CN101533917B - Device for heating and refrigerating flowing liquid - Google Patents

Device for heating and refrigerating flowing liquid Download PDF

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Publication number
CN101533917B
CN101533917B CN2009100110462A CN200910011046A CN101533917B CN 101533917 B CN101533917 B CN 101533917B CN 2009100110462 A CN2009100110462 A CN 2009100110462A CN 200910011046 A CN200910011046 A CN 200910011046A CN 101533917 B CN101533917 B CN 101533917B
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China
Prior art keywords
heating plate
thermal insulation
insulation board
shaped groove
plate
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Expired - Fee Related
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CN2009100110462A
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Chinese (zh)
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CN101533917A (en
Inventor
刘冲
梁军生
李苗苗
孔令华
王大志
张文涛
吕志平
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Dalian University of Technology
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Dalian University of Technology
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Publication of CN101533917A publication Critical patent/CN101533917A/en
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Publication of CN101533917B publication Critical patent/CN101533917B/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells

Abstract

The invention relates to a device for heating and refrigerating flowing liquid, and belongs to the field of temperature control systems. The device adopts a double-layer loop-shaped passage to heat or refrigerate the flowing liquid; the device is provided with a front heating plate, a rear heating plate and a middle heating plate which have the same shape and dimension; the middle heating plate is a rectangular plate; one side of the rectangular plate is processed with a front loop-shaped groove of the middle heating plate with a semicircular cross section; and the other side of the rectangular plate is processed with a rear loop-shaped groove of the middle heating plate with a semicircular cross section. The contact faces of the front heating plate and the rear heating plate towards the middle heating plate are processed with a loop-shaped groove of the front heating plate with a semicircular cross section and a loop-shaped groove of the rear heating plate with a semicircular cross section respectively; and metal hoses are positioned in the loop-shaped grooves to form the double-layer loop passage. The lateral surface of the heating plate is stuck with four semiconductor refrigerating sheets; and by heating of the heating plate, the temperature of the flowing liquid is indirectly controlled. The device has a simple structure, has no problem of liquid sealing, is convenient to maintain and realizes even and rapid heating and refrigeration of the flowing liquid.

Description

The device of a kind of heating and refrigerating flowing liquid
Technical field
A kind of heating of the present invention belongs to field of temperature control with the device of refrigerating flowing liquid, particularly be the device that is applied to Fast Heating and refrigerating flowing liquid temperature.
Background technology
Directly fuel liquid battery is the Blast Furnace Top Gas Recovery Turbine Unit (TRT) that a kind of chemical energy that directly will be stored in liquid fuel and the oxidant efficiently, contamination-freely is converted into electric energy.It is efficient with it, environmental protection, energy density height, store outstanding advantages such as easy to carry, is considered to the ideal source of portable electric appts, is subjected to attention more and more widely.
Fuel cell technology is in development, and the factor that influences direct fuel liquid battery practicability mainly contains: the ratio of performance to price is low, and the reliability and stability of long-term work are undesirable.The influencing factor in battery performance and life-span, except the membrane electrode material and preparation technology, battery structure design and packaging technology of battery, service conditions such as temperature and flow all can produce appreciable impact to the performance and the life-span of battery.The humidifying of battery operation temperature effect catalyst activity, film, the mass transfer of inside battery and the heat balance of battery.Temperature effect battery life that liquid fuel is too high even damage battery, low excessively temperature then has a strong impact on the performance of battery.The mass transfer of the flow effect inside battery of direct liquid fuel, the too small meeting of flow causes the anode fuel undersupply, causes the concentration polarization of battery; Can increase the channelling of anode fuel from the anode to the negative electrode and flow is excessive, thereby the cooled catalyst surface temperature reduces catalyst activity simultaneously, reduce fuel cell performance.In the running of fuel cell, temperature is different to the performance impact of battery with flow under the different operating modes.Therefore, in the process of operational factors such as research temperature and flow, need the temperature and the flow of controlling liquid fuel to battery performance and life-span influence.
At present, liquid heater has various ways, but majority is the heater that is used for inactive liquid.Chinese patent ZL200520109719.5 has introduced a kind of heater that heats when liquid flow, adopt the liquid in several electric heating body heated quarty tube.Comprise a tubular heat-resistant tube and a plurality of electric heating body.Wherein quartzy heat-resistant tube inside is provided with the calandria cavity volume of several separate space, and the flow channel for liquids in each calandria cavity volume all communicates with the interior flow channel for liquids of adjacent calandria cavity volume.And in each calandria cavity volume, be provided with electric heating body.When flow of liquid is heated by electric heating body during through the runner of quartz ampoule inside, the liquid of design temperature flows out from delivery line.The cavity volume that is heated fluid in the whole heater is bigger, if having additional supply of electric power to electric heating body, then needs the liquid of the output design temperature that one period long period could be stable after predetermined temperature is set.After turning down, design temperature need the long period could stablize the liquid that the back temperature is adjusted in output equally.U.S. Pat 5381510 discloses the working fluid heater of another kind of form.It has a flat board that has the serpentine flow structure, and a dull and stereotyped end leaves the inlet of serpentine flow, and the other end leaves outlet.Dull and stereotyped upper and lower surface is used for the crossfire between heat conduction and partition adjacent channels closely with the flexible aluminium foil that is easy to heat conduction, and the outside of each aluminium foil is a heating plate.Heating plate heats the dull and stereotyped fluid of going up serpentine flow of flowing through by aluminium foil.But the too big heats that influences of the size of serpentine flow, the too little flow field difficulty of processing that then increases of size, and also the sealing of dull and stereotyped and aluminium foil is relatively more difficult.
Summary of the invention
The technical barrier that the present invention will solve is the defective that overcomes prior art, the device of a kind of heating with refrigerating flowing liquid is provided, on the contact-making surface of adjacent heating plate, mill out back-shaped groove, two-layer groove is communicated with in the through hole of middle heating plate, and metal hose is embedded in the groove passage as working fluid.Double-deck back-shaped passage has increased the flowing time of fluid in heater greatly, helps abundant heat transfer.Adopt semiconductor chilling plate by heating plate indirectly to working fluid heating or refrigeration, liquid heat or refrigeration fast evenly, the working fluid temperature of can very fast tracking setting.
The technical solution used in the present invention is: the device of a kind of heating and refrigerating flowing liquid is characterized in that: adopt double-deck back-shaped passage heating or refrigerating flowing liquid, device has the identical preceding heating plate 4 of overall dimension, back heating plate 7 and middle heating plate 6; Middle heating plate 6 is rectangular plates, it is the positive back-shaped groove h of semicircular middle heating plate that its one side is processed with cross section, it is the semicircular middle heating plate back-shaped groove i in the back side that another side also is processed with cross section, at middle heating plate 6 centers a through hole d is arranged, by alignment pin 16 heating plate 4 and back heating plate 7 before the both sides of middle heating plate 6 are separately installed with, preceding heating plate 4 and back heating plate 7 before to be processed with cross section on the contact-making surface of middle heating plate 6 respectively be semicircular the back-shaped groove g of heating plate and after the back-shaped groove a of heating plate; Metal hose 5 is positioned among preceding back-shaped groove g of heating plate and the positive back-shaped groove h of middle heating plate, forming cross section is circular back-shaped passage, and after passing the through hole d of middle heating plate 6, be positioned among middle heating plate back-shaped groove i in the back side and the back-shaped groove a of back heating plate, whole double-deck back-shaped passage, the filling heat-conducting silicone grease 25 between metal hose 5 and back-shaped passage of forming; Before thermal insulation board 2 and back two cuboid cavity ms identical with semiconductor chilling plate 3 shapes are respectively arranged on the thermal insulation board 9 respectively, and before being installed on by fin bolt 18 and fin nut 26 symmetries heating plate 4 with after the outside of heating plate 7; 4 semiconductor chilling plates 3 embed respectively among 4 cuboid cavity m, and the face that the heats n of 4 semiconductor chilling plates 3 towards preceding heating plate 4 and back heating plate 7, is equipped with 4 fin 11 at the chill surface p of semiconductor chilling plate 3 respectively; The outside of thermal insulation board 2 and back thermal insulation board 9 before 4 fin 11 are separately fixed at by fin bolt 18 and fin nut 26 is filled heat-conducting silicone grease 25 at 4 fin 11 with the place, slit of preceding thermal insulation board 2 and back thermal insulation board 9; Fin bolt 18 outsides are with bolt plastic, thermal-insulation cover 15; The outside of 4 fin 11 is separately installed with 4 fans 10, and heat-conducting silicone grease 25 is filled at place, the slit between fin 11 and fan 10; Before the upper and lower, left and right face of heating plate 4, middle heating plate 6 and back heating plate 7 respectively be coated with heat insulation support 13, heat insulation support 1, left heat insulation support 12 and right heat insulation support 14 down, with preceding thermal insulation board 2 and back thermal insulation board 9 jointly with three heating plates encirclements; The left surface of thermal insulation board 2 and back thermal insulation board 9 before the heat insulation support 12 in a left side is fixed on by left socle screw 19, the right flank of thermal insulation board 2 and back thermal insulation board 9 before right heat insulation support 14 is fixed on by right support screw 20, go up heat insulation support 13 is fixed on preceding thermal insulation board 2 and back thermal insulation board 9 by upper bracket screw 17 upper side, the bottom surface of heat insulation support 1 is processed with screw deep gouge q down, and is fixed on the downside of preceding thermal insulation board 2 and back thermal insulation board 9 by lower carriage screw 8.
Remarkable result of the present invention is that heater is simple in structure, and the no liquid sealing problem is convenient to operation.Double-deck back-shaped passage has increased the flowing time of fluid in heater greatly, helps abundant heat transfer.Can be evenly, heating or refrigerating flowing liquid fast, can fast and stable ground when changing heating-up temperature export the liquid of design temperature.
Description of drawings
Fig. 1 is the front view of a kind of heating and refrigerating flowing liquid device, Fig. 2 is the A-A cutaway view of Fig. 1, Fig. 3 is the B-B cutaway view of Fig. 2, Fig. 4 is the C-C cutaway view of Fig. 2, Fig. 5 is the left view of Fig. 1, Fig. 6 is the solid expanded view left of three heating plates, and Fig. 7 is the solid expanded view to the right of three heating plates, Fig. 8 be in the middle of the assembling relationship figure of heating plate and metal hose.Wherein: thermal insulation board before the heat insulation support under the 1-, 2-, 3-semiconductor chilling plate, heating plate before the 4-, heating plate in the middle of the 5-metal hose, 6-, heating plate behind the 7-, 8-lower carriage screw, thermal insulation board behind the 9-, 10-fan, 11-fin, the heat insulation support in a 12-left side, the last heat insulation support of 13-, the right heat insulation support of 14-, 15-bolt plastic, thermal-insulation cover, the 16-alignment pin, 17-upper bracket screw, 18-fin bolt, 19-left socle screw, 20-right support screw, 21-semiconductor chilling plate cathode power supply line, 22-semiconductor chilling plate anode power cord, 23-fan cathode power supply line, 24-fan anode power cord, the 25-heat-conducting silicone grease, 26-fin nut, the back-shaped groove of heating plate behind the a-, heating plate insulation trepanning behind the b-, heating plate location hole behind the c-, heating plate location hole before the d-through hole, e-, heating plate insulation trepanning before the f-, the positive back-shaped groove of heating plate in the middle of the back-shaped groove of heating plate before the g-, h-, the back-shaped groove in the heating plate back side in the middle of the i-, heating plate location hole in the middle of the j-, heating plate insulation trepanning in the middle of the k-, m-cuboid cavity, n-heats face, p-heats face, q-screw deep gouge.
Embodiment
Describe enforcement of the present invention in detail below in conjunction with technical scheme and accompanying drawing.Shown in accompanying drawing 1,2,3,4,5,6,7,8, the device of a kind of heating of this invention and refrigerating flowing liquid, adopt semiconductor chilling plate to heat to heating plate, and then conduct heat to the indirect mode of the working fluid in the metal hose, increase the flow path of liquid in heater by back-shaped pipeline, prolong the flowing time of liquid in heater.It mainly comprises three heating plates, a strip metal flexible pipe, four semiconductor chilling plates, four radiators, two thermal insulation boards, four heat insulation supports and four fans.
Preceding heating plate 4, middle heating plate 6 and back heating plate 7 are three identical cuboid copper coins that are stacked together successively of overall dimension.It is the semicircular preceding back-shaped groove g of heating plate, middle heating plate positive back-shaped groove h, the back-shaped groove i in the middle heating plate back side and the back-shaped groove a of back heating plate that the one side of the one side of preceding heating plate 4, the two-sided and back heating plate 7 of middle heating plate 6 mills out a cross section respectively.After preceding heating plate 4 and middle heating plate 6 closely stack, the positive back-shaped groove h of preceding back-shaped groove g of heating plate and middle heating plate forms the conglobate back-shaped passage of cross section, one end opening of passage is at the lower-left of middle heating plate 6 end, and other end opening is located at the through hole d (center of heating plate 6 in the middle of being positioned at) of middle heating plate 6.After middle heating plate 6 and back heating plate 7 closely stack, middle heating plate back-shaped groove i in the back side and the back back-shaped groove a of heating plate form the conglobate back-shaped passage of cross section, opening one end of passage is at the left upper end of middle heating plate 6, and other end opening is at the through hole d place of middle heating plate 6.For the channel cross-section that forms between the back-shaped groove g of heating plate before guaranteeing and the positive back-shaped groove h of middle heating plate and back-shaped groove i in the middle heating plate back side and the back-shaped groove a of back heating plate is circle, before the lower right corner of heating plate 4, middle heating plate 6 and back heating plate 7 have before heating plate location hole e, middle heating plate location hole j and back heating plate location hole c, and clamp by alignment pin 16 location.Groove between three layers of heating plate has formed the back-shaped passage of a kind of bilayer.
The metal hose 5 that is used for liquid flow path can adopt stainless steel material, it is coiled and the identical shape of double-deck back-shaped passage, the cross section that positive back-shaped groove h of the back-shaped groove g of heating plate and middle heating plate and the back-shaped groove i in the middle heating plate back side and the back back-shaped groove a of heating plate form before being positioned over is in the circular back-shaped passage, two-layer between through hole d by middle heating plate 6 be communicated with.The inlet of metal hose 5 is at the lower-left of middle heating plate 6 end, and outlet is at the left upper end of middle heating plate 6.Between metal hose 5 and back-shaped passage, fill heat-conducting silicone grease 25, good to guarantee the heat conduction between metal hose 5 and 3 heating plates.
Preceding thermal insulation board 2 and back thermal insulation board 9 can adopt the cuboid plate of polytetrafluoroethylene or polyethylene from high pressure process material, be individually fixed in the outside of preceding heating plate 4 and back heating plate 7 by fin bolt 18 and fin nut 26, be used for the insulation of 3 heating plates, the heat dissipation that prevents heating plate is in external environment.Hollow out two cuboid cavity ms identical on it respectively with semiconductor chilling plate 3 shapes.Fin bolt 18 outsides are with bolt plastic, thermal-insulation cover 15, and are lost from fin bolt 18 with the heat of heating plate before preventing 4 and back heating plate 7.
The semiconductor chilling plate 3 of 4 same sizes is embedded respectively among the cuboid cavity m of preceding thermal insulation board 2 and back thermal insulation board 9, heat-conducting silicone grease 25 was filled at heating plate 4 and back heating plate 7 and place, slit before the face that the heats n of 4 semiconductor chilling plates 3 was closely pasting, and guaranteed that the heat conduction between semiconductor chilling plate 3 and preceding heating plate 4 and the back heating plate 7 is good.The fine copper fin 11 of 4 same sizes closely is attached to the chill surface p of 4 semiconductor chilling plates 3 respectively, the heat or the cold air that are used for semiconductor chilling plate 3 spread to external environment, prevent the chill surface p of semiconductor chilling plate 3 and heat the damage that the face m temperature difference causes semiconductor chilling plate 3 too greatly.Heat-conducting silicone grease 25 is filled at the place, slit of semiconductor chilling plate 3 and fin 11, guarantees that heat conduction between the two is good.The outside of thermal insulation board 2 and back thermal insulation board 9 before 4 fin 11 are separately fixed at by fin bolt 18 and fin nut 26.4 fans 10 by self structure with clip be directly installed on the outside of 4 fin 11, be used to increase cross-ventilation, strengthen the diffusion of fin 11 heats or cold air, reduce chill surface p and heat the temperature difference of face m.
Can adopt the cuboid sheet material of polytetrafluoroethylene or polyethylene from high pressure process material: go up heat insulation support 13, following heat insulation support 1, left heat insulation support 12 and right heat insulation support 14, heating plate 4, middle heating plate 6 and back heating plate 7 before encasing jointly from the upper and lower, left and right four direction respectively, jointly 3 heating plates and external environment are separated with preceding thermal insulation board 2 and back thermal insulation board 9, play insulation effect.The left surface of thermal insulation board 2 and back thermal insulation board 9 before the heat insulation support 12 in a left side is fixed on by left socle screw 19, the right flank of thermal insulation board 2 and back thermal insulation board 9 before right heat insulation support 14 is fixed on by right support screw 20, go up heat insulation support 13 is fixed on preceding thermal insulation board 2 and back thermal insulation board 9 by upper bracket screw 17 upper side, the downside of thermal insulation board 2 and back thermal insulation board 9 worked the bilayer effect that is incubated and supports whole heater before heat insulation support 1 was fixed on by lower carriage screw 8 down.In addition, the bottom surface of following heat insulation support 1 is processed with the screw deep gouge q of lower carriage screw 8, and the bottom surface of heat insulation support 1 is smooth under guaranteeing.
The present invention is a kind of, and to heat the device operation principle of working fluid as follows: the liquid fuel constant flow of direct fuel liquid battery is fed in the metal hose 5, and fluid temperature sensor is put in the exit of metal hose 5, be used to monitor the temperature of working fluid.The power supply of connecting the 12V Switching Power Supplies when semiconductor chilling plate cathode power supply line 21 just, when semiconductor chilling plate anode power cord 22 is connected the power supply ground of 12V Switching Power Supply, semiconductor chilling plate 3 is started working, it heats face m and produces heat, preceding heating plate 4, middle heating plate 6 and back heating plate 7 temperature rise, then give the liquid fuel heat of 5 li of metal hoses, simultaneously before thermal insulation board 2, back thermal insulation board 9, go up heat insulation support 13, heat insulation support 1, left heat insulation support 12 and right heat insulation support 14 heat that reduced three heating plates greatly scatters and disappears in the environment towards periphery down.When the temperature of liquid fuel arrived the target temperature of setting, disconnection semiconductor chilling plate 3 was connected with the 12V Switching Power Supply, and semiconductor chilling plate 3 stops heating.The temperature constant of heating plate 4, middle heating plate 6 and back heating plate 7 is a set point before regulating by the power-on time of control semiconductor chilling plate 3, thus control metal hose 5 outlet flowing liquid fuel temperatures.When needs reduced the temperature of liquid fuel, semiconductor chilling plate cathode power supply line 21 was connected the power supply ground of 12V Switching Power Supply, and the power supply of semiconductor chilling plate anode power cord 22 connection 12V Switching Power Supplies just.Then the face that the heats m of semiconductor chilling plate 3 begins refrigeration, preceding heating plate 4, middle heating plate 6 and back heating plate 7 temperature reduce, thereby the temperature of working fluid fuel reduces, and when liquid fuel reached the target temperature of setting, disconnection semiconductor chilling plate 3 was connected with the 12V Switching Power Supply.In semiconductor chilling plate 3 work, the power supply that fan cathode power supply line 23 is connected the 5V power supplies just, fan anode power cord 24 is connected the power supply ground of 5V power supplies.Fan 10 is in running order, be used to increase the convection current of surrounding air, help cold air or the heat of semiconductor chilling plate 3 chill surface p in time to be diffused in the surrounding air, reduce the semiconductor chilling plate 3 chill surface p and the temperature difference that heats face m, prevent that semiconductor chilling plate 3 from damaging too greatly because of the two sides temperature difference.
The present invention uses electric energy effectively to heat working fluid, and control rapidly.Employing prolongs the method for liquid flow path length as far as possible in the useful space, realized that the temperature of working fluid is accurately controlled, and a kind of Fast Heating and refrigerating plant of working fluid is provided.

Claims (1)

1. the device of heating and refrigerating flowing liquid is characterized in that, adopts double-deck back-shaped passage heating or refrigerating flowing liquid, and device has the identical preceding heating plate (4) of overall dimension, afterwards heating plate (7) and middle heating plate (6); Middle heating plate (6) is a rectangular plate, it is the positive back-shaped groove (h) of semicircular middle heating plate that its one side is processed with cross section, it is the semicircular middle back-shaped groove in the heating plate back side (i) that another side is processed with cross section, at middle heating plate (6) center a through hole (d) is arranged, be separately installed with preceding heating plate (4) and back heating plate (7) in the both sides of middle heating plate (6) by alignment pin (16), preceding heating plate (4) and back heating plate (7) be back-shaped groove of heating plate (g) and the back back-shaped groove of heating plate (a) before to be processed with cross section on the contact-making surface of middle heating plate (6) respectively be semicircular; Metal hose (5) is positioned in preceding back-shaped groove of heating plate (g) and the positive back-shaped groove of middle heating plate (h), forming cross section is circular back-shaped passage, and after passing the through hole (d) of middle heating plate (6), be positioned in middle back-shaped groove in the heating plate back side (i) and the back back-shaped groove of heating plate (a), the double-deck back-shaped passage of whole formation is filled heat-conducting silicone grease (25) between metal hose (5) and back-shaped passage; Before two cuboid cavitys (m) identical with semiconductor chilling plate (3) shape are respectively arranged on thermal insulation board (2) and back thermal insulation board (9) respectively, and be installed on the outside of preceding heating plate (4) and back heating plate (7) by fin screw (18) symmetry; 4 semiconductor chilling plates (3) embed respectively in 4 cuboid cavitys (m), the face that heats (n) of 4 semiconductor chilling plates (3) is respectively towards preceding heating plate (4) and back heating plate (7), the fin of 4 same sizes (11) closely is attached to respectively on the chill surface (p) of 4 semiconductor chilling plates (3), 4 fin (11) are separately fixed at the outside of preceding thermal insulation board (2) and back thermal insulation board (9) by fin screw (18), at place, the slit filling heat-conducting silicone grease (25) of 4 fin (11) and preceding thermal insulation board (2) and back thermal insulation board (9); Fin screw (18) outside is with screw plastic, thermal-insulation cover (15); 4 fans (10) by self structure with clip be directly installed on the outside of 4 fin (11), and heat-conducting silicone grease (25) is filled at place, the slit between fin (11) and fan (10); The upper and lower, left and right face of preceding heating plate (4), middle heating plate (6) and back heating plate (7) respectively is coated with heat insulation support (13), following heat insulation support (1), left heat insulation support (12) and right heat insulation support (14), jointly three heating plates is surrounded with preceding thermal insulation board (2) and back thermal insulation board (9); The heat insulation support in a left side (12) is fixed on the left surface of preceding thermal insulation board (2) and back thermal insulation board (9) by left socle screw (19), right heat insulation support (14) is fixed on the right flank of preceding thermal insulation board (2) and back thermal insulation board (9) by right support screw (20), go up heat insulation support (13) is fixed on preceding thermal insulation board (2) and back thermal insulation board (9) by upper bracket screw (17) upper side, the bottom surface of heat insulation support (1) is processed with screw deep gouge (q) down, and is fixed on the downside of preceding thermal insulation board (2) and back thermal insulation board (9) by lower carriage screw (8).
CN2009100110462A 2009-04-02 2009-04-02 Device for heating and refrigerating flowing liquid Expired - Fee Related CN101533917B (en)

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CN2009100110462A CN101533917B (en) 2009-04-02 2009-04-02 Device for heating and refrigerating flowing liquid

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Application Number Priority Date Filing Date Title
CN2009100110462A CN101533917B (en) 2009-04-02 2009-04-02 Device for heating and refrigerating flowing liquid

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CN101533917B true CN101533917B (en) 2010-09-08

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869249B (en) * 2012-12-14 2016-06-22 上海汽车集团股份有限公司 Storage battery test bench installation
CN106394306A (en) * 2016-12-01 2017-02-15 中车株洲电力机车有限公司 Suspension electromagnet packaging structure and suspension electromagnet
CN109962262B (en) * 2019-03-18 2020-10-27 东莞众创新能源科技有限公司 Temperature control mechanism and fuel cell with same
CN111029614A (en) * 2019-11-29 2020-04-17 天津中德应用技术大学 Proton exchange membrane fuel cell stack temperature control device and method based on semiconductor refrigerator

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