CN101634015B - Converting device of silicon wafer loading devices for PECVD - Google Patents
Converting device of silicon wafer loading devices for PECVD Download PDFInfo
- Publication number
- CN101634015B CN101634015B CN200910183760XA CN200910183760A CN101634015B CN 101634015 B CN101634015 B CN 101634015B CN 200910183760X A CN200910183760X A CN 200910183760XA CN 200910183760 A CN200910183760 A CN 200910183760A CN 101634015 B CN101634015 B CN 101634015B
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- slide glass
- plate body
- support arm
- chip slide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a converting device of silicon wafer loading devices for PECVD, which comprises a plate body, wherein the corner part of the plate body extends outwards to form four support arms by taking the center of the plate body as a center to form a radial shape so that the plate body is in a crisscross; one surface of the plate body is provided with a crisscross groove which corresponds to the crisscross; the width of the crisscross groove is equal to that of a frame rod of a silicon wafer loading device with a first specification; and the width of the support arms is a value of a difference of the side length of the silicon wafer loading device with a first specification and the side length of a silicon wafer loading device with a second specification and the width of the frame rod with a first specification. The converting device is installed in the crossing position of the silicon wafer loading device with a first specification, converts the silicon wafer loading device with a first specification into the silicon wafer loading device with a second specification, is used for producing a product with a second specification and can save the purchasing cost; after the converting device is disassembled, the product with a first specification can be produced, and the conversion is convenient.
Description
Technical field
The present invention relates to a kind of photovoltaic inductrial technology equipment, specifically be used for the corollary apparatus of flattening oven PECVD (plasma reinforced chemical vapour deposition).
Background technology
Solar cell mainly contains 125 types (being 125x125), 156 types specifications such as (being 156x156), and corresponding silicon chip slide glass device also has specifications such as 125 types, 156 types.When carrying out the technology of flattening oven PECVD, silicon chip is to be placed on the hook of silicon chip slide glass device of same specification, because flattening oven is a continuous production, the silicon chip slide glass device of configuration is wanted more than 10 at least.Because of its price is very expensive, some producer has only disposed the silicon chip slide glass device of 156 specifications, just needs to be equipped with in addition 125 types if produce the product of 125 specifications, thereby has increased purchase cost.
Summary of the invention
The present invention is directed to the problems referred to above, a kind of PECVD is provided the changing device with silicon chip slide glass device, this device is installed on the 156 type silicon chip slide glass devices, 156 types can be transformed into the silicon chip slide glass device of 125 types, can reduce purchase cost significantly.
According to technical scheme of the present invention: a kind of PECVD comprises plate body with the changing device of silicon chip slide glass device, and it is characterized in that: the bight of described plate body is that the center is outward extended with four support arms radially with the center of plate body, makes described plate body across; The one side setting of plate body and described cruciform corresponding cross groove; Described cross recessed width equates with the frame bar width of the silicon chip slide glass device of first kind of specification, and the width of support arm is the frame bar width sum that the difference of the length of side of the silicon chip slide glass device of the length of side of silicon chip slide glass device of first kind of specification and second kind of specification is added first kind of specification.
The infall of the support arm that each is adjacent is provided with transition arc.Be provided with half oval groove symmetrically on two outer sides of described support arm, the symmetric line of half oval groove is perpendicular to the sideline of described support arm, and described support arm is provided with circular hole, and the medullary ray of circular hole is on the symmetric line of half oval groove.In two support arms on being in same straight line, the outer end of a support arm and described cross recessed homonymy are provided with first shoulder, and the outer end of another support arm and described cross recessed opposition side are provided with second shoulder.
Technique effect of the present invention is: the present invention is installed on the silicon chip slide glass device infall of first kind of specification, and the silicon chip slide glass device of first kind of specification is converted to the silicon chip slide glass device of second kind of specification, is used to produce the product of second kind of specification, can save purchase cost; After removing the present invention, can produce the product of first kind of specification again, conversion is convenient; The infall of support arm is provided with transition arc, can be assembled into the monocrystalline silicon piece slide glass device of second kind of specification, can be used for the produce single crystal silicon chip.
Description of drawings
Fig. 1 is the structural representation of a square frame in the 156 type silicon chip slide glass devices;
Fig. 2 is a structural representation of the present invention;
Fig. 3 is installed on structural representation on the 156 type silicon chip slide glass devices for the present invention.
Embodiment
The present invention is the changing device of a kind of PECVD with silicon chip slide glass device, and specific embodiment is that 156 type silicon chip slide glass devices are transformed to 125 type silicon chip slide glass devices.Fig. 1 is the structural representation of a square frame 1 in the 156 type silicon chip slide glass devices.
As shown in Figure 2, the PECVD of the present invention changing device 2 of silicon chip slide glass device, comprise criss-cross plate body 3, the bight of described plate body 3 is that the center is outward extended with four support arms 10 radially with the center of plate body 3, one side surface of plate body 3 is provided with cross recess 4, the width of cross recess 4 equates with the frame bar width of the C/C frame of first kind of specification, and the width of support arm 10 is the frame bar width sum that the difference of the length of side of the silicon chip slide glass device of the length of side of silicon chip slide glass device of first kind of specification and second kind of specification is added the silicon chip slide glass device of first kind of specification.
The infall of each adjacent support arm 10 is provided with transition arc 6.Be respectively arranged with the sideline of the symmetric line of half oval groove, 7, half oval grooves 7 perpendicular to described support arm 10 on two outsides of described support arm 10, be provided with circular hole 9 in the described support arm 10, the medullary ray of circular hole 9 is on the symmetric line of half oval groove 7.Half oval groove 7 matches with circular hole 9 and is used for installing hook.
Be in the outer end of 10, one support arms 10 of two support arms on the same straight line and the homonymy of described cross recess 4 and be provided with first shoulder 8, the opposition side of the outer end of another support arm 10 and described cross recess 4 is provided with second shoulder 5.As shown in Figure 3, four PECVD are installed on four infalls of the square frame 1 of 156 type silicon chip slide glass devices with silicon chip slide glass device changing device 2, cross recess 4 embeds in the frame bar of square frame 1, first shoulder 8 overlaps mutually with second shoulder 5,156 type silicon chip slide glass devices are converted to the silicon chip slide glass device of 125 types, produce 125 type polycrystalline products.The infall of support arm 10 is provided with transition arc 6, can be assembled into 125 type monocrystalline silicon piece slide glass devices, can be used for the produce single crystal silicon chip.Use the present invention, can save 2/3 silicon chip slide glass device cost.
Can carry out the production of 156 specification products again after removing the present invention.The present invention is easy to loading and unloading, and result of use is good.
Claims (4)
1. the changing device of a PECVD usefulness silicon chip slide glass device comprises plate body (3), and it is characterized in that: the bight of described plate body (3) is that the center is outward extended with four support arms (10) radially with the center of plate body (3), makes described plate body (3) across; The one side setting of plate body (3) and described cruciform corresponding cross groove (4); The width of described cross recess (4) equates with the frame bar width of the silicon chip slide glass device of first kind of specification, and the width of support arm (10) is the frame bar width that the difference of the length of side of the silicon chip slide glass device of the length of side of silicon chip slide glass device of first kind of specification and second kind of specification is added first kind of specification.
2. according to the changing device of the described PECVD of claim 1 with silicon chip slide glass device, it is characterized in that: the infall of each adjacent support arm (10) is provided with transition arc (6).
3. according to the changing device of the described PECVD of claim 2 with silicon chip slide glass device, it is characterized in that: be provided with half oval groove (7) on two outer sides of described support arm (10) symmetrically, the symmetric line of half oval groove (7) is perpendicular to the sideline of described support arm (10), described support arm (10) is provided with circular hole (9), and the medullary ray of circular hole (9) is on the symmetric line of half oval groove (7).
4. according to the changing device of the described PECVD of claim 1 with silicon chip slide glass device, it is characterized in that: in two support arms (10) on being in same straight line, the homonymy of the outer end of a support arm (10) and described cross recess (4) is provided with first shoulder (8), and the opposition side of outer end of another support arm (10) and described cross recess (4) is provided with second shoulder (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910183760XA CN101634015B (en) | 2009-08-07 | 2009-08-07 | Converting device of silicon wafer loading devices for PECVD |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910183760XA CN101634015B (en) | 2009-08-07 | 2009-08-07 | Converting device of silicon wafer loading devices for PECVD |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101634015A CN101634015A (en) | 2010-01-27 |
CN101634015B true CN101634015B (en) | 2011-04-06 |
Family
ID=41593343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910183760XA Expired - Fee Related CN101634015B (en) | 2009-08-07 | 2009-08-07 | Converting device of silicon wafer loading devices for PECVD |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101634015B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386278B (en) * | 2011-10-21 | 2014-02-26 | 无锡绿波新能源设备有限公司 | Quick switching device for quickly switching polycrystalline chip carrying device to monocrystalline chip carrying device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4556145A (en) * | 1985-03-28 | 1985-12-03 | Control Data Corporation | One piece flatpack chip carrier |
CN1173039A (en) * | 1996-07-12 | 1998-02-11 | 氟器皿有限公司 | Wafer carrier |
CN201032628Y (en) * | 2007-01-29 | 2008-03-05 | 刘卓 | Carrier for silicon slice production |
-
2009
- 2009-08-07 CN CN200910183760XA patent/CN101634015B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4556145A (en) * | 1985-03-28 | 1985-12-03 | Control Data Corporation | One piece flatpack chip carrier |
CN1173039A (en) * | 1996-07-12 | 1998-02-11 | 氟器皿有限公司 | Wafer carrier |
CN201032628Y (en) * | 2007-01-29 | 2008-03-05 | 刘卓 | Carrier for silicon slice production |
Also Published As
Publication number | Publication date |
---|---|
CN101634015A (en) | 2010-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105460910B (en) | A kind of constant temperature and the extensive method for preparing banding black phosphorus | |
CN104310326A (en) | Black phosphorus preparation method with high conversion rate | |
CN101979721A (en) | Silicon core rods and silicon core structure for growth of polycrystalline silicon | |
CN101634015B (en) | Converting device of silicon wafer loading devices for PECVD | |
CN202323023U (en) | PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment with new-structure graphite boat | |
CN202316870U (en) | Processing device for cloud-shaped lock springs | |
CN101634016B (en) | Modifying device of silicon wafer loading devices for PECVD | |
CN201495285U (en) | Conversion device of silicon wafer carrier used for PECV | |
CN104192829B (en) | A kind of multidimensional-multi-stage porous SiO2/ C composite granule and preparation method thereof | |
CN202098632U (en) | Mother-subsidiary bag | |
CN203876063U (en) | Sapphire crystal ingot rod-drawing pressing structure | |
CN101629282B (en) | Conversion device of silicon wafer carrier for PECVD | |
CN201473587U (en) | Silicon wafer carrier refitting device for PECVD | |
CN201495286U (en) | Switching device of silicon wafer carrier used for PECVD | |
CN205396893U (en) | Handle device of multistation usage | |
CN201702708U (en) | Tool fixture | |
CN203503769U (en) | Cross-coupling assembly and coaxial-cavity passive device | |
CN202152056U (en) | Feed trolley for solar film coated pipes | |
CN203279103U (en) | Novel horn holder | |
CN202259393U (en) | Fast transformation device used for transforming polycrystal sheet loading device into single crystal sheet loading device | |
CN204130510U (en) | For graphite boat piece and the graphite boat of double-sided coating | |
CN202826118U (en) | Child-mother frame for fixing crystal bar | |
CN203026490U (en) | Wafer boat | |
CN203779381U (en) | Clamping device for sheet-like workpiece | |
CN102730670A (en) | Preparation method of non-planar graphical graphene |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20160807 |