CN101630948B - Tuner device - Google Patents
Tuner device Download PDFInfo
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- CN101630948B CN101630948B CN2009101522794A CN200910152279A CN101630948B CN 101630948 B CN101630948 B CN 101630948B CN 2009101522794 A CN2009101522794 A CN 2009101522794A CN 200910152279 A CN200910152279 A CN 200910152279A CN 101630948 B CN101630948 B CN 101630948B
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- earth terminal
- circuit substrate
- lead
- tuner
- free solder
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Abstract
A tuner device lightens a mechanical stress that changes along with the temperatures of a grounding terminal, a circuit substrate and a lead-free solder; it is able to prevent the lead-free solder from having crack even if using the lead-free solder. A sequential transfer punching is carried out on a bending portion (110a), that is one portion of the grounding terminal (105A) that extends from one part of a tuner shell (101) to form a width that is narrower than the grounding terminal in the vicinity of a solder jointing portion (108); or a shaping processing step is carried out to form a plate thickness thinner than the grounding terminal plate in the vicinity of the solder jointing portion (108). Therefore, the stress caused by the thermal expansion coeffici9ent difference of the grounding terminal (105A), the circuit substrate (102) and the lead-free solder when driving the tuner device can be absorbed by the bending portion (110A) and the occurrence of crack on the lead-free solder can be prevented.
Description
Technical field
The present invention relates to the tuner apparatus that television broadcastings such as terrestrial broadcasting and satellite broadcasting are used.
Say in detail to be exactly that an earth terminal part of extending from a position of tuner housing is that bend has the width than solder bonds portion's earth terminal narrow width nearby, or than solder bonds portion's thin plate thickness of earth terminal plate thickness nearby.Earth terminal with this bend is connected with circuit substrate via lead-free solder.Thus, the stress that is caused by the coefficient of thermal expansion differences of earth terminal, circuit substrate and lead-free solder that produces when driving tuner apparatus is absorbed by bend, alleviates the mechanical stress of the variations in temperature of following earth terminal, circuit substrate and lead-free solder.
Background technology
Now, limiting RoHS (the Restriction of Hazardous Substances) rule of using special harmful substance in electronics, the electric machine for the environmental pollution that prevents the earth went into effect from July, 2006.Therefore, in recent years for using the exploitation of electronics, electric machine etc. that does not contain plumbous lead-free solder as main component with tin in progress rapidly.
The television equipment that only possesses the tuner apparatus that receives terrestrial broadcasting and satellite broadcasting in this electronics, the electric machine once in the period of production reach 100,000,000 thousands of; If comprise the tuner apparatus that recording apparatus possessed such as video tape recorder, DVD register and hdd recorder, then there is the tuner apparatus of huge quantity to be produced.
Circuit substrate is housed in these tuner apparatus, and this circuit substrate is connected with various electronic components etc. through scolder.Replace this scolder by lead-free solder and be very effective for the environmental pollution that prevents the earth.
The tuner apparatus operated by rotary motion has and tuner housing all-in-one-piece earth terminal, and this earth terminal is electrically connected via scolder with the circuit substrate that constitutes this tuner apparatus.Earth terminal plays the effect that engages with the ground electricity, particularly in tuner housing, becomes the very important connection that on circuit substrate, guides earthing potential.
Because this earth terminal is different separately with the thermal coefficient of expansion of circuit substrate and scolder; So in the environmental test of temperature cycling test etc. (for example-40 ℃～85 ℃ temperature cycles); Sometimes crackle appears in scolder, and the contact of earth terminal and circuit substrate is reduced.
In recent years tuner apparatus particularly; Not only to handle VHF (VeryHigh Frequency) ripple and UHF (the Ultra High Frequency) ripple of terrestrial broadcasting; And want the microwave of treatments B S (Broadcasting Satellite, broadcasting satellite) and CS (Communication Satellite, communications satellite); Therefore, the variations in temperature by caused this tuner apparatus of ON/OFF of tuner apparatus is big.
To compare thermal coefficient of expansion only be half the because lead-free solder is with containing plumbous scolder, so can not absorb the poor of thermal coefficient of expansion fully, crackle appears in this lead-free solder and the possibility that makes earth terminal and circuit substrate become loose contact uprises.When loose contact appears in earth terminal and circuit substrate, become various generation of noise reasons sometimes.
As prerequisite; When tuner apparatus drives; In order to reduce stress by the generation that coefficient of thermal expansion differences causes of earth terminal, circuit substrate and the scolder of tuner housing setting; Through making the earth terminal that is formed with notch part and bending part have elastic effect, can prevent that crackle from appearring in the scolder between earth terminal and circuit substrate.
Thus, in the thermal shock after soldering, even earth terminal is different with the thermal coefficient of expansion of printed base plate, its difference also is absorbed, and the crackle of scolder is prevented from.
Figure 10 is the stereogram of the existing earth terminal 105 shapes example of expression, and Figure 11 is its cutaway view, and Figure 12 is its front view.Shown in figure 10, earth terminal 105 has the Rack and regulation plate thickness that extends at the position (other end 106 of earth terminal) from tuner housing 101.
Bend to this earth terminal 105 circular-arc, earth terminal leading section 107 is become downwards and earth terminal 105 is connected towards solder bonds portion 108, this solder bonds portion 108 is arranged on the circuit substrate 102 regulation positions that tuner housing 101 is accommodated.
102 inboard solder bonds portions 108 are connected this circuit substrate 102 via the lead-free solder (not shown) that utilizes soldering method coatings such as flow soldering, return air welding and flatiron weldering with earth terminal 105 at circuit substrate.
Shown in figure 11, the plate thickness of circuit substrate 102 is 1.2mm, and the plate thickness of the plate thickness of earth terminal 105 and tuner housing 101 is 0.6mm.Below circuit substrate 102, are 1.5mm to the distance of earth terminal leading section 107 and the thickness of lead-free solder 109.Shown in figure 12, the width of earth terminal 105 is 0.9mm.
Figure 14 (1) be before the expression stress about the stereogram of Stress calculation structure example, when Figure 14 (2) is the expression stress about the stereogram of Stress calculation structure example.Shown in Figure 14 (1), being considered to is to be the width setup of top that bo, following width setup are that b, height setting are the plate that 1 trapezoidal bottom surface has thickness h.Shown in Figure 14 (2), fix the following b side of its plate, being set at the deflection when the bo side applied stress of top is δ.According to above structure, stress σ is by formula 1 expression.
[formula 1]
At this, E is a modulus of longitudinal elasticity, trapezoidal coefficient of elasticity when α is b＞bo.
Figure 13 is the cutaway view of expression about the development size example of earth terminal 105 Stress calculation.Shown in figure 13, in Figure 10-Figure 12, launch crooked earth terminal 105.The distance setting of other end 106 from earth terminal leading section 107 to earth terminal for being 6.0mm; From other end 106 of earth terminal to circuit substrate the 102 inboard distances height 1 of earth terminal (below be called) to be set at be 4.5mm; Being set at the plate thickness h of earth terminal is 0.6mm, and being set at the plate thickness of circuit substrate 102 is 1.2mm.
At this, the suitable type electronic component of for example unleaded environment that calculates Figure 13 illustrated dimension is the stress of Ai Kutuo mechanical ohm (login trade mark) with steel plate.The modulus of longitudinal elasticity E of Ai Kutuo mechanical ohm (login trade mark) is 21000 (kg/mm
2).The width b of earth terminal is 0.9mm; Trapezoidal coefficient of elasticity α is 1.0; The height l of earth terminal is 4.5mm, and the plate thickness h of earth terminal is 0.6mm, when considering the stress to other end 106 effects of earth terminal; Be updated to formula 1 to these values and carry out stress Calculation, its stress σ is 11.2 δ (kg/mm
2).
Figure 15 is the curve of the variations in temperature example of expression temperature cycling test.So-called temperature cycling test is to confirm the test of the reliability of various test material variations in temperature such as electronic component and electronic installation.Shown in figure 15, for example putting test material into ambient temperature begin is 85 ℃, becomes-40 ℃ after one hour, and it becomes after one hour in 85 ℃ the thermostat with such temperature cycles again, confirms the reliability of this test material variations in temperature.In this cycle sets for being two hours.
Carry out this temperature cycling test with the tuner housing 101 that uses lead-free solder 109 to connect earth terminal 105 and circuit substrate 102; The result is that crackle appears in lead-free solder 109 in 500 circulations, and earth terminal 105 loose contact occurs with circuit substrate 102.
That is, when the stress to 106 effects of other end of earth terminal be 11.2 δ (kg/mm
2) when above, can not absorb the coefficient of thermal expansion differences of earth terminal 105 and circuit substrate 102 and lead-free solder 109, crackle appears in lead-free solder 109, and earth terminal 105 loose contact occurs with circuit substrate 102.
Patent documentation 1: the spy opens clear 63-185096 communique (the 2nd page, first figure, second figure)
Patent documentation 2: the spy opens flat 07-142882 communique (the 2nd page, first figure)
Earth terminal shape shown in patent documentation 1, patent documentation 2 and Figure 10 to 13 makes this earth terminal have elasticity for the thermal expansion difference that absorbs earth terminal, circuit substrate and scolder; Seeking to prevent the crackle of scolder, but under the situation of using lead-free solder, the problem that can not be suitable for is arranged.Particularly Figure 10 need be reduced to less than the stress to this earth terminal effect 11.2 δ (kg/mm to earth terminal shown in Figure 13
2).
Summary of the invention
The present invention then solves this problem; Purpose is to alleviate the mechanical stress of following earth terminal, circuit substrate and solder temperature to change with existing comparing; Even use lead-free solder for scolder; Prevent that also this lead-free solder from having crackle, a kind of long tuner apparatus of antipollution life-span is provided.
In order to solve above-mentioned problem; Tuner apparatus of the present invention possesses: tuner housing, the circuit substrate and the earth terminal of being accommodated by tuner housing; This earth terminal is connected with circuit substrate via lead-free solder; Have the Rack and the regulation plate thickness that extend from a position of tuner housing; And have the solder bonds portion that is provided with to circuit substrate regulation position and bend to circular-arc bend, bend has the width than solder bonds portion's earth terminal narrow width nearby, or than solder bonds portion's thin plate thickness of earth terminal plate thickness nearby.
According to tuner apparatus of the present invention; Through being the part of the earth terminal that extends from a position of tuner housing that bend sets for is the width than solder bonds portion's earth terminal narrow width nearby; Or than solder bonds portion's thin plate thickness of earth terminal plate thickness nearby, in the time of can driving this tuner apparatus by the stress of the generation that coefficient of thermal expansion differences causes of earth terminal, circuit substrate and lead-free solder by this bend absorption.
According to tuner apparatus of the present invention; Through being the part of earth terminal that bend sets for is the width than solder bonds portion's earth terminal narrow width nearby; Or than solder bonds portion's thin plate thickness of earth terminal plate thickness nearby, in the time of then can driving this tuner apparatus by the stress of the generation that coefficient of thermal expansion differences causes of earth terminal, circuit substrate and lead-free solder by this bend absorption.
Thus, can alleviate the mechanical stress of following earth terminal, circuit substrate and lead-free solder variations in temperature.Even consequently use lead-free solder for scolder, can prevent that also this lead-free solder from having crackle, a kind of long tuner apparatus of antipollution life-span can be provided.
Description of drawings
Fig. 1 is the stereogram of expression tuner apparatus 100 structure example of the present invention;
Fig. 2 is the stereogram of expression first embodiment earth terminal 105A shape example;
Fig. 3 is the cutaway view of expression earth terminal 105A shape example;
Fig. 4 is the front view of expression earth terminal 105A shape example;
Fig. 5 is the cutaway view of expression about the development size example of earth terminal 105A Stress calculation;
Fig. 6 is the stereogram of expression second embodiment earth terminal 105B shape example;
Fig. 7 is the cutaway view of expression earth terminal 105B shape example;
Fig. 8 is the front view of expression earth terminal 105B shape example;
Fig. 9 is the cutaway view of expression about the development size example of earth terminal 105B Stress calculation;
Figure 10 is the stereogram of the existing earth terminal 105 shapes example of expression;
Figure 11 is the cutaway view of the existing earth terminal 105 shapes example of expression;
Figure 12 is the front view of the existing earth terminal 105 shapes example of expression;
Figure 13 is the cutaway view of expression about the development size example of earth terminal 105 Stress calculation;
Figure 14 (1) is the preceding stereogram about the Stress calculation structure example of expression stress;
Figure 14 (2) is expression stereogram about Stress calculation structure example during stress;
Figure 15 is the curve of expression temperature cycling test variations in temperature example.
Symbol description
100 tuner apparatus, 101 tuner housings, 102 circuit substrates
103 input pads, 104 Interface Terminals 105,105A, 105B earth terminal
109 lead- free solder 110A, 110B bend
Embodiment
[first embodiment]
Following one side is explained tuner apparatus of the present invention on one side with reference to accompanying drawing.Fig. 1 is the stereogram of expression tuner apparatus 100 structure example of the present invention.As shown in Figure 1, tuner apparatus 100 comprises: tuner housing 101, circuit substrate 102, input pad 103, Interface Terminal 104 and earth terminal 105A.
The soldering method of flow soldering is such method: be coated with scaling powders to circuit substrate 102 mounting interface terminals 104 with various electronic components and to this circuit substrate 102; The circuit substrate that has been coated with scaling powder 102 solder bath of bar-shaped lead-free solder of having put into high temperature melting; Take out this circuit substrate 102 from solder bath again, just be connected with various electronic components Interface Terminal 104 with circuit substrate 102 via lead-free solder.
The soldering method of return air welding is such method: utilize lead-free solder all kinds of solvents to become paste; Utilize the lead-free solder of this paste printing machine etc. to be coated on the circuit substrate 102; After being installed to Interface Terminal 104 and various electronic components on the circuit substrate 102; Make this circuit substrate 102 through reflow ovens (high temperature furnace), all kinds of solvents volatilization that the paste lead-free solder is comprised is connected with various electronic components Interface Terminal 104 via lead-free solder like this with circuit substrate 102.
The soldering method of flatiron weldering is such method: after being installed to Interface Terminal 104 and various electronic components on the circuit substrate 102; Supply with the solder wire that forms by lead-free solder to abundant warmed-up solder horn; Through scolder and circuit substrate 102 butts that make this supply, and be connected with various electronic components Interface Terminal 104 with circuit substrate 102 via lead-free solder.
Lead-free solder of the present invention is not contain plumbous scolder, for example uses tin-silver-copper system, tin-zinc-bismuth system, tin-copper system, Xi-Yin-indium-bismuth system, tin-zinc-aluminium system and tin-copper-nickel-germanium system etc.
The earth terminal 105A with Rack and regulation plate thickness that extends from a position of tuner housing 101 combines with above-mentioned circuit substrate 102 through lead-free solder, plays the effect that engages with the ground electricity.
Fig. 2 is the stereogram of expression first embodiment earth terminal 105A shape example, and Fig. 3 is its cutaway view, and Fig. 4 is its front view.Then omit its explanation with above-mentioned Figure 10 to the existing earth terminal 105 same parts of Figure 12.
As shown in Figure 2, earth terminal 105A has the bend 110A of the width narrower than the Rack of this earth terminal 105A nearby of solder bonds portion 108.Be meant the distance of this earth terminal 105A transverse direction that is positioned at the face parallel that earth terminal 105A extends with the predetermined surface of tuner housing 101 at this said width.
As shown in Figure 3, the cutaway view of expression earth terminal 105A shape example is identical with the cutaway view of Figure 11.As shown in Figure 4, the width of the earth terminal 105A of bend 110A becomes 0.6mm.
The sequence delivery punch process of making the bend 110A of earth terminal 105A is that tuner housing 101 employed parts are carried out punch process.Be these parts box-shaped by the punch press type of being stamped to form at first.Then, cut away unnecessary place or form in order to make various terminals at the regulation position concavo-convex, for bend to earth terminal 105A circular-arc with cut out taper portion, and carry out repeatedly punching press by punch press.
This sequence delivery punch process is making tuner housing 101 employed parts utilize the feed appliance of punch press inlet to move by each operation, can processing this parts continuously.
Thus, can be the part of earth terminal 105A that bend 110A forms the width than the narrow width of the earth terminal 105A nearby of solder bonds portion 108 at low cost through implementing the sequence delivery punch process.
Fig. 5 is the cutaway view of expression about the development size example of earth terminal 105A Stress calculation.Identical with existing example shown in Figure 13; As shown in Figure 5; Launch crooked earth terminal 105A, the distance setting of other end 106 from earth terminal leading section 107 to earth terminal for being 6.0mm, 102 being set at apart from l of inboard are 4.5mm from other end 106 of earth terminal to circuit substrate; Being set at the plate thickness h of earth terminal is 0.6mm, and being set at the plate thickness of circuit substrate 102 is 1.2mm.
At this, the stress of the said Ai Kutuo mechanical ohm (login trade mark) of calculating chart 5 illustrated dimension.Modulus of longitudinal elasticity E is 21000 (kg/mm
2), the width b of earth terminal is 0.6mm, and the height 1 of earth terminal is 4.5mm, and the plate thickness h of earth terminal is 0.6mm.And because the width of the earth terminal 105A of bend 110A is 0.6mm, so the trapezoidal coefficient of elasticity α shown in the formula 1 participates in into.At this, α=1.1.
Be updated to formula 1 to these values and this stress σ of carrying out other end 106 of earth terminal and having stress σ to do the time spent when calculating, its stress σ is 6.8 δ (kg/mm
2), with the stress (11.2 δ (kg/mm of existing routine earth terminal shape
2)) relatively, reduce to 61% stress approximately.
When carrying out above-mentioned temperature cycling test by the tuner apparatus that possesses earth terminal 105A 100 with bend 110A; Before 1000 circulations, do not find that tuner apparatus 100 has unusually, lead-free solder 109 does not have crackle to occur because of the coefficient of thermal expansion differences of earth terminal 105A and circuit substrate 102 and lead-free solder 109.
Even in the variations in temperature of the tuner apparatus 100 that is caused by the ON/OFF of the tuner apparatus 100 that receives BS and CS microwave, crackle does not appear in lead-free solder 109 yet.
Thus, can alleviate the mechanical stress of following earth terminal 105A, circuit substrate 102 and lead-free solder 109 variations in temperature, even use lead-free solder 109 can prevent that also crackle from appearring in this lead-free solder 109.
[second embodiment]
Fig. 6 is the stereogram of expression second embodiment earth terminal 105B shape example, and Fig. 7 is its cutaway view, and Fig. 8 is its front view.Then omit its explanation with above-mentioned Figure 10 to the existing earth terminal 105 same parts of Figure 12.
As shown in Figure 6, earth terminal 105B has the bend 110B of the plate thickness thinner than the regulation plate thickness of this earth terminal 105B nearby of solder bonds portion 108.This said plate thickness be meant with the face of the width vertical direction of said earth terminal in the horizontal distance of this earth terminal.
As shown in Figure 7, the plate thickness of the earth terminal 105B of bend 110B is 0.4mm.Other structures are then identical with Figure 11.As shown in Figure 8, the front view of expression earth terminal 105B shape is identical with the front view of Figure 12.
Through implementing shaping processing, can make earth terminal 105B with bend 110B to implementing earth terminal 105 established parts that said sequence transmits the tuner housing 101 that punch process makes.
Thus, can be the part of earth terminal 105B that bend 110B forms the thin plate thickness of plate thickness than the earth terminal 105B nearby of solder bonds portion 108 at low cost through implementing shaping processing.
Fig. 9 is the cutaway view of expression about the development size example of earth terminal 105B Stress calculation.Identical, as shown in Figure 9 with existing example shown in Figure 13, launch crooked earth terminal 105B, the distance setting of other end 106 from earth terminal leading section 107 to earth terminal for being 6.0mm.
102 inboard distances 1 are 4.7mm from other end 106 of earth terminal to circuit substrate.This is owing to after having made tuner housing 101 in enforcement sequence delivery punch process; Bend 110B is implemented shaping processing, thus than from other end 106 of earth terminal of existing tuner housing to circuit substrate 102 inboard grown 0.2mm apart from 4.5mm.And the plate thickness h of bend 110B becomes 0.4mm owing to implementing shaping processing attenuation.
At this, calculate the stress of the earth terminal 105B with size shown in Figure 9.Sheet material uses above-mentioned Ai Kutuo mechanical ohm (login trade mark).Modulus of longitudinal elasticity E is 21000 (kg/mm
2), the width b of earth terminal is 0.9mm, and trapezoidal coefficient of elasticity α is 1.0, and the height 1 of earth terminal is 4.7mm, and the plate thickness h of earth terminal is 0.4mm.
Be updated to above-mentioned value formula 1 and carry out the stress σ of other end 106 of earth terminal when stress is arranged when calculating, its stress σ is 2.9 δ (kg/mm
2), with the stress (11.2 δ (kg/mm of existing routine earth terminal shape
2)) relatively, reduce to 26% stress approximately.
When carrying out above-mentioned temperature cycling test by the tuner apparatus that possesses earth terminal 105B with bend 110B; Before 1000 circulations, do not find that tuner apparatus has unusually, lead-free solder 109 does not have crackle to occur because of the coefficient of thermal expansion differences of earth terminal 105B and circuit substrate 102 and lead-free solder 109.
In the variations in temperature of this tuner apparatus that is caused by the ON/OFF of the tuner apparatus that receives BS and CS microwave, crackle does not appear in lead-free solder 109 yet.
Thus, can alleviate the mechanical stress of following earth terminal 105B, circuit substrate 102 and lead-free solder 109 variations in temperature, even use lead-free solder 109 can prevent that also crackle from appearring in this lead-free solder 109.
Table 1 has gathered the stress that earth terminal was applied that existing example and tuner apparatus of the present invention possess.
[table 1]
| Existing example | First embodiment | Second embodiment | |
| Stress σ (kg/mm 2) | 11.2δ | 6.8δ | 2.9δ |
| The |
100％ | About 61% | About 26% |
| Trapezoidal coefficient of elasticity α | 1.0 | 1.1 | 1.0 |
| The width b (mm) of earth terminal | 0.9 | 0.6 | 0.9 |
| The height l (mm) of earth terminal | 4.5 | 4.5 | 4.7 |
| The plate thickness h (mm) of earth terminal | 0.6 | 0.6 | 0.4 |
When being set at stress σ necessarily and more separately to distortion δ, existing example is 11.2 δ (kg/mm
2), first embodiment is 6.8 δ (kg/mm
2), second embodiment is 2.9 δ (kg/mm
2).When being set at the stress of existing example when being 100%, then first embodiment is reduced to about 61%, the second embodiment and is reduced to about 26%.
The tuner apparatus of first embodiment and second embodiment; Utilization is than bend 110A, the 110B of narrow width of solder bonds portion 108 Rack nearby or the plate thickness thinner than solder bonds portion 108 regulation plate thickness nearby; By the stress of the generation that coefficient of thermal expansion differences causes of earth terminal 105A, 105B, circuit substrate 102 and lead-free solder 109, can alleviate the mechanical stress of following earth terminal 105A, 105B, circuit substrate 102 and lead-free solder 109 variations in temperature when absorbing this tuner apparatus and driving.
Even consequently use lead-free solder 109, can prevent that also this lead-free solder 109 from having crackle, long tuner apparatus of antipollution life-span can be provided.
Various television broadcastings such as ripple broadcasting and satellite broadcasting are suitable with tuner apparatus earthward is very effective in the present invention.
Claims (3)
1. tuner apparatus wherein, possesses: tuner housing,
The circuit substrate of being accommodated by said tuner housing,
Earth terminal; This earth terminal is connected with said circuit substrate via lead-free solder; Have the Rack and the regulation plate thickness that extend from a position of said tuner housing, and the solder bonds portion that has to the setting of said circuit substrate regulation position bends to circular-arc bend
Said bend has the width than the narrow width of the said solder bonds of being positioned at of said earth terminal portion part nearby, or than the thin plate thickness of plate thickness of the said solder bonds of being positioned at of said earth terminal portion part nearby.
2. tuner apparatus as claimed in claim 1 wherein, is implemented shaping processing and is possessed said bend said tuner housing, and this bend has the thin plate thickness of plate thickness than said solder bonds portion said earth terminal nearby.
3. tuner apparatus as claimed in claim 2; Wherein, The employed parts of said tuner housing are implemented the sequence delivery punch process and possessed said bend, and this bend has the width than the narrow width of said solder bonds portion said earth terminal nearby.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008183164A JP2010021494A (en) | 2008-07-14 | 2008-07-14 | Tuner apparatus |
| JP183164/08 | 2008-07-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101630948A CN101630948A (en) | 2010-01-20 |
| CN101630948B true CN101630948B (en) | 2012-07-11 |
Family
ID=41575925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101522794A Expired - Fee Related CN101630948B (en) | 2008-07-14 | 2009-07-14 | Tuner device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2010021494A (en) |
| CN (1) | CN101630948B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111373664B (en) | 2017-11-28 | 2022-07-29 | 索尼半导体解决方案公司 | Tuner module and receiving apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06310890A (en) * | 1993-04-20 | 1994-11-04 | Matsushita Electric Ind Co Ltd | Circuit unit |
-
2008
- 2008-07-14 JP JP2008183164A patent/JP2010021494A/en active Pending
-
2009
- 2009-07-14 CN CN2009101522794A patent/CN101630948B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101630948A (en) | 2010-01-20 |
| JP2010021494A (en) | 2010-01-28 |
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Granted publication date: 20120711 Termination date: 20130714 |