CN101621267B - Fastening arrangement and method for designing same - Google Patents
Fastening arrangement and method for designing same Download PDFInfo
- Publication number
- CN101621267B CN101621267B CN200910151887.3A CN200910151887A CN101621267B CN 101621267 B CN101621267 B CN 101621267B CN 200910151887 A CN200910151887 A CN 200910151887A CN 101621267 B CN101621267 B CN 101621267B
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- CN
- China
- Prior art keywords
- transmitting medium
- fixture
- electrothermal module
- heat transmitter
- profiled piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000005275 alloying Methods 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000007790 solid phase Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000011796 hollow space material Substances 0.000 abstract 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention relates to fastening arrangement and a method for designing the same. The arrangement (10) for fastening a thermoelectric module (12) and a heat exchanger (14) has the heat exchanger (14) for absorbing and/or releasing heat and the thermoelectric module (12). The thermoelectric module (12) and the heat exchanger (14) are connected with a hull profile (18). The hull profile (18) together with the module (12) and the heat exchanger (14) forms a hollow space (28). The hollow space (28) is partially filled with a heat conducting medium (22) whose shape changes during operation of the arrangement. The medium (22) is partially arranged between the module (12) and the heat exchanger (14), for thermal contact of the module with the heat exchanger. By means of the heat conducting medium (22) with a changeable shape between the module (12) and the heat exchanger (14), it is capable of ensuring improved thermal contact between the module (12) and the heat exchanger (14) under a condition of a large temperature difference and thermal expansion caused by the large temperature difference.
Description
Technical field
The present invention relates to a kind of fixture and a kind of method that forms this fixture, wherein can by one for example for the electrothermal module of thermoelectric generator and heat transmitter for example a heat exchanger fix.
Background technology
For one is for example connected with a heat exchanger for the electrothermal module of thermoelectric generator, need between these two parts, implement heat and mechanical connection.For this reason known electrothermal module is compressed on the surface of heat exchanger with spring force.Because contact-making surface has inevitable out-of-flatness, produce high thermo-contact resistance, work the difficulty that makes to conduct heat and be even obstructed.In addition known electrothermal module and heat exchanger are welded mutually.Different thermal coefficient of expansion due to the material of scolder, electrothermal module and heat exchanger, in high temperature difference situation at work, scolder may peel off, and may partially or even wholly lose thus thermo-contact or electrothermal module and be subject to until the load of its strength degree.
Summary of the invention
Of the present inventionly think to provide a kind of a kind of fixture and method that forms this fixture for electrothermal module and heat transmitter are fixed, even also can realize the thermo-contact of improvement in this device high temperature difference situation at work.
According to the present invention, this thinks that the method by the formation fixture of a kind of fixture of the feature with claim 1 and a kind of feature with claim 1 solves.Preferred embodiment of the present invention provides in the dependent claims.
According to fixture of the present invention for for example comprising for absorbing and/or the heat transmitter of release heat as the electrothermal module of the parts of thermoelectric generator and the heat transmitter fixture that for example heat exchanger fixes.In addition be provided with electrothermal module.According to the present invention, electrothermal module is connected with containing profiled piece with heat transmitter, this containing profiled piece and electrothermal module and heat transmitter) together with form a cavity.It is changeable for heat conducting transmitting medium that this cavity is partly filled a kind of shape at work.Transmitting medium is arranged between electrothermal module and heat transmitter at least in part, so that electrothermal module and heat transmitter thermo-contact.
Because transmitting medium shape at work that is when heat transmitter has a kind of temperature in its working temperature can change, so transmitting medium can compensate the change causing due to thermal expansion.For this reason electrothermal module especially on gravity direction, be arranged in heat transmitter above.If for example the spacing between electrothermal module and heat transmitter, because thermal expansion is changed, can be extruded the gap between electrothermal module and heat transmitter and/or flow in this gap in order to compensate the change transmitting medium of spacing so at work.This can and actual temperature independently realize the good thermo-contact between electrothermal module and heat transmitter.Thermo-contact is especially irrelevant with the current temperature of heat transmitter.The transmitting medium that the irregularity degree of electrothermal module and heat transmitter can automatically can be changed by shape compensates.Because transmitting medium does not need to be firmly connected with electrothermal module or with heat transmitter, therefore transmitting medium can not peel off, even thereby large temperature difference Δ T, for example 400 ℃ of <=Δ T <=800 ℃, can not cause affecting heat conduction yet.By containing profiled piece, prevent that the changeable transmitting medium of shape from flowing away from electrothermal module.In addition by containing profiled piece, can realize especially hermetic seals of a kind of sealing, thus transmitting medium not can with environmental exposure.This can choose transmitting medium from many suitable materials, because also can use in principle material poisonous and/or that be harmful to environment.Transmitting medium is preferably unguinosus and/or liquid and/or gluey substantially under the changeable state of shape.
Especially, transmitting medium is at least until 200 ℃, especially until 150 ℃, preferably until 100 ℃ and particularly preferably until 50 ℃ be solid-state substantially.This is convenient to extra the fixing of transporting transmitting medium and can realize electrothermal module and heat transmitter before using in order to form fixture.Transmitting medium can be from 500 ℃, especially from 400 ℃, preferably from 300 ℃ and be particularly preferably changeable shape substantially from 200 ℃.At this temperature, compare with the normal temperature in heat transmitter and electrothermal module, form a kind of enough large thermal expansions, it can compensate by the transmitting medium of changeable shape.
Particularly preferably, transmitting medium has the thermal conductivity of the thermal conductivity that is greater than heat transmitter and/or electrothermal module.Can reduce thermal resistance thus.In addition because having the bed thickness that can change, transmitting medium can ignore the change of hot conduction resistance.
In a preferred embodiment, transmitting medium is metal substantially.Transmitting medium can especially a kind of liquid metal, if wherein transmitting medium carries out temperature compensation at needs by transmitting medium, for example liquefy just at the temperature from 200 ℃, just enough.Transmitting medium is especially made by a kind of pure material or preferred a kind of alloy, and the principal component with maximum weight ratio of this alloy is from comprising bismuth, indium, and gallium, selects in tin and/or plumbous group.Especially alloying element that can be by adding other is silver for example, copper, and antimony and/or zinc affect the characteristic of transmitting medium, for example, in order to reduce fusing point.For example additive and/or additive can be set, they can be semimetals, nonmetal or oxide.
In a preferred embodiment, contain profiled piece and can change height, to change the spacing between electrothermal module and heat transmitter.Contain profiled piece and can follow according to thermal expansion a kind of geometry of change thus.Contain for this reason profiled piece on cross section, be for example designed to corrugated, can be compressed or stretch thereby contain profiled piece.
Especially preferred, contain profiled piece have on cross section especially around container cavity, by means of it, can partly hold that volume becomes large transmitting medium due to thermal expansion.Container cavity is especially drained under normal temperature, that is transmitting medium is not in container cavity.If the shape of transmitting medium becomes and can change and become large because thermal expansion makes its volume at the temperature compared with high, transmitting medium can partly enter in container cavity so.Can obviously reduce to be thus applied to the power containing on profiled piece.Simultaneously passable, transmitting medium can enter into container cavity at this electrothermal module in the situation that heat transmitter moves.
Preferably, contain profiled piece around ground and electrothermal module and/or around ground and heat transmitter especially match materials be connected.By around connection cavity is closed with respect to environment.Connection by match materials realizes firm especially connection, and it can not destroy at high temperature yet.
Particularly preferably, select in this wise the quantity of transmitting medium, considering under all thermal expansions that occur at work, electrothermal module to be contacted by transmitting medium with total mutual relative point and the overlapped surface of heat transmitter.Quantity by transmitting medium can guarantee that the contact-making surface of mutual relative point of electrothermal module and heat transmitter is always in thermo-contact completely.
Especially, contain profiled piece and/or electrothermal module and/or heat transmitter and have the protective layer that points to cavity, it especially consists of the material with respect to liquid metal with high resistance.By this protective layer, especially provide the anti-corrosion protection for transmitting medium.Contain profiled piece, electrothermal module and heat transmitter can protectedly thus not be corroded, and during this corrosion possibility, by transmitting medium, are especially at high temperature caused.
The present invention relates to a kind of method that is used to form fixture in addition, and this fixture can be constructed especially as previously mentioned and expand.The method is especially described according to fixture as front, structure and expansion.Be provided in the method the heat transmitter of absorption and/or release heat.By one, contain profiled piece and be connected to form a cavity with heat transmitter.In cavity, partly fill a kind of transmitting medium for thermo-contact, this transmitting medium is changeable shape at work.One is for example inserted at least in part in cavity for generation of the electrothermal module of electric current, wherein between electrothermal module and heat transmitter, arranges at least in part transmitting medium.Electrothermal module is connected with containing profiled piece.
Because electrothermal module is not to be directly connected with heat transmitter, but indirectly by containing profiled piece, therefore can allow thermal expansion, wherein in order to fill a kind of transmitting medium that can change shape in the gap of thermo-contact between electrothermal module and heat transmitter.So also avoid the impact of thermal expansion on the thermo-contact between electrothermal module and heat transmitter at high temperature at work.
In the method preferably, the transmitting medium under solid phase is especially filled in cavity with the form of film, particle and/or powder.This is convenient to operate transmitting medium when cavity filling.
Particularly preferably, during forming fixture, transmitting medium is placed in to a kind of state that can change shape, wherein transmitting medium is especially melted.This especially carried out before electrothermal module is connected with containing profiled piece.By transmitting medium being placed under its state that can change shape, during forming fixture, just can be provided in the best thermo-contact between electrothermal module and heat transmitter.This is convenient to coming into operation of fixture, because can consider any particularity when using first.
Accompanying drawing explanation
Referring to accompanying drawing, according to preferred embodiment, describe the present invention in detail.
Fig. 1 shows a schematic section according to fixture of the present invention,
Fig. 2 shows a schematic cross section of different containing profiled pieces,
Fig. 3 shows the schematic section being connected that contains profiled piece and heat transmitter.
Embodiment
Figure 2 illustrates a plurality of different containing profiled pieces 18, according to its geometry, especially due to thermal expansion, section can change height for they.Containing profiled piece 18 can be stretched and upset at the middle in the vertical direction that arranges shown in Fig. 2 respectively.In addition contain profiled piece 18 and form and hold recess 30 in upper area, transmitting medium 22 can partly flow into this and holds recess when needed.Contain profiled piece 18 and especially on cross section, have a radius or a plurality of radius, this radius is design significantly preferably, to avoid strong notch stress to concentrate.
As shown in Figure 3, containing profiled piece 18 can connect 32 by extruding and be connected with heat transmitter 14.Heat transmitter 14 has and can will contain the space 34 of profiled piece 18 insertions for this reason.In order to contain profiled piece 18, insert between projection 36, can be first cooling containing profiled piece 18 significantly, make to contain profiled piece 18 and first there is less thickness.Space 34 is limited by two mutual relative projections 36, and this projection top is pressed in contains on profiled piece 18.Additionally can also be with a kind of bonding agent or a kind of scolder this space 34 of filling partly particularly.
Claims (26)
1. for by the fixing fixture of electrothermal module (12) and heat transmitter (14), comprise,
For absorbing and/or heat transmitter (14) and the electrothermal module (12) of release heat,
It is characterized in that,
Electrothermal module (12) and heat transmitter (14) are connected to one and contain profiled piece (18) above,
Wherein this containing profiled piece (18) forms a cavity (28) together with electrothermal module (12) and heat transmitter (14),
Wherein in cavity (28), partly fill a kind of shape at work changeable for heat conducting transmitting medium (22) and
Transmitting medium (22) is arranged between electrothermal module (12) and heat transmitter (14) at least in part, so that electrothermal module (12) and heat transmitter (14) thermo-contact.
2. fixture according to claim 1, is characterized in that, transmitting medium (22) is unguinosus substantially under the changeable state of shape, liquid state and/or gluey.
3. fixture according to claim 1, is characterized in that, transmitting medium (22) at least until 200 ℃ be solid-state substantially.
4. fixture according to claim 2, is characterized in that, transmitting medium (22) at least until 200 ℃ be solid-state substantially.
5. fixture according to claim 3, is characterized in that, transmitting medium (22) until 150 ℃ be solid-state substantially.
6. fixture according to claim 3, is characterized in that, transmitting medium (22) until 100 ℃ be solid-state substantially.
7. fixture according to claim 3, is characterized in that, transmitting medium (22) until 50 ℃ be solid-state substantially.
8. fixture according to claim 1, is characterized in that, transmitting medium (22) is changeable shape substantially from 500 ℃.
9. fixture according to claim 8, is characterized in that, transmitting medium (22) is changeable shape substantially from 400 ℃.
10. fixture according to claim 8, is characterized in that, transmitting medium (22) is changeable shape substantially from 300 ℃.
11. fixtures according to claim 8, is characterized in that, transmitting medium (22) is changeable shape substantially from 200 ℃.
12. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, transmitting medium (22) has the thermal conductivity of the thermal conductivity that is greater than heat transmitter (14) and/or electrothermal module (12).
13. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, transmitting medium (22) be metal or by a kind of alloy, made, the principal component with maximum weight ratio of this alloy is from comprising bismuth, indium, gallium, tin, and/or select in plumbous group.
14. fixtures according to claim 13, is characterized in that, in this alloy, can add alloying element: silver, copper, antimony, and/or zinc.
15. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, contains profiled piece (18) and can change height, to change the spacing between electrothermal module (12) and heat transmitter (14).
16. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, contain profiled piece (18) have around container cavity (30), it becomes large transmitting medium (22) for partly holding the volume due to thermal expansion.
17. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, contains profiled piece (18) and is connected with heat transmitter (14) match materials ground with electrothermal module (12) and/or around ground around ground.
18. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, select in this wise the quantity of transmitting medium (22), considering under all thermal expansions that occur at work, electrothermal module (12) and total mutual relative point and overlapped surface (24,26) of heat transmitter (14) to be contacted by transmitting medium (22).
19. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, contains the protective layer that profiled piece (18) and/or electrothermal module (12) and/or heat transmitter (14) have sensing cavity (28).
20. fixtures according to claim 19, is characterized in that, this protective layer provides the anti-corrosion protection for transmitting medium (22).
21. according to the fixture one of claim 1 to 11 Suo Shu, it is characterized in that, transmitting medium (22) is made by a kind of pure material.
22. are used to form according to the method for the fixture one of claim 1 to 21 Suo Shu (10), wherein
Be provided for the heat transmitter (14) of absorption and/or release heat,
By one, contain profiled piece (18) and be connected to form a cavity (28) with heat transmitter (14),
In cavity (28), partly fill a kind of transmitting medium for thermo-contact (22), this transmitting medium (22) is changeable shape at work,
An electrothermal module (12) inserts in cavity (28) at least in part, wherein between electrothermal module (12) and heat transmitter (14), arranges at least in part transmitting medium (22), and
Electrothermal module (12) is connected with containing profiled piece (18).
23. methods according to claim 22, is characterized in that, the transmitting medium in solid phase (22) is filled in cavity (28).
24. methods according to claim 23, is characterized in that, the form by transmitting medium (22) with film, particle and/or powder is filled in cavity (28).
25. according to the method described in claim 22 or 23, it is characterized in that, electrothermal module (12) is inserted contain profiled piece (18) in before or during transmitting medium (22) is placed in to a kind of state that can change shape.
26. methods according to claim 25, is characterized in that, transmitting medium (22) is to be melted.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008040190A DE102008040190A1 (en) | 2008-07-04 | 2008-07-04 | Arrangement for fastening thermoelectric generator with heat exchanger, has heat conducting medium partially arranged between thermoelectric module and heat exchanger, for thermal contact of thermoelectric module with heat exchanger |
| DE102008040190.0 | 2008-07-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101621267A CN101621267A (en) | 2010-01-06 |
| CN101621267B true CN101621267B (en) | 2014-03-05 |
Family
ID=41396857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910151887.3A Expired - Fee Related CN101621267B (en) | 2008-07-04 | 2009-07-03 | Fastening arrangement and method for designing same |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101621267B (en) |
| DE (1) | DE102008040190A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011007395A1 (en) * | 2011-04-14 | 2012-10-18 | Behr Gmbh & Co. Kg | Thermoelectric module for use in thermoelectric generator, for producing electrical energy, has device for generating electrical energy from heat, where contact surface of device is in thermal or electrical contact with connector |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2738162Y (en) * | 2004-11-03 | 2005-11-02 | 王建军 | Water heater electric core |
| CN1702881A (en) * | 2004-03-25 | 2005-11-30 | 株式会社东芝 | Thermoelectric device |
| CN1744338A (en) * | 2004-08-31 | 2006-03-08 | 株式会社东芝 | Thermoelectric device and method of manufacturing the same |
-
2008
- 2008-07-04 DE DE102008040190A patent/DE102008040190A1/en not_active Withdrawn
-
2009
- 2009-07-03 CN CN200910151887.3A patent/CN101621267B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1702881A (en) * | 2004-03-25 | 2005-11-30 | 株式会社东芝 | Thermoelectric device |
| CN1744338A (en) * | 2004-08-31 | 2006-03-08 | 株式会社东芝 | Thermoelectric device and method of manufacturing the same |
| CN2738162Y (en) * | 2004-11-03 | 2005-11-02 | 王建军 | Water heater electric core |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102008040190A1 (en) | 2010-01-07 |
| CN101621267A (en) | 2010-01-06 |
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