical path space (AR1 of view field) of exposure light EL, from the position of the AR1 of view field in Y direction position deflection θ Z direction side by side, exhausr port 130A (the 2nd position) also be located at from throw the position of color regional AR1 in X-direction position deflection θ Z direction side by side.Even this kind formation also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
The 15th example
Figure 31 is the figure that shows the 15th example.The characteristic of this example is, each liquid supply port 140A and exhausr port 130A are located in the optical path space exterior lateral area of exposure light EL three both allocations respectively.In this example, liquid supply port 140A and exhausr port 130A are in optical path space (AR1 of the view field) exterior lateral area at exposure light EL, roughly uniformly-spaced to be configured to surround the optical axis AX of projection optical system PL alternately.Again, it is with set angular cross that many stream 181F that form with the 1st guidance part 181 reach many stream 182F that form with the 2nd guidance part 182.Even this kind formation also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
The 16th example
Figure 32 is the figure that shows the 16th example.The characteristic of this example is; Liquid supply port 140A (the 1st position) be provided in a side of in optical path space (AR1 of the view field) exterior lateral area of exposure light EL with the AR1 of view field in Y direction position side by side, exhausr port 130A (the 2nd position) be provided in a side of from the position of the AR1 of view field in Y direction position deflection θ Z direction side by side.In this example, exhausr port 130A (the 2nd position) is provided in a side of optical path space (AR1 of the view field) exterior lateral area from exposure light EL, from leave the position of about 45 degree to θ Z direction in Y direction position side by side with the AR1 of view field.Again, base plate 172D has: the 1st guidance part 181 forms from the flow direction of the optical path space of the past exposure light EL of liquid supply port 140A; And the 2nd guidance part 82, form flow direction from the optical path space of exposure light EL toward exhausr port 130A.Stream 181F so that the 1st guidance part 181 forms roughly flows liquid LQ along Y direction.On the other hand; With the stream 182F that the 2nd guidance part 182 forms, has the 2nd regional 182Fb that the 1st regional 182Fa that liquid LQ roughly flows along X-direction and the liquid LQ that makes the 1st regional 182Fa that flows through are flowed to exhausr port 130A.Through the 1st regional 182Fa of stream 181F and stream 182F, formation is overlooked and roughly is criss-cross peristome 74 '.According to this kind structure; Even there is restriction the position in that liquid supply port 140A or exhausr port 130A are set; Also can suppress the generation of eddy current, prevent that gas (bubble) from staying the liquid LQ of the optical path space of exposure light EL, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
In addition; If can suppress eddy current produces; And can gas (bubble) be expelled to the optical path space outside of exposure light EL; The number of liquid supply port 140A and exhausr port 130A and configuration and to should liquid supply port 140A and the stream 181F of exhausr port 130A, the shape of 182F etc. can be set arbitrarily.For example, a plurality of liquid supply port 140A and exhausr port 130A more than four can be set also, or the number of liquid supply port 140A and exhausr port 130A is differed from one another, or also can be with unequal arranged spaced liquid supply port 140A and exhausr port 130A.The number of liquid supply port 140A and exhausr port 130A and configuration and to should liquid supply port 140A and the stream 181F of exhausr port 130A; The shape of 182F etc.; Preferably make it reach optimization according to experiment or analog result, can suppress eddy current generation, and can gas (bubble) be expelled to the optical path space outside of exposure light EL.
In addition; In above-mentioned the 8th to 16 example, though liquid dipping machine structure 1, though through base plate (guide member) 172D; The liquid LQ that the liquid supply port 140A that is located at the 1st position is supplied flows to and is located at the exhausr port 130A of the 2nd position, but also can exhausr port 130A be located at the 2nd position.Even there is not exhausr port 130A, also can be through the flowing of liquid LQ, will be expelled to the optical path space outside of exposure light EL in the gas part (bubble) of the optical path space of exposure light EL, prevent that gas from staying among the liquid LQ of optical path space of exposure light EL.On the other hand, through exhausr port 130A being set, and can discharge gas sleekly from the optical path space of exposure light EL in the 2nd position.
Again; In above-mentioned the 8th to the 16th example; Though liquid dipping machine structure 1 to the AR1 of view field supply fluid LQ, also can for example be located at the X-direction both sides respectively with the relative AR1 of view field of liquid supply port 140A along Y direction, again along X-direction to the AR1 of view field supply fluid LQ.
In addition, in above-mentioned the 1st to the 16th example, be formed at nozzle member 70 following inclined-planes (below the porous member) and also can be curved surface.In illustrated above-mentioned the 2nd to the 4th example of Fig. 9 to Figure 11, also can wall portion 76 be located at following 2 peripheries of porous member 25 again.
In addition, in above-mentioned the 1st to the 16th example,, also can not dispose porous member 25 though dispose porous member 25 in liquids recovery mouth 22.Even this moment; For example below nozzle member 70, be provided with and the distance of the optical axis AX of exposure light EL is then longer and the substrate P surface between big more inclined-plane, interval; And the liquids recovery mouth is located at both allocations on this inclined-plane; Also can keep the shape of interface LG in view of the above, prevent that bubble from resulting from the medium bad situation of liquid LQ that liquid soaks regional AR2.Also can dwindle the size that liquid soaks regional AR2 again.
Again; In above-mentioned the 1st to the 16th example; Though the inclined-plane below nozzle member 70 (below the porous member) is provided with the liquids recovery mouth; As long as be maintained at desired state but can the liquid of liquid LQ be soaked regional AR2, can be not beveled be formed in below the nozzle member 70 yet, and with the face of tabular surface 75 almost parallels (high) with one side on the liquids recovery mouth is set.Also be; When liquid LQ is big to the contact angle of substrate P; Or from the recovery ability of liquids recovery mouth 22 withdrawal liquid LQ when higher etc.; Also can under the state that liquid LQ is spilt, reclaim even increase the translational speed of substrate P, also can the liquids recovery mouth be located at the face with tabular surface 75 parallel (with the one side height).
In above-mentioned the 1st to the 16th example,,, also can omit the setting of wall portion 76 if can suppress the spilling of liquid LQ the time though the inclined-plane below being formed at nozzle member 70 (below the porous member) is provided with wall portion 76 on every side again.
Again, in above-mentioned the 1st to the 16th example, be located at nozzle member, also can omit this slot part 73 though will have with the slot part 73 of the opening 73A subtend of substrate P.At this moment, soak state, can use liquids recovery mouth 22 that the liquid LQ of the image planes side of all projection optical system PL is reclaimed for the space of the image planes side that makes projection optical system PL becomes non-liquid.At this moment, like the 6th to the 16th example, when being formed with the opening of the space G2 that is connected in above the base plate 72D and between optical element LS1, also can be parallel next from this opening withdrawal liquid LQ with the liquids recovery action of liquids recovery mouth 22.
Again; The nozzle member nozzle member 70 of above-mentioned the 1st to the 16th example; Though be that a part with tabular surface (par) 75 is formed between projection optical system PL and the substrate P; And form inclined-plane (below the porous member) in its outside, but also can be not the part of tabular surface be disposed under the projection optical system PL, but the optical axis of projection optical system PL is disposed at the end face T1 outside (on every side) of projection optical system PL relatively.At this moment, tabular surface 75 also can be roughly high with one side with the end face T1 of projection optical system PL, or also can make the Z-direction position of tabular surface 75, be positioned at relative projection optical system PL end face T1 past+the Z direction or-the Z direction leaves part.
In above-mentioned the 1st to the 5th example,, a plurality of supply openings separated from one another can be set also though liquid supply port 12 is to form the narrow annular channel shape with the mode of surrounding the AR1 of view field again.At this moment,, can (X-direction both sides or Y direction both sides) respectively establish a supply opening, also can respectively establish (amounting to four a) supply opening at the X of the AR1 of view field axle and Y direction both sides in view field AR1 both sides though the position of supply opening does not have special qualification.Again, soak regional AR2, also can toward deciding the position that direction leaves a supply opening only be set at the relative AR1 of view field so long as can form the liquid of being desired.Again, during from a plurality of supply opening supply fluid LQ, also can adjust, come from the liquid of the different amounts of each supply opening supply from the amount of the liquid LQ of each supply opening supply.
Again, in above-mentioned the 1st to the 16th example, though the optical element LS1 of projection optical system PL is the lens element with refracting power, the planopaallel plate that also can use no refracting power is as optical element LS1.
Again; In above-mentioned the 1st to the 16th example; Though be the optical path space that is full of the optical element LS1 image planes side (following side) of projection optical system PL with liquid LQ; But also can adopt such as No. 2004/019128 instructions of International Publication as the announcement, with liquid LQ be full of projection optical system PL optical element LS1 upper face side and below the structure of optical path space of side two sides.
As stated, the liquid LQ of this example is to use pure water.The advantage of pure water is for can be easily locating to obtain in a large number at semiconductor fabrication factory etc., and the photoresist on the substrate P or optical element (lens) etc. is had no adverse effects.Again, pure water is except having no adverse effects to environment, because the amount of impurity is extremely low, and therefore can expect that also clean optical element the is arranged effect of (being located at the surface and the projection optical system PL front end face of substrate P).When the pure water purity of being supplied from factory etc. is low, also can makes exposure device possess ultrapure water and make device again.
Again; Pure water (water) is that the refractive index n of the exposure light EL about 193nm is roughly about 1.44 to wavelength; If use ArF PRK (wavelength 193nm) when being used as the light source of exposure light EL; Then wavelength decreases being 1/n, also being about about 134nm on the substrate P, can obtain high resolving power.Moreover; Because depth of focus amplifies about n times, also promptly about about 1.44 times with in air, comparing; Therefore so long as can guarantee the depth of focus of same degree when in air, using the time, can more increase the numerical aperture of projection optical system PL, from then on also can improve resolution.
In addition, when using aforesaid immersion method, the numerical aperture NA of projection optical system PL can become 0.9～1.3 sometimes.So, when the numerical aperture NA of projection optical system PL becomes big,, therefore preferably use polarizing illumination because the existing any polar biased light that is used as exposure light worsens imaging performance because of the polarisation effect is different sometimes.At this moment; Preferably cooperate the linear polarization illumination of line pattern long side direction of line/space (line andspace) pattern of mask (graticule), and penetrate more S polarized component (TE polarized component), also be the diffraction light of the polarization direction composition of pattern long side direction along the line from the pattern of mask (graticule).At projection optical system PL and when coating between the photoresist on substrate P surface full of liquid; And at projection optical system PL and coat the situation that is full of air (gas) between the photoresist on substrate P surface and compare; Because helping to improve the photoresist surface transmissivity of diffraction light of the S polarized component (TE polarized component) of contrast can uprise; Even therefore the numerical aperture NA of projection optical system surpasses at 1.0 o'clock, also can obtain high imaging performance.Again, if appropriate combination phase-shift mask version or as the special oblique incidence illumination (particularly dipole (dipole) illumination) of opening the line of engagement pattern long side direction that flat 6-188169 communique disclosed etc., then have more effect.Particularly, the combination of linear polarization illumination and dipole illumination, when the cycle of line/space pattern direction is limited to a set direction or sectional hole patterns quite effective during along the intensive formation of a set direction.For example; And with linear polarization illumination and dipole illumination; During semi-transparent (half-tone) type phase-shift mask version (pattern about half spacing 45nm) of the transmissivity of throwing light on 6%; The illumination σ of the circumscribed circle defined of two light beams that form dipole in the pupil face of illuminator is made as 0.95, each beam radius of its pupil plane is made as 0.125 σ, when the numerical aperture of projection optical system PL is made as NA=1.2, can uses any polar biased light that depth of focus (DOF) is increased about 150nm.
Again; Be exposure light for example with the ArF PRK; The projection optical system PL of the reduction magnification of use about 1/4; With fine line/space pattern (the for example line/space about 25～50nm) when being exposed on the substrate P; According to the difference of mask M structure (the for example trickle degree of pattern or the thickness of chromium), make mask M bring into play the effect of Polarizer through waveguide effect (Wave guide), penetrate the diffraction light of the diffraction light of S polarized component (TE polarized component) and make more than the P polarized component (TM polarized component) that contrast is descended from mask M.At this moment, though preferably use the illumination of above-mentioned linear polarization, even with any polar biased light mask M that throws light on, and the numerical aperture NA of projection optical system PL also can obtain high analysis feature when being situation bigger as 0.9～1.3.
Again; When being exposed to the atomic fine rule/space pattern on the mask M on the substrate P; Through wiregrating (Wire Grid) though effect also might make P polarized component (TM polarized component) greater than S polarized component (TE polarized component); But be exposure light for example with the ArF PRK; And the projection optical system PL that uses the reduction magnification about 1/4 is when will the line/space pattern big than 25nm being exposed on the substrate P; Owing to penetrate the diffraction light of the diffraction light of S polarized component (TE polarized component),, also can obtain high analysis feature even therefore the numerical aperture NA of projection optical system PL is when being situation bigger as 0.9～1.3 more than P polarized component (TM polarized component) from mask M.
Moreover; Except the linear polarization illumination (S polarizing illumination) that the line pattern long side direction with mask (graticule) cooperates; Opening the announcement of flat 6-53120 communique institute like the spy, will be that polarizing illumination method and the oblique incidence illumination of round wiring (week) the direction linear polarization at center makes up and also have effect with the optical axis.Particularly; Except the line pattern that the set direction in pattern edge of mask (graticule) is extended; Mix at the line pattern that extends along a plurality of different directions under the situation of (the different line/space pattern of cycle direction mixes), same as spy opens announcements of flat 6-53120 communique institute, through also with polarizing illumination method (edge is the wiring direction linear polarization of the circle at center with the optical axis) and endless belt illumination; Even when the numerical aperture NA of projection optical system PL is big, also can obtain high imaging performance.For example; And with polarizing illumination method (along being the wiring direction linear polarization of the circle at center) and endless belt illumination (endless belt is than 3/4) with the optical axis; Under the situation of the semi-transparent type phase-shift mask version (pattern about half spacing 63nm) of the transmissivity of throwing light on 6%; With illumination σ be made as 0.95, when the numerical aperture of projection optical system PL is made as NA=1.00; Use the situation of any polar biased light that depth of focus (DOF) is increased about 250nm,, depth of focus is increased about 100nm when half spacing is the numerical aperture of pattern and projection optical system PL about 55nm when being NA=1.2.
In this example, optical element LS2 is installed on projection optical system PL front end, can carries out the adjustment of the optical characteristics of projection optical system PL, for example aberration (spherical aberration, intelligent image difference etc.) through these lens.In addition, as the optical element that is installed on projection optical system PL front end, also be used in the optical sheet of the optical characteristics of adjustment projection optical system PL.Or also can make the planopaallel plate of exposure light EL transmission.
In addition, because of liquid LQ flows optical element and the pressure between substrate P of the projection optical system PL front end produced when big, can this optical element not made permutable structure yet, but optical element firmly is not fixed into and can moves because of its pressure.
Again, in this example, though be to be full of the formation between projection optical system PL and substrate P with liquid LQ, but also for example in the formation that the cover glass that planopaallel plate constituted is installed on full of liquid LQ under the surperficial state of substrate P.
Again; Use the projection optical system PL of the example of Fig. 1 to Figure 32 explanation; Though be the optical path space of image planes side that is full of the optical element of front end with liquid; But also can adopt such as No. 2004/019128 communique of International Publication as the announcement, also be full of the projection optical system of optical path space of the mask M side of optical element LS1 with liquid.
In addition, though the liquid of this example is water, the also liquid beyond the water.For example, the light source of exposure light is F 2During laser, because this F 2Laser can't transmission water, therefore also can use to make F 2The liquid of laser-transmitting is used as the 1st, the 2nd liquid LQ1, LQ2, for example cross perfluoroalkyl polyether (PFPE, perfluoro-polyether) or fluorine series wet goods fluorine series fluid also can.At this moment, for example form film with the little molecular configuration material of polarity that comprises fluorine, in view of the above to the 1st, the 2nd liquid LQ1, the part of LQ2 contact is carried out the lyophily processing.Again; As the 1st, the 2nd liquid LQ1; LQ2, other also can use to exposure light EL tool transmittance and refractive index is higher as far as possible and to coat projection optical system PL and substrate P the surface the more stable liquid (for example san-mou oil (cedar oil)) of photoresist.At this moment, also according to employed the 1st, the 2nd liquid LQ1, the polarity of LQ2 is carried out in surface treatment.Again, also can use have desire refractive index various fluids substitute liquid LQ1, the pure water of LQ2, for example supercritical fluid or high index of refraction gas.
Again; In using Fig. 1,4,15,16,18,21,22 and 24 explanation; Though be under the state of T1 subtend below making substrate P and optical element LS1; Be full of the following T1 of optical element LS1 and the space between substrate P with liquid LQ, even but during projection optical system PL and other member (for example top 91 of baseplate carrier etc.) subtend, also can be full of between projection optical system PL and other member with liquid.
Again; Substrate P as above-mentioned each example; Except the semiconductor wafer of semiconductor element manufacturing usefulness, also can be applicable to glass substrate that display device uses, ceramic wafers that thin-film head is used or at master (synthetic quartz, silicon wafer) of employed mask of exposure device or graticule etc.
In addition; In the above-mentioned example, though be used in the transmitance mask (graticule) that forms set light-shielding pattern (or phase pattern, dim light pattern) on the substrate of tool transmitance; But also can use for example United States Patent (USP) the 6th; The electronics mask that 778, No. 257 communique disclosed replaces this graticule, and this electronics mask is according to treating that the electronic bits of data of exposing patterns forms transmission pattern, reflection graphic patterns or luminous pattern.
Again, the present invention also can be applicable to, such as No. 2001/035168 instructions of International Publication announcement, be formed at the exposure device (etching system) that on wafer W, forms line/space pattern on the wafer W through interfering line.
Exposure device EX; Make mask M and substrate P come the pattern of mask M is carried out the scanning exposure apparatus (scanning stepper) of the step-scan mode of scan exposure except being applicable to moved further; Also can be applicable to the projection aligner (ledex) of stepping repetitive mode; It is to make under the static state of mask M and substrate P, makes the pattern single exposure of mask M, and substrate P stepping is in regular turn moved.
Again; As exposure device EX; Also can be suitable for following exposure device; That is: make under the roughly static state of the 1st pattern and substrate P, use projection optical system (for example 1/8 reduction magnification and do not contain the refractive projection optical system of reflecting element) with the reduced image single exposure of the 1st pattern in the exposure device of the mode of substrate P.At this moment; Further in thereafter; Also can be applicable to the single exposure device of juncture, it is to make under the roughly static state of the 2nd pattern and substrate P, uses this projection optical system to make the overlapping and single exposure of reduced image and the 1st pattern part of the 2nd pattern in substrate P.Again,, also can be applicable to the exposure device of stepping juncture as the exposure device of juncture, its be will at least 2 on substrate P the overlapping and transfer printing of pattern parts, and moving substrate P in regular turn.
Again, the present invention also can be applicable to the two microscope carrier type exposure devices that possess two baseplate carriers that keep substrate.The structure and the exposure actions of two microscope carrier type exposure devices for example are disclosed in the spy and open flat 10-163099 number and spy and open flat 10-214783 number (corresponding United States Patent (USP) 6,341,007,6,400; 441,6,549,69 and 6,590; 634), special table 2000-505958 number (corresponding United States Patent (USP) 5,969,441) or United States Patent (USP) 6; 208,407, in the scope that the state decree of the appointment of border application case or selection is allowed home, quote the part of the announcement of above-mentioned document as this paper record.
Moreover also applicable to putting down the exposure device that the 11-135400 communique is disclosed like special opening, this exposure device possesses in the present invention: keep the baseplate carrier of substrate P and load being formed with the reference feature of reference mark or the instrumentation microscope carrier of various photoelectric sensors.
Kind as exposure device EX; Be not limited in order to the semiconductor element exposure device for making of semiconductor element pattern exposure in substrate P, and also can adaptable across the liquid crystal display cells manufacturing with or the exposure device of display manufacturing usefulness or in order to the exposure device of making thin-film head, photographic element (CCD), graticule and mask etc. etc.
When in baseplate carrier PST or mask microscope carrier MST use linear motor, also can adopt the air supporting type that has used air bearing and use the magnetic of Lorenz (Lorentz) power or reactance to float the arbitrary type in the type.Again, each microscope carrier PST, MST, the type that also moves, but or the no guiding element type of also not establishing guiding element along guiding element.In the example of microscope carrier use linear motor, be to be disclosed in United States Patent (USP) 5,623,853 and 5,528,118, in the scope that the state decree of the appointment of border application case or selection is allowed home respectively, quote the part of the record content of these documents as this paper record.
Driving mechanism as each microscope carrier PST, MST also can use planar motors, and it is to make two-dimensional arrangement that the magnet unit of magnet and the armature unit subtend that two-dimensional arrangement has coil arranged, and drives each microscope carrier PST, MST through electromagnetic force.At this moment, if with the arbitrary side in magnet unit and the armature unit be connected in microscope carrier PST, MST and with the opposing party in magnet unit and the armature unit be arranged at microscope carrier PST, MST moves side.
The reacting force that is produced that moves because of baseplate carrier PST also can use the frame member mechanically to be released into ground (ground connection), makes it not reach projection optical system PL.The disposal route of this reacting force, for example, United States Patent (USP) 5; 528; The content that 118 (spies open flat 8-166475 communique) institute discloses in detail in the scope that the state decree of the appointment of border application case or selection is allowed home, is quoted the part that the record content of the document is put down in writing as this paper.
The reacting force that is produced that moves because of baseplate carrier MST also can use the frame member mechanically to be released into ground (ground connection), makes it not reach projection optical system PL.The disposal route of this reacting force, for example, United States Patent (USP) 5; 874; The content that 820 (spies open flat 8-330224 communique) institute discloses in detail in the scope that the state decree of the appointment of border application case or selection is allowed home, is quoted the part that the record content of the document is put down in writing as this paper.
As stated, the exposure device EX of the example of the application's case is through assembling various subsystems (comprising each cited in claims of the present invention inscape), can keep the mode manufacturing of set mechanical precision, electric precision, optical accuracy.For guaranteeing these various precision; Before and after assembling, carry out various optical systems are carried out in order to the adjustment of reaching optical accuracy, various mechanical systems are carried out in order to the adjustment of reaching mechanical precision, various electrical systems are carried out in order to reach the adjustment of electric precision.From the assembling processing procedure of various subsystems to exposure device, comprise the distribution connection of mechanical connection, circuit, the pipe arrangement connection of pneumatic circuit etc.Certainly, before the assembling processing procedure of various subsystems to exposure device, each subsystem other assembling processing procedure is arranged.After the assembling processing procedure of various subsystems to exposure device finishes, promptly comprehensively adjust, with the various precision of guaranteeing that exposure device is whole.In addition, the manufacturing of exposure device is preferably carried out in the toilet that temperature and cleanliness etc. is all managed.
The microcomponent of semiconductor element; Shown in figure 33; Be via following step manufacturing, that is: carry out function, the performance design of microcomponent step 201, according to this design procedure make mask (graticule) step 202, make exposure-processed step 204, element number of assembling steps (comprising cutting step, engagement step, encapsulation step) 205, inspection step 206 etc. that the step 203 of the substrate of composed component base material, exposure device EX through aforementioned example are exposed to reticle pattern substrate.
According to the present invention, even, therefore can carry out exposure-processed well with good efficiencies owing to when making the sweep velocity high speed, also can the liquid of liquid be soaked zone maintenance in desired state.

Claims (62)

1. an exposure device is to see through liquid exposure light is shone in substrate, so that this base plate exposure is characterized in that possessing:
Optical system has the end face with the substrate subtend, and the exposure light that shines in substrate is passed through;
Baseplate carrier, have the substrate that keeps this substrate keep tool and to remain in can liquid be remained under this optical system when this substrate keeps the circumference of this substrate of tool to make public above; And
Liquid dipping machine structure is supplied this liquid and is reclaimed this liquid;
This liquid dipping machine structure has: board member, have with and the mode of the parallel subtend of this substrate be disposed between this substrate and this optical system end face and be configured to surround the tabular surface of the light path of exposure light; Supply opening is supplied to the space between this optical system end face and this board member with liquid; The liquids recovery mouth, the position configuration of more leaving this exposure light light path at the tabular surface than this board member becomes and the substrate subtend, reclaims from the liquid of this supply opening supply; And be different from this supply opening, be connected in the opening in the space between this optical system end face and this board member, during from this supply opening supply fluid, this opening is connected in suction device.
2. exposure device as claimed in claim 1 is characterized in that, this board member, have with the face of this optical system end face subtend and with this tabular surface of this substrate subtend.
3. exposure device as claimed in claim 1 is characterized in that, this supply opening is disposed at the light path both sides of this exposure light.
4. exposure device as claimed in claim 1 is characterized in that, this supply opening can supply gas to the space between this optical system end face and this board member.
5. exposure device as claimed in claim 1 is characterized in that, sees through this opening and discharges the liquid in the space between this optical system end face and this board member.
6. exposure device as claimed in claim 1 is characterized in that, sees through this opening and reclaims the liquid in the space between this optical system end face and this board member.
7. exposure device as claimed in claim 6 is characterized in that, soaks state for the optical path space that makes this exposure light becomes non-liquid, and carries out the recovery of liquid from this opening.
8. exposure device as claimed in claim 1 is characterized in that, this opening can supply gas to the space between this optical system end face and this board member.
9. exposure device as claimed in claim 1 is characterized in that, this board member to the shape of irradiation area that should exposure light, and has the set shaped aperture that this exposure light passes through.
10. exposure device as claimed in claim 1 is characterized in that this board member has the opening that this exposure light passes through;
Be supplied to the one side of this board member and the liquid in the space between this optical system end face from this supply opening, can see through this opening and flow into the another side of this board member and the space between this substrate.
11. exposure device as claimed in claim 10 is characterized in that, this supply opening is disposed at the tabular surface top of this board member.
12. exposure device as claimed in claim 1 is characterized in that, this supply opening is seen liquid off towards the direction parallel with this substrate.
13. exposure device as claimed in claim 1 is characterized in that, in the exposure of this substrate, continues to reclaim a mouthful withdrawal liquid from this supply opening supply fluid and from this, and is full of between the end face and this substrate of this optical system with liquid.
14. exposure device as claimed in claim 1 is characterized in that, this liquid dipping machine structure, and the light path of this exposure light has the inclined-plane to this tabular surface inclination in the tabular surface outside of this board member relatively.
15. exposure device as claimed in claim 14 is characterized in that, this recovery degree of lip-rounding is formed in this inclined-plane.
16. exposure device as claimed in claim 14 is characterized in that, the light path of this recovery mouthful relative this exposure light is formed at this outside, inclined-plane.
17. exposure device as claimed in claim 14 is characterized in that, this liquid dipping machine structure can form the interface that liquid soaks the zone between this inclined-plane and this substrate, and the interface that this liquid soaks the zone is to be formed at the last branch of this substrate.
18. exposure device as claimed in claim 14 is characterized in that, relative this tabular surface in this inclined-plane is with the angle tilt of 3～20 degree.
19. exposure device as claimed in claim 1 is characterized in that, disposes porous member in this liquids recovery mouth.
20. exposure device as claimed in claim 1 is characterized in that, this liquids recovery degree of lip-rounding becomes surrounds this tabular surface.
21. exposure device as claimed in claim 1 is characterized in that, this liquid dipping machine structure has the slot part that forms the encirclement opening that this exposure light passed through;
This slot part has and is configured to and the peristome of this substrate surface subtend and peristome to atmosphere opening.
22., it is characterized in that this liquid dipping machine structure has the recovery tube and the liquids recovery portion that be connected in this recovery tube of confession from the liquid flow of this liquids recovery mouth like each described exposure device in the claim 1 to 21;
This liquids recovery portion has the accumulator tank that is connected in this recovery tube one end, is connected in this accumulator tank top and connects the pipe arrangement of this accumulator tank and vacuum system and is connected in this accumulator tank bottom and is used for discharging the pipe arrangement of the liquid that is reclaimed by this accumulator tank.
23. exposure device as claimed in claim 22 is characterized in that, this recovery tube is connected in this accumulator tank top.
24., it is characterized in that this liquid dipping machine structure has the optical element nozzle member on every side that is configured to surround this optical system leading section like each described exposure device in the claim 1 to 21;
This opening that this nozzle member has this board member, this supply opening, this liquids recovery mouth and is connected in this suction device.
25. a manufacturing method is characterized in that:
Be to use each described exposure device in the claim 1 to 24.
26. the nozzle member of a ring-type is used for seeing through liquid and will shines from the exposure light of optical system in substrate with the exposure device with this base plate exposure, this nozzle member is configured to surround around the optical element of this optical system leading section, it is characterized in that possessing:
Board member, have with and the mode of the parallel subtend of this substrate be disposed between this substrate and this optical system end face and be configured to surround the tabular surface of the light path of this exposure light;
Supply opening is configured to and this substrate surface subtend, from this substrate top liquid is supplied on this substrate; And
The liquids recovery mouth, the light path of this exposure light is disposed at the position that the tabular surface than this board member leaves and is configured to and this substrate subtend relatively, is used for reclaiming the liquid from this supply opening supply.
27. nozzle member as claimed in claim 26 is characterized in that, this supply opening this light path relatively is disposed at this tabular surface outside.
28. nozzle member as claimed in claim 26 is characterized in that, this liquids recovery mouth is disposed at this supply opening outside.
29. nozzle member as claimed in claim 26 is characterized in that, this board member has the face with this optical system end face subtend.
30. nozzle member as claimed in claim 26 is characterized in that, this board member to the shape of irradiation area that should exposure light, and has the set shaped aperture that this exposure light passes through.
31. nozzle member as claimed in claim 30 is characterized in that, the shape of the opening that this exposure light passes through is oval.
32. nozzle member as claimed in claim 26 is characterized in that, disposes porous member in this liquids recovery mouth.
33. nozzle member as claimed in claim 26 is characterized in that, this tabular surface is a lyophily.
34. nozzle member as claimed in claim 26 is characterized in that, the part of this tabular surface is a lyophily.
35. nozzle member as claimed in claim 26 is characterized in that, this liquids recovery degree of lip-rounding becomes surrounds this tabular surface.
36. nozzle member as claimed in claim 26 is characterized in that, possesses the hole portion of configurable this optical element;
Between this hole portion medial surface and this optical element side, be provided with the gap.
37., it is characterized in that this exposure device possesses the recovery tube and the liquids recovery portion that be connected in this recovery tube of confession from the liquid flow of this liquids recovery mouth like each described nozzle member in the claim 26 to 36;
This liquids recovery portion has the accumulator tank that is connected in this recovery tube one end, is connected in this accumulator tank top and connects the pipe arrangement of this accumulator tank and vacuum system and is connected in this accumulator tank bottom and is used for discharging the pipe arrangement of the liquid that is reclaimed by this accumulator tank.
38. nozzle member as claimed in claim 37 is characterized in that, this recovery tube is connected in this accumulator tank top.
39. nozzle member as claimed in claim 26 is characterized in that, the light path of this exposure light has the inclined-plane to this tabular surface inclination in the tabular surface outside of this board member relatively.
40. nozzle member as claimed in claim 39 is characterized in that, this liquids recovery degree of lip-rounding is formed in this inclined-plane.
41. nozzle member as claimed in claim 39 is characterized in that, this liquids recovery mouth light path of this exposure light relatively is formed at this outside, inclined-plane.
42. nozzle member as claimed in claim 39 is characterized in that, relative this tabular surface in this inclined-plane is with the angle tilt of 3～20 degree.
43. an exposure device is to see through liquid exposure light is shone in substrate, so that this base plate exposure is characterized in that possessing:
Projection optical system;
Baseplate carrier, have the substrate that keeps this substrate keep tool and to remain in can liquid be remained under this optical system when this substrate keeps the circumference of this substrate of tool to make public above; And
Liquid dipping machine structure is supplied this liquid and is reclaimed this liquid;
This liquid dipping machine structure has to form with this substrate surface subtend and with this substrate surface and becomes parallel par;
The par of this liquid dipping machine structure is configured to surround the view field that this exposure light shines between the image planes side end face of this projection optical system and this substrate;
The liquid supply port of this liquid dipping machine structure, with the mode of this substrate surface subtend relatively the light path of this exposure light be disposed at this outside, par.
44. exposure device as claimed in claim 43 is characterized in that, the liquids recovery mouth of this liquid dipping machine structure, and being configured to relatively, this view field is positioned at this outside, par and surrounds this par.
45. exposure device as claimed in claim 43 is characterized in that, the liquids recovery mouth of this liquid dipping machine structure, and being configured to relatively, this view field is positioned at this liquid supply port outside.
46. exposure device as claimed in claim 45 is characterized in that, this liquid dipping machine structure has the inclined-plane that forms with this substrate surface subtend, and the liquids recovery degree of lip-rounding of this liquid dipping machine structure is formed in this inclined-plane.
47. exposure device as claimed in claim 46 is characterized in that, this beveled becomes, when the distance of the optical axis of itself and this exposure light longer then big more with this substrate distance.
48. exposure device as claimed in claim 46 is characterized in that, this liquid dipping machine structure has in this inclined-plane periphery and to be used for suppressing the wall portion that this liquid spills.
49. exposure device as claimed in claim 44 is characterized in that, disposes porous member in this liquids recovery mouth.
50. exposure device as claimed in claim 43; It is characterized in that; This liquid dipping machine structure possesses and is formed with the tabular component that makes the peristome that this exposure light passes through, and is this par with the one side of this tabular component, and this tabular component is configured to and this substrate surface subtend.
51. exposure device as claimed in claim 43 is characterized in that, this liquid dipping machine structure continues the supply and the recovery of this liquid in the exposure of this substrate.
52. a manufacturing method is characterized in that:
Be to use each described exposure device in the claim 43 to 51.
53. an exposure method is through optical component and liquid exposure light to be shone in substrate, so that this base plate exposure is characterized in that:
Substrate is configured to the end face subtend with this optical component;
With liquid be supplied to board member one side in the light path that is configured to surround this exposure light between this optical component end face and this substrate, with this optical component end face between the space and from this space discharge gas, be full of with liquid between the another side and this substrate of space and this board member between this optical component end face and this substrate;
With with the parallel mode of the supply of this liquid from being configured to the recovery mouth withdrawal liquid with this substrate subtend, form liquid with the part on this substrate and soak the zone;
A part that sees through on this substrate forms the liquid that liquid soaks the zone, exposure light is shone in this substrate, so that this base plate exposure.
54. exposure method as claimed in claim 53 is characterized in that, the another side of this board member, comprise parallel with this substrate surface and with the tabular surface of this substrate subtend.
55. exposure method as claimed in claim 54 is characterized in that, this reclaims mouth, and the light path of this exposure light is disposed at this tabular surface outside relatively.
56. exposure method as claimed in claim 53 is characterized in that, this board member has the opening that this exposure light is passed through;
Be supplied to the one side of this board member and the liquid in the space between this optical component end face, can see through this opening and flow into the another side of this board member and the space between this substrate.
57. an exposure method is that the liquid of light path that sees through optical component and be full of end face and the exposure light between substrate of this optical component shines exposure light in this substrate, so that this base plate exposure is characterized in that, comprises:
Substrate is configured to, and between the end face of this optical component and this substrate, is configured to surround the action of one side subtend of board member of the light path of this exposure light;
From being configured to the action with the supply opening supply fluid of this substrate subtend;
With the supply of this liquid concurrently, from being configured to the action with the recovery mouth withdrawal liquid of this substrate subtend;
The supply through carrying out this liquid and the recovery of this liquid see through the liquid that the liquid that is formed on the last branch of this substrate soaks the zone exposure light are shone on this substrate, so that the action of this base plate exposure.
58. exposure method as claimed in claim 57 is characterized in that, this supply opening is supplied to liquid on this substrate from this substrate top.
59. exposure method as claimed in claim 57 is characterized in that, this supply opening, and this light path is at this one side outside supply fluid of this board member relatively.
60. exposure method as claimed in claim 57 is characterized in that, this liquids recovery mouth, and this light path is in this supply opening outside withdrawal liquid relatively.
61. exposure method as claimed in claim 57 is characterized in that, this liquids recovery mouth sees through the porous member withdrawal liquid.
62. exposure method as claimed in claim 57 is characterized in that, this liquids recovery mouth forms this one side of surrounding this board member.
CN2009101636954A 2004-06-10 2005-06-09 Exposure apparatus, exposure method, and method for producing elements Expired - Fee Related CN101639631B (en)

Applications Claiming Priority (9)

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JP2004172569 2004-06-10
JP2004172569 2004-06-10
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JP2004245260 2004-08-25
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JP2004-330582 2004-11-15

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US8681308B2 (en) * 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL2004362A (en) * 2009-04-10 2010-10-12 Asml Netherlands Bv A fluid handling device, an immersion lithographic apparatus and a device manufacturing method.
EP2521163A1 (en) * 2009-12-28 2012-11-07 Nikon Corporation Liquid immersion member, method for manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
CN117742084A (en) * 2020-12-25 2024-03-22 浙江启尔机电技术有限公司 Immersion liquid supply recovery device for improving pressure characteristic of immersion flow field

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