CN101517445A - Process for manufacturing light guide - Google Patents
Process for manufacturing light guide Download PDFInfo
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- CN101517445A CN101517445A CNA200780034484XA CN200780034484A CN101517445A CN 101517445 A CN101517445 A CN 101517445A CN A200780034484X A CNA200780034484X A CN A200780034484XA CN 200780034484 A CN200780034484 A CN 200780034484A CN 101517445 A CN101517445 A CN 101517445A
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- sandwich layer
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- covering
- optical waveguide
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Abstract
The present invention provides a process for manufacturing a light guide, including the steps of hardening a cladding layer forming resin superimposed on a base material to thereby form an inferior cladding layer; superimposing a core layer forming resin film on the inferior cladding layer to thereby form a core layer; subjecting the core layer to exposure/development to thereby form a core pattern; and hardening a cladding layer forming resin provided so as to bury the core pattern to thereby form a superior cladding layer, characterized in that the core layer forming step includes the operations of (1) temporarily attaching the core layer forming resin film onto the inferior cladding layer with the use of roll laminator and (2) performing hot press bonding of the temporarily attached core layer forming resin film in vacuum atmosphere. Thus, there can be provided a process for manufacturing a light guide with uniform core in high productivity.
Description
Technical field
The present invention relates to have uniform core, the good method for manufacturing optical waveguide of productivity.
Background technology
Along with the increase of information capacity,, and also use the exploitation of the optical interconnection technology of light signal to make progress in the information processing in router or server not only in main line or a kind of like this communications field of connecting system.Specifically, use up, carrying out the exploitation of the optical/electrical mixed mounting substrate of compound optical transmission pathway on electric distributing board in order to make between the plate in router or server unit or in the short-range signal in the plate transmission.As optical transmission pathway, wish to use and to compare with optical fiber, high and the optical waveguide that can densification of the degree of freedom of distribution especially, wishes to use the optical waveguide of the good polymeric material of processability, economy.
For optical waveguide and electric distributing board are coexisted, therefore when requiring high transparent, also require high-fire resistance, as such a optical waveguide material, (for example the real dress of エ レ Network ト ロ ニ Network ス is learned will to have proposed fluorinated polyimide, Vol.7, No.3, pp.213-218,2004) or epoxy resin (for example the spy opens flat 6-228274 communique).
Fluorinated polyimide has the high-fire resistance more than 300 ℃ and has the high transparent of 0.3dB/cm at wavelength 850nm, but when film forming, need be at the heating condition from tens of minutes to a few hours more than 300 ℃, thereby the film forming on electric distributing board is difficult.In addition, fluorinated polyimide does not have photonasty, thereby can not use the optical waveguide facture that is produced by sensitization, development, and is very unfavorable aspect productivity, large tracts of landization.Have again, because carrying out the method for film forming, use aqueous material of coating on substrate makes optical waveguide, so the control of thickness is miscellaneous, and the resin that is coated on the substrate is aqueous before curing, resin can flow on substrate, be difficult to keep the homogeneity of thickness etc., these all are problem that produce because material shape is aqueous.
On the other hand, the optical waveguide of adding Photoepolymerizationinitiater initiater in liquid epoxy resin forms uses epoxy resin, it is possible utilizing sensitization, development method to form the core pattern, also has high transparent, high-fire resistance, but also exist because of material be the aqueous same problem that produces.
Therefore, can adopt such method to make the good optical waveguide of transport property: lamination contains the dry film that can carry out the composition of radioactive ray polymerization on substrate, shine the light of ormal weight and make the place of regulation that radiation-curing take place, when forming covering, unexposed portion is developed, grade thereby form core, be formed for imbedding the covering of this core segment again.If this method of use is just guaranteed the flatness of the covering after core is imbedded easily.In addition, also be applicable to the large-area optical waveguide of manufacturing.As the method that press dry film on the substrate upper strata, the known vacuum type laminating machine that utilizes, under reduced pressure carry out the so-called vacuum lamination mode of lamination, it is disclosed that described vacuum type laminating machine such as spy open Fig. 1 and Fig. 2 of flat 11-320682 communique, forms vacuum chamber by relatively movable up and down a pair of block body., when vacuumizing in vacuum chamber, air is mobile in vacuum chamber, and therefore the dust around rolling etc. exist in the preceding such problem of dust of adhering easily of lamination between dry film and matrix material.In addition, wrinkle take place easily when lamination because these wrinkle, when forming the core of optical waveguide or core thick, or lack the distortion of core, by light signal the time,, cause losing the big problem of change in core variant part light generation scattering.
Summary of the invention
The present invention in view of the above problems, purpose is to provide productivity to make the method for the optical waveguide with uniform core well.
The inventor carries out found that of intensive research, uses the method in following record, can solve above-mentioned problem.
That is, the present invention provides,
(1) method for manufacturing optical waveguide, it has: make at the resin solidification that is used to form covering that forms on the matrix material and the operation of wrap under forming, press the operation that is used to form the resin film of sandwich layer and forms sandwich layer on this time wrap upper strata, this sandwich layer exposure imaging is formed the operation of core pattern, and make the resin solidification that is used to form covering that forms in order to imbed this core pattern and form the operation of upper clad layer, it is characterized in that the operation that forms this sandwich layer has (1) and uses the roll-in laminator to be used to form the operation of the resin film of sandwich layer and (2) operation with this resin film heat pressure adhesive that is used to form sandwich layer of temporarily fitting under the decompression atmosphere in temporary transient applying on the following wrap.
According to the method for manufacturing optical waveguide of above-mentioned (1) record, it is characterized in that (2) in above-mentioned operation (1), use the laminating machine with warm-up mill as the roll-in laminator, heat pressure adhesive is used to form the resin of sandwich layer and temporarily fits on following wrap.
(3) method for manufacturing optical waveguide of putting down in writing according to above-mentioned (1) or (2), it is characterized in that, in above-mentioned operation (2), use plate laminating machine, the resin film heat pressure adhesive that is used to form sandwich layer that under the decompression atmosphere, will in above-mentioned operation (1), temporarily fit.And
According to the method for manufacturing optical waveguide of each record in above-mentioned (1)～(3), it is characterized in that (4) above-mentioned wrap does not down form height difference on the surface of laminated sandwich layer one side.
According to the present invention, can provide productivity to make optical waveguide well with uniform core.
Description of drawings
The figure of Fig. 1 method for manufacturing optical waveguide of the present invention that to be explanation use as matrix material with the supporting carrier film of the resin film that is used to form covering.
Fig. 2 be explanation on the matrix material different with the supporting carrier film of the resin film that is used to form covering, be formed for forming the figure of method for manufacturing optical waveguide of the present invention of the resin of covering.
Fig. 3 is the figure that the resin film that is used to form covering that uses in method for manufacturing optical waveguide of the present invention is described.
Fig. 4 is the figure that the resin film that is used to form sandwich layer that uses in the manufacture method of flexible optical waveguide of the present invention is described.
Symbol description
1: matrix material, 2: under-clad layer, 3: sandwich layer; 4: supporting carrier film (being used to form sandwich layer), 5: roll-in laminator, 6: the vacuum pressed laminator; 7: photomask, 8: core pattern, 9: top covering; 10: supporting carrier film (being used to form covering); 11: protective film (protective seam), 20: be used to form the resin of covering, 30: the resin that is used to form sandwich layer; 200: be used to form the resin film of covering, 300: the film that is used to form sandwich layer.
Embodiment
Optical waveguide constructed in accordance, for example shown in Fig. 1 (f) and Fig. 2 (g), it is the optical waveguide that on matrix material 1, has following wrap 2, core pattern 8 and upper clad layer 9, can use a kind of resin film (Fig. 4 that is used to form sandwich layer with high index of refraction, 300) and have 2 kinds of resins that are used to form covering of low-refraction, the preferred resin film (Fig. 3,200) that is used to form covering is made.By using the film like material, can solve the problem of distinctive productivity of relevant liquid material or large tracts of land correspondence.
Matrix material
As the kind of matrix material 1, restriction especially for example can not used FR-4 substrate, polyimide, semiconductor substrate, silicon substrate or glass substrate etc.
In addition, as matrix material 1,, can on optical waveguide, give flexibility and obdurability because of using film.Material as film, not restriction especially, but consider from viewpoint with flexibility, obdurability, polyester such as the suitable polyethylene terephthalate enumerated, polybutylene terephthalate, Polyethylene Naphthalate, tygon, polypropylene, polyimide, polycarbonate, polyphenylene oxide, polyether sulfides, polyarylate, liquid crystal polymer, polysulfones, polyethersulfone, polyetheretherketone, polyetherimide, poly-imines acid imide, polyimide etc.
Film thickness can change aptly according to the flexibility as purpose, preferably 5～250 μ m.If more than the 5 μ m, just have to obtain the such benefit of obdurability easily, if below the 250 μ m, just obtain sufficient flexibility.
As matrix material shown in Figure 11, can use the supporting carrier film 10 that in the manufacturing process of the resin film 200 that is used to form covering described later, uses.In the case, as the resin film 200 that is used to form covering, as shown in Figure 3, the resin 20 that is used to form covering is preferably being implemented film forming on the supporting carrier film 10 that adhesion handles.Whereby, the clinging power of wrap 2 and matrix material 1 is improved, can suppress to descend peeling off of wrap 2 and matrix material 1 bad.Here, so-called adhesion is handled, and is by the rough processing that produced by easy adhesion resinous coat, corona treatment, blasting treatment etc. etc., makes supporting carrier film 10 and the processing of the clinging power raising of the resin that is used to form covering 10 that forms thereon.
In addition, as matrix material 1, when using other matrix materials beyond the above-mentioned supporting carrier film 10, as shown in Figure 2, on supporting carrier film 10, be used to form the resin film that is used to form covering 200 that resin 20 film forming of covering form and also can utilize laminating etc. to transfer on the matrix material 1.In the case, the processing of preferably on this supporting carrier film 10, not adhering.
In addition, the outside at above-mentioned covering also can have matrix material, kind as this matrix material, can enumerate the kind identical, for example can enumerate the employed supporting carrier film 10 etc. in the manufacturing process of the resin film 200 that is used to form covering described later shown in Fig. 1 (f) with above-mentioned matrix material 1.
Also the several layers of macromolecule layer with core pattern and covering can be laminated on the one side or two sides of above-mentioned matrix material, make multilayer lightguide.
Have again, also can electric distribution be set on above-mentioned matrix material 1, in the case, also can use the matrix material that sets in advance electric distribution as matrix material 1.Perhaps, also can after making, optical waveguide on matrix material 1, form electric distribution.Thus, on substrate 1, possess two kinds of transmission lines of the signal transmssion line of the signal transmssion line of metal wiring and optical waveguide, can separately use both, can easily carry out at a high speed and the signal transmission of long distance fast.
Be used to form the resin and the resin film that is used to form covering of covering
Below, be described in detail resin that is used to form covering that uses among the present invention and the resin film (Fig. 3,200) that is used to form covering.
As the resin that is used to form covering that uses among the present invention, if lower than sandwich layer refractive index, perhaps the resin combination that solidifies by light or heat generation with regard to not restriction especially, can be fit to use compositions of thermosetting resin or photosensitive polymer combination.What be used to form that the resin of covering is more suitable for preferably is made of (A) matrix polymer, (B) optical polymerism compound and the resin combination that (C) contains Photoepolymerizationinitiater initiater.Moreover, the resin combination that in being used to form the resin of covering, uses, in upper clad layer 9 and following wrap 2, the composition that contains this resin combination can be identical, also can be different, the refractive index of this resin combination can be identical, also can be different.
(A) used herein matrix polymer is the intensity that is used to form covering and guarantees this covering, so long as can reach the matrix polymer of this purpose, just not restriction especially, can enumerate phenoxy resin, epoxy resin, (methyl) acryl resin, polycarbonate resin, polyarylate resin, polyetheramides, polyetherimide, polyethersulfone etc., perhaps their derivant etc.These matrix polymers can use a kind separately, perhaps also can mix more than 2 kinds and use.In above-mentioned illustrative matrix polymer, consider preferably on main chain, have the aromatics skeleton from the viewpoint that thermotolerance is high, preferred especially phenoxy resin.In addition, crosslinked from carrying out 3 dimensions, can improve stable on heating viewpoint and consider, preferred epoxy, special is solid-state epoxy resin in room temperature.Having, with the intermiscibility of (B) described later optical polymerism compound, is important for the transparency of the resin of guaranteeing to be used to form covering again, considers preferred above-mentioned epoxy resin and (methyl) acryl resin from this point.Moreover at this, so-called (methyl) acryl resin is to mean acryl resin and methacrylic resin.
Even among the phenoxy resin, contain with bisphenol-A, bisphenol type epoxy compound or its derivant and Bisphenol F, Bisphenol F type epoxy compound or its derivant phenoxy resin, because thermotolerance, stickability and dissolubility are good and preferred as the component unit of polymerization composition.Derivant as bisphenol-A or bisphenol type epoxy compound, suitable tetrabromobisphenol A, the epoxidised derivant of tetrabromobisphenol A type etc. enumerated, in addition, as the derivant of Bisphenol F or Bisphenol F type epoxy compound, the suitable tetrabromobisphenol enumerated F, tetrabromobisphenol F type epoxy compound etc.As the object lesson of bisphenol-A/Bisphenol F copoly type phenoxy resin, can enumerate Toto Kasei KK's system " Off エ ノ ト-ト YP-70 " (trade name).
As epoxy resin, for example can enumerate Toto Kasei KK's system " エ Port ト-ト YD-7020, エ Port ト-ト YD-7019, エ Port ト-ト YD-7017 " (all being trade name), ジ ヤ パ Application エ ボ キ シ レ ジ Application Co., Ltd.'s system " Ai Bikete 1010, Ai Bikete 1009, Ai Bikete 1008 " bisphenol A type epoxy resins such as (all being trade name) in room temperature solid.
Then, as (B) optical polymerism compound, so long as the optical polymerism compound that carries out polymerization by light such as irradiation ultraviolet radiations, just restriction especially can be enumerated compound that has the ethene unsaturated group in molecule or the compound that has the epoxy radicals more than 2 in molecule etc.
As the compound that in molecule, has the ethene unsaturated group, can enumerate (methyl) acrylate, vinylidene halide, vinyl ether, vinylpyridine, vinylphenol etc., even but among these, consider preferred (methyl) acrylate from the transparency and stable on heating viewpoint.
As (methyl) acrylate, can use any of (methyl) acrylate of (methyl) acrylate, 3 functionalities of (methyl) acrylate, 2 functionalities of 1 functionality.Moreover so-called here (methyl) acrylate is to mean acrylic acid and methacrylate.
As the compound that has the epoxy radicals more than 2 in the molecule, can enumerate bisphenol A type epoxy resin etc. 2 officials can or multifunctional aromatic glycidyl ethers, 2 officials of polyethylene glycol type epoxy resin etc. can or multifunctional aliphatic glycidyl ether, the 2 officials energy alicyclic ring glycidol ether of bisphenol-A epoxy resin etc., 2 functional aromatic ethylene oxidic esters of o-phthalic acid diglycidyl ester etc., the 2 officials energy ester ring type ethylene oxidic ester of tetrahydrophthalic acid 2-glycidyl ester etc., N, 2 officials of N-diglycidylaniline etc. can or multifunctional aromatics glycidyl group amine, the 2 officials energy alicyclic epoxy resin of alicyclic diepoxy carboxylate etc., 2 officials energy hetero ring type epoxy resin, multifunctional hetero ring type epoxy resin, 2 officials can or the multifunctional epoxy silicone etc. that contains.These (B) optical polymerism compounds can separately or make up more than 2 kinds and use.
Then, Photoepolymerizationinitiater initiater as (C) composition, have no particular limits, initiating agent during for example as use epoxy compound in (B) composition can be enumerated aryl diazonium salts, diaryl group iodized salt, triarylsulfonium salt, triaryl selenium salt, dialkyl group phenacyl (dialkylphenazyl) sulfonium salt, dialkyl group-4 hydroxy phenyl sulfonium salt, sulphonic acid ester etc.
In addition; initiating agent when in (B) composition, using the compound in molecule, have the ethene unsaturated group; can enumerate aromatic ketones such as benzophenone; quinones such as 2-EAQ; benzoin ether compounds such as benzoin methylether; benzoin compounds such as benzoin; benzyl derivatives such as benzyl dimethyl ketal; 2-(Chloro-O-Phenyl)-4; 2 of 5-diphenyl-imidazole dipolymer etc.; 4; 5-triarylimidazoles dipolymer; benzimidazoles such as 2-mercaptobenzimidazole; two (2; 4,6-trimethylbenzoyl) phosphinoxides such as phenyl phosphine oxide; acridine derivatives such as 9-phenylacridine; N-phenylglycine; the N-phenylglycine derivant; coumarin series compounds etc.In addition, as the combination of diethyl thioxanthone and dimethylaminobenzoic acid, also can make up thioxanthones based compound and tertiary amine compound.Moreover, consider from the viewpoint of the transparency that improves sandwich layer and covering, in the above-claimed cpd, preferred aromatic ketone and phosphinoxides.These (C) Photoepolymerizationinitiater initiater can separately or make up more than 2 kinds and use.
(A) use level of matrix polymer, (A) composition and (B) total amount of composition relatively are preferably 5～80 quality %.In addition, (B) use level of optical polymerism compound, (A) and (B) total amount of composition relatively are preferably 95～20 quality %.
Should (A) composition and (B) use level of composition, if (A) composition is more than the 5 quality %, (B) composition is below the 95 quality %, just can make the easy filming of resin combination.On the other hand, if (A) composition is below the 80 quality %, (B) composition is more than the 20 quality %, (A) matrix polymer is twined and curing easily, when forming optical waveguide, and the raising of pattern formation property, and also photocuring reaction carries out fully.Consider that from above viewpoint as this (A) composition and (B) use level of composition, more preferably (A) composition is 10～75 quality %, (B) composition is 90～25 quality %, and most preferably (A) composition is 20～70 amount %, and (B) composition is 80～30 quality %.
(C) use level of Photoepolymerizationinitiater initiater, (A) composition and (B) total amount 100 mass fractions of composition relatively are preferably 0.1～10 mass fraction.This use level is if more than 0.1 mass fraction, and light sensitivity is exactly fully, and on the other hand if below 10 mass fractions, the light absorption on the top layer of resin combination when exposure does not just increase, and inner photocuring becomes abundant.Having, when using as optical waveguide, because the influence of the light absorption of polymerization initiator self is transported loss and also do not increased, is suitable again.Consider (C) use level of Photoepolymerizationinitiater initiater, more preferably 0.2～5 mass fraction from above viewpoint.
In addition, in addition, as required, in being used to form the resin of covering, also can adding antioxidant, prevent so-called adjuvants such as xanthochromia agent, ultraviolet light absorber, visible light absorber, colorant, plastifier, stabilizing agent, filling agent with the ratio that effect of the present invention is not given baneful influence.
Be used to form the resin film (Fig. 3,200) of covering,, be coated on the above-mentioned supporting carrier film 10, remove solvent then and just can easily make by in solvent, dissolving the resin combination that contains above-mentioned (A)～(C) composition.
The supporting carrier film 10 that uses in the manufacturing process of the resin film 200 that is used to form covering about the not restriction especially of its material, can use various supporting carrier films.Consider from viewpoint as the flexibility of supporting carrier film and obdurability, can enumerate with as the illustrative identical supporting carrier film of the membraneous material of above-mentioned matrix material 1.
The thickness of supporting carrier film 10 can change aptly according to the flexibility as purpose, but 5～250 μ m preferably.If more than the 5 μ m, just obtain obdurability, if below the 250 μ m, just obtain sufficient flexibility.
At this moment, from the protection of the resin film 200 that is used to form covering or the viewpoints such as batching property when manufacturing the roller shape consider, as required also can be on the resin film 200 that is used to form covering applying protective film 11.As protective film 11, can use with as supporting carrier film 10 illustrative identical films, also can implement demoulding processing or antistatic treatment as required.
As solvent as used herein, so long as can dissolve the just not restriction especially of solvent of this resin combination, for example can use acetone, MEK, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylacetamide, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetic acid esters, cyclohexanone, N-N-methyl-2-2-pyrrolidone N-equal solvent or its mixed solvent.Solid component concentration in the preferred resin solvent is 30～80 quality % degree.
About the thickness of down wrap 2 and upper clad layer 9 (below, be called for short covering 2,9), at dried thickness, the scope of preferred 5～500 μ m.If more than the 5 μ m, just can guarantee to close cladding thickness into light time necessity, if below the 500 μ m, it is easy controlling thickness equably.Consider that from above viewpoint the thickness of this covering 2,9 is more preferably the scope of 10～100 μ m.
In addition, the thickness of covering 2,9, at the initial following wrap that forms 2 be used for imbedding the upper clad layer 9 of core pattern, can be identical also can be different, but in order to imbed the core pattern, the thickness of preferred upper clad layer 9 is thicker than the thickness of sandwich layer 3.
Be used to form the resin film of sandwich layer
Then, at length narrate the resin film that is used to form sandwich layer (Fig. 4,300) that uses among the present invention.
The resin that is used to form sandwich layer 30 as the resin film 300 that is configured for forming sandwich layer, for sandwich layer 3 is designed to refractive index height than covering 2,9, can use the resin combination that can form the core pattern with the light active wire, photosensitive polymer combination is suitable.Specifically, contain with at the above-mentioned identical resin combination of resin combination that uses in the resin of covering that is used to form, promptly contain above-mentioned (A), (B) and (C) composition, preferential use contains the resin combination of above-mentioned any composition as required.
Be used to form the resin film 300 of sandwich layer, the resin combination that contains above-mentioned (A)～(C) composition is dissolved in the solvent, be coated on then on the supporting carrier film 4, just can easily make by removing solvent.As solvent, if can dissolve the solvent of this resin combination, just not restriction especially can be used the identical solvent of the illustrative solvent of solvent that uses with conduct in the manufacturing of the resin film that is used to form covering.Solid component concentration in the resin solution, preferably 30～80 quality % degree.
About the thickness of the resin film 300 that is used to form sandwich layer, restriction especially, the thickness of dried sandwich layer is adjusted to 10～100 μ m usually.If more than this film thickness 10 μ m, photo detector after forming with optical waveguide or and the combination of optical fiber in, just there is the position tolerance on fit can enlarge such benefit, if below the 100 μ m, photo detector after forming with optical waveguide or and the combination of optical fiber in, just have joint efficiency to improve such benefit.Consider that from above viewpoint the thickness of this film is more preferably the scope of 30～70 μ m.
The supporting carrier film 4 that uses in the manufacturing process of the resin film 300 that is used to form sandwich layer is supporting carrier films that support is used to form the resin 30 of sandwich layer, about its material, not restriction especially, from peeling off later the resin 30 that is used to form sandwich layer easily, and the viewpoint with thermotolerance and solvent resistance is considered polyester such as the suitable polyethylene terephthalate enumerated, polypropylene, tygon etc.
The thickness of this supporting carrier film 4, preferably 5～50 μ m.If more than the 5 μ m, just have to obtain easily as the such benefit of the intensity of supporting carrier film 4, if below the 50 μ m and the gap of the mask of pattern when forming just diminishes, have to form the such benefit of trickleer pattern.Consider that from above viewpoint more preferably the thickness of this supporting carrier film 4 is scopes of 10～40 μ m, especially preferably 15～30 μ m.
From the protection of the resin film 300 that is used to form sandwich layer or the viewpoints such as batching property when manufacturing the roller shape consider, as required can be on the resin film 300 that is used to form sandwich layer applying protective film 11.As protective film 11, can use and the identical film of in example, being lifted as supporting carrier film 4, also can implement demoulding processing or electrostatic prevention as required and handle.
Method for manufacturing optical waveguide
Below, at length narrate method for manufacturing optical waveguide of the present invention (with reference to Fig. 1,2).Moreover, in following Production Example, an example of the embodiment when specifically describing resin film (Fig. 3,200) that is used to form covering and the resin film (Fig. 4,300) that is used to form sandwich layer.
At first, as the 1st operation, use the resin film that is used to form covering (Fig. 3,200) that constitutes by resin 20 that is used to form covering and supporting carrier film 10, by light or heating this resin that is used to form covering 20 is solidified, form wrap 2 (Fig. 1 (a)) down.At this moment, above-mentioned supporting carrier film 10 shown in Fig. 1 (a), becomes the matrix material 1 of wrap 2 down.
This time wrap 2, from considering with the adhesive viewpoint of sandwich layer described later, preferred height difference but smooth not on the surface of laminated sandwich layer one side.In addition, owing to be used to form the resin film of covering, can guarantee the surface of covering 2.
As shown in Figure 3, when the opposition side of the supporting carrier film 10 of the resin film 200 that is used to form covering was provided with protective film 11, after this protective film peeled off, the resin 20 that utilizes light or heating to be used in to form covering solidified, and forms covering 2.At this moment, be used to form the resin 20 of covering, preferably film forming on the supporting carrier film 10 of having implemented the adhesion processing.On the other hand, in order to peel off from the resin film 200 that is used to form covering easily, preferred protective film 11 is not implemented the adhesive part reason, can implement the demoulding as required yet and handle.
As matrix material 1, supporting carrier film 10 also can use other matrix material.In the case; on the resin film 200 that is used to form covering during matcoveredn 11; protective seam 11 is peeled off; then; shown in Fig. 2 (a); laminating by using roll-in laminator 5 etc. will be used to form the resin film 200 of covering and transfer on the matrix material 1, then supporting carrier film 10 be peeled off.Then, utilize light or heating to be used in the resin 20 that forms covering and be solidified to form down wrap 2.In addition, in the case,, can use the resin that is used to form covering that constitutes separately with the resin 20 that is used to form covering as the resin film 200 that is used to form covering.
Then, according to the described in detail below the 2nd and the 3rd operation, forming sandwich layer 3 on the wrap 2 down.In the 2nd and the 3rd operation, the resin film 300 that is used to form sandwich layer is laminated to down on the wrap 2, form the high sandwich layer 3 of wrap under the refractive index ratio 2.
Specifically, as the 2nd operation, the resin film 300 that uses roll-in laminator 5 will be used to form sandwich layer is temporarily fitted, and makes sandwich layer 3 be laminated to down (Fig. 1 (b)) on the wrap 2.Here, consider from the viewpoint of stickability and tracing ability raising that preferred pressurized adhesion is on one side temporarily fitted, and when carrying out pressurized adhesion, can use the laminating machine with warm-up mill on one side, the limit heating edge is carried out.The temperature of lamination, the scope of preferred room temperature (25 ℃)～100 ℃.If than the high temperature of room temperature, the stickability of following wrap and sandwich layer just improves, if more than 40 ℃, clinging power is more improved.On the other hand, if below 100 ℃, sandwich layer just becomes when roll laminating and flows easily, obtains as necessary thickness.Consider from above viewpoint, more preferably 40～100 ℃ scope.Preferred pressure is 0.2～0.9MPa.Preferred laminate speed is 0.1～3m/min, and these conditions have no particular limits.
Then, as the 3rd operation, the resin film that is used to form sandwich layer (Fig. 1 (c)) that heat pressure adhesive is temporarily fitted in above-mentioned the 2nd operation under the decompression atmosphere.Here, the 3rd operation is considered from the viewpoint that improves stickability and tracing ability, during heat pressure adhesive, is to carry out under the decompression atmosphere.Preferred plate laminating machine 6 heat pressure adhesive that under the decompression atmosphere, reduces pressure that uses.Moreover in the present invention, so-called plate laminating machine is called clamping laminated material between pair of plates, by adding the laminating machine that locating back carries out pressurized adhesion.As plate laminating machine, for example can use the special laminating machine of putting down in writing in the flat 11-320682 communique of opening of picture suitably.As the upper limit of vacuum tightness of decompression yardstick, below the preferred 10000Pa, more preferably below the 1000Pa.Vacuum tightness is considered from the viewpoint of stickability and tracing ability, wishes low as far as possible.On the other hand, the lower limit of vacuum tightness is considered from productive viewpoint (time that needs vacuumizing), preferably the degree of 10Pa.Heating-up temperature, preferably 40～130 ℃, the pressure of pressurized adhesion, preferably 0.1～1.0MPa (1～10kgf/cm
2), but the not restriction especially of these conditions.
Be used to form the resin film 300 of sandwich layer, consider, preferably constitute, in the case, be used to form the resin 30 of sandwich layer at following wrap 2 one side laminations by resin 30 that is used to form sandwich layer and supporting carrier film 4 from the viewpoint of operability.In addition, be used to form the resin film 300 of sandwich layer, also can constitute by the resin 30 that is used to form sandwich layer separately.
As shown in Figure 4, be provided with under the situation of protective film 11 in the opposite side of the matrix material of the resin film 300 that is used to form sandwich layer, peel off this protective film 11 after, will be used to form resin film 300 laminations of sandwich layer.At this moment, protective film 11 and supporting carrier film 4, in order to peel off easily from the resin film 300 that is used to form sandwich layer, the processing of preferably not adhering also can be implemented the demoulding as required and handle.
Then, as the 4th operation,, form the core pattern 8 (Fig. 1 (d), (e)) of optical waveguide with sandwich layer 3 exposure imagings.Specifically, on the image shape, shine active ray by optical mask pattern 7.As the light source of active ray, for example can enumerate the ultraviolet known light source of radiation effectively of extra-high-pressure mercury vapour lamp, high-pressure mercury-vapor lamp, xenon lamp etc.In addition, in addition also can use the light source that radiates visible light effectively of taking pictures with plane bulb, sunlamp etc.
Then, under the situation of the supporting carrier film 4 of the residual resin film 300 that is used to form sandwich layer, peel off supporting carrier film 4, with wet develop to wait remove unexposed portion, develop, form core pattern 8.When wet the development, using the organic solvent of the composition that is suitable for above-mentioned film is developer solution, by spraying, shake dipping, known method such as brushing, scrape and develop.
As organic solvent is developer solution, for example can enumerate N-Methyl pyrrolidone, N, dinethylformamide, N,N-dimethylacetamide, cyclohexanone, MEK, methyl isobutyl ketone, gamma-butyrolacton, methyl cellosolve, ethyl cellosolve, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetic acid esters etc.In addition, the developing method that also two or more kinds may be used as required.
As visualization way, for example can enumerate spray regimes such as impregnation method, alr mode, high-pressure injection mode, brush, scrape etc., be only in order to improve exploring degree high-pressure injection mode.
As the processing after developing, can use the heating or the 0.1～100mJ/cm that carry out 60～250 ℃ of degree as required
2The exposure of degree is solidified the core pattern again.After this, lamination is used to imbed the resin film that is used to form covering 200 of core pattern 8, and the resin that is used to form covering 20 of this resin film that is used to form covering 200 is solidified, and forms the 5th operation (Fig. 1 (f)) of upper clad layer 9.Lamination when the resin film 200 that is used to form covering is made of resin 20 that is used to form covering and support 10, is used in the resin 20 that forms covering and carries out lamination in core pattern 8 one sides.The thickness of the covering 9 of this moment is preferred thicker than the thickness of sandwich layer 3 as mentioned above.Solidify, utilize light or heating and above-mentionedly similarly carry out.
As shown in Figure 4, when the opposition side of the supporting carrier film 10 of the resin film 200 that is used to form covering is provided with protective film 11, peel off protective film 11 after, lamination is used to form the resin film 200 of covering, utilizes light or heating to be cured and just forms covering 9.At this moment, the resin 20 that is used to form covering is preferably being implemented film forming on the supporting carrier film 10 that adhesion handles.On the other hand, protective film 11, the adhesion that preferably is not used for peeling off from the resin film 200 that is used to form covering is easily handled, and also can implement the demoulding as required and handle.
According to manufacture method of the present invention, in the operation of lamination sandwich layer 3, by carrying out above-mentioned the 2nd operation and above-mentioned the 3rd operation after this, can productivity make optical waveguide (Fig. 1 (f), Fig. 2 (g)) well with uniform core, not the core distortion of the thick or breach of the core of problem in the past etc., and do not have the snotter adhesion.
Below, be described more specifically the present invention according to embodiment, but the present invention is not subjected to any restriction of these embodiment.
Production Example 1
Be used to form the resin film and the making that is used to form the resin film of covering of sandwich layer
With the cooperation shown in the table 1, prepare sandwich layer and the resin combination that is used to form covering, in this resin combination, add the ethyl cellosolve that relative full dose is 40 mass parts as solvent, reconcile into the lacquer type organic coating that covering was used and be used to form to sandwich layer.Moreover, in the cooperation shown in the table 1, (A) matrix polymer and (B) use level of optical polymerism compound, be to (A) composition and (B) the quality % of the total amount of composition, (C) use level of Photoepolymerizationinitiater initiater is to (A) composition and (B) ratio (mass parts) of total amount 100 mass parts of composition.
Table 1
*1 Off エ ノ ト-ト YP-70: Toto Kasei KK's system, bisphenol-A/Bisphenol F copoly type phenoxy resin
*2 A-BPEF: Xin Zhong village Industrial Co., Ltd system, 9, two [4-(the 2-acryloyl-oxy base oxethyl) phenyl] fluorenes of 9-
*2 EA-1020: Xin Zhong village Industrial Co., Ltd system, bisphenol-a epoxy acrylate
*4 KRM-2110: Xin Zhong village Industrial Co., Ltd system, alicyclic diepoxy carboxylate
*52, two (the 2-chlorphenyls)-4,4 of 2-', 5,5 '-tetraphenyl-1,2 '-the di-imidazoles, Tokyo HuaCheng Industry Co., Ltd's system
*64,4 '-two (diethylamino) benzimidazole, Tokyo HuaCheng Industry Co., Ltd's system
*7 2-mercaptobenzimidazoles, Tokyo HuaCheng Industry Co., Ltd's system
*8 SP-170: Asahi Denka Kogyo K. K's system, triphenylsulfonium hexafluoro antimonate
Use coating device (the smart machine of ヨ シ ミ Star Co., Ltd. system, " YBA-4 ") (Performance Co., Ltd. system is spun by Japan at the PET film, trade name " コ ス モ シ ヤ イ Application A1517 ", thick 16 μ m) upward coating sandwich layer that obtains and the lacquer type organic coating that is used to form covering (is used to form the interior adhesion treated side of resin film use volume of covering, the resin film that is used to form sandwich layer uses the outer non-treated side of volume), made solvent seasoning 10 minutes at 80 ℃, make solvent seasoning 10 minutes at 100 ℃ then, obtain sandwich layer and the resin film that is used to form covering.The thickness of the film of this moment, by regulating the gap of coating device, it is possible at random adjusting between 5～100 μ m, in this Production Example, thickness after the curing, as sandwich layer become 40 μ m, down wrap becomes 20 μ m, upper clad layer becomes and regulate the 70 μ m.
The making of optical waveguide
(the big Japanese ス Network リ Application system of Co., Ltd. is MAP-1200) with 1000mJ/cm to use ultraviolet exposure machine
2Irradiation ultraviolet radiation (wavelength 365nm) makes the resin film generation photocuring that is used to form covering that obtains in the above-mentioned Production Example 1, forms wrap 2 (with reference to Fig. 1 (a)) down.
Then, ((Co., Ltd. Hitachi changes into the industry system to use the roll-in laminator, HLM-500)), with the condition of pressure 0.4MPa, 50 ℃ of temperature, laminate speed 0.2m/min, the resin film that is used to form sandwich layer that obtains in the above-mentioned Production Example 1 is laminated to (with reference to Fig. 1 (b)) on this time wrap.
Then, as plate laminating machine, use vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system, MVLP-500), after being evacuated to below the 500Pa, working pressure 0.4Ma, 70 ℃ of temperature, the condition of 30 seconds pressing times, will be in above-mentioned operation the resin film heat pressure adhesive that is used to form sandwich layer of lamination, lamination sandwich layer (with reference to Fig. 1 (c)).
Then, the photomask (minus) across wide 40 μ m uses above-mentioned ultraviolet exposure machine with 1000mJ/cm
2Irradiation ultraviolet radiation (wavelength 365nm) back (with reference to Fig. 1 (d)), with ethyl cellosolve and N, 8 couple of dinethylformamide, 2 quality make core pattern development (with reference to Fig. 1 (e)) than mixed solvent.The clean use first alcohol and water of developer solution.
Then, use vacuum pressure type laminating machine (Co., Ltd. Mingji Koito's system, MVLP-500), after vacuumizing below the 500Pa, working pressure 0.4Ma, 70 ℃ of temperature, the lamination of 30 seconds pressing times, will be in above-mentioned operation the resin film lamination that is used to form covering of lamination, so that imbed the core pattern, use and above-mentioned identical method and condition irradiation ultraviolet radiation, carry out heat treated at 110 ℃ then, form upper clad layer 9, make optical waveguide (with reference to Fig. 1 (f)).
Moreover when measuring the refractive index of sandwich layer and covering with Metricon corporate system prism coupler (Model2010), at wavelength 850nm, sandwich layer is 1.584, and covering is 1.537.
The optical waveguide of using above-mentioned method to make, there is not the core distortion of the thick or shortcoming of core etc., there is not snotter to sneak into yet, the qualification rate of the optical waveguide of 200 10cm length is 80%, use the LED (ア of Co., Ltd. De バ Application テ ス ト system of 855nm at light source, Q81201) and be subjected to the optical sensor (ア of Co., Ltd. De バ Application テ ス ト system, Q82214), when utilizing incident optical (the polymorphic fiber of GI-50/125 (NA=0.20)), outgoing optical fiber (SI-144/125 (NA=0.22)), incident light (effectively core diameter 26 μ m) mensuration, transmission loss (TL) is 1.5～1.7dB/cm.
Production Example 2
Be used to form the making of the resin film of covering
In above-mentioned Production Example 1, except (Performance Co., Ltd. system is spun by Japan at the PET film as supporting carrier film 10, trade name " コ ス モ シ ヤ イ Application A1517 ", thick 16 μ m) be formed for forming beyond the lacquer type organic coating of covering on the non-treated side and Production Example 1 is similarly made the resin film that is used to form covering.
The making of optical waveguide
Under the formation of embodiment 1 in the operation of wrap 2, as matrix material 1, utilize the roll laminating method that the resin film that is used to form covering 200 that obtains in the above-mentioned Production Example 2 is transferred on the FR-4, after peeling off the PET film, be cured from the resin side utilization ultraviolet ray that is used to form covering, form covering 2, in addition and embodiment 1 similarly make optical waveguide.
Make like this optical waveguide, do not have the core distortion of the thick or shortcoming of core etc., do not have snotter to sneak into yet, the qualification rate of the optical waveguide that 200 10cm are long is 90%.Use the LED (ア of Co., Ltd. De バ Application テ ス ト system of 855nm at light source, Q81201) and be subjected to the optical sensor (ア of Co., Ltd. De バ Application テ ス ト system, Q82214), when utilizing incident optical (the polymorphic fiber of GI-50/125 (NA=0.20)), outgoing optical fiber (SI-144/125 (NA=0.22)), incident light (effectively core diameter 26 μ m) mensuration, transmission loss (TL) is 1.5dB/cm.
Comparative example 1
The making of optical waveguide
With the use roll-in laminator among the embodiment 1, then use the vacuum pressure type laminating machine, the operation that the resin film that is used to form sandwich layer is laminated on the covering of bottom changes, do not use the lamination of roll-in laminator, the resin film that uses the vacuum pressed machine will be used to form sandwich layer under the condition identical with embodiment 1 is laminated on the covering of bottom, in addition and embodiment 1 similarly make optical waveguide.
At this moment, owing to or core shortcoming thick at the core SMIS, snotter are sneaked into, thereby, the qualification rate of the optical waveguide of 200 10cm length is 15%, use the LED (ア of Co., Ltd. De バ Application テ ス ト system of 855nm at light source, Q81201) and be subjected to the optical sensor (ア of Co., Ltd. De バ Application テ ス ト system, Q82214), utilize incident optical (the polymorphic fiber of GI-50/125 (NA=0.20)), outgoing optical fiber (SI-144/125 (NA=0.22)), incident light (effectively core diameter 26 μ m) when measuring, transmission loss (TL) is 1.5～4.0dB/cm, and is bigger than embodiment 1 fluctuation.
Comparative example 2
The making of optical waveguide
With the use roll-in laminator among the embodiment 1, then use the vacuum pressure type laminating machine, the operation that the resin film that is used to form sandwich layer is laminated on the covering of bottom changes, under the condition identical, use the roll-in laminator with embodiment 1, the resin film that is used to form sandwich layer is laminated on the covering of bottom, then do not use the heat pressure adhesive operation of vacuum pressed laminating machine, in addition and embodiment 1 similarly make optical waveguide.
At this moment, owing to the not enough core that takes place of clinging power is peeled off bad, the qualification rate of the optical waveguide of 200 10cm length is 10%, use the LED (ア of Co., Ltd. De バ Application テ ス ト system of 855nm at light source, Q81201) and be subjected to the optical sensor (ア of Co., Ltd. De バ Application テ ス ト system, Q82214), utilize incident optical (the polymorphic fiber of GI-50/125 (NA=0.20)), outgoing optical fiber (SI-144/125 (NA=0.22)), incident light (effectively core diameter 26 μ m) when measuring, transmission loss (TL) is 1.5～30dB/cm, and is bigger than embodiment 1 fluctuation.
Application possibility on the industry
According to the present invention, can productivity make well and have the uniform core that do not have distortion, drawn by field trash The less bad and good fiber waveguide of adherence core pattern and covering that rises. By manufacture method of the present invention The fiber waveguide that obtains, light-transfer characteristic is good, can be used between the plate or the optical interconnection in the plate etc. wide General field.
Claims (4)
1. method for manufacturing optical waveguide, this method for manufacturing optical waveguide comprises:
Make the resin solidification that on matrix material, forms, be used to form covering, thereby form the operation of wrap down;
Press the resin film that is used to form sandwich layer on this time wrap upper strata, thereby form the operation of sandwich layer;
With this sandwich layer exposure and development, thus the operation of formation core pattern; And,
Will be in order to imbed the resin solidification that this core pattern formed, was used to form covering, thus the operation of upper clad layer formed;
It is characterized in that the operation of described formation sandwich layer comprises:
(1) resin film that uses the roll-in laminator will be used to form sandwich layer temporarily fits to down the operation on the wrap, and,
(2) under the decompression atmosphere thermocompression bonded should the operation of the temporary transient resin film that is used to form sandwich layer of fitting.
2. optical waveguide manufacture method according to claim 1 is characterized in that, in above-mentioned operation (1), as the roll-in laminator, uses the laminating machine with warm-up mill, and heat pressure adhesive is used to form the resin film of sandwich layer, and it temporarily is fitted in down on the wrap.
3. optical waveguide manufacture method according to claim 1 and 2 is characterized in that, in above-mentioned operation (2), uses plate laminating machine, and heat pressure adhesive is through the temporary transient resin film that is used to form sandwich layer of fitting of above-mentioned operation (1) under the decompression atmosphere.
4. according to each described optical waveguide manufacture method in the claim 1～3, it is characterized in that, described down wrap on the surface of laminated sandwich layer one side, form height difference.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP257350/2006 | 2006-09-22 | ||
| JP2006257350 | 2006-09-22 | ||
| JP312033/2006 | 2006-11-17 |
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| Publication Number | Publication Date |
|---|---|
| CN101517445A true CN101517445A (en) | 2009-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200780034484XA Pending CN101517445A (en) | 2006-09-22 | 2007-09-18 | Process for manufacturing light guide |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105264430A (en) * | 2013-12-05 | 2016-01-20 | 华为技术有限公司 | Optical modulator and planar photonic device module |
| CN111061009A (en) * | 2019-12-30 | 2020-04-24 | 腾讯科技（深圳）有限公司 | Suspended optical waveguide and preparation method thereof |
-
2007
- 2007-09-18 CN CNA200780034484XA patent/CN101517445A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105264430A (en) * | 2013-12-05 | 2016-01-20 | 华为技术有限公司 | Optical modulator and planar photonic device module |
| CN111061009A (en) * | 2019-12-30 | 2020-04-24 | 腾讯科技（深圳）有限公司 | Suspended optical waveguide and preparation method thereof |
| CN111061009B (en) * | 2019-12-30 | 2022-06-28 | 腾讯科技（深圳）有限公司 | Suspended optical waveguide and preparation method thereof |
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