CN101578929A - Printed wiring board and method for manufacturing the same - Google Patents
Printed wiring board and method for manufacturing the same Download PDFInfo
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- CN101578929A CN101578929A CNA2008800015813A CN200880001581A CN101578929A CN 101578929 A CN101578929 A CN 101578929A CN A2008800015813 A CNA2008800015813 A CN A2008800015813A CN 200880001581 A CN200880001581 A CN 200880001581A CN 101578929 A CN101578929 A CN 101578929A
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- pad
- resin insulating
- insulating barrier
- printed substrate
- metal forming
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Abstract
A printed wiring board is provided with a plurality of resin insulating layers each of which has an opening for a via conductor; a plurality of conductor layers each of which has a conductor circuit; a via conductor, which is formed at the opening and connects conductor circuits formed on different conductor layers among the conductor layers to each other; and a component mounting pad, which is formed on the topmost resin insulating layer positioned outermost among the resin insulating layers, for mounting an electronic component. The resin insulating layer and the conductor layer are alternately laminated, and the component mounting pad is formed of copper foil. As a result, the printed wiring board wherein the conductor circuits and the insulating layers are alternately laminated and the semiconductor element mounting pad is formed on one side of the laminate is provided. The printed wiring board is thin and capable of stably mounting the electronic component for a long time.
Description
Technical field
The present invention relates to a kind of printed substrate, relate in particular to a kind of that constitute by alternately laminated conducting channel and insulating barrier and on a surface of plate, have a printed substrate of the pad that is used to load electronic building bricks such as IC.
Background technology
In recent years, along with the electronic installation height functionalization that becomes more, also require to make electronic device miniaturization and slimming.Therefore, the electronic building brick of IC chip and LSI etc. is Highgrade integration just fast, and constantly increases for the demand of the terminal of more highdensity circuit and greater number in the base plate for packaging that loads these electronic building bricks.
In order to tackle this demand, disclose that a kind of to be used to make the dielectric layer made by macromolecular material and conductive layer alternately laminated and have a method of the printed substrate of above-mentioned pad, this method may further comprise the steps: (a) preparation is close to body by two metal formings being close to the metal forming that is prepared into to mother metal, and by alternately stack of dielectric layer and conductive layer and cambium layer lamination body on the surface being close to body in this metal forming; (b) peripheral part of removing stacked lamellar body is peeled off from mother metal so that metal forming is close to body, and one of them that wherein keeps metal forming is attached to stacked lamellar body; (c) undertaken graphically by the surface that utilizes mask material to cover metal forming, with at the location formation opening that is used for forming metal terminal pads; (d) on metal terminal pads, form the plate surface layer by electroplating processes; And (e) remove mask material, then by using the plate surface layer to carry out the etch processes (referring to patent documentation 1) of metal forming as resist.
In addition, the Japanese unexamined spy opens flat 10-41610 and discloses a kind of printed substrate that is used to install the IC chip; By on two surfaces of the substrate of making by expoxy glass etc. alternately between layer laminate resin insulating barrier and conductive layer prepare this printed substrate.
[patent documentation 1] Japanese unexamined spy opens 2006-19591
[patent documentation 2] Japanese unexamined spy opens flat 10-41610
Summary of the invention
The problem that invention will solve
In the printed substrate of making by the method for opening 2006-19591 according to the Japanese unexamined spy (hereinafter being called " conventional example 1 "), on metal forming, form electrodeposited coating by electroplating, and use this electrodeposited coating as resist to form conducting channel by etching.Then, use this conducting channel as the pad that is used to install semiconductor element.
In above-mentioned manufacture method, be formed on the electrodeposited coating that forms on the pad by electroplating.About electroplating, the thickness of electroplating film is according to the density of figure or the position of pad (being positioned at the center or the place, end of base material) or other factors and different.Therefore, thickness of plating layer is different on each pad.If thickness of plating layer difference on each pad, then at each pad place, the electrode of electronic building brick be formed on pad on electrodeposited coating between distance different.
Because electronic building brick has different thermal coefficient of expansions with printed substrate, so this has caused stress.Usually relax this stress by the solder projection that is used to install electronic building brick.Yet if the distance between each pad place electronic building brick and pad is different, stress is tending towards concentrating on some solder projection, causes these solder projections thus because fatigue and deterioration.As a result, rate of finished products and the installation reliability that electronic building brick is installed will reduce.
In conventional example 1, in the method for explanation, use electrodeposited coating 94
1With 94
2As being used to form pad 92
1With 92
2Resist.Therefore, the part 94A of electrodeposited coating
1And 94B
1From pad outstanding (referring to Figure 11).The ledge 94A of electrodeposited coating
1And 94B
1Be not fixed on conducting channel 92 as substrate
1On.Thereby these parts are relative to freely moving, and are tending towards taking place easily fatigue fracture.Then, be starting point with the fatigue fracture, be easy to occur as being formed on the problems such as crackle in the projection on the pad.
In addition, if at electrodeposited coating 94
1Last formation solder projection is then from pad 92
1The part 94A of outstanding electrodeposited coating
1And 94B
1On also form solder projection.Because the solder projection and the electrodeposited coating that are formed on these parts are not fixed on the pad in the same manner, so these solder projections may move easily.Therefore, may appear at the problems such as crackle in solder projection self or its underfilling, and the electronic building brick of IC etc. may be easy to damage.
In the method described in the conventional example 1, be close to body as metal forming, use two Copper Foils for example being close to mutually via the coat of metal (for example, Cr coating).Yet, be close in the body in this metal forming, a little less than the bond strength between two metal formings.Therefore, during the heat treatment of carrying out in the manufacturing process of printed substrate and other are handled, separated from one another easily between the metal forming that is engaged.Then, separate owing to produce between them, the metal forming of being close on the body breaks away from from this supporting member of being close on the body, and generates bubble sometimes between metal forming and supporting member, and immerses plating solution etc.In addition, because a little less than the bond strength between two paper tinsels, therefore, may break or fracture attached to the metal forming on the printed substrate when by using lamination process when metal forming is close on the body formation line layer.
Open the Japanese unexamined spy that disclosed printed substrate has substrate among the flat 10-41610 (hereinafter being called " conventional example 2 "), this causes the printed substrate thickening.Therefore, need be used to install thinner, the more stable and more durable printed substrate of the electronic building brick of IC etc.
The scheme that is used to deal with problems
Printed substrate of the present invention is such printed substrate, and this printed substrate comprises: a plurality of resin insulating barriers, and each described resin insulating barrier all has the opening that is used for via conductor; A plurality of conductive layers, each described conductive layer all has conducting channel; Via conductor, it is formed in the described opening, and is connected to form the conducting channel in the different conductive layers in described conductive layer; And assembly loads pad, it is used to load electronic building brick, and be formed on and be positioned in described a plurality of resin insulating barrier on the outermost the superiors resin insulating barrier, wherein said resin insulating barrier and described conductive layer are alternately laminated, and form described assembly by Copper Foil and load pad.
Here, preferably, described assembly loads pad and has the truncated cone shape of the bottom surface area on the surface that contacts described the superiors resin insulating barrier greater than the upper surface area of loading described electronic building brick.In addition, preferably, load on the upper surface of the described electronic building brick of loading of pad at described assembly and described assembly loads on the side surface of pad and is formed with solder members.In addition, preferably, the side surface that described assembly loads pad is a roughened surface.
In addition, in described printed substrate, preferably, on described the superiors resin insulating barrier, do not form the conducting channel of drawing to the substrate peripheral direction from described pad.In addition, preferably, be arranged in described assembly on the described the superiors resin insulating barrier and load pad and be formed on pad and form in the zone, and in the zone beyond described pad forms the zone, the surface of described the superiors resin insulating barrier exposes.
In addition, preferably, load on the upper surface of pad and the side surface at described assembly and to be formed with diaphragm, and preferably, described interlayer resin insulating layers is the insulating barrier that comprises the filler except that glass cloth and continuous glass fibre.
In described printed substrate, preferably, described assembly loads pad and comprises that power supply loads pad with assembly and earthy assembly loads pad, and load in the formation zone of pad at described assembly, form and be electrically connected each described power supply loads pad with assembly power supply with the inner conductive circuit be electrically connected earthy inner conductive circuit that each described earthy assembly loads pad one of at least.
The present invention still is a kind of manufacture method of printed substrate, may further comprise the steps: by bonding or joint metal forming is fixed to supporting member; On described metal forming, form resin insulating barrier; In described resin insulating barrier, be formed for the opening of via conductor; On described resin insulating barrier, form conducting channel; In described opening, form the via conductor that is electrically connected described conducting channel and described metal forming; Separate described supporting member and described metal forming; And the outside terminal that is formed for being electrically connected to other substrate or electronic building brick by described metal forming.
Here, preferably, form described conducting channel and described via conductor simultaneously, and preferably, by the outer peripheral portion of described metal forming is bonding or be engaged to described supporting member and carry out the fixing of described metal forming and described supporting member.
In the manufacture method of printed substrate of the present invention, preferably, further comprising the steps of: as to form the upper strata resin insulating barrier on the described resin insulating barrier and on the described conducting channel; In the resin insulating barrier of described upper strata, be formed for forming the opening of upper strata via conductor; On the resin insulating barrier of described upper strata, form the upper strata conducting channel; And the upper strata via conductor that in the opening of described upper strata, forms described conducting channel of electrical connection and described upper strata conducting channel.In addition, preferably, form described upper strata conducting channel and described via conductor simultaneously.
Preferably, described supporting member is metallic plate or the tabular component that comprises the metal on the surface of supporting mother metal and covering described support mother metal.Here, " support mother metal " is defined as is used to utilize the metal covering surfaces to form the member of supporting member.Particularly, this member comprises the tabular component of being made by expoxy glass resin or other resin.Here, preferably, described metal is a metal forming, and preferably, engages described supporting member and described metal forming by ultrasonic wave.In addition, preferably, described supporting member is the copper-clad lamination, and preferably, engages described supporting member and described metal forming by ultrasonic wave.
The effect of invention
By adopting said structure, the height of each first pad becomes roughly even.As a result, the distance between electrodes that can make these pads and electronic building brick about equally.Thus, can avoid stress to concentrate on some projection, and can improve connection reliability.
In addition, because each electrode of electronic building brick and equate, so can reduce the amount of both scolders that will be used to connect them with distance between corresponding each first pad of each electrode of electronic building brick.Therefore, the impedance that is connected between electronic building brick and the printed substrate can be reduced, the fault of electronic building brick can be prevented thus.In addition, owing to reduced the amount of scolder, therefore when installation component (solder reflow), can reduce the heat that is applied to printed substrate.
Description of drawings
(A) among Fig. 1 is the profile of printed substrate of the present invention.
(B) among Fig. 1 is the plane graph of printed substrate of the present invention.
Fig. 2 A is the figure (step 1) that the step that is used to make printed substrate of the present invention is shown.
Fig. 2 B is the figure (step 2) that the step that is used to make printed substrate of the present invention is shown.
Fig. 2 C is the figure (step 3) that the step that is used to make printed substrate of the present invention is shown.
Fig. 2 D is the figure (step 4) that the step that is used to make printed substrate of the present invention is shown.
Fig. 3 A is the figure (step 5) that the step that is used to make printed substrate of the present invention is shown.
Fig. 3 B is the figure (step 6) that the step that is used to make printed substrate of the present invention is shown.
Fig. 3 C is the figure (step 7) that the step that is used to make printed substrate of the present invention is shown.
Fig. 4 A is the figure (step 8) that the step that is used to make printed substrate of the present invention is shown.
Fig. 4 B is the figure (step 9) that the step that is used to make printed substrate of the present invention is shown.
Fig. 5 A is the figure (step 10) that the step that is used to make printed substrate of the present invention is shown.
Fig. 5 B is the figure (step 11) that the step that is used to make printed substrate of the present invention is shown.
Fig. 6 A is the figure (step 12) that the step that is used to make printed substrate of the present invention is shown.
Fig. 6 B is the figure (step 13) that the step that is used to make printed substrate of the present invention is shown.
Fig. 7 A is the figure (step 14) that the step that is used to make printed substrate of the present invention is shown.
Fig. 7 B is the figure (step 15) that the step that is used to make printed substrate of the present invention is shown.
Fig. 8 A is the figure (step 16) that the step that is used to make printed substrate of the present invention is shown.
Fig. 8 B is the figure (step 17) that the step that is used to make printed substrate of the present invention is shown.
Fig. 8 C is the figure (step 18) that the step that is used to make printed substrate of the present invention is shown.
Fig. 9 illustrates the pad on the outermost layer that is arranged in printed substrate of the present invention and the schematic diagram (diagrammatic sketch 1) of the circuit between these pads.
Figure 10 illustrates pad on the outermost layer that is arranged in printed substrate of the present invention to form the zone, be formed on this pad and form the pad in the zone and the schematic diagram (diagrammatic sketch 2) of the circuit between these pads.
Figure 11 illustrates by the printed substrate of conventional method manufacturing and the profile of pad.
Embodiment
Below, as embodiment, will provide detailed description with reference to figure 1～10 according to printed substrate of the present invention.In addition, with reference to figure 1～8, the embodiment that the described via conductor in back is formed two row has been described.In below the explanation and accompanying drawing, identical Reference numeral is represented element identical or that be equal to, and the repetitive description thereof will be omitted.
Shown in (A) among Fig. 1, the printed substrate 100 of present embodiment comprises: (a) duplexer 18L, wherein resin insulating barrier 10L
i(i=1～N) and have conducting channel (conductive pattern) 19L
iConductive layer alternately laminated, and interlayer connects the via conductor of usefulness, the conducting channel that is used for being connected to form at different conductive layers (comprises and the first pad 15L described below
k(the corresponding via conductor 14L of k=1～M)
1,1～14L
N, M); (b) first pad (first external connection terminals) 15L
k, it is formed on the edge (+Z) surface of direction (the resin insulating barrier 10L of the superiors of duplexer 18L
1First surface) on; And (c) solder members (solder projection) 30L
k, it is formed on pad 15L
kOn.In addition, printed substrate 100 has: (d) solder resist 20L, its edge that is formed on duplexer 18L is (Z) on the surface of direction (second surface of orlop resin insulating barrier).
Shown in (B) among Fig. 1, in printed substrate 100, solder members 30L will be formed with on it
kThe first pad 15L
kTwo-dimensional arrangement is at the resin insulating barrier 10L of the superiors
1First surface on to form the pad group.
In addition, solder resist has a plurality of openings.Open the conducting channel 19L on the second surface that is formed on the orlop resin insulating barrier this opening portion
NThe surface or the surface of via conductor.Be formed on a surface and a part that is connected to the conducting channel (path bonding pad) of via conductor that the opening in the solder resist can also partly be opened via conductor.The part of the conducting channel (orlop conducting channel) that exposes by opening or the part of via conductor become second pad (second external connection terminals).Here, the first surface of each resin insulating barrier represents to be formed with the surface of first pad; And the second surface of each resin insulating barrier represents to be formed with the apparent surface of second pad.
Shown in Fig. 2 A, by adding method or the method that deducts at the last formation of supporting member (hereinafter being referred to as " supporting bracket ") SM duplexer 18L.On outermost layer, form solder resist 20L or 20U (referring to Fig. 6 B), in the precalculated position duplexer is cut so that it is peeled off from supporting member SM then.
By lift-off processing, the outermost layer resin insulating barrier relative with the layer that is formed with solder resist 20U or 20L becomes the resin insulating barrier 10U of the superiors
1Or 10L
1Metal forming by on the first surface that is formed on the superiors' resin insulating barrier (in the face of the surface of supporting member SM, will be exposed to the surface of outside printed substrate) forms assembly and loads pad (first external connection terminals) 15L
1～15L
M(referring to (A) among Fig. 1 and (B)).
Preferably assembly is loaded pad and be cut into truncated cone shape, and in the X-Z profile, shown in (A) among Fig. 1, with the resin insulating barrier 10L of the superiors
1The area of the basal surface of contact is bigger than the area of the upper surface that electronic building brick will be installed.
After having formed pad, load on the pad at assembly and form diaphragm by electroless deposition etc.Therefore, the peripheral part 94A of diaphragm
1And 94B
1Will be not from first pad outstanding (referring to Figure 11).
On the truncated cone shape pad that is cut into, form upper surface and the side surface (referring to (A) in Fig. 1) of solder members to cover first pad.
Then, the manufacturing that has the electronic building brick of said structure with reference to the material explanation of each element.At first, preparation supporting member SM (referring to Fig. 2 A).Supporting member SM comprises two lip-deep stacked conductive layer FU and the FL that is positioned at insulating material S.The conductive layer FU and the FL that are used to construct supporting member SM are that thickness is the metal forming of a few approximately μ m to tens μ m.After this manner, on the surface of supporting member (supporting bracket), be preferably formed metal level.From forming the angle of uniform thickness, more preferably form this metal level by metal forming.
For supporting member SM, can use the member of on the surface of insulating material S, having fixed conductive layer with above-mentioned thickness by bonding agent etc.
For insulating material S, for example, can use the plywood that is impregnated with bismaleimide-triazine resin, based on the plywood that is impregnated with polyphenylene oxide resin of glass or based on the plywood that is impregnated with polyimide resin of glass based on glass.Can the metal forming of Copper Foil etc. be fixed on two surfaces of this material by using known method.
In addition, can use commercially available two-sided copper-clad lamination or single face copper-clad lamination.For this commercially available plywood, for example can enumerate " MCL-E679 FGR " (by the Hitachi Chemical Co. that is positioned at Xinsu, Tokyo district, Ltd. makes).Particularly, can use this substrate: this substrate comprises that thickness is that the expoxy glass plywood 11 of 0.2～0.6mm and the thickness that is laid on the substrate both sides are the Copper Foil 12 of 3～20 μ m.Alternatively, for supporting member SM, can also use metallic plate.
Then, shown in Fig. 2 B, the first surface of metal forming 11U or 11L is layered in conductive layer FU or FL goes up with in the face of conductive layer FU or FL.For metal forming, for example, can use the Copper Foil, nickel foil or the titanium foil that have expectation thickness separately.This metal forming be preferably rough surface with the first surface opposing second surface.For example, when using Copper Foil as metal forming 11U or 11L, preferred used thickness is the Copper Foil of about 3 μ m～about 35 μ m.
Then, shown in Fig. 2 C and 2D, preferably conductive layer FU or FL and metal forming are interfixed by the bonding or peripheral part (being expressed as the part of " AD ") that engages supporting member SM.In the present embodiment, the part of conductive layer that be fixed and metal forming is preferably placed at from the end of metal forming towards inboard about 10～about 30mm in centre.More preferably, this part is positioned at from the end about 20mm to the inside.In addition, preferably with the width of about 1～about 5mm, and more preferably fix this two parts with the width of about 2mm.
For example, can conductive layer (supporting bracket) and metal forming be fixed by using ultrasonic wave or bonding agent.Being close to aspect intensity and the convenience, with fixedly preponderating of ultrasonic wave mode.When using the ultrasonic wave junction apparatus, for example, can fix with the desired site that the width of expectation and shape are located in the end of relative supporting member SM as mentioned above.As long as have no to remove troublesomely conductive layer and metal forming in the strip step of explanation below, then can adopt the fixing of rectangular-shaped (referring to Fig. 2 D) or grid (not shown in the accompanying drawing).
By fixedly conductive layer and metal forming, when forming interlayer resin insulating layers described below or conductive layer, can prevent following problem.When forming resin insulating barrier, resin insulating barrier is according to heating repeatedly and keeping freezing and expand repeatedly and shrink.Because this resin insulating barrier is formed on the metal forming, so metal forming is also followed resin insulating barrier and is expanded repeatedly and shrink.As a result, distortion or deflection appear in the metal forming easily.In addition, distortion significantly or deflection may cause breaking or crooked, and metal forming may go to pot thus.On the other hand, by fixedly conductive layer and metal forming, can prevent that this problem from taking place.
In addition, when forming conductive layer, can also prevent following problem by the use shikishima plating process.In plating, substrate should be immersed in the solution of plating solution etc.In this case, removed on-fixed conductive layer and metal forming immerses otherwise have plating solution between the two, and this may cause conductive layer to separate because of being soaked with metal forming.On the other hand, conductive layer and metal forming are fixedly made it possible to avoid this problem.
Then, shown in Fig. 3 A and 3B, resist 12U and 12L are formed up to engaging zones AD.Fig. 3 B is the plane graph of the plywood after having formed resist 12U.Form resist 12U and weld part A D with overlapping ultrasonic wave partly.In order to form this resist, can use commercially available dry film photoresist or liquid resist.
Then, remove the conductive layer FU at the place, end that is positioned at supporting member and the outer peripheral portion of FL and metal forming 11U and 11L respectively by using known method to carry out etching etc.Afterwards, by traditional process, remove resist (referring to Fig. 3 C).
Preferably make two metal forming 11U and 11L second surface separately coarse, rather than level and smooth, and if desired, can carry out roughening to it.If the second surface of metal forming is smooth, then preferably it is carried out roughening with the close property of enhancing with resin insulating barrier described below.For this roughened, can use the black oxidation processes of alkaline solution or use the etching of suitable etching solution.For etching solution, can use microetching solution " CZ series " (by the MecCo. that is positioned at the rugged city of Buddhist nun, Bingku county, Ltd. makes) etc.Therefore, formed mother metal BS (referring to Fig. 3 C).
Then, in order to go up formation resin insulating barrier, stacked resin insulating barrier 10U at the metal forming 11U and the 11L second surface (rough surface) separately that are layered on the mother metal BS
1And 10L
1First surface with substrate contacts (referring to Fig. 4 A).For resin insulating barrier, can use film that layer insulation uses or as semi-solid preparation resin sheets such as prepreg or other.Replace using the semi-solid preparation resin sheet, can be by uncured liquid resin silk screen printing be formed resin insulating barrier on metal forming.No matter which kind of mode all forms interlayer resin insulating layers (the resin insulating barrier 10L of the superiors by hot curing
1Or 10U
1) (referring to Fig. 4 A).
As the film of this interlayer insulation resin, for example, can enumerate the interlayer film " ABF series " (by the AjinomotoFine-Techno Co. that is positioned at Kawasaki city, Prefectura de Kanagawa, Inc. makes) that lamination circuit board is used.For prepreg, can use Co., the various products that Ltd. makes by HitachiChemical.
The thickness that preferably makes resin insulating barrier is about 30 μ m～about 100 μ m.In resin insulating barrier, the preferred utilization by the resin that includes filler (except that glass cloth and continuous glass fibre) forms one deck at least in these resin insulating barriers.Especially, if printed substrate 100 comprises 5 or more a plurality of resin insulating barrier, then preferred whole resin insulating barrier all comprises filler (except that glass cloth and continuous glass fibre).For filler, be preferably inorganic filler, and if use glass fibre, the then glass fibre of preferably making by short fiber.
If printed substrate 100 comprises four or resin insulating barrier still less, one or two in then preferred whole resin insulating barriers is the resin insulating barrier that comprises as core such as glass cloth or continuous glass fibre and resin; And preferred remaining resin insulating barrier is to comprise the filler except that glass cloth and continuous glass fibre and the resin insulating barrier of resin.
Then, shown in Fig. 4 A, at resin insulating barrier 10U
1And 10L
1In, form the opening of via hole by laser.For the laser that will be used to form opening, can enumerate carbon dioxide gas laser, excimer laser, YAG laser and UV laser etc.When forming opening, can use diaphragms such as (polyethylene terephthalates) as PET by laser.
Then, in order to improve the close property with conductive layer, preferably roughening is carried out on the surface of resin insulating barrier.For example, by the surface of resin insulating barrier is immersed in the potassium permanganate solution roughening is carried out on the surface of this resin insulating barrier.Then, on the surface of resin insulating barrier, form the catalysis core.
Then, shown in Fig. 4 B,, form the thin electroless deposition film PU of thickness for a few approximately μ m by using commercially available plating coating groove
1And PL
1Electroless deposition film as forming here is preferably the electroless deposition of copper film.
Then, shown in Fig. 5 A, on the electroless deposition film, form anti-plating figure RU
1And RL
1To resist plating figure RU
1And RL
1Be formed on except that the described via conductor in back forms zone and conducting channel and form on the zone the zone, and can it be exposed, then figure is developed, form to resist and plate figure RU by the dry film of stacked anti-plating usefulness for example
1And RL
1
Then, electroplating to form thickness in the zone that does not form anti-plating agent is the electroplating film of about 5～about 20 μ m.By this operation, form conducting channel and via conductor.Here the via conductor that will form is preferably so-called filling vias conductor, promptly is filled in the via conductor in the opening that is formed in the resin insulating barrier.In addition, the upper surface of via conductor be preferably be positioned at be formed on same resin insulating barrier on the identical plane of the upper surface of conductive pattern on.
Then, remove anti-plating agent.Then, shown in Fig. 5 B, owing to expose the electroless deposition film by removing anti-plating figure, the exposed region of therefore removing plated film is to form conducting channel 19U and 19L and via conductor 14U and 14L.Here, because the electroless deposition film is thin, therefore can remove the electroless deposition film by the etching (hereinafter, sometimes this being called " fast-etching ") of not using resist.
For example, can comprise that the etching solution of hydrogen peroxide/sulfuric acid system carries out this fast-etching by use.
By above step, ground floor resin insulating barrier (the superiors' resin insulating barrier), ground floor conductive layer and via conductor (referring to Fig. 5 B) have been formed.Here, on the second surface of the superiors' resin insulating barrier, form the ground floor conducting channel.Preferably roughening is carried out on the surface of conductive pattern (conducting channel) and via conductor.
Then, in order to form second layer resin insulating barrier, the first surface of above-mentioned semi-solid preparation resin sheet is layered on the second surface of the superiors' resin insulating barrier and on first conductive layer.Subsequently, by repeating, form second layer resin insulating barrier, second layer conductive layer and via conductor from the step shown in Fig. 4 A to Fig. 5 B.Equally, repeat from forming resin insulating barrier, to obtain the resin insulating barrier and the alternately laminated duplexer 17U and the 17L (referring to Fig. 6 A) of conductive layer of desired amt to the step that forms via conductor and conductive pattern.
Subsequently, at the outermost layer resin insulating barrier 10U of each duplexer 17U and 17L
NAnd 10L
N(orlop resin insulating barrier) gone up and the conducting channel 19U on the second surface that is formed at the orlop resin insulating barrier
NAnd 19L
NWith via conductor 14U
N, M/2+1, 14U
N, M/2, 14L
N, 1And 14L
N, MOn, form solder resist 20L and 20U.At this moment, preferably roughening is all carried out on the surface of orlop resin insulating barrier and the surface that is formed on the conducting channel on the second surface of orlop resin insulating barrier.
Here, preferably respectively roughening is carried out on the surface of resin insulating barrier and the surface of conducting channel.For example, by in the duplexer immersion potassium permanganate solution that will form above roughening being carried out on the surface of above-mentioned resin insulating barrier.In addition, can carry out roughening to above-mentioned conducting channel by using above-mentioned " CZ series " microetching solution.
Then, by solder resist being exposed and developing, arrange to be used to expose conducting channel 19U
NAnd 19L
NAnd via conductor 14U
N, M/2+1, 14U
N, M/2, 14L
N, 1And 14L
N, MThe opening (referring to Fig. 6 A) on surface.The conducting channel that exposes by the opening in the solder resist and the surface of via conductor become second pad (second external connection terminals).Then, on second external connection terminals (second pad), form solder members (solder projection) or pin, be electrically connected to other plate by this solder members or pin.
The opening that forms in solder resist can form a surface that exposes via conductor and a part that is connected to the conducting channel (path bonding pad) of this via conductor.In this case, the part of the conductor that exposes by the opening in the solder resist will constitute second pad.
Then, in order to peel off duplexer 17U and duplexer 17L respectively from supporting member SM, along the line of cut A1 and the A2 that are arranged in the regional AD inside that engages by ultrasonic wave duplexer is cut (referring to Fig. 6 B), wherein, duplexer 17U comprises metal forming 11U, a plurality of resin insulating barrier 10U
1～10U
N, a plurality of conductive layer 19U
1～19U
N, 14U
1,1～14U
N, M/2+1And 14U
1,2～14U
N, M/2And solder resist 20U, duplexer 17L comprises metal forming 11L, a plurality of resin insulating barrier 10L
1～10L
N, a plurality of conductive layer 19L
1～19L
N, 14L
1,1～14L
N, 1And 14L
1,2～14L
N MAnd solder resist 20L.Like this, isolate above two duplexers from supporting member SM.
As a result, obtain Intermediate substrate 18L shown in Fig. 7 A and the Intermediate substrate 18U shown in Fig. 7 B.By using said process, can obtain the Intermediate substrate 18U and the 18L that on two surfaces of supporting member SM, form simultaneously simultaneously.
Hereinafter, the step that is used for making according to Intermediate substrate 18L printed substrate 100 is described.On isolated Intermediate substrate 18L, utilize metal forming 11L to cover and the surperficial facing surfaces (first surface of the superiors' resin insulating barrier) (referring to Fig. 7 A) that is formed with solder resist 20L from supporting member SM.
On metal forming 11L, the dry film photoresist that stacked etching is used is then by using suitable mask that resist is exposed and developing to form resist pattern PRL
1～PRL
M(referring to Fig. 8 A).
Then, shown in Fig. 8 B, comprise the etching solution (etchant) of copper chloride (II) or iron chloride (II) by use, remove the part except that the zone that is formed with resist pattern of metal forming, with the formation first pad 15L on the first surface of the superiors' resin insulating barrier
k(k=1～M).Load pad (first pad) by form assembly by Copper Foil, can realize easily that each pad thickness is even.In addition, owing to use resist to form first pad as etching mask, therefore different with conventional method, not outstanding at the upper surface place of pad electrodeposited coating from this pad.
At this moment, be not subjected to etchant etching, preferably cover the surface and the opening of solder resist by above-mentioned resist in order to protect second external connection terminals.
The first pad 15L of Xing Chenging in the above
kSurface (side surface that comprises first pad) on, form and to comprise the diaphragm of one deck electroless deposition film at least.When formation comprises the diaphragm of one deck, for example, on pad, form no electric Au deposited film or Pd deposited film.When formation comprises two-layer diaphragm, for example, after forming the electroless nickel deposition film earlier, order on the pad forms no electric golden plated film.When formation comprises three layers diaphragm, form no electric Pd deposited film between superincumbent electroless nickel deposition film and the golden plated film.
Before forming diaphragm on first pad, can remove the resist on the solder resist and can on second external connection terminals, form diaphragm.
At first pad (first external connection terminals) 15L
kOn the surface of second pad (second external connection terminals), replace the diaphragm made by the electroless deposition film, can form water-soluble OSP film (Organic Solderability Preservative, Organic Solderability protective layer).By forming diaphragm or OSP film, can improve their corrosion resistance and solderability.
When on pad, forming the OSP film,, comprise that in fact the thickness of the assembly installation pad of assembly loading pad (first pad) and diaphragm equate with the thickness of assembly loading pad because the OSP film is extremely thin monomolecular film.In addition, forming after assembly loads pad, form diaphragm on their surface, therefore, the diaphragm that is formed on the upper surface of pad is not outstanding from this pad.
Then, for example by silk screen printing at the first pad 15L
kLast printing soldering paste.Because assembly loading pad (first pad) is truncated cone-shaped as mentioned above, therefore form diaphragm to cover all surfaces (upper surface and sidewall) of pad.Therefore, make on the upper surface and sidewall that solder members (solder projection) is dispersed in first pad by wetting.Then, via the solder projection that is formed on first pad for example electronic building brick of IC chip etc. is installed.
Then, shown in Fig. 8 C, form solder projection 30L by reflow soldering
kSo that IC chip etc. to be installed.
On second pad, form solder projection in the same manner as described above to connect for example other plate of motherboard etc.As mentioned above, made printed substrate of the present invention.
In above-mentioned printed substrate, can on the superiors' resin insulating barrier and first pad, form solder resist with the opening that is used to expose first pad according to the embodiment of the invention.
In addition, can be as shown in Figure 9 with first solder pad arrangements at the resin insulating barrier 10L of the superiors
1On, then by inner conductive circuit 44L
N+1Interconnect.When forming first pad as mentioned above, PAL shown in Figure 10 becomes pad and forms zone (pad that assembly loads pad forms the zone).Can be with these pads as the 30L that for example is used for signal
n, be used for the 32L of ground connection
N+1And the 31L that is used for power supply
N+1Here, the assembly pad that loads pad forms the zone and is rectangle (comprising square and rectangle) or circular (comprise circle and ellipse both) shape, has the zone in order to the minimum area that comprises whole pads.
As shown in Figure 9, assembly loading pad comprises that power supply loads pad with assembly and earthy assembly loads pad.The pad that loads pad at assembly forms in the zone, is preferably formed electric connection of power supply loads pad with assembly power supply inner conductive circuit 41L
nWith the earthy inner conductive circuit 41L that is electrically connected earthy assembly loading pad
N+1One of at least.
Figure 10 is the vertical view of the superiors' resin insulating barrier.As shown in the figure, in printed substrate, preferably on the superiors' resin insulating barrier, do not form the conducting channel of drawing to the substrate peripheral direction from pad according to the embodiment of the invention.The assembly loading pad of preferred arrangements on the superiors' resin insulating barrier is formed on pad and forms in the zone; And preferably in the zone beyond pad forms the zone, expose the surface of the superiors' resin insulating barrier.
Above-mentioned printed substrate according to the embodiment of the invention has core substrate unlike conventional example.Usually, under the situation that does not have core substrate, the rigidity of printed substrate may reduce, or thermal coefficient of expansion may become big.As a result, big stress concentrates on the solder projection that connects electronic building brick and printed substrate, thereby causes connection reliability to go wrong.
Yet in the above-mentioned printed substrate according to the embodiment of the invention, owing to formed solder projection on the upper surface of first pad and sidewall, so solder members becomes higher with adhesion between the assembly loading pad.As a result, be difficult to load pad and peel off solder members from assembly.Like this, even do not have core substrate, can not destroy the connection reliability between IC chip and the pad yet.When preferably at least the side surface of first pad (assembly loading pad) being carried out roughening, further improve the intensity of being close between pad and the solder projection.
In addition, when having formed solder projection on the side surface of the pad that also has the rectangular section shape, the distance between the solder projection becomes shorter.Yet shown in Fig. 8 B, the section shape (along watching with the direction of the Surface Vertical of the superiors resin insulating barriers) that assembly loads pad is the truncated cone.Thereby, even on the sidewall of first pad, form solder projection, also can keep the distance between the wide contiguous solder projection.
In addition, as mentioned above roughening is carried out on the surface of the superiors' resin insulating barrier.Like this, improved the wetability of underfilling and the fillibility of underfilling and become higher.Thus, can improve the intensity of being close between underfilling and the superiors' resin insulating barrier.
Variation
The invention is not restricted to aforesaid embodiment, and can be out of shape in every way.
In the above-described embodiments, by using ultrasonic wave to engage metal forming (FU, FL) and other metal forming (11U, 11L) as the assembly of supporting member SM.Yet the method that is used for the jointing metal paper tinsel is not limited thereto.During manufacturing process from first step to step that metal forming is separated from each other (with reference to figure 2A～7B),, just can use other joint method as long as metal forming is interfixed.For example, can use by using the fixing means of bonding agent, welding etc.
When by using bonding agent that supporting member SM and metal forming fixedly the time, can be made of the assembly S of supporting member SM insulating material or non-insulating material.Supporting member SM can be a metallic plate or by the plate of metal forming covering surfaces.
As supporting member SM, on each surface of using, be laminated with fibre reinforced plastics (the fiber reinforced plastic of metal forming at plate, FRP) during plate, (11U, 11L) is layered in respectively on each surface of supporting member SM with metal forming, uses bonding agent that the outer peripheral portion and the supporting member SM of metal forming fixed then.Afterwards, according to the step shown in Fig. 3 C or the back, make printed substrate.
In addition, when using bonding agent as mentioned above, the preferred bonding agent that satisfies following requirement that uses.
(a) in each shown in Fig. 2 C～7B handled, metal forming (11U, 11L) can not break away from from supporting member SM.During making the insulating barrier curing that will be formed on the metal forming, contraction etc., must make metal forming (11U, 11L) not because of deflection, break, bending and distortion etc. be out of shape or rupture.
(b) can not pollute the solution that will in each step shown in Fig. 2 C～7B, use and other.
According to above-mentioned (a) and requirement (b), be chosen in the resin that can not soften or melt under the temperature that adopts in the treatment step shown in Fig. 2 C～7B.
In addition, when supporting member SM and metal forming (11U, 11L) not only engage when also engaging in their whole surface at outer peripheral portion, the preferred use satisfied the following bonding agent that requires: this bonding agent can not peeled off Intermediate substrate 18U, 18L when reaching the temperature that makes the printed substrate deterioration from supporting member SM.
Particularly, selection has the thermoplastic resin of following characteristic: this thermoplastic resin in the temperature that each step adopted from Fig. 2 C to 6B that is used for handling (for example, 180 ℃) under can not soften or melt, but the temperature of the temperature when not being higher than the Intermediate substrate deterioration or the temperature (for example, 280 ℃) when welding are softening down or fusing.
The ultrasonic wave that replaces using in the above-described embodiments engages, and can engage supporting member SM and metal forming (11U, 11L) by using.Yet when adopting welding, the junction surface is exposed under the higher temperature.Be furnished with in printed substrate for fear of this fire damage in the zone of circuit and spread, preferably be not universally but partly carry out welding.
According to example of the present invention or variant embodiment, the step of peeling off from the first step to the Intermediate substrate is kept close property between supporting member SM and the metal forming (11U, 11L) by engaging supporting member SM and metal forming (11U, 11L).Therefore, make metal forming (11U, 11L) avoid deforming in the curing of insulating barrier or when shrinking (for example, distortion, deflection, break and crooked) or fracture.As a result, made the printed substrate that between pad that forms by metal forming (C4 pad) and via conductor, has good connection reliability.The broken string and the good printed substrate of positional precision of the pad that forms by metal forming have also been made.
Example
Hereinafter, describe the present invention in detail according to example.Yet, the invention is not restricted to these examples.
Example 1: the manufacturing of printed substrate
(1) makes mother metal BS
For supporting member SM, use two-sided copper-clad lamination SM (goods number: MCL-E679 FGR, by Hitachi Chemical Co., Ltd. makes) (referring to Fig. 2 A), wherein thick Copper Foil FU and the FL of stacked 18 μ m on two surfaces of the thick expoxy glass plate of 0.4mm.
Then, shown in Fig. 2 B, Copper Foil 11U that 18 μ m are thick and the first surface of 11L are layered on two surfaces of two-sided copper-clad lamination SM.Copper Foil 11U and 11L have the rough surface (roughened surface) of being appointed as second surface (roughened surface).Then, be provided with the ultrasonic wave junction apparatus soldering tip so that Copper Foil and two-sided copper-clad lamination from each end to the inside the position of 20mm engage.Then, under the following conditions, move soldering tip along four limits to engage copper-clad lamination and Copper Foil (referring to Fig. 2 C and 2D).
The amplitude of soldering tip: about 12 μ m
The vibration number of soldering tip: f=28kHz
Be applied to the about 0～12kgf of the pressure of the soldering tip on the Copper Foil: p=
Soldering tip is sent speed: v=about 10mm/sec along Copper Foil
Fig. 2 B and 2C illustrate the standing part of two-sided copper-clad lamination and metal forming.This standing part is positioned at from each end of metal forming towards the inboard 20mm at center, and the width of standing part is 2mm.
Then, on this Copper Foil, form resist, then this resist is exposed and develop by using commercially available product.Then, shown in Fig. 3 A and 3B, resist is carried out graphically with overlapping bonding part (AD).
Then, comprise the processing of sheltering of copper chloride (II) or other etching solution, remove the part that does not form resist of Copper Foil FU and 11U and FL and 11L by use.Then, remove resist and make mother metal BS by traditional process.
(2) handle the formation duplexer by lamination
Interlayer film (" ABF " series of using on the stack layer line road, upper strata, each surface (second surface of metal forming) of the mother metal BS that as above makes, by Ajinomoto Fine-TechnoCo., Inc. make), and about 170 ℃ under with this interlayer film hot curing 180 minutes with formation resin insulating barrier (the superiors' resin insulating barrier) 10U and 10L.
Then, shown in Fig. 4 A, form the opening that via hole is used by using carbon dioxide gas laser.
Then, the liquor potassic permanganate by using 50g/L under 50～80 ℃ with the surface roughening of resin insulating barrier 1～5 minute.Then, using commercially available plating coating groove to carry out electroless deposition of copper is the electroless deposition of copper film (chemical copper deposited film) of about 0.3～1 μ m with the thickness that forms shown in Fig. 4 B.
Then, stacked commercially available dry film.Afterwards, shown in Fig. 5 A, undertaken graphically by photographic means antagonism plating agent.
The electroless deposition of copper film that use is formed on the resin insulating barrier carries out the copper plating as electrode, to form the thick copper electroplating film of 5～20 μ m on the electroless deposition of copper film that does not form anti-plating agent.Then, remove anti-plating agent.
Then, shown in Fig. 5 B, the electroless deposition of copper film of removal between the copper electroplating film is to form conducting channel 19U, 19L and via conductor 14U, 14L.Here, form via conductor and be formed at opening in the resin insulating barrier, and make the upper surface and the upper surface flush that is formed on the conductive pattern on the same resin insulating barrier of via conductor with filling.
Repeat above-mentioned steps has 8 layers of resin insulating barrier and 8 layers of conductive layer for 8 times with formation duplexer 17U and 17L (referring to Fig. 6 A).
(3) form second external connection terminals (second pad)
In comprising 8 layers duplexer 17U and 17L, to orlop resin insulating barrier 10U
N, 10L
NRoughening is carried out with the surface that is formed on the conductive pattern on the resin insulating barrier in the surface of (resin insulating barrier of relative formation with supporting bracket).In order to carry out roughening in the surface to resin insulating barrier, duplexer 17U and the 17L that forms here is immersed in the potassium permanganate solution.In addition, for conducting channel is carried out roughening, use above-mentioned " CZ series ".
Then, use commercially available product in the orlop interlayer resin insulating layers be formed on the conducting channel on the orlop interlayer resin insulating layers and form solder resist 20U and 20L.Then, stacked mask on solder resist, and in solder resist 20U and 20L, form opening by photoetching process.Make the surface of the via conductor that exposes by opening and the surface of conductive pattern become second external connection terminals (referring to Fig. 6 A).
(4) peel off and form (first weldering of first external connection terminals from supporting member SM
Dish)
Cutting part is set is right after inboard, bonding part (referring to A1 and the A2 of Fig. 6 B), and cut at these positions to be arranged in.Then, peel off duplexer 17U and 17L to make Intermediate substrate 18U, 18L (referring to Fig. 7 A, 7B) respectively from supporting member SM.
From the Copper Foil 11L of supporting member SM Intermediate substrate 18L that separate and that be exposed out, the dry film that stacked commercially available resist is used.Then, by photographic process resist is carried out graphically (referring to Fig. 8 A).
In order to protect second pad that is formed among the solder resist 20L not to be subjected to etchant etching, stacked resist same as described above is to cover whole surface and the opening of solder resist 20L.
Then, use mainly to comprise the etching solution of copper chloride (II) and under the atomisation pressure of 0.3～0.8MPa, be etched with the part that does not form resist in the removal Copper Foil, form first pad then.Shown in Fig. 8 B, the first pad 15L
k(k=1～M) is shaped as the truncated cone; Wherein, with the interlaminar resin insulating layer 10L of the superiors
1The area of the contacted basal surface of first surface greater than the area of the upper surface that electronic building brick will be installed.
In addition, as mentioned above, on the roughened surface of Copper Foil, form the superiors' insulating barrier.Therefore, after removing Copper Foil, on the first surface of the superiors' resin insulating barrier, form the roughened surface that duplicates from the roughened surface of Copper Foil thus by etching.
Then, shown in Fig. 8 B, remove resist and comprise the pad group that a plurality of assemblies load pad (first pad) with formation.Load pad (first pad) owing to form assembly, so the thickness of each pad is roughly even by Copper Foil 11L.In addition, owing to use resist to form first pad, therefore can not form from the outstanding electrodeposited coating of pad at the upper surface place of pad as etching mask.
(5) surface treatment of pad
After forming first pad, the surface of handling each first pad and second pad by OSP (Organic SolderabilityPreservative, Organic Solderability protective layer) is to form protective layer.Like this, on pad, form extremely thin unimolecule diaphragm, and comprise that the thickness of the assembly installation pad of assembly loading pad (first pad) and diaphragm equates with the thickness of pad is actual.In addition, after forming first pad, form diaphragm on the surface of these first pads, the diaphragm that is formed at thus on the upper surface of pad is outstanding from pad.
(6) form solder projection
Then, shown in Fig. 8 C, on first pad and second pad, print soldering paste, and forming solder projection (solder projection on not shown second pad of Fig. 8 C) on first pad and second pad by reflow soldering by method for printing screen.Owing on the whole surface of first pad (upper surface and sidewall), formed diaphragm, therefore scolder is dispersed on upper surface and the sidewall form solder projection by wetting.
Although embodiments of the invention do not have core substrate, owing on the upper surface of first pad and sidewall, all be formed with solder projection, so the adhesion between the solder projection and first pad is higher.As a result, be difficult to peel off solder projection from first pad.
In addition, because the section shape of first pad is the truncated cone, distance and the distance between the pad between the therefore contiguous solder projection are roughly the same, and keep wide spacing.
In addition, in example 1,, form solder resist with the opening that is used to expose first pad on the superiors' resin insulating barrier and on first pad.Therefore, compare with the printed substrate with solder resist, the distance between the surface of the superiors' resin insulating barrier and the IC chip is big.As a result, improved the fillibility that is used for the underfilling that between IC chip and printed substrate, seals.
In addition, owing to as mentioned above roughening is carried out on the surface of the superiors' resin insulating barrier, so the wetability of underfilling is higher and improved the fillibility of underfilling.Thus, improved the intensity of being close between underfilling and the superiors' resin insulating barrier.
Example 2
As supporting member SM, use two-sided copper-clad lamination, wherein thick Copper Foil FU and the FL of stacked 5 μ m on each surface of the thick fibre reinforced plastics of 0.4mm.By the epoxy type bonding agent Copper Foil is fixed on Copper Foil FU and the FL, other with example 1 in identical, thereby form printed substrate.
Example 3
Replace being formed at OSP film on first pad and second pad as diaphragm in the example 1; on the surface of first pad and second pad, form the plated film comprise electroless nickel plated film and no electric golden plated film with as diaphragm, wherein form the no electric golden plated film of formation behind the electroless nickel plated film earlier.
Except that this point with example 1 in identical, thereby formation printed substrate.In this example,, do not form diaphragm by electroless deposition by plating in order to realize being formed at the uniform thickness of the diaphragm on each first pad.In addition, electronic building brick installation pad comprises that electronic building brick loads pad and utilizes the film formed diaphragm of electroless deposition.As a result, the distance between the electrode of electronic building brick and the electronic building brick installation pad becomes even.
Example 4
Be used for forming the Copper Foil 11U and the 11L of first pad in the example 1 in the replacement example 1, use Copper Foil with first smooth surface and second rough surface.In addition, the side surface to first pad carries out roughening after forming first pad and before removing resist.Except that these the point with example 1 in identical, thereby formation printed substrate.As a result, first pad in the example 4 has the sidewall of smooth upper surface and roughening.
Example 5
The diaphragm that forms in the example 1 both be not formed on first pad and be not formed on second pad yet.Except that these the point with example 1 in identical, thereby formation printed substrate.
Owing to only utilize Copper Foil to form first pad, therefore the thickness of each first pad is even.As a result, realized as each electrodes of electronic building bricks such as IC and the even distance between each first pad and the minimizing that forms the amount of the employed scolder of solder projection.As a result, realized the reduction that is connected impedance between printed substrate and the electronic building brick.
Example 6
In example 5,, carry out the CZ processing and carry out roughening with surface to first pad in order to improve the bond strength between the solder projection and first pad.Thus, the upper surface of first pad and sidewall become coarse.Except that these the point with example 1 in identical, thereby formation printed substrate.
Example 7
In example 6, on first pad and second pad, form and utilize the film formed diaphragm of no electric deposition of gold.Except that these the point with example 1 in identical, thereby formation printed substrate.
Example 8
In example 6, on first pad and second pad, use OSP to form diaphragm.Except that these the point with example 1 in identical, thereby formation printed substrate.
Example 9
In example 9, make the FRP plate that adopts in the use-case 2 as supporting member.Copper foil layer is stacked on each surface of FRP plate, then by using the epoxy type bonding agent that the outer peripheral portion of Copper Foil is fixed on the supporting member.Then, reach the step that illustrates subsequently according to Fig. 3 C in the example 1 and make printed substrate.
Utilizability on the industry
As mentioned above, flexible print circuit board according to the present invention is as thin track The road plate is useful. This flexible print circuit board is suitable for making littler device.
In addition, be fit to high output capacity system according to flexible print circuit board of the present invention Make the thin printed substrate with excellent connection reliability.
Claims (19)
1. printed substrate comprises:
A plurality of resin insulating barriers, each described resin insulating barrier all has the opening that is used for via conductor;
A plurality of conductive layers, each described conductive layer all has conducting channel;
Via conductor, it is formed in the described opening, and is connected to form the conducting channel in the different conductive layers in described conductive layer; And
Assembly loads pad, and it is used to load electronic building brick, and is formed in described a plurality of resin insulating barrier and is positioned on the outermost the superiors resin insulating barrier, wherein
Described resin insulating barrier and described conductive layer are alternately laminated, and form described assembly loading pad by Copper Foil.
2. printed substrate according to claim 1 is characterized in that, described assembly loads pad and has the truncated cone shape of the bottom surface area on the surface that contacts described the superiors resin insulating barrier greater than the upper surface area of loading described electronic building brick.
3. printed substrate according to claim 1 is characterized in that, loads on the upper surface of the described electronic building brick of loading of pad at described assembly and described assembly loads on the side surface of pad and is formed with solder members.
4. printed substrate according to claim 3 is characterized in that, the side surface that described assembly loads pad is a roughened surface.
5. printed substrate according to claim 1 is characterized in that, does not form the conducting channel of drawing to the substrate peripheral direction from described pad on described the superiors resin insulating barrier.
6. printed substrate according to claim 1, it is characterized in that, be arranged in described assembly on the described the superiors resin insulating barrier and load pad and be formed on pad and form in the zone, and in the zone beyond described pad forms the zone, the surface of described the superiors resin insulating barrier exposes.
7. printed substrate according to claim 1 is characterized in that, loads on the upper surface of pad and the side surface at described assembly to be formed with diaphragm.
8. printed substrate according to claim 1 is characterized in that, described interlayer resin insulating layers is the insulating barrier that comprises the filler except that glass cloth and continuous glass fibre.
9. printed substrate according to claim 1 is characterized in that, described assembly loads pad and comprises that power supply loads pad with assembly and earthy assembly loads pad, and
Load in the formation zone of pad at described assembly, form and be electrically connected each described power supply loads pad with assembly power supply with the inner conductive circuit be electrically connected earthy inner conductive circuit that each described earthy assembly loads pad one of at least.
10. the manufacture method of a printed substrate may further comprise the steps:
By bonding or joint metal forming is fixed to supporting member;
On described metal forming, form resin insulating barrier;
In described resin insulating barrier, be formed for the opening of via conductor;
On described resin insulating barrier, form conducting channel;
In described opening, form the via conductor that is electrically connected described conducting channel and described metal forming;
Separate described supporting member and described metal forming; And
Be formed for being electrically connected to the outside terminal of other substrate or electronic building brick by described metal forming.
11. the manufacture method of printed substrate according to claim 10 is characterized in that, forms described conducting channel and described via conductor simultaneously.
12. the manufacture method of printed substrate according to claim 10 is characterized in that, by the outer peripheral portion of described metal forming is bonding or be engaged to described supporting member and carry out the fixing of described metal forming and described supporting member.
13. the manufacture method of printed substrate according to claim 10 is characterized in that, and is further comprising the steps of:
Forming the upper strata resin insulating barrier on the described resin insulating barrier and on the described conducting channel;
In the resin insulating barrier of described upper strata, be formed for forming the opening of upper strata via conductor;
On the resin insulating barrier of described upper strata, form the upper strata conducting channel; And
In the opening of described upper strata, form the upper strata via conductor that is electrically connected described conducting channel and described upper strata conducting channel.
14. the manufacture method of printed substrate according to claim 13 is characterized in that, forms described upper strata conducting channel and described via conductor simultaneously.
15. the manufacture method of printed substrate according to claim 10 is characterized in that, described supporting member is metallic plate or the tabular component that comprises the metal on the surface of supporting mother metal and covering described support mother metal.
16. the manufacture method of printed substrate according to claim 15 is characterized in that, described metal is a metal forming.
17. the manufacture method of printed substrate according to claim 16 is characterized in that, engages described supporting member and described metal forming by ultrasonic wave.
18. the manufacture method of printed substrate according to claim 15 is characterized in that, described supporting member is the copper-clad lamination.
19. the manufacture method of printed substrate according to claim 18 is characterized in that, engages described supporting member and described metal forming by ultrasonic wave.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010610783.7A CN102045966B (en) | 2007-09-20 | 2008-08-21 | The manufacture method of printed substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97397107P | 2007-09-20 | 2007-09-20 | |
| US60/973,971 | 2007-09-20 | ||
| US60/988,887 | 2007-11-19 | ||
| US12/188,795 | 2008-08-08 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210058921.4A Division CN102612252B (en) | 2007-09-20 | 2008-08-21 | Printed wiring board |
| CN201010610783.7A Division CN102045966B (en) | 2007-09-20 | 2008-08-21 | The manufacture method of printed substrate |
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| Publication Number | Publication Date |
|---|---|
| CN101578929A true CN101578929A (en) | 2009-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CNA2008800015813A Pending CN101578929A (en) | 2007-09-20 | 2008-08-21 | Printed wiring board and method for manufacturing the same |
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| CN (1) | CN101578929A (en) |
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| CN104241231B (en) * | 2013-06-11 | 2017-12-08 | 南安市鑫灿品牌运营有限公司 | The preparation method of chip package base plate |
| CN107393899B (en) * | 2013-06-11 | 2020-07-24 | 龙南骏亚精密电路有限公司 | Chip packaging substrate |
| CN104703385A (en) * | 2013-12-09 | 2015-06-10 | 揖斐电株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN104703385B (en) * | 2013-12-09 | 2018-03-09 | 揖斐电株式会社 | The manufacture method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN105636365A (en) * | 2014-10-27 | 2016-06-01 | 健鼎（无锡）电子有限公司 | Adapter plate manufacturing method |
| CN105636365B (en) * | 2014-10-27 | 2018-03-13 | 健鼎（无锡）电子有限公司 | The preparation method of pinboard |
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