CN101621890A - Technology for improving welding disk circuit of flexible circuit board of back light source - Google Patents
Technology for improving welding disk circuit of flexible circuit board of back light source Download PDFInfo
- Publication number
- CN101621890A CN101621890A CN200910136114A CN200910136114A CN101621890A CN 101621890 A CN101621890 A CN 101621890A CN 200910136114 A CN200910136114 A CN 200910136114A CN 200910136114 A CN200910136114 A CN 200910136114A CN 101621890 A CN101621890 A CN 101621890A
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- pad
- welding disk
- circuit board
- flexible circuit
- copper sheet
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Links
- 238000003466 welding Methods 0.000 title abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 241000221931 Hypomyces rosellus Species 0.000 claims abstract description 18
- 238000010615 ring circuit Methods 0.000 claims description 15
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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Abstract
The invention relates to a technology for improving a welding disk circuit of a flexible circuit board of a back light source. The technology is characterized in that the area of a copper sheet (2) at a welding disk of a flexible circuit board (1) is equal to that of the welding disk (3), a cobweb annular circuit (4) is formed at the periphery and is connected in series and communicated with the welding disk (3), an open window (51) of a covering film (5) is slightly bigger than the welding disk (3) and is slightly smaller than the periphery of the cobweb annular circuit (4), the welding disk (3) is completely exposed when being covered, the cobweb annular circuit (4) at the periphery of the welding disk (3) is also pressed, the area of the copper sheet (2) is already determined, the covering film (5) is arranged at the periphery of the copper sheet (2), the copper sheet (2) can not be soldered, the size of the welding disk (3) can not be changed even if the area of the open window (51) of the covering film (5) is bigger, namely, the area of the welding disk (3) can not be changed because the area of the copper sheet (2) is etched out, the tolerance can be ensured in the range of +/-0.05, the requirement of high accuracy of the size of the welding disk of the flexible circuit board is achieved, and the design purpose is achieved.
Description
Technical field
The pad circuit that the present invention relates to the backlight flexible circuit board improves technology.
Background technology
Extensive use along with mobile phone, the consumer is more and more higher to effect of requirement backlight, and the contraposition that causes during because of backlight flexible circuit board and LED welding, factors such as perk, to effect backlight, the brightness influence clearly, therefore, it is big that the dimensional accuracy of the pad of flexible circuit board influences tool to this, tolerance is being+/-during 0.05mm, can guarantee its effect backlight and brightness requirement, and present pad tolerance mostly is greatly+/-0.1mm, the processing technology of flexible circuit board pad can not satisfy new required precision at all at present, because present pad size is to determine pad size with the size of windowing of the coverlay of flexible circuit board, peel off in order to prevent to weld back pad and flexible circuit board, the copper sheet area of line layer is more much bigger than pad size, the copper sheet that the part of windowing of coverlay exposes out is exactly the area size of pad, with coverlay copper sheet is pushed down around the pad, play the effect that prevents that pad from peeling off, but, because the scale error of coverlay is bigger, and be manual covering when covering, error is bigger, do not satisfy tolerance for+/-the new required precision of 0.05mm, because determining of the position of pad is exactly by manual operations fully, so the positional precision of pad is also poor, general relative position of related features be+/-0.15mm with+/-0.1mm, and left and right sides pad relative position in the horizontal direction, the consistency influence that the LED light inlet is entered light guide plate is very big, if it is inconsistent, can occur when the closely close light guide plate of certain LEDs, other some all the time can't be close, particularly with on a slice flexible circuit board, LED is many more with regard to easy more this phenomenons that occur.
For reaching new required precision, can adopt the manufacturing equipment that upgrades flexible circuit board, the scheme of technology to realize, but the processing cost of flexible circuit board increase greatly again, enterprise loses competitiveness, is unfavorable for the development of enterprise.
Summary of the invention
The objective of the invention is to develop a kind of addressing the above problem, reach the new dimension precision requirement of pad of flexible circuit board, cost is low, and technology is simple, and the pad circuit of the better backlight flexible circuit board of pad performance improves technology.
The present invention is achieved through the following technical solutions:
The pad circuit of backlight flexible circuit board of the present invention improves technology, the same size of the area of the copper sheet at flexible circuit board pad place with pad, form the cobweb ring circuit on every side, and also be connected logical with pad, windowing of coverlay is bigger slightly than pad, slightly littler than cobweb ring circuit periphery, complete exposed pad during covering, push down simultaneously pad cobweb ring circuit on every side again, the area of copper sheet is determined, is coverlay around the copper sheet, can not scolding tin, the area that coverlay is windowed is big again, and the size of pad can not become yet, and just the area of pad can not become, because being etching, the area of copper sheet comes out, tolerance can guarantee to reach the size high-precision requirement of the pad of flexible circuit board in+/-0.05 scope, reaches purpose of design.
The present invention has the following advantages:
Via enforcement of the present invention, the position of pad is no longer determined by manual, directly when cutting, determine by the mould that cuts profile, general relative position of related features be+/-0.1mm with+/-0.05mm, pad relative position in the horizontal direction in the left and right sides can be controlled at the 0.05mm scope, guaranteed that the LED light inlet enters the consistency of light guide plate, well guaranteed the consistency of the effect of backlight, the light-emitting window that has guaranteed LED can both be fully near light guide plate, guarantee that light enters light guide plate fully, improve the luminous utilance of LED, thereby improved brightness backlight.
Via implementation of processes of the present invention, the cobweb ring circuit prevents that effectively pad from peeling off, even because the external force effect, when wherein a line disconnects, and effective connections of other and connection circuit guarantee effective connection of entire circuit, improve reliability of products.
Description of drawings
The present invention is further described below in conjunction with accompanying drawing.
Fig. 1 is the line layer copper sheet schematic diagram of flexible circuit board in the existing technology.
Fig. 2 be in the existing technology flexible circuit board by covering film formed pad schematic diagram.
Fig. 3 is the line layer copper sheet schematic diagram of flexible circuit board of the present invention.
Fig. 4 is the pad schematic diagram of flexible circuit board of the present invention.
Among the figure, 1 flexible circuit board, 2 copper sheets, 3 pads, 4 cobweb ring circuits, 5 coverlays, 51 are windowed
Embodiment
The pad circuit of backlight flexible circuit board improves technology, it is characterized in that: the same size of the area of the copper sheet (2) at flexible circuit board (1) pad place with pad (3), form cobweb ring circuit (4) on every side, and also be connected logical with pad (3), window (51) of coverlay (5) are bigger slightly than pad (3), slightly littler than cobweb ring circuit (4) periphery, complete exposed pad (3) during covering, push down simultaneously pad (3) cobweb ring circuit (4) on every side again, the area of copper sheet (2) is determined, around the copper sheet (2) is coverlay (5), can not scolding tin, the window area of (51) of coverlay (5) is big again, and the size of pad (3) can not become yet, and just the area of pad (3) can not become, because the area of copper sheet (2) is that etching is come out, tolerance can guarantee to reach the size high-precision requirement of the pad of flexible circuit board in+/-0.05 scope, reaches purpose of design.
In Fig. 1, copper sheet (2) area of flexible circuit board (1) as shown in the figure, by the external main circuit of uniline.
In Fig. 2, (51) size of windowing of coverlay (5) is determined pad (3) size, in order to prevent that welding back pad (3) peels off with flexible circuit board (1), copper sheet (2) area is more much bigger than pad (3) size, the copper sheet that (51) part of windowing of coverlay (5) exposes out is exactly the area size of pad (3), with coverlay (5) copper sheet (2) is pushed down around the pad (3), play the effect that prevents that pad (3) from peeling off, but, because the scale error of coverlay (5) is bigger, and be manual covering when covering, error is bigger, do not satisfy tolerance for+/-the new required precision of 0.05mm, causing the definite of position of pad (3) is exactly by manual operations fully, so the positional precision of pad (3) is also poor, general relative position of related features be+/-0.15mm with+/-0.1mm, and left and right sides pad (3) relative position in the horizontal direction, the consistency influence that the LED light inlet is entered light guide plate is very big, if it is inconsistent, can occur when the closely close light guide plate of certain LEDs, other some all the time can't be close, particularly with on a slice flexible circuit board, and many more just easy more this phenomenons that occur of LED.
In Fig. 3, pad (3) is to be formed by the area that copper sheet (2) etching is come out, the same size of the copper sheet area that pad (3) is located with copper sheet (2), manufacturing tolerance can guarantee in+/-0.05 scope, reach the size high-precision requirement of the pad (3) of flexible circuit board, pad (3) forms cobweb ring circuit (4) on every side, and also is connected logical with pad (3), wherein any one when disconnecting of cobweb ring circuit (4) does not influence the connection of pad and main circuit.
In Fig. 4, window (51) of coverlay (5) are bigger slightly than pad (3), slightly littler than cobweb ring circuit (4) periphery, complete exposed pad (3) during covering, push down simultaneously pad (3) cobweb ring circuit (4) on every side again, the area of copper sheet (2) is determined, around the copper sheet (2) is coverlay (5), can not scolding tin, the window area of (51) of coverlay (5) is big again, and the size of pad (3) can not become yet, just the area of pad (3) can not become, because the area of copper sheet (2) is that etching is come out, tolerance can guarantee to reach the size high-precision requirement of the pad of flexible circuit board in+/-0.05 scope.
Process of the present invention is simple, and the technology cost is low, and the precision height is beneficial to the precision of effective control subsequent handling, dependable performance, and the pad circuit that is widely used in the backlight flexible circuit board improves technology field.
Claims (1)
1, the pad circuit of backlight flexible circuit board improves technology, it is characterized in that: the same size of the area of the copper sheet (2) at flexible circuit board (1) pad place with pad (3), form cobweb ring circuit (4) on every side, and also be connected logical with pad (3), window (51) of coverlay (5) are bigger slightly than pad (3), slightly littler than cobweb ring circuit (4) periphery, complete exposed pad (3) during covering is pushed down pad (3) cobweb ring circuit (4) on every side simultaneously again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101361148A CN101621890B (en) | 2009-04-30 | 2009-04-30 | Technology for improving welding disk circuit of flexible circuit board of back light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101361148A CN101621890B (en) | 2009-04-30 | 2009-04-30 | Technology for improving welding disk circuit of flexible circuit board of back light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101621890A true CN101621890A (en) | 2010-01-06 |
| CN101621890B CN101621890B (en) | 2013-11-20 |
Family
ID=41514851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101361148A Active CN101621890B (en) | 2009-04-30 | 2009-04-30 | Technology for improving welding disk circuit of flexible circuit board of back light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101621890B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648236A (en) * | 2013-12-31 | 2014-03-19 | 深圳市深联电路有限公司 | Method for improving PCB (Printed Circuit Board) metal binding local windowing |
| CN103742821A (en) * | 2014-01-25 | 2014-04-23 | 深圳市灿明科技有限公司 | LED flexible light bar |
| CN114473277A (en) * | 2022-01-26 | 2022-05-13 | 浙江大学台州研究院 | High-precision positioning device and method for wire taking and welding |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980525A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Circuit-board welding plate of connecting element welding leg, its connection structure and connection method |
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20090033857A1 (en) * | 2007-07-31 | 2009-02-05 | Hitachi Displays, Ltd. | Liquid crystal display device |
-
2009
- 2009-04-30 CN CN2009101361148A patent/CN101621890B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1980525A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Circuit-board welding plate of connecting element welding leg, its connection structure and connection method |
| CN101083878A (en) * | 2006-05-29 | 2007-12-05 | 深圳飞通光电子技术有限公司 | Method for welding FPC plate with PCB plate and its dedicated clamp |
| US20090033857A1 (en) * | 2007-07-31 | 2009-02-05 | Hitachi Displays, Ltd. | Liquid crystal display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648236A (en) * | 2013-12-31 | 2014-03-19 | 深圳市深联电路有限公司 | Method for improving PCB (Printed Circuit Board) metal binding local windowing |
| CN103648236B (en) * | 2013-12-31 | 2016-09-21 | 深圳市深联电路有限公司 | The method windowed in a kind of PCB of improvement metal hemming edge local |
| CN103742821A (en) * | 2014-01-25 | 2014-04-23 | 深圳市灿明科技有限公司 | LED flexible light bar |
| CN114473277A (en) * | 2022-01-26 | 2022-05-13 | 浙江大学台州研究院 | High-precision positioning device and method for wire taking and welding |
| CN114473277B (en) * | 2022-01-26 | 2024-04-05 | 浙江大学台州研究院 | High-precision positioning device and method for wire taking and welding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101621890B (en) | 2013-11-20 |
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| C06 | Publication | ||
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| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 518000, District, Guangdong City, Baoan District Province, Guanlan Road, Niu Tai Lake paddy Industry Park, B District Applicant after: SHENZHEN BAOMING TECHNOLOGY Ltd. Address before: 518000, District, Guangdong City, Baoan District Province, Guanlan Road, Niu Tai Lake paddy Industry Park, B District Applicant before: SHENZHEN BAOMING SEIKO Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: SHENZHEN BAOMING SEIKO CO., LTD. TO: SHENZHEN BAOMING TECHNOLOGY CO., LTD. |
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Address after: 518000 room 3001, building 2, Huilong business center, North Station community, Minzhi street, Longhua District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN BAOMING TECHNOLOGY Ltd. Address before: 518000, District, Guangdong City, Baoan District Province, Guanlan Road, Niu Tai Lake paddy Industry Park, B District Patentee before: SHENZHEN BAOMING TECHNOLOGY Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Improved technology of pad circuit of backlight flexible circuit board Effective date of registration: 20210727 Granted publication date: 20131120 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BAOMING TECHNOLOGY Ltd. Registration number: Y2021440020059 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221118 Granted publication date: 20131120 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN BAOMING TECHNOLOGY Ltd. Registration number: Y2021440020059 |