CN101582720B - Light receiving-transmitting component for optical fiber communication - Google Patents
Light receiving-transmitting component for optical fiber communication Download PDFInfo
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- CN101582720B CN101582720B CN200810097959.6A CN200810097959A CN101582720B CN 101582720 B CN101582720 B CN 101582720B CN 200810097959 A CN200810097959 A CN 200810097959A CN 101582720 B CN101582720 B CN 101582720B
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Abstract
The invention relates to a light receiving-transmitting component for optical fiber communication, which comprises a sealing cover, a base matching with the sealing cover to form an accommodating space, a laser chip arranged on the base and positioned in the accommodating space and a light detecting chip arranged on the base and positioned in the accommodating space, wherein the sealing cover comprises a cover body and a lens embedded on the cover body; the laser chip emits out a first laser beam towards the lens; the light detecting chip faces towards the lens and can receive a second laser beam transmitted by the lens; and by sealing the laser chip and the light detecting chip together in the accommodating space formed by the sealing cover and the base, the light receiving-transmitting component capable of transmitting and receiving light rays with different wavelengths can be obtained.
Description
Technical field
The invention provides a kind of photoelectric subassembly, refer in particular to a kind of light transmitting-receiving subassembly for optical fiber communication.
Background technology
The Internet provides an information exchange platform easily.Because the transinformations such as audio or video increase day by day, the maximum transfer speed of the transmission cable of conventional client is not applied and is used gradually, impels optical fiber to replace gradually traditional cable, so that user to be provided larger transinformation.
In order further to improve the transinformation of optical fiber; often can adopt wavelength-division multiplex (WDM; WavelengthDivision Multiplex) technology, multiple light with different wave length is transmitted in an optical fiber, to improve overall transinformation simultaneously.
The two-way multitask transmission of three-wavelength in the past, there is light emission secondary module (TOSA, Transmitteroptical subassembly), and the light-receiving secondary module (ROSA, Receiveroptical subassembly) of collocation light emission secondary module.Wherein, this light-receiving secondary module has the laser module and two the inspection optical assemblies that encapsulate with metal can (TO-can) respectively separately.
But because the structure of above-mentioned light-receiving secondary module is comparatively complicated, part and the assembly cost followed are higher, so that have hindered the universal of optical fiber communication.Therefore, how simplified construction reduce cost of manufacture, has become the important exploitation direction of numerous insiders.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of light transmitting-receiving subassembly for optical fiber communication, can make the light-receiving secondary module with this light transmitting-receiving subassembly have the structure of simplification and lower cost of manufacture.
For achieving the above object, the invention provides a kind of light transmitting-receiving subassembly, comprise capping, coordinate with this capping form accommodation space pedestal, be arranged on this pedestal and be positioned at the laser chip of this accommodation space, and be arranged on this pedestal and be positioned at the inspection optical chip of this accommodation space, this capping comprises lid and is embedded the lens on this lid; This laser chip sends the first laser beam towards these lens; This inspection optical chip is towards these lens, and can receive the second laser beam transmitting via these lens.
The present invention is by this laser chip and this inspection optical chip are encapsulated in the accommodation space of this capping and the formation of this pedestal jointly, can obtain launching and receiving the light transmitting-receiving subassembly of different wave length light, there is the structure of simplification and lower cost of manufacture so that there is the light-receiving secondary module of this light transmitting-receiving subassembly.
Brief description of the drawings
Fig. 1 is the schematic diagram of the light transmitting-receiving subassembly for optical fiber communication of the first preferred embodiment of the present invention;
Fig. 2 is the sectional view of the light transmitting-receiving subassembly for optical fiber communication of the first preferred embodiment of the present invention;
Fig. 3 is the sectional view of the light transmitting-receiving subassembly of the second preferred embodiment of the present invention;
Fig. 4 is another embodiment schematic diagram of the dual wavelength laser component of this second preferred embodiment;
Fig. 5 is the another embodiment schematic diagram of the dual wavelength laser component of this second preferred embodiment;
Fig. 6 is the sectional view of the light transmitting-receiving subassembly of the 3rd preferred embodiment of the present invention;
Fig. 7 is another embodiment schematic diagram of the dual wavelength laser component of the 3rd preferred embodiment;
Fig. 8 is the another embodiment schematic diagram of the dual wavelength laser component of the 3rd preferred embodiment;
Fig. 9 is an embodiment schematic diagram again of the dual wavelength laser component of the 3rd preferred embodiment.
Description of reference numerals
10 capping 11 lids
12 lens 20 pedestals
21 base plate 23 metal pins
50 laser chips 60 are examined optical chip
The smooth transmitting-receiving subassembly of 70 accommodation space 100
Embodiment
Relevant technology contents of the present invention, coordinating in three preferred embodiments with reference to accompanying drawing below, can clearly illustrate.
The first preferred embodiment
As shown in Figures 1 and 2, the present invention, for the first preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, mainly comprises capping (TO cap) 10, pedestal (TO header) 20, laser chip 50, and inspection optical chip 60.
This capping 10 comprises lid 11 and is embedded the lens 12 on this lid 11, and in the present embodiment, these lens 12 are spherical lens, and when actual enforcement, the shape of lens is not limit with this.
This pedestal 20 is made up of metal material, and it comprises and coordinates the base plate 21 that forms accommodation space 70 (seeing Fig. 2) with this capping 10, and through these base plate 21 projection two or more metal pins 23 in this accommodation space 70.This pedestal 20 coordinates formation metal can (TO-can) encapsulation with this capping 10.The metal can pattern of the present embodiment is TO-46 pattern, when actual enforcement, does not limit with this, can be the TO pattern of TO-56 pattern or other kind.
Vertical cavity surface emitting laser (VCSEL) (the VCSEL of this laser chip 50 for being made by semiconductor material, vertical cavity surface emitting laser) chip, when actual enforcement, also can be the made horizontal resonance chamber plane radial type laser of semiconductor material (HCSEL, horizontal cavity surface emitting laser) chip.
60 of this inspection optical chips are the PIN type diode inspection optical chip of being made up of semiconductor material, or avalanche photodide (APD) inspection optical chip.
This laser chip 50 is arranged on the upper surface of the base plate 21 of this pedestal 20 adjacent to each other with this inspection optical chip 60, and is positioned at this accommodation space 70, and this laser chip 50 sends the first laser beam towards these lens 12.This inspection optical chip 60 towards these lens 12 to receive by the second laser beam of these lens 12 transmissions.
In the present embodiment, the wavelength of the first laser beam that this laser chip 50 is launched is about 850 nanometers, but do not limit with this, the wavelength of the second laser beam that this inspection optical chip 60 receives is about 1310 nanometers, when practical application, do not limit with this, but the wavelength of the second laser beam that this inspection optical chip 60 receives is different from the wavelength of the first laser beam that this laser chip 50 launches.
The second preferred embodiment
As shown in Figure 3, the present invention is for the second preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, roughly the same with the first preferred embodiment, difference is that this preferred embodiment also comprises the inferior pedestal 40 between base plate 21 and this inspection optical chip 60 that is arranged on this pedestal 20.
This pedestal 40 is arranged on the upper surface of this base plate 21.In the present embodiment, this time pedestal 40 is made up of silicon material (as Silicon Wafer), when actual enforcement, does not limit with this, can be made up of insulation material or conductive material.
This laser chip 50 is arranged on the upper surface of this base plate 21, and is adjacent to pedestal 40 this time.60 of this inspection optical chips are arranged on this pedestal 40.This laser chip 50 sends the first laser beam towards these lens 12.This inspection optical chip 60 is towards these lens 12 and in order to receive the second laser beam by these lens 12 transmissions.In addition, when actual enforcement, also this laser chip 50 can be arranged on this pedestal 40, and this inspection optical chip 60 be arranged on to the upper surface of this base plate 21.
By the padded inspection optical chip 60 of pedestal 40 is set this time, make laser chip 50 and examine optical chip 60 places at various height, can make this laser chip 50 slightly be overlapped in this inspection optical chip 60, so that the first laser beam that this laser chip 50 sends is also close to the second laser beam incident direction that this inspection optical chip 60 receives.
Or, as shown in Figure 4, time pedestal 30 also can be set between the base plate of this pedestal 20 21 and this laser chip 50, with the height of padded this laser chip 50.In addition, as shown in Figure 5, also can be between the base plate of this pedestal 20 21 and this laser chip 50, and between the base plate 21 of this pedestal 20 and this inspection optical chip 60, time pedestal 30,40 is set respectively, respectively in order to adjust the relative position of laser chip 50 and inspection optical chip 60 and lens 12, to obtain preferably optical property.This time pedestal 30,40 can be made up of insulation material or conductive material.
The 3rd preferred embodiment
As shown in Figure 6, the present invention is for the 3rd preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, roughly the same with the first preferred embodiment, its difference is that the pedestal 20 of this preferred embodiment also comprises the projection 22 towards these accommodation space 70 interior projections by base plate 21 upper surfaces.This projection 22 comprise in the face of the top installation surface 220 of these lens 12 and with the side installation surface 221 of these top installation surface 220 perpendicular abutment.
This laser chip 50 is for penetrating type laser chip in the limit of being made up of semiconductor material.This laser chip 50 is arranged in this side installation surface 221 and towards these lens 12 and sends the first laser beam.This inspection optical chip 60 is arranged in this top installation surface 220, and towards these lens 12 to receive by the second laser light light of these lens 12 transmissions.
The side installation surface 221 providing by the projection 22 of this pedestal 20, the laser chip 50 that can supply limit to penetrate type is arranged in side installation surface 221, to send laser the first laser beam towards these lens 12.
In addition, as shown in Figure 7, the inferior pedestal 30 of the relative position in order to adjust laser chip 50 and lens 12 also can be set between the side installation surface 221 of this projection 22 and this laser chip 50.Or, as shown in Figure 8, the inferior pedestal 40 of the relative position in order to adjust inspection optical chip 60 and these lens 12 is set between the top of this projection 22 installation surface 220 and this inspection optical chip 60.
Moreover, also can be as shown in Figure 9, inferior pedestal 30 in order to adjust laser chip 50 and the relative position of lens 12 is set between the side installation surface 221 of this projection 22 and this laser chip 50, and the inferior pedestal 40 in order to adjust the relative position of examining optical chip 60 and lens 12 is set between the top of this projection 22 installation surface 220 and this inspection optical chip 60, to obtain preferably optical property.This time pedestal 30,40 can be made up of insulation material or conductive material.
In sum, within laser chip 50 and inspection optical chip 60 are co-located on metal can encapsulation by the present invention, can obtain launching and receiving the light transmitting-receiving subassembly of different wave length light.Smooth transmitting-receiving subassembly of the present invention only needs arrange in pairs or groups the inspection optical assembly of another metal can encapsulation or the laser module of another Metal Packaging, just can form the required light-receiving secondary module of three-wavelength transmitted in both directions or light emission secondary module, because this light-receiving secondary module or light emission secondary module only have the assembly of two metal cans encapsulation, simplified textural more in the past, can reduce part and assembly cost, really reach effect of the present invention.
As described above is only preferred embodiment of the present invention, not in order to limit practical range of the present invention.All equivalences of doing according to the claims in the present invention book change and modify, within all still belonging to patent scope of the present invention.
Claims (4)
1. for a light transmitting-receiving subassembly for optical fiber communication, this assembly comprises:
Capping, comprises lid and is embedded the lens on this lid;
Pedestal, coordinates with this capping and forms accommodation space;
Laser chip, is arranged on this pedestal and is positioned at this accommodation space, and this laser chip sends the first laser beam towards these lens;
Inspection optical chip, is arranged on this pedestal and is positioned at this accommodation space, and this inspection optical chip is towards these lens, and can receive the second laser beam transmitting via these lens;
It is characterized in that: this assembly also comprises time pedestal, be located between the base plate and this inspection optical chip of this pedestal, make this laser chip from this inspection optical chip in different height, and this laser chip is slightly overlapped in this inspection optical chip, makes this inspection optical chip part hide the upper surface of this laser chip.
2. the light transmitting-receiving subassembly for optical fiber communication according to claim 1, is characterized in that: described inspection optical chip is PIN type diode inspection optical chip or the avalanche photodide inspection optical chip made by semiconductor material.
3. the light transmitting-receiving subassembly for optical fiber communication according to claim 2, is characterized in that: described laser chip is vertical cavity surface emitting laser (VCSEL) or the horizontal resonance chamber plane radial type laser chip made by semiconductor material.
4. the light transmitting-receiving subassembly for optical fiber communication according to claim 1, is characterized in that: described time pedestal is made up of insulate material or conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810097959.6A CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810097959.6A CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101582720A CN101582720A (en) | 2009-11-18 |
| CN101582720B true CN101582720B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810097959.6A Active CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013112882B4 (en) | 2013-11-21 | 2019-05-09 | Osram Opto Semiconductors Gmbh | Radiation detector device |
| CN113050236A (en) * | 2019-12-27 | 2021-06-29 | 讯芯电子科技（中山）有限公司 | Optical transceiver module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469147A (en) * | 2002-07-01 | 2004-01-21 | 精工爱普生株式会社 | Optical transceiver and its producing method |
| CN1759489A (en) * | 2003-03-10 | 2006-04-12 | 松下电器产业株式会社 | Bidirectional optical module and light transmitting device |
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- 2008-05-16 CN CN200810097959.6A patent/CN101582720B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469147A (en) * | 2002-07-01 | 2004-01-21 | 精工爱普生株式会社 | Optical transceiver and its producing method |
| CN1759489A (en) * | 2003-03-10 | 2006-04-12 | 松下电器产业株式会社 | Bidirectional optical module and light transmitting device |
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| CN101582720A (en) | 2009-11-18 |
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