CN101538715A - Flexible circuit board etching liquid concentration control device - Google Patents

Flexible circuit board etching liquid concentration control device Download PDF

Info

Publication number
CN101538715A
CN101538715A CN200910030797A CN200910030797A CN101538715A CN 101538715 A CN101538715 A CN 101538715A CN 200910030797 A CN200910030797 A CN 200910030797A CN 200910030797 A CN200910030797 A CN 200910030797A CN 101538715 A CN101538715 A CN 101538715A
Authority
CN
China
Prior art keywords
inlet pipe
etch bath
liquid
test box
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200910030797A
Other languages
Chinese (zh)
Other versions
CN101538715B (en
Inventor
陆传生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU FLEXIBLE PBC ELE CO Ltd
Original Assignee
SUZHOU FLEXIBLE PBC ELE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU FLEXIBLE PBC ELE CO Ltd filed Critical SUZHOU FLEXIBLE PBC ELE CO Ltd
Priority to CN2009100307979A priority Critical patent/CN101538715B/en
Publication of CN101538715A publication Critical patent/CN101538715A/en
Application granted granted Critical
Publication of CN101538715B publication Critical patent/CN101538715B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention relates to a flexible circuit board etching liquid concentration control device belonging to the technical field of etching liquid detection and control devices and comprising a testing box with a box cavity, an etching pool, a liquid inlet pipe and a liquid return pipe. The testing box is provided with a controller as well as an oxidant probe, a hydrochloric acid probe and a hydrometer which are respectively and electrically connected with the controller and extend into the testing box; the etching pool is provided with an oxidant adding pipe, a hydrochloric acid inlet pipe and a water inlet pipe; the oxidant adding pipe, the hydrochloric acid inlet pipe and the water inlet pipe are respectively provided with a control valve; the control valves are electrically connected with the controller; one end of the liquid inlet pipe is connected with the etching pool, the middle is provided with a conveying pump and a valve, and the other end extends into the testing box; and one end of the liquid return pipe is connected with the etching pool and the other end is connected with the testing box. The invention has the characteristic that the oxidant probe is inserted into the pipe cavity of the liquid inlet pipe. The invention has the advantage of ensuring the etching effect of the etching pool to FPC boards.

Description

Flexible circuit board etching liquid concentration control device
Technical field
The invention belongs to etching solution Detection ﹠ Controling device technique field, be specifically related to a kind of flexible circuit board etching liquid concentration control device.
Background technology
In the course of processing of flexible circuit board (FPC) plate, in order to adopt the etching solution etching to use the formation circuit structure to FPC, and the oxygenant in the etching solution is the many or few unfavorable factors that all can produce of composition of cupric chloride, for example when oxidizer composition be after a little while content when low etching speed just slack-off even can't etching, can cause unnecessary waste at most and cross.Therefore the manufacturing enterprise of FPC plate is connect by the test box of pipeline with etch bath and etching liquid concentration control device, and forms the pump around circuit of etching solution between the two usually at the supporting etching liquid concentration control device in etch bath (also claiming work pool) position.Specifically: the etching solution in the etch bath is introduced aforesaid test box by pump, is returned by test box to cause in the etch bath again.In this process, measure corresponding value by the oxygenant on the test box top that is installed in etching liquid concentration control device probe, hydrochloric acid probe and specific gravity hydrometer.
The oxygenant probe is the oxygenant sensor or claims transmitter, measure the potential value (ORP value) of the oxygenant in the etching solution by it, and give controller with signal feedback, give the control valve of the oxygenant liquid-inlet pipe that is installed on the etch bath to signal by controller, with in good time unlatching or close the control valve of oxygenant liquid-inlet pipe, add oxygenant or stop to add oxygenant to etch bath, make the oxidizer composition in the etch bath be controlled at content or the title concentration that the rational numerical scope is promptly stipulated.
The hydrochloric acid probe is the hydrochloric acid sensor, according to electromagnetic induction principle, when electric current passes through hydrochloric acid sensor coil, can produce flux (magnetic line of force), this flux can produce the certain proportion electric current according to the ionic concn of hydrochloric acid in the etching solution, again this current change quantity is quantized, and be converted to electrical signal and pass to controller, controller judges according to electrical signal whether the ionic concn of hydrochloric acid in the etching solution is unusual, give the control valve that is installed in the hydrochloric acid liquid-inlet pipe on the etch bath to send instruction, with in good time unlatching or close the control valve of hydrochloric acid liquid-inlet pipe, make the content of hydrochloric acid in the etch bath be controlled at reasonable range.
Specific gravity hydrometer is the specific gravity hydrometer sensor, its mechanism of action is to increase buoyancy according to etching solution proportion to increase, the reason that vice versa, when content of copper ion in the etching solution increases or reduces, the buoyancy of etching solution also can become big or reduce, the variation of buoyancy makes the certain ball float of weight rise or descend, the lifting meeting occurrence positions of ball float changes, when proportion reaches set(ting)value, when the tinsel at ball float top contacts with metal sensor, inductor block is converted to electric signal transmission with its potential energy (potential energy → electric energy) variable quantity and gives controller, controller is judged the size of etching solution proportion according to electrical signal, give the control valve that is installed in the water inlet pipe on the etch bath to send signal (instruction),, that is to say by adding tap water and control proportion in etch bath, to add entry (being generally tap water) in good time.
But, there is following shortcoming in the structure of the flexible circuit board etching liquid concentration control device in the prior art: because the oxygenant that is installed on the tstr probes in the interior etching solution of test box, therefore the oxidant concentration in its etching solution that measures is essentially the concentration of the oxygenant in the interior etching solution of test box, and be not oxidant concentration for follow-up etching solution when etch bath is incorporated into test box, because in test box, had the previous etching solution that comes from the etch bath, and the oxidant concentration in the previous etching solution that comes from the etch bath often with follow-up and the oxidant concentration from the etching solution that etch bath is introduced there are differences, therefore the value of measuring of oxygenant probe has the phenomenon of lagging, the so-called phenomenon that lags is meant: oxygenant probe can not directly measure follow-up introduces oxidant concentration in the etching solution of test box by etch bath, and can only or claim the different periods to enter into the concentration determination of the oxygenant that mixed etching solution occurred of test box to different steps, thereby lack specific aim and accuracy inevitably, influence etch effect.
Summary of the invention
Task of the present invention is to provide a kind of oxygenant probe that can make to measure the oxidant concentration that comes from the etching solution in the etch bath timely and accurately and use the flexible circuit board etching liquid concentration control device that ensures etch effect.
Task of the present invention is finished like this, a kind of flexible circuit board etching liquid concentration control device, it comprises the test box with case chamber, etch bath, liquid-inlet pipe and liquid returning tube, disposing oxygenant that controller is connected with controller circuitry with each and that all extend in the test box on the test box pops one's head in, hydrochloric acid probe and specific gravity hydrometer, etch bath is provided with the oxygenant filling tube, hydrochloric acid feed-pipe and water inlet pipe, the oxygenant filling tube, hydrochloric acid feed-pipe and water inlet pipe respectively are equipped with a control valve, control valve and described controller are electrically connected, one end of liquid-inlet pipe is connected with etch bath, the middle part disposes transferpump and valve, the other end is stretched in the test box, one end of liquid returning tube is connected with etch bath, the other end is connected with test box, and characteristics are: described oxygenant probe is inserted in the tube chamber of described liquid-inlet pipe.
In a specific embodiment of the present invention, an end of described liquid-inlet pipe is connected with etch bath and communicates, and the other end stretches into and extend to the top in the case chamber of test box from the bottom of described test box.
In another specific embodiment of the present invention, every being provided with specific gravity hydrometer test bucket, the bottom of specific gravity hydrometer test bucket offers a guiding fluid hole in described test box, and this guiding fluid hole communicates with described case chamber.
Go back in the specific embodiment of the present invention, an end of described liquid returning tube is connected with the top of etch bath and communicates with etch bath, and the other end is connected with the bottom of test box and communicates with described case chamber.
In another specific embodiment of the present invention, the pipeline of described liquid returning tube is provided with valve.
In another specific embodiment of the present invention, described etch bath is provided with and is used for mixing mechanism to what etching solution stirred.
More of the present invention and in specific embodiment, the described mechanism of mixing comprises motor, step-down gear and stirring arm, motor and step-down gear connect and take the top that motor is installed in etch bath by step-down gear, and stirring arm is positioned at etch bath and connects with the step-down gear transmission.
Technical scheme provided by the present invention is owing to be inserted into the oxygenant probe in the liquid-inlet pipe, therefore can in time and exactly measure the oxidant concentration that comes from the etching solution in the etch bath, the oxidant concentration that the oxygenant probe is measured is the oxidant concentration of the etching solution in the etch bath, thereby can guarantee the etch effect of etch bath to the FPC plate.
Description of drawings
Accompanying drawing is a specific embodiment structure iron of the present invention.
Embodiment
Please be referring to accompanying drawing, the test box 1 of being furnished with controller 11, oxygenant probe 12, hydrochloric acid probe 13 and specific gravity hydrometer 14 can be from the market acquisition, for example select for use name by the production and sales of the special Electronics Equipment Co., Ltd of Jiangsu Province, China Changzhou Gree to be called oxygenant regeneration and add controller.Aforesaid oxygenant probe 12, hydrochloric acid probe 13 and specific gravity hydrometer 14 are electrically connected by circuit and controller 11.Every being provided with specific gravity hydrometer test bucket 16, in the bucket chamber of specific gravity hydrometer 14 corresponding to specific gravity hydrometer test bucket 16, offer a guiding fluid hole 161 in the bottom of specific gravity hydrometer test bucket 16 in the case chamber 15 of test box 1, guiding fluid hole 161 communicates with case chamber 15.
One end of one liquid-inlet pipe 3 is that illustrated right-hand member communicates with the bottom side joint of etch bath 2 and with etch bath 2, the middle part of liquid-inlet pipe 3 disposes transferpump 31 and valve 32, to be illustrated left end be incorporated into the case chamber 15 of test box 1 from the bottom of test box 1 the other end of liquid-inlet pipe 3 and stretch upwards the top in case chamber 15, and aforesaid oxygenant probe 12 probes into or claims to be inserted in the tube chamber of liquid-inlet pipe 3.As shown in the above description, the effect that pipeline section in the case chamber 15 of liquid-inlet pipe 3 test box that is insinuated into 1 has been filled the post of testing tube 33 in fact, because oxygenant probe 12 is inserted in the testing tube 33, therefore the oxidant concentration in oxygenant probe 12 etching solutions that measured is the oxidant concentration of the etching solution in the etch bath 2, so can reflect the situation of the etching solution in the etch bath 2 timely and accurately, and give controller 11 with signal feedback, so that send instruction by the control valve 5 of controller 11 on the pipeline that is installed in the oxidant feed pipe 21 on the etch bath 2, open 5 of this control valves and in etch bath 2, add oxygenant, promptly add cupric chloride.Be installed on the etch bath 2 and hydrochloric acid feed-pipe 22 that respectively be furnished with control valve 5 and water inlet pipe 23 also are controlled by controller 11.Therefore its reason is no longer given unnecessary details as applicant's explanation to hydrochloric acid probe and specific gravity hydrometer in the background technology hurdle.
One end of one liquid returning tube 4 is that illustrated right-hand member is connected with the top of etch bath 2 and communicates with etch bath 2, the other end is that illustrated right-hand member is connected with test box 1 in the bottom of test box 1, and the bucket chamber with case chamber 15 and specific gravity hydrometer test bucket 16 communicates respectively, is provided with valve 41 on the pipeline of liquid returning tube 4.
Still ask for an interview accompanying drawing, be provided with one in a side of etch bath 2 and mix mechanism 6 by what motor 61, step-down gear 62 and stirring arm 63 constituted, wherein, motor 61 and step-down gear 62 are matched and take the top that it is installed in etch bath 2 by step-down gear 62, stirring arm 63 be positioned at etch bath 2 and with step-down gear 62 connections.
The applicant sketches principle of work of the present invention, the etched FPC plate of needs is put in the etch bath 2 that fills the etching solution of preparing on request in advance (etch bath 2 is work pool as can be known), carrying out along with etching work, the oxidant concentration of the etching solution in the etch bath 2 (cupric chloride) can change, in order to make oxygenant, hydrochloric acid and water are in the required equilibrium state of technology all the time, therefore in etching process, transferpump 31 and valve 32 on the pipeline of timing or not timing ground unlatching liquid-inlet pipe 3, etching solution in the etch bath 2 is introduced until being drawn out to the case chamber 15 from testing tube 33 by liquid-inlet pipe 3, this moment is owing to oxygenant probe 12 is inserted in the testing tube 33, therefore can in time and accurately measure the oxidant concentration in the etching solution that comes from the etch bath 2, promptly measure the potential value of the oxygenant of etching solution by oxygenant probe 12, give controller 11 with signal feedback, and then be located at control valve 5 on the pipeline of oxygenant filling tube 21 by controller 11 control, added oxygenants or stop to add oxygenant to etch bath 2 by oxygenant filling tube 21, making oxygenant is that the content of cupric chloride remains in appropriate vol in etching solution.Simultaneously whether normal according to the ionic concn that electromagnetic induction principle obtains hydrochloric acid in the etching solution in the case chamber 15 by hydrochloric acid probe 13, and give controller 11 to signal, send instruction to the control valve 5 on the pipeline of hydrochloric acid feed-pipe 22 by controller 11,5 of opening controlling valves add hydrochloric acid to etch bath, vice versa, uses the scope that the content of hydrochloric acid that makes in the etching solution is controlled at regulation.Again, meanwhile, increase the principle that buoyancy also increases by specific gravity hydrometer 14 according to the proportion of etching solution, when the content of copper ion in the etching solution increases or reduces, the ball float come-up of specific gravity hydrometer 14 or sink (decline), when proportion reaches set(ting)value, the tinsel at ball float top contacts with metal sensor, by inductor block its potential energy (potential energy → electric energy) variable quantity is converted to electric signal transmission and gives controller 11, give the control valve 5 on the pipeline of water inlet pipe 23 to instruction by controller 11, in etch bath 2, to add tap water or to stop to add tap water in good time.

Claims (7)

1, a kind of flexible circuit board etching liquid concentration control device, it comprises the test box (1) with case chamber (15), etch bath (2), liquid-inlet pipe (3) and liquid returning tube (4), dispose that controller (11) is connected with controller (11) circuit with each on the test box (1) and all extend into oxygenant probe (12) in the test box (1), hydrochloric acid probe (13) and specific gravity hydrometer (14), etch bath (2) is provided with oxygenant filling tube (21), hydrochloric acid feed-pipe (22) and water inlet pipe (23), oxygenant filling tube (21), hydrochloric acid feed-pipe (22) and water inlet pipe (23) respectively are equipped with a control valve (5), control valve (5) is electrically connected with described controller (11), one end of liquid-inlet pipe (3) is connected with etch bath (2), the middle part disposes transferpump (31) and valve (32), the other end is stretched in the test box (1), one end of liquid returning tube (4) is connected with etch bath (2), the other end is connected with test box (1), it is characterized in that: described oxygenant probe (12) is inserted in the tube chamber of described liquid-inlet pipe (3).
2, flexible circuit board etching liquid concentration control device according to claim 1, an end that it is characterized in that described liquid-inlet pipe (3) is connected with etch bath (2) and communicates, and the other end stretches into and extend to (150 the top, case chamber of test box (1) from the bottom of described test box (1).
3, flexible circuit board etching liquid concentration control device according to claim 1, it is characterized in that in described test box (1) every being provided with specific gravity hydrometer test bucket (16), the bottom of specific gravity hydrometer test bucket (16) offers a guiding fluid hole (161), and this guiding fluid hole (161) communicates with described case chamber (15).
4, flexible circuit board etching liquid concentration control device according to claim 1, an end that it is characterized in that described liquid returning tube (4) is connected with the top of etch bath and communicates with etch bath (2), and (10 bottom is connected and communicates with described case chamber (15) the other end with test box.
5,, it is characterized in that the pipeline of described liquid returning tube (4) is provided with valve (41) according to claim 1 or 4 described flexible circuit board etching liquid concentration control devices.
6, flexible circuit board etching liquid concentration control device according to claim 1 is characterized in that described etch bath (2) is provided with and is used for mixing mechanism (6) to what etching solution stirred.
7, flexible circuit board etching liquid concentration control device according to claim 6, it is characterized in that the described mechanism (6) of mixing comprises motor (61), step-down gear (62) and stirring arm (63), motor (61) connects with step-down gear (62) and takes the top that motor (61) is installed in etch bath (2) by step-down gear (62), and stirring arm (63) is positioned at etch bath (2) and connects with step-down gear (62) transmission.
CN2009100307979A 2009-04-15 2009-04-15 Flexible circuit board etching liquid concentration control device Expired - Fee Related CN101538715B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009100307979A CN101538715B (en) 2009-04-15 2009-04-15 Flexible circuit board etching liquid concentration control device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009100307979A CN101538715B (en) 2009-04-15 2009-04-15 Flexible circuit board etching liquid concentration control device

Publications (2)

Publication Number Publication Date
CN101538715A true CN101538715A (en) 2009-09-23
CN101538715B CN101538715B (en) 2011-01-12

Family

ID=41122095

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009100307979A Expired - Fee Related CN101538715B (en) 2009-04-15 2009-04-15 Flexible circuit board etching liquid concentration control device

Country Status (1)

Country Link
CN (1) CN101538715B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534621A (en) * 2012-02-21 2012-07-04 上海正帆科技有限公司 Method for treating acidic etching solution
CN104846374A (en) * 2015-06-09 2015-08-19 成都虹华环保科技股份有限公司 Automatic liquid adding etching tank
CN104977947A (en) * 2014-04-01 2015-10-14 宇宙电路板设备(深圳)有限公司 Automatic adding system for printed circuit board production line etching liquid
CN111926334A (en) * 2020-09-08 2020-11-13 深圳市志凌伟业光电有限公司 Regeneration system and regeneration method for acidic copper chloride etching solution

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105208782B (en) * 2015-09-28 2017-12-08 惠州市特创电子科技有限公司 The automatic etching apparatus of circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2329472Y (en) * 1998-05-05 1999-07-21 赵庶忠 Electric etching machine for metal
US6752545B2 (en) * 2001-08-16 2004-06-22 Nagase & Co., Ltd. Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment
CN100377312C (en) * 2004-03-03 2008-03-26 鸿富锦精密工业(深圳)有限公司 Etching system and pure water adding device thereof
KR20080022917A (en) * 2006-09-08 2008-03-12 삼성전자주식회사 Etchant supplying unit, etching apparatus and method of etching
JP5058560B2 (en) * 2006-10-26 2012-10-24 株式会社平間理化研究所 Etching solution management device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102534621A (en) * 2012-02-21 2012-07-04 上海正帆科技有限公司 Method for treating acidic etching solution
CN104977947A (en) * 2014-04-01 2015-10-14 宇宙电路板设备(深圳)有限公司 Automatic adding system for printed circuit board production line etching liquid
CN104846374A (en) * 2015-06-09 2015-08-19 成都虹华环保科技股份有限公司 Automatic liquid adding etching tank
CN111926334A (en) * 2020-09-08 2020-11-13 深圳市志凌伟业光电有限公司 Regeneration system and regeneration method for acidic copper chloride etching solution

Also Published As

Publication number Publication date
CN101538715B (en) 2011-01-12

Similar Documents

Publication Publication Date Title
CN201386136Y (en) Concentration control device of flexible circuit board etching liquid
CN101538715B (en) Flexible circuit board etching liquid concentration control device
CN206611657U (en) A kind of chemical liquid adding apparatus
CN201780281U (en) Online water quality analyzer for permanganate index
CN103006073B (en) Automatic water adding device with water level detection control and control method thereof
CN101254533A (en) Constant fluid level control device of fused mass box for casting
CN202875042U (en) Automatic water feeding device with water level detection control
CN204550715U (en) Regeneration system of acid etching liquid
CN105301056A (en) Electrical conductivity type moisture content measurement device
CN201242561Y (en) Apparatus for detecting power supply current
CN204826042U (en) Water supply detection device
CN202492579U (en) Regenerative control device for acidic cupric chloride etchant
CN201198456Y (en) Full automatic chameleon solution adding apparatus
CN202421902U (en) Water level controlling apparatus for nuclear power station king bolt center aperture ultrasonic detection
CN201896196U (en) Automatic copper chloride corrosion device
CN201839773U (en) Konjaku refiner
CN107504819B (en) Intelligent detection device and detection method for electrode depth of submerged arc furnace
CN203035510U (en) Electronic flow controller
CN206684588U (en) A kind of vinegar pours leaching pit level control device
CN202905852U (en) Device for injecting electrolyte quantitatively
CN203241095U (en) Low-flow liquid flow measurement device
CN202469145U (en) Torque measurement control device for valve rod of electric actuating mechanism
CN205281275U (en) Liquid level controller
CN213254327U (en) Feeding control device of electroplating brightener reaction kettle
CN1301405C (en) Device for measuring permeability of concrete

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110112

Termination date: 20150415

EXPY Termination of patent right or utility model