CN101570675A - Delayed coagulation adhesive used for retard-bonded prestressed tendon - Google Patents
Delayed coagulation adhesive used for retard-bonded prestressed tendon Download PDFInfo
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- CN101570675A CN101570675A CNA2009100869497A CN200910086949A CN101570675A CN 101570675 A CN101570675 A CN 101570675A CN A2009100869497 A CNA2009100869497 A CN A2009100869497A CN 200910086949 A CN200910086949 A CN 200910086949A CN 101570675 A CN101570675 A CN 101570675A
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNA2009100869497A CN101570675A (en) | 2009-06-11 | 2009-06-11 | Delayed coagulation adhesive used for retard-bonded prestressed tendon |
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CNA2009100869497A CN101570675A (en) | 2009-06-11 | 2009-06-11 | Delayed coagulation adhesive used for retard-bonded prestressed tendon |
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CN101570675A true CN101570675A (en) | 2009-11-04 |
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CNA2009100869497A Pending CN101570675A (en) | 2009-06-11 | 2009-06-11 | Delayed coagulation adhesive used for retard-bonded prestressed tendon |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103214436A (en) * | 2013-03-29 | 2013-07-24 | 青岛俪徕精细化工有限公司 | Long carbon chain glycol diglycidyl ether and preparation method thereof |
CN103320071A (en) * | 2013-06-28 | 2013-09-25 | 上海悍马建筑科技有限公司 | Modified epoxy transparent crack sealing compound |
CN107216838A (en) * | 2017-06-20 | 2017-09-29 | 大连凯华新技术工程有限公司 | A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive |
CN109988531A (en) * | 2017-12-29 | 2019-07-09 | 西安增材制造国家研究院有限公司 | SLA die surface step patching material and preparation method thereof |
CN110821046A (en) * | 2019-11-20 | 2020-02-21 | 北京市建筑工程研究院有限责任公司 | Slow-bonding prestressed tendon and preparation method thereof |
CN110845979A (en) * | 2019-11-20 | 2020-02-28 | 北京市建筑工程研究院有限责任公司 | Modified delayed coagulation binder and preparation method thereof |
CN113717675A (en) * | 2021-08-12 | 2021-11-30 | 河北工程大学 | Modified delayed coagulation binder |
CN118026618A (en) * | 2024-04-15 | 2024-05-14 | 天津市辰青金属制品有限公司 | Slow adhesive and application thereof in steel bar |
-
2009
- 2009-06-11 CN CNA2009100869497A patent/CN101570675A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103214436A (en) * | 2013-03-29 | 2013-07-24 | 青岛俪徕精细化工有限公司 | Long carbon chain glycol diglycidyl ether and preparation method thereof |
CN103320071A (en) * | 2013-06-28 | 2013-09-25 | 上海悍马建筑科技有限公司 | Modified epoxy transparent crack sealing compound |
CN103320071B (en) * | 2013-06-28 | 2015-08-12 | 上海悍马建筑科技有限公司 | The transparent Crack Sealing chewing-gum of modified epoxy |
CN107216838A (en) * | 2017-06-20 | 2017-09-29 | 大连凯华新技术工程有限公司 | A kind of bisphenol A epoxide resin class heat-resistant building structure adhesive |
CN109988531A (en) * | 2017-12-29 | 2019-07-09 | 西安增材制造国家研究院有限公司 | SLA die surface step patching material and preparation method thereof |
CN110821046A (en) * | 2019-11-20 | 2020-02-21 | 北京市建筑工程研究院有限责任公司 | Slow-bonding prestressed tendon and preparation method thereof |
CN110845979A (en) * | 2019-11-20 | 2020-02-28 | 北京市建筑工程研究院有限责任公司 | Modified delayed coagulation binder and preparation method thereof |
CN113717675A (en) * | 2021-08-12 | 2021-11-30 | 河北工程大学 | Modified delayed coagulation binder |
CN118026618A (en) * | 2024-04-15 | 2024-05-14 | 天津市辰青金属制品有限公司 | Slow adhesive and application thereof in steel bar |
CN118026618B (en) * | 2024-04-15 | 2024-06-07 | 天津市辰青金属制品有限公司 | Slow adhesive and application thereof in steel bar |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20091211 Address after: Beijing city Haidian District Xitucheng Road No. 33 post encoding: 100088 Applicant after: China Jing Ye Engineering Technology Co., Ltd. Co-applicant after: MCC Central Research Institute of Building and Construction Co., Ltd. Address before: Beijing city Haidian District Xitucheng Road No. 33 post encoding: 100088 Applicant before: China Jing Ye Engineering Technology Co., Ltd. Co-applicant before: MCC Central Research Institute of Building and Construction Co., Ltd. Co-applicant before: Wu Zhuanqin |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20091104 |