CN101543974A - Grinding unit and grinding method for magnetic head slider - Google Patents
Grinding unit and grinding method for magnetic head slider Download PDFInfo
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- CN101543974A CN101543974A CN200810087035A CN200810087035A CN101543974A CN 101543974 A CN101543974 A CN 101543974A CN 200810087035 A CN200810087035 A CN 200810087035A CN 200810087035 A CN200810087035 A CN 200810087035A CN 101543974 A CN101543974 A CN 101543974A
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Abstract
The invention provides a grinding device and a grinding method for inhibiting deviation of grinding quantity of an element in a surface processing grinding process after an element height forming grinding process. The magnetic head slider grinding device 1 comprises a grinding head 2, a support structure, a base and a decompression structure, wherein the grinding head 2 can compress and support an element to be a magnetic head slider S on a rotating grinding flat pan; the support structure is provided with a first embedding part 12 extended along the vertical direction, and supports the grinding head; the base is provided with a second embedding part 13 extended along the vertical direction, and supports the support structure; the second embedding part 13 and the first embedding part 12 are mutually embedded, and an inner space is formed between the second embedding part 13 and the first embedding part 12; the decompression structure decompresses the inner space; and the support structure is applied with the force of the decompressed inner space along the vertical direction, and the base can movably support the support structure along the vertical direction.
Description
Technical field
The present invention relates to the lapping device and the Ginding process of a kind of head-slider (slider), especially relate to the lapping device and the Ginding process that use in the Surface Machining grinding step after element heights forms grinding step.
Background technology
The middle head-slider that uses of hard disk drive (hard disk drive) is to make through the operations such as grinding step of wafer (wafer) operation that forms read-write elements, the operation of cutting off member block (block) and element bar (bar), formation regulation air bearing face.Grinding step is made up of two to three independent grinding steps usually.
The first step of grinding step is the rough lapping operation of carrying out for the efficient that improves following elements height formation operation.Sometimes also omit this operation.In the rough lapping operation, will be by a plurality of elements of head-slider that will become (hereinafter to be referred as element.) member block and the element bar that form be ground to the read element height near desired value.The read element height is meant the length (depth) of MR (Magnetic Resistance) element with respect to air bearing face vertical direction, is the key factor that realizes middle ideal characterisiticses such as MR rate of change.
Second step of grinding step is to be that the purpose element heights of carrying out forms grinding step with correct formation read element height.This grinding is also referred to as and forms height (height) grinding step.This grinding step is epochmaking for correct formation read element height, and is the Ginding process that a kind of use resistance grinds indication (RLG, Resistance Lapping Guide) constant resistance (resistance) element.This resistive element is pre-formed between each element by the wafer operation, and the two ends of resistive element are electrically connected by element internal and backing plate (pad), and this backing plate is formed on the face different with element bar abradant surface.In process of lapping, measure the resistance value (electrical resistance) of resistive element by backing plate.Owing to simultaneously resistive element and element are ground, the resistance value of component resistance increases along with the carrying out of grinding.Obtain the relation of resistive element amount of grinding and resistance value in advance,, just can learn amount of grinding indirectly at polished element on one side grind by the resistance value of one side monitoring resistor element.
When grinding a plurality of element simultaneously,, also be difficult to avoid the amount of grinding deviation of producing component even use said method to grind.Therefore, disclose recently by a plurality of compressing flat-top (ceiling) and each element is applied optimum pressure power and then suppresses the technology (with reference to patent documentation 1) of amount of grinding deviation corresponding to each element are set.
The final step of grinding step is so-called Surface Machining grinding step, is called contact again and grinds (touchlap) grinding step.The Surface Machining grinding step is to use mirror finish to grind the square position and fully grinds the air bearing face.After finishing surperficial processing grinding operation, remove the cut wound of air bearing face etc., improved the smoothness of air bearing face.At this moment, also formed simultaneously for the very important convex shape of head-slider flight characteristics, this convex shape is called Guan Ding (crown).In the Surface Machining operation, because amount of grinding seldom, and pressure is also very little, so be difficult to amount of grinding itself is monitored.So can only grind through finishing after certain milling time by confirming the grinding rate in advance.As the method for exerting pressure, disclose and form the identical a plurality of flat-tops of use of operation with element heights each element is applied the method (with reference to patent documentation 1) of optimum pressure power, and the easier grinding head at support component (lapping head) is gone up the method (with reference to patent documentation 2) of mounting weight.
Though preferably use grinding square position smooth as far as possible and that level is installed, in fact since grind exist on the square position small uneven, so element can change along with the rotation of grinding square position with respect to the position of grinding square position vertical direction when grinding.When the installation degree of accuracy of grinding the square position horizontal direction was not enough, the position of element vertical direction also can change along with the rotation of grinding the square position during grinding.Specifically, the power (thrust) that is subjected to the self-grind square position to make progress when element element when grinding the square position protuberance increases, and the pressure of element is also increased.When causing grinding the element of a plurality of forms in the prior art Ginding process simultaneously, the variation of this pressure in an element bar, the average pressure of each element is produced deviation.In addition, change continuously because in grinding, grind the square position surface state, so even different elements bar average pressure each other also has deviation.Thereby the flatness of grinding the square position to be maintained smooth and certain state always be extremely difficult.
In case average pressure produces deviation, element under great stress in the worst case may be damaged.In addition, even owing in the Surface Machining grinding step, in fact still can how much produce amount of grinding, so, also might increase deviation on the contrary although specially in element heights formation grinding step, come the straining element height tolerance by fully having ground the surface.Investigation result according to inventor etc. finds that the deviation that the Surface Machining grinding step finishes back element heights (MR height) can worsen about 3nm with respect to the deviation that element heights forms after grinding step finishes.For the progress of magnetic head record densification from now on must be dwindled element heights, and if element heights increase in the Surface Machining grinding step just is difficult to reach the densification of magnetic head record.In addition, if average pressure has deviation, be called that the deviation of height plane difference also might increase around the read-write elements of Pole Tip Recession in Abrasive (PTR, Pole Tip Recession).For example read element is with respect to Al
2O
3The TiC base portion begins to stretching away from direction from the air bearing face, increased and recording medium between distance, be difficult to the characteristic that reads that obtains stipulating.Therefore, the increase of PTR deviation also can cause the deterioration of yield rate.
And if average pressure produces deviation, the square position is from the reaction force that also has been subjected on the position (protuberance) that element has been applied very big pressure from element.This reaction force becomes makes the square position produce the reason of trickle damage, owing to used the square position that has the high degree of accuracy through mirror finish in the Surface Machining grinding step, has therefore caused the square position lost of life.
In view of this, the purpose of this invention is to provide in a kind of Surface Machining grinding step after element heights forms grinding step especially the lapping device and the Ginding process of straining element amount of grinding generation deviation.
Patent documentation 1: Japanese Patent Application Laid-Open 2002-157723 communique
Patent documentation 2: the flat 10-249714 communique of Japanese Patent Application Laid-Open
Summary of the invention
Head-slider lapping device of the present invention comprises: can compress and be supported on grinding head on the grinding square position of rotation to the element that will become head-slider; Be provided with vertically first gomphosis part that extends and support the supporting construction of grinding head; Be provided with vertically second gomphosis part that extends and support the base portion (base) of supporting construction, second gomphosis part and the first gomphosis part tabling also form the inner space between second gomphosis part and first gomphosis part; And the pressure reduction structure in decompressing inner space, supporting construction is subjected to the power that vertically makes progress from post-decompression inner space, the vertically movable support supporting construction of base portion.
So in the head-slider lapping device that constitutes, the element that become head-slider is subjected to the reaction force of self-grind square position in grinding, and this reaction force passes to supporting construction from grinding head.As mentioned above, grind and to exist small unevenly on the square position, element vertical direction position changes along with the position of rotation that grinds the square position.Specifically, when element when the recess that grinds the square position moves on to adjacent protuberance, also rise in element vertical direction position thereupon.But, because rising along with element vertical direction position, first gomphosis part of supporting construction also rises with respect to second gomphosis part, so the grinding square position is absorbed by the inner space that forms between first gomphosis part and second gomphosis part the increase of element reaction force, thereby suppressed the increase of reaction force.Then, when element moves to recess by protuberance once more, first gomphosis part by and second gomphosis part between frictional force rest on the shift position.When element re-moves higher protuberance, same afterwards, first gomphosis part rises.Like this, slowly rise when grinding the square position protuberance at element in the vertical direction position of first gomphosis part, and control is adapted to the most suitable position automatically.Because the amount of movement of first gomphosis part is minimum, the pressure of inner space can change hardly, thereby can not take place because the obstruction that pressure rising in inner space causes moves.In addition, because the amount of movement of first gomphosis part is minimum, so element can be suppressed to Min. to the pressure oscillation of grinding the square position.
Head-slider Ginding process of the present invention comprises: the step of preparing lapping device, this lapping device comprises grinding head, the supporting construction of supporting grinding head that can support the element that will become head-slider, the base portion of supporting supporting construction, this supporting construction is provided with first gomphosis part that vertically extends, this base portion is provided with second gomphosis part that vertically extends, first gomphosis part and the second gomphosis part tabling, and form the inner space between first gomphosis part and second gomphosis part; The component side that uses grinding head support will becoming head-slider is to the support step of grinding the square position; And decompressing inner space, make supporting construction be subjected to the power that vertically makes progress from post-decompression inner space, on the grinding square position that under the state of the vertically movable support supporting construction of base portion element is pressed on rotation, and grind the grinding steps of this element.
In sum, can provide in a kind of Surface Machining grinding step after element heights forms grinding step especially the lapping device and the Ginding process of straining element amount of grinding generation deviation according to the present invention.
Description of drawings
Fig. 1 is the stereogram that has disposed the element bar of a plurality of elements that will become head-slider.
Fig. 2 is the concept map of the head-slider lapping device that relates to of one embodiment of the invention.
Fig. 3 is the structuring concept figure of expression grinding head.
Fig. 4 has represented the syndeton between supporting construction and the base portion, is the summary amplification sectional view of A portion among Fig. 2.
Fig. 5 has represented other syndetons between supporting construction and the base portion, is the summary amplification sectional view of A portion among Fig. 2.
Fig. 6 is the flow chart of the head-slider Ginding process that relates to of expression one embodiment of the invention.
Fig. 7 has represented before the Surface Machining grinding step state of installation elements bar on lapping device, is the concept map of lapping device.
Fig. 8 is an expression effect concept map of the present invention.
Fig. 9 is the pressure concept map compared with prior art of pusher in the embodiment of the invention (pusher).
Figure 10 is the summary construction diagram of element bar, pusher and the rubber slab (rubber sheet) etc. that use among the embodiment.
The specific embodiment
An embodiment to lapping device of the present invention and Ginding process is elaborated with reference to the accompanying drawings.
At first, use present embodiment that polished element is described.Fig. 1 is the stereogram that has disposed the element bar of a plurality of elements that will become head-slider.Element bar B is formed by the cutting of the part of a plurality of element S that form on wafer.Each element S possesses the MR element M as read element.MR element M forms towards the air bearing face, by attrition process to specific element heights.Therefore, the air bearing face of formation MR element M becomes the abradant surface LS of element bar B.Be arranged between the element S of delegation and be provided with element gap (gap) G.Be provided with RLG element R on the element clearance G towards abradant surface LS.The RLG element for example has the identical membrane structure with MR element M, can make simultaneously with the MR element in the wafer operation.RLG element and backing plate (figure does not show) are electrically connected, and the backing plate two ends are arranged on the face different with abradant surface LS.Among the figure, the element clearance G is arranged on one group of continuous element S and another is organized between the continuous element S, but the element clearance G also can be arranged between each element S.In addition, the cutting material between each element S (figure does not show) can also be used as the element clearance G.And,,, also can cut out element bar B from each member block more afterwards if when cutting crystal wafer, be divided into some member block though be to describe as grinding object in this specification with element bar B.At this moment, can also be member block as grinding object.
Fig. 2 is the concept map of the head-slider lapping device that relates to of one embodiment of the invention.This lapping device can be used for the Surface Machining grinding step in the said head slide block grinding step.This lapping device can also be used for element heights and form other grinding step such as grinding step.
The lapping device 1 of head-slider comprises grinding head 2, supports the base portion 4 of the supporting construction 3 and the support supporting construction 3 of grinding head 2.The grinding square position 5 of rotation has been installed on base portion 4.But the abradant surface LS of grinding head 2 support component bar B is towards grinding square position 5.Element bar B is pressed on the grinding square position 5 of rotation and simultaneously it is ground.Among this figure, the length direction of element bar B is the direction that intersects vertically with paper.
Fig. 3 is the structuring concept figure of expression grinding head.Among this figure, the length direction of element bar B is the horizontal direction of paper.Grinding head 2 has the pusher (pusher) 6 that lapping stick B is pressed on a plurality of cylinder shapes on the grinding square position 5 by rubber slab (rubber sheet) G.Pusher 6 be arranged on a plurality of element S separately the installation site directly over.Pusher support sector 8 has the cylinder (cylinder) 9 that holds pusher 6, and by air duct 10 air is sent in the cylinder 9.Among the figure in left side, represented the cross section of pusher 6 and cylinder 9.Can press by the air in the control cylinder 9 pusher is moved in the vertical direction, therefore can control respectively grinding square position 5 applied pressures by each pusher 6.Emphasized among the figure to represent to grind the deformation state of square position 5 on radial direction, the left side is ground square position 5 and is upwards produced some distortion among the figure.At this moment, the length that left side pusher 6 is released from cylinder 9 is shorter, and the length that right side pusher 6 is released from cylinder 9 is longer.That is to say that pusher 6 is transportable with respect to pusher support sector 8, and pusher support sector 8 be set to can not move in vertical direction at least with respect to supporting construction 3.
With reference to Fig. 2, supporting construction 3 is assisted the action of base portion 4 when supporting grinding head 2, according to the vertical direction position of the uneven automatic control align hone head 2 that grinds the square position.Fig. 4 has represented the syndeton of supporting construction and base portion, is the summary amplification sectional view of A portion among Fig. 2.Be provided with the cylinder 12 (first gomphosis part) of vertically extension and upper end open in the upper end of supporting construction 3.On base portion 4, be provided with the piston (piston) 13 (second gomphosis part) that also vertically extends towards cylinder 12.Piston 13 is embedded in the cylinder 12.But piston 13 can not arrive the bottom of cylinder 12, and forms inner space 14 by piston 13 and cylinder 12.Connected air hose (tube) 15 in the inner space 14, the other end of air hose 15 is connected (figure does not show) on the vavuum pump.By the pressure reduction structure that constitutes by air hose 15 and vavuum pump, can be so that the air pressure in the inner space 14 reduces (formation negative pressure) with respect to atmospheric pressure.
In case the air pressure of inner space 14 is reduced, supporting construction 3 just is subjected to the power F that vertically makes progress from the inner space 14 that is depressurized.The size of power F depends on the degree (vacuum) of decompression, and preferably supporting construction 3 and the own wt that is connected in the grinding head 2 of supporting construction 3 roughly can be offset (cancel).Because between piston 13 and cylinder 12, and between the jut 21 of the groove 20 of aftermentioned base portion 4 and supporting construction 3, can produce frictional force, so cylinder 12 has been kept static relatively state with respect to supporting construction 13.Under this state, supporting construction 3 and grinding head 2 can be described as and remain on quick condition, so can move in the vertical direction static then in high sensitivity for the external force of vertical direction.Therefore, base portion 4 has just been supported supporting construction 3 and grinding head 2.
And, in the foregoing description, on supporting construction 3, be provided with cylinder 12, on base portion 4, be provided with cylinder 13, in addition, as shown in Figure 5, cylinder 13a can also be set on supporting construction, and cylinder 12a is set on base portion.In addition, because can not produce power F under the state that is not depressurized in inner space 14, so the brake (stopper schemes not show) that can support supporting construction 3 on base portion 4 preferably is set when non-decompression.This brake can be arranged on the junction surface of cylinder 12 and piston 13, also can be arranged between the jut 21 of the groove 20 of base portion 4 and supporting construction 3.
Refer again to Fig. 2, base portion 4 comprises to be supported and fixing support (frame) portion 16 of grinding square position 5, guiding (guide) portion 18 that can move in the vertical direction with respect to cradle portion 16.Above-mentioned piston 13 (second gomphosis part) is connected with guide portion 18.By being arranged on ball-screw (ball screw) 19a on the cradle portion 16 and being arranged on the guide portion 18 and cradle portion 16 and guide portion 18 being linked together with nut (nut) 19b of ball-screw 19a tabling.Guide portion 18 is the structures that can vertically move with respect to cradle portion 16, need be provided with in the situation in space between grinding head 2 and square position 5 during installation elements bar B etc. on grinding head, and this structure is very useful.The syndeton of cradle portion 16 and guide portion 18 is not limited only to the combining structure of ball-screw 19a and nut 19b, so long as the syndeton that guide portion 18 is vertically relatively moved with respect to cradle portion 16 can.For example, can adopt combination, the linear electric motors arbitrary structures such as (linear motor) of tooth bar (rack) and gear (pinion).
Grind square position 5 and make, and imbedded diamond (diamond) abrasive particle (abrasivegrain) by tin (Sn).Grind and be provided with the rotating shaft (figure does not show) that drives rotation by motor (motor) (figure does not show) on the square position 5.In order to form suitable hat top shape on element S, the edge that grinds square position 5 upwards forms the nick shape.The curvature of for example grinding square position 5 can be from about the 5m to 30m.
Flow chart below with reference to Fig. 6 describes the head-slider Ginding process that has used aforesaid lapping device 1.Usually in the manufacture method of head-slider, use the wafer operation after forming a plurality of elements on the wafer, carry out the above-mentioned rough lapping operation of above-mentioned grinding wafer rear (back side rap) and cutting element piece and element bar.In addition; do not carry out element heights and form grinding step and Surface Machining grinding step; cover DLC (Diamond like Carbon) film thereon in order to protect the air bearing face, and after being separated into head-slider, be connected on the HGA (Head Gimbal Assembly).Because present embodiment is characterised in that Surface Machining grinding step aspect wherein, so in following record, omitted explanation to other operations.But the Ginding process of present embodiment also can be equally applicable to the grinding step beyond the Surface Machining grinding step.
(step 1) is at first prepared above-mentioned lapping device 1.Fig. 7 has represented before the Surface Machining grinding step state of installation elements bar on lapping device, is the concept map of lapping device.In advance by cylinder 12 (first gomphosis part) and the chimeric inner space 14 that forms of piston 13 (second gomphosis part).Guide portion 18 is carried on ball-screw 19a top, and forms the space between grinding head 2 and grinding square position 5.
(step 2) then uses grinding head 2 support component bar B towards grinding square position (support step).Because guaranteed the space of 5 of grinding head 2 and grinding square positions in the step in front, so can utilize this space that element bar B is installed on the grinding head 2.Specifically, at first, by rubber slab G installation elements bar B on grinding head.Grinding head 2 is provided with vacuum absorption device (figure does not show), and this device is supported on element bar B on the grinding head 2 accurately.In addition, contact with detector (probe) in order to detect the resistance change of RLG element R in the grinding, make the backing plate that is arranged on the stick B.And, obtain the amount of grinding of RLG element R and the relation between resistance value in advance.
(step 3) then, swing roller leading screw 19a falls guide portion 18.Reach predetermined distance in case distance detection device 23 detects pusher support sector 8 and grinds between the square position 5, guide portion just stops.This moment, element bar B did not also contact with grinding the square position, ground the position of top a little, square position 5 and be positioned at.Starting grinding square position 5 afterwards makes it rotate with the regulation rotary speed.
(after the step 4), by air hose 15 decompressing inner spaces 14.By like this, allow supporting construction 3 be subjected to the power F (with reference to Fig. 4) that vertically makes progress from post-decompression inner space 14.When removing described brake, support the supporting construction 3 of quick condition on respect to the vertical direction of base portion 4 movably.
(step 5) is then sent into air in the cylinder 9 by air duct 10.Thereby the release pusher, and element bar B is pressed on the grinding square position 5 of rotation beginning grinding element bar B.Except element S, also grind on abradant surface LS the RLG element R in abutting connection with configuration simultaneously with element S, and the resistance value of continuous monitoring RLG element R.The height (concavo-convex) that grinds square position 5 is ground the influence that the local concavo-convex and level in square position 5 is installed the degree of accuracy, the difference with the variation of grinding 5 radial direction positions, square position.Its result is that the average pressure that each element S is subjected to all changes on each element S.Because the average pressure of each element S is roughly proportional with the amount of grinding of this element S, so can know the average pressure of each element S by the resistance change that detects RLG element R.Therefore according to the air pressure in the detected average pressure control cylinder 9, and control the impact (stroke) of pusher 6 vertical direction respectively.Therefore, on one side can control 6 pairs of pressure that grind square position 5 of pusher on each element S position, Yi Bian grinding element bar B.When concerning predefined target resistance values between reaching according to RLG element R amount of grinding and resistance value, the resistance value of RLG element R finishes grinding steps.
As mentioned above, base portion 4 is vertically supported the supporting construction 3 under the quick condition.Consequent effect describes with reference to Fig. 8.The situation that 5 surfaces, square position are in low relatively position is ground in Fig. 8 (a) expression, and the situation that 5 surfaces, square position are in high relatively position is ground in Fig. 8 (b) expression.In addition, in order to illustrate, amplify emphasized to represent Fig. 8 (a) and (b) between difference, and actual variance is minimum.When element bar B was in the state of Fig. 8 (a), the release length of pusher was S1, and cylinder 9 pressure inside are P1.Cylinder 12 upper ends are near the bottom of piston 13.The negative pressure that inner space 14 produces has been offset the own wt of supporting construction 3 and grinding head 2, thereby makes supporting construction 3 and grinding head 2 roughly be in quick condition.
Then, with reference to the state of figure 8 (b), the spin finishing square position 5 once more, with the contact position of element bar B on grind square position 5 the apparent height height D1 that raise.Element bar B's height D1 has upward raise, and correspondingly supporting construction 3 and grinding head 2 also raise.In addition, simple in order to make explanation, suppose that height D1 is certain at the length direction of element bar B.At this moment, because piston 13 maintains static on base portion 4, so cylinder 12 rises with respect to piston 13, inner space 14 parts reduce.The ascending amount of supporting construction 3 and grinding head 2 is subjected to the influence of the friction of inertia, cylinder 12 and piston 13 of supporting construction 3 and grinding head 2 itself and guide portion 18 and the various factors such as friction of jut 21, thereby inconsistent with height D1.The common height D2 that is caused rising by supporting construction 3 and grinding head 2 inertia own is greater than height D1.But in case the influence of the back inertia that rises disappears, because subject cylinder 12 and the friction of piston 13 and the frictional influence of guide portion 18 and jut 21, supporting construction 3 and grinding head 2 rest on the position after the rising.Because in fact height D1 only is a nanoscale, so the pressure of inner space 14 rises in negligible scope, supporting construction 3 and the position of grinding head 2 after rising become poised state once again, and revert to quick condition.Therefore, owing to absorbed the reaction force (release) of element bar B self-grind square position 5 when grinding the protuberance of square position 5, prevent that the pressure that element bar B is subjected to from sharply increasing.This pressure is the very big reason that causes element S amount of grinding deviation, thereby has reduced the deviation of element S amount of grinding.
The spin finishing square position 5 once more, with the contact position of element bar B on, when the apparent height that grinds square position 5 during less than height D1, because element bar B is not subjected to the influence of the projection of self-grind square position 5, so the also not further rising of supporting construction 3 and grinding head 2.On the other hand, with the contact position of element bar B on, when the apparent height that grinds square position 5 during, repeat above-mentioned action greater than height D1.The rising of supporting construction 3 and grinding head 2 roughly recovers when therefore rotating a circle in grinding square position 5 usually, has so just prevented substantially that element bar B from being ground upwards top, square position 5.That is to say that according to present embodiment, element bar B revises to avertible position to top offset to greatest extent with the relative height relation self-grind square position in future 5 of grinding square position 5.And this action can produce by the rotation oneself control ground that grinds square position 5.The surface state of grinding square position 5 and element bar B changes in grinding constantly, and the relativeness of therefore grinding square position 5 and element bar B also changes constantly, so supporting construction 3 and grinding head 2 are risen once more in grinding.But this action also is to produce by the rotation oneself control ground that grinds square position 5.Thereby, even in grinding, also can maintain element bar 5 with respect on the suitableeest relative height relation of grinding square position 5 usually.
On the other hand, because supporting construction 3 and grinding head 2 risings usually, thereby the pressure portion that pusher 6 is produced reduces.But because the ascending amount of supporting construction 3 and grinding head 2 is number nm level, reduction is few.And, because pusher 6 is by rubber slab 21 clamping element bar B, so the elasticity of rubber slab 21 also can be slowed down the minimizing of pressure.Therefore suppress and reduced the deviation of pressure.
In addition, in the present embodiment, owing to control the release length of pusher 6 respectively, thereby also can suppress the deviation of pressure.Correspondingly amount of grinding also changes when pressure change.Can infer the amount of grinding that each element S by monitoring aforesaid RLG element R resistance change.In the present embodiment,, can control the amount of grinding of each element S respectively by the pressure of the cylinder 9 directly over the adjustment element S and the release length of adjusting pusher 6.Among Fig. 8 (b), because the lifting height D2 of grinding head 2 is bigger than height D1, so cylinder 9 pressure inside increase to P2, the release length of pusher 6 increases to S2.Therefore, can further keep certain pressure by the protuberance front and back.And, because can adjust the pressure of each element S, so can further suppress the deviation of pressure.In addition, just also need to consider to destroy the situation of element bar B for the most suitable position relation of grinding square position 5 in case adjust the release length of pusher 6, as mentioned above, supporting construction 3 and grinding head 2 rise, and are adapted to new the most suitable position relation automatically.
Fig. 9 is the pressure concept map compared with prior art of pusher in the embodiments of the invention (pusher).With figure (a) is the pressure that grinds the front and back pusher in the prior art.Transverse axis is represented the length direction of element bar.In the prior art, the setting member bar also keeps this state with respect to the relative altitude of grinding the square position in the grinding before grinding.Pressure after the grinding with grind before compare significantly to reduce and show the element bar and the tendency of come-up is arranged with respect to grinding the square position.This is because be subjected to the overmastication of strong pressure in grinding, and its result is, in the element bar part of over-lapping with do not have the partially mixed of over-lapping to be in the same place.Show that element heights forms the element heights that evenly forms in the grinding step and produce deviation in the Surface Machining grinding step.In the Surface Machining grinding step, the deviation of straining element height and even simultaneously the grinding are very important as far as possible.
On the other hand, same Fig. 9 (b) is the pressure of pusher before and after grinding in the present embodiment.In the present embodiment owing to can effectively absorb the concavo-convex influence that causes of grinding the square position, so can prevent from grinding, to be subjected to strong pressure.Therefore almost one how much reduce pressure surely.
At last, by embodiments of the invention effect of the present invention is described.With tunnel magnetoresistance element (TMR) element is object, has estimated the deviation of MR height, the deviation of PTR and the life-span of grinding the square position.Figure 10 is the summary construction diagram of element bar, pusher and the rubber slab etc. that use in following examples.With figure (a) is the side view of element bar, rubber slab etc., is the stereogram of expression pusher and element bar relativeness with figure (b), is the vertical view of element bar, rubber slab etc. with figure (c).The long 69.6mm of element bar, the wide 1.2mm, the high 0.3mm that use.Length on the element bar length direction of each element is 1.15mm, guarantees to have at each interelement the cutting part of 0.15mm, disposes the RLG element herein.Rubber slab uses the material of poly(ether-urethane) class, and its thickness is 0.8mm, is preferably in 0.7～0.9mm scope.Rubber slab hardness is 14 (JISZ0237).Shown in Figure 10 (a), between pusher and rubber slab, be provided with double-sided belt (tape).Shown in Figure 10 (b), pusher be arranged on the element bar directly over.Comparative example and embodiment are supported on quick condition on the vertical direction of base portion 4 this structure except supporting construction 3, and be roughly the same.The average pressure of pusher is 23g (38g in the comparative example), and average amount of grinding is that 30nm (20nm in the comparative example), milling time are 120 seconds (in the comparative example 60 seconds).
Use 100 set of pieces bars earlier, estimate and grind front and back MR difference in height, promptly the amount of grinding in the Surface Machining grinding step is obtained its deviation.The result is, the deviation of MR height is 8nm in the comparative example, present embodiment be reduced to 3nm.Then, the Al behind use AFM (AFM Atomic Force Microscope) the mensuration Surface Machining grinding step
2Near O3TiC base portion and the read-write elements difference (PTR).Use 100 set of pieces bars, being equivalent to 3 elements with 1 set of pieces bar is that object is measured.Its result is 0.8nm for difference in the comparative example, and is reduced to 0.5nm in the present embodiment.Further estimate the life-span of grinding the square position, the life-span herein is meant when working modulus it is the life-span of 5nm/ timesharing grinding square position.The life-span of the grinding square position in the comparative example be for can grind 40 element bars, and can grind 80 element bars in the present embodiment, and affirmation can prolong life-cycle.
Claims (11)
1. the lapping device of a head-slider is characterized in that comprising:
Can compress and be supported on grinding head on the grinding square position of rotation to the element that will become head-slider;
Be provided with vertically first gomphosis part that extends and support the supporting construction of described grinding head;
Be provided with vertically second gomphosis part that extends and support the base portion of described supporting construction, described second gomphosis part and the described first gomphosis part tabling, and between described second gomphosis part and described first gomphosis part, form the inner space; And
Reduce the pressure reduction structure of described inner space pressure,
Described supporting construction is subjected to the power that vertically makes progress from post-decompression described inner space, the vertically movable support supporting construction of described base portion.
2. head-slider lapping device as claimed in claim 1 is characterized in that: described first gomphosis part is arranged on the cylinder on the described supporting construction, and described second gomphosis part is arranged on the piston on the described base portion.
3. head-slider lapping device as claimed in claim 1 is characterized in that: described first gomphosis part is arranged on the piston on the described supporting construction, and described second gomphosis part is arranged on the cylinder on the described base portion.
4. as each described head-slider lapping device in the claim 1 to 3, it is characterized in that:
Described base portion comprises to be supported and the cradle portion of fixing described grinding square position and the conduit part that is provided with described second gomphosis part and can moves on respect to the vertical direction of described support,
Side in described cradle portion and described conduit part is provided with ball-screw, and opposite side is provided with the nut with this ball-screw tabling.
5. head-slider lapping device as claimed in claim 4, it is characterized in that: described conduit part has vertically first engaging piece that extends, and described supporting construction has and is engaged in described first engaging piece and is used to limit second engaging piece that described conduit only moves in vertical direction.
6. as each described head-slider lapping device in the claim 1 to 5, it is characterized in that described conduit part comprises: a plurality of pushers that can control the extruding force that puts on described grinding square position respectively, this pusher be arranged on corresponding position, a plurality of described elements installation site separately on, and support described pusher and be installed to be the support sector that can not move in vertical direction at least with respect to described supporting construction.
7. the Ginding process of a head-slider is characterized in that this method comprises:
Prepare the step of lapping device, described lapping device comprises grinding head, the supporting construction of supporting described grinding head that can support the element that will become head-slider, the base portion of supporting described supporting construction, described supporting construction is provided with first gomphosis part that vertically extends, described base portion is provided with second gomphosis part that vertically extends, described first gomphosis part and the described second gomphosis part tabling, and form the inner space between described first gomphosis part and described second gomphosis part;
The component side that uses described grinding head support will becoming head-slider is to the support step of grinding the square position; And
The described inner space of reducing pressure, make described supporting construction be subjected to the power that vertically makes progress from post-decompression described inner space, be pressed on the grinding square position of rotation at following described element of the state of the vertically movable support supporting construction of described base portion, and grind the grinding steps of this element.
8. head-slider Ginding process as claimed in claim 7 is characterized in that described grinding steps comprises: control a plurality of described elements pressure to described square position on position separately respectively, and grind described a plurality of element simultaneously.
9. head-slider Ginding process as claimed in claim 8 is characterized in that: described angle of rake pressure is controlled the control that comprises the axial displacement of this propeller vertical direction.
10. as each described head-slider Ginding process in the claim 7 to 9, it is characterized in that: the element heights that formed the read element height of described element before described support step and described grinding steps in addition forms grinding steps, described grinding steps is included on the abradant surface and disposes resistive element with described element adjoining position, grinds this resistive element and this element in the described resistive element resistance value of monitoring.
11. as each described head-slider Ginding process in the claim 7 to 10, it is characterized in that described grinding steps comprises: according to the relation between described resistive element amount of grinding and resistance value, when the resistance value of described resistive element finishes to grind when reaching default target resistance values.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100870358A CN101543974B (en) | 2008-03-28 | 2008-03-28 | Grinding unit and grinding method for magnetic head slider |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100870358A CN101543974B (en) | 2008-03-28 | 2008-03-28 | Grinding unit and grinding method for magnetic head slider |
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| Publication Number | Publication Date |
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| CN101543974A true CN101543974A (en) | 2009-09-30 |
| CN101543974B CN101543974B (en) | 2011-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100870358A Expired - Fee Related CN101543974B (en) | 2008-03-28 | 2008-03-28 | Grinding unit and grinding method for magnetic head slider |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102284911A (en) * | 2011-07-22 | 2011-12-21 | 中国科学院长春光学精密机械与物理研究所 | Long-range polishing stable-clearance device |
| CN102284893A (en) * | 2011-09-14 | 2011-12-21 | 中国航空工业第六一八研究所 | High-precision permanent magnet seat grinding method |
| CN104070448A (en) * | 2013-03-28 | 2014-10-01 | 新科实业有限公司 | Fixture for grinding of elongated members, grinding device of elongated members, and grinding method of elongated members |
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| JP3914006B2 (en) * | 2000-06-16 | 2007-05-16 | Ｔｄｋ株式会社 | Polishing apparatus and method for magnetic head |
| JP2002157723A (en) * | 2000-11-21 | 2002-05-31 | Tdk Corp | Method of manufacturing magnetic head slider and method of polishing bar |
| JP2007334934A (en) * | 2006-06-12 | 2007-12-27 | Shinka Jitsugyo Kk | Polishing amount detecting element for laminate, wafer, and polishing method of laminate |
| CN100491070C (en) * | 2007-01-10 | 2009-05-27 | 友达光电股份有限公司 | Grinding and polishing method |
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| CN102284911A (en) * | 2011-07-22 | 2011-12-21 | 中国科学院长春光学精密机械与物理研究所 | Long-range polishing stable-clearance device |
| CN102284911B (en) * | 2011-07-22 | 2013-01-02 | 中国科学院长春光学精密机械与物理研究所 | Long-range polishing stable-clearance device |
| CN102284893A (en) * | 2011-09-14 | 2011-12-21 | 中国航空工业第六一八研究所 | High-precision permanent magnet seat grinding method |
| CN104070448A (en) * | 2013-03-28 | 2014-10-01 | 新科实业有限公司 | Fixture for grinding of elongated members, grinding device of elongated members, and grinding method of elongated members |
| CN105500203A (en) * | 2016-01-07 | 2016-04-20 | 韩金桥 | Flexible control device for lifting of grinding head of grinding equipment |
| CN107009226A (en) * | 2017-03-31 | 2017-08-04 | 耐世特凌云驱动系统（芜湖）有限公司 | Retainer grinds window device |
| CN113134785A (en) * | 2020-01-17 | 2021-07-20 | 株式会社荏原制作所 | Polishing head system and polishing device |
| CN113134785B (en) * | 2020-01-17 | 2024-05-14 | 株式会社荏原制作所 | Polishing head system and polishing apparatus |
| US12017323B2 (en) | 2020-01-17 | 2024-06-25 | Ebara Corporation | Polishing head system and polishing apparatus |
| CN112171461A (en) * | 2020-09-21 | 2021-01-05 | 苏州浩耐特磨具有限公司 | Self-adaptive curved surface polishing system and method |
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