CN101593671B - Welding line machine, welding line method and workbench thereof - Google Patents
Welding line machine, welding line method and workbench thereof Download PDFInfo
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- CN101593671B CN101593671B CN2009101082402A CN200910108240A CN101593671B CN 101593671 B CN101593671 B CN 101593671B CN 2009101082402 A CN2009101082402 A CN 2009101082402A CN 200910108240 A CN200910108240 A CN 200910108240A CN 101593671 B CN101593671 B CN 101593671B
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Abstract
The invention discloses a welding line machine, a welding line method and a workbench thereof. The welding line machine comprises a welding head, a heating plate, a front clip, a rear clip, a front guide rail, a rear guide rail and a control system, wherein the front clip and the rear clip are positioned on both sides of the heating plate respectively, and clamp and position a front lead frame between the front clip and the heating plate, and a rear lead frame between the rear clip and the heating plate respectively; the front guide rail and the rear guide rail are positioned below the front lead frame between the front clip and the heating plate, and the rear lead frame between the rear clip and the heating plate respectively; the front lead frame and the rear lead frame are arranged on the front guide rail and the rear guide rail in a sliding way respectively; and the control system alternately controls the front clip and the rear clip to position and clamp the front lead frame and to clamp the rear lead frame, and also controls the welding head to alternately carry out continuous welding line on the positioned and clamped front lead frame and rear lead frame. The welding linemachine, the welding line method and the workbench thereof can make the welding head continuously carry out welding line so as to improve the production efficiency.
Description
Technical field
The present invention relates to welding equipment, particularly relate to bonding equipment, bonding wire method and workbench thereof.
Background technology
Ultrasonic wave bonding wire machine is a kind of inner leading bonding device of semiconductor device, and it not only is suitable for universities and colleges, scientific research institutions use under study for action, and also is used widely in the production of semiconductor device.
Consult Fig. 1, at present, big, the higher manual ultrasonic wave aluminum steel bonding machine of complete machine height of commonly a kind of volume on the market.Described bonding machine comprises that mainly driving mechanism 120 ' up and down that frame 100 ', soldering tip 140 ', cabinet 110 ', control soldering tip 140 ' move up and down, carrying are by the workbench 170 ' and the horizontal drive mechanism 150 ' of weldering product.Described soldering tip 140 ' is made up of ultrasonic transducer, welding chopper and servicing unit.Described workbench 170 ' is provided with anchor clamps 160 ', and anchor clamps 160 ' are clamped lead frame 180 ' and are beneficial to soldering tip 140 ' it is welded.
During work, anchor clamps 160 ' clamp lead frame 180 ' and it is positioned, thereby allow soldering tip 140 ' that metal wire is welded on the lead frame 180 '.Welded this lead frame 180 ', the action of soldering tip 140 ' of need stopping, so that change the action of next lead frame, and next lead frame also needs to clamp and locate, and welds again.So welding-pause-welding constantly circulates, lead frame is welded one by one finish.
The above-mentioned step that allows soldering tip pause with the restringing frame quite expends time in, and influences the speed of whole bonding wire flow process, thereby influence speed of production, thereby lack economic and practical, and reality has the necessity that is further improved.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of bonding equipment, bonding wire method and workbench thereof, can allow soldering tip ceaselessly carry out bonding wire continuously, enhances productivity.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of bonding equipment is provided, comprise soldering tip, heating board, fore-clamp, the back folder, fromer rail, rear rail and control system, described fore-clamp and back folder lay respectively at described heating board both sides, described fore-clamp clamps and the preceding lead frame of location between fore-clamp and heating board, described back folder clamps and the back lead frame of location between back folder and heating board, described fromer rail is below the preceding lead frame between fore-clamp and the heating board, described rear rail is below the back lead frame between back folder and the heating board, lead frame and back lead frame slide respectively and place on described fromer rail and the rear rail before described, lead frame and back lead frame before described control system is alternately controlled described fore-clamp and back folder and located respectively and clamp are also controlled preceding lead frame and the back lead frame that described soldering tip alternately clamps described location and are carried out continuous bonding wire.
Wherein, comprising: along the preceding importing module of fromer rail setting with leadingly go out module, lay respectively at described fore-clamp two ends, and connect described control system; Derive module along back importing module and back that rear rail is provided with, lay respectively at folder two ends, described back, and connect described control system.
Wherein, comprise: have the guiding wall between described fromer rail and the rear rail, import module before described, leadingly go out module, back and import module and back and derive module and respectively comprise contact roller, described contact roller is pressed on lead frame before described or back lead frame on the described guiding wall, and preceding lead frame is ordered about in rolling or back lead frame slides on fromer rail or rear rail.
Wherein, comprise: described control system is also controlled and is imported module before described, leadingly goes out module, the back imports module and module is derived in the back, described control system control fore-clamp, back folder, soldering tip, preceding importing module, leadingly goes out module, back and imports module and back to derive the order of module as follows: control described before the importing module preceding lead frame is transported between fore-clamp and the heating board through fromer rail; Controlling described fore-clamp positions and clamps preceding lead frame; Control described soldering tip preceding lead frame carried out bonding wire, control simultaneously that described back imports that module press from both sides back lead frame through rear rail is transported to after and heating board between, control described afterwards the folder back lead frame positioned and clamps; After preceding lead frame bonding wire is intact, the control soldering tip moves to the back lead frame position back lead frame is carried out bonding wire, control simultaneously leadingly to go out module preceding lead frame is derived, and repeat to control and import the running that module carries out the input of lead frame before next and location, clamping, bonding wire before described.
Wherein, comprising: the height adjustment mechanism of adjusting described fromer rail and rear rail height.
For solving the problems of the technologies described above, another technical solution used in the present invention is: a kind of bonding equipment workbench is provided, comprise heating board, fore-clamp, the back folder, fromer rail, rear rail and control device, described fore-clamp and back folder lay respectively at described heating board both sides, described fore-clamp clamps and the preceding lead frame of location between fore-clamp and heating board, described back folder clamps and the back lead frame of location between back folder and heating board, described fromer rail is below the preceding lead frame between fore-clamp and the heating board, described rear rail is below the back lead frame between back folder and the heating board, lead frame and back lead frame slide respectively and place on described fromer rail and the rear rail before described, and described fore-clamp alternately controlled by described control device and preceding lead frame and back lead frame are located and clamped to the back folder respectively.
For solving the problems of the technologies described above, another technical scheme that the present invention adopts is: a kind of bonding wire method is provided, adopt fore-clamp and back folder to lay respectively at the structure that operate preceding lead frame and back lead frame respectively the heating board both sides, comprise step: preceding lead frame is transported between fore-clamp and the heating board; Lead frame before described is positioned and clamps; Lead frame before described is carried out bonding wire, simultaneously back lead frame is transported between back folder and the heating board, and back lead frame is positioned and clamps; After preceding lead frame bonding wire is intact, continuously back lead frame is carried out bonding wire, simultaneously preceding lead frame is derived, and repeat the running of the input of lead frame before next and location, clamping, bonding wire.
The invention has the beneficial effects as follows: being different from the prior art bonding equipment needs to allow the soldering tip pause cause expending time in, influencing the situation of bonding wire speed with the restringing frame between welding different conductor frame, the present invention adopts fore-clamp and back folder to lay respectively at heating board both sides, the structure respectively preceding lead frame and back lead frame are operated, last lead frame is positioned and clamps and bonding wire, position and clamp between folder and the heating board after simultaneously back one lead frame being transported to; After last lead frame bonding wire was intact, soldering tip can carry out bonding wire to back one lead frame without a break continuously, and so circulation can significantly reduce the stand-by period, effectively enhances productivity, and saves cost.
Description of drawings
Fig. 1 is the schematic diagram of a kind of bonding equipment of prior art;
Fig. 2 is the schematic perspective view of bonding equipment of the present invention;
Fig. 3 is the schematic diagram of lead frame input before bonding equipment of the present invention carries out;
Fig. 4 is the schematic diagram that preceding lead frame arrives position of bonding wire among Fig. 3;
Fig. 5 is the schematic diagram of deriving after preceding lead frame bonding wire finishes among Fig. 3;
Fig. 6 is the flow chart of bonding wire method of the present invention.
The primary clustering symbol description:
30 leadingly go out module 40 backs and derive modules
50 heating boards, 60 back folders
70 backs import module lead frame after 80s
110 rear rails, 101 guiding walls
112 height adjustment mechanisms
Embodiment
Consult Fig. 2 together, bonding equipment of the present invention mainly comprises: soldering tip (figure does not show), heating board 50, fore-clamp 20, back folder 60, fromer rail 100, rear rail 110 and control system (figure does not show).Described heating board 50, fore-clamp 20, back folder 60, fromer rail 100, rear rail 110 etc. constitute the workbench of described bonding equipment.Soldering tip promptly is arranged at workbench top, can be at heating board 50, move with forward and backward folder 20,60 tops.
Described fore-clamp 20 and back folder 60 lay respectively at described heating board 50 both sides, and described fore-clamp 20 clamps and the preceding lead frame 90 of location between fore-clamp 20 and heating board 50, and described back folder 60 clamps and the back lead frame 80 of location between back folder 60 and heating board 50;
Described fromer rail 100 is below the preceding lead frame 90 between fore-clamp 20 and the heating board 50, described rear rail 110 is below the back lead frame 80 between back folder 60 and the heating board 50, and described preceding lead frame 90 and back lead frame 80 slide respectively and place on described fromer rail 100 and the rear rail 110;
During work, described control system is as follows to the control procedure of each element:
Lead frame 90 positions and clamps before controlling 20 pairs of described fore-clamps;
Control described soldering tip preceding lead frame 90 is carried out bonding wire, simultaneously back lead frame 80 is transported between back folder 60 and the heating board 50, control 60 pairs of back lead frames 80 of described back folder and position and clamp;
After preceding lead frame 90 bonding wires were intact, the control soldering tip moved to back lead frame 80 positions back lead frame 80 is carried out bonding wire, prepared next preceding lead frame 90 simultaneously.
Soldering tip can remain continuous operation in the said process.
Being different from the prior art bonding equipment needs to allow the soldering tip pause cause expending time in, influencing the situation of bonding wire speed with the restringing frame between welding different conductor frame, the present invention adopts fore-clamp 20 and back folder 60 to lay respectively at heating board 50 both sides, the structure respectively preceding lead frame 90 and back lead frame 80 are operated, last lead frame is positioned and clamps and bonding wire, position and clamp between folder 60 and the heating board 50 after simultaneously back one lead frame being transported to; After last lead frame bonding wire was intact, soldering tip can carry out bonding wire to back one lead frame without a break continuously, and so circulation can significantly reduce the stand-by period, effectively enhances productivity, and saves cost;
Again because forward and backward lead frame 80 positions are very approaching, therefore soldering tip almost can not need to carry out to move too greatly promptly can move between forward and backward lead frame 80 to carry out bonding wire, therefore can carry out the switching of forward and backward lead frame 80 bonding wires very soon, the volume of equipment can not increase substantially simultaneously, and structure is also comparatively simple.
Above-mentioned is the basic embodiment of the present invention, also consults Fig. 2, also comprises in specific embodiment:
The preceding importing module 10 that is provided with along fromer rail 100 and leadingly go out module 30 lays respectively at described fore-clamp 20 two ends, and connects described control system;
Before import module 10 and leadingly go out module 30, back and import module 70 and back and derive module 40 and can automatically lead frame be transported to forward and backward folder 20,60 and heating board 50 between, and after bonding wire finishes, lead frame is derived, realize that more convenient, automation efficiently replaces the bonding wire function, improves bonding wire speed greatly.
On concrete, can also comprise and have guiding wall 101 between described fromer rail 100 and the rear rail 110, import module 10 before described, leadingly go out module 30, back and import module 70 and back and derive module 40 and respectively comprise contact roller, described contact roller is pressed on lead frame 90 before described or back lead frame 80 on the described guiding wall 101, and preceding lead frame 90 is ordered about in rolling or back lead frame 80 slides on fromer rail 100 or rear rail 110.
Described control system control fore-clamp 20, back folder 60, soldering tip, preceding importing module 10, leadingly go out module 30, back and import module 70 and back to derive the order of module 40 as follows:
1) consults Fig. 3, control the described preceding module 10 that imports preceding lead frame 90 is transported between fore-clamp 20 and the heating board 50 through fromer rail 100;
2) consult Fig. 4, control 20 pairs of described fore-clamps before lead frame 90 position and clamp;
3) the described soldering tip of control carries out bonding wire to preceding lead frame 90, control simultaneously described back import module 70 with back lead frame 80 through rear rail 110 is transported to after, press from both sides 60 and heating board 50 between, control and press from both sides 60 pairs of back lead frames 80 after described and position and clamp;
4) after preceding lead frame 90 bonding wires are intact, the control soldering tip moves to back lead frame 80 positions back lead frame 80 is carried out bonding wire, consult Fig. 5, control simultaneously leadingly to go out module 30 preceding lead frame 90 is derived, and repeat to control and import the running that module 10 carries out the input of lead frame 90 before next and location, clamping, bonding wire before described.
For further facilitating the location of lead frame, can also comprise the height adjustment mechanism 112 of adjusting described fromer rail 100 and rear rail 110 height, position adjustment with convenient lead frame to different size, make the lead frame of the compatible all size of the present invention.
Also consult Fig. 2, the present invention also provides a kind of bonding equipment workbench, comprising:
Described fore-clamp 20 and back folder 60 lay respectively at described heating board 50 both sides, clamp and locate between fore-clamp 20 and the heating board 50 respectively, preceding lead frame 90 and back lead frame 80 between back folder 60 and the heating board 50;
Described fromer rail 100 is below the preceding lead frame 90 between fore-clamp 20 and the heating board 50, described rear rail 110 is below the back lead frame 80 between back folder 60 and the heating board 50, and described preceding lead frame 90 and back lead frame 80 slide respectively and place on described fromer rail 100 and the rear rail 110;
Described fore-clamp 20 alternately controlled by described control device and preceding lead frame 90 and back lead frame 80 are located and clamped to back folder 60 respectively.
As described above, workbench of the present invention can allow bonding equipment continuously back one lead frame be carried out bonding wire without a break, significantly reduces the stand-by period, effectively enhances productivity, and saves cost, and is simple in structure.
Above-mentioned workbench can also comprise:
The preceding importing module 10 that is provided with along fromer rail 100 and leadingly go out module 30 lays respectively at described fore-clamp 20 two ends;
And comprise having guiding wall 101 between described fromer rail 100 and the rear rail 110, import module 10 before described, leadingly go out module 30, back and import module 70 and back and derive module 40 and respectively comprise contact roller, described contact roller is pressed on lead frame 90 before described or back lead frame 80 on the described guiding wall 101, and preceding lead frame 90 is ordered about in rolling or back lead frame 80 slides on fromer rail 100 or rear rail 110.
Also comprise the height adjustment mechanism of adjusting described fromer rail 100 and rear rail 110 height.
The present invention also provides a kind of bonding wire method, adopts fore-clamp and back folder to lay respectively at the structure that operate preceding lead frame and back lead frame respectively the heating board both sides, comprises step:
Step 601: preceding lead frame is transported between fore-clamp and the heating board;
Step 602: lead frame before described is positioned and clamps;
Step 603: lead frame before described is carried out bonding wire, simultaneously back lead frame is transported between back folder and the heating board, and back lead frame is positioned and clamps;
Step 604: after preceding lead frame bonding wire is intact, continuously back lead frame is carried out bonding wire, simultaneously preceding lead frame is derived, and repeat the running of the input of lead frame before next and location, clamping, bonding wire.
It should be understood that the invention described above bonding wire method can adopt concrete bonding equipment as shown in Figure 2 to realize described method, also can adopt other bonding equipments to realize said method with same principle different structure.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. bonding equipment is characterized in that:
Comprise soldering tip, heating board, fore-clamp, back folder, fromer rail, rear rail and control system,
Described fore-clamp and back folder lay respectively at described heating board both sides, and described fore-clamp clamps and the preceding lead frame of location between fore-clamp and heating board, and described back folder clamps and the back lead frame of location between back folder and heating board,
Described fromer rail is below the preceding lead frame between fore-clamp and the heating board, and described rear rail is below the back lead frame between back folder and the heating board, and described preceding lead frame and back lead frame slide respectively and place on described fromer rail and the rear rail,
Lead frame and back lead frame before described control system is alternately controlled described fore-clamp and back folder and located respectively and clamp are also controlled preceding lead frame and the back lead frame that described soldering tip alternately clamps described location and are carried out continuous bonding wire.
2. bonding equipment according to claim 1 is characterized in that, comprising:
Along the preceding importing module of fromer rail setting with leadingly go out module, lay respectively at described fore-clamp two ends, and connect described control system;
Derive module along back importing module and back that rear rail is provided with, lay respectively at folder two ends, described back, and connect described control system.
3. bonding equipment according to claim 2 is characterized in that, comprising:
Has the guiding wall between described fromer rail and the rear rail, import module before described, leadingly go out module, back and import module and back and derive module and respectively comprise contact roller, described contact roller is pressed on lead frame before described or back lead frame on the described guiding wall, and preceding lead frame is ordered about in rolling or back lead frame slides on fromer rail or rear rail.
4. bonding equipment according to claim 3 is characterized in that, comprising:
Described control system control fore-clamp, back folder, soldering tip, preceding importing module, leadingly go out module, back and import module and back to derive the order of module as follows:
Controlling the described preceding module that imports is transported to preceding lead frame between fore-clamp and the heating board through fromer rail;
Controlling described fore-clamp positions and clamps preceding lead frame;
Control described soldering tip preceding lead frame carried out bonding wire, control simultaneously that described back imports that module press from both sides back lead frame through rear rail is transported to after and heating board between, control described afterwards the folder back lead frame positioned and clamps;
After preceding lead frame bonding wire is intact, the control soldering tip moves to the back lead frame position back lead frame is carried out bonding wire, control simultaneously leadingly to go out module preceding lead frame is derived, and repeat to control and import the running that module carries out the input of lead frame before next and location, clamping, bonding wire before described.
5. according to each described bonding equipment of claim 1 to 3, it is characterized in that, comprising:
Adjust the height adjustment mechanism of described fromer rail and rear rail height.
6. bonding equipment workbench is characterized in that:
Comprise heating board, fore-clamp, back folder, fromer rail, rear rail and control device,
Described fore-clamp and back folder lay respectively at described heating board both sides, and described fore-clamp clamps and the preceding lead frame of location between fore-clamp and heating board, and described back folder clamps and the back lead frame of location between back folder and heating board,
Described fromer rail is below the preceding lead frame between fore-clamp and the heating board, and described rear rail is below the back lead frame between back folder and the heating board, and described preceding lead frame and back lead frame slide respectively and place on described fromer rail and the rear rail,
Described fore-clamp alternately controlled by described control device and preceding lead frame and back lead frame are located and clamped to the back folder respectively.
7. bonding equipment workbench according to claim 6 is characterized in that, comprising:
Along the preceding importing module of fromer rail setting with leadingly go out module, lay respectively at described fore-clamp two ends;
Derive module along back importing module and back that rear rail is provided with, lay respectively at folder two ends, described back.
8. bonding equipment workbench according to claim 7 is characterized in that, comprising:
Has the guiding wall between described fromer rail and the rear rail, import module before described, leadingly go out module, back and import module and back and derive module and respectively comprise contact roller, described contact roller is pressed on lead frame before described or back lead frame on the described guiding wall, and preceding lead frame is ordered about in rolling or back lead frame slides on fromer rail or rear rail.
9. according to each described bonding equipment workbench of claim 6 to 8, it is characterized in that, comprising:
Adjust the height adjustment mechanism of described fromer rail and rear rail height.
10. bonding wire method adopts fore-clamp and back folder to lay respectively at the structure that operate preceding lead frame and back lead frame respectively the heating board both sides, it is characterized in that, comprises step:
Preceding lead frame is transported between fore-clamp and the heating board;
Lead frame before described is positioned and clamps;
Lead frame before described is carried out bonding wire, simultaneously back lead frame is transported between back folder and the heating board, and back lead frame is positioned and clamps;
After preceding lead frame bonding wire is intact, continuously back lead frame is carried out bonding wire, simultaneously preceding lead frame is derived, and repeat the running of the input of lead frame before next and location, clamping, bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101082402A CN101593671B (en) | 2009-06-18 | 2009-06-18 | Welding line machine, welding line method and workbench thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101082402A CN101593671B (en) | 2009-06-18 | 2009-06-18 | Welding line machine, welding line method and workbench thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101593671A CN101593671A (en) | 2009-12-02 |
| CN101593671B true CN101593671B (en) | 2010-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101082402A Active CN101593671B (en) | 2009-06-18 | 2009-06-18 | Welding line machine, welding line method and workbench thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020000990A (en) * | 2000-06-23 | 2002-01-09 | 윤종용 | Wire bonding apparatus comprising bonding assembly with additional heat block |
| CN1969368A (en) * | 2004-06-15 | 2007-05-23 | 库利克和索夫工业公司 | Apparatus and method for indexing of substrates and lead frames |
-
2009
- 2009-06-18 CN CN2009101082402A patent/CN101593671B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020000990A (en) * | 2000-06-23 | 2002-01-09 | 윤종용 | Wire bonding apparatus comprising bonding assembly with additional heat block |
| CN1969368A (en) * | 2004-06-15 | 2007-05-23 | 库利克和索夫工业公司 | Apparatus and method for indexing of substrates and lead frames |
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| Publication number | Publication date |
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| CN101593671A (en) | 2009-12-02 |
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