CN101604784A - The processing procedure that is used for the antenna on the electronic product - Google Patents
The processing procedure that is used for the antenna on the electronic product Download PDFInfo
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- CN101604784A CN101604784A CNA2008101094710A CN200810109471A CN101604784A CN 101604784 A CN101604784 A CN 101604784A CN A2008101094710 A CNA2008101094710 A CN A2008101094710A CN 200810109471 A CN200810109471 A CN 200810109471A CN 101604784 A CN101604784 A CN 101604784A
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Abstract
A kind of processing procedure that is used for the antenna on the electronic product, comprise one and set step, a positioning step, a welding step, and encapsulation step, this positioning step is that an iron core that is arranged with a coil is positioned on the joint face of a substrate, this welding step is first with this coil, first on the joint face that is welded in this substrate respectively held in two welderings, two weld parts, this encapsulation step is to utilize the moulding means with a nappe moulding and be incorporated on the joint face of this substrate earlier, and then this coil and iron core buried be overlying on wherein, utilize this nappe moulding to be incorporated on the joint face of this substrate, to penetrate the operation that encapsulation replaces the encapsulating encapsulation, can significantly shorten man-hour, improve production efficient.
Description
[technical field]
The present invention relates to a kind of processing procedure of antenna, be meant a kind of processing procedure that is used for the antenna on the electronic product especially.
[background technology]
Consult Fig. 1,2, the antenna element that generally is used for electronic product, the square casing 11, one that comprises a hollow form is located in this housing 11 and had the iron core 13 of a coil 12, two to be placed in first weld tabs 18 on this housing 11, two second weld tabs 14 that are placed at intervals on this housing 11 at intervals around the home, and one is filled in this housing 11 and gives the filling glue 15 that this coil 12 and iron core 13 is fixing.
Wherein, this housing 11 comprises a diapire 111, one side is from the upwardly extending leg 112 of these diapire 111 peripheries, this diapire 111 and this leg 112 define the ccontaining accommodation space 16 of this coil 12 of a confession and iron core 13 jointly, and this leg 112 have one away from this diapire 111 away from face 113, described first and second weld tabs the 18, the 14th is placed in this away from the face 113, and all is flush state with this away from face 113.
Moreover, the processing procedure of this antenna element is earlier this coil 12 to be positioned in this accommodation space 16 with iron core 13, again described first weld tabs 18 is welded at these coil 12 two ends respectively, and described two second weld tabs 14 are welded together, but make described two second weld tabs 14 link and be electric conducting state, then, the mode of this filling glue 15 with the encapsulating encapsulation is filled in this accommodation space 16, this coil 12 and iron core 13 are buried by this fillings glue 15 to be covered and is positioned in the interior accommodation space 16 of this housing 11, but because this filling glue 15 is after solidifying on this housing 11, can produce as shown in Figure 2 filling glue 15 protrude in this leg 112 away from face 113, and can't flush away from face 113 with this, need utilize plain grinding means to make this filling glue 15 again and reach the aspect that flushes away from face 113.
But, all quite thin and does not also have location because of first and second weld tabs, cause it when weld job, quite difficulty in addition, in the process of encapsulating, not only need will be filled the position that glue 15 alignings are inserted with inconvenient, and its filler operation also expends a large amount of man-hours.
Then, in the middle of the plain grinding process, excessively deeply polish this filling glue 15 and be somebody's turn to do away from face 113, first and second weld tabs 18,14 that very easily may wear to and should flush away from face 113, therefore, make not only consumption during expenses of labour in the operation of this filling glue 15 of plain grinding of this antenna element, and improve the risk that described first and second weld tabs 18,14 worn and torn accidentally and cause the product out-of-flatness.
[summary of the invention]
The object of the present invention is to provide a kind of processing procedure that is used for the antenna on the electronic product, can effectively reduce work flow and reduce product defect.
For achieving the above object, the present invention is used for the processing procedure of the antenna on the electronic product, and comprise one and set step, a positioning step, a welding step, and an encapsulation step.
This sets step is to have purchased a substrate earlier, this substrate has a joint face, and one in contrast to this joint face away from face, with one first metalwork, one second metalwork and one the 3rd metalwork are embedded on this substrate at intervals, make this first metalwork have first weld part that is revealed in the joint face of this substrate, and first contact site that is connected in this first weld part and is revealed in this substrate away from face, in like manner, this second metalwork also has second weld part that is revealed in the joint face of this substrate, and second contact site that is connected in this second weld part and is revealed in this substrate away from face, and the 3rd metalwork has two portions that appear that are revealed in the joint face of this substrate, and one is connected in described the 3rd contact site away from face that appears portion and be revealed in this substrate.
This positioning step is that an iron core that is arranged with a coil is positioned on the joint face of this substrate, and wherein, this coil has one first weldering end, and second a weldering end in contrast to this first weldering end.
This welding step is first weld part that the first weldering end of this coil is welded in this first metalwork, and the second weldering end of this coil is welded in second weld part of this second metalwork.
This encapsulation step is to utilize the moulding means with a nappe moulding and be incorporated on the joint face of this substrate earlier, and then this coil and iron core together buried is overlying on wherein.
By this nappe moulding is incorporated on the joint face of this substrate, and is buried and covered this coil and iron core,, can significantly be shortened man-hour, improved production efficient to penetrate the operation that encapsulation replaces the encapsulating encapsulation.
[description of drawings]
Fig. 1 is a three-dimensional exploded view, and the antenna element aspect that generally is used on the electronic product is described.
Fig. 2 is a cutaway view, the thin bilge construction of the antenna element of aid illustration Fig. 1.
Fig. 3 is a block flow diagram, illustrates that the present invention is used for the processing procedure of the antenna on the electronic product.
Fig. 4 is a part of three-dimensional exploded view, and the step of setting of this preferred embodiment is described, the aspect that this substrate combines with first, second and third metalwork.
Fig. 5 is a part of vertical view, and the positioning step of this preferred embodiment is described, this colloid is coated the aspect on this substrate.
Fig. 6 is that a part is surveyed view, and the welding step of this preferred embodiment is described, the aspect that this first and second weldering end welds this first and second weld part respectively.
Fig. 7 is a cutaway view, illustrates that this preferred embodiment finishes the aspect of product.
Fig. 8 is a stereogram, illustrate this preferred embodiment the product of finishing substrate away from face.
Fig. 9 is a vertical view, and the encapsulation step of this preferred embodiment is described, is placed with a plurality of substrates and the aspect of moulding.
[embodiment]
Below by a preferred embodiment and accompanying drawing the processing procedure that the present invention is used for the antenna on the electronic product is elaborated.
Consult Fig. 3, the present invention is used for the preferred embodiment of the processing procedure of the antenna on the electronic product, and comprise one and set step 21, positioning step 22, welding step 23, a baking step 24, and an encapsulation step 25.
Consult Fig. 3,4,5, as shown in Figure 3 set step 21, purchased a substrate 3 earlier, this substrate 3 has a joint face 31, and one in contrast to this joint face 31 away from face 32, one first metalwork 41, second metalwork 42 and one the 3rd metalwork 43 are embedded on this substrate 3 at intervals.
Wherein, this substrate 3 separates and is provided with four and runs through this joint face 31 and embedding hole 33 away from face 32, and these substrate 3 peripheries are formed with a plurality of bellmouths 34, and this first metalwork 41, second metalwork 42 and the 3rd metalwork 43 are correspondingly to be placed through described embedding hole 33 and to be embedded on this substrate 3.
Therefore, when these first, two, three metalworks 41,42,43 when being embedded on this substrate 3 respectively, then this first metalwork 41 has first weld part 411 that is revealed in the joint face 31 of this substrate 3, and first contact site 412 that is connected in this first weld part 411 and is revealed in this substrate 3 away from face 32, this second metalwork 42 also has second weld part 421 that is revealed in the joint face 31 of this substrate 3, and second contact site 422 that is connected in this second weld part 421 and is revealed in this substrate 3 away from face 32, and the 3rd metalwork 43 has two portions that appear 431 that are revealed in the joint face 31 of this substrate 3, and the 3rd contact site 432 away from face 32 that is revealed in this substrate 3.
Consult Fig. 5,6, positioning step 22 as shown in Figure 3, be earlier a colloid 51 to be coated on the joint face 31 of this substrate 3, again an iron core 53 that is arranged with a coil 52 is touched and stick on this colloid 51, this iron core 53 is positioned on the joint face 31 of this substrate 3 with coil 52, wherein, this coil 52 has one first weldering end 521, and second weldering end 522 in contrast to this first weldering end 521, as for, the colloid 51 that present embodiment adopted is to be thick silica gel, in the preset range of this pedestal 3 as this colloid 51 must be coated on as shown in Figure 5, avoid being stained with other parts or the described embedding hole 33 that adhere to this pedestal 3, wherein, this substrate 3 also can be the aspect of a recess for the preset range of these colloid 51 coatings, so that this colloid 51 is fixed on this substrate 3, and provides the space of this coil 52 with iron core 53 fixed placement.
The continuous Fig. 6 that consults, welding step 23 as shown in Figure 3, be first weld part 411 that the first weldering end 521 of this coil 52 is welded in first metalwork 41 as shown in Figure 4, and the second weldering end 522 of this coil 52 be welded in second weld part 421 of second metalwork 42 as shown in Figure 4.
Consult Fig. 3,6, in this baking step 24, be that this substrate 3 that this coil 52 and this iron core 53 will be installed is positioned in the baking box (figure does not show), and to set its heating-up temperature be 60 ℃ Celsius (error range ± 10 ℃), continue heating after 30 minutes, make these colloid 51 bakings and solidify typing, and then strengthen the locating effect of this iron core 53, though present embodiment is the mode that adopts the oven heat baking, makes this colloid 51 solidify typing,, also can utilize the mode of natural air drying, make this colloid 51 solidify typing gradually, difference of them depends on the speed of operation, is not therefore limited to the present embodiment exposure.
Consult Fig. 7,8, encapsulation step 25 as shown in Figure 3, be that substrate 3 with the previous step gained is placed in the Jet forming machine (figure does not show), utilize the means of ejection formation to mold a nappe 6, and this nappe 6 is incorporated on the joint face 31 of this substrate 3, and together being buried, this coil 52 and this iron core 53 be overlying between this nappe 6 and the substrate 3, and then produce one and finish product, the product of finishing exposed face as shown in Figure 8 (be exactly this substrate 3 away from face 32), appear this first contact site 412 is arranged, second contact site 422 and the 3rd contact site 432, it is to touch mutually in order to the internal control circuit with electronic product (as mobile phone, figure does not show).
In addition, this encapsulation step 25 also can be utilized mould 7 as shown in Figure 9, and a plurality of substrate 3 rows are placed in one, and in the mode of batch processed, molds product as shown in Figure 8 in a large number.
According to above-mentioned design, the processing procedure that the present invention is used for the antenna on the electronic product is that this first, second and third metalwork 41,42,43 is embedded at this substrate 3, this iron core 53 that will be wound with coil 52 again is positioned on the joint face 31 of this substrate 3, and be coated with colloid 51 between the two, again these nappe 6 moulding are incorporated on this substrate 3 at last, its process to be to penetrate the operation that encapsulation replaces the encapsulating encapsulation, makes the simplification of overall operation flow process and significantly shortens man-hour, improves production efficient.
Moreover, because the shaped design of the 3rd metalwork 43, make as shown in Figure 5 this two appear the state that portion 431 has had electrical connection, replace two second operations that weld tabs 14 must additionally weld together again as shown in Figure 1, can effectively shorten the activity duration of production, and the product of the general processing procedure of shape is smooth outside this product, is convenient to be used in the real industry of pretending in surface.
In addition, by the colloid of coating on this substrate 3 51, effectively do not locate this iron core 53 only, also can in follow-up packaging operation, slow down this iron core 53 and shrink, can effectively reduce the risk of these iron core 53 fractures because of rapid colding and heat succeed each other causes excessive expansion, and, these substrate 3 formed bellmouths 34 make the plastics of this nappe 6 enter this bellmouth 34 in packaging operation, make this nappe 6 more not easily separated with these substrate 3 generation blockings.
And, can utilize mould 7 simultaneously a plurality of substrates 3 to be carried out operation with described nappe 6 connecting shapings as shown in Figure 9 in this encapsulation step 25, can effectively improve the output of product.
Conclude above-mentioned, the present invention is used for the processing procedure of the antenna on the electronic product, utilization is incorporated into these nappe 6 moulding on the joint face 31 of this substrate 3, and buried and covered this coil 52 and this iron core 53, can avoid as employing the plain grinding means and cause component abrasion and product defect, real effectively reduction work flow, improve the production quality and the efficient of its product, to penetrate the operation that encapsulation replaces the encapsulating encapsulation, can significantly shorten man-hour, improve production efficient, and, the product of the general processing procedure of shape is smooth outside this product, is convenient to be used in the real industry of pretending in surface, so can reach purpose of the present invention really.
Claims (6)
1. processing procedure that is used for the antenna on the electronic product is characterized in that:
This processing procedure comprises one and sets step, a positioning step, a welding step, and encapsulation step, this sets step is to have purchased a substrate earlier, this substrate has a joint face, and one in contrast to this joint face away from face, with one first metalwork, one second metalwork and one the 3rd metalwork are embedded on this substrate at intervals, make this first metalwork have first weld part that is revealed in the joint face of this substrate, and first contact site that is connected in this first weld part and is revealed in this substrate away from face, this second metalwork also has second weld part that is revealed in the joint face of this substrate, and second contact site that is connected in this second weld part and is revealed in this substrate away from face, and the 3rd metalwork has two portions that appear that are revealed in the joint face of this substrate, reach one and be connected in described the 3rd contact site that appears portion and be revealed in this substrate away from face, this positioning step is that an iron core that is arranged with a coil is positioned on the joint face of this substrate, wherein, this coil has one first weldering end, and second weldering end in contrast to this first weldering end, this welding step is first weld part that the first weldering end of this coil is welded in this first metalwork, and the second weldering end of this coil is welded in second weld part of this second metalwork, this encapsulation step is to utilize the moulding means with a nappe moulding and be incorporated on the joint face of this substrate, and then this coil and iron core together buried is overlying on wherein.
2. be used for the processing procedure of the antenna on the electronic product according to claim 1, it is characterized in that:
This is set in the step, be earlier this substrate is separated be provided with four run through this joint face with should be away from the embedding hole of face, then again with described first metalwork, second metalwork is corresponding with the 3rd metalwork is placed through described embedding hole, and then be embedded on this substrate.
3. as being used for the processing procedure of the antenna on the electronic product as described in the claim 2, it is characterized in that:
This is set in the step, is this substrate periphery is formed with a plurality of bellmouths.
4. be used for the processing procedure of the antenna on the electronic product according to claim 1, it is characterized in that:
In this positioning step, be that elder generation coats a colloid on the joint face of substrate, this iron core touched to stick on this colloid again, this iron core is positioned on the joint face of this substrate.
5. as being used for the processing procedure of the antenna on the electronic product as described in the claim 4, it is characterized in that:
This processing procedure that is used for the antenna on the electronic product also comprises a baking step after this welding step, and this baking step is that this colloid baking is added thermocoagulation.
6. as being used for the processing procedure of the antenna on the electronic product as described in the claim 5, it is characterized in that:
In this positioning step, the colloid of coating on the joint face of substrate is thick silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101094710A CN101604784A (en) | 2008-06-12 | 2008-06-12 | The processing procedure that is used for the antenna on the electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101094710A CN101604784A (en) | 2008-06-12 | 2008-06-12 | The processing procedure that is used for the antenna on the electronic product |
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| Publication Number | Publication Date |
|---|---|
| CN101604784A true CN101604784A (en) | 2009-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101094710A Pending CN101604784A (en) | 2008-06-12 | 2008-06-12 | The processing procedure that is used for the antenna on the electronic product |
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| CN (1) | CN101604784A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157776A (en) * | 2011-03-02 | 2011-08-17 | 上海交通大学 | Data card low-SAR (Specific Absorption Rate) value antenna for notebook computer |
| CN103187612A (en) * | 2011-12-28 | 2013-07-03 | 汉王科技股份有限公司 | Method for fabricating antenna board, antenna board and electromagnetic input board |
| CN109286062A (en) * | 2017-07-19 | 2019-01-29 | 深圳市裕展精密科技有限公司 | Antenna structure and its manufacturing method |
-
2008
- 2008-06-12 CN CNA2008101094710A patent/CN101604784A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157776A (en) * | 2011-03-02 | 2011-08-17 | 上海交通大学 | Data card low-SAR (Specific Absorption Rate) value antenna for notebook computer |
| CN102157776B (en) * | 2011-03-02 | 2014-08-27 | 上海交通大学 | Data card low-SAR (Specific Absorption Rate) value antenna for notebook computer |
| CN103187612A (en) * | 2011-12-28 | 2013-07-03 | 汉王科技股份有限公司 | Method for fabricating antenna board, antenna board and electromagnetic input board |
| CN103187612B (en) * | 2011-12-28 | 2016-03-02 | 汉王科技股份有限公司 | Make the method for antenna plate, antenna plate and electromagnetism tablet |
| CN109286062A (en) * | 2017-07-19 | 2019-01-29 | 深圳市裕展精密科技有限公司 | Antenna structure and its manufacturing method |
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Open date: 20091216 |