CN101582399B - Contact structure and joining structure - Google Patents
Contact structure and joining structure Download PDFInfo
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- CN101582399B CN101582399B CN 200810099538 CN200810099538A CN101582399B CN 101582399 B CN101582399 B CN 101582399B CN 200810099538 CN200810099538 CN 200810099538 CN 200810099538 A CN200810099538 A CN 200810099538A CN 101582399 B CN101582399 B CN 101582399B
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- substrate
- connection pad
- macromolecular convex
- convex
- conductive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
The invention discloses a contact structure and a joining structure. The contact structure is arranged on a base plate and comprises at least one contact pad, at least one macromolecular projection and at least one conducting layer, wherein the contact pad is positioned on the base plate, and the macromolecular projection is arranged on the base plate; the macromolecular projection has a curved surface, and a plurality of concave-convex structures are arranged on the curved surface; and the conducting layer is covered on the macromolecular projection and is electrically connected with the contact pad.
Description
Technical field
The present invention relates to a kind of contact point structure and connected structure, and be particularly related to a kind of electrical reliability preferable contact point structure and connected structure.
Background technology
Along with scientific and technological progress, various electronic installations develop towards the direction of miniaturization and multifunction.Therefore for chip in the electronic installation being transmitted or receiving more signal, the contact that is electrically connected between chip and the wiring board also develops towards the direction of densification.
In known technology, the method that electrically connects chip and glass substrate mostly be first at chip contact and the conductive structure of glass substrate between dispose anisotropic conductive film (Anisotropic Conductive Film, ACF), and the conductive structure of the contact of chip and glass substrate all towards anisotropic conductive film.Then, the conductive structure of the contact of pressing chip, anisotropic conductive film and glass substrate is with the conductive structure corresponding with aforementioned contact on each contact of electrically connecting chip by the conductive particle in the anisotropic conductive film and the glass substrate.
Yet when the density of the conductive structure of the contactor density of chip and glass substrate increased, the spacing between the spacing between the contact of chip and the conductive structure of glass substrate was all dwindled.Therefore, the contact of chip might electrically connect with contiguous contact or conductive structure by the conductive particle in the anisotropic conductive film, and then causes short circuit or electric leakage.
Therefore, existing people proposes a kind of surface coverage has the column macromolecular convex of metal level with the contact point structure as chip.And the method that the conductive structure that makes the contact of chip and glass substrate electrically connects is to dispose non-conductive mucigel earlier between the conductive structure of chip and glass substrate.Then, with chip pressing on glass substrate, so that the column macromolecular convex runs through non-conductive viscose and contacts and electrically connect with the conductive structure of glass substrate.
Yet therefore the problem that the column macromolecular convex has stress to concentrate when pressing easily easily causes metal level to break and influences its electrical reliability.
Summary of the invention
The present invention proposes a kind of contact point structure, and its macromolecular convex does not have the problem that stress is concentrated when engaging with another substrate.
The present invention proposes a kind of contact point structure in addition, and its macromolecular convex more easily runs through grafting material when engaging with another substrate.
The present invention also proposes a kind of connected structure, has preferable electrical reliability.
For specifically describing content of the present invention, at this a kind of contact point structure is proposed, it is arranged on the substrate.Contact point structure comprises at least one connection pad, at least one macromolecular convex and at least one conductive layer.Wherein, connection pad is positioned on the substrate, and macromolecular convex is disposed on the substrate.Macromolecular convex has the arcuation surface, and has a plurality of concaveconvex structures on the arcuation surface, and the first contact angle θ 1 of arcuation surface and substrate is greater than zero degree and smaller or equal to 80 degree.Conductive layer covers macromolecular convex, and conductive layer and connection pad electric connection.
In one embodiment of this invention, conductive layer covers comprehensively or partly covers macromolecular convex.
In one embodiment of this invention, contact point structure also comprises protective layer, and protective layer is disposed on the substrate and exposes connection pad.
In one embodiment of this invention, macromolecular convex be disposed on the connection pad or cross over simultaneously on the connection pad with substrate on.
In one embodiment of this invention, conductive layer has one or more than one, and conductive layer covers on the same macromolecular convex and electrically connects with corresponding connection pad respectively.
In one embodiment of this invention, conductive layer has one or more than one, and conductive layer covers on the same macromolecular convex and with same connection pad and electrically connects.
In one embodiment of this invention, be positioned on the macromolecular convex conductive layer can with one or electrically connect more than one connection pad.
In one embodiment of this invention, be positioned at one or all electrically connect with same connection pad more than the conductive layer on one the macromolecular convex.
In one embodiment of this invention, contact point structure also comprises the polymer protection layer, is positioned on the substrate and exposes macromolecular convex and connection pad at least.
For specifically describing content of the present invention, at this a kind of contact point structure is proposed, it is arranged on the substrate.Contact point structure comprises at least one connection pad, at least one macromolecular convex and at least one conductive layer.Connection pad is positioned on the substrate, and macromolecular convex is disposed on the substrate.The arcuation convex-concave surface that macromolecular convex has top plan and is positioned at the top plan both sides, the first contact angle θ 1 of arcuation surface and substrate is greater than zero degree and smaller or equal to 80 degree.Conductive layer covers macromolecular convex, and electrically connects with connection pad.
In one embodiment of this invention, top plan has a plurality of concaveconvex structures or is smooth structure.
In one embodiment of this invention, conductive layer covers comprehensively or partly covers macromolecular convex.
In one embodiment of this invention, contact point structure also comprises protective layer, and protective layer is disposed on the substrate and exposes connection pad.
In one embodiment of this invention, macromolecular convex be disposed on the connection pad or cross over simultaneously on the connection pad with substrate on.
In one embodiment of this invention, conductive layer has one or more than one, and conductive layer covers on the same macromolecular convex and electrically connects with corresponding connection pad respectively.
In one embodiment of this invention, conductive layer has one or more than one, and conductive layer covers on the same macromolecular convex and with same connection pad and electrically connects.
In one embodiment of this invention, be positioned on the macromolecular convex conductive layer can with one or electrically connect more than one connection pad.
In one embodiment of this invention, be positioned at one or all electrically connect with same connection pad more than the conductive layer on one the macromolecular convex.
In one embodiment of this invention, contact point structure also comprises the polymer protection layer, is positioned on the substrate and exposes macromolecular convex and connection pad at least.
For specifically describing content of the present invention, propose a kind of connected structure at this and comprise first substrate, second substrate and grafting material.First substrate comprises at least one connection pad, at least one macromolecular convex, at least one conductive layer and basic unit.The corresponding setting of macromolecular convex with connection pad, and macromolecular convex has the arcuation surface, and on the arcuation surface, have a plurality of concaveconvex structures.Conductive layer covers macromolecular convex and electrically connects with connection pad.Connection pad, macromolecular convex and conductive layer are disposed in the basic unit, and wherein the arcuation surface is spent greater than zero degree and smaller or equal to 80 with the first contact angle θ 1 of basic unit.Comprise on second substrate being provided with at least one conductive structure that wherein conductive layer on first substrate and conductive structure electrically connect.Grafting material is between first substrate and second substrate, and the conductive layer of part runs through grafting material with macromolecular convex and contacts with conductive structure.
In one embodiment of this invention, grafting material comprises hot curing grafting material, thermoplastification grafting material or above-mentioned combination.
In one embodiment of this invention, grafting material comprise non-conductive stick together cream (Non-ConductiveAdhesive, NCA), non-conductive stick together film (Non-Conductive Film, NCF), anisotropic conductive cream or anisotropic conductive film.
In one embodiment of this invention, also comprise in the grafting material and be distributed with filler particles.
In one embodiment of this invention, filler particles comprises conductive particle or insulated particle.
For specifically describing content of the present invention, propose a kind of connected structure at this and comprise first substrate, second substrate and grafting material.First substrate comprises at least one connection pad, at least one macromolecular convex, at least one conductive layer and basic unit.The corresponding setting of macromolecular convex with connection pad.The arcuation convex-concave surface that macromolecular convex has top plan and is positioned at the top plan both sides.Conductive layer covers macromolecular convex and electrically connects with connection pad.Connection pad, macromolecular convex and conductive layer are disposed in the basic unit, and wherein the first contact angle θ 1 of arcuation convex-concave surface and basic unit is greater than zero degree and smaller or equal to 80 degree.Comprise on second substrate being provided with at least one conductive structure, and conductive layer on first substrate and conductive structure electric connection.Grafting material is between first substrate and second substrate, and the conductive layer of part runs through grafting material with macromolecular convex and contacts with conductive structure.
In one embodiment of this invention, top plan has a plurality of concaveconvex structures or is smooth structure.
In one embodiment of this invention, grafting material comprises non-conductive cream, non-conductive film, anisotropic conductive cream or the anisotropic conductive film of sticking together of sticking together.
In one embodiment of this invention, grafting material comprises hot curing grafting material, thermoplastification grafting material or above-mentioned combination.In one embodiment of this invention, also comprise in the grafting material and be distributed with filler particles.
In one embodiment of this invention, filler particles comprises conductive particle or insulated particle.
From the above, the macromolecular convex of contact point structure of the present invention and connected structure has the arcuation surface, and has a plurality of concaveconvex structures on the arcuation surface.Therefore, macromolecular convex can avoid that macromolecular convex as is known is general easy to be produced the situation that stress concentrates and cause the metal level on the known macromolecular convex to break with another substrate contacts the time.And when the macromolecular convex and second substrate contacts, concaveconvex structure can help to make macromolecular convex run through grafting material and contact with the conductive structure of second substrate.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the profile of the contact point structure of one embodiment of the invention.
Fig. 2 to Figure 13 is the profile of multiple variation of the contact point structure of Fig. 1.
Figure 14 A is the top view of the contact point structure of one embodiment of the invention.
Figure 14 B is that the contact point structure of Figure 14 A is along I-I ' profile of line segment.
Figure 14 C is that the contact point structure of Figure 14 A is along II-II ' profile of line segment.
Figure 15 A is the top view of the contact point structure of another embodiment of the present invention.
Figure 15 B is that the contact point structure of Figure 15 A is along I-I ' profile of line segment.
Figure 15 C is that the contact point structure of Figure 15 A is along II-II ' profile of line segment.
Figure 16 is the profile of the contact point structure of one embodiment of the invention.
Figure 17 to Figure 28 is the profile of multiple variation of the contact point structure of Figure 16.
Figure 29 A is the top view of the contact point structure of one embodiment of the invention.
Figure 29 B is that the contact point structure of Figure 29 A is along I-I ' profile of line segment.
Figure 29 C is that the contact point structure of Figure 29 A is along II-II ' profile of line segment.
Figure 30 A is the top view of the contact point structure of another embodiment of the present invention.
Figure 30 B is that the contact point structure of Figure 30 A is along I-I ' profile of line segment.
Figure 30 C is that the contact point structure of Figure 30 A is along II-II ' profile of line segment.
Figure 31 is the profile of the contact point structure of another embodiment of the present invention.
Figure 32 is the profile of connected structure before engaging of one embodiment of the invention.
Figure 33 and Figure 34 are the profile of the connected structure of one embodiment of the invention.
Figure 35 is the profile of connected structure before engaging of one embodiment of the invention.
Figure 36 and Figure 37 are the profile of the connected structure of one embodiment of the invention.
Figure 38 A and Figure 38 B are the generalized section of the contact point structure of another embodiment of the present invention.
Figure 39 A to Figure 39 E is the generalized section of formation method of the contact point structure of one embodiment of the invention.
Description of reference numerals
100,300: contact point structure
110,150,310,350,512,712: connection pad
120,160,320,360,514,714: macromolecular convex
120a: polymer protection layer 122,162,514a: arcuation surface
122a, 162a, 322a: concaveconvex structure 130,330,516,716: conductive layer
140,340: protective layer 200,400: substrate
322,362,714a: top plan 324,364,714b: arcuation convex-concave surface
500,600,700,800: connected structure 510,710: the first substrates
518,718: basic unit 520,720: the second substrates
522,722: conductive structure 530,730: grafting material
800: photoresist layer 802: conductive layer
2: the second contact angles of 1: the first contact angle θ of θ
Embodiment
First embodiment
Fig. 1 is the profile of the contact point structure of one embodiment of the invention.Please refer to Fig. 1, the contact point structure 100 of present embodiment is arranged on the substrate 200.Contact point structure 100 comprises connection pad 110, macromolecular convex 120 and conductive layer 130.Wherein, connection pad 110 is positioned on the substrate 200, and macromolecular convex 120 is disposed on the substrate 200.Macromolecular convex 120 has arcuation surface 122, and has a plurality of concaveconvex structure 122a on arcuation surface 122.Conductive layer 130 covers macromolecular convex 120, and conductive layer 130 electrically connects with connection pad 110.It should be noted that the arcuation surface 122 in the present embodiment is the surfaces of giving prominence to towards away from the direction of substrate 200, and the first contact angle θ 1 of arcuation surface 122 and substrate 200 for example is greater than zero degree and smaller or equal to 80 degree.
From the above, macromolecular convex 120 of the present invention has arcuation surface 122, and has a plurality of concaveconvex structure 122a on arcuation surface 122.And the arcuation surface 122 of macromolecular convex 120 does not have the situation that stress is concentrated when macromolecular convex 120 and another substrate contacts.Therefore, macromolecular convex 120 can avoid that elastic projection as is known is general easy to be produced the situation that stress concentrates and cause the metal level on the known elastic projection to break with another substrate contacts the time.In addition, when between substrate 200 and another substrate, disposing grafting material and desire to make macromolecular convex 120 with another substrate contacts, concaveconvex structure 122a can help to make macromolecular convex 120 to run through grafting material and with another substrate contacts.
Letter, spirit of the present invention is that macromolecular convex of the present invention has the arcuation surface, and on the arcuation surface, have a plurality of concaveconvex structures, therefore when macromolecular convex and another substrate contacts, can avoid producing the problem that stress is concentrated, and when macromolecular convex and another substrate contacts, the macromolecular convex that can help these concaveconvex structures runs through the grafting material between substrate and another substrate, and those skilled in the art, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.
Please referring again to Fig. 1, contact point structure 100 also comprises protective layer 140, and protective layer 140 is disposed on the substrate 200 and exposes connection pad 110.In first embodiment, above-mentioned macromolecular convex 120 can utilize GTG (Gray level) mask to form.More specifically, can use the material of photosensitive material as macromolecular convex, use the design of special gray scale mask that photosensitive material is exposed then, after developing, just can obtain having the macromolecular convex 120 that has concaveconvex structure 122a on arcuation surface 122 and the arcuation surface 122.Afterwards, can utilize deposition or sputter or galvanizing process to form conductive layer 130, formed conductive layer 130 can conformably cover thereon according to the surface texture of macromolecular convex 120, so conductive layer 130 surfaces also are ups and downs surfaces.
And in the present invention, between above-mentioned macromolecular convex 120 and the conductive layer 130 multiple variation can also be arranged.Below will introduce the multiple variation of the contact point structure 100 of Fig. 1.
The contact point structure of Fig. 2 also comprises the connection pad 150 that is disposed on the substrate 200 except as shown in Figure 1 macromolecular convex 120, connection pad 110 and conductive layer 130.Particularly, macromolecular convex 120 between two connection pads 110,150, and the conductive layer 130 that covers macromolecular convex 120 can extend to two connection pads 110,150 the surface and with its electric connection.
The contact point structure of Fig. 3 also comprises the macromolecular convex 160 that is disposed on the substrate 200 except as shown in Figure 1 macromolecular convex 120, connection pad 110 and conductive layer 130.Connection pad 110 is between macromolecular convex 160 and macromolecular convex 120, and conductive layer 130 more covers macromolecular convex 160.In addition, macromolecular convex 160 can have arcuation surface 162, and has a plurality of concaveconvex structure 162a on arcuation surface 162.It should be noted that the arcuation surface 162 in the present embodiment is the surfaces of giving prominence to towards away from the direction of substrate 200, and the second contact angle θ 2 of arcuation surface 162 and substrate 200 for example is greater than zero degree and smaller or equal to 80 degree.
The macromolecular convex of above-mentioned Fig. 1 to Fig. 3 does not cover connection pad 110, but in fact, in the present invention, macromolecular convex can also be positioned on the connection pad 110.As shown in Figure 4, macromolecular convex 120 is to be positioned on connection pad 110 surfaces, and exposes the connection pad 110 of part, can electrically connect with the connection pad 110 that exposes so that cover the conductive layer 130 of macromolecular convex 120.Similarly, in Fig. 5, first and second macromolecular convex 130,160 all is to be configured on the connection pad 110, and exposes the connection pad 110 of part, and the conductive layer 130 that therefore covers first and second macromolecular convex 120,160 can electrically connect with the connection pad 110 that exposes.
In addition, macromolecular convex be except can being positioned on the connection pad 110 or being positioned on the connection pad 110, can also be that to have only the part of macromolecular convex be to be positioned on the connection pad 110 and another part is to be positioned on the substrate 200.As shown in Figure 6, macromolecular convex 120 can be crossed over simultaneously on connection pad 110 and substrate 200.That is to say; some is to be positioned at that go up on connection pad 110 surfaces and another part is to be positioned on substrate 200 or the protective layer 140 for a macromolecular convex 120; and expose the connection pad 110 of part, can electrically connect with the connection pad 110 that exposes so that cover the conductive layer 130 of macromolecular convex 120.Similarly; in Fig. 7; first and second macromolecular convex 120,160 all is that some is to be configured on the connection pad 110 and another part is positioned on substrate 200 or the protective layer 140; and expose the connection pad 110 of part, the conductive layer 130 that therefore covers first and second macromolecular convex 120,160 can electrically connect with the connection pad 110 that exposes.
The embodiment of above-mentioned Fig. 1 to Fig. 7 is that conductive layer 130 is all to cover macromolecular convex.In the present invention, conductive layer 130 can be that part covers macromolecular convex, and is as described below but in fact.
The embodiment that Fig. 8 to Figure 13 illustrated is similar to Fig. 1 to Fig. 7 respectively, and difference is among the embodiment of Fig. 8 to Figure 13 that conductive layer 130 is partly to cover macromolecular convex 120, or partly covers first and second macromolecular convex 120,160.
In addition, the macromolecular convex in the various embodiments described above can be block structure or list structure.
Figure 14 A to Figure 14 C is that the explanation macromolecular convex can be the embodiment of block structure.Particularly, Figure 14 A to Figure 14 C is that the configuration mode with the macromolecular convex of Fig. 1 illustrates, though this paper does not show the block structure of the macromolecular convex of each embodiment that Fig. 2 to Figure 13 illustrated one by one, these one of ordinary skill in the art should understand the block structure of the macromolecular convex of Fig. 2 to Figure 13 according to the explanation of Figure 14 A to Figure 14 C.
The profile of Figure 14 A is the top view of the contact point structure of one embodiment of the invention, and Figure 14 B is that the contact point structure of Figure 14 A is along I-I ' profile of line segment, and Figure 14 C is that the contact point structure of Figure 14 A is along II-II ' line segment.Please be simultaneously with reference to Figure 14 A to Figure 14 C, macromolecular convex 120 is a block structure, and has concaveconvex structure 122a on the surface of macromolecular convex 120.Because macromolecular convex 120 is a block structure, thereby is that correspondence is coated with conductive layer 130 on the macromolecular convex 120 of each block structure.
Figure 15 A to Figure 15 C is that the explanation macromolecular convex is the embodiment of list structure.Particularly, Figure 15 A to Figure 15 C is that the macromolecular convex configuration mode with Fig. 1 illustrates, though this paper does not show the list structure of the macromolecular convex of each embodiment that Fig. 2 to Figure 13 illustrated one by one, these one of ordinary skill in the art should understand the list structure of the macromolecular convex of Fig. 2 to Figure 13 according to the explanation of Figure 15 A to Figure 15 C.
The profile of Figure 15 A is the top view of the contact point structure of another embodiment of the present invention, and Figure 15 B is that the contact point structure of Figure 15 A is along I-I ' profile of line segment, and Figure 15 C is that the contact point structure of Figure 15 A is along II-II ' line segment.Please when macromolecular convex 120 is list structure, on same macromolecular convex 120, then cover a plurality of conductive layers 130 simultaneously with reference to Figure 15 A to Figure 15 C, and each conductive layer 130 can electrically connect with corresponding connection pad 110.In addition, in other embodiments, also can be that a plurality of conductive layers that are disposed on same the macromolecular convex all electrically connect with same connection pad.
Second embodiment
Figure 16 is the profile of the contact point structure of second embodiment of the invention.Please refer to Figure 16, the contact point structure 300 of present embodiment is arranged on the substrate 400.Contact point structure 300 comprises connection pad 310, macromolecular convex 320 and conductive layer 330.Wherein, connection pad 310 is positioned on the substrate 400, and macromolecular convex 320 is disposed on the substrate 400.The arcuation convex-concave surface 324 that macromolecular convex 320 has top plan 322 and is positioned at top plan 322 both sides.In present embodiment, top plan 322 is a smooth structure.Conductive layer 330 covers macromolecular convex 320, and conductive layer 330 electrically connects with connection pad 310.It should be noted that the arcuation convex-concave surface 324 in the present embodiment is the surfaces of giving prominence to towards away from the direction of substrate 400, and the first contact angle θ 1 of arcuation convex-concave surface 324 and substrate 400 for example is greater than zero degree and smaller or equal to 80 degree.
From the above, macromolecular convex 320 of the present invention has arcuation convex-concave surface 324.Because, the arcuation convex-concave surface 324 of macromolecular convex 320 does not have the situation that stress is concentrated when macromolecular convex 320 and another substrate contacts, so macromolecular convex 320 can be avoided, and macromolecular convex is general easy as is known produces the concentrated situation of stress and cause the metal level on the known macromolecular convex to break with another substrate contacts the time.In addition, top plan 322 can increase the contact area with another substrate.
Please referring again to Figure 16, in present embodiment, contact point structure 300 also comprises protective layer 340, and protective layer 340 is disposed on the substrate 400 and exposes connection pad 310.In one embodiment, above-mentioned macromolecular convex 320 can utilize gray-tone mask to form.More specifically, can use the material of photosensitive material as macromolecular convex 320, use the design of special gray-tone mask that photosensitive material is exposed then, after developing, just can obtain having the macromolecular convex 320 of top plan 322 and arcuation convex-concave surface 324.Afterwards, can utilize the deposition program to form conductive layer 330, formed conductive layer 330 can conformably cover thereon according to the surface texture of macromolecular convex 320, therefore the conductive layer 130 that covers on the top plan 322 also has top plan, and conductive layer 130 surfaces that cover on the arcuation convex-concave surface 324 also are the ups and downs surfaces of arcuation.
And in the present invention, between above-mentioned macromolecular convex 320 and the conductive layer 330 multiple variation can also be arranged.Below will introduce the multiple variation of the contact point structure 300 of Figure 16.
The contact point structure of Figure 17 also comprises the connection pad 350 that is disposed on the substrate 400 except as shown in figure 16 macromolecular convex 320, connection pad 310 and conductive layer 330.Particularly, macromolecular convex 320 between two connection pads 310,350, and the conductive layer 330 that covers macromolecular convex 320 can extend to two connection pads 310,350 the surface and with its electric connection.
The contact point structure of Figure 18 also comprises the macromolecular convex 360 that is disposed on the substrate 400 except as shown in figure 16 macromolecular convex 320, connection pad 310 and conductive layer 330.Connection pad 310 is between macromolecular convex 360 and macromolecular convex 320, and conductive layer 330 more covers macromolecular convex 360.In addition, the macromolecular convex 360 arcuation convex-concave surface 364 that has top plan 362 and be positioned at top plan 362 both sides.In present embodiment, arcuation convex-concave surface 364 protrudes towards the direction away from substrate 400, and the second contact angle θ 2 of arcuation convex-concave surface 364 and substrate 400 for example is greater than zero degree and smaller or equal to 80 degree.
The macromolecular convex of above-mentioned Figure 16 to Figure 18 does not cover connection pad, but in fact, in the present invention, macromolecular convex 320 can also be positioned on the connection pad 310.As shown in figure 19, macromolecular convex 320 is to be positioned on connection pad 310 surfaces, and exposes the connection pad 310 of part, can electrically connect with the connection pad 310 that exposes so that cover the conductive layer 330 of macromolecular convex 320.Similarly, in Figure 20, macromolecular convex 320,360 all is to be configured on the connection pad 310, and exposes the connection pad 310 of part, and the conductive layer 330 that therefore covers macromolecular convex 320,360 can electrically connect with the connection pad 310 that exposes.
In addition, macromolecular convex 320 be except can being positioned on the connection pad 310 or being positioned on the connection pad 310, can also be macromolecular convex 320 cross over simultaneously on the connection pad 310 with substrate 400 on.That is to say that the part of macromolecular convex 320 is to be positioned on the connection pad 310 and another part is to be positioned on the substrate 400.As shown in figure 21; some is to be positioned at that go up on connection pad 310 surfaces and another part is to be positioned on substrate 400 or the protective layer 340 for a macromolecular convex 320; and expose the connection pad 310 of part, can electrically connect with the connection pad 310 that exposes so that cover the conductive layer 330 of macromolecular convex 320.Similarly; in Figure 22; macromolecular convex 320,360 all is that some is to be configured on the connection pad 310 and another part is positioned on substrate 400 or the protective layer 340; and expose the connection pad 310 of part, the conductive layer 330 that therefore covers macromolecular convex 320,360 can electrically connect with the connection pad 310 that exposes.
The embodiment of above-mentioned Figure 16 to Figure 22 is that conductive layer 330 is all to cover macromolecular convex 320.In the present invention, conductive layer 330 can be that part covers macromolecular convex 320, and is as described below but in fact.
The embodiment that Figure 23 to Figure 28 illustrated is similar to Figure 16 to Figure 22 respectively, and difference is among the embodiment of Figure 23 to Figure 28 that conductive layer 330 is partly to cover macromolecular convex 320, or partly covers first and second macromolecular convex 320,360.
In addition, the macromolecular convex in the various embodiments described above 320 can be block structure or list structure.
Figure 29 A to Figure 29 C is that explanation macromolecular convex 320 can be the embodiment of block structure.Particularly, Figure 29 A to Figure 29 C is that macromolecular convex 320 configuration modes with Figure 16 illustrate, though this paper does not show the block structure of the macromolecular convex 320 of each embodiment that Figure 17 to Figure 28 illustrated one by one, these one of ordinary skill in the art should understand the block structure of the macromolecular convex 320 of Figure 17 to Figure 28 according to the explanation of Figure 29 A to Figure 29 C.
The profile of Figure 29 A is the top view of the contact point structure of one embodiment of the invention, and Figure 29 B is that the contact point structure of Figure 29 A is along I-I ' profile of line segment, and Figure 29 C is that the contact point structure of Figure 29 A is along II-II ' line segment.Please be simultaneously with reference to Figure 29 A to Figure 29 C, macromolecular convex 320 is a block structure, and the macromolecular convex 320 arcuation convex-concave surface 324 that has top plan 322 and be positioned at top plan 322 both sides.Because macromolecular convex 320 is a block structure, thereby is that correspondence is coated with conductive layer 330 on the macromolecular convex 320 of each block structure.
Figure 30 A to Figure 30 C is that explanation macromolecular convex 320 is embodiment of list structure.Particularly, Figure 30 A to Figure 30 C is that the projection configuration mode with Figure 16 illustrates, though this paper does not show the list structure of the macromolecular convex of each embodiment that Figure 17 to Figure 28 illustrated one by one, these one of ordinary skill in the art should understand the list structure of the macromolecular convex of Figure 17 to Figure 28 according to the explanation of Figure 30 A to Figure 30 C.
The profile of Figure 30 A is the top view of the contact point structure of another embodiment of the present invention, and Figure 30 B is that the contact point structure of Figure 30 A is along I-I ' profile of line segment, and Figure 30 C is that the contact point structure of Figure 30 A is along II-II ' line segment.Please when macromolecular convex 320 is list structure, on same macromolecular convex 320, then cover a plurality of conductive layers 330 simultaneously with reference to Figure 30 A to Figure 30 C, and each conductive layer 330 can electrically connect with corresponding connection pad 310.In addition, in other embodiments, also can be that a plurality of conductive layers that are disposed on same the macromolecular convex all electrically connect with same connection pad.
Figure 31 is the profile of the contact point structure of another embodiment of the present invention.Please refer to Figure 31, the contact point structure among Figure 31 is similar to the contact point structure 300 among Figure 16, and difference is that the top plan 322 of the contact point structure among Figure 31 also has a plurality of concaveconvex structure 322a.And the contact point structure among above-mentioned Figure 17～Figure 30 all can replace with the contact point structure among Figure 31.
The disclosed contact point structure of above-mentioned Fig. 1 to Figure 31 will constitute connected structure with another substrate pressing.Its joint method of connected structure is as described below in detail.
Please refer to Figure 32, first substrate 510 and second substrate 520 at first are provided, wherein comprise at least one connection pad 512, at least one macromolecular convex 514 and at least one conductive layer 516 on first substrate 510.Macromolecular convex 514 and connection pad 512 corresponding settings, and macromolecular convex 514 has arcuation surface 514a, and on the 514a of arcuation surface, have a plurality of concaveconvex structure B.What deserves to be mentioned is that the contact point structure on first substrate 510 can be arbitrary contact point structure among previous described Fig. 1 to Figure 15, and and non-limiting be shown in figure 32 structure.In addition, in the present embodiment, first substrate 510 can have more basic unit 518, and connection pad 512, macromolecular convex 514 and conductive layer 516 are all configurable in basic unit 518.And the arcuation surface 514a of macromolecular convex 514 and the first contact angle θ 1 of basic unit 518 for example are greater than zero degree and smaller or equal to 80 degree.Conductive layer 516 covers macromolecular convex 514 and electrically connects with connection pad 512.In addition, comprise on second substrate 520 and be provided with at least one conductive structure 522.
Then, between first substrate 510 and second substrate 520, grafting material 530 is set, and the side with conductive structure 522 of the side with macromolecular convex 514 of first substrate 510 and second substrate 520 is all towards grafting material 530.At this, grafting material 530 can be ultraviolet curing grafting material, hot curing grafting material, thermoplastification grafting material or above-mentioned combination.In other words, grafting material 530 can be to utilize the mode of ultraviolet light polymerization, hot curing, microwave curing, ultrasonic curing or combinations thereof and the grafting material that solidifies.In addition, grafting material 530 comprises non-conductive cream, non-conductive film, anisotropic conductive cream or the anisotropic conductive film of sticking together of sticking together.In addition, in present embodiment, also comprise in the grafting material 530 being distributed with filler particles (not illustrating).Aforementioned filler particles comprises conductive particle or insulated particle.
Then, please refer to Figure 33,, contact with conductive structure 522 so that macromolecular convex 514 can run through grafting material 530 with conductive layer 516 and form connected structure 500 first substrate 510, second substrate 520 and grafting material 530 pressings.
If the power of being bestowed during above-mentioned pressing is bigger, will makes slightly deformation of macromolecular convex 514 so, and form connected structure 600 as shown in figure 34.Connected structure 600 and the difference part of connected structure 500 only are that the conductive layer 516 of the part of connected structure 600 runs through grafting material 530 with macromolecular convex 514 and the contact area that contacts with conductive structure 522 is bigger.
From the above, the macromolecular convex 514 of the connected structure 500,600 of present embodiment has arcuation surface 514a, and has a plurality of concaveconvex structure B on the 514a of arcuation surface.The arcuation surface 514a of macromolecular convex 514 does not have the situation that stress is concentrated when macromolecular convex 514 contacts with second substrate 520.Therefore, macromolecular convex 514 can avoid that macromolecular convex as is known is general easy to be produced the situation that stress concentrates and cause the metal level on the known macromolecular convex to break with another substrate contacts the time.In addition, when macromolecular convex 514 contacted with second substrate 520, concaveconvex structure B can help to make macromolecular convex 514 to run through grafting material 530 and contact with the conductive structure 522 of second substrate 520.
According to another embodiment of the present invention, the connected structure and the joint method that are provided are as described below.
Please refer to Figure 35, first substrate 710 and second substrate 720 at first are provided, wherein first substrate 710 comprises at least one connection pad 712, at least one macromolecular convex 714 and at least one conductive layer 716.Macromolecular convex 714 and connection pad 712 corresponding settings.The arcuation convex-concave surface 714b that macromolecular convex 714 has top plan 714a and is positioned at top plan 714a both sides.In addition, in present embodiment, first substrate 710 can have more basic unit 718, and connection pad 712, macromolecular convex 714 and conductive layer 716 all are arranged in the basic unit 718.In present embodiment, arcuation convex-concave surface 714b protrudes towards the direction away from basic unit 718, and the first contact angle θ 1 of arcuation convex-concave surface 714b and basic unit 718 for example is greater than zero degree and smaller or equal to 80 degree.Conductive layer 716 covers macromolecular convex 714 and electrically connects with connection pad 712.In addition, comprise on second substrate 720 and be provided with at least one conductive structure 722.
Then, between first substrate 710 and second substrate 720, grafting material 730 is set, and the side with conductive structure 722 of the side with macromolecular convex 714 of first substrate 710 and second substrate 720 is all towards grafting material 730.At this, grafting material 730 can be ultraviolet curing grafting material, hot curing grafting material, thermoplastification grafting material or above-mentioned combination.In other words, grafting material 730 can be to utilize the mode of ultraviolet light polymerization, hot curing, microwave curing, ultrasonic curing or combinations thereof and the grafting material that solidifies.In addition, grafting material 730 comprises non-conductive cream, non-conductive film, anisotropic conductive cream or the anisotropic conductive film of sticking together of sticking together.In addition, in present embodiment, also comprise in the grafting material 730 being distributed with filler particles (not illustrating).Aforementioned filler particles comprises conductive particle or insulated particle.
Then, please refer to Figure 36, with first substrate 710, second substrate 720 and grafting material 730 pressings, so that macromolecular convex 714 can run through grafting material 730 with conductive layer 716 and contact with conductive structure 722.
In addition,, will make slightly deformation of macromolecular convex 714 so, and form connected structure 800 as shown in figure 37 if the power of being bestowed during above-mentioned pressing is bigger.Connected structure 800 and the difference part of connected structure 700 only are that the conductive layer 716 of the part of connected structure 800 runs through grafting material 730 with macromolecular convex 714 and the contact area that contacts with conductive structure 722 is bigger.
Figure 38 A and Figure 38 B are the generalized section of the contact point structure of another embodiment of the present invention.Please refer to Figure 38 A, contact point structure of the present invention is except the variation of above-mentioned various embodiment, and it can also comprise polymer protection layer 120a.Polymer protection layer 120a can define when forming macromolecular convex 120 in the lump.In the embodiment of Figure 38 A, polymer protection layer 120a and macromolecular convex 120 link together, and cover local substrate 200.In another embodiment, shown in Figure 38 B, polymer protection layer 120a more covers most substrate 200 except linking together with macromolecular convex 120a.Particularly, the thickness of polymer protection layer 120a can be lower than the thickness of macromolecular convex 120.And the advantage that forms polymer protection layer 120a is to strengthen the structural strength of macromolecular convex 120, makes its not easy fracture or by peeling off on the substrate 200, and has the function of protection component simultaneously.
What is particularly worth mentioning is that; Figure 38 A and Figure 38 B be the relevant position that comes specification polymer protection layer 120a with contact point structure shown in Figure 1 with and character; so, (as Fig. 2 to Figure 37) can also be according to the required polymer protection layer 120a that designed of reality in other the contact point structure of embodiment.
Figure 39 A to Figure 39 E is the generalized section of formation method of the contact point structure of one embodiment of the invention.Please refer to Figure 39 A, on substrate 200, form after connection pad 110, the macromolecular convex 120, on substrate 200, form conductive layer 130, and conductive layer 130 covers macromolecular convex 120 and contacts with connection pad 110.Afterwards, shown in Figure 39 B, form photoresist layer 800 on substrate 200, it exposes the conductive layer 130 of macromolecular convex 120 and connection pad 110 tops.Afterwards, please refer to Figure 39 C, carry out galvanizing process, form conductive layer 802 with surface in the conductive layer 130 that is exposed by photoresist layer 800.Particularly, because of conductive layer 802 is to utilize galvanizing process to form, so its thickness can easily be controlled to thicker.
Then, remove photoresist layer 800, shown in Figure 39 D.Then, shown in Figure 39 E, carry out conductive layer and remove program, so that the thin conductive layer 130 that is covered by thick conductive layer 802 does not remove fully, at the same time, thick conductive layer 802 also can be removed the thickness of part.
Because the foregoing description utilizes galvanizing process to form conductive layer 802, thereby has thicker thickness in left next conductive layer 802,130 gross thickness of Figure 39 E compared to only using depositional mode to form conductive layer at last.So, will help to improve the conductivity of contact point structure.
In sum, the macromolecular convex of contact point structure of the present invention and connected structure has the arcuation surface, and has a plurality of concaveconvex structures on the arcuation surface.Because, the arcuation surface of macromolecular convex does not have the situation that stress is concentrated when the macromolecular convex and second substrate contacts, so macromolecular convex can be avoided, and macromolecular convex is general easy as is known produces the concentrated situation of stress and cause the metal level on the known macromolecular convex to break with another substrate contacts the time.
In addition, when the macromolecular convex and second substrate contacts, concaveconvex structure can help to make macromolecular convex run through grafting material and contact with the conductive structure of second substrate.In addition, the macromolecular convex of contact point structure of the present invention and connected structure also can be the arcuation convex-concave surface that has top plan and be positioned at the top plan both sides, and the contact area that has between the conductive structure of the macromolecular convex of top plan and second substrate is bigger.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.
Claims (30)
1. a contact point structure is arranged on the substrate, comprising:
At least one connection pad is positioned on this substrate;
At least one macromolecular convex is disposed on this substrate, and wherein this macromolecular convex has the arcuation surface, and has a plurality of concaveconvex structures on this arcuation surface, and one first contact angle θ 1 of this arcuation surface and this substrate is greater than zero degree and smaller or equal to 80 degree; And
At least one conductive layer covers this macromolecular convex, and electrically connects with this connection pad.
2. contact point structure as claimed in claim 1, wherein this conductive layer covers comprehensively or partly covers this macromolecular convex.
3. contact point structure as claimed in claim 1 also comprises protective layer, and it is disposed on this substrate and exposes this connection pad.
4. contact point structure as claimed in claim 1, wherein this macromolecular convex be disposed on this connection pad or cross over simultaneously on this connection pad with this substrate on.
5. contact point structure as claimed in claim 1, wherein this conductive layer has one or more than one, covers on the same macromolecular convex, and electrically connects with corresponding connection pad respectively.
6. contact point structure as claimed in claim 1, wherein this conductive layer has one or more than one, covers on the same macromolecular convex, and electrically connects with same connection pad.
7. contact point structure as claimed in claim 1, wherein be positioned on this macromolecular convex this conductive layer can with one or electrically connect more than one connection pad.
8. contact point structure as claimed in claim 1 wherein is positioned at one or all electrically connect with same connection pad more than this conductive layer on one the macromolecular convex.
9. contact point structure as claimed in claim 1 also comprises the polymer protection layer, is positioned on this substrate and exposes this macromolecular convex at least and this connection pad.
10. a contact point structure is arranged on the substrate, comprising:
At least one connection pad is positioned on this substrate;
At least one macromolecular convex, be disposed on this substrate, this macromolecular convex arcuation convex-concave surface of having top plan and being positioned at these top plan both sides wherein, one first contact angle θ 1 of this arcuation convex-concave surface and this substrate is greater than zero degree and smaller or equal to 80 degree; And
At least one conductive layer covers this macromolecular convex, and electrically connects with this connection pad.
11. contact point structure as claimed in claim 10, wherein this top plan has a plurality of concaveconvex structures or is smooth structure.
12. contact point structure as claimed in claim 10, wherein this conductive layer covers comprehensively or partly covers this macromolecular convex.
13. contact point structure as claimed in claim 10 also comprises protective layer, it is disposed on this substrate and exposes this connection pad.
14. contact point structure as claimed in claim 10, wherein this macromolecular convex be disposed on this connection pad or cross over simultaneously on this connection pad with this substrate on.
15. contact point structure as claimed in claim 10, wherein this conductive layer has one or more than one, covers on the same macromolecular convex, and electrically connects with corresponding connection pad respectively.
16. contact point structure as claimed in claim 10, wherein this conductive layer has one or more than one, covers on the same macromolecular convex, and electrically connects with same connection pad.
17. contact point structure as claimed in claim 10, wherein be positioned on this macromolecular convex this conductive layer can with one or electrically connect more than one connection pad.
18. contact point structure as claimed in claim 10 wherein is positioned at one or all electrically connect with same connection pad more than this conductive layer on one the macromolecular convex.
19. contact point structure as claimed in claim 10 also comprises the polymer protection layer, is positioned on this substrate and exposes this macromolecular convex at least and this connection pad.
20. a connected structure comprises:
First substrate comprises:
At least one connection pad;
At least one macromolecular convex, corresponding setting with this connection pad, this macromolecular convex has the arcuation surface, and has a plurality of concaveconvex structures on this arcuation surface;
At least one conductive layer covers this macromolecular convex, and electrically connects with this connection pad; And
Basic unit, this connection pad, this macromolecular convex and this conductive layer are disposed in this basic unit, and wherein this arcuation surface is spent greater than zero degree and smaller or equal to 80 with one first contact angle θ 1 of this basic unit;
Second substrate comprises on this second substrate being provided with at least one conductive structure, and wherein this conductive layer on this first substrate and this conductive structure electrically connect; And
Grafting material, between this first substrate and this second substrate, and this conductive layer of part runs through this grafting material with this macromolecular convex and contacts with this conductive structure.
21. connected structure as claimed in claim 20, wherein this grafting material comprises non-conductive cream, non-conductive film, anisotropic conductive cream or the anisotropic conductive film of sticking together of sticking together.
22. connected structure as claimed in claim 20, wherein this grafting material comprises hot curing grafting material, thermoplastification grafting material or above-mentioned combination.
23. connected structure as claimed in claim 20 wherein also comprises in this grafting material being distributed with filler particles.
24. connected structure as claimed in claim 23, wherein this filler particles comprises conductive particle or insulated particle.
25. a connected structure comprises:
First substrate comprises:
At least one connection pad;
At least one macromolecular convex, corresponding setting with this connection pad, the arcuation convex-concave surface that this macromolecular convex has top plan and is positioned at these top plan both sides;
At least one conductive layer covers this macromolecular convex, and electrically connects with this connection pad; And
Basic unit, this connection pad, this macromolecular convex and this conductive layer are disposed in this basic unit, and wherein one first contact angle θ 1 of this arcuation convex-concave surface and this basic unit is greater than zero degree and smaller or equal to 80 degree;
Second substrate comprises on this second substrate being provided with at least one conductive structure, and wherein this conductive layer on this first substrate and this conductive structure electrically connect; And
Grafting material, between this first substrate and this second substrate, and this conductive layer of part runs through this grafting material with this macromolecular convex and contacts with this conductive structure.
26. connected structure as claimed in claim 25, wherein this top plan has a plurality of concaveconvex structures or is smooth structure.
27. connected structure as claimed in claim 25, wherein this grafting material comprises non-conductive cream, non-conductive film, anisotropic conductive cream or the anisotropic conductive film of sticking together of sticking together.
28. connected structure as claimed in claim 25, wherein this grafting material comprises hot curing grafting material, thermoplastification grafting material or above-mentioned combination.
29. connected structure as claimed in claim 25 wherein also comprises in this grafting material being distributed with filler particles.
30. connected structure as claimed in claim 29, wherein this filler particles comprises conductive particle or insulated particle.
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| CN 200810099538 CN101582399B (en) | 2008-05-13 | 2008-05-13 | Contact structure and joining structure |
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| CN 200810099538 CN101582399B (en) | 2008-05-13 | 2008-05-13 | Contact structure and joining structure |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1753603A (en) * | 2004-09-22 | 2006-03-29 | 精工爱普生株式会社 | Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
| CN1893069A (en) * | 2005-07-06 | 2007-01-10 | 精工爱普生株式会社 | Semiconductor device and method of manufacturing the same |
| CN1992246A (en) * | 2005-12-29 | 2007-07-04 | 财团法人工业技术研究院 | Composite projection |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1753603A (en) * | 2004-09-22 | 2006-03-29 | 精工爱普生株式会社 | Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus |
| CN1893069A (en) * | 2005-07-06 | 2007-01-10 | 精工爱普生株式会社 | Semiconductor device and method of manufacturing the same |
| CN1992246A (en) * | 2005-12-29 | 2007-07-04 | 财团法人工业技术研究院 | Composite projection |
Non-Patent Citations (1)
| Title |
|---|
| JP特开平5－182516A 1993.07.23 |
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