CN101562149B - Panel, liquid crystal display and formation method of panel - Google Patents
Panel, liquid crystal display and formation method of panel Download PDFInfo
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- CN101562149B CN101562149B CN2009101454585A CN200910145458A CN101562149B CN 101562149 B CN101562149 B CN 101562149B CN 2009101454585 A CN2009101454585 A CN 2009101454585A CN 200910145458 A CN200910145458 A CN 200910145458A CN 101562149 B CN101562149 B CN 101562149B
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Abstract
The invention provides a panel, an LCD (liquid crystal display) and a formation method of the panel, wherein the formation method of the panel comprises the steps of: providing an substrate, forming afirst conductor on the substrate, forming a first insulating layer on the first conductor, forming at least one second conductor on the first insulating layer, forming a second insulating layer on th e second conductor and forming a first conducting structure on the second insulating layer. The first conductor has a first part and a second part which are electrically isolated from each other; the second conductor interlaces with and is electrically isolated from the second part of the first conductor; and the first conducting structure is electrically connected with the first part and the second part. The embodiment of the invention electrically separates the part interlacing with and in cross connection with other conductors from the other part of the conductor so as to prevent the insulating layer at the cross connection position from being damaged by electro-static discharging charges, and then the embodiment forms the conductor structure so as to lead the whole conductor to be conducted. The invention can effectively avoid or reduce the damage caused by static discharge and cause each conductor to pass signals smoothly.
Description
Technical field
The invention relates to the formation method of panel, LCD and panel, and particularly relevant for the panel formation method of the injury that can reduce static discharge (electrostatic discharge).
Background technology
Comprise many conducting wires interlaced with each other or signal wire in the panel (for example being display panel or contact panel), these conducting wires interlaced with each other and by be folded in each other insulation course and electrical isolation.With the display panel is example, these conducting wires for example be the sweep trace (scan line) that defines pixel region with data line (data line) or non-pixel region in various cablings, for example power lead, measurement circuit or the circuit that links to each other with drive integrated circult etc.
Owing to need in panel, to form many conducting wires,, need make the cross-over connection interlaced with each other of part circuit in the limited above-mentioned circuit of Substrate Area layout.Yet, in the technological process that forms panel (for example, the array processes in the display panel), easy discharge (for example dry ecthing cavity) because of process equipment, and electric charge is accumulated in the panel.When panel and other Mechanical Contact, electric charge can be moved and causes the Electrostatic Discharge phenomenon toward electronegative potential by noble potential.Static discharge can be up to thousands of volts, and cross-over connection place (cross-over) between the conducting wire of cross-over connection interlaced with each other takes place easily, and its insulation course that will cause isolating two staggered leads in order to electricity is subjected to the destruction of static discharge and two staggered cross-over connection leads are short-circuited.
Therefore, industry is needed the injury that can avoid or reduce the element in the static discharge counter plate badly.
Summary of the invention
One embodiment of the invention provides a kind of formation method of panel, and described formation method comprises provides substrate; On substrate, form first lead, first lead has first and second portion, first and second portion are electrically insulated from each other, and described first lead also has one first opening, and described first opening is electrically insulated from each other described first and described second portion; On first lead, form first insulation course; On first insulation course, form at least one second lead, interlaced with each other and electrical isolation with the second portion of first lead; On second lead, form second insulation course; And on second insulation course, forming first conductive structure, first conductive structure is electrically connected first and second portion.
One embodiment of the invention provides a kind of panel, and described panel comprises substrate; First lead is positioned on the substrate, and first lead has first, first opening and second portion, is separated with first opening between first and the second portion and is electrically insulated from each other, and wherein first opening is arranged in non-pixel region; First insulation course is positioned on first lead; At least one second lead is positioned on first insulation course, the interlaced with each other and electrical isolation with the second portion of first lead; Second insulation course is positioned on second lead; And first conductive structure, be positioned on second insulation course and be electrically connected first and second portion.
Another embodiment of the present invention provides a kind of panel, and described panel comprises substrate; First lead is positioned on the substrate, and extends towards first direction, and first lead has first, first opening and second portion, is separated with first opening between first and the second portion and is electrically insulated from each other; First insulation course is positioned on first lead; A plurality of second leads are positioned on first insulation course, and all extend towards second direction, and each second lead is the interlaced with each other and electrical isolation with the second portion of first lead all respectively; Second insulation course is positioned on second lead; And conductive structure, be positioned on the substrate and electrical connection first and second portion; Wherein, the first of first lead directly over do not have the lead that extends towards second direction.
Further embodiment of this invention provides a kind of panel, and described panel comprises substrate; First lead is positioned on the substrate, and first lead has first, first opening and second portion, is separated with first opening between first and the second portion and is electrically insulated from each other; First insulation course is positioned on first lead; At least one second lead is positioned on first insulation course, the interlaced with each other and electrical isolation with the second portion of first lead; Middle conductive structure is positioned on first insulation course and with second lead and is electrically insulated from each other; Second insulation course is positioned on second lead; And first conductive structure, be positioned on second insulation course and conductive structure in the middle of being electrically connected, first, and second portion.
Further embodiment of this invention provides a kind of LCD, comprises one of above-mentioned panel.
The embodiment of the invention is destroyed the insulation course of cross-over connection place by having earlier and the part of the staggered cross-over connection of other leads and other part electrical isolation of lead to avoid the static discharge electric charge during technology.Then, form conductive structure and make the conducting of whole piece lead.Can effectively avoid or reduce the injury that the static discharge phenomenon is caused, and make each lead successfully transmit signal according to its function.
Description of drawings
Figure 1A and Figure 1B show the top view and the sectional view of this case a kind of panel known for inventor respectively;
Fig. 2 A to Fig. 2 G shows the synoptic diagram and the process section of the panel formation method of one embodiment of the invention;
Fig. 3 A to Fig. 3 C shows the sectional view of the panel of another embodiment of the present invention;
Fig. 4 A to Fig. 4 B shows the process section of the panel of further embodiment of this invention;
Fig. 5 A to Fig. 5 B shows the synoptic diagram of the panel of further embodiment of this invention;
Fig. 6 A to Fig. 6 B shows the synoptic diagram of the panel of further embodiment of this invention.
Drawing reference numeral
100,200～substrate;
G1, G2, G3, G4, G5, G6, S1, S2, S3, S4, S5, S6,206,204～lead;
102,106,101～insulation course;
10～contact hole;
C1, C2, C3, C4, C5～cross-over connection place;
G1,206a～first;
G2,206b～second portion;
G3,206c～third part;
12,12 '～opening;
104～middle conductive structure;
108,208a, 208b, 208c～conductive structure;
120a, 120b, 122a, 122b～perforation;
PX～pixel region;
210～pixel;
D1, D2～direction.
Embodiment
Below will describe the making and the use-pattern of the embodiment of the invention in detail.So it should be noted, the invention provides many inventive concepts of supplying usefulness, it can multiple specific pattern be implemented.The specific embodiment of discussing of giving an example in the literary composition only is to make and use ad hoc fashion of the present invention, and is non-in order to limit the scope of the invention.In addition, in different embodiment, may use the label or the sign of repetition.These only repeat to have any relevance in order simply clearly to narrate the present invention, not represent between the different embodiment that discussed and/or the structure.Moreover, when address that one first material layer is positioned on one second material layer or on the time, comprise that first material layer directly contacts with second material layer or be separated with the situation of one or more other materials layers.
Before entering explanation of the present invention, cooperate Figure 1A to Figure 1B to narrate this case a kind of panel construction known for inventor earlier, it should be noted that the following description only is used for showing the problem that the inventor finds.
Figure 1A shows the local top view of a panel, and Figure 1B shows the panel sectional view of the tangent line a to a ' in Figure 1A.Panel comprises substrate 100 and is formed at many conducting wires on the substrate 100.These conducting wires comprise many on the whole longitudinal extension and the lead G1 to G6 that are electrically insulated from each other, and many on the whole horizontal expansion and the lead S1 to S6 that are electrically insulated from each other.Be separated with insulation course 102 between lead G1 to G6 and the lead S1 to S6.Wherein, lead S1 is electrically connected with lead G1 by the contact hole 10 in the insulation course 102 of lead G1 top.Similarly, layer conductor G2 to G6 also is electrically connected with corresponding topping wire S2 to S6 respectively in the same manner under all the other.As shown in the figure, lead S2 to S6 crosses over lead G1, and it has a plurality of cross-over connection place C1 to C5 each other.
During panel technology, may produce the static discharge phenomenon, discharge institute's electric charge of giving birth to may be along lead G1 mobile and arrival cross-over connection place C1 to C5, cause the insulation course 102 of cross-over connection place to be damaged because of static discharge, make between each lead that should be electrically insulated from each other and be short-circuited, for example be lead G1 and lead S2 ... or S6 influences the normal signal transmission.
For improving the described electrostatic discharge problem of Figure 1A to Figure 1B, the embodiment of the invention provides a kind of formation method of panel, can avoid static discharge to take place in cross-over connection place.Below, will cooperate the formation method of the panel of Fig. 2 A to Fig. 2 G explanation one embodiment of the invention.
Please refer to Fig. 2 A, the intermediate steps top view when it shows the panel that forms this embodiment.Shown in Fig. 2 A, this panel comprises lead G1, and it has the g1 of first, second portion g2, reaches third part g3.Panel also comprises lead S1, S2, reaches S3, wherein is separated with the insulation course (not shown) between lead S1 to S3 and the lead G1.Lead S1 is electrically connected with lead G1 by the contact hole 10 in the insulation course.Then be electrically insulated from each other as for lead S2, S3 with the staggered cross-over connection of lead G1.Be similar to shown in Figure 1A and Figure 1B, have cross-over connection place C1 and C2 respectively between lead S2, S3 and lead G1, it is to be subject to the zone that the static discharge electric charge destroys.In this embodiment, be electrically insulated from each other because of being separated with first opening 12 between g1 of first and the second portion g2, and also be electrically insulated from each other between second portion g2 and the third part g3 because of being separated with second opening 12 '.The embodiment of the invention forms opening because of two ends or at least one end prior to predetermined cross-over connection place among the lead G1, can make the static discharge of being given birth to during the subsequent technique isolated and be unlikely to conduct to cross-over connection place by opening, can effectively reduce or avoid the static discharge phenomenon to take place, and avoid being short-circuited between circuit in cross-over connection place.Below, conjunction with figs. is described in detail the series of process sectional view of the panel of this embodiment.
Fig. 2 B to Fig. 2 F shows the series of process sectional view that the tangent line a to a ' corresponding to Fig. 2 A locates.Shown in Fig. 2 B, at first provide substrate 100.Substrate 100 can be a transparent substrates, for example is glass substrate.Then, form the first lead G1 on substrate 100, it has g1 of first and second portion g2.The formation of the first lead G1 is included in and forms conductive material on the substrate 100 earlier, and it is patterned as the first lead G1.Can when Patternized technique, in first lead, form first opening 12 simultaneously, so that the first lead G1 is divided into g1 of first insulated from each other and second portion g2.In one embodiment, also can be further when Patternized technique, in first lead, form second opening 12 ', further to isolate the third part g3 (shown in Fig. 2 A) with second portion g2 electrical isolation.The formation of the first lead G1 can form in same technology by the All other routes in panel.For example, the first lead G1 can form simultaneously with the sweep trace in the panel, and promptly the first lead G1 and sweep trace are to be got by same conductive layer patternization.Perhaps, in other embodiments, the first lead G1 itself is wherein sweep trace.
Then, shown in Fig. 2 C, go up formation first insulation course 102 in the first lead G1, insulation course 102 can further be inserted among the g1 of first and first opening 12 between the second portion g2 of the first lead G1.In subsequent technique, will on first insulation course 102, form many leads.In part embodiment, the first lead G1 can be electrically connected (so nonessential) with one of many leads on first insulation course 102.At this moment, can be in advance prior to reserving contact hole 10 in first insulation course 102.General Patternized technique can be for example adopted in the formation of contact hole 10.
Shown in Fig. 2 D, then on first insulation course 102, form conductive material, and with its patterning.In this embodiment, can distinguish patterning forms lead S 1, the second lead S2, reaches middle conductive structure 104.Wherein, lead S1 is electrically connected with the first lead G1 by contact hole 10, can be considered the extension of first lead.The bearing of trend of the second lead S2 is different with the first lead G1 and cross-over connection is staggered each other, for example is on the whole being perpendicular to one another shown in Fig. 2 A.Be separated with first insulation course 102 between the second portion g2 of the second lead S2 and the first lead G1 and be electrically insulated from each other.When patterning formed the second lead S2, the alternative middle conductive structure 104 of formation near the insulation course 102 first opening, 12 tops simultaneously that is to say that the middle conductive structure 104 and the second lead S2 form with one deck.Middle conductive structure 104 can not need to extend towards a certain specific direction as the second lead S2, and it for example can be a rectangular conductive block.In one embodiment, first insulation course 102 directly contacts with the first lead G1 and the second lead S2 respectively.In addition, the formation of the second lead S2 can form in same technology by the All other routes in panel.For example, the second lead S2 can form simultaneously with the data line in the panel, and promptly the second lead S2 and data line are to be got by same conductive layer patternization.Perhaps, in other embodiments, the second lead S2 itself is wherein data line.
Then, shown in Fig. 2 E, go up formation second insulation course 106 in the second lead S2.In this embodiment, second insulation course 106 also covers lead S 1 and middle conductive structure 104.
Shown in Fig. 2 F, then first insulation course 102 and second insulation course, 106 patternings are bored a hole 120b to expose g1 of first and second portion g2 respectively to form at least one first perforation 120a and at least one second, such as Fig. 2 F example, the first perforation 120a exposes the g1 of first of the first lead G1, and the second perforation 120b exposes the second portion g2 of the first lead G1.In this embodiment, also comprise second insulation course, 106 patternings of middle conductive structure 104 tops to form one the 3rd perforation 122a (or 122b), conductive structure 104 in the middle of expose the bottom of the 3rd perforation at least.At this embodiment is to have formed two the 3rd perforation, is respectively 122a and 122b.
By the explanation of Fig. 2 B to Fig. 2 F as can be known, in the forming process of panel, experience the technology of many depositions and patterning.The static discharge phenomenon is easy in carrying out produce during these technologies.Because the embodiment of the invention in advance prior to forming opening among the first lead G1, for example is first opening 12 and second opening 12 ' (please refer to Fig. 2 A).Therefore, the static discharge electric charge that is produced from other parts of panel only can conduct to g1 of first or third part g3, and the static discharge electric charge will be subjected to the isolated of opening and can't conduct to second portion g2 afterwards.Nature can significantly reduce the chance of the cross-over connection place C1 generation static discharge between the second portion g2 and the second lead S2, can significantly promote technological quality.Though the opening 12 and 12 ' shown in Fig. 2 A is all and the two ends of other lead cross-over connections place (as C1, C2) that are formed among the first lead G1, the right embodiment of the invention is not limited thereto.In other embodiments, but multiform become to be opened between cross-over connection place, be not limited to be formed at the two ends of all cross-over connections place, can further reduce the probability that static discharge betides cross-over connection place between lead.
Then, shown in Fig. 2 G, on second insulation course 106, form conductive material and with its patterning to form the conductive structure 108 that is electrically connected g1 of first and second portion g2.In this embodiment, conductive structure 108 is that branch is made left and right sides two parts, and it inserts perforation 120a, 122a and perforation 120b, 122b respectively.In this embodiment, middle conductive structure 104 is as middle conduction bridge, and further by the conductive structure 108 in perforation the g1 of first is electrically connected with second portion g2.After conductive structure 108 is electrically connected, can make electric signal be able between g1 of first and second portion g2, transmit.Please refer to Fig. 2 A, also can form the conductive structure that is similar among Fig. 2 G, make electric signal be able between second portion g2 and third part g3, transmit in the position of second opening 12 '.In addition, the formation of conductive structure 108 can form in same technology by the All other routes in panel.For example, conductive structure 108 can form simultaneously with the pixel electrode in the panel, and promptly conductive structure 108 is to be got by same conductive layer patternization with pixel electrode.
The embodiment of the invention is by being opened on the one or both ends of cross-over connection place prior to formation in the lead, lead is divided into the part that several are electrically insulated from each other, can make the static discharge electric charge that is produced in the follow-up various technology can't conduct to cross-over connection place, effectively avoid or reduce the static discharge phenomenon taking place in cross-over connection place.After several technology of easily giving birth to the static discharge electric charge is finished, just form conductive structure the each several part of lead is electrically connected, make electric signal transmitted.
In the embodiment of the invention, various form can be arranged in order to the g1 of first of electrical connecting wire G1 and conductive structure 108 and/or the middle conductive structure 104 of second portion g2 (or second portion g2 and third part g3).3A to 3C figure enumerates the form of part.
Local panel sectional view as shown in Figure 3A, the structural similarity of itself and Fig. 2 G, difference is among Fig. 3 A embodiment, tool 1 the 3rd perforation 122a only, and conductive structure 108 is not divided into left and right sides two parts.Fig. 3 B and Fig. 3 C show two kinds of possible conductive structure forms in addition.In the structure of Fig. 3 B, do not form perforation in the top of middle conductive structure 104, directly be electrically connected g1 of first and second portion g2 with conductive structure 108.In the structure of Fig. 3 C, do not have middle conductive structure 104, and directly be electrically connected g1 of first and second portion g2 yet with conductive structure 108.As mentioned above, in the panel of the embodiment of the invention, the conductive structure that is electrically connected g1 of first and second portion g2 (or second portion g2 and third part g3) is not limited to any particular form or structure.
In addition, though among the embodiment of Fig. 2 A to Fig. 2 G and Fig. 3 A to Fig. 3 C, g1 of first and second portion g2 are on the plane of more or less the same height each other.The right embodiment of the invention is not limited thereto.In other embodiments, the first of first lead is on the plane of differing heights each other with the second portion of part.For example, in the embodiment shown in Fig. 4 A, the g1 of first of the first lead G1 and the second portion g2 of part are on the plane of differing heights each other.The embodiment of Fig. 4 A also comprises an insulation course 101, and the second portion g2 of part is positioned at upward being in each other on the plane of differing heights with the g1 of first of insulation course 101.In this case, still can be by in the first lead G1, forming first opening 12 of electrical isolation g1 of first and second portion g2, with the static discharge charge-conduction avoiding being produced during the technology to cross-over connection place C1, C2.So, can protect the insulation course 102 of cross-over connection place C1, C2 to avoid being subjected to the destruction of static discharge, make the transmission of signal be able to smooth and easy.Then, please refer to Fig. 4 B, can form the perforation 120a and the 120b that expose g1 of first and second portion g2 respectively, and then on second insulation course 106, form conductive structure 108.Conductive structure 108 is further inserted among perforation 120a and the 120b and g1 of first and second portion g2 is electrically connected to each other, and makes electric signal transmitted.
In the above-described embodiments, first opening 12 and/or second opening 12 ' can be arranged in a non-pixel region of panel.The opening of the right embodiment of the invention also can be formed in the panel pixels district.
Fig. 5 A to Fig. 5 B shows in the panel of the embodiment of the invention, and opening is formed at embodiment in the pixel region.Shown in Fig. 5 A, panel comprises substrate 200, is formed with many first leads 206 that on the whole extend towards a first direction D1 on it.In this embodiment, first lead 206 for example is the sweep trace of many longitudinal extensions.Similar to previous embodiment, when patterning forms first lead 206, can in first lead 206, form opening 12 and 12 ' (seeing also Fig. 2 A), first lead 206 is divided into the 206a of first, the second portion 206b that are electrically insulated from each other, and third part 206c.So, Patternized techniques such as follow-up various depositions, photoetching and etching with form the insulation course (not shown) with many on the whole during second lead 204 of second direction D2 extension, the static discharge electric charge can't conduct to staggered cross-over connection place between first lead 206 and second lead 204.In this embodiment, second lead 204 for example is the data line of many horizontal expansions.First lead 206 and second lead 204 define a pixel region PX of panel jointly.
Shown in Fig. 5 A, opening is that the two ends that are formed at all cross-over connections place can not conduct to all cross-over connections place to guarantee the static discharge electric charge.In other words, do not have the lead that on the whole extends directly over the 206a of first of first lead 206, and do not have the lead that on the whole extends D2 directly over the third part 206c yet towards second direction towards second direction D2.In this embodiment, because opening (12 and 12 ') is the two ends that are formed at all cross-over connections place, therefore staggered cross-over connection place between first lead 206 and second lead 204 only limits on the second portion 206b.
Then, shown in Fig. 5 B, can then carry out various technologies in pixel region, to form pixel 210, and during forming pixel 210, form the first conductive structure 208a that is electrically connected 206a of first and second portion 206b, and the second conductive structure 208b that is electrically connected second portion 206b and third part 206c.The first conductive structure 208a and the second conductive structure 208b can for example form when forming the pixel electrode of pixel 210 simultaneously.
Fig. 6 A to Fig. 6 B shows the synoptic diagram of the panel of other embodiments of the invention.As shown in Figure 6A, reach cross-over connection place to avoid the static discharge electric charge, also can in second lead 204 that for example is data line, form opening and reach cross-over connection place to avoid the static discharge electric charge except in first lead 206 that for example is sweep trace, forming opening.Similarly, after each technology is finished, can further form conductive structure 210a and 210b so that each several part conducting in second lead 204.In the embodiment of Fig. 6 A, the opening of each lead also is formed at the two ends of all cross-over connections place of this lead and other leads.
In the embodiment of Fig. 6 B, the opening of lead is not limited to be formed at the two ends of all cross-over connections place of this lead and other leads.In this embodiment, also can be in forming opening between cross-over connection place, can further avoid betiding the insulation course that static discharge electric charge between cross-over connection place reaches cross-over connection place.Then, can further form conductive structure 208c with lead 206 conductings.
The embodiment of the invention is destroyed the insulation course of cross-over connection place by having earlier and the part of the staggered cross-over connection of other leads and other part electrical isolation of lead to avoid the static discharge electric charge during technology.Then, form conductive structure and make the conducting of whole piece lead.Can effectively avoid or reduce the injury that the static discharge phenomenon is caused, and make each lead successfully transmit signal according to its function.
The present invention more discloses a kind of LCD, comprises the panel of the various embodiments described above, and subtend substrate and liquid crystal layer are between panel and substrate.
Though the present invention discloses as above with several preferred embodiments; right its is not in order to limit the present invention; technical field technician under any; without departing from the spirit and scope of the present invention; when can changing arbitrarily and retouching, so protection scope of the present invention attached claims scope before look defines and is as the criterion.
Claims (26)
1. the formation method of a panel is characterized in that, described formation method comprises:
One substrate is provided;
On described substrate, form one first lead, described first lead has a first and a second portion, described first and described second portion are electrically insulated from each other, described first lead also has one first opening, and described first opening is electrically insulated from each other described first and described second portion;
On described first lead, form one first insulation course;
On described first insulation course, form at least one second lead, with the interlaced with each other and electrical isolation of described second portion of described first lead;
On described second lead, form one second insulation course; And
Form one first conductive structure on described second insulation course, described first conductive structure is electrically connected described first and described second portion.
2. the formation method of panel as claimed in claim 1, it is characterized in that, described first lead also has a third part, described third part and described first and described second portion are electrically insulated from each other, wherein said first lead also has one second opening, and described second opening is electrically insulated from each other described second portion and described third part.
3. the formation method of panel as claimed in claim 1, it is characterized in that, described first lead also has a third part, described third part and described first and described second portion are electrically insulated from each other, described formation method also is included in and forms one second conductive structure on described second insulation course, and described second conductive structure is electrically connected described third part and described second portion.
4. the formation method of panel as claimed in claim 1 is characterized in that, the step that forms described first conductive structure on described second insulation course comprises:
Described first insulation course and described second insulating layer patternization are bored a hole to form at least one first perforation and one second, the described first that described first lead is exposed in described first perforation, the described second portion of described first lead is exposed in described second perforation; And
Form a conductive material on described second insulation course, described conductive material is inserted and is formed described first conductive structure in described first perforation and described second perforation.
5. the formation method of panel as claimed in claim 1, it is characterized in that, conductive structure in the middle of described formation method also is included in and forms one on described first insulation course, conductive structure and described second lead are electrically insulated from each other in the middle of described, and the step that wherein forms described first conductive structure on described second insulation course comprises:
Described first insulation course and described second insulating layer patternization are bored a hole to form at least one first perforation and one second, the described first that described first lead is exposed in described first perforation, the described second portion of described first lead is exposed in described second perforation;
To form at least one the 3rd perforation, described middle conductive structure is exposed in described the 3rd perforation with described second insulating layer patternization; And
On described substrate, form a conductive material, described conductive material insert described first perforation, described second perforation, and described the 3rd perforation in and form described first conductive structure.
6. the formation method of panel as claimed in claim 5 is characterized in that, described middle conductive structure and described second lead are to form simultaneously.
7. the formation method of panel as claimed in claim 1 is characterized in that, described formation method also comprises:
Form that the one scan line is on described substrate at least, wherein said first lead and described sweep trace are to form simultaneously;
Form at least one data line on described substrate, wherein said two leads and described data line are to form simultaneously; And
Form at least one pixel electrode on described substrate, wherein, described first conductive structure and described pixel electrode are to form simultaneously.
8. the formation method of panel as claimed in claim 1 is characterized in that, described first lead is the one scan line in the described panel, and described second lead is the data line in the described panel.
9. the formation method of panel as claimed in claim 1 is characterized in that, the described first of described first lead is on the plane of differing heights each other with the described second portion of part.
10. the formation method of panel as claimed in claim 1 is characterized in that, described first insulation course directly contacts with described first lead and described second lead respectively.
11. a panel is characterized in that, described panel comprises:
One substrate;
One first lead, be positioned on the described substrate, described first lead has a first, one first opening and a second portion, is separated with described first opening between described first and the described second portion and is electrically insulated from each other, and wherein said first opening is arranged in a non-pixel region;
One first insulation course is positioned on described first lead;
At least one second lead is positioned on described first insulation course, with the interlaced with each other and electrical isolation of described second portion of described first lead;
One second insulation course is positioned on described second lead; And
One first conductive structure is positioned on described second insulation course and is electrically connected described first and described second portion.
12. panel as claimed in claim 11, it is characterized in that, described panel also comprises one first perforation and one second perforation, expose described first and described second portion respectively, and described first conductive structure of part is filled among described first perforation and described second perforation and is electrically connected described first and described second portion.
13. panel as claimed in claim 11, it is characterized in that, described first lead also has a third part and one second opening, be separated with described second opening between described third part and the described second portion and be electrically insulated from each other, and described third part and described first are electrically insulated from each other, described panel also comprises one second conductive structure, is positioned on described second insulation course, and is electrically connected described second portion and described third part.
14. panel as claimed in claim 11 is characterized in that, described panel also comprises a middle conductive structure, is positioned on described first insulation course and with described second lead to be electrically insulated from each other, and wherein said first conductive structure is electrically connected with described middle conductive structure.
15. panel as claimed in claim 11 is characterized in that, the described first of described first lead is on the plane of differing heights each other with the described second portion of part.
16. panel as claimed in claim 11 is characterized in that, described first insulation course directly contacts with described first lead and described second lead respectively.
17. a panel is characterized in that, described panel comprises:
One substrate;
One first lead is positioned on the described substrate, and extends towards a first direction, and described first lead has a first, one first opening and a second portion, is separated with described first opening between described first and the described second portion and is electrically insulated from each other;
One first insulation course is positioned on described first lead;
A plurality of second leads are positioned on described first insulation course, and all extend towards a second direction, each described a plurality of second lead all respectively with the interlaced with each other and electrical isolation of described second portion of described first lead;
One second insulation course is positioned on described a plurality of second lead; And
One conductive structure is positioned on the described substrate and is electrically connected described first and described second portion;
Wherein, the described first of described first lead directly over do not have the lead that extends towards described second direction.
18. panel as claimed in claim 17, it is characterized in that, described panel also comprises one first perforation and one second perforation, expose described first and described second portion respectively, and described first conductive structure of part is filled among described first perforation and described second perforation and is electrically connected described first and described second portion.
19. panel as claimed in claim 17, it is characterized in that, described first lead also has a third part and one second opening, be separated with described second opening between described third part and the described second portion and be electrically insulated from each other, and described third part and described first are electrically insulated from each other, do not have the lead that extends towards described second direction directly over the described third part, described panel also comprises one second conductive structure, be positioned on described second insulation course, and be electrically connected described second portion and described third part.
20. panel as claimed in claim 17, it is characterized in that, described panel also comprises a middle conductive structure, is positioned on described first insulation course and with described a plurality of second leads to be electrically insulated from each other, and wherein said first conductive structure is electrically connected with described middle conductive structure.
21. panel as claimed in claim 17 is characterized in that, the described first of described first lead is on the plane of differing heights each other with the described second portion of part.
22. panel as claimed in claim 17 is characterized in that, described first insulation course directly contacts with described first lead and described second lead.
23. a panel is characterized in that, described panel comprises:
One substrate;
One first lead is positioned on the described substrate, and described first lead has a first, one first opening and a second portion, is separated with described first opening between described first and the described second portion and is electrically insulated from each other;
One first insulation course is positioned on described first lead;
At least one second lead is positioned on described first insulation course, with the interlaced with each other and electrical isolation of described second portion of described first lead;
Conductive structure in the middle of one is positioned on described first insulation course and with described second lead and is electrically insulated from each other;
One second insulation course is positioned on described second lead; And
One first conductive structure, be positioned on described second insulation course and be electrically connected described in the middle of conductive structure, described first, and described second portion.
24. panel as claimed in claim 23, it is characterized in that, described first lead also has a third part and one second opening, be separated with described second opening between described third part and the described second portion and be electrically insulated from each other, and described third part and described first are electrically insulated from each other, described panel also comprises one second conductive structure, is positioned on described second insulation course, and is electrically connected described second portion and described third part.
25. panel as claimed in claim 23 is characterized in that, described first insulation course directly contacts with described first lead and described second lead respectively.
26. a LCD is characterized in that, described LCD comprises as the described panel of each claim in the claim 11 to 25.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101454585A CN101562149B (en) | 2009-06-01 | 2009-06-01 | Panel, liquid crystal display and formation method of panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101454585A CN101562149B (en) | 2009-06-01 | 2009-06-01 | Panel, liquid crystal display and formation method of panel |
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| Publication Number | Publication Date |
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| CN101562149A CN101562149A (en) | 2009-10-21 |
| CN101562149B true CN101562149B (en) | 2010-09-15 |
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| CN108198786B (en) * | 2017-12-29 | 2020-09-18 | 深圳市华星光电技术有限公司 | TFT array substrate overline structure and manufacturing method thereof |
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