CN101587078B - 硅片的快速检测方法 - Google Patents
硅片的快速检测方法 Download PDFInfo
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- CN101587078B CN101587078B CN2009100324828A CN200910032482A CN101587078B CN 101587078 B CN101587078 B CN 101587078B CN 2009100324828 A CN2009100324828 A CN 2009100324828A CN 200910032482 A CN200910032482 A CN 200910032482A CN 101587078 B CN101587078 B CN 101587078B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 14
- 239000010703 silicon Substances 0.000 title claims abstract description 14
- 238000001514 detection method Methods 0.000 title abstract 2
- 230000007547 defect Effects 0.000 claims abstract description 9
- 230000002950 deficient Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 239000006002 Pepper Substances 0.000 claims description 4
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- 238000004364 calculation method Methods 0.000 abstract description 3
- 238000004458 analytical method Methods 0.000 abstract 1
- 238000011897 real-time detection Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
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- 235000016761 Piper aduncum Nutrition 0.000 description 1
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CN2009100324828A CN101587078B (zh) | 2009-06-18 | 2009-06-18 | 硅片的快速检测方法 |
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CN2009100324828A CN101587078B (zh) | 2009-06-18 | 2009-06-18 | 硅片的快速检测方法 |
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CN101587078A CN101587078A (zh) | 2009-11-25 |
CN101587078B true CN101587078B (zh) | 2011-05-04 |
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CN2009100324828A Expired - Fee Related CN101587078B (zh) | 2009-06-18 | 2009-06-18 | 硅片的快速检测方法 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1214116A (zh) * | 1996-03-15 | 1999-04-14 | 株式会社日立制作所 | 表面晶体缺陷的测量方法及装置 |
CN101151522A (zh) * | 2005-03-28 | 2008-03-26 | 芝浦机械电子株式会社 | 变形硅晶片的表面检查方法和检查装置 |
CN101398393A (zh) * | 2007-09-28 | 2009-04-01 | 上海华虹Nec电子有限公司 | 硅片制品缺陷分析方法及装置 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1214116A (zh) * | 1996-03-15 | 1999-04-14 | 株式会社日立制作所 | 表面晶体缺陷的测量方法及装置 |
CN101151522A (zh) * | 2005-03-28 | 2008-03-26 | 芝浦机械电子株式会社 | 变形硅晶片的表面检查方法和检查装置 |
CN101398393A (zh) * | 2007-09-28 | 2009-04-01 | 上海华虹Nec电子有限公司 | 硅片制品缺陷分析方法及装置 |
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Owner name: BEIJING KEEVEN PRECISION MACHINERY CO., LTD. Free format text: FORMER OWNER: ZHOU QIAOZHI Effective date: 20111213 |
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Free format text: CORRECT: ADDRESS; FROM: 226000 NANTONG, JIANGSU PROVINCE TO: 100086 HAIDIAN, BEIJING |
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Effective date of registration: 20111213 Address after: 100086, No. 43 West Third Ring Road, Beijing, Haidian District Patentee after: Beijing Keeven Precision Machinery Co., Ltd. Address before: 226000 Jiangsu Province, Nantong City Chongchuan District City Huacheng Building No. 9 room 604 Chen Deyun Patentee before: Zhou Qiaozhi |
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Owner name: SONG YUEFENG Effective date: 20150402 |
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Effective date of registration: 20150402 Address after: 100086, No. 43 West Third Ring Road, Beijing, Haidian District Patentee after: Beijing Keeven Precision Machinery Co., Ltd. Patentee after: Song Yuefeng Address before: 100086, No. 43 West Third Ring Road, Beijing, Haidian District Patentee before: Beijing Keeven Precision Machinery Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110504 Termination date: 20180618 |
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CF01 | Termination of patent right due to non-payment of annual fee |