CN101618849B - Method for adjusting resonant frequency of torsional micro electro-mechanical component - Google Patents
Method for adjusting resonant frequency of torsional micro electro-mechanical component Download PDFInfo
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- CN101618849B CN101618849B CN200810127290A CN200810127290A CN101618849B CN 101618849 B CN101618849 B CN 101618849B CN 200810127290 A CN200810127290 A CN 200810127290A CN 200810127290 A CN200810127290 A CN 200810127290A CN 101618849 B CN101618849 B CN 101618849B
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000000047 product Substances 0.000 description 21
- 238000005516 engineering process Methods 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- -1 aluminium metals Chemical class 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
The invention discloses a method for adjusting resonant frequency of a torsional micro electro-mechanical component. Firstly, the torsional micro electro-mechanical component is provided, and then the resonant frequency of the torsional micro electro-mechanical component is detected to obtain a real resonant frequency of the torsional micro electro-mechanical component; if the real resonant frequency of the torsional micro electro-mechanical component is higher than a standard resonant frequency, at least one mass block is fixed on the torsional micro electro-mechanical component so as to increase the quality of the torsional micro electro-mechanical component and lower the real resonant frequency to approach to the standard resonant frequency, so that the purpose of adjusting the resonant frequency of the torsional micro electro-mechanical component is achieved.
Description
Technical field
The present invention relates to a kind of method of adjusting resonant frequency of torsional micro electro-mechanical component, particularly a kind of fixing at least one mass is to this torsion-type MEMS element, to adjust the method for this resonant frequency of torsional micro electro-mechanical component.
Background technology
In recent years; The downsizing that mainly develops into various mechanical organs (miniaturization) in micro electronmechanical (MEMS) field; Utilize the technology of integrated circuit to make microcomputer electric component; Typical microcomputer electric component has little gear, little lever or little valve, cooperates relevant control circuit to operate often in running, for example acceleration sensor (accelerometer), pressure and chemical sensor (pressure and chemicalsensors) and actuator (actuator) etc.
Micro electronmechanical product often is material with silicon, see through the multiple tracks semiconductor technology and the silicon material is processed as specific physical construction uses, for example, torsion-type MEMS element just often with torsion shaft (hinge) as actuating structure.Yet the geometric configuration of torsion shaft is for influencing resonant frequency (resonantfrequency, one of principal element RF) of torsion-type MEMS element; Simultaneously; Resonant frequency also is the parameter that the most often influences the product dynamic operation in this type of torsion-type MEMS element design, therefore, and when making torsion-type MEMS element; Need to make or adjust the torsion shaft that meets the resonant frequency area requirement through the different processes method.Be anticipated that more meticulous when harsh when the resonant frequency area requirement of product specification, the geometric configuration that decides torsion shaft through existing gold-tinted technology or etch process merely also is not easy.Therefore; The special adjustable torsion-type MEMS element of a kind of resonant frequency that proposes of inventor; Improve the restriction of existing torsion-type MEMS element technology; And after the torsion-type MEMS element manufacturing process was accomplished, the action of further resonant frequency of torsion-type MEMS element being adjusted was to meet the requirement of product resonant frequency scope.
Summary of the invention
For satisfying the demand, the present invention provides a kind of method of adjusting resonant frequency of torsional micro electro-mechanical component, and after the preliminary structure of torsion-type MEMS element was accomplished, the mode that sees through additional mass was adjusted its resonant frequency, to meet the demand of product specification.
For reaching above-mentioned purpose, the present invention provides a kind of method of adjusting resonant frequency of torsional micro electro-mechanical component.At first, a torsion-type MEMS element is provided, it comprises a supporting structure, a dull and stereotyped main body, and at least two torsion shafts that connect this flat board main body and this supporting structure.Then this torsion-type MEMS element being carried out a resonant frequency detects; To know an actual resonance frequency of this torsion-type MEMS element; When this actual resonance frequency of this torsion-type MEMS element is higher than a standard resonant frequency; Then fixing at least one mass increases the quality of this torsion-type MEMS element, so that this actual resonance frequency is reduced near this standard resonant frequency in this flat board main body.
Description of drawings
Fig. 1 and Fig. 2 a, 2b are the synoptic diagram of the method for the adjustment resonant frequency of torsional micro electro-mechanical component that illustrated according to a preferred embodiment of the present invention.
Fig. 3 is the schematic flow sheet that method illustrated according to adjustment resonant frequency of torsional micro electro-mechanical component of the present invention.
Fig. 4 and Fig. 5 a, 5b are the synoptic diagram according to the method for the adjustment resonant frequency of torsional micro electro-mechanical component that another preferred embodiment of the present invention illustrated.
Description of reference numerals
10 torsion-type MEMS elements, 12 dull and stereotyped main bodys
14 torsion shafts, 16 supporting structures
18 spatial accommodations, 20 active regions
21 non-active regions, 24 fronts
26 minute surfaces, 28 masses
29 back sides, 30 grafting materials
31 torsion-type MEMS elements, 32 dull and stereotyped main bodys
34 torsion shafts, 36 back sides
38 magnet, 40 supporting structures
42 spatial accommodations, 44 fronts
48 grafting materials, 50 masses
100、102、104、106、108
The process step of the method for adjustment resonant frequency of torsional micro electro-mechanical component
Embodiment
For making a nearlyer step understand characteristic of the present invention and technology contents, see also and followingly describe in detail bright and accompanying drawing about of the present invention.Yet the appended diagram usefulness with aid illustration only for reference is not that the present invention is limited.
Please refer to Fig. 1 and Fig. 2 a, 2b, Fig. 1 and Fig. 2 a, 2b are the synoptic diagram of the method for the adjustment resonant frequency of torsional micro electro-mechanical component that illustrated according to a preferred embodiment of the present invention.As shown in Figure 1, a torsion-type MEMS element 10 is provided, it includes a dull and stereotyped main body 12 and two torsion shafts 14.Arrange through a first direction of the mass centre of dull and stereotyped main body 12 on torsion shaft 14 edges of torsion-type MEMS element 10; Connect dull and stereotyped main body 14 in a supporting structure 16; And dull and stereotyped main body 12 is arranged in the spatial accommodation 18 of supporting structure 16, and dull and stereotyped main body 12 is that centre of twist axle (torsinal axis) freely swings with torsion shaft 14 in spatial accommodation 18.In addition; One positive 24 definition of dull and stereotyped main body 12 have an active region 20 and a non-active region 21; Metal deposition process titanium deposition capable of using/gold (Ti/Au), copper/gold (Cu/Au) or aluminium metals such as (Al) are as reflection layer in active region 20; Be used as micromirror and use, for example the minute surface 26 shown in this preferred embodiment also can be provided with various device or element according to the specification demand of product in active region 20; And, also can install other micro electronmechanical moving part or electronic circuit systems not as limit.
After torsion-type MEMS element 10 preliminary structures are accomplished; Provide a driving force to make torsion-type MEMS element 10 produce resonance; And torsion-type MEMS element 10 is carried out a resonant frequency detect, to learn an actual resonance frequency of torsion-type MEMS element 10.The driving force that drives torsion-type MEMS element 10 can comprise sources such as electromagnetic force, electrostatic force, hot driving force or piezoelectricity, and torsion-type MEMS element of the present invention can cooperate relevant component arrangement, resonates in response to different driving power source.For instance; If torsion-type MEMS element of the present invention utilizes electromagnetic force to drive; When making this torsion-type MEMS element; Can a magnet or a solenoid be arranged on a back side of this torsion-type MEMS element, after the structure fabrication of treating this torsion-type MEMS element is accomplished, the below that in addition a corresponding external electromagnetic coil or a magnet is arranged on this torsion-type MEMS element; To provide this torsion-type MEMS element resonance required driving force; Yet the installing of this magnet or this solenoid is not limited in the manufacturing process of this torsion-type MEMS element, also can behind the making step of accomplishing this torsion-type MEMS element, add separately to this torsion-type MEMS element again.
After learning this actual resonance frequency of torsion-type MEMS element 10; Then compare this actual resonance frequency and a standard resonant frequency; Wherein, This standard resonant frequency is decided according to the product of torsion-type MEMS element 10 desires application, confirms simultaneously whether this actual resonance frequency meets in the scope of this required standard resonant frequency of product.If the comparison back finds that this actual resonance frequency of torsion-type MEMS element 10 drops on outside the scope of this standard resonant frequency, for example this actual resonance frequency is higher than this standard resonant frequency, then can fix at least one mass; Shown in Fig. 2 a and Fig. 2 b, wherein Fig. 2 a is the diagrammatic cross-section of torsion-type MEMS element 10, and Fig. 2 b is the schematic bottom view of torsion-type MEMS element 10; With this preferred embodiment is example; On the dull and stereotyped main body 12 of fixing a plurality of mass 28 to torsion-type MEMS elements 10 that comprise non-magnet material, and consider that the active region 20 of torsion-type MEMS element 10 is located at the front 24 of torsion-type MEMS element 10, for not influencing the elements running in the active region 20; Preferred mode is a back side 29 that mass 28 is fixed on dull and stereotyped main body 12; Wherein, this preferred embodiment utilizes a grafting material 30, and for example a ultraviolet tape or other have the material of good set ability; The quantity of the mass 28 that desire is fixing is decided by the error of this actual resonance frequency and this standard resonant frequency; And be fixed to the dull and stereotyped main body 12 of torsion-type MEMS element 10 at mass 28 after, generally speaking, the quality of torsion-type MEMS element 10 increases; Make this actual resonance frequency of torsion-type MEMS element 10 descend, to conform to this required standard resonant frequency of product specification; In addition, shown in Fig. 2 b, the mass 28 of fixed length strip is to dull and stereotyped main body 28 back sides in this preferred embodiment, and so its shape and quantity are not limited by the synoptic diagram of Fig. 2 b.
Please refer to Fig. 3, Fig. 3 is the schematic flow sheet that method illustrated according to adjustment resonant frequency of torsional micro electro-mechanical component of the present invention, concludes the operation steps of the method for adjustment resonant frequency of torsional micro electro-mechanical component among the present invention with summary.The method of adjustment resonant frequency of torsional micro electro-mechanical component of the present invention comprises following steps:
Step 100 a: torsion-type MEMS element is provided;
Step 102: this torsion-type MEMS element is carried out a resonant frequency detect, to learn an actual resonance frequency of this torsion-type MEMS element;
Whether step 104: whether this actual resonance frequency of comparing this torsion-type MEMS element conforms to a standard resonant frequency, meet in the scope of this required standard resonant frequency of product to confirm this actual resonance frequency; After comparison,, when for example the actual resonance frequency of this microcomputer electric component is higher than this standard resonant frequency, then carry out step 106 if this actual resonance frequency of this microcomputer electric component drops on outside the scope of this standard resonant frequency; After comparison,, then carry out step 108 if the resonant frequency of this microcomputer electric component drops in the scope of this standard resonant frequency;
Step 106: fixing at least one mass to adjust this actual resonance frequency, drops near this standard resonant frequency the torsion frequency of this torsion-type MEMS element to this torsion-type MEMS element;
Step 108: this microcomputer electric component that will meet product standard is delivered to other follow-up processing steps, for example encapsulates or the combination of elements relevant with other, to be made into operational electronic product.
Different in response to torsion-type MEMS element product design and driving method, the present invention provides a preferred embodiment in addition, please refer to Fig. 4 and Fig. 5 a, 5b.Fig. 4 one drives to produce the structural representation that a torsion-type MEMS element 31 is provided of resonance with electromagnetism strength; It includes the magnet 38 that a dull and stereotyped main body 32, two torsion shafts 34 and are located at a back side 36 of dull and stereotyped main body 32; Compare with last embodiment; Drive with generation resonance because of torsion-type MEMS element 31 utilizes with electromagnetism strength, thereby the back side 36 of torsion-type MEMS element 31 is provided with magnet 38.As last preferred embodiment; Arrange through a first direction of the mass centre of dull and stereotyped main body 32 on torsion shaft 34 edges of torsion-type MEMS element 31; Connect dull and stereotyped main body 32 in a supporting structure 40; And dull and stereotyped main body 32 is arranged in the spatial accommodation 42 of supporting structure 40, and dull and stereotyped main body 32 is that centre of twist axle freely swings with torsion shaft 34 in spatial accommodation 42.One positive 44 of torsion-type MEMS element 31 is provided with an active region 46; Cooperate product design to be used for the various element of device; For example: a micromirror can be applicable to laser printer, digital light processor (digital light processing device) or other need see through the product that torsion-type MEMS element 31 of the present invention changes opticpaths.
Said as last preferred embodiment; Torsion-type MEMS element 31 is after preliminary completing; Can carry out the detection of a resonant frequency, learning an actual resonance frequency of torsion-type MEMS element 31, and compare with a standard resonant frequency; To confirm whether this actual resonance frequency meets in the scope of this required standard resonant frequency of product; If this actual resonance frequency of torsion-type MEMS element 31 drops on outside the scope of this standard resonant frequency, when for example the actual resonance frequency of this torsion-type MEMS element is higher than this standard resonant frequency, then can fix at least one mass to torsion-type MEMS element 31.Please refer to Fig. 5 a and Fig. 5 b, wherein Fig. 5 a is the diagrammatic cross-section of torsion-type MEMS element 31, and Fig. 5 b is the schematic bottom view of torsion-type MEMS element 31; With this preferred embodiment is example, utilizes a grafting material 48 that a plurality of masses 50 are fixed on the back side 36 of torsion-type MEMS element 31, for example is fixed on the surface of magnet 38; Increase the quality of torsion-type MEMS element 31 integral body, this actual torsion frequency of torsion-type MEMS element 31 is dropped near this standard resonant frequency, wherein; When fixing those masses; Preferred mode is to fix along the first direction that torsion shaft 34 is arranged, to avoid behind fixed mass piece 50 the extra moment of those masses 50 generations; Go to influence the effect that the present invention adjusts torsion-type MEMS element 31 resonant frequencies; And those masses 50 that are fixed to torsion-type MEMS element 31 are not limited to the circle shown in Fig. 5 b, can cooperate the structure of torsion-type MEMS element 31 and determine its pattern, and consider that torsion-type MEMS element 31 drives with electromagnetism strength; The material of those masses 50 need be selected for use and not have a material of magnetic, in order to avoid influence the normal operation of torsion-type MEMS 31.
In general; Torsion-type MEMS element of the present invention can be through a series of semiconductor technology; For example photoetching process, etch process, depositing operation, CMP process; And seeing through the design of optical mask pattern, same road promptly capable of using photomask defines dull and stereotyped main body, torsion shaft, supporting structure and the micromirror of torsion-type MEMS element of the present invention simultaneously on silicon wafer.If be used to make torsion-type MEMS element of the present invention is to be the wafer of a normal thickness; This torsion-type MEMS element below is emptied in technological design capable of using and realization, makes it can not receive to arrest the space of limitting and having the FREE TORSION motion; And after producing a plurality of torsion-type MEMS elements on the same wafers; Each torsion-type MEMS element all can FREE TORSION move on the wafer at this moment, and the resonant frequency that can carry out a wafer scale detects, in order to detect the resonant frequency of those torsion-type MEMS elements; Adjust respectively according to other demand again, to meet the demand of product specification; Otherwise; If being used to make those torsion-type MEMS elements of the present invention is a LED reverse mounting type, consider that LED reverse mounting type itself can be the structure material of torsion-type MEMS element, not having enough spaces at the LED reverse mounting type thickness direction can empty; Thereby possibly not have enough spaces the motion of this torsion-type MEMS element FREE TORSION is provided; Then can test one by one again, to adjust each independently resonant frequency of torsion-type MEMS cutting apart those torsion-type MEMS elements for behind the element independently.In addition; If find that behind fixed mass piece to torsion-type MEMS element the resonant frequency fall of this torsion-type MEMS element is excessive; When being lower than this standard resonant frequency, the mass of desirable lower part drops in the scope of this standard resonant frequency adjusted actual resonance frequency.
Hence one can see that, the invention provides a kind of method of adjusting resonant frequency of torsional micro electro-mechanical component, behind the preliminary structure fabrication of accomplishing torsion-type MEMS element; Measure earlier an actual resonance frequency of this torsion-type MEMS element, and with a standard resonant frequency of product specification relatively, if when the actual resonant frequency of torsion-type MEMS element of the present invention is higher than the required standard resonant frequency of product specification; Then can on torsion-type MEMS element, fix at least one mass; Need consider the position and the symmetry of those masses in the time of fixedly, select the mass of right quantity, and through suitable grafting material; A ultraviolet tape for example; Mass is fixed in torsion-type MEMS element, in order to increase the quality of whole little torsion element, so that reduce its resonant frequency.Therefore, substandard torsion-type MEMS element can avoid scrapping a way, and improve its product yield behind the mass that increases some originally.Moreover; The fixing position of those masses of the present invention is not limited to the back side of being located at dull and stereotyped main body shown in the aforementioned preferred embodiments; Also can be located at the place beyond the active region on the dull and stereotyped main body front, for example non-active region 21, its quantity, position, shape, size all can be adjusted according to circumstances; Only otherwise the element operation that influences on the active region gets final product; And the element that can be provided with in the active region is not limited to the minute surface shown in the preferred embodiments of the present invention, and other mechanical moving part, sensing element or electronic circuit etc. are looked closely the purposes of product and selected required element to be located in the active region.
The above is merely the preferred embodiments of the present invention, and all equivalent variations and modifications of doing according to claim of the present invention all should belong to covering scope of the present invention.
Claims (11)
1. method of adjusting resonant frequency of torsional micro electro-mechanical component, it includes:
One torsion-type MEMS element is provided, and it comprises a magnet, a supporting structure, a dull and stereotyped main body, and at least two torsion shafts that connect this flat board main body and this supporting structure;
This torsion-type MEMS element is carried out a resonant frequency detect, to know an actual resonance frequency of this torsion-type MEMS element; And
When this actual resonance frequency of this torsion-type MEMS element is higher than a standard resonant frequency; Then fixing at least one detachable mass is in another surface with respect to this magnet of joint and this flat board main body of this magnet; Increase this torsion-type MEMS element quality so that this actual resonance frequency be reduced near this standard resonant frequency
Wherein this detachable mass is provided with along these torsion shafts.
2. the method for claim 1, wherein should the flat board main body serve as resonance central shaft and twisting vibration with these torsion shafts.
3. the method for claim 1 wherein should the flat board main body comprise a positive and back side.
4. method as claimed in claim 3, wherein this detachable mass is fixed in this front of this flat board main body.
5. method as claimed in claim 3, wherein this detachable mass is fixed in this back side of this flat board main body.
6. method as claimed in claim 5 wherein should the flat board main body comprise an active region and a non-active region, was located at this front.
7. method as claimed in claim 6 wherein should the flat board main body comprise a minute surface, was located at this active region of this flat board main body.
8. method as claimed in claim 6, wherein this non-active region is located at the periphery of this active region.
9. the method for claim 1, wherein the material of this detachable mass comprises silicon.
10. the method for claim 1, wherein this detachable mass comprises non-magnet material.
11. like claim the 10 described methods, wherein this detachable mass utilizes a grafting material, adheres and is fixed in this flat board main body.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844937A (en) * | 2006-05-12 | 2006-10-11 | 中国科学院上海微系统与信息技术研究所 | High-sensitivity MEMS photoelectric galvanometer, making and detecting method thereof |
| CN101121498A (en) * | 2006-08-07 | 2008-02-13 | 探微科技股份有限公司 | Method for manufacturing micro-torsion shaft |
| CN101126837A (en) * | 2006-08-14 | 2008-02-20 | 株式会社理光 | Vibrating mirror, light writing device, and image forming apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844937A (en) * | 2006-05-12 | 2006-10-11 | 中国科学院上海微系统与信息技术研究所 | High-sensitivity MEMS photoelectric galvanometer, making and detecting method thereof |
| CN101121498A (en) * | 2006-08-07 | 2008-02-13 | 探微科技股份有限公司 | Method for manufacturing micro-torsion shaft |
| CN101126837A (en) * | 2006-08-14 | 2008-02-20 | 株式会社理光 | Vibrating mirror, light writing device, and image forming apparatus |
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