CN101545060A - Method for preparing copper porous material - Google Patents
Method for preparing copper porous material Download PDFInfo
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- CN101545060A CN101545060A CN200910136734A CN200910136734A CN101545060A CN 101545060 A CN101545060 A CN 101545060A CN 200910136734 A CN200910136734 A CN 200910136734A CN 200910136734 A CN200910136734 A CN 200910136734A CN 101545060 A CN101545060 A CN 101545060A
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- porous material
- chromiumcopper
- copper porous
- copper
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Abstract
The present invention discloses a method for preparing copper porous material, wherein the method comprises the following steps: (1) polishing the surface of copper chromium alloy with fine metallographical sandpaper, then flushing with clean water, after degreasing the absolute ethyl alcohol, drying the absolute ethyl alcohol in the temperature of 40-60DEG C; (2) immersing the surface-treated copper chromium alloy in H2SO4 solution which has a concentration of 2.5-3.0mol/liter and contains 15-20g of NaCl in per liter of H2SO4 and is in the temperature of 20-40 DEG C; and (3) under the ultrasonic oscillation with oscillation frequency of 40-80KHz, generating de-chromium corrosion, after the de-chromium corrosion is finished, flushing the alloy with clean water and drying, and the copper porous material can be obtained. The method of the invention has the advantages of simple technique, easy operation, and prepared copper porous material with the advantages of high porosity, uniform pore distribution, stable and reliable quality, etc. The method of the invention is suitable for industrial batch production.
Description
Technical field
The present invention relates to a kind of metal material field, particularly relate to a kind of preparation method of copper porous material.
Background technology
Porous metal material is a kind of functional structure material that has function and structure double attribute concurrently of development in recent years, such material has good energy absorption performance, high damping properties, sound absorbing capabilities and good heat-conductivity conducting performance, and density is little, specific surface area is big, becomes one of focus direction of present material class research.At present, the method for preparing porous metal material has following several: (1) liquid phase method: mainly contain particle THROUGH METHOD, microcast process, molten metal foaming and hollow ball casting.Adopt this method can prepare that porosity height, size are big, the porous metal of unicellular structure, but preparation process control is comparatively complicated, the pore structure distributing homogeneity is not high.(2) powder metallurgic method: mainly comprise powder sintered foaming, sintering-precipitation method, loose powder sintering method and hollow ball sintering process etc.The advantage of this method is that technology is simple, cost is low, and shortcoming is that the strength of materials is low.(3) sedimentation: mainly comprise three kinds of metal gas evaporation sedimentation, atom sputtering sedimentation and electrochemical deposition methods.Adopting the characteristics of sedimentation method is that porosity height and void distribution are very even, but the cost height, production process is long, and operational condition is strict.
Summary of the invention
For deficiency such as overcome that pore structure skewness, the strength of materials that prior art exists are low, production process is long and operational condition is strict, the invention provides a kind of preparation method of copper porous material, this method technology is simple, and cost is low, even pore distribution, reliable in quality.
The technical solution adopted for the present invention to solve the technical problems is: with high strength chromiumcopper material, adopt and take off alloy technology and remove chromium element in the chromiumcopper, to prepare copper porous material.Concrete processing step is as follows:
1, selecting the Cr constituent content for use is the chromiumcopper that 10~70% (massfractions) and Cr exist with particulate state.
2, with thin abrasive paper for metallograph copper-chromium alloy surface is polished earlier, use flushing with clean water then, use the dehydrated alcohol degreasing, 40~60 ℃ of oven dry processing down.
3, the chromiumcopper after the surface treatment is immersed in the H that concentration is 2.5~3.0 mol
2SO
4In the solution, and every liter of H
2SO
4Add 15~20 gram NaCl in the solution.
4, at H
2SO
4Solution temperature is 20~40 ℃, and oscillation frequency is under 40~80KHz ultra-sonic oscillation, and this chromiumcopper takes off chromium corrosion, waits to take off after the chromium corrosion finishes, and takes out laboratory sample, use flushing with clean water, and the oven dry processing can obtain copper porous material.
The invention has the beneficial effects as follows: technology simply is easy to control, and adopts this processing method prepared copper porous material porosity height and even pore distribution, and steady quality is reliable, is suitable for industrial production in batches.
Description of drawings
Fig. 1 is the metallographic structure of casting copper chrome copper;
Fig. 2 is embodiment 1 a copper porous material surface SEM photo;
Fig. 3 is embodiment 2 a copper porous materials surface SEM photo.
Embodiment:
Embodiment 1
Selecting Cr element massfraction for use is 40% chromiumcopper, and wherein the Cr element in the chromiumcopper exists with particulate state.With 1000
#Abrasive paper for metallograph polishing chromiumcopper specimen surface, specimen size is 10mm * 10mm * 3mm, uses flushing with clean water again, dehydrated alcohol degreasing and oven dry under 20 ℃.Then the chromiumcopper sample after the surface treatment being immersed in concentration is 2.7 mol, contains 1 liter of H of the NaCl of 20 grams
2SO
4Solution in, wherein solution temperature is 25 ℃, oscillation frequency is 70KHz, after soaking 20 hours, takes out laboratory sample, use flushing with clean water, the oven dry processing can obtain copper porous material.
Embodiment 2
Selecting Cr element massfraction for use is 50% chromiumcopper, and wherein the Cr element in the chromiumcopper exists with particulate state.With 1000
#Abrasive paper for metallograph polishing chromiumcopper specimen surface, specimen size is 10mm * 10mm * 3mm, uses flushing with clean water again, dehydrated alcohol degreasing and oven dry under 40 ℃.Then the chromiumcopper sample after the surface treatment being immersed in concentration is 3.0 mol, contains 1 liter of H of the NaCl of 15 grams
2SO
4Solution in, wherein solution temperature is 30 ℃, oscillation frequency is 40KHz, after soaking 15 hours, takes out laboratory sample, use flushing with clean water, the oven dry processing can obtain copper porous material.
Find through Neophot21 metallography microscope sem observation, the tissue of chromiumcopper is by Cu phase and Cr phase composite, wherein Cr is distributed in (see figure 1) in the Cu matrix with irregular particulate state, embodiment 1 and embodiment 2 obtain in the copper porous material, the Cr particle is taken off from the tissue of chromiumcopper fully, organizing of material only is promptly to form copper porous material by the Cu matrix in hole with holes.The aperture of copper porous material is about 25~40 μ m, and distribution uniform, its porosity (30~50%) relevant with the Cr granule content (seeing Fig. 2,3).
Claims (1)
1. the preparation method of a copper porous material is characterized in that: said method comprising the steps of:
(1) selecting Cr element massfraction for use is 10~70% chromiumcopper, and wherein the Cr element in the chromiumcopper exists with particulate state;
(2) with thin abrasive paper for metallograph copper-chromium alloy surface is polished earlier, use flushing with clean water then, after the dehydrated alcohol degreasing, 40~60 ℃ of oven dry processing down;
(3) again the chromiumcopper after the surface treatment is immersed in the H that concentration is 2.5~3.0 mol
2SO
4In the solution, described every liter of H
2SO
4Contain 15~20 gram NaCl in the solution;
(4) at H
2SO
4Solution temperature is 20~40 ℃, and oscillation frequency is under 40~80KHz ultra-sonic oscillation, and this chromiumcopper takes off chromium corrosion, waits to take off after the chromium corrosion finishes, and use flushing with clean water, and the oven dry processing can obtain copper porous material.
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CN2009101367341A CN101545060B (en) | 2009-05-14 | 2009-05-14 | Method for preparing copper porous material |
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CN2009101367341A CN101545060B (en) | 2009-05-14 | 2009-05-14 | Method for preparing copper porous material |
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CN101545060A true CN101545060A (en) | 2009-09-30 |
CN101545060B CN101545060B (en) | 2010-10-27 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104630537A (en) * | 2015-02-11 | 2015-05-20 | 山东大学 | Method for preparing germanium porous material |
CN106521501A (en) * | 2016-12-05 | 2017-03-22 | 河北工业大学 | Brass alloy with macro-hole, micron-hole and nano-hole hierarchical hole structure and application thereof |
CN108061754A (en) * | 2017-11-28 | 2018-05-22 | 清华大学 | The caustic solution of nickel base superalloy surface microstructure pattern |
WO2020124840A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Substrate and display panel |
CN113865953A (en) * | 2021-08-26 | 2021-12-31 | 唐山钢铁集团有限责任公司 | Method for displaying and evaluating grain boundary carbide in low-carbon stamping steel by metallographic method |
-
2009
- 2009-05-14 CN CN2009101367341A patent/CN101545060B/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104630537A (en) * | 2015-02-11 | 2015-05-20 | 山东大学 | Method for preparing germanium porous material |
CN106521501A (en) * | 2016-12-05 | 2017-03-22 | 河北工业大学 | Brass alloy with macro-hole, micron-hole and nano-hole hierarchical hole structure and application thereof |
CN108061754A (en) * | 2017-11-28 | 2018-05-22 | 清华大学 | The caustic solution of nickel base superalloy surface microstructure pattern |
WO2020124840A1 (en) * | 2018-12-18 | 2020-06-25 | 武汉华星光电半导体显示技术有限公司 | Substrate and display panel |
CN113865953A (en) * | 2021-08-26 | 2021-12-31 | 唐山钢铁集团有限责任公司 | Method for displaying and evaluating grain boundary carbide in low-carbon stamping steel by metallographic method |
CN113865953B (en) * | 2021-08-26 | 2023-10-31 | 唐山钢铁集团有限责任公司 | Method for displaying and evaluating grain boundary carbide in low-carbon stamping steel by metallographic method |
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