CN101610639B - Multidirectional separated scalable interconnected mother board - Google Patents
Multidirectional separated scalable interconnected mother board Download PDFInfo
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- CN101610639B CN101610639B CN2009100598419A CN200910059841A CN101610639B CN 101610639 B CN101610639 B CN 101610639B CN 2009100598419 A CN2009100598419 A CN 2009100598419A CN 200910059841 A CN200910059841 A CN 200910059841A CN 101610639 B CN101610639 B CN 101610639B
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- mother board
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- board unit
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Abstract
The invention provides a multidirectional separated scalable interconnected mother board, aiming to provide a mother board which is compact in architecture, close in cooperation, rapid in interconnected separation and reunion, convenient in change of circuit modules and capable of expanding the core number of channels/ports of the circuit modules. The mother board comprises at least two blocks of rigid interconnected mother board units, the front end of each interconnected mother board unit is embedded with a minitype elastic sphere connector which is electrically connected with a tail-end interconnected contact point by a flexible printed circuit board (FPCB); the minitype elastic sphere connector linear array is distributed in encapsulation materials of the interconnected mother board units, which is corresponding to the interconnected contact point of the front interconnected mother board units and connects with each other successively in an end-to-end manner, and conducts the electrical signal of the interconnected mother board in series. The invention solves the problem that mother boards can not be interconnected at other side surfaces among several different interconnected circuit modules after the traditional bus mother board and rigid interconnected mother board are interconnected, and overcomes the defect that the traditional bus mother board and the rigid interconnected mother board are inherently integrated and can not be separated.
Description
Technical field
The present invention relates to a kind of modular electronic equipment engineering that is used for and use, different printing circuit board unit and the interconnected motherboard of circuit module are used to peg graft.
Background technology
As shown in Figure 4, being contained in the cabinet 1 in the prior art, being plugged on circuit module 2 lower ends, circuit module 2 is carried out interconnected traditional motherboard 3, is the bus mother board of the changeless integrated inseparable expansion of a kind of output signal line way.This bus is interconnected, the motherboard of grafting different printing circuit board unit and transfer circuit modular telecommunications number, the element circuit module that can only hold specified signal circuit heart yearn total amount, and can't may overshoot the channels/ports core number of amount and printed board unit circuit module hold the piece number.Also circuit module that can not several differences are interconnected carries out interconnected on other sides of its motherboard.Thereby adopt restriction also to restrict different circuit modules, around carry out further expanding of circuit function in interconnected separation and the module simultaneously.In case plug-in unit channels/ports signal line core is counted the maximum number that total amount overshoot saturation capacity or printed board unit circuit module external interface hold on the motherboard, bus mother board just can not be finished the integrated of adjunct circuit modular circuit, can only strengthen the volume and the intensive wiring of modular electronic equipment and just can carry out limited solution with increasing motherboard confined space traverse line face length degree in length and breadth.
Again because vertical the pegging graft of this employing polylith is fixed on circuit module in the rigidity box body, being pegged graft by motherboard up and down is fixed on that printed board unit in the rigidity box body forms.Circuit module is the integrated vertical abreast fixed structure that is associated on the motherboard of inserting.Thisly be encapsulated in printed board unit circuit module in the rigidity box body by motherboard up and down, the quantity of its interconnect printed circuit board and output signal line way immobilize and can not expand.Therefore, hold printed board unit circuit module piece number and cannot exceed the ormal weight of motherboard signal line wick passageway up and down, and then restricted further expanding of printed board circuit module plug-in channels/ports core number interconnection motherboard.Its another weak point is that quilt is the circuit module of motherboard fixed pattern interconnection up and down, cannot extract out arbitrarily.If will extract out and safeguard or change, after then must will being interconnected in upper end bus mother board on the circuit module frame and extracting, just can carry out, this just gives and changes and safeguard and brought operation to go up inconvenient trouble.
Summary of the invention
The objective of the invention is the weak point that exists at above-mentioned prior art, propose a kind of compact in architecture, close in cooperation, interconnected clutch is efficient and convenient, separated scalable interconnected mother board that can multi-direction expansion interconnection circuit module plug-in.
Above-mentioned purpose of the present invention can reach by following measure, a kind of multidirectional separated scalable interconnected mother board provided by the invention, it comprises, rigidity interconnected mother board unit more than at least two, it is characterized in that, the front end of every interconnected mother board unit is embedded with the miniature elastic connector, and connect the interconnected contact signal line of next interconnected mother board unit tail linear array linear array contact circuit by the spheroid that the miniature elastic connector protrudes end face, this miniature elastic connector linear array is arranged in the encapsulating material of described interconnected mother board unit, and corresponding interconnected contact at preceding interconnected mother board unit tail end; It is end to end successively that each joins the motherboard unit, the signal of telecommunication of the continuous interconnected mother board of series connection conducting.
The present invention has following beneficial effect than prior art.
The present invention is by being encapsulated in miniature elastic ball connector and the flexible PCB in the rigidity interconnected mother board unit more than two, the complete multidirectional separated scalable interconnected mother board that is electrically connected of end to end successively formation, not only can extend longitudinally expansion interconnection circuit module plug-in, made things convenient for the interconnected and expansion between the circuit module, improved the extending space of printed board unit circuit module output signal capacity of trunk, and circuit module is plugged arbitrarily on can be in any direction, for safeguarding or change inserting to get arbitrarily and providing quick of vertical grafting function circuit module, the timesaving convenience.Whole compact in architecture, close in cooperation, interconnected clutch is quick and easy.Solved conventional bus motherboard, rigid-flexible interconnected mother board interconnected after, can not carry out the interconnected problem of motherboard in other sides between the interconnected circuit module of several differences.Avoid conventional bus motherboard, the intrinsic integrated inseparable shortcoming of rigid-flexible interconnected mother board, enriched the kind and the form of interconnected mother board between the circuit module.
Description of drawings
Further specify the present invention below in conjunction with drawings and Examples, but therefore do not limit the present invention among the described scope of embodiments.
Fig. 1 shows be multidirectional separated scalable interconnected mother board of the present invention analyse and observe the interconnecting relation schematic diagram.
Fig. 2 is the vertical view after the level of Fig. 1 is cutd open.
What Fig. 3 showed is the cutaway view of multidirectional separated scalable interconnected mother board of the present invention unit.
What Fig. 4 showed is present motherboard and the interconnected view of circuit module.
Among the figure: 1. cabinet, 2. circuit module, 3. interconnected mother board, 4. interconnected mother board unit, 5. flexible circuit board, 6. encapsulating material, 7. miniature elastic connector, 8. microsprings, 9. metal ball body, 10. interconnected contact, 11. pads, the interconnected expansion interface of 12. circuit modules, 13. printed conductors.
Embodiment
Consult Fig. 1～Fig. 2.Join end to end successively by the rigidity interconnected mother board unit 4 more than two.Miniature elastic ball connector 7 and flexible circuit board 5 (FPCB) encapsulate and are embedded in the rigidity interconnected mother board encapsulating material 6 shown in Figure 3.Miniature elastic ball connector 7 is arranged on the front end of every interconnected mother board unit, and by the interconnected contact 10 on the flexible circuit board 5 circuit connections electrical connection tail end.Miniature elastic ball connector 7 is arranged by linear array, and cross direction profiles is in the front end faying face of interconnected mother board unit.The miniature elastic ball connector 7 that connects the interconnected contact of next interconnected mother board unit tail linear array 10 holding wire linear array contact circuits, corresponding to the interconnected contact 10 of preceding interconnected mother board unit 4 tail ends, and end to end.Spheroid by miniature elastic connector 7 protrusion end faces between each interconnected mother board unit is connected with 10 contacts of interconnected contact, realizes signal of telecommunication conducting.
Interconnected mother board unit linear combination by such more than two can constitute multidirectional separated scalable interconnected mother board of the present invention.
Consult Fig. 3.Miniature elastic connector 7 is formed by burying the microsprings 8 and the metal ball body 9 that are encapsulated in the interconnected mother board 4 one side faces underground.Described microsprings 8 connects firmly on the pad on the flexible circuit board 5 11, and by the electronic circuit on the above-mentioned pad 11 electrical connection flexible circuit boards 5.Have soft folding characteristics according to flexible circuit board, flexible circuit board can bend to " U " shape shape of tallboy projection of shape.Pad 11 is fixed on " U " shape profile of flexible board one side, and links to each other with miniature elastic connector 7.The interconnected expansion interface 12 of circuit module that interconnected mother board unit 4 is formed by flexible board carries out electric the connection with circuit module 2.The interconnected contact 10 of linear array layout is the corresponding port that connects miniature elastic connector 7 on the interconnected mother board unit 4 tail side faying faces, this port is the identical spherical groove of shape size and above-mentioned metal ball body 9, metal ball body 9 with multi-direction rolling is under the effect of above-mentioned microsprings 8, and elasticity connects spherical groove.Being communicated with of the signal of telecommunication realized in the interconnected contact 10 that miniature elastic connector 7 is gone up correspondence position by printed conductor 13 and flexible circuit board 5 (FPCB).
Consult Fig. 4.When circuit module 2 plug-in units are inserted on traditional motherboard 3, by the multidirectional separated scalable interconnected mother board that the present invention is combined to form, can be by the locking of the locking strip on the module interconnect circuit 2 plug-in unit housings.The metal ball body 9 of the linear array miniature elastic connector 7 on the interconnected mother board unit 4 is corresponding continuous with the linearly aligned interconnected contact 10 on another piece interconnected mother board unit 4, and the signal of telecommunication intercommunication between the circuit module.
When needs were safeguarded or changed circuit module 2, as long as extract wherein circuit module 2 that insulate with the housing contact-making surface out, end to end interconnected mother board unit 4 will automatic disconnection.If interconnected mother board unit 4 is assembled in the end face and the side of circuit module 2 housings simultaneously, so, when assembling or extraction circuit module 2, in the metal ball body 9 of the linear array miniature elastic connector 7 on the interconnected mother board unit 4 on the circuit module 2 housing end faces and the linearly aligned interconnected contact 10 on another piece interconnected mother board unit 4, just can be at Z to interconnected or separation, simultaneously, in the metal ball body 9 of the linear array miniature elastic connector 7 on the interconnected mother board unit 4 on the circuit module 2 housing sides and the linearly aligned interconnected contact 10 on another piece interconnected mother board unit 4, just can be at Y to interconnected or separation.If interconnected mother board unit 4 is assembled in around the circuit module 2 simultaneously, plug on just can be in the horizontal direction linear assembling of circuit module 2 or the vertical direction and be assembled in the cabinet, so, the metal ball body 9 of the linear array miniature elastic connector 7 on the interconnected mother board unit 4 and the linearly aligned interconnected contact 10 on another piece interconnected mother board unit 4, just can X to Y to or Z to Y to simultaneously interconnected or separate, realize multidirectional separated scalable interconnected.
The thickness of interconnected mother board unit 4 can design according to actual needs, but must be greater than the full-size of miniature elastic connector 7, interconnected mother board unit 4 length and width decide according to the face size and the circuit module 2 channels/ports core numbers of the circuit module 2 that is connected.Because the concrete structure of interconnected mother board unit 4 is identical, and certain difference is just arranged on length and width, so, except with having put in order of the circuit module 2 that is connected outside the Pass, do not have the sequence requirement on self making up.
Above-described only is the preferred embodiments of the present invention.Should be understood that, for the person of ordinary skill of the art, under the prerequisite that does not break away from the principle of the invention, can also make some distortion and improvement, such as, the present invention can change the metal ball body 9 in the linear array miniature elastic connector 7 on the interconnected mother board unit 4 into spherical end surface metal column.These changes and change should be considered as belonging to protection scope of the present invention.
Claims (7)
1. multidirectional separated scalable interconnected mother board, it comprises, rigidity interconnected mother board unit more than at least two, it is characterized in that, the front end of every interconnected mother board unit is embedded with the miniature elastic connector, and connect the interconnected contact signal line of next interconnected mother board unit tail linear array linear array contact circuit by the spheroid that the miniature elastic connector protrudes end face, this miniature elastic connector linear array is arranged in the encapsulating material of described interconnected mother board unit, and corresponding interconnected contact at preceding interconnected mother board unit tail end; Each interconnected mother board unit is end to end successively, the signal of telecommunication of the continuous interconnected mother board of series connection conducting.
2. multidirectional separated scalable interconnected mother board as claimed in claim 1 is characterized in that, miniature elastic connector (7) is arranged by linear array, and cross direction profiles is in the front end faying face of interconnected mother board unit.
3. multidirectional separated scalable interconnected mother board as claimed in claim 1 is characterized in that, described miniature elastic connector (7) is encapsulated in interconnected mother board (4) the one side faces microsprings (8) and metal ball body (9) and forms by burying underground.
4. multidirectional separated scalable interconnected mother board as claimed in claim 3, it is characterized in that, described microsprings (8) connects firmly on the pad (11) on the flexible circuit board (5), and by the electronic circuit on above-mentioned pad (11) the electrical connection flexible circuit board (5).
5. multidirectional separated scalable interconnected mother board as claimed in claim 1 is characterized in that, pad (11) is fixed on " U " shape profile of flexible circuit board one side, and links to each other with miniature elastic connector (7).
6. multidirectional separated scalable interconnected mother board as claimed in claim 1 is characterized in that, the interconnected expansion interface of circuit module (12) that interconnected mother board unit (4) are formed by flexible circuit board carries out electric the connection with circuit module (2).
7. multidirectional separated scalable interconnected mother board as claimed in claim 6, it is characterized in that, the interconnected contact (10) of linear array layout is the corresponding port that connects miniature elastic connector (7) on interconnected mother board unit (4) the tail side faying face, this port is a shape size and the identical spherical groove of above-mentioned metal ball body (9), metal ball body (9) with multi-direction rolling is under the effect of above-mentioned microsprings (8), and elasticity connects spherical groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100598419A CN101610639B (en) | 2009-06-29 | 2009-06-29 | Multidirectional separated scalable interconnected mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100598419A CN101610639B (en) | 2009-06-29 | 2009-06-29 | Multidirectional separated scalable interconnected mother board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101610639A CN101610639A (en) | 2009-12-23 |
| CN101610639B true CN101610639B (en) | 2010-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100598419A Expired - Fee Related CN101610639B (en) | 2009-06-29 | 2009-06-29 | Multidirectional separated scalable interconnected mother board |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6020635A (en) * | 1998-07-07 | 2000-02-01 | Advanced Interconnections Corporation | Converter socket terminal |
| CN1885623A (en) * | 2005-06-24 | 2006-12-27 | 哈廷电子有限公司及两合公司 | Printed circuit board connector for differential signal transmission |
-
2009
- 2009-06-29 CN CN2009100598419A patent/CN101610639B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6020635A (en) * | 1998-07-07 | 2000-02-01 | Advanced Interconnections Corporation | Converter socket terminal |
| CN1885623A (en) * | 2005-06-24 | 2006-12-27 | 哈廷电子有限公司及两合公司 | Printed circuit board connector for differential signal transmission |
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| Publication number | Publication date |
|---|---|
| CN101610639A (en) | 2009-12-23 |
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