CN101575084A - Method for bonding polymeric microfluidic chip in die - Google Patents
Method for bonding polymeric microfluidic chip in die Download PDFInfo
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- CN101575084A CN101575084A CNA2009100437031A CN200910043703A CN101575084A CN 101575084 A CN101575084 A CN 101575084A CN A2009100437031 A CNA2009100437031 A CN A2009100437031A CN 200910043703 A CN200910043703 A CN 200910043703A CN 101575084 A CN101575084 A CN 101575084A
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Abstract
The invention relates to a method for bonding a polymeric microfluidic chip in a die, which comprises: arranging a bonding die between a moving die fixed plate and a fixed die fixed plate of an injection molding machine, and placing a cover plate and a substrate which are subjected to surface cleaning treatment through ethanol into a moving die cavity and a fixed die cavity respectively, wherein the cover plate is 0.02 to 0.08 millimeter protruded out of a die joint of the die, and one side of the substrate provided with a microflute is parallel to the die joint of the die; utilizing a die temperature control machine to heat the die and the chip until the bonding temperature is between 80 and 100 DEG C, and continuously maintaining the temperature; driving the injection molding machine to close the die, driving the moving die plate to be slowly close to the fixed die plate, and driving the substrate and the cover plate to contact each other and be compressed; maintaining the bonding time for 3 to 5 minutes after the injection molding machine completely closes the die; adjusting the die temperature control machine to cool the die to be less than 50 DEG C; and driving the injection molding machine to open the die, and taking out the chip. The method reduces the procedures of alignment of the substrate and the cover plate and pressure detection and feedback in a common bonding process, and is simpler, more convenient and more practical in chip bonding.
Description
Technical field
The present invention relates to polymeric micro-fluidic chip and make the field, relate to a kind of method that is used for bonding polymeric microfluidic chip in die.
Background technology
Micro-fluidic chip is sample preparation, sample introduction, reaction related in chemistry and the field such as biology, separate, detection is integrated in one, to replace conventional chemical or the various functions of biology laboratory, polymer is because of having good bio-compatibility, machine-shaping is convenient, characteristics such as cost of material is low, good in optical property become the optimal material of micro-fluidic chip; At present, the polymeric micro-fluidic chip preparation method is to utilize pressure sintering or injection moulding process to produce substrate and cover plate earlier, the microflute that wherein has 10-100 micron labyrinth on the substrate, cover plate is the uniform tabula rasa of a thickness, on baking box, hot press, substrate and cover plate are carried out bonding then, become micro-fluidic chip thereby bond together, complicated microflute then becomes the microchannel of sealing in the substrate.
But bonding on baking box and hot press, need before the bonding earlier substrate and cover plate to be aimed at, para-linkage pressure is accurately controlled in the bonding process, and excessive pressure will cause the chip internal channel blocked, too small then can not the bonding success or bond strength very low, and the moulding of current chip and bonding technology are separately, carry out on different equipment, it is low that these problems all cause micro-fluidic chip to face productivity ratio, the cost height, problems such as the cycle is long have limited the production of micro-fluidic chip.
Summary of the invention
The method that the purpose of this invention is to provide bonding in a kind of micro-fluidic chip mould, micro-fluidic chip is realized bonding at mould inside, obtain polymeric micro-fluidic chip more simply and easily, also provide bonding method for bonding techniques in the injection molding of micro-fluidic chip mould.
The technical solution adopted in the present invention is: offer die cavity in bonding mould moving platen and the solid plate, dynamic model inserts and cover half inserts in the die cavity are separately fixed on moving platen and the solid plate by screw, the bonding mould is installed between the dynamic mould fixing plate and cover half fixed head of injection machine, install when the closure because of mould, can guarantee the accurate aligning of two die cavities; After cover plate and substrate carry out the cleaning surfaces processing with ethanol, put into dynamic model and cover half die cavity respectively, wherein cover plate protrudes mould die joint 0.02mm-0.08mm, and it is concordant with the die joint of mould to have microflute one side on the substrate, and the rectangle microflute is of a size of 0.1mm * 0.04mm in the substrate; Oilhole in moving platen and the solid plate is connected with die heater, utilizes die heater heating mould continuation maintenance temperature behind 80 ℃-100 ℃ of the bonding temperatures of setting; Injection machine matched moulds then, dynamic model is slowly close to cover half, makes substrate contact compression with cover plate, behind the complete matched moulds of injection machine, keeps bonding time 3-5min, regulates die heater again and makes below the mold cools down to 50 ℃, and injection moulding machine mould open takes out chip then.
Implement bonding method in the mould of the present invention, it has following beneficial effect: before the bonding cover plate and substrate are put into die cavity respectively, the die cavity on the active and inactive mold plate is accurately to aim at, and has therefore reduced the aligning link of common bonding process substrate and cover plate; By the control chip compressed thickness, make substrate contact stressed realization bonding with cover plate, the microchannel is not blocked in the chip, and adopts this method needn't the operating key resultant pressure, pressure detecting, feedback element when having reduced common thermocompression bonding, chip bonding is with convenient and practical; Adopt this bonding method in the injection molding of micro-fluidic chip mould in the bonding techniques, the die joint by designing mould makes cover plate protrude certain altitude, can realize bonding by injection machine secondary matched moulds compression chip.
Description of drawings
Fig. 1 is the structural representation of this bonding method embodiment.
Below in conjunction with drawings and the embodiments the present invention is described in further details.
The specific embodiment
Embodiment 1 polymeric micro-fluidic chip is to be bonded together by the pressurization of heating by the substrate of a tape channel and a tabula rasa cover plate.As shown in Figure 1, in this bonding method, offer die cavity in bonding mould moving platen 2 and the solid plate 5, dynamic model inserts 3 and cover half inserts 4 in the die cavity are separately fixed on moving platen and the solid plate by screw 10; The bonding mould is installed between the dynamic mould fixing plate 1 and cover half fixed head 6 of injection machine, installs when the closure because of mould, can guarantee the accurate aligning of two die cavities; Before the bonding, after cover plate 9 and substrate 8 usefulness ethanol carry out the cleaning surfaces processing, put into dynamic model and cover half die cavity respectively, its size all is 80mm * 54mm, thickness is 1mm, wherein cover plate 9 protrudes mould die joint 0.02mm-0.08mm, and it is concordant with the die joint of mould to have microflute one side on the substrate 8, and the rectangle microflute is of a size of 0.1mm * 0.04mm in the substrate; Oilholes 7 in moving platen 2 and the solid plate 3 are connected with die heater, utilize die heater heating mould continuation maintenance temperature behind 80 ℃-100 ℃ of the bonding temperatures of setting; Injection machine matched moulds then, dynamic model is slowly close to cover half, makes substrate contact compression with cover plate, behind the complete matched moulds of injection machine, keeps bonding time 3-5min, regulates die heater again and makes below the mold cools down to 50 ℃, and injection moulding machine mould open takes out chip then.
In conjunction with the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to the above-mentioned specific embodiment, and the above-mentioned specific embodiment only is exemplary, is not restrictive; any innovation and creation that do not exceed claim of the present invention are all within protection of the present invention.
Claims (1)
1. method that is used for bonding polymeric microfluidic chip in die, it is characterized in that: offer die cavity in bonding mould moving platen and the solid plate, dynamic model inserts and cover half inserts in the die cavity are separately fixed on moving platen and the solid plate by screw, and the bonding mould is installed between the dynamic mould fixing plate and cover half fixed head of injection machine; Cover plate and substrate are put into dynamic model and cover half die cavity respectively after carrying out the cleaning surfaces processing with ethanol, and wherein cover plate protrudes mould die joint 0.02-0.08mm, and it is concordant with the mould die joint to have microflute one side on the substrate; Utilize die heater heating mould and chip after bonding temperature 80-100 ℃, continue to keep this temperature; Injection machine matched moulds then, moving platen is slowly close to solid plate, makes substrate contact compression with cover plate, behind the complete matched moulds of injection machine, keeps bonding time 3-5min; Regulate die heater again and make below the mold cools down to 50 ℃, injection moulding machine mould open takes out chip then.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100437031A CN101575084A (en) | 2009-06-18 | 2009-06-18 | Method for bonding polymeric microfluidic chip in die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100437031A CN101575084A (en) | 2009-06-18 | 2009-06-18 | Method for bonding polymeric microfluidic chip in die |
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| Publication Number | Publication Date |
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| CN101575084A true CN101575084A (en) | 2009-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2009100437031A Pending CN101575084A (en) | 2009-06-18 | 2009-06-18 | Method for bonding polymeric microfluidic chip in die |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102069564A (en) * | 2010-11-12 | 2011-05-25 | 中南大学 | Rotary multi-station injection molding mould for manufacturing microfluidic chip |
| CN102189633A (en) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | Method and system for manufacturing microfluidic chip |
| CN106809801A (en) * | 2017-03-29 | 2017-06-09 | 广东工业大学 | A kind of facture of microchip method and device |
| CN110293687A (en) * | 2019-06-05 | 2019-10-01 | 大连理工大学 | A kind of more menifold plate bonding methods of polyetherimide |
| CN111009481A (en) * | 2019-12-19 | 2020-04-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Chip substrate high-pressure flip-chip bonding flexible pressurization method |
| CN118059974A (en) * | 2024-04-22 | 2024-05-24 | 中南大学 | Microfluidic chip collaborative thermocompression bonding regulation and control method |
-
2009
- 2009-06-18 CN CNA2009100437031A patent/CN101575084A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102189633A (en) * | 2010-03-05 | 2011-09-21 | 北京同方光盘股份有限公司 | Method and system for manufacturing microfluidic chip |
| CN102069564A (en) * | 2010-11-12 | 2011-05-25 | 中南大学 | Rotary multi-station injection molding mould for manufacturing microfluidic chip |
| CN102069564B (en) * | 2010-11-12 | 2013-12-04 | 中南大学 | Rotary multi-station injection molding mould for manufacturing microfluidic chip |
| CN106809801A (en) * | 2017-03-29 | 2017-06-09 | 广东工业大学 | A kind of facture of microchip method and device |
| CN110293687A (en) * | 2019-06-05 | 2019-10-01 | 大连理工大学 | A kind of more menifold plate bonding methods of polyetherimide |
| CN111009481A (en) * | 2019-12-19 | 2020-04-14 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Chip substrate high-pressure flip-chip bonding flexible pressurization method |
| CN111009481B (en) * | 2019-12-19 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Chip substrate high-pressure flip-chip bonding flexible pressurization method |
| CN118059974A (en) * | 2024-04-22 | 2024-05-24 | 中南大学 | Microfluidic chip collaborative thermocompression bonding regulation and control method |
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Open date: 20091111 |