CN101509625A - Backlight module and optoelectronic device - Google Patents
Backlight module and optoelectronic device Download PDFInfo
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- CN101509625A CN101509625A CNA2009101330845A CN200910133084A CN101509625A CN 101509625 A CN101509625 A CN 101509625A CN A2009101330845 A CNA2009101330845 A CN A2009101330845A CN 200910133084 A CN200910133084 A CN 200910133084A CN 101509625 A CN101509625 A CN 101509625A
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- optical sheet
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Abstract
The invention relates to a backlight module and a photoelectric device, the backlight module comprises an optical plate and at least one light emitting element. The optical plate comprises a light-incoming face and a light-exiting face. The light emitting element is arranged on a circuit board and faces toward the light-incoming face, wherein, the light emitting element is magnetically absorbed on the optical plate by making use of at least one magnetic absorption member that is arranged on at least one or both of the optical plate and the circuit board. On account of using the magnetic absorption member for the assembly, the assembly positioning precision of the backlight module can be improved and the risk that the light emitting element is damaged can be reduced.
Description
Technical field
The present invention relates to a kind of backlight module and electrooptical device, and be particularly related to a kind of backlight module and the simple electrooptical device of assembly program that can precisely locate assembling.
Background technology
In general LCD, because display panels (Liquid crystal display panel) does not have the function of active illuminating, so the display panels back light of must arranging in pairs or groups can carry out the demonstration of image.
Figure 1A and Figure 1B are the schematic diagram of existing a kind of side direction type backlight module 100.Please refer to Figure 1A, in the prior art, the circuit board 110 that is to use viscose (not indicating) will be provided with light-emitting component 120 is fixed on glue frame 130 or the LGP 140.But, above-mentioned in the fixing mode of viscose easily because of the displacement of LGP 140 or other factors cause the gap d that exists between LGP 140 and the light-emitting component 120, shown in Figure 1B.Thus, backlight module 100 is easy to generate light leak.In addition, wayward because of LGP 140 with the positioning accuracy of light-emitting component 120, therefore fix said elements and also be difficult for making LGP 140 and precisely contraposition of light-emitting component 120 with viscose.In addition, when carrying out the heavy industry program to backlight module 100, needs when (rework process), also must overcome the stickiness of viscose glue and residual problem, so the heavy industry program is difficult for carrying out.
Summary of the invention
The present invention proposes a kind of backlight module, can improve the assembling positioning accuracy.
The present invention proposes a kind of backlight module again, can lower the risk that light source is damaged.
The present invention reintroduces a kind of electrooptical device, has above-mentioned backlight module, can simplify assembly program and heavy industry program.
The present invention proposes a kind of backlight module, and it comprises a light-emitting device, and described light-emitting device comprises optical sheet and at least one light-emitting component.Optical sheet comprises incidence surface and exiting surface.Light-emitting component is arranged on the circuit board, and light-emitting component regards to incidence surface, and wherein, light-emitting component is to utilize at least one magnetic absorption member on one of them at least that is arranged at optical sheet and circuit board and be magneted on the optical sheet.
The present invention proposes a kind of backlight module again, comprises optical sheet, backboard, at least one fluorescent tube and a plurality of fluorescent-tube fixer.Optical sheet comprises incidence surface and exiting surface.Backboard is positioned at the below of the incidence surface of optical sheet.Fluorescent tube is arranged between the incidence surface of backboard and optical sheet.A plurality of fluorescent-tube fixers are coated on the end of fluorescent tube respectively, and optical sheet is arranged on the fluorescent-tube fixer, each fluorescent-tube fixer electrode of comprising elastic body, being embedded in the magnetic absorption member in the elastic body and being embedded in the elastic body and electrically connecting with the end of fluorescent tube wherein, the magnetic absorption member that wherein is embedded in a plurality of fluorescent-tube fixers is magneted on the incidence surface of backboard or optical sheet.
The present invention reintroduces a kind of electrooptical device, and it comprises above-mentioned backlight module.
Useful technique effect of the present invention is, because backlight module proposed by the invention is to use magnetic absorption member to assemble, therefore can improves the assembling positioning accuracy, also can lower the risk that light source is damaged.In addition, because electrooptical device of the present invention has above-mentioned backlight module, therefore can simplify assembling and heavy industry program.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Figure 1A and Figure 1B are the schematic diagram of existing a kind of side direction type backlight module 100.
Fig. 2 is the decomposing schematic representation of the backlight module 200 of preferred embodiment of the present invention.
Fig. 3 A is the schematic diagram of the light-emitting device 300 of preferred embodiment of the present invention.
Fig. 3 B is the schematic side view of Fig. 3 A.
Fig. 4 is the schematic diagram of light-emitting component 320.
Fig. 5 A is the schematic side view before light-emitting device 400 assemblings of another preferred embodiment of the present invention.
Fig. 5 B is the schematic side view after light-emitting device 400 assemblings.
Fig. 6 A is the light-emitting device 500 assemblings schematic diagram before of the another preferred embodiment according to the present invention.
Fig. 6 B be after light-emitting device 500 assembling on look schematic diagram.
Fig. 6 C is the schematic side view after light-emitting device 500 assemblings.
Fig. 7 A is the decomposing schematic representation of the backlight module 600 ' of preferred embodiment of the present invention.
Fig. 7 B is the light-emitting device 600 assemblings schematic side view before of Fig. 7 A.
Fig. 7 C is the schematic side view after light-emitting device 600 assemblings.
Fig. 8 A is the schematic side view before backlight module 700 assemblings of preferred embodiment of the present invention.
Fig. 8 B is the schematic side view after backlight module 700 assemblings.
Fig. 9 A is the schematic side view before the backlight module 700 ' assembling of another preferred embodiment of the present invention.
Fig. 9 B is the schematic side view after the backlight module 700 ' assembling.
Figure 10 A is the backlight module 700 of the another preferred embodiment of the present invention " assembling schematic side view before.
Figure 10 B is a backlight module 700 " assembling after schematic side view.
Figure 11 is the schematic diagram of display module according to an embodiment of the invention.
Figure 12 is the schematic diagram of electrooptical device according to an embodiment of the invention.
Wherein, description of reference numerals is as follows:
100,200,600 ', 820,700,700 ', 700 ": backlight module
110,330,630: circuit board 120,320,620: light-emitting component
130: glue frame 140: LGP
210,620 ': reflecting plate 220,630 ': optical sheet set
230: framework 232: hold side
300,400,500,600: light-emitting device 310,510,610,710: optical sheet
310c, 510c: bottom surface
310a, 510a, 610a, 710a: incidence surface
310b, 510b, 610b, 710b: exiting surface
322, storage tank 324: light-emitting diode chip for backlight unit
326: optical cement 340,640,744: magnetic absorption member
340a: the surface of magnetic absorption member 340
350a: by the surface of magnetic absorption member 350
350,650,750: by magnetic absorption member 610 ', 720,720 ', 720 ": backboard
730: fluorescent tube 732: end
740: fluorescent-tube fixer 742: elastic body
800: display module 810: display floater
900: electronic component 950: electrooptical device
D: gap E1, E2: electrode
The specific embodiment
Fig. 2 is the decomposing schematic representation of the backlight module 200 of preferred embodiment of the present invention.Fig. 3 A is the local member schematic diagram of the backlight module of Fig. 2.Fig. 3 B is the schematic side view of Fig. 3 A.In this embodiment, backlight module 200 is the side direction type backlight module, and Fig. 3 A and Fig. 3 B are LGP in the light-emitting device 300 of Fig. 2 and the schematic diagram before the circuit board assembling.
Please refer to Fig. 2, Fig. 3 A and Fig. 3 B, backlight module 200 comprises light-emitting device 300, and preferably, backlight module 200 also comprises reflecting plate 210, optical sheet set 220 and framework 230.Reflecting plate 210 is arranged under the light-emitting device 300.Optical sheet set 220 is arranged at the top of light-emitting device 300.The side 232 that holds of framework 230 defines a spatial accommodation 232a, to hold light-emitting device 300, reflecting plate 210 and optical sheet set 220.
Particularly, be arranged at the light reflection that light-emitting device 300 beneath reflecting plates 210 can be produced light-emitting device 300, so that light penetrates toward specific direction.In addition, the optical sheet set 220 that is arranged at light-emitting device 300 tops for example can be used diffusion sheet (Diffuser), blast sheet (BrightnessEnhancement film, BEF), polar biased conversion sheet (DBEF) or other suitable diaphragm, wherein, optical sheet set 220 is arranged in pairs or groups and is formed by being selected from above-mentioned blooming piece more than at least a, so that light evenly and concentrate.Be noted that herein the present invention does not limit the setting of reflecting plate 210, in other embodiments, a coating or pattern also can be set on the 310c of the bottom surface of optical sheet 310 to replace the configuration of reflecting plate 210.
Light-emitting device 300 comprises optical sheet 310 and at least one light-emitting component 320, shown in Fig. 3 A and Fig. 3 B.
In this embodiment, optical sheet 310 for example is a LGP.Optical sheet 310 comprises incidence surface 310a and exiting surface 310b.So-called incidence surface 310a refers to light and injects optical sheet 310 parts, and exiting surface 310b then is that light penetrates part from optical sheet 310.And the surface (for example be bottom surface 310c and other side surface) of optical sheet 310 except incidence surface 310a and exiting surface 310b can be designed to reflecting surface, and then improves the light extraction efficiency of optical sheet 310.The material of optical sheet 310 can be the transparent polymer material, for example poly-methyl propionyl acid methyl esters class (PMMA), polycarbonate-based (PC), polystyrene type, perfluorinated resin class, epoxy resin or other suitable material.
Light-emitting component 320 is arranged on the circuit board 330.In the present embodiment, have circuit design on the circuit board 330, the light-emitting component 320 that therefore is arranged on the circuit board 330 just can electrically connect with external circuit or power supply by the circuit on the circuit board 330.In addition, in the present embodiment, light-emitting component 320 for example is to describe explanation with light emitting diode.Particularly, the light-emitting component 320 of present embodiment as shown in Figure 4.Please refer to Fig. 4, light-emitting component 320 comprises storage tank 322, light-emitting diode chip for backlight unit 324 and optical cement 326.Light-emitting diode chip for backlight unit 324 is positioned at storage tank 322, and optical cement 326 fills up storage tank 322 and covering luminousing diode chip 324 impacts light-emitting diode chip for backlight unit 324 to intercept aqueous vapor or other external force.Optical cement 326 for example comprises poly-methyl propionyl acid methyl esters class (PMMA), polycarbonate-based (PC), polystyrene type, perfluorinated resin class, epoxy resin or other suitable material.
What deserves to be mentioned is, please refer to Fig. 3 A and Fig. 3 B, the light-emitting component 320 that is arranged on the circuit board 330 is the incidence surface 310a that regard to optical sheet 310, so the incidence surface 310a that the light that sent of light-emitting component 320 can direct directive optical sheet 310.Particularly, light-emitting component 320 is to utilize at least one magnetic absorption member 340 on one of them at least be arranged at optical sheet 310 and circuit board 330 and be magneted on the optical sheet 310.
In detail, in the light-emitting device 300 of present embodiment, on the incidence surface 310a of optical sheet 310, magnetic absorption member 340 can be set, and on opposed circuit boards 330, then be provided with at least one by magnetic absorption member 350, by Fig. 3 B as can be known, this moment, magnetic absorption member 340 was the incidence surface 310a that protrude in optical sheet 310.In other embodiments, magnetic absorption member 340 is better to embed among the incidence surface 310a of optical sheet 310, at this moment, the surperficial 340a of magnetic absorption member 340 can trim in the incidence surface 310a of optical sheet 310 or in sink among the incidence surface 310a of optical sheet 310 requisite space when saving assembling.When circuit board 330 and optical sheet 310 are assembled, as shown in Figure 2, since by the surperficial 340a of the surperficial 350a of magnetic absorption member 350 and magnetic absorption member 340 can because of magnetic attraction mutually near, and then the incidence surface 310a that makes light-emitting component 320 on the circuit board 330 and optical sheet 310 mutually near.At this moment, Yi Bufen circuit board 330 can be fitted in the bottom surface 310c of optical sheet 310.
In this embodiment, be on circuit board, to be provided with, and on optical sheet, magnetic absorption member be set by magnetic absorption member.Yet, in other embodiments, also magnetic absorption member can be set on circuit board, and on optical sheet, be provided with by magnetic absorption member.For example, magnetic absorption member with can be the magnetizable metal-adsorbed metal of metal that can be magnetized by the combination of magnetic absorption member, or magnetic absorption member and be all magnetizable metal by magnetic absorption member.Magnetizable metal for example is a magnet, in addition, also can be and form soft magnet with magnet and mixed with polymers, to form above-mentioned magnetic absorption member.
In addition, the present invention do not limit magnetic absorption member 340 with by the quantity of magnetic absorption member 350.In fact, magnetic absorption member 340 with can be provided with by magnetic absorption member 350 one group, two groups or more than.The present invention does not also limit magnetic absorption member 340 and by the position of magnetic absorption member 350, it also can only be arranged on Liang Chu, three places or the above position of LGP 310 and circuit board 330.
Because above-mentioned light-emitting device 300 is to utilize magnetic absorption member 340 to carry out the location assembling of light-emitting component 320 and optical sheet 310, the assembling contraposition that it is hereby ensured light-emitting component 320 and optical sheet 310 precisely and really near and do not produce light leak.In addition, can not finish the assembling contraposition, therefore can lower the risk of light-emitting component 320 damages owing to do not need earlier optical sheet 310 to be pressed light-emitting component 320.
In addition, in other embodiments, the light-emitting device 300 of backlight module 200 can also use the light-emitting device of different designs to be replaced, and below will be illustrated for several embodiment.
Fig. 5 A is the schematic side view before light-emitting device 400 assemblings of another preferred embodiment of the present invention.Fig. 5 B is the schematic side view after light-emitting device 400 assemblings.Please refer to Fig. 5 A and Fig. 5 B, light-emitting device 400 has the member similar to the described light-emitting device of Fig. 3 A and Fig. 3 B 300, and therefore same or analogous member is represented with identical Reference numeral, and can be corresponding to previous explanation, in this and repeat no more.Light-emitting device 400 is that with the difference of light-emitting device 300 circuit board 330 of light-emitting device 400 is the incidence surface 310a configurations in the face of optical sheet 310.And be arranged at being attracted each other by magnetic absorption member 350 and magnetic absorption member 340 on the optical sheet 310 and make light-emitting component 320 be able to incidence surface 310a on the circuit board 330 near optical sheet 310.
Fig. 6 A is the light-emitting device 500 assemblings schematic diagram before of the another preferred embodiment according to the present invention.Fig. 6 B be after light-emitting device 500 assembling on look schematic diagram.Fig. 6 C is the schematic side view after light-emitting device 500 assemblings.Please refer to Fig. 6 A, Fig. 6 B and Fig. 6 C, the light-emitting device 300 identical members of light-emitting device 500 and Fig. 3 A and Fig. 3 B are represented with identical Reference numeral, and can be repeated no more in this with reference to previous explanation.Light-emitting device 500 is that with light-emitting device 300 differences in light-emitting device 500, optical sheet 510 has a plurality of grooves (not indicating), and optical sheet 510 has incidence surface 510a, exiting surface 510b and bottom surface 510c.In addition, in light-emitting device 500, magnetic absorption member 340 is to be set on the bottom surface 510c of optical sheet 510, and circuit board 330 is adjacent to the part of the bottom surface 510c of optical sheet 510, therefore when on the circuit board 330 by the magnetic absorption member 340 on magnetic absorption member 350 and the optical sheet 510 each other magnetic together after, the circuit board 330 of some can be attached to the bottom surface 510c of optical sheet 510.In other embodiments, magnetic absorption member 340 better embeddings in the optical sheet 510, requisite space when assembling to save.At this moment, by Fig. 6 C as can be known, the side of magnetic absorption member 340 can trim in the incidence surface 510a of optical sheet 510 or in be trapped among the incidence surface 510a of optical sheet 510, or the side of magnetic absorption member 340 can trim in optical sheet 510 bottom surface 510c, or sink into the bottom surface 510c of optical sheet 510 in the side of magnetic absorption member 340.Here be stressed that the present invention does not limit the shape of optical sheet and magnetic absorption member and magnetic absorption member and by the number of magnetic absorption member and position.
It is that example illustrates that light-emitting component 320 in the light-emitting device 300,400 and 500 among each above-mentioned embodiment is with the light emitting diode, but the invention is not restricted to this.In other embodiments of the invention, also can use negative electrode fluorescent tube, outer electrode fluorescent tube or other suitable fluorescent tube light source as the side direction type backlight module, in other words, for adopting magnetic absorption member of the present invention in the side direction type backlight module that uses negative electrode fluorescent tube, outer electrode fluorescent tube or other suitable fluorescent tube and, reaching the purpose of light source and optical sheet contraposition and assembling by the mode of magnetic absorption member.
In addition, the present invention also can be applicable on the backlight module of straight-down negative.
Fig. 7 A is the decomposing schematic representation of the backlight module 600 ' of preferred embodiment of the present invention.Fig. 7 B is the light-emitting device 600 assemblings schematic side view before of Fig. 7 A.Fig. 7 C is the schematic side view after light-emitting device 600 assemblings.Please refer to Fig. 7 A, Fig. 7 B and Fig. 7 C, backlight module 600 ' comprises light-emitting device 600, and preferably, backlight module 600 ' also comprises backboard 610 ', reflecting plate 620 ' and optical sheet set 630 '.Backboard 610 ' be positioned under the reflecting plate 620 ' and in the face of the incidence surface 610a of optical sheet 610 holding light-emitting device 600 and reflecting plate 620 ', and reflecting plate 620 ' is arranged under the light-emitting device 600.Optical sheet set 630 ' is arranged at the top of light-emitting device 600.
Light-emitting device 600 comprises optical sheet 610 and a plurality of light-emitting component 620, shown in Fig. 7 B and Fig. 7 C.Optical sheet 610 comprises incidence surface 610a and exiting surface 610b.Light-emitting component 620 is arranged on the circuit board 630, and light-emitting component 620 regards to the incidence surface 610a of optical sheet 610.In the present embodiment, optical sheet 610 for example is a diffuser plate.
In light-emitting device 600, a plurality of light-emitting components 620 for example can directly use the light emitting diode mixed light of white light emitting diode or multiple different color light to produce white light.In detail, when light-emitting component 620 uses the light emitting diode of multiple different color light, can have a gap d between light-emitting component 620 and the optical sheet 610 to carry out mixed light, this gap d can be by adjusting magnetic absorption member 640 and being reached desirable light mixing distance by the thickness of magnetic absorption member 650.The light-emitting component 620 of present embodiment can also adopt light emitting diode construction as shown in Figure 4.
Please continue with reference to figure 7B and Fig. 7 C, particularly, respectively dispose a magnetic absorption member 640, and respectively dispose one by magnetic absorption member 650 in four positions of circuit board 630 corresponding to magnetic absorption member 640 in four corners of optical sheet 610.Optical sheet 610 and a plurality of light-emitting component 620 can by magnetic absorption member 640 and by the magnetic of magnetic absorption member 650 and near.In other embodiment, in order to allow optical sheet 610 and light-emitting component 620 more near, the magnetic absorption member 640 on the optical sheet 610 or can be changed then by the number of magnetic absorption member 650 and position thereof.For example: between four corners of circuit board 630, add at least one magnetic absorption member 640 again or by magnetic absorption member 650, or add at least one magnetic absorption member 640 again or by magnetic absorption member 650, or on the correct position of circuit board 630, add at least one magnetic absorption member 640 again or by magnetic absorption member 650 in the middle section of circuit board 630.
In the present embodiment, the circuit board 630 of light-emitting device 600 is a continuous flat board.And in other embodiments, circuit board is arranged by a plurality of strip circuit boards to form, and be provided with a magnetic absorption member on each strip circuit board at least or by magnetic absorption member, at this moment, correspond to the magnetic absorption member of each strip circuit board on the optical sheet 610 or by magnetic absorption member, at least one group of magnetic absorption member also can be set or by magnetic absorption member.In addition, please no longer be repeated in this with reference to the explanation of above-mentioned Fig. 4～Fig. 6 by the relevant design of magnetic absorption member and magnetic absorption member.
In the above-described embodiment, carry out the location assembling of optical sheet and light-emitting component owing to all use the mode of magnetic absorption, therefore do not have viscose in the prior art and stick the problem that area deficiency or location are difficult for, and backlight module of the present invention all can precisely be located assembling.
In addition, light-emitting device 600 of the present invention in other embodiments, also can use negative electrode fluorescent tube, outer electrode fluorescent tube or other suitable fluorescent tube as light source except using light emitting diode as the light source.
Above-mentioned several embodiment is with magnetic absorption member and is designed on circuit board and optical sheet by magnetic absorption member, so, the invention is not restricted to this.In other embodiment of the present invention, also can design on other member, with magnetic absorption member and by magnetic absorption member as the explanation of following embodiment.
Fig. 8 A is the schematic side view before backlight module 700 assemblings of preferred embodiment of the present invention.Fig. 8 B is the schematic side view after backlight module 700 assemblings.Please refer to Fig. 8 A and Fig. 8 B, backlight module 700 comprises optical sheet 710, backboard 720, at least one fluorescent tube 730 and a plurality of fluorescent-tube fixer 740.
Fluorescent-tube fixer 740 is coated on the end 732 of fluorescent tube 730 respectively, and optical sheet 710 is arranged on the fluorescent-tube fixer 740.Particularly, each fluorescent-tube fixer 740 electrode E1 of including elastic body 742, being embedded in the magnetic absorption member 744 in the elastic body 742 and being embedded in the elastic body 742 and electrically connecting with the end 732 of fluorescent tube 730.The magnetic absorption member 744 that is embedded in a plurality of fluorescent-tube fixers 740 is magneted on the incidence surface 710a of optical sheet 710.
Here be noted that in backlight module 700 the incidence surface 710a of optical sheet 710 goes up and to be provided with another by magnetic absorption member 750 with respect to magnetic absorption member 744 parts so that fluorescent-tube fixer 740 and optical sheet 710 near and make fluorescent tube 730 location.At this moment, by Fig. 8 B as can be known, are the incidence surface 710a that protrude in optical sheet 710 by magnetic absorption member 750.In other embodiments, in the better incidence surface 710a that embeds optical sheet 710 of magnetic absorption member 750, so that by the lower surface of magnetic absorption member 750 trim in the incidence surface 710a of optical sheet 710 or in sink among the incidence surface 710a of optical sheet 710 requisite space when saving assembling.In addition, in other embodiments, the upper surface of magnetic absorption member 744 also can protrude in the surface of elastic body 742, and promptly the upper surface of magnetic absorption member 744 is higher than the upper surface of elastic body 742.In other embodiment, magnetic absorption member 744 with can be by the position of magnetic absorption member 750 and its material with reference to the explanation of above-mentioned Fig. 4～Fig. 6.In addition, the position corresponding to electrode E1 on backboard 720 also is provided with electrode E2, and electrode E2 can electrically connect the electrode E1 that makes external power source signal energy conducting fluorescent tube 730 with electrode E1, and then makes fluorescent tube 730 luminous.In addition, fluorescent-tube fixer 740 the elastic body that uses 742 for example be elastomeric material.
In addition, by magnetic absorption member 744 and by the design of the height of magnetic absorption member 750, can control the distance between fluorescent tube 730 and the optical sheet 710, to reach the purpose that desired light evenly penetrates optical sheet 710.
In the present embodiment and since backlight module 700 be by magnetic absorption member 744 with by the magnetic of magnetic absorption member 750 so that fluorescent tube 730 and optical sheet 710 location, so optical sheet 710 is simple and precisely, optical sheet 710 is difficult for displacement with the location of fluorescent tube 730.When needing rework, only need overcome magnetic absorption member 744 and optical sheet 710 can be separated with fluorescent tube 730 by the magnetic force between the magnetic absorption member 744 to finish the heavy industry program when fluorescent tube 730 or other component failures, again that backlight module 700 assemblings are also quite convenient.
Fig. 9 A is the schematic side view before the backlight module 700 ' assembling of another preferred embodiment of the present invention.Fig. 9 B is the schematic side view after the backlight module 700 ' assembling.Please refer to Fig. 9 A and Fig. 9 B, backlight module 700 ' has the member similar to the described backlight module of Fig. 8 A and Fig. 8 B 700, and therefore same or analogous member is represented with identical Reference numeral, sees also above-mentioned explanation, repeats no more in this.Backlight module 700 ' is with the difference of backlight module 700, and the backboard 720 ' of backlight module 700 ' is by can being constituted by the metal of magnetic absorption member 744 magnetic, and the position of magnetic absorption member 744 near backboard 720 ' with backboard 720 ' magnetic.In backlight module 700 ', because only need overcome magnetic absorption member 744 can separate fluorescent tube 730 with magnetic force between backboard 720 ' with backboard 720 ', when carrying out the assembling of backlight module 700 ' once more, only need electrode E1 do not needed to weld again with electrode E2 contraposition so that electrode E1 and electrode E2 electric connection, so the assembling of backlight module 700 ' is quite easy.
Figure 10 A is the backlight module 700 of the another preferred embodiment of the present invention " assembling schematic side view before.Figure 10 B is a backlight module 700 " assembling after schematic side view.Please refer to Figure 10 A and Figure 10 B, backlight module 700 ' has the member similar to the described backlight module of Fig. 9 A and Fig. 9 B 700 ', and therefore same or analogous member is represented with identical Reference numeral, please refer to above-mentioned explanation, repeats no more in this.Backlight module 700 " be with the difference of backlight module 700 '; backlight module 700 " backboard 720 " do not have magnetic and can't with magnetic absorption member 744 magnetic; at this moment, can be by at backboard 720 " on respect to magnetic absorption member 744 parts be provided with another by magnetic absorption member 750 so that fluorescent tube 730 is positioned backboard 720 " on.
In addition, in other embodiments of the invention, also the embodiment of Fig. 8 B and the embodiment of Fig. 9 or Figure 10 B can be made up, just be arranged at simultaneously on optical sheet 710, backboard 720 and the fluorescent-tube fixer 740, so that optical sheet 710, backboard 720 and fluorescent tube 730 all use the magnetic mode to fix with magnetic absorption member 744 or by magnetic absorption member 750.In other embodiment, magnetic absorption member 744 with can be by the position of magnetic absorption member 750 and its material with reference to the explanation of Fig. 4～Fig. 6.
Therefore, by all above-mentioned embodiment magnetic absorption member or by the position of magnetic absorption member and number as can be known, can exchange mutually, or magnetic absorption member or can be come across simultaneously on the object by magnetic absorption member, for example: on the optical sheet, or on the backboard, or on the circuit board or on the fluorescent-tube fixer.
Figure 11 is display module 800 schematic diagrames of preferred embodiment of the present invention.Please refer to Figure 11, for instance, display unit 800 can have display floater 810 and backlight module 820, and backlight module 820 for example can have wherein any or backlight module 700,700 ' and 700 of above-mentioned light-emitting device 300,400,500,600 " wherein any.
Display floater 810 can be semi-penetrating and semi-reflecting type display panel, reflective display panel, colored filter display floater of (color filter on array) on active layers, active layers display floater of (array on color filter) on colored filter, vertical orientation type (VA) display floater, horizontal switch type (IPS) display floater, multi-domain perpendicular alignment-type (MVA) display floater, twisted nematic (TN) display floater, super-twist nematic (STN) display floater, pattern vertical orientation type (PVA) display floater, super pattern vertical orientation type (S-PVA) display floater, the advanced person is type (ASV) display floater with great visual angle, fringe field switch type (FFS) display floater, continuous fireworks shape arrange type (CPA) display floater, axial symmetry is arranged micella type (ASM) display floater, optical compensation curved arrange type (OCB) display floater, super horizontal switch type (S-IPS) display floater, advanced super horizontal switch type (AS-IPS) display floater, extreme edge electric field switch type (UFFS) display floater, blue phase display floater (Blue phasedisplay panel), stabilizing polymer alignment-type display floater, double vision angle type (dual-view) display floater, the electrophoretype display floater, blue phase display floater (Blue Phase), three visual angle type (triple-view) display floaters, 3 d display (three-dimensional) or other profile plate.
Figure 12 is the schematic diagram of the electrooptical device of preferred embodiment of the present invention.The display module 800 of Figure 11 can be combined into an electrooptical device 950 with electronic component 900 electrical connections.Electronic component 900 comprises as control element, executive component, treatment element, input element, memory element, driving element, light-emitting component, protecting component, sensing element, detecting element or other function element or aforesaid combination.And the type of electrooptical device 320 comprises the panel in portable product (as mobile phone, video camera, camera, mobile computer, game machine, wrist-watch, music player, electronic mail transceiver, map navigator, digital photo or similar products like), video and audio product (as audio-visual projector or similar products like), screen, TV, billboard, the projector etc.
In sum, because backlight module proposed by the invention is to use magnetic absorption member to assemble, therefore can improve the assembling positioning accuracy, lower risk that light source damages, and can save built-up time.In addition, because electrooptical device proposed by the invention has above-mentioned backlight module, therefore can simplify assembling and heavy industry program to reduce manufacturing cost.
Though the present invention discloses as above with embodiment; yet it is not in order to limit the present invention; the personnel that have common knowledge in the technical field under any; under the situation that does not break away from the spirit and scope of the present invention; can do a little change and retouching, so protection scope of the present invention is when being as the criterion with the scope that appending claims was defined.
Claims (14)
1. a backlight module comprises a light-emitting device, and this light-emitting device comprises:
One optical sheet, it comprises an incidence surface and an exiting surface;
At least one light-emitting component is arranged on the circuit board, and this light-emitting component regards to this incidence surface, and wherein this light-emitting component is to utilize at least one magnetic absorption member on one of them at least that is arranged at this optical sheet and this circuit board and be magneted on this optical sheet.
2. backlight module as claimed in claim 1, wherein this magnetic absorption member is arranged on the part of this incidence surface.
3. backlight module as claimed in claim 2, wherein this circuit board is in the face of this incidence surface.
4. backlight module as claimed in claim 1, wherein this optical sheet also comprises a bottom surface, and this magnetic absorption member is arranged on this bottom surface, and this circuit board is adjacent to the part of this bottom surface.
5. backlight module as claimed in claim 4, wherein this backlight module also comprises a reflecting plate, and this reflecting plate is arranged under this optical sheet.
6. backlight module as claimed in claim 1, wherein this backlight module also comprises:
One optical sheet set is arranged on this exiting surface.
7. backlight module as claimed in claim 1, wherein this backlight module also comprises a backboard, and this backboard is in the face of this incidence surface, to hold this optical sheet.
8. backlight module as claimed in claim 1, wherein this light-emitting component comprises:
One storage tank;
One light-emitting diode chip for backlight unit is positioned at this storage tank;
One optical cement fills up this storage tank, and covers this light-emitting diode chip for backlight unit.
9. backlight module comprises:
One optical sheet, it comprises an incidence surface and an exiting surface;
One backboard is positioned at the below of the incidence surface of this optical sheet;
At least one fluorescent tube is arranged between the incidence surface of this backboard and this optical sheet; And
A plurality of fluorescent-tube fixers, be coated on the end of this fluorescent tube respectively, and this optical sheet is arranged on this fluorescent-tube fixer, each fluorescent-tube fixer electrode of comprising an elastic body, being embedded in the magnetic absorption member in this elastic body and being embedded in this elastic body and electrically connecting with the end of this fluorescent tube wherein, this magnetic absorption member that wherein is embedded in the described fluorescent-tube fixer is magneted on this incidence surface of this backboard or this optical sheet.
10. backlight module as claimed in claim 9 wherein is provided with another magnetic absorption member with respect to this magnetic absorption member part on this incidence surface of this optical sheet.
11. backlight module as claimed in claim 9, wherein this backboard is provided with another magnetic absorption member with respect to this magnetic absorption member part.
12. backlight module as claimed in claim 9, wherein this backboard is by being constituted by the metal of this magnetic absorption member magnetic.
13. backlight module as claimed in claim 9, wherein this elastic body is an elastomeric material.
14. an electrooptical device, it comprises as claim 1,9 each described backlight modules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101330845A CN101509625B (en) | 2009-04-07 | 2009-04-07 | Backlight module and optoelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101330845A CN101509625B (en) | 2009-04-07 | 2009-04-07 | Backlight module and optoelectronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101509625A true CN101509625A (en) | 2009-08-19 |
| CN101509625B CN101509625B (en) | 2011-02-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101330845A Active CN101509625B (en) | 2009-04-07 | 2009-04-07 | Backlight module and optoelectronic device |
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| CN (1) | CN101509625B (en) |
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| CN102635813A (en) * | 2011-12-30 | 2012-08-15 | 友达光电股份有限公司 | Backlight module and method for manufacturing circuit board with alignment patterns |
| WO2013078698A1 (en) * | 2011-11-29 | 2013-06-06 | 深圳市华星光电技术有限公司 | Printed circuit board and liquid crystal display module |
| WO2013078784A1 (en) * | 2011-11-29 | 2013-06-06 | 深圳市华星光电技术有限公司 | Display, liquid crystal module and fixing structure |
| CN103851414A (en) * | 2012-12-04 | 2014-06-11 | 深鑫成光电（深圳）有限公司 | Backlight module |
| US8928834B2 (en) | 2011-11-29 | 2015-01-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Printed circuit board and liquid crystal display module |
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| CN113109967A (en) * | 2020-01-09 | 2021-07-13 | 苏州佳世达电通有限公司 | Backlight module and display device |
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| CN1612182A (en) * | 2003-10-30 | 2005-05-04 | 上海中策工贸有限公司 | Planar display casing light source device |
| CN2724038Y (en) * | 2004-08-12 | 2005-09-07 | 瑞轩科技股份有限公司 | Liquid crystal display capable of changing panels |
| CN2826583Y (en) * | 2005-06-30 | 2006-10-11 | 邱汉墙 | Adhesive crystal lamp box |
| CN100451766C (en) * | 2006-12-30 | 2009-01-14 | 友达光电股份有限公司 | Liquid crystal display device and its backlight module |
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| WO2013078698A1 (en) * | 2011-11-29 | 2013-06-06 | 深圳市华星光电技术有限公司 | Printed circuit board and liquid crystal display module |
| WO2013078784A1 (en) * | 2011-11-29 | 2013-06-06 | 深圳市华星光电技术有限公司 | Display, liquid crystal module and fixing structure |
| US8928834B2 (en) | 2011-11-29 | 2015-01-06 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Printed circuit board and liquid crystal display module |
| CN102635813A (en) * | 2011-12-30 | 2012-08-15 | 友达光电股份有限公司 | Backlight module and method for manufacturing circuit board with alignment patterns |
| CN103851414A (en) * | 2012-12-04 | 2014-06-11 | 深鑫成光电（深圳）有限公司 | Backlight module |
| CN103851414B (en) * | 2012-12-04 | 2016-08-03 | 盐城华星光电技术有限公司 | Backlight module |
| CN107940406A (en) * | 2017-12-08 | 2018-04-20 | 欧普照明股份有限公司 | A kind of modular lighting lamps and lanterns and its connector |
| CN113109967A (en) * | 2020-01-09 | 2021-07-13 | 苏州佳世达电通有限公司 | Backlight module and display device |
| WO2023178823A1 (en) * | 2022-03-21 | 2023-09-28 | 瑞仪光电(南京)有限公司 | Backlight module capable of maintaining design angle of folded edge of reflector sheet, and display device |
| CN115407556A (en) * | 2022-08-23 | 2022-11-29 | 惠科股份有限公司 | Backlight module and display device |
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| CN101509625B (en) | 2011-02-09 |
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