CN101582720A - Light receiving-transmitting component for optical fiber communication - Google Patents
Light receiving-transmitting component for optical fiber communication Download PDFInfo
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- CN101582720A CN101582720A CNA2008100979596A CN200810097959A CN101582720A CN 101582720 A CN101582720 A CN 101582720A CN A2008100979596 A CNA2008100979596 A CN A2008100979596A CN 200810097959 A CN200810097959 A CN 200810097959A CN 101582720 A CN101582720 A CN 101582720A
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- chip
- pedestal
- optical fiber
- receiving subassembly
- fiber communication
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Abstract
The invention relates to a light receiving-transmitting component for optical fiber communication, which comprises a sealing cover, a base matching with the sealing cover to form an accommodating space, a laser chip arranged on the base and positioned in the accommodating space and a light detecting chip arranged on the base and positioned in the accommodating space, wherein the sealing cover comprises a cover body and a lens embedded on the cover body; the laser chip emits out a first laser beam towards the lens; the light detecting chip faces towards the lens and can receive a second laser beam transmitted by the lens; and by sealing the laser chip and the light detecting chip together in the accommodating space formed by the sealing cover and the base, the light receiving-transmitting component capable of transmitting and receiving light rays with different wavelengths can be obtained.
Description
Technical field
The invention provides a kind of photoelectric subassembly, refer in particular to a kind of light transmitting-receiving subassembly that is used for optical fiber communication.
Background technology
The internet provides an information exchange platform easily.Because transinformations such as audio or video increase day by day, the maximum transfer speed of the transmission cable of conventional client is not applied gradually and is used, and impels optical fiber to replace traditional cable gradually, so that the user to be provided bigger transinformation.
In order further to improve the transinformation of optical fiber; regular meeting adopts wavelength division multiplexing (WDM; WavelengthDivision Multiplex) technology transmits a plurality of light with different wave length simultaneously, to improve whole transinformation in an optical fiber.
The two-way multitask transmission of three-wavelength in the past has light emission secondary module (TOSA, Transmitteroptical subassembly), and the light-receiving secondary module (ROSA, Receiveroptical subassembly) of collocation light emission secondary module.Wherein, this light-receiving secondary module has a laser module and two the inspection optical assemblies that encapsulate with metal can (TO-can) respectively separately.
Yet because the structure of above-mentioned light-receiving secondary module is comparatively complicated, part and the assembly cost followed are higher, so that have hindered popularizing of optical fiber communication.Therefore, how simplified construction and reduce cost of manufacture has become the important exploitation direction of numerous insiders.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of light transmitting-receiving subassembly that is used for optical fiber communication, can make the light-receiving secondary module with this light transmitting-receiving subassembly have the structure and the lower cost of manufacture of simplification.
For achieving the above object, the invention provides a kind of smooth transmitting-receiving subassembly, comprise capping, cooperate the pedestal that forms accommodation space with this capping, be arranged on this pedestal and be positioned at the laser chip of this accommodation space, and be arranged on this pedestal and be positioned at the inspection optical chip of this accommodation space, this capping comprises lid and is embedded lens on this lid; This laser chip sends first laser beam towards these lens; This examines optical chip towards these lens, and can receive second laser beam that transmits via these lens.
The present invention is by this laser chip and this are examined the optical chip mutual encapsulation in the accommodation space of this capping and the formation of this pedestal, can obtain to launch and receiving the light transmitting-receiving subassembly of different wave length light, have structure and the lower cost of manufacture of simplifying so that have the light-receiving secondary module of this light transmitting-receiving subassembly.
Description of drawings
Fig. 1 is the schematic diagram of the light transmitting-receiving subassembly that is used for optical fiber communication of first preferred embodiment of the present invention;
Fig. 2 is the sectional view of the light transmitting-receiving subassembly that is used for optical fiber communication of first preferred embodiment of the present invention;
Fig. 3 is the sectional view of the light transmitting-receiving subassembly of second preferred embodiment of the present invention;
Fig. 4 is another embodiment schematic diagram of the dual wavelength laser component of this second preferred embodiment;
Fig. 5 is the another embodiment schematic diagram of the dual wavelength laser component of this second preferred embodiment;
Fig. 6 is the sectional view of the light transmitting-receiving subassembly of the 3rd preferred embodiment of the present invention;
Fig. 7 is another embodiment schematic diagram of the dual wavelength laser component of the 3rd preferred embodiment;
Fig. 8 is the another embodiment schematic diagram of the dual wavelength laser component of the 3rd preferred embodiment;
Fig. 9 is an embodiment schematic diagram again of the dual wavelength laser component of the 3rd preferred embodiment.
Description of reference numerals
10 cappings, 11 lids
12 lens, 20 pedestals
21 base plates, 23 metal pins
50 laser chips, 60 inspection optical chips
70 accommodation spaces, 100 smooth transmitting-receiving subassemblies
Embodiment
Relevant technology contents of the present invention in following cooperation three preferred embodiments with reference to the accompanying drawings, can clearly illustrate.
First preferred embodiment
As shown in Figures 1 and 2, the present invention is used for first preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, mainly comprises capping (TO cap) 10, pedestal (TO header) 20, laser chip 50, and inspection optical chip 60.
This capping 10 comprises lid 11 and is embedded lens 12 on this lid 11, and in the present embodiment, these lens 12 are spherical lens, and during actual enforcement, the shape of lens is not limit with this.
This pedestal 20 is made by metal material, and it comprises and cooperates the base plate 21 that forms accommodation space 70 (see figure 2)s with this capping 10, and passes this base plate 21 and projection two or more metal pins 23 in this accommodation space 70.This pedestal 20 cooperates formation metal can (TO-can) encapsulation with this capping 10.The metal can pattern of present embodiment is the TO-46 pattern, does not limit with this during actual enforcement, can be the TO pattern of TO-56 pattern or other kind.
Vertical cavity surface emitting laser (VCSEL) (the VCSEL of this laser chip 50 for making by semiconductor material, vertical cavity surface emitting laser) chip, during actual enforcement, also can be the made horizontal resonance chamber wall emission laser of semiconductor material (HCSEL, horizontal cavity surface emitting laser) chip.
60 PIN type diode inspection optical chips of this inspection optical chip, or avalanche photo diode (APD) inspection optical chip for making by semiconductor material.
This laser chip 50 is arranged on the upper surface of the base plate 21 of this pedestal 20 with this inspection optical chip 60 located adjacent one anotherly, and is positioned at this accommodation space 70, and this laser chip 50 sends first laser beam towards these lens 12.This inspection optical chip 60 towards these lens 12 to receive second laser beam by these lens 12 transmissions.
In the present embodiment, the wavelength of first laser beam that this laser chip 50 is launched is about 850 nanometers, but do not limit with this, the wavelength of second laser beam that this inspection optical chip 60 is received is about 1310 nanometers, do not limit during practical application, but the wavelength of second laser beam that received of this inspection optical chip 60 is different from the wavelength of first laser beam that this laser chip 50 launched with this.
Second preferred embodiment
As shown in Figure 3, the present invention is used for second preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, roughly the same with first preferred embodiment, difference is that this preferred embodiment also comprises the base plate 21 that is arranged on this pedestal 20 and the inferior pedestal 40 between this inspection optical chip 60.
This time pedestal 40 is arranged on the upper surface of this base plate 21.In the present embodiment, this time pedestal 40 is made by silicon material (as Silicon Wafer), does not then limit with this during actual enforcement, can be made by insulation material or conductive material.
This laser chip 50 is arranged on the upper surface of this base plate 21, and is adjacent to this time pedestal 40.60 of this inspection optical chips are arranged on this time pedestal 40.This laser chip 50 sends first laser beam towards these lens 12.This inspection optical chip 60 is towards these lens 12 and in order to receive second laser beam by these lens 12 transmissions.In addition, during actual enforcement, also this laser chip 50 can be arranged on this time pedestal 40, and will examine the upper surface that optical chip 60 is arranged on this base plate 21.
By this time pedestal 40 bed hedgehoppings inspection optical chip 60 is set, make laser chip 50 and examine optical chip 60 places at various height, can make this laser chip 50 be overlapped in this inspection optical chip 60 slightly, so that first laser beam that this laser chip 50 is sent also is close to the second laser beam incident direction that this inspection optical chip 60 is received.
Perhaps, as shown in Figure 4, also can time pedestal 30 be set between the base plate 21 of this pedestal 20 and this laser chip 50, with the height of this laser chip 50 of bed hedgehopping.In addition, as shown in Figure 5, also can be between the base plate 21 and this laser chip 50 of this pedestal 20, and between the base plate 21 of this pedestal 20 and this inspection optical chip 60, time pedestal 30,40 is set respectively, each is in order to adjust the relative position of laser chip 50 and inspection optical chip 60 and lens 12, to obtain preferable optical property.This time pedestal 30,40 can be made by insulation material or conductive material.
The 3rd preferred embodiment
As shown in Figure 6, the present invention is used for the 3rd preferred embodiment of the light transmitting-receiving subassembly 100 of optical fiber communication, roughly the same with first preferred embodiment, its difference is that the pedestal 20 of this preferred embodiment also comprises by the projection 22 of base plate 21 upper surfaces towards these accommodation space 70 interior projections.This projection 22 comprises top in the face of these lens 12 and face 220 is set and with side that this top is provided with face 220 perpendicular abutment face 221 is set.
This laser chip 50 is penetrated the type laser chip for the limit of being made by semiconductor material.This laser chip 50 is arranged on this side and is provided with on the face 221 and towards these lens 12 and sends first laser beam.This inspection optical chip 60 is arranged on this top and is provided with on the face 220, and towards these lens 12 to receive the second laser light light by these lens 12 transmissions.
The side that is provided by the projection 22 of this pedestal 20 is provided with face 221, can be arranged on side for the laser chip 50 that type is penetrated on the limit and be provided with on the face 221, to send laser first laser beam towards these lens 12.
In addition, as shown in Figure 7, the inferior pedestal 30 that is provided with between face 221 and this laser chip 50 in order to the relative position of adjusting laser chip 50 and lens 12 can be set also in the side of this projection 22.Perhaps, as shown in Figure 8, the inferior pedestal 40 that is provided with between face 220 and this inspection optical chip 60 in order to the relative position of adjusting inspection optical chip 60 and these lens 12 is set on the top of this projection 22.
Moreover, also can be as shown in Figure 9, side at this projection 22 is provided with the inferior pedestal 30 that is provided with between face 221 and this laser chip 50 in order to the relative position of adjusting laser chip 50 and lens 12, and be provided with on the top of this projection 22 and be provided with between face 220 and this inspection optical chip 60 in order to adjust the inferior pedestal 40 of inspection optical chip 60 and the relative position of lens 12, to obtain preferable optical property.This time pedestal 30,40 can be made by insulation material or conductive material.
In sum, the present invention is co-located on laser chip 50 and inspection optical chip 60 within the metal can encapsulation, can obtain launching and receiving the light transmitting-receiving subassembly of different wave length light.Smooth transmitting-receiving subassembly of the present invention only need arrange in pairs or groups the inspection optical assembly of another metal can encapsulation or the laser module of another metallic packaging, just can constitute required light-receiving secondary module of three-wavelength transmitted in both directions or light emission secondary module, because this light-receiving secondary module or light emission secondary module only have the assembly of two metal can encapsulation, simplified textural more in the past, can reduce part and assembly cost, reach effect of the present invention really.
The above person is preferred embodiment of the present invention only, is not in order to limit practical range of the present invention.All equivalences of doing according to claims of the present invention change and modify, and all still belong within the patent of the present invention institute covering scope.
Claims (13)
1, a kind of light transmitting-receiving subassembly that is used for optical fiber communication, it is characterized in that: this assembly comprises:
Capping comprises lid and is embedded lens on this lid;
Pedestal cooperates the formation accommodation space with this capping;
Laser chip is arranged on this pedestal and is positioned at this accommodation space, and this laser chip sends first laser beam towards these lens; And
The inspection optical chip is arranged on this pedestal and is positioned at this accommodation space, and this inspection optical chip is towards these lens, and can receive second laser beam that transmits via these lens.
2, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 1 is characterized in that: described inspection optical chip is by semiconductor material made PIN type diode inspection optical chip or avalanche photodide inspection optical chip.
3, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 2 is characterized in that: described laser chip is by semiconductor material made vertical cavity surface emitting laser (VCSEL) or horizontal resonance chamber wall emission laser chip.
4, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 3, it is characterized in that: described smooth transmitting-receiving subassembly also comprises between the base plate and described inspection optical chip that is located at described pedestal, or the inferior pedestal between the base plate of described pedestal and the described laser chip.
5, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 4 is characterized in that: described time pedestal is made by insulation material or conductive material.
6, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 3, it is characterized in that: described smooth transmitting-receiving subassembly also comprises between the base plate and described inspection optical chip that is located at described pedestal respectively, and two pedestals between the base plate of described pedestal and the described laser chip.
7, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 6 is characterized in that: described time pedestal is made by insulation material or conductive material.
8, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 2, it is characterized in that: described pedestal comprises base plate, and by the projection of this base plate projection in the described accommodation space, this projection comprises the top and face is set and with side that this top is provided with the face adjacency face is set, described laser chip is arranged at this side and is provided with on the face, and described inspection optical chip then is arranged on this top and is provided with on the face.
9, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 8, it is characterized in that: type laser is penetrated on the limit that described laser chip is made by semiconductor material.
10, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 9 is characterized in that: described smooth transmitting-receiving subassembly also comprises and is located at described top and is provided with between face and the described inspection optical chip, or described side is provided with the inferior pedestal between face and the described laser chip.
11, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 10 is characterized in that: described time pedestal is made by insulation material or conductive material.
12, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 9 is characterized in that: described smooth transmitting-receiving subassembly also comprises and is located at described top respectively and is provided with between face and the described inspection optical chip and described side is provided with pedestals between face and the described laser chip two times.
13, the light transmitting-receiving subassembly that is used for optical fiber communication according to claim 12 is characterized in that: described time pedestal is made by insulation material or conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810097959.6A CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810097959.6A CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
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| Publication Number | Publication Date |
|---|---|
| CN101582720A true CN101582720A (en) | 2009-11-18 |
| CN101582720B CN101582720B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810097959.6A Active CN101582720B (en) | 2008-05-16 | 2008-05-16 | Light receiving-transmitting component for optical fiber communication |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105814814A (en) * | 2013-11-21 | 2016-07-27 | 欧司朗光电半导体有限公司 | Radiation receiver device |
| CN113050236A (en) * | 2019-12-27 | 2021-06-29 | 讯芯电子科技（中山）有限公司 | Optical transceiver module |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004086137A (en) * | 2002-07-01 | 2004-03-18 | Seiko Epson Corp | Optical transceiver and method for manufacturing same |
| JP2004271921A (en) * | 2003-03-10 | 2004-09-30 | Matsushita Electric Ind Co Ltd | Bidirectional optical module and optical transmission device |
-
2008
- 2008-05-16 CN CN200810097959.6A patent/CN101582720B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105814814A (en) * | 2013-11-21 | 2016-07-27 | 欧司朗光电半导体有限公司 | Radiation receiver device |
| US9843399B2 (en) | 2013-11-21 | 2017-12-12 | Osram Opto Semiconductors Gmbh | Radiation receiver apparatus |
| CN105814814B (en) * | 2013-11-21 | 2018-09-04 | 欧司朗光电半导体有限公司 | Radiation receiver equipment |
| CN113050236A (en) * | 2019-12-27 | 2021-06-29 | 讯芯电子科技（中山）有限公司 | Optical transceiver module |
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| Publication number | Publication date |
|---|---|
| CN101582720B (en) | 2014-06-25 |
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