CN101509744A - Microchannel for compact heat exchanger and atomic diffusion bonding manufacturing method thereof - Google Patents
Microchannel for compact heat exchanger and atomic diffusion bonding manufacturing method thereof Download PDFInfo
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- CN101509744A CN101509744A CNA2009100258116A CN200910025811A CN101509744A CN 101509744 A CN101509744 A CN 101509744A CN A2009100258116 A CNA2009100258116 A CN A2009100258116A CN 200910025811 A CN200910025811 A CN 200910025811A CN 101509744 A CN101509744 A CN 101509744A
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Abstract
The invention discloses a compact heat exchanger micro-channel and a manufacture method thereof. The micro-channel is formed by the mutual superposition of a plurality of elementary layers, which are sequentially a refrigeration working substance layer, a baffle layer, a working fluid layer and a baffle layer. The elementary layers are put in a cavity under vacuum state for heating and pressurizing after superposition, and finally, due to atomic diffusion happening on metal surfaces, the elementary layers are mutually combined as a whole the same as a metal fine structure, and the diameter of the micro-channel and the thickness range of the interlayer are both micron level. The invention is characterized by no thermal resistance caused by welding, random design of hydraulics diameter of a micro-channel and the heat transfer area in unit volume more than 700, and the like. The manufactured micro-channel heat exchanger can be used as a heat pump water heater, a heat pump boiler and a condenser, a gas cooler or an evaporator used in a geothermal heat pump, thus greatly improving the heat exchange capacity of the heat exchanger in unit volume, saving the using materials of the heat exchanger, and further reducing the volume and weight of the heat pump water heater, the heat pump boiler and the geothermal heat pump.
Description
Technical field:
The present invention relates to a kind of manufacture method of compact microchannel heat exchanger, be specifically related to be used for Teat pump boiler with the manufacturing of diffusion combination technology, the condenser that uses in heat pump boiler and the geothermal heat pump, the compact microchannel heat exchanger of gas cooler or evaporimeter belongs to production technical field.
Background technology:
Teat pump boiler in the heat exchanger that heat pump boiler and geothermal heat pump use, is generally made (bushing type twines formula outward, and is inserted etc.) with copper pipe at present.Problems such as with the heat exchanger that copper pipe is made, it is big to have a volume, uses the copper pipe amount many, and heat exchange area is few in the unit volume have directly caused consumed resource big, and construction area and utilization of space are little, use problems such as refrigeration working medium is many.In order to solve the problem that heat exchanger brought of copper pipe manufacturing, plate type heat exchanger is expected, and begins now gradually to use in heat pump boiler and the geothermal heat pump at some Teat pump boilers.Plate type heat exchanger is generally made with stainless steel, compares under the condition of same exchange capability of heat and with the heat exchanger that copper pipe is made, and weight and volume all approximately can reduce over half, becomes a direction of present research and development.Although plate type heat exchanger has overcome some problems with the copper pipe heat exchanger made, still do not reach the requirement of compact heat exchanger, promptly the heat exchange area in each cubic metre will reach more than 700.Simultaneously, the forced-convection heat transfer coefficient of plate type heat exchanger is little, and it is big with the thermal resistance between fin and the channel material strengthen to conduct heat in the passage, and problem such as fluid skewness needs to be resolved hurrily in each runner.
The research and development micro-channel heat exchanger as plate type heat exchanger substitute from now on, has become a new direction in the heat exchanger research and development.Under the condition of same exchange capability of heat, it is littler that micro-channel heat exchanger has a volume with respect to plate type heat exchanger, and weight lighter (volume and weight can reduce over half for plate type heat exchanger again) can reach the requirement of compact heat exchanger.But, how realizing that the size of heat exchanger microchannel satisfies heat transfer, how the designing requirement of heat exchange eliminates heat transfer, the thermal resistance in the heat transfer process, this manufacture method to micro-channel heat exchanger has proposed new requirement.
The manufacture method of microchannel, in number of patent application 200510012007.6, mention, but the micro-channel heat exchanger that can make, application target is the heat exchange between refrigeration working medium and the gas, can not be used for as Teat pump boiler refrigeration working medium that uses in heat pump boiler and the geothermal heat pump and the heat exchange between the liquid.Number of patent application is in 200510011254.4 the application for a patent for invention prospectus, stated that a kind of microchannel plate sticks up the formula heat exchanger, its main body has adopted plate to stick up the plate bundle body structure of formula heat exchanger, and each layer has hydraulic diameter and be welded into an integral body less than the grooved drum plate separate machined of 3mm groove again after good.Plate bundle body adopts vacuum brazing, and plate Shu Tiyu end socket etc. adopt manual argon arc welding.Can above-mentioned microchannel plate stick up the formula heat exchanger and be suitable for for the micro-channel heat exchanger of micron order hydraulic diameter, not clear and definite.This obviously exists between the plate bundle body that constitutes micro-channel heat exchanger because the thermal resistance that soldering produces.
Summary of the invention:
The objective of the invention is at the deficiencies in the prior art, adopt the method for atom diffusion combination to make micro-channel heat exchanger, be used for Teat pump boiler, the condenser that uses in heat pump boiler and the geothermal heat pump, gas cooler or evaporimeter.The micro-channel heat exchanger made from the method for atom diffusion combination, eliminated the thermal resistance that constitutes the micro-channel heat exchanger metal interlevel, can be according to heat transfer, the result of heat exchange and mobile performance design, compressive resistance, the design result of rigidity decides the hydraulic diameter of microchannel, greatly improves the exchange capability of heat of unit volume heat exchanger, saves heat exchanger and uses material.
The present invention is achieved in that microchannel for compact heat exchanger is formed by several elementary layer mutual superposition, and each elementary layer is followed successively by refrigeration working medium layer, carrier ring, working fluid layer and carrier ring.On described refrigeration working medium layer and working fluid layer, be evenly distributed with several passages.
The microchannel for compact heat exchanger atomic diffusion bonding manufacturing method: at first to refrigeration working medium layer and working fluid layer processing channel, the cavity that the is in vacuum state pressurization of heating is put in all elementary layers stack that will constitute the microchannel then; The surface of last refrigeration working medium layer, working fluid layer and carrier ring produces the atom diffusion, and mutually combining is the integral body the same with the metal superfine structure.
The present invention compares with the microchannel manufacture method with existing heat exchanger, has following significant advantage and outstanding effect:
1. eliminated fully in the microchannel because the thermal resistance that welding produces.
2. satisfy the hydraulic diameter requirement of the design of any microchannel fully.
3. can bear the condition of any hot fluid heat exchange under the high temperature and high pressure condition fully.
Exactly because adopt the method for atom diffusion combination to make micro-channel heat exchanger aforesaid characteristics are arranged, therefore, under the condition of same exchange capability of heat, compare with double pipe heat exchanger just in use, volume can reduce more than 100 times.Weight can be reduced to below 1/8th, and the heat transfer area in the unit volume has reached the index of compact heat exchanger definition greater than 700.Realized there is not thermal resistance, working fluid and refrigeration working medium both sides all are the liquid of micron order passage and the micro-channel heat exchanger of refrigeration working medium heat exchange.Use the heat pump product of above-mentioned microchannel, can do compactly, reduce the occupied area or the space of building, improve performance, reduce the use amount of refrigeration working medium.
Description of drawings:
Fig. 1 is the schematic diagram of metallic atom diffusion cohesive process
Among the figure, A and B are respectively that the atom diffusion is in conjunction with preceding independent metal
(a) represent two and stacked later situation
(b) represented to heat, after the pressurization, the atom diffusion process between metal
(c) represented that atom spreads the result of two independent metal combinations
Fig. 2 is the refrigeration working medium layer, carrier ring, the structural representation of working fluid layer.
Left side figure is that figure is that the right figure of carrier ring is that C is a passage among the working fluid layer figure in the refrigeration working medium layer
Fig. 3 is the structural representation of microchannel for compact heat exchanger.
1. elementary layers, 2. refrigeration working medium layers, 3. interlayer, 4. working fluid layers, 5. passage among the figure
The specific embodiment:
As shown in Figure 2, microchannel for compact heat exchanger of the present invention is formed by several elementary layer 1 mutual superposition, each elementary layer 1 is followed successively by refrigeration working medium layer 2, carrier ring 3, working fluid layer 4 and carrier ring 3, is evenly distributed with several passages 5 on refrigeration working medium layer 2 and working fluid layer 4.Result according to heat transfer, heat exchange and mobile performance design, and the design result of compressive resistance, rigidity, process passage in refrigeration working medium layer and the working fluid layer with light burn into precision stamping and mode such as discharge processing etc., process interlayer between refrigeration working medium layer and the working fluid layer and the interlayer between elementary layer and the elementary layer.After all elementary layers stacks with the formation micro-channel heat exchanger, put into the cavity that is in vacuum state, to its pressurization of heating.At vacuum state, metallic surface is subjected to temperature and pressure and produces the atom diffusion later on, is combined into the integral body the same with the metal superfine structure through between the regular hour metal surface, as shown in Figure 1.
The material of above-mentioned microchannel for compact heat exchanger can be copper, aluminium or stainless steel.
The scope of design of the hydraulic diameter of microchannel is a micron order.The scope of design of the thickness of interlayer is for also being micron order.
Claims (5)
1. microchannel for compact heat exchanger, form by several elementary layers (1) mutual superposition, each elementary layer (1) is followed successively by refrigeration working medium layer (2), carrier ring (3), working fluid layer (4) and carrier ring (3), is evenly distributed with several passages (5) on described refrigeration working medium layer (2) and working fluid layer (4).
2. microchannel for compact heat exchanger according to claim 1 is characterized in that: described passage (5) is a micron order.
3. microchannel for compact heat exchanger according to claim 1 is characterized in that: described interlayer (3) is a micron order.
4. microchannel for compact heat exchanger according to claim 2 is characterized in that: described refrigeration working medium layer (2), carrier ring (3) are identical with the material of working fluid layer (4), and its material is copper, aluminium or stainless steel.
5. microchannel for compact heat exchanger atomic diffusion bonding manufacturing method, at first to refrigeration working medium layer (2) and working fluid layer (4) processing channel (5), the cavity that the is in vacuum state pressurization of heating is put in all elementary layers (1) stack that will constitute the microchannel then; The surface of last refrigeration working medium layer (2), working fluid layer (4) and carrier ring (3) produces the atom diffusion, and mutually combining is the integral body the same with the metal superfine structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2009100258116A CN101509744A (en) | 2009-03-10 | 2009-03-10 | Microchannel for compact heat exchanger and atomic diffusion bonding manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2009100258116A CN101509744A (en) | 2009-03-10 | 2009-03-10 | Microchannel for compact heat exchanger and atomic diffusion bonding manufacturing method thereof |
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| CN101509744A true CN101509744A (en) | 2009-08-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095284A (en) * | 2011-01-30 | 2011-06-15 | 杭州沈氏换热器有限公司 | Manufacture method of microchannel heat exchange body of heat exchanger |
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2009
- 2009-03-10 CN CNA2009100258116A patent/CN101509744A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102095284A (en) * | 2011-01-30 | 2011-06-15 | 杭州沈氏换热器有限公司 | Manufacture method of microchannel heat exchange body of heat exchanger |
| CN102095284B (en) * | 2011-01-30 | 2013-03-27 | 杭州沈氏换热器有限公司 | Manufacture method of microchannel heat exchange body of heat exchanger |
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Open date: 20090819 |