CN101534619A - Ceramic plate capable of increasing working area - Google Patents
Ceramic plate capable of increasing working area Download PDFInfo
- Publication number
- CN101534619A CN101534619A CN200810085410A CN200810085410A CN101534619A CN 101534619 A CN101534619 A CN 101534619A CN 200810085410 A CN200810085410 A CN 200810085410A CN 200810085410 A CN200810085410 A CN 200810085410A CN 101534619 A CN101534619 A CN 101534619A
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- China
- Prior art keywords
- ceramic wafer
- work area
- substrate
- shell
- increases work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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Abstract
The invention relates to a ceramic plate capable of increasing working area, which comprises a base plate and a plurality of shells extended out from the base plate. The shells are arranged at intervals, and the total superficial area of all the shells and the base plate is more than 1.5 times larger than that of the flat plate with same size to the base plate. Owning to the greatly increased superficial area, the heat conducting and dissipation effect of radiating fin group can be greatly improved and the electric quantity output of the fuel batteries can be increased when the ceramic plate is used in the fields of radiating fin group and fuel batteries and the like.
Description
Technical field
The present invention relates to a kind of ceramic wafer, relate in particular to a kind of ceramic wafer that increases work area.
Background technology
Because ceramic wafer has acidproof, alkaline-resisting, high temperature resistance and many good characteristics such as corrosion-resistant, thereby is widely used in fields such as radiating fin group, fuel cell and Cat Catalytic Converter.Wherein, in fuel cell with soild oxide that ceramic wafer was constituted as electrolyte, not only have the high-effect and oligosaprobic advantage of other fuel cell, but also can avoid because of using problems such as corrosion that liquid electrolyte brought and electrolyte loss.Therefore, the inventor is promptly with this research topic as this case, and ceramic wafer is carried out innovation.
Known ceramic wafer is consulted Fig. 1, and this ceramic wafer 1a mainly is made by ceramic material, and is a rectangular-shaped substrate body.Yet the surface area of this ceramic wafer 1a is quite limited, no matter so its be applied in each side such as radiating fin group, fuel cell or Cat Catalytic Converter, can produce lead, radiating effect and electric weight output all be subjected to sizable limitation, remain to be improved.
Summary of the invention
Purpose of the present invention is to provide a kind of ceramic wafer that increases work area, and it is realized by becoming the shell cap or make ceramic wafer be wavy on ceramic wafer.
In order to reach above-mentioned purpose, according to a kind of ceramic wafer that increases work area provided by the invention, comprise substrate and extended a plurality of shell caps on described substrate, described a plurality of shell caps compartment of terrain is provided with, each described shell cap surface long-pending with described substrate surface area sum be with the unidimensional planar surface of described substrate amass more than 1.5 times.
In order to reach above-mentioned purpose, can increase the ceramic wafer of work area according to another kind provided by the invention, be waveform, be connected in sequence described crest segment table area and described trough segment table area sum more than 1.5 times of plane ceramic wafer surface area that this ceramic wafer surrounds on the border of described datum level, that thickness is identical with this ceramic wafer of serving as reasons by a plurality of crest section and a plurality of trough sections that are lower than datum level that exceed datum level.
Description of drawings
Fig. 1 is the stereo appearance figure of known ceramic wafer;
Fig. 2 is the ceramic wafer stereo appearance figure of one embodiment of this invention;
Fig. 3 is the 3-3 profile of Fig. 2;
The stereo appearance figure of the radiating fin group that Fig. 4 forms for a plurality of ceramic wafer of the present invention;
Fig. 5 is the stereo appearance figure of another embodiment of ceramic wafer of the present invention.
[primary clustering symbol description]
<known
Ceramic wafer 1a
<the present invention 〉
Substrate thickness t2
Shell cap 20
Shell cap thickness t 1
Shell cap height H
Shell cap bottom width W1
Shell crown portion width W 2
The center line spacing distance D of shell cap
Crest section 30
Trough section 40
Embodiment
Below in conjunction with accompanying drawing technology contents of the present invention is elaborated, yet accompanying drawing is only for reference and the usefulness of explanation, and is not to be used for the present invention is limited.
Fig. 2 and Fig. 3 are respectively the 3-3 profile of ceramic wafer stereo appearance figure of the present invention and Fig. 2, according to the ceramic wafer 1 that increases work area provided by the invention, be with zirconia ceramic material integral injection molding such as (ZrO2), mainly comprise substrate 10 and most shell cap 20.Substrate 10 is rectangular, and the surface of substrate 10 extends upward moulding a plurality of shell caps 20.The shell cap 20 of present embodiment is a hollow pyramid shell (as shown in Figure 3), but does not exceed with this kind shape, also can be other various different geometries.
In addition, the face thickness t1 that decides what is right and what is wrong of the shell cap 20 of present embodiment equates with the thickness t 2 of substrate 10.The height H of shell cap 20 is 10 times (being H=10t2) of the thickness t 2 of substrate 10.The bottom width W1 of shell cap 20 is 10 times (being W1=10t2) of the thickness t 2 of substrate 10, and the top width W2 of shell cap 20 is 5 times (being W2=5t2) of the thickness t 2 of substrate 10.Moreover, is equidistant arrangement between each shell cap 20 and lays, and the center line spacing distance d of wantonly two adjacent shell caps 20 is 15 times (they being D=15t2) of the thickness t 2 of substrate 10.Therefore, under the situation of the overall dimension of the length and width that does not change substrate 10, the surface area that this ceramic wafer 1 is increased is more than 50% (containing 50%) of plane ceramic wafer surface area of same size.That is, each shell cap 20 surface area and substrate 10 surface area sums be with the unidimensional planar surface of substrate 10 long-pending more than 1.5 times.
See also shown in Figure 4, the radiating fin group that it is formed for a plurality of ceramic wafer of the present invention.By being superimposed with each other, a plurality of ceramic wafer 1 can constitute radiating fin group as in the present embodiment.This radiating fin group is owing to have more cooling surface areas, therefore can increase the heat exchange work area with extraneous gas, and significantly promotes the heat conduction and the radiating effect of radiating fin group.
See also shown in Figure 5ly, it is another embodiment stereo appearance figure of ceramic wafer of the present invention.The ceramic wafer 1 of present embodiment ' be waveform, it is formed by connecting by a plurality of crest section 30 and a plurality of trough sections 40 that are lower than datum level that exceed datum level, and the surface area of this ceramic wafer 1 ' increased is more than 50% (containing 50%) of plane ceramic wafer surface area of same size.That is, the surface area of crest section 30 and the surface area sum of trough section 40 serve as reasons this ceramic wafer the border planar surface that surround, that thickness is identical with this ceramic wafer of datum level (being the surface that the closing line of crest and trough is positioned at) long-pending more than 1.5 times.This ceramic wafer 1 ' also by ceramic material integral injection molding such as zirconias.
The foregoing description for explanation the present invention's usefulness, and is not a limitation of the present invention only, those skilled in the art under the premise without departing from the spirit and scope of the present invention, the various equivalent structures of being made change all within protection scope of the present invention.Protection scope of the present invention is defined by the claims.
Claims (8)
1. the ceramic wafer that can increase work area is characterized in that, comprising:
Substrate; And
Extended a plurality of shell caps on described substrate, described a plurality of shell caps compartment of terrain are provided with, each described shell cap surface long-pending with described substrate surface area sum be with the unidimensional planar surface of described substrate amass more than 1.5 times.
2. the ceramic wafer that increases work area as claimed in claim 1, wherein said substrate and described shell cap integral injection molding.
3. the ceramic wafer that increases work area as claimed in claim 1, the material of wherein said ceramic wafer are zirconia.
4. the ceramic wafer that increases work area as claimed in claim 1, wherein said shell cap are hollow pyramid shell.
5. the ceramic wafer that increases work area as claimed in claim 1, wherein each described shell cap is equidistant arrangement laying.
6. ceramic wafer that can increase work area, it is a waveform, be connected in sequence by a plurality of crest section and a plurality of trough sections that are lower than datum level that exceed datum level, described crest segment table area and described trough segment table area sum serve as reasons the planar surface that this ceramic wafer surrounds on the border of described datum level, that thickness is identical with this ceramic wafer long-pending more than 1.5 times.
7. the ceramic wafer that increases work area as claimed in claim 6, wherein said ceramic wafer are integral injection molding.
8. the ceramic wafer that increases work area as claimed in claim 6, the material of wherein said ceramic wafer are zirconia.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810085410A CN101534619A (en) | 2008-03-14 | 2008-03-14 | Ceramic plate capable of increasing working area |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810085410A CN101534619A (en) | 2008-03-14 | 2008-03-14 | Ceramic plate capable of increasing working area |
Publications (1)
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CN101534619A true CN101534619A (en) | 2009-09-16 |
Family
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Family Applications (1)
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CN200810085410A Pending CN101534619A (en) | 2008-03-14 | 2008-03-14 | Ceramic plate capable of increasing working area |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107135630A (en) * | 2016-02-29 | 2017-09-05 | Smc株式会社 | Controller assemblies |
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2008
- 2008-03-14 CN CN200810085410A patent/CN101534619A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107135630A (en) * | 2016-02-29 | 2017-09-05 | Smc株式会社 | Controller assemblies |
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Open date: 20090916 |