CN101513989B - Functional device and manufacturing method thereof - Google Patents
Functional device and manufacturing method thereof Download PDFInfo
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- CN101513989B CN101513989B CN2009100014516A CN200910001451A CN101513989B CN 101513989 B CN101513989 B CN 101513989B CN 2009100014516 A CN2009100014516 A CN 2009100014516A CN 200910001451 A CN200910001451 A CN 200910001451A CN 101513989 B CN101513989 B CN 101513989B
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Abstract
In a functional device having a cavity with a containing function structure, problems of bad action, differences of components and the like, are lessened by reducing cover of the cavity. The functional device includes: a substrate (11); a functional structure (13A, 15A) formed on the substrate; a cavity (C) in which the functional structure is disposed; and a cover D (19A, 22) which covers the cavity, wherein the cover D (19A, 22) includes a bumpy structure including rib shaped portions (19b), or groove shaped portions (19c), which cross a covering range (20c) covering at least the cavity.
Description
Technical field
The present invention relates to a kind of function element and manufacturing approach thereof, relate in particular to the structure and the manufacturing approach thereof that MEMS functional configuration bodies such as (MEMSs) are configured in the function element that is formed at the blank part on the substrate.
Background technology
Generally, be manufactured into various electronic units as the MEMS (MEMS) of function element into the employing fine pattern technology of in semiconductor fabrication process etc., using.More often than not; At least a portion that disposes the MEMS tectosome is accommodated in blank part inside being formed on the substrate, and as required, this blank part is sealed from the top by lining portion; Become the reduced pressure sealing state in the blank part, perhaps become the state of being enclosed special gas in the blank part.
For example, put down in writing the seal construction that utilizes following method to constitute in the patent documentation 1 below, formed the MEMS tectosome with sacrifice layer; On this MEMS tectosome, form insulating barrier, on this insulating barrier, form the 1st sealant then, remove insulating barrier and sacrifice layer through this outlet etching with outlet (passage); Form blank part; In this blank part, import gas, on the 1st sealant, form the 2nd sealant, sealing outlet thus then.
And, put down in writing a kind of and above-mentioned similar method in the patent documentation 2 below, on monolithic, form in the structure of conductor integrated circuit device (CMOS) and MEMS tectosome, use the wiring formation technology of MOSFET to form blank part simultaneously.
[patent documentation 1] TOHKEMY 2004-314292 communique
[patent documentation 2] TOHKEMY 2006-263902 communique
But; In like the structure that configuration MEMS tectosome also seals in blank part noted earlier; For example, when formation has the 1st coating of perforate and utilize etching through this perforate to form blank part, after etching, wash when making blank part dry then; Sometimes follow the water level in the blank part to reduce, the 1st coating inboard of submerging.Then, poor according to external and internal pressure when at the 1st coating laminated the 2nd coating and reduced pressure sealing blank part, the portion of the lining sometimes inboard of submerging because of external pressure.Submerging of this lining portion reduces the fabrication yield of electronic installation sometimes, causes the quality of product to descend, for example sometimes because lining portion contacts MEMS tectosome etc. causes moving bad etc.
In addition; The form that covers the lining portion of blank part deviation occurs according to resulting from the difference, the change of creating conditions etc. of coefficient of thermal expansion of layer structure of lining portion; So be not limited to above-mentioned when dry during with reduced pressure sealing, because the other reasonses such as internal stress of lit-par-lit structure produce the distortion of submerging the inboard or giving prominence to laterally sometimes; This will cause the deviation etc. of device property, impact for the quality of product.
Summary of the invention
The present invention proposes in order to address the above problem just, and its problem is in the function element with the blank part of accommodating the functional configuration body, through reducing the distortion of the lining portion that covers blank part, alleviates the problems such as deviation bad, device property of moving.
In light of this situation; Function element of the present invention possesses substrate, is formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered; Said function element is characterised in that; Said lining portion has the sag and swell that comprises rib shape portion or groove shape portion, and wherein, the lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion; And surpass said lining scope and extend to its both sides, said sag and swell extends to the outside that the lining scope is the blank part zone.
According to the present invention; The lining portion that is used to accommodate the blank part of functional configuration body in lining; Setting comprises the rib shape portion of the lining scope of crossing this blank part of covering at least or the sag and swell of groove shape portion; Lining portion improves with respect to the rigidity of submerging and distortion such as give prominence to thus, thereby can reduce the bad problems such as deviation with device property of the action of functional configuration body.
In a mode of the present invention, said sag and swell comprises parallel each other a plurality of said rib shape portion or groove shape portion.Therefore, through comprising parallel each other a plurality of rib shape portions or groove shape portion, can further improve lining portion, so can further reduce bad with respect to the rigidity of submerging and giving prominence to.
At this, comprise that sag and swell forms the situation of corrugated plate shape at least in said lining scope.In this case; Through forming corrugated plate shape, can further improve the rigidity of lining portion, become corrugated plate shape through the surface that makes the lower floor that utilizes formations such as dielectric film simultaneously; And it is membranaceous that lining portion is formed on the surface of this lower floor, can easily form lining portion.At this, the sag and swell of corrugated plate shape is meant that the posture with correspondence forms in corresponding each other plan-position for rib shape portion that is located at the one side side and the groove shape portion that is located at the another side side, a plurality of groups of structures that walk abreast and extend to form that are made up of these rib shape portions and groove shape portion.
And, be included in said lining portion in the face of being formed with the situation of said rib shape portion on the inner surface of said blank part.In this case, on the surface of the lower floor that utilizes formations such as dielectric film that separation (release) exists before, form groove, it is membranaceous that lining portion is formed, and can easily form lining portion thus.
And; In other modes of the present invention; Said lining portion has and is formed at said blank part side and has in the face of the 1st coating of the perforate of said blank part and seal the 2nd coating of the said perforate of the 1st coating, on said the 1st coating, is provided with said sag and swell.Have in said lining portion and to be formed at said blank part side and to have in the face of the 1st coating of the perforate of said blank part and seal under the situation of the 2nd coating of said perforate of the 1st coating; Can implement to be used to form the etch processes of blank part through the 1st coating with perforate; And reduce pressure and the importing of gas; Form the 2nd coating then and seal perforate, can seal blank part thus, can easily carry out the sealing of this blank part.And, during this situation, on the 1st coating, being provided with said sag and swell, the rigidity of the 1st coating improves thus, so during dry when forming blank part, after the washing, during reduced pressure sealing etc., can reduce submerging and distortion such as outstanding of lining portion reliably.
In other modes in addition of the present invention; Said functional configuration body is followed its function and the movable part that moves in the one side setting of said lining portion; Said lining portion in the face of in the inner surface of said blank part with the scope of said movable part planes; Become and do not have the inclination that constitutes by said rib shape portion or said groove shape portion and the tabular surface zone of step; Said lining portion comprises metal level, and said movable part constitutes and the lower electrode planes, by and said lower electrode between electrostatic force vibrate.Therefore; Through becoming flat site with the scope of movable part planes in the said inner surface that makes lining portion; Under the situation at the interval that can not fully guarantee movable part and lining portion, also can avoiding causing the increase of parasitic capacitance that movable part takes place with deviation and when movable part moves, to contact the sag and swell etc. of lining portion bad.At this, in the both sides of the scope of said and movable part planes said sag and swell is set respectively, be preferred aspect the rigidity that improves lining portion.
In different modes of the present invention; Said functional configuration body is followed its function and the movable part that moves in the one side setting of said lining portion; Said lining portion in the face of on the inner surface of said blank part, avoid forming said rib shape portion with the scope of said movable part planes.Therefore; Owing to the scope of on the said inner surface of lining portion, avoiding with the movable part planes forms rib shape portion; So under the situation at the interval that can not fully guarantee movable part and lining portion, also can avoiding causing the increase of parasitic capacitance that movable part takes place with deviation and when movable part moves, to contact the rib shape portion etc. of lining portion bad.At this, said rib shape portion is set respectively in the both sides of the scope of said and movable part planes, be preferred aspect the rigidity that improves lining portion.
In other different modes of the present invention, said functional configuration body is followed its function and the movable part that moves in the one side setting of said lining portion, and said sag and swell constitutes and makes said rib shape portion or said groove shape portion cross the scope with said movable part planes.Therefore; Make rib shape portion or groove shape portion cross the scope with the movable part planes through constituting; As long as can fully guarantee the interval of movable part and lining portion; Just can improve the rigidity of the said scope of lining portion, thus the distortion of said scope can further be reduced, thus can reduce the bad problems such as deviation with device property of the action of functional configuration body.
In other modes of the present invention, the relief region that is made up of said rib shape portion or said groove shape portion is avoided in said perforate in said the 1st coating, is formed at the flat site of said the 1st coating.Therefore; Through avoiding having the inclination that forms by rib shape portion or groove shape portion and the relief region of step, at the flat site of the 1st coating perforate is set, can stably form perforate; So can improve the precision and the repeatability of opening shape; As a result, the stability and the repeatability of separation circuit can be guaranteed, thereby the stability and the yield rate of the characteristic of functional configuration body can be improved.
In in addition other modes of the present invention, said functional configuration body is followed its function and the movable part that moves in the one side setting of said lining portion, and said perforate is avoided forming with the scope of said movable part planes.Therefore, through avoiding forming perforate, when the sealing perforate, can prevent that encapsulant is attached to causing the bad of functional configuration body on the movable part with the scope of movable part planes.
In other modes of the present invention, loose at said covered part and to dispose a plurality of perforates, said rib shape portion or groove shape portion straight line between said perforate extends.In the present invention, the extension shape of rib shape portion or groove shape portion is not limited to linearity, not special the qualification.For example, also can be snakelike shape, word shape, refraction shape etc.But, form linearity through making rib shape portion or groove shape portion, can further improve the raising effect of rigidity.And; Though can easily carry out importing of the formation of blank part, decompression, gas etc. through a plurality of perforates are set; But can reduce the rigidity of lining portion like this, so, can guarantee rigidity more reliably through making rib shape portion or groove shape portion constitute straight line extension between perforate.
In other modes of the present invention, said blank part is depressurized sealing.In the present invention; Making blank part become the reduced pressure sealing state is not necessary condition, when blank part is not depressurized, when being enclosed gas etc., is effective yet; But when blank part is depressurized sealing; The external and internal pressure difference increases, so make the functional configuration body produce the bad possibility increase of action because lining portion submerges, especially the present invention is more effective in this mode.In addition, as being depressurized the mode the sealing, can enumerate that blank part utilizes lining portion sealing under normal pressure situation, blank part are covered by lining portion but the situation that not have to seal, situation about sealing to blank part gas-pressurized etc. etc. except that said blank part.
Below; The manufacturing approach of function element of the present invention; This function element possesses substrate, is formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered; Said manufacturing approach is characterised in that, comprising: tectosome forms step, forms said functional configuration body with sacrifice layer; Dielectric film forms step, on said functional configuration body, forms dielectric film, and this dielectric film has the concaveconvex shape that comprises groove shape portion or rib shape portion at least a portion surf zone; The 1st coating forms step; On said surf zone, form the 1st coating; The 1st coating has the sag and swell that embodies said concaveconvex shape and comprise rib shape portion or groove shape portion, and has perforate, and the lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion; And surpass said lining scope and extend to its both sides, said sag and swell extends to the outside that the lining scope is the blank part zone; Separating step through the said perforate of said the 1st coating, is removed said dielectric film and said sacrifice layer on the said functional configuration body; With the lining step, form the 2nd coating of the said perforate of said the 1st coating of sealing.
And; Other the manufacturing approach of function element of the present invention; This function element possesses substrate, is formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered; Said manufacturing approach is characterised in that, comprising: tectosome forms step, forms said functional configuration body with sacrifice layer; Dielectric film forms step, on said functional configuration body, forms dielectric film; The 1st coating forms step; On said dielectric film, form the 1st coating, the 1st coating has two-layer at least stepped construction, has the comprise rib shape portion corresponding with the formation scope of any at least one deck or the sag and swell of groove shape portion; And has perforate; The lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion, and extends to its both sides above said lining scope, and said sag and swell extends to the outside that the lining scope is the blank part zone; Separating step through the said perforate of said the 1st coating, is removed said dielectric film and said sacrifice layer on the said functional configuration body; With the lining step, form the 2nd coating of the said perforate of said the 1st coating of sealing.
In a mode of the present invention, in said lining step, said the 2nd coating utilizes chemical vapour deposition film forming in the space that is depressurized, the said blank part of reduced pressure sealing thus.Through in the space that is depressurized, utilizing chemical vapour deposition film forming the 2nd coating, extremely easily reduced pressure sealing blank part.But; The invention is not restricted to blank part and be depressurized the situation of sealing, also go for blank part and under normal pressure, utilize situation, the blank part of the sealing of lining portion to be covered but the situation that not have to seal, situation about sealing to blank part gas-pressurized etc. etc. by lining portion.
Description of drawings
Fig. 1 is the concise and to the point longitudinal section of the structure of expression embodiment.
Fig. 2 is near the part vertical view (a) and the phantom (b) of blank part of embodiment.
Fig. 3 is the part vertical view (a) and the phantom (b) of other structures of expression embodiment.
Fig. 4 is the part vertical view (a) and the phantom (b) of other structures of expression embodiment.
Fig. 5 is the part vertical view (a) and the phantom (b) of other structures of expression embodiment.
Fig. 6 is the concise and to the point cutaway view (a)-(f) of other section configurations of lining portion or any coating of expression embodiment.
Fig. 7 is the concise and to the point step cutaway view of the manufacturing step of expression embodiment.
Fig. 8 is the concise and to the point step cutaway view of the manufacturing step of expression embodiment.
Fig. 9 is the concise and to the point step cutaway view of the manufacturing step of expression embodiment.
Figure 10 is the concise and to the point step cutaway view of the manufacturing step of expression comparative example.
Figure 11 is the concise and to the point step cutaway view of the manufacturing step of expression comparative example.
Figure 12 is the concise and to the point step cutaway view of the manufacturing step of expression comparative example.
Figure 13 is near the vertical vertical view of the amplifier section of the blank part of other embodiments of expression.
Figure 14 is near the amplifier section vertical view of blank part of other embodiments of expression.
Figure 15 is near the expression vertical vertical view of amplifier section of blank part of other embodiments in addition.
Figure 16 is near the expression amplifier section vertical view of blank part of other embodiments in addition.
Figure 17 is the concise and to the point diagrammatic top view that the position of sag and swell and the perforate of explanation lining portion concerns.
Figure 18 is the concise and to the point diagrammatic top view that the position of the sag and swell of explanation MEMS tectosome and lining portion concerns.
Symbol description
11 substrates; The 11A semiconductor regions; 11B, 11C extrinsic region; 12 basalises; 13A infrastructure body; The 13B lower electrode; The 14A sacrifice layer; The 14B dielectric film; The 14C gate insulating film; 15A superstructure body; The 15B upper electrode; The 15C gate electrode; 16,18 interlayer dielectrics; 17A, 17B, 17C, 17D, 19B, 19C, 19D, 19E wiring layer; 19A the 1st coating; The 19a perforate; 19b rib shape portion; 19c groove shape portion; The 19u flat site; The 19t relief region; 19x (the blank part side) inner surface; 19y tabular surface zone; 19z male and fomale(M&F) zone; The 20MEMS tectosome; The 20C scope that is covered; The movable planar range of 20S; 21 surface protection films; 22 the 2nd coatings; The C blank part; D lining portion.
The specific embodiment
Below, specify embodiment of the present invention with reference to accompanying drawing.The embodiment of the function element that the present invention relates at first, is described.Fig. 1 and Fig. 2 are the concise and to the point amplification longitudinal sections of example of the section structure of the function element that the present invention relates to of expression.
In this embodiment, adopt the substrate 11 that constitutes by the semiconductor substrate of silicon and compound semiconductor etc. etc.But in the present invention, substrate 11 also can utilize other materials such as glass, pottery, sapphire, diamond, synthetic resin to constitute sometimes.
In this embodiment, utilize commonsense method (thermal oxidation method etc.) on aforesaid substrate 11, to form LOCOS element isolation film 11S such as (Local Oxidation of Silicon), form the basalis (element separating layer) 12 that utilizes formations such as silicon nitride above that.And, on this basalis 12, be formed with 13A of infrastructure portion and the 15A of superstructure portion that resonator (resonator), wave filter, actuator, sensor etc. constitute the MEMS tectosome.13A of infrastructure portion and the 15A of superstructure portion devices spaced apart arranged opposite.And, on this basalis 12, also be formed with the capacitor that obtains across dielectric film 14B arranged opposite lower electrode 13B and upper electrode 15B.In addition, the skin section at substrate 11 is formed with the MOS transistor that is made up of active layer 11A, extrinsic region 11B and 11C, gate insulating film 14C and gate electrode 15C.This MOS transistor is surrounded by said element isolation film 11S in the plane, and structure realizes that element separates relatively on every side.
The material of 13A of infrastructure portion and the 15A of superstructure portion is so long as electric conductor; Then there is not particular determination; But, for example preferably utilize electric conductivity silicon fiml (polysilicon of doping) to constitute from considering in the viewpoint of step identical or step of the same race enforcement respectively with the gate electrode 15C that constitutes MOS transistor.The electric conductivity silicon fiml is the material that is formed in the functional layer that forms in the semiconductor fabrication process, is not limited to said MOS transistor, through with semiconductor circuit in functional layer form simultaneously, have the advantage that can make the manufacturing step sharing.
On substrate 11, be formed with silica (SiO as insulating barrier
2); More specifically say, be formed with wiring layer 17A, 17B, 17C, 17D and the 1st coating 19A, wiring layer 19B, 19C, 19D, the 19E that constitute by the interlayer dielectric 16,18 of formations such as PSG (glass of Doping Phosphorus) and TEOS (cvd film that forms tetraethoxysilane etc. as unstrpped gas), by aluminium etc.This wiring layer becomes the conductive pattern that is used on substrate 11, forming predetermined circuit.Have by silica (SiO in above-mentioned each layer laminated
2) and silicon nitride (Si
3N
4) wait the surface protection film 21 of formation.The sacrifice layer of these surface protection film 21 utilizations and interlayer dielectric and back narration has optionally material formation of pattern (etching).In addition, on the 1st coating 19A, be formed with the 2nd coating 22.
Be provided with peristome at above-mentioned interlayer dielectric 16,18, utilize this peristome to constitute blank part C, portion disposes above-mentioned MEMS tectosome within it.Blank part C is covered the D of portion from top lining and sealing, and the D of this lining portion is made up of said the 1st coating 19A and the 2nd coating 22.Be formed with a plurality of perforate 19a that are communicated with blank part C at the 1st coating 19A, these perforates 19a is covered from the top by the 2nd coating 22, thereby is closed.
Said the 1st coating 19A and wiring layer 19B, 19C, 19D, 19E form simultaneously.For example, the film forming metal layer, patterning then, thus form the perforate 19a of the 1st coating 19A simultaneously with the profile pattern of the 1st coating 19A and each wiring layer.At this, the 1st coating 19A is identical with other wiring layers sometimes, utilizes the lit-par-lit structure of multilayer to constitute.For example; The 1st layer (orlop) is by thickness 1-1000nm, preferably the Ti about about 50nm or TiN constitute; The 2nd layer (intermediate layer) by thickness 10-10000nm, preferably the Al-Cu alloy-layer about about 800nm constitutes, and the 3rd layer (the superiors) are by thickness 1-1000nm, preferably the TiN about about 50nm constitutes.During this situation, through remove be configured in blank part C directly over the 1st layer, can easily carry out separating step.
In addition; In fact forming said the 1st coating 19A of said interlayer dielectric 16,18 back formation; Perforate 19a through the 1st coating 19A; Remove said interlayer dielectric 16,18 with mode etchings such as Wet-type etching and dry-etchings, then through carrying out the separating step of clean, forming said peristome is blank part C.
And the 2nd coating 22 utilizes chemical vapour depositions such as vacuum evaporation, sputter, CVD method, and film forming is on the 1st coating 19A under decompression state, and thus, perforate 19a is closed under the state that said blank part C is depressurized through perforate 19a.The 2nd coating 22 utilizes metals such as insulator such as silica, silicon nitride and aluminium, titanium, tungsten to form.The formation step of the 2nd coating 22 becomes the reduced pressure sealing step of blank part C.
Fig. 2 (a) and (b) be near the blank part C shown in Figure 1 partial top view and partial sectional view.At this, in Fig. 2 (a), omit the 2nd coating 22 that utilizes double dot dash line to represent, utilize solid line that the shape of the 1st 19A of lining portion of its below is shown.In this embodiment, be formed with and cross lining scope 20C and (refer to the be covered scope of the D of portion lining of blank part C being disposed at the 1st coating 19A on the said blank part C.Rectangular extent at the vertical Ca of illustrated example middle finger, horizontal Cb) rib shape 19b of portion and the groove shape 19c of portion.In addition, the Ca of expression lining scope 20C, the size of Cb in the scope of 10-500 μ m, are generally about 20-60 μ m usually.At this, the rib shape 19b of portion gives prominence on the inner surface (facing the surface of the inboard of blank part C) that is arranged at the 1st coating 19A, extends to the end of opposition side at least from the end straight line of lining scope 20C.And the groove shape 19c of portion is formed on the outer surface (outer surface of the opposition side of blank part C) of the 1st coating 19A, extends to the end of opposition side at least from the end straight line of lining scope 20C.
At this, as long as the rib shape 19b of portion and the groove shape 19c of portion cross lining scope 20C, though preferably according to top said straight line extension, also can extend become snakelike shape, the word shape, reflect shape, bending.And, preferably surpass said lining scope 20C and extend to its both sides always.In illustrated example, rib shape 19b of portion and the groove shape 19c of portion are formed into the ora terminalis of opposition side always from the ora terminalis of the 1st coating 19A.
In this embodiment, in the 1st coating 19A decentralized configuration a plurality of perforate 19a are arranged, said rib shape 19b of portion and the groove shape 19c of portion form through between the perforate 19a.And in this embodiment, a plurality of rib shape 19b of portion and the groove shape 19c of portion (in illustrated example for abreast) each other concurrently extend.And the 1st coating 19A integral body forms corrugated plate shape.Therefore, the rigidity of the 1st coating 19A improves, and can prevent that especially the D of lining portion is out of shape with the mode of submerging or give prominence to.Especially the 1st coating 19A makes reduced stiffness because a plurality of perforate 19a disperse to form, so extremely good according to the effect of top said rib shape 19b of portion that is provided with the mode of crossing lining scope 20C and the groove shape 19c of portion.
In addition; General rib is called as sometimes and is formed at that the surface is gone up and at the integrated strengthening part of installing with the direction of this surface quadrature; But the said rib shape of this specification portion not only comprises said rib self; Also comprise having from the surface the outstanding more multimode that becomes the thickness part of rib shape, be not limited to the outstanding mode of the direction of said surperficial quadrature.
Fig. 3 (a) is the partial top view and the partial sectional view of the expression mode different with above-mentioned embodiment with (b).In this example, on the outer surface of the 1st coating 19A, be formed with the rib shape 19d of portion.What this rib shape 19d of portion was provided with and crosses lining scope 20C, straight line extends, walks abreast each other between perforate 19a is a plurality of, and this point is identical with the above-mentioned rib shape 19c of portion.But the inner surface of the opposition side of the 1st coating 19A forms flat condition, does not form above-mentioned groove shape portion, so global shape does not constitute corrugated plate shape, this point is different.Even this shape, the rigidity of the 1st coating 19A also can improve, and this point is identical with above-mentioned embodiment.
Fig. 4 (a) is the partial top view and the partial sectional view of expression other modes different with above-mentioned embodiment with (b).In this example, in the 1st coating 19A, be provided with cross one another rib shape 19e of portion and 19f, this point is different with above-mentioned embodiment.On the 1st coating 19A, be respectively equipped with a plurality of rib shape 19e of portion and 19f with parallel each other mode.In addition, in illustrated example, rib shape 19e of portion and 19f are arranged on the outer surface of the 1st coating 19A, but also can all be arranged on the inner surface, perhaps also can any side be arranged on the outer surface, and the opposing party is arranged on the inner surface.
Fig. 5 (a) is the partial top view and the partial sectional view of expression other modes different with above-mentioned embodiment with (b).In this example, on the outer surface of the 2nd coating 22, be formed with the rib shape 22b of portion.When this situation; Distortion before the 2nd lining portion 22 that for example can not suppress forms; But use the embrane method that becomes of grooving and mask to form the rib shape 22b of portion through in the formation step of the 2nd coating 22, utilizing; The rigidity of the D of lining portion after the 2nd lining portion 22 of can improving forms is so for example can suppress to result from the distortion of the external and internal pressure difference behind the reduced pressure sealing.In addition, in illustrated example, be provided with the rib shape 22b of portion, replace but groove shape portion also can be set on the outer surface of the 2nd coating 22.
Fig. 6 (a)～(f) is the concise and to the point cutaway view of the variety of way when being illustrated in the D of lining portion rib shape portion or groove shape portion being set.Fig. 6 (a) expression has the corrugated section shown in the literal; Fig. 6 (b) expression has the concavo-convex section of square shape; Fig. 6 (c) expression has the concavo-convex section of triangle; Fig. 6 (d) expression upper surface has rib shape portion, and Fig. 6 (e) expression upper surface has groove shape portion, and Fig. 6 (f) expression lower surface has rib shape portion.In either case, can improve the Flexurally rigid of the D of lining portion.In addition, illustrated example all is the example of shape that schematically illustrates sag and swell, has stressed to draw concavo-convex degree, but in fact preferred positive and negative concavo-convex height difference separately is less than thickness.This is because in concavo-convex height difference during greater than thickness, because the attachment state (I ま わ り state) during film forming etc. make rigidity descend on the contrary.In addition; In the present invention; The sag and swell of corrugated plate shape is meant that the posture with correspondence forms in corresponding each other plan-position for rib shape portion that is located at the one side side as stated and the groove shape portion that is located at the another side side, a plurality of groups of structures that walk abreast and extend to form that are made up of these rib shape portions and groove shape portion.For above-mentioned concrete example, be equivalent to above-mentioned Fig. 6 (a) and (b) and section configuration (c).
Below, with reference to the manufacturing approach of Fig. 7～function element that Fig. 9 explanation the present invention relates to.Below the manufacturing approach of explanation is represented to make the MEMS element with MEMS tectosome and is had the example of the integrated multiple device that forms of semiconductor circuit of semiconductor element; But the invention is not restricted to this mode, comprise that also the functional configuration body is configured in the various function elements in the blank part.
As shown in Figure 7, at first form active layer 11A in the skin section of substrate 11.And; Utilize film techniques such as sputtering method and CVD method and fine pattern technology on substrate 11, to form basalis 12; On this basalis 12, utilize film technique and fine pattern technology such as sputtering method and CVD method, utilize same material to form 13A of infrastructure portion and lower electrode 13B simultaneously.
Then, utilize sputtering method and CVD method, utilize same material to form sacrifice layer 14A, dielectric film 14B, gate insulating film 14C simultaneously.Then, utilize sputtering method and CVD method etc., utilize same material to form the 15A of superstructure portion, upper electrode 15B and gate electrode 15C simultaneously.In addition, after forming gate electrode 15C, 15C carries out self calibration as mask this gate electrode, utilizes formation extrinsic region 11B and 11C such as ion implantation.
Then, utilize sputtering method and CVD method etc.,, form contact hole through patterned at above-mentioned textural formation interlayer dielectric 16.Then; Utilize vapour deposition method, sputtering method and CVD method etc.; On interlayer dielectric 16, form suitable wiring pattern, form the wiring layer 17A that is connected with the 13A of infrastructure portion conduction through above-mentioned contact hole, with upper electrode 15B conduct electricity the wiring layer 17B that is connected, conduct electricity the wiring layer 17C that is connected and 17D etc. with extrinsic region 11B and 11C.And, comprise other not shown wiring layers, utilize these wiring layers formation to be derived from the lead-out wiring structure of MEMS tectosome, capacitor, MOS transistor.
Then, utilize sputtering method and CVD method etc., at above-mentioned textural formation interlayer dielectric 18.And, on this interlayer dielectric 18, utilize fine pattern technology to form contact hole same as described above and have the concave-convex surface structure of the groove shape 18b of portion in the top position of the said superstructure 15A of portion.In addition, be not to form this concave-convex surface structure simultaneously with the patterning step of interlayer dielectric 18.But, preferably form in other steps before and after this patterning step.This is because can obtain best concaveconvex shape through independently handling.
Then, as shown in Figure 8, utilize vapour deposition method, sputtering method and CVD method etc., on interlayer dielectric 18, form the 1st coating 19A, wiring layer 19B, 19C, 19D, 19E.On the 1st coating 19A, utilize the fine pattern technology to form perforate 19a with its profile pattern and wiring pattern.It is textural that the 1st coating 19A is formed at said concave-convex surface, embodied outstanding being arranged on the lower surface of the rib shape 19b of portion of the said groove shape 18b of portion thus, and in the upper surface depression of the opposition side of this rib shape 19b of portion the groove shape 19c of portion is set.In addition, also can constitute the rib shape portion that replaces the said groove shape 18b of portion is set on the surface of interlayer dielectric 18, the groove shape portion of having embodied this rib shape portion is formed at the lower surface (inner surface) of the 1st coating 19A.
Then, as shown in Figure 9, utilize sputtering method and CVD method etc. to form the surface protection film 21 that constitutes by silicon nitride etc. from the teeth outwards.And, under the state that exposes in the zone that makes except that the circumference of said the 1st coating 19A, utilize surface protection film 21 zone beyond this zone that is covered fully.And, utilize hydrofluoric acid aqueous solution, the buffered hydrofluoric acid aqueous solution and hydrofluoric acid gas etc., remove interlayer dielectric 18,16 and sacrifice layer 14A under it through said perforate 19a.Form blank part C thus.Then, wait the inner surface that cleans blank part C through washing.
At last, as shown in Figure 1, utilize vapour deposition method, sputtering method and CVD method etc., film forming the 2nd coating 22 in post-decompression space (reaction vessel) becomes thus the state that reduces pressure in the blank part C is sealed perforate 19a, thereby seals.
In addition; In the above-described embodiment, be illustrated in interlayer dielectric 18 concave-convex surface structure is set, form the example of the 1st coating 19A above that with mode with the rib shape 19b of portion that embodies the concave-convex surface structure and groove shape 19c of portion; But; For example also can make any one deck in two-layer up and down form the beam shape, it is planar and range upon range of that another layer is formed, and forms above-mentioned various rib shape portions and groove shape portion thus.And, also can carry out film forming through mask and grooving, form above-mentioned various rib shape portions and groove shape portion.
Below, for the action effect of foregoing invention is described, comparative example is described with reference to Figure 10～Figure 12.In addition, in this comparative example, give same-sign, and omit its explanation the part identical with above-mentioned embodiment.
In this comparative example, shown in figure 10, the 1st coating 19A forms flat condition except that the perforate 19a with communicating structure, and this point is different with above-mentioned embodiment.And, formation blank part C same as described above, shown in figure 11 then, form the 2nd coating 22 and reduced pressure sealing blank part C.Under this state, revert to atmospheric pressure around making, shown in figure 12, because blank part C is poor with outside external and internal pressure, the D of lining portion that constitutes by the 1st coating 19A and the 2nd coating 22 inboard of submerging.
The above-mentioned lining D of portion submerging shown in the arrow among Figure 12 towards the 15A of superstructure portion to the inside, under the poorest situation, the D of portion of lining sometimes (the 1st coating 19A) contacts the superstructure 15A of portion in blank part C, causes the action of MEMS tectosome bad.And, even do not produce and the contacting of the 15A of superstructure portion, also can cause the pressure in the blank part C to rise, the perhaps change of the Electric Field Distribution in the blank part C makes the characteristic of MEMS tectosome produce deviation.In addition; Except that the external and internal pressure difference; According to the component of the 1st coating 19A and the 2nd coating 22, membrance casting condition, when dry water surface tension, based on the internal stress of the lit-par-lit structure of lining portion etc.; Make the D of lining portion produce distortion sometimes, thereby the distortion of the D of lining portion generation deviation, make device property produce deviation.In this embodiment, rigidity improves as stated, is difficult for producing the distortion of the lining D of portion, so it is bad with characteristic deviation etc. to reduce action, improves the yield rate of product, improves the quality of products.
In addition, electronic installation of the present invention and manufacturing approach thereof are not limited to above-mentioned illustrated example, certainly in the scope that does not break away from aim of the present invention, implement various changes.
For example; In the above-described embodiment; On semiconductor substrate, implement the semiconductor fabrication processes identical with CMOS technology; Form to constitute the MEMS tectosome as the MEMS element of function element such as actuator, oscillator, high frequency filter, but the invention is not restricted to have the MEMS element, can also be applicable to have quartz vibrator, the situation of the various function element beyond the MEMS element such as SAW element, acceleration transducer, gyro sensor.
And in the above-described embodiment, it is the semiconductor device of one that formation makes function element and semiconductor integrated circuit, but also can use the substrate beyond the semiconductor substrate, and other electronic circuits beyond the semiconductor circuit are connected with function element.
Below, with reference to Figure 13 and Figure 14 other embodiments that the present invention relates to are described.Figure 13 is near the amplifier section cutaway view of blank part C that amplifies this embodiment of expression, and Figure 14 is near the vertical view of blank part C of this embodiment.In this embodiment, not shown part with the structure of unaccounted part can be and above-mentioned Fig. 1～identical structure of embodiment shown in Figure 12, so give same-sign to the part corresponding with this embodiment.
In this embodiment, in blank part C, be provided with MEMS tectosome 20, it has 13A of infrastructure portion and the 15A of superstructure portion, and the 15A of superstructure portion is formed on the 13A of this infrastructure portion, and a part of separating with the 13A of infrastructure portion is disposed at the top with gap.This MEMS tectosome 20 is the functional configuration bodies that constitute MEMS, but the functional configuration body is not limited to MEMS.Be provided with the function of following MEMS tectosome 20 and the movable part that moves at the 15A of superstructure portion.This movable part is located at the D of lining portion one side in MEMS tectosome 20.
In illustrated example, the 13A of infrastructure portion forms according to being split into two-part pattern, and the wherein part of the 13A of infrastructure portion constitutes lower electrode 21, and other parts constitute the underclad portion of upper electrode 23.And the 15A of superstructure portion constitutes the above-mentioned movable part of upper electrode 22.In addition; Be not limited to the superstructure 15A of portion as shown in the figure and directly constitute the situation of movable part; Can make the part of the 15A of superstructure portion become movable part; Also can comprise the part outside the 15A of superstructure portion and constitute movable part, can also make the part that is positioned at coating D one side outside the 15A of superstructure portion constitute movable part.In addition, in this manual, in following explanation, be called movable part 15A.
Said movable part 15A constitutes and lower electrode 21 planes, and movable part and lower electrode 21 separate the gap arranged opposite.And, through between lower electrode 21 and upper electrode 23, applying AC signal, between lower electrode 21 and upper electrode 23, produce electrostatic force alternately, by this electrostatic force, the said movable part 15A vibration of upper electrode 23.Therefore, this MEMS tectosome 20 is brought into play the effect of resonator and wave filter according to the vibration characteristics of the said movable part 15A of upper electrode 23.
In addition; Functional configuration body (MEMS tectosome 20) is not limited to said structure; For example also can be as electrostatic actuator etc.; On basalis 12, do not separate movable part 15A directly is set with gap, can also as pressure sensor etc., make a part of attenuation of structure portion, the part of this attenuation constitutes movable part 15A.
The D of lining portion that blank part C is made up of the 1st coating 19A and the 2nd coating 22 is covered from the top.The 1st coating 19A is identical with each embodiment of front, is supported on the height and position that leaves basalis 12 and MEMS tectosome 20 by the dielectric film 16,18 that is formed on the substrate 11, and integral body constitutes tabular.Be formed with the groove shape 19e of portion facing on the inner surface of blank part C of the 1st coating 19A.This groove shape 19e of portion blank part C that crosses shown in figure 14.In addition, on the outer surface of the 1st coating 19A, be formed with the rib shape 19f of portion corresponding to the groove shape 19e of portion.And, on the inner surface of the 2nd coating 22, be formed with the groove shape 22e of portion corresponding to the rib shape 19f of portion, on the outer surface of the 2nd coating 22, be formed with the rib shape 22f of portion corresponding to this groove shape 22e of portion.In this embodiment, a plurality of groove shape 19e of portion, the rib shape 19f of portion, the groove shape 22e of portion, the rib shape 22f of portion are parallel respectively to form linearity, and crosses lining scope 20C.On the 1st coating 19A of the D of lining portion that constitutes like this, be provided with relief region 19t and flat site 19u; Relief region 19t has inclination and the step (having inclined plane and step surface at inner surface and at least one side of outer surface) that is formed by the groove shape 19e of portion, the rib shape 19f of portion, the groove shape 22e of portion, the rib shape 22f of portion; Flat site 19u be formed between a plurality of groove shape 19e of portion, the rib shape 19f of portion, the groove shape 22e of portion, the rib shape 22f of portion respectively and the outer rim of these parts and lining scope 20C between (zone that inner surface and outer surface are all smooth does not promptly have the zone of sag and swell).In addition, said flat site 19u has the wide width of width than the groove shape 19e of portion, the rib shape 19f of portion, the groove shape 22e of portion, the rib shape 22f of portion.
Be provided with the identical perforate 19a of embodiment that explains with the front at the 1st coating 19A.This perforate 19a forms in the face of blank part C, and a plurality of perforate 19a decentralized configuration are in lining scope 20C.Under the situation of illustrated example, perforate 19a avoids said relief region 19t, is formed on the said flat site 19u that is located between them.Through perforate 19a is arranged on the flat site 19u, as the mask body narration of back, the shape of perforate 19a can not destroyed like this; Can form opening shape with good repeatability accurately; And the circulation of etching solution in the time of can also guaranteeing to separate is so the stability when making improves; The stability and the repeatability of the characteristic of MEMS tectosome 20 can be guaranteed, yield rate can also be improved.
In this embodiment, in said lining scope 20C, be provided with scope (being designated hereinafter simply as " movable planar range 20S ") with the movable part 15A planes of MEMS tectosome 20.At this, movable part 15A constitutes rectangular shape when overlooking, the result, and said movable planar range 20S also becomes the rectangular extent of vertical Ma, horizontal Mb.But the shape of movable planar range 20S is not limited to rectangular-shaped, and its shape with movable part 15A can be a flat shape arbitrarily such as other polygon-shaped, circular, oval, Long Circle.
In this embodiment, be designed to and make the said groove shape 19e of portion, the rib shape 19f of portion, the groove shape 22e of portion, the rib shape 22f of portion cross movable planar range 20S.Therefore; Can improve the rigidity of the D of lining portion directly over the movable part 15A of MEMS tectosome 20; Can prevent the bad of MEMS tectosome 20 that the distortion of the D of lining portion causes, for example can prevent that the increase of parasitic capacitance from contacting with the 1st coating 19A etc. with deviation, movable part 15A.
In addition; In illustrated example; Perforate 19a also is formed in the movable planar range 20S with said movable part 15A planes, but forming the 2nd coating 22 during sealing perforate 19a, for the constituent material that prevents the 2nd coating 22 through this perforate 19a attached on the movable part 15A; Make the characteristic of MEMS tectosome 20 different with design load, the deviation of characteristic increases, and preferably in said movable planar range 20S, perforate 19a is not set.
And in this embodiment, at least one side utilizes electric conductor formations such as metal in preferred the 1st coating 19A and the 2nd coating 22, and the more preferably two-layer electric conductor that all utilizes constitutes.This is because through utilizing electric conductors such as metal to constitute the lining D of portion, can obtain electromagnetic shielding action.During this situation, preferably the D of lining portion is by electrical ground.
Figure 17 is the cutaway view of relation of the sag and swell formation position, the 1st coating 19A and perforate 19a of schematically representing to be used to explain the perforate 19a of above-mentioned embodiment.Shown in Figure 17 (a), do not form perforate 19a at the relief region 19t of the 1st coating 19A (in illustrated example, only form rake, but can form stage portion yet), only be formed with perforate 19a at the flat site 19u of the 1st coating 19A.In addition, 19z is different in the male and fomale(M&F) of the relief region 19t of the 1st coating 19A shown in Figure 17 and the above-mentioned inner surface shown in Figure 180 of following explanation zone, refers among the 1st coating 19A to be provided with inner surface and at least one side of outer surface the part of inclination and step.And the flat site 19u of the 1st coating 19A refers among the 1st coating 19A flat portions of inner surface and outer surface both sides.
Through forming perforate 19a at the flat site 19u of the 1st coating 19A as stated, for example use the opening shape of the perforate 19a of formation such as photoetching technique can not destroy, can realize high precision int and the raising of repeatability of the opening shape of perforate 19a.Therefore, can improve the stability of separating step, and then improve the repeatability of the shape of blank part C, the result can realize the stabilisation of the characteristic of MEMS tectosome 20 improving yield rate.To this; If perforate 19a is set at relief region 19t, then at least one square neck of the inner surface of the 1st coating 19A and outer surface tiltedly or become step-like, so under-exposed or superfluous when for example producing photoetching; Cause etching mask bad; As a result, can not form perforate 19a, perhaps opening shape is too small or excessive.
Below, with reference to Figure 15 and Figure 16 other embodiments in addition of the present invention are described.Figure 15 is near the amplifier section cutaway view of blank part C that amplifies this embodiment of expression, and Figure 16 is near the vertical view of blank part C of this embodiment.In this embodiment, not shown part with the structure of unaccounted part can be and above-mentioned Fig. 1～identical structure of embodiment shown in Figure 12, so give same-sign to the part corresponding with this embodiment.And, below do not do the item of in embodiment, having explained in the item of explanation with reference to Figure 13, Figure 14 and Figure 17 explanation, promptly and the reconcilable item of this embodiment, in this embodiment structure same as described above.
In this embodiment, MEMS tectosome 20 and Figure 13 and embodiment shown in Figure 14 are identical, but it is different with the sag and swell of the 2nd coating 22 to be located at the 1st coating 19A.In this embodiment, the 1st coating 19A has the rib shape 19g of portion in the face of on the inner surface 19x of blank part C.This rib shape 19g of portion blank part C that crosses shown in figure 16.In addition, on the outer surface of the 1st coating 19A, be formed with the groove shape 19h of portion corresponding to the rib shape 19g of portion.And, on the inner surface of the 2nd coating 22, be formed with the rib shape 22g of portion corresponding to the groove shape 19h of portion, on the outer surface of the 2nd coating 22, be formed with the groove shape 22h of portion corresponding to this rib shape 22g of portion.In this embodiment, a plurality of rib shape 19g of portion, the groove shape 19h of portion, the rib shape 22g of portion, the groove shape 22h of portion are parallel respectively to form linearity, and crosses lining scope 20C.On the D of lining portion that constitutes like this; Between a plurality of rib shape 19g of portion, the groove shape 19h of portion, the rib shape 22g of portion, the groove shape 22h of portion and between the outer rim of these parts and lining scope 20C; Be respectively equipped with flat site (zone that inner surface and outer surface are all smooth does not promptly have the zone of sag and swell).In addition, said flat site has the wide width of width than the rib shape 19g of portion, the groove shape 19h of portion, the rib shape 22g of portion, the groove shape 22h of portion.
In the D of lining portion of this embodiment; The said rib shape 19g of portion avoids being provided with the movable planar range 20S of the movable part 15A planes of the upper electrode 23 of MEMS tectosome 20; The inner surface in the face of movable part C of the D of lining portion is the movable planar range 20S of the inner surface 19x of the 1st coating 19A, becomes the tabular surface zone 19y less than inclination that forms with sag and swell and step.Therefore, can guarantee the interval of movable part 15A and the D of lining portion accurately with good repeatability, result, the generation of the increase that can suppress parasitic capacitance and deviation, movable part 15A and unfavorable conditions such as the D of lining portion contacts.And, in the zone of avoiding said movable planar range 20S of the D of lining portion, the sag and swell that is made up of the said rib shape 19g of portion, the groove shape 19h of portion, the rib shape 22g of portion, the groove shape 22h of portion is set, so can give sufficient rigidity to the D of lining portion.Especially through said flat site (the tabular surface zone 19y of the inner surface 19x of the 1st coating 19A) both sides at the D of lining portion; The sag and swell that is made up of the said rib shape 19g of portion, the groove shape 19h of portion, the rib shape 22g of portion, the groove shape 22h of portion is set respectively, can further improves the rigidity of the D of lining portion.
In this embodiment, in said movable planar range 20S, perforate 19a is not set, a plurality of perforate 19a avoid movable planar range 20S and are provided with, and disperse to be formed at the position beyond the movable planar range 20S among the lining scope 20C.Therefore, when utilizing the perforate 19a of the 2nd coating 22 sealings the 1st coating 19A, can prevent that the constituent material of the 2nd coating 22 is first-class attached to movable part 15A, make the characteristic degradation of MEMS tectosome 20, characteristic produce deviation.
In this embodiment; The whole lining D of portion becomes the flat site that sag and swell is not set in said movable planar range 20S; But as long as at least in the face of the inner surface of blank part C, be on the inner surface 19x of the 1st coating 19A in this embodiment, said movable planar range 20S becomes not have to form the inclination following sag and swell and form and the regional 19y of tabular surface of step gets final product.
Figure 18 is the sketch map in the face of the relation of the said inner surface 19x of blank part C of MEMS tectosome 20 and the D of lining portion in the expression lining scope.At this, as stated, be provided with tabular surface zone 19y at inner surface 19x, utilize said sag and swell to form male and fomale(M&F) zone 19z simultaneously.This male and fomale(M&F) zone 19z is equivalent in inner surface 19x, have the part of inclination and step through in said inner surface 19x, forming rib shape 19g of portion and the groove shape 19h of portion.At the rib shape 19g of portion and the groove shape 19h of portion when its integral width direction is only formed by inclined plane and step surface; The formation scope of this rib shape 19g of portion or the groove shape 19h of portion all becomes male and fomale(M&F) zone 19z; And; Shown in illustrated example, when there was flat surface portion in the central authorities at rib shape 19g of portion and the groove shape 19h of portion, male and fomale(M&F) zone 19z was located at two edge portions of a rib shape portion and groove shape portion respectively.And the part among the said inner surface 19x outside the 19z of male and fomale(M&F) zone becomes said tabular surface zone 19y.
Shown in figure 18, in the said movable planar range 20S of said inner surface 19x, there is not said male and fomale(M&F) zone 19z, all become said tabular surface zone 19y.During this situation; As shown in the figure; When said movable planar range 20S becomes the elongate shape of vertical Ma＞horizontal Mb; Be preferably formed that the length direction along movable planar range 20S is that longitudinal direction extends in the outside of said movable planar range 20S for male and fomale(M&F) zone 19z, that is, rib shape 19g of portion and the groove shape 19h of portion on the said inner surface 19x cross lining scope 20C at said length direction (longitudinal direction).In addition, in these both sides of more preferably the rib shape 19g of portion on male and fomale(M&F) zone 19z or the said inner surface and the groove shape 19h of portion being located at said movable planar range 20S, this point is same as described above.
According to said structure; Male and fomale(M&F) zone 19z is not set and only has tabular surface zone 19y at movable planar range 20S; Can improve the rigidity of the D of lining portion among the lining scope 20C thus, the influence of avoiding the sag and swell in the movable planar range 20S to cause to movable part 15A.Especially shown in illustrated example, when the length direction of the length direction of the lining scope 20C of the shape of growing crosswise that becomes vertical Ca＜horizontal Cb and said movable planar range 20S intersects (quadrature), can constitute the integral rigidity that reduces the D of lining portion hardly.
On the other hand, shown in the dotted line among Figure 18, make the rib shape 19g ' of portion that comprises male and fomale(M&F) zone or the groove shape 19h ' of portion intersect the direction of (quadrature) when crossing at the length direction with said movable planar range 20S being designed to, the rigidity of the D of lining portion descends easily.Especially shown in illustrated example; Make the rib shape 19g ' of portion or the groove shape 19h ' of portion when the length direction of the lining scope 20C of the shape of growing crosswise that becomes vertical Ca＜horizontal Cb crosses being designed to, almost can't expect to improve effect based on the rigidity of the D of lining portion of sag and swell.
Claims (15)
1. a function element possesses substrate, is formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered, and said function element is characterised in that,
Said lining portion has the sag and swell that comprises rib shape portion or groove shape portion; Wherein, The lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion, and extends to its both sides above said lining scope, and said sag and swell extends to the outside that the lining scope is the blank part zone.
2. function element according to claim 1 is characterized in that, said sag and swell comprises parallel each other a plurality of said rib shape portion or groove shape portion.
3. function element according to claim 2 is characterized in that, said sag and swell forms corrugated plate shape at least in said lining scope.
4. function element according to claim 1 is characterized in that, said lining portion in the face of being formed with said rib shape portion on the inner surface of said blank part.
5. function element according to claim 1; It is characterized in that; Said lining portion has and is formed at said blank part side and has in the face of the 1st coating of the perforate of said blank part and seal the 2nd coating of the said perforate of the 1st coating, on said the 1st coating, is provided with said sag and swell.
6. function element according to claim 5 is characterized in that, looses at said covered part and disposes a plurality of said perforates, and said rib shape portion or groove shape portion straight line between said perforate extends.
7. according to any described function element in the claim 1～6, it is characterized in that said blank part is depressurized sealing.
8. according to any described function element in the claim 1～3, it is characterized in that,
Said functional configuration body has the movable part of following its function and moving in said lining portion one side,
Said lining portion in the face of in the inner surface of said blank part with the scope of said movable part planes; Become and do not have the inclination that constitutes by said rib shape portion or said groove shape portion and the tabular surface zone of step; Said lining portion comprises metal level; Said movable part constitutes and the lower electrode planes, by and said lower electrode between electrostatic force vibrate.
9. function element according to claim 4 is characterized in that,
Said functional configuration body has the movable part of following its function and moving in said lining portion one side,
Said lining portion in the face of on the inner surface of said blank part, avoid forming said rib shape portion with the scope of said movable part planes.
10. according to any described function element in the claim 1～4, it is characterized in that,
Said functional configuration body has the movable part of following its function and moving in said lining portion one side,
Said sag and swell constitutes and makes said rib shape portion or said groove shape portion cross the scope with said movable part planes.
11. function element according to claim 5 is characterized in that, the relief region that is made up of said rib shape portion or said groove shape portion is avoided in said perforate in said the 1st coating, is formed at the flat site of said the 1st coating.
12. according to claim 5,6 or 11 described function elements, it is characterized in that,
Said functional configuration body has the movable part of following its function and moving in said lining portion one side,
Said perforate is avoided forming with the scope of said movable part planes.
13. the manufacturing approach of a function element, this function element possess substrate, are formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered, said manufacturing approach is characterised in that, comprising:
Tectosome forms step, forms said functional configuration body with sacrifice layer;
Dielectric film forms step, on said functional configuration body, forms dielectric film, and this dielectric film has the concaveconvex shape that comprises groove shape portion or rib shape portion at least a portion surf zone;
The 1st coating forms step; On said surf zone, form the 1st coating; The 1st coating has the sag and swell that embodies said concaveconvex shape and comprise rib shape portion or groove shape portion, and has perforate, and the lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion; And surpass said lining scope and extend to its both sides, said sag and swell extends to the outside that the lining scope is the blank part zone;
Separating step through the said perforate of said the 1st coating, is removed said dielectric film and said sacrifice layer on the said functional configuration body; With
The lining step, the 2nd coating of the said perforate of said the 1st coating of formation sealing.
14. the manufacturing approach of a function element, this function element possess substrate, are formed at the functional configuration body on this substrate, the lining portion that disposes the blank part of this functional configuration body and this blank part that is covered, said manufacturing approach is characterised in that, comprising:
Tectosome forms step, forms said functional configuration body with sacrifice layer;
Dielectric film forms step, on said functional configuration body, forms dielectric film;
The 1st coating forms step; On said dielectric film, form the 1st coating, the 1st coating has two-layer at least stepped construction, has the comprise rib shape portion corresponding with the formation scope of any at least one deck or the sag and swell of groove shape portion; And has perforate; The lining scope that covers said blank part is crossed by said rib shape portion or groove shape portion, and extends to its both sides above said lining scope, and said sag and swell extends to the outside that the lining scope is the blank part zone;
Separating step through the said perforate of said the 1st coating, is removed said dielectric film and said sacrifice layer on the said functional configuration body; With
The lining step, the 2nd coating of the said perforate of said the 1st coating of formation sealing.
15. the manufacturing approach according to claim 13 or 14 described function elements is characterized in that, in said lining step, said the 2nd coating utilizes chemical vapour deposition film forming in the space that is depressurized, the said blank part of reduced pressure sealing thus.
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|---|---|---|---|
| JP2008004037 | 2008-01-11 | ||
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| JP2008300523 | 2008-11-26 | ||
| JP2008-300523 | 2008-11-26 | ||
| JP2008300523A JP5435199B2 (en) | 2008-01-11 | 2008-11-26 | Functional device and manufacturing method thereof |
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| TWI611569B (en) * | 2015-09-29 | 2018-01-11 | 精材科技股份有限公司 | Electrical device and manufacturing method thereof |
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| US7405924B2 (en) * | 2004-09-27 | 2008-07-29 | Idc, Llc | System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
-
2008
- 2008-11-26 JP JP2008300523A patent/JP5435199B2/en not_active Expired - Fee Related
-
2009
- 2009-01-09 CN CN2009100014516A patent/CN101513989B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1251099A2 (en) * | 2000-03-24 | 2002-10-23 | Interuniversitair Microelektronica Centrum Vzw | Method of improving mechanical strength in micro electro mechanical systems and devices produced thereof |
| EP1226944A1 (en) * | 2001-01-24 | 2002-07-31 | Xerox Corporation | Fabrication method |
| JP2004314292A (en) * | 2003-03-20 | 2004-11-11 | Robert Bosch Gmbh | Electromechanical system having controlled atmosphere. and method of manufacturing same |
| CN1586653A (en) * | 2004-09-03 | 2005-03-02 | 清华大学 | Piezoelectric driven array micro spray and its processing method |
| EP1640328A2 (en) * | 2004-09-27 | 2006-03-29 | Idc, Llc | System and method for protecting microelectromechanical systems array using back-plate with non-flat portion |
| JP2006263902A (en) * | 2005-02-25 | 2006-10-05 | Hitachi Ltd | Integrated micro electromechanical system, and manufacturing method thereof |
| FR2901264A1 (en) * | 2006-05-22 | 2007-11-23 | Commissariat Energie Atomique | MICRO COMPONENT HAVING A CAVITY DELIMITED BY A COVER WITH IMPROVED MECHANICAL RESISTANCE |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009184102A (en) | 2009-08-20 |
| JP5435199B2 (en) | 2014-03-05 |
| CN101513989A (en) | 2009-08-26 |
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