CN101596771A - The manufacture method of electronic machine case and electronic machine case - Google Patents
The manufacture method of electronic machine case and electronic machine case Download PDFInfo
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- CN101596771A CN101596771A CNA2009101382816A CN200910138281A CN101596771A CN 101596771 A CN101596771 A CN 101596771A CN A2009101382816 A CNA2009101382816 A CN A2009101382816A CN 200910138281 A CN200910138281 A CN 200910138281A CN 101596771 A CN101596771 A CN 101596771A
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Abstract
The invention provides a kind of manufacture method and electronic machine case of electronic machine case, it not only can guarantee resin resin flow when one-body molded on metallic plate, and can prevent the warpage of the cabinet that takes place after the moulding.Method of the present invention is, metallic plate (40) is arranged in the metal die (60a, 60b), resin (50) is expelled in the metal die (60a, 60b), thereby metallic plate (40) at least the one side on the whole resin (50) is shaped to one, wherein, make and contain the fibrous filler that forms by silicate glass in the resin (50).At this moment, adjust the amount of silica contained in the filler, with the molding shrinkage S of resin (50)
RBe set at shrinkage factor S less than the metallic plate in one-body molded (40)
M
Description
Technical field
The present invention relates to manufacture method and electronic machine case with the one-body molded electronic machine case on metallic plate of resin.
Background technology
As this e-machine, known have a notebook computer.Laptop (below, abbreviate " notebook PC " as) possesses main body cabinet and lid and constitutes.The main body cabinet is the casing that accommodates the component parts of computer, and its upper surface is provided with keyboard.Lid is to possess display unit such as LCD on the face relative with the upper surface of main body cabinet.
As aforementioned body cabinet and lid, in the past, all the time all by the resin monomer moulding is obtained, but in recent years, to metallic plate and the one-body molded cabinet that obtains of resin being carried out various researchs (for example, with reference to patent documentation 1) by in-molded grade.This cabinet is, by metallic plate is configured in the metal die, with resin injection in metal die, make the integrated and product that obtains of metallic plate and resin, compare with the cabinet that forms by resin monomer that obtains with the same thickness moulding, intensity is improved, therefore can realize further slimming, the lightweight of cabinet.
Patent documentation 1: TOHKEMY 2003-170531 communique
Summary of the invention
But usually, the coefficient of thermal expansion of resin is greater than the coefficient of thermal expansion of metal.Therefore, with resin injection in being arranged at metal die metallic plate and with metallic plate and resin when one-body molded because the coefficient of thermal expansion of metal and resin is different, cabinet generation warpage.Therefore, in patent documentation 1, contain fillers such as glass fibre, be adjusted into the coefficient of thermal expansion of metal the coefficient of thermal expansion of resin basic identical by making resin.
But the filler in the resin is many more, the resin flow reduction during injection moulding, and mouldability worsens, and therefore has the problem that is difficult to the resin portion branch is shaped to thin-walled.
The present invention In view of the foregoing obtains, purpose is, provide a kind of and not only can guarantee, and can prevent the manufacture method and the electronic machine case of electronic machine case of the warpage of the cabinet that takes place after the moulding the one-body molded resin flow on metallic plate time of resin.
To achieve these goals, the invention provides the manufacture method of electronic machine case, be that metallic plate is arranged in the metal die, resin injection is arrived in the described metal die, thereby described metallic plate at least the one side be the method for one on the whole with resin forming, it is characterized in that, described resin contains the fibrous filler that is formed by silicate glass, by adjusting the content of the silica in the described filler, the molding shrinkage of described resin is set at shrinkage factor S less than the described metallic plate in one-body molded
M
Here, the molding shrinkage S of so-called described resin
RFor, the metal die size is being set at L
R0, the size of the resin when returning to room temperature after the moulding is set at L
R1The time, with S
R=(L
R0-L
R1)/L
R0Represent.In addition, when shrinking owing to variations in temperature, above-mentioned molding shrinkage S
R, use the coefficient of thermal expansion α of this resin
R, with S
R=(the temperature variation Δ t of the resin during moulding
R) * α
RRepresent.The shrinkage factor S of the metallic plate in addition, one-body molded
MFor, will be owing to the injection of resin the rise size of the metallic plate when maximum of the temperature of metallic plate be set at L
M0, the size of the metallic plate when returning to room temperature after the moulding is set at L
M1The time, with S
M=(L
M0-L
M1)/L
M0Represent.In addition, when shrinking owing to variations in temperature, above-mentioned shrinkage factor S
M, use the coefficient of thermal expansion α of this metallic plate
M, with S
M=(the temperature variation Δ t of the metal during moulding
M) * α
MRepresent.
In addition, according to optimal way of the present invention, preferably the content with the silica in the described filler is adjusted into 60 quality %～100 quality %, makes the described filler that contains 25 quality %～50 quality % in the described resin.
In addition, according to optimal way of the present invention, preferably the molding shrinkage with described resin is set at littler by 0.5/1000～1.0/1000 than the shrinkage factor of the described metallic plate in one-body molded.
In addition, the present invention is, by metallic plate is arranged in the metal die, with resin injection in the described metal die, thereby the one side at least of described metallic plate be the electronic machine case of one with resin forming on the whole, it is characterized in that, described resin contains the fibrous filler that is formed by silicate glass, described filler is, by adjusting the content of silica, the molding shrinkage of described resin is set at shrinkage factor less than the described metallic plate in one-body molded.
In addition, according to optimal way of the present invention, preferred described resin is the resin that contains filler 25 quality %～50 quality %, and the content of the silica in the described filler is adjusted into 60 quality %～100 quality %.
In addition, according to optimal way of the present invention, preferred described resin is that molding shrinkage is set at the resin than the shrinkage factor little 0.5/1000～1.0/1000 of the described metallic plate in one-body molded.
In addition, according to optimal way of the present invention, the thickness of the periphery of described metallic plate preferably with towards end face gradually attenuation mode and form.
In addition, according to optimal way of the present invention, be preferably applied to the lid of laptop.
Manufacture method and electronic machine case according to electronic machine case of the present invention, by the content of the silica in the filler contained in the resin is adjusted, reduce the coefficient of thermal expansion of filler self, by making the molding shrinkage of resin be set at shrinkage factor less than the described metallic plate in one-body molded, thereby not only can guarantee resin resin flow when one-body molded on metallic plate, and can prevent the warpage of the cabinet that takes place after the moulding.
Description of drawings
Fig. 1 is the brief strabismus map of the notebook PC of expression embodiments of the present invention.
Fig. 2 is that the lid from notebook PC shown in Figure 1 takes off display unit, makes the general view of the lid under the state that exposes between the space empty of holding display unit.
Fig. 3 is the cross-sectional view of lid shown in Figure 2.
Fig. 4 is the cross-sectional view of lid shown in Figure 2.
Fig. 5 is the figure of an example of the forming method of expression lid.
Symbol description
1 laptop
10 main body cabinets
The upper surface of 11 main body cabinets
12 keyboards
13 key pieces
14 put wrist (palm rest) zone
15 articulated sections
20 lids
The base end part of 21 lids
22 antenna installing space spaces
23 covering portions
24a, 24b, 24c, 24d side wall portion
25 display unit spatial accommodation spaces
26 (covering portion) surface
27 (covering portion) back side
28 covering portion peripheries
30 display unit
40 metallic plates
41 faces in the face of display unit spatial accommodation space
42 resin inlets
43 slits
44 end faces
45 peripheries
46 shoulder holes
50 resins
60a, 60b metal die
61 streams
62 cast gates
The C die cavity
The specific embodiment
Below, with reference to accompanying drawing, the suitable embodiment when electronic machine case of the present invention being applied to the lid of laptop is elaborated.
Fig. 1 is the oblique view of the laptop 1 (being designated hereinafter simply as " notebook PC1 ") of expression embodiments of the present invention.Here, illustrative computer PC1 possesses main body cabinet 10 and lid 20.
Fig. 2 takes off display unit 30 from lid shown in Figure 1 20, makes the general view of the lid 20 under the state that the space that holds display unit 30 exposes.In addition, Fig. 3 and Fig. 4 are the cross-sectional views of the described lid 20 of Fig. 2.Lid 20 is by the side wall portion 24a～24d formation that becomes with the big much at one ninor feature of upper surface 11 of main body cabinet 10, see rectangular covering portion 23 and form as one with this covering portion 23 from the plane.As mentioned above, the space that is surrounded by covering portion 23 and side wall portion 24a～24d becomes the spatial accommodation 25 (below, abbreviate " display unit spatial accommodation 25 " as) of display unit 30.
As shown in Figure 3, the side wall portion of lid 20 24a～24d resin 50 monomer moulding.On the other hand, the covering portion 23 of lid 20 is disposed at the mode that surperficial 26 sides, metallic plate 40 are disposed at the back side 27 sides with resin 50, and metallic plate 40 and resin 50 are shaped to one.
In the display unit spatial accommodation 25, the end (during lid 20 closed conditions be positioned at the end of nearly body side) relative with the base end part 21 of lid 20 becomes the antenna installing space 22 that wireless communication is used.Therefore, as shown in Figure 2, the shape that the part that metallic plate 40 forms antenna installing space 22 is cut off, this antenna installing space 22 is made of resin 50.
As shown in Figure 2, be formed with a plurality of through holes 42 and a plurality of slit 43 every the interval of regulation in the metallic plate 40.A plurality of through holes 42 are the inlets that are used for the resin 50 of molten condition is expelled to (with reference to Fig. 5) in the die cavity C when injection mo(u)lding.In the following description, this through hole 42 is called resin inlet 42.In addition, slit 43 is the exhaust outlets of discharging the gas that is produced by resin 50 when injection mo(u)lding.The shape of this exhaust outlet is not limited to slit shown in Figure 2, also can be circular.
In addition, as shown in Figure 3, the thickness of the periphery 45 of metallic plate 40, with towards end face 44 gradually attenuation mode and form.Form the reasons are as follows of said structure.In the covering portion 23,, different with the thickness of the resin 50 of metallic plate 40 and the resin 50 one-body molded parts that obtain by the thickness (thickness of the resin 50 of covering portion periphery 28) of the resin 50 of the part of resin 50 monomer moulding.Therefore, the amount of shrinking during owing to moulding has nothing in common with each other, and therefore " contraction " of resin take place, and produces difference of height on the surface 26 of covering portion 23.Therefore, by with towards end face 44 gradually the mode of attenuation form the thickness of the periphery 45 of metallic plate 40, then can reduce the difference of height on the surface 26 of covering portion 23, improve flatness.The thickness that makes end face 44 places of metallic plate 40 is about 40～60% of the thickness of the central authorities of metallic plate 40 near.In addition, preferably as illustrated in fig. 3, making the length on inclined plane of the periphery 45 of metallic plate 40 is more than 3 times of thickness at end face 44 places of metallic plate 40.
As the material of metallic plate 40, can use magnesium calendering plate (AZ31, AM60 etc.), magnesium die casting (AZ91 etc.), aluminium calendering plate (A5052, A2024, A6062 etc.), aluminium diecasting (ADC10, ADC12 etc.) etc. with above-mentioned formation.In addition, near the thickness of metallic plate 40 (central authorities) is about 0.4mm～1.0mm.
The lid 20 of structure can be made by in-molded (inner (inside) moulding) as mentioned above.Here, in-molded is a kind of of injection mo(u)lding, is that metallic plate is arranged in the metal die, with resin injection mo(u)lding in this metal die, thereby makes both integrated methods.
When one-body molded, the difference of the coefficient of thermal expansion of metallic plate 40 and resin 50 is a problem very much with metallic plate 40 and resin 50.That is, since usually the coefficient of thermal expansion of resin greater than the coefficient of thermal expansion of metal, when the coefficient of thermal expansion of therefore not adjusting resin 50 just carries out moulding, because the coefficient of thermal expansion α of metallic plate 40
MCoefficient of thermal expansion α with resin 50
RDifference, so the lid after the moulding 20 produces recessed song.
Therefore, in the present embodiment, for the coefficient of thermal expansion α that reduces resin 50
RPurpose, make and contain the fibrous filler that forms by silicate glass in the resin 50.The fibrous filler that is formed by silicate glass (do not have diagram, be designated hereinafter simply as " filler ") is with silica (SiO
2) be principal component, remaining composition is the material that is formed by sodium (Na), calcium (Ca), boron (B) and their oxide etc.Because the coefficient of thermal expansion of silica is 0,, can reduce the coefficient of thermal expansion α of resin 50 therefore by making the filler that contains silica in the resin 50
RIn addition, fibrous filler is compared with the spherical filler of other shapes that waits, the effect excellence of the power that the resin 50 the when resin 50 after the inhibition moulding cools off shrinks.
The amount of the filler that resin 50 contains is many more, the coefficient of thermal expansion α of resin 50
RMore little, if but the content of the filler in the resin 50 surpasses a certain amount of (about 40%), then resin 50 mobile reductions, and mouldability worsens.Therefore, the limit of the amount of the contained filler of resin 50 is 40 quality %～50 quality %.Therefore, in the present embodiment,, reduce the coefficient of thermal expansion of filler self, can not increase the content of the filler in the resin 50, and reduce the coefficient of thermal expansion α of resin 50 by improving the content of the contained silica of filler
R
Here, method as the content that improves the silica in the filler, the method of considering is: implement to reduce the processing that the network modification thing composition (above-mentioned sodium, calcium, boron etc.) in the glass that forms filler improves dioxide-containing silica, perhaps, use the high filler of purity of the such silica of quartz glass.
Usually, the temperature variation of the resin during injection mo(u)lding is greater than the temperature variation of metal.For example so that the resin temperature of the molten condition during injection mo(u)lding is about 280 ℃, the temperature of metal die be about 120 ℃ for example describes, be arranged at metal in the metal die rises to metal die along with the time temperature.The moment that the resin of fusion is injected into, metal obtains heat from resin, about 50 ℃ the temperature of rising, and resin temperature sharply descends, and therefore can not rise its above temperature.So, the temperature variation Δ t of metal 40
MFor, about 25 ℃=145 ℃ of (50 ℃ of 120 ℃+rising parts of metal die temperature)-room temperatures, the temperature variation Δ t of resin 50
RFor, about 25 ℃=255 ℃ of 280 ℃-room temperatures.
Therefore, even if make the coefficient of thermal expansion α of resin 50
RCoefficient of thermal expansion α with metallic plate 40
MUnanimity is because the molding shrinkage S of resin 50
RWith one-body molded in the shrinkage factor S of metallic plate 40
MDifference, so the amount of contraction of resin 50 is big, after the moulding, warpage takes place in lid 20 easily.Here, the molding shrinkage S of resin 50
R, by metal die is being set at L
R0, the size of the resin when returning to room temperature after the moulding is set at L
R1The time, with S
R=(L
R0-L
R1)/L
R0Represent.In addition, when shrinking owing to variations in temperature, above-mentioned molding shrinkage S
R, use the coefficient of thermal expansion α of this resin
R, with S
R=(the temperature variation Δ t of the resin during moulding
R) * α
RRepresent.The shrinkage factor S of the metallic plate in addition, one-body molded
M, by will be owing to the injection of resin the size of metallic plate during maximum rising of temperature of metallic plate be set at L
M0, the size of the metallic plate when returning to room temperature after the moulding is set at L
M1The time, with S
M=(L
M0-L
M1)/L
M0Represent.In addition, when shrinking owing to variations in temperature, above-mentioned molding shrinkage S
M, use the coefficient of thermal expansion α of this metallic plate
M, with S
M=(the temperature variation Δ t of the metal during moulding
M) * α
MRepresent.
Discoveries such as the inventor are with the molding shrinkage S of resin 50
RBe set at shrinkage factor S than the described metallic plate in one-body molded
MLittle by 0.5/1000～1.0/1000 o'clock can suppress the warpage of the lid 20 after the moulding.Therefore, with the coefficient of thermal expansion α of resin 50
RBe set at the coefficient of thermal expansion α of metallic plate 40
MAbout 32%～45%.
The content of the silica in the common glass fibre is about 40 quality %～50 quality %, in order to make the coefficient of thermal expansion α of resin 50 as described above
RCoefficient of thermal expansion α for metallic plate 40
MAbout 32%～45%, the content of the silica in the filler is adjusted.Specifically, in the situation of the combination of above-mentioned metallic plate of enumerating 40 and resin 50, the content of the silica in the filler is adjusted into 60 quality %～100 quality %, makes the adjusted filler that in resin 50, contains 25 quality %～50 quality %, thus can be with the coefficient of thermal expansion α of resin 50
RBe set at the coefficient of thermal expansion α of metallic plate 40
MAbout 32%～45%.
Here, enumerate the shrinkage factor shrinkage S of the metallic plate 40 in one-body molded
MShrinkage factor S with resin 50
RAn example.As metallic plate 40, when using the above-mentioned magnesium plate of enumerating, the coefficient of thermal expansion α of these metals
MBe about 16 * 10
-6/ ℃.Temperature variation Δ t when making the moulding of metallic plate 40
MWhen being 145 ℃, the above-mentioned shrinkage factor S of metallic plate 40
MBe 2.32/1000.By containing above-mentioned filler, make the coefficient of thermal expansion α of resin 50
RBe set at the coefficient of thermal expansion α of metallic plate 40
M32%～45%.Therefore, at this moment, the coefficient of thermal expansion α of resin 50
RBe 6 * 10
-6/ ℃.Make the temperature variation Δ t of resin 50
RWhen being 255 ℃, the molding shrinkage S of resin 50
MBe 1.53/1000.Thereby, the above-mentioned shrinkage factor S of metallic plate 40
MMolding shrinkage S with resin 50
RDifference in 0.5/1000～1.0/1000 scope.
Then, with reference to Fig. 5, an example of the forming method of lid 20 is described.At first, in advance at the bonding agent (not having diagram) of the surperficial coated heat fusion of metallic plate 40.At this moment, by with the surface of metallic plate 40 moderately asperitiesization increase surface area, thereby can increase the dhering strength with resin 50.Then, metallic plate 40 is arranged in the metal die 60b, carries out matched moulds, form die cavity C by metal die 60a.The temperature of metal die 60a, 60b is about about 120 ℃.A plurality of cast gates 62 among metal die 60b break-through respectively are formed at a plurality of resin inlets 42 on the metallic plate 40.Then, by being formed at stream 61 and the cast gate 62 among the metal die 60b, the resin 50 of molten condition is expelled in the die cavity C.The temperature of the resin 50 of molten condition is about 280 ℃.Since the heat of the resin 50 of this molten condition, the bonding agent fusion on metallic plate 40 surfaces, and metallic plate 40 and resin 50 are firmly bonded.Afterwards, make resin 50 coolings in the die cavity C, solidify, form lid 20 after, open mould, cut off the resin 50 of cast gate 62 parts, from die cavity C, take out the lid 20 of moulding.
As mentioned above, in the present embodiment, because with the molding shrinkage S of resin 50
RBe set at shrinkage factor S than the described metallic plate in one-body molded
MLittle by about 0.5/1000～1.0/1000, so the warpage of the lid 20 by above-mentioned forming step moulding is suppressed in Min..In addition, because increased the content of the contained silica of filler, reduced the coefficient of thermal expansion of filler self, so the content of the filler in the resin 50 is seldom just passable.Therefore, the flowability of the resin 50 during injection mo(u)lding is also guaranteed.
In addition, in the above-mentioned forming method, on metallic plate 40, form resin inlet 42, resin 50 is provided with side injection in die cavity C from metallic plate 40.Therefore, the section (gate vestiges) of the resin of cast gate 62 parts remains in the back side 27 sides of lid 20, and surperficial 26 sides can not produce gate vestiges.So, and compare from metal die 60a side injection resin 50, not only can improve the flatness on surface 26, and the modification of carrying out the surface 26 of lid 20 is easily handled.
In the above-mentioned forming method, by surperficial coating adhesive at metallic plate 40, when injection moulding, make the bonding agent fusion, come bonded metal plate 40 and resin 50, in addition, also can be as illustrated in fig. 4, form shoulder hole 46 by prior many places at metallic plate 40, during injection moulding, resin 50 is injected in these shoulder holes 46, thus also can bonded metal plate 40 and resin 50.Shoulder hole 46 owing to form big diameter in face 41 sides of metallic plate 40, therefore injects the resin 50 of shoulder hole 46 and can bring into play anchoring effect, can further improve the dhering strength of metallic plate 40 and resin 50.
As above-mentioned explanation, the manufacture method of the electronic machine case in the present embodiment and electronic machine case, by adjusting the content of the silica in the filler that contains in the resin, reduce the coefficient of thermal expansion of filler self, thereby the molding shrinkage of resin is set at molding shrinkage less than metal.Specifically, be adjusted into 60 quality %～100 quality %, make the adjusted filler that in resin, contains 25 quality %～50 quality % by content with the silica in the filler, thus can be with the molding shrinkage S of resin 50
RBe set at shrinkage factor S less than metallic plate 40
M0.5/1000～1.0/1000.As a result, the flowability of the resin 50 when resin 50 is shaped in metallic plate 40 not only can be guaranteed, and the warpage of the cabinet (lid 20) that produces after the moulding can be prevented.
In addition, utilize the electronic machine case of present embodiment, the thickness of the periphery 45 by making described metallic plate 40 with towards end face 44 gradually the mode of attenuation form, can prevent the contraction of resin 50, make the surface 26 of cabinet (lid 20) smoothly.
In addition, be applied to the lid 20 of notebook PC1, can realize further slimming, the lightweight of notebook PC1 by electronic machine case with present embodiment.
In the above-mentioned embodiment, the example that the electronic machine case of present embodiment is applied to the lid 20 of notebook PC1 has been described, but has the invention is not restricted to this, also can be applied to the main body cabinet 10 of notebook PC1 or other e-machine.
Claims (8)
1. the manufacture method of electronic machine case, it is, metallic plate is arranged in the metal die, resin injection is arrived in the described metal die, thereby described metallic plate at least the one side be the method for one with resin forming on the whole, it is characterized in that described resin contains the fibrous filler that is formed by silicate glass, by adjusting the content of the silica in the described filler, the molding shrinkage of described resin is set at shrinkage factor less than the described metallic plate in one-body molded.
2. according to the manufacture method of the electronic machine case of claim 1 record, it is characterized in that, the content of the silica in the described filler is adjusted into 60 quality %～100 quality %, make the described filler that contains 25 quality %～50 quality % in the described resin.
3. according to the manufacture method of electronic machine cases of claim 1 or 2 records, it is characterized in that, be set at the molding shrinkage of described resin littler by 0.5/1000～1.0/1000 than the shrinkage factor of the described metallic plate in one-body molded.
4. electronic machine case, it is, by metallic plate is arranged in the metal die, with resin injection in the described metal die, thereby the one side at least of described metallic plate be the electronic machine case of one with resin forming on the whole, it is characterized in that, described resin contains the fibrous filler that is formed by silicate glass, described filler is, by adjusting the content of silica, the molding shrinkage of described resin is set at shrinkage factor less than the described metallic plate in one-body molded.
5. according to the electronic machine case of claim 4 record, it is characterized in that described resin contains the described filler of filler 25 quality %～50 quality %, the content of the silica in the described filler is adjusted into 60 quality %～100 quality %.
6. according to the electronic machine case of claim 4 or 5 records, it is characterized in that described resin is that molding shrinkage is set at the resin than the shrinkage factor little 0.5/1000～1.0/1000 of the described metallic plate in one-body molded.
7. according to the electronic machine case of each record of claim 4～6, it is characterized in that, with towards end face gradually the mode of attenuation form the thickness of the periphery of described metallic plate.
8. according to the electronic machine case of each record of claim 4～7, it is characterized in that, be applied to the lid of notebook computer.
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|---|---|---|---|
| JP2008-141259 | 2008-05-29 | ||
| JP2008141259A JP4555874B2 (en) | 2008-05-29 | 2008-05-29 | Manufacturing method of electronic device casing and electronic device casing |
| JP2008141259 | 2008-05-29 |
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|---|---|
| CN101596771A true CN101596771A (en) | 2009-12-09 |
| CN101596771B CN101596771B (en) | 2014-12-03 |
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Cited By (3)
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| CN104421136A (en) * | 2013-08-23 | 2015-03-18 | 株式会社丰田自动织机 | Motor-driven compressor |
| CN105835303A (en) * | 2014-12-12 | 2016-08-10 | 罗伯特·博世有限公司 | Method for establishing sealing connection between metal member and plastic package by means of intermediate layer |
| CN111605132A (en) * | 2020-06-23 | 2020-09-01 | 广东美的厨房电器制造有限公司 | Manufacturing method of appearance piece and appearance piece |
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| JP2010000718A (en) * | 2008-06-20 | 2010-01-07 | Toho Kogyo Kk | Insert-molded component and its manufacturing method |
| JP5255577B2 (en) * | 2010-01-13 | 2013-08-07 | 古河電気工業株式会社 | Substrate and substrate manufacturing method |
| TW201313484A (en) * | 2011-09-27 | 2013-04-01 | Ichia Tech Inc | Metal housing with plastic member of composite parts |
| CN102615772B (en) * | 2012-03-31 | 2014-10-15 | 上海琥达投资发展有限公司 | Kunlun spar composite material product with insert on surface and preparation method |
| JP6941285B2 (en) * | 2018-05-24 | 2021-09-29 | 日産自動車株式会社 | A method for molding a part using a resin-metal composite, and a mold for molding the part. |
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| JP4166127B2 (en) * | 2003-08-07 | 2008-10-15 | 大成プラス株式会社 | Aluminum alloy composite product and manufacturing method thereof |
| JP4270444B2 (en) * | 2003-10-14 | 2009-06-03 | 大成プラス株式会社 | Aluminum alloy / resin composite and method for producing the same |
| JP2005179631A (en) * | 2003-11-28 | 2005-07-07 | Aisin Seiki Co Ltd | Composite material and production method therefor |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104421136A (en) * | 2013-08-23 | 2015-03-18 | 株式会社丰田自动织机 | Motor-driven compressor |
| CN104421136B (en) * | 2013-08-23 | 2017-01-18 | 株式会社丰田自动织机 | Motor-driven compressor |
| CN105835303A (en) * | 2014-12-12 | 2016-08-10 | 罗伯特·博世有限公司 | Method for establishing sealing connection between metal member and plastic package by means of intermediate layer |
| CN111605132A (en) * | 2020-06-23 | 2020-09-01 | 广东美的厨房电器制造有限公司 | Manufacturing method of appearance piece and appearance piece |
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| Publication number | Publication date |
|---|---|
| JP4555874B2 (en) | 2010-10-06 |
| JP2009285991A (en) | 2009-12-10 |
| CN101596771B (en) | 2014-12-03 |
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