CN101499468A - LED device - Google Patents
LED device Download PDFInfo
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- CN101499468A CN101499468A CNA2009100003460A CN200910000346A CN101499468A CN 101499468 A CN101499468 A CN 101499468A CN A2009100003460 A CNA2009100003460 A CN A2009100003460A CN 200910000346 A CN200910000346 A CN 200910000346A CN 101499468 A CN101499468 A CN 101499468A
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- light
- emitting diode
- diode assembly
- luminescence chip
- assembly according
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The invention discloses a light-emitting diode device which includes a substrate with a circuit pattern, a reflective layer arranged on the substrate, at least one light-emitting chip arranged on the reflective layer, a reflector winding the light-emitting chip, a colloid covered on the light-emitting chip, and a phosphor powder layer arranged above the colloid. The light-emitting chip has a conductive part, and the circuit pattern of the substrate is connected with the conductive part. In the embodiment, a plurality of light-emitting chips are arranged in a linear way, moreover, a distance piece is arranged between two adjacent light-emitting chips.
Description
Technical field
The present invention relates to a kind of light-emitting diode assembly, relate in particular to a kind of light-emitting diode assembly that improves the mixed light effect and enlarge the sorting scope of luminescence chip that utilizes.
Background technology
Owing in the luminescence chip manufacturing, exist all variations, make between the luminescence chip of making and on characteristics such as brightness or emission wavelength, can exist a little difference.Utilize luminescence chip as at the beginning of the illumination, in the majority with single application person, the control of brightness or color is less demanding, so the differentia influence between luminescence chip is not obvious.
Yet, a majority luminescence chip is arranged in array when being used, if without assorting room, may cause brightness or irregular colour even on the whole.In order to solve this problem, luminescence chip is classified according to some characterisitic parameters, after test, respectively at giving a classification value (bincodes) on the different qualities parameter.In use, choose the luminescence chip of close classification value, so can avoid luminescence chip to line up array after, the inhomogeneous problem that is caused., the sorting luminescence chip can increase cost expenditure, and, along with the utilization of big lighting area and to the requirement of lighting quality, the limit relatively of the range of choice of classification value, this causes the inconvenience in the use undoubtedly, more causes cost skyrocketing.
In addition; the efficient of fluorescent material can make its efficient reduce because of the rising of ambient temperature; and the luminescence component that belongs to high heat-flux because of luminescence chip; if the radiating module design is not good or environmental condition control is bad; then can have influence on the efficient of fluorescent material; therefore if the influence that will avoid fluorescent material to be heated then needs fluorescent material is done further protection.
Again, with luminescence chip during as the light source of backlight module, using difference with other illumination, to be to allow lighting angle on the direction need bigger, to carry out mixed light; And the while also will be limited the lighting angle on the other direction, makes more incident optical energy enter backlight module, to improve brightness.
Comprehensively described, as to be combined into after sorting luminescence chip array can be guaranteed luminous mass, yet the cost height does not meet economic benefit.Fluorescent material is subjected to Temperature Influence and efficient reduces, yet, still there is not the road of strick precaution in the design of prior art.Moreover the luminescence chip arrayed applications need have different lighting angles in different directions when backlight module, and in the existing skill, does not see corresponding technological development yet.
Summary of the invention
The invention provides a kind of light-emitting diode assembly, it utilizes the means of light diffusion, improves the mixed light effect, strengthens the sorting scope of luminescence chip whereby.
For achieving the above object, a kind of light-emitting diode assembly of one embodiment of the invention substrate, of comprising a tool one circuit pattern is arranged at the phosphor powder layer that reflector layer on this substrate, at least one luminescence chip that is arranged at this reflector layer, colloid and that a reflector around this luminescence chip, is covered in this luminescence chip are arranged at this colloid top and are used for even mixed light.This luminescence chip tool one conductive part, this circuit pattern of this substrate is connected with this conductive part, and this luminescence chip obtains driving power whereby.This reflector comprises one and is positioned at the exiting surface of reflector outlet and is positioned at one first reflecting surface of reflector inner edge.
And, for achieving the above object, a kind of light-emitting diode assembly of another embodiment of the present invention substrate, of comprising a tool one circuit pattern is arranged at reflector layer on this substrate, at least one luminescence chip that is arranged at this reflector layer, one around the reflector of this luminescence chip and a tool one surface and be covered in the fluorescent colloid of this luminescence chip.This luminescence chip tool one conductive part, this circuit pattern of this substrate is connected with this conductive part, and this luminescence chip obtains driving power whereby.This reflector comprises one and is positioned at the exiting surface of reflector outlet and is positioned at one first reflecting surface of reflector inner edge.This fluorescent colloid is that fluorescent material and silica gel are mixed and made into.
Adopt light-emitting diode assembly of the present invention, can improve the mixed light effect, the sorting scope that strengthens luminescence chip whereby in addition, utilizes colloid that phosphor powder layer is separated in addition, makes its more unwarmed influence, and can keep certain efficient.Again, utilize light diffusion and light harvesting means in different directions, make light-emitting diode assembly have different lighting angles in different directions.
Description of drawings
Fig. 1 shows that the present invention first implements the vertical view of the light-emitting diode assembly of example;
Fig. 2 is the profile of Fig. 1 along X1-X ' 1 hatching;
Fig. 3 shows that the present invention second implements the cutaway view of the light-emitting diode assembly of example;
Fig. 4 shows that the present invention the 3rd implements the cutaway view of the light-emitting diode assembly of example;
Fig. 5 shows that the present invention the 4th implements the cutaway view of the light-emitting diode assembly of example;
Fig. 6 shows that the present invention the 5th implements the cutaway view of the light-emitting diode assembly of example;
Fig. 7 shows that the present invention the 6th implements the cutaway view of the light-emitting diode assembly of example;
Fig. 8 shows that the present invention the 7th implements the vertical view of the light-emitting diode assembly of example;
Fig. 9 shows that the present invention the 8th implements the schematic perspective view of the light-emitting diode assembly of example;
Figure 10 is the profile of Fig. 9 along X2-X ' 2 hatchings;
Figure 11 shows that the present invention the 9th implements the schematic perspective view of the light-emitting diode assembly of example;
Figure 12 shows that the present invention the tenth implements the vertical view of the light-emitting diode assembly of example;
Figure 13 shows that the present invention the 11 implements the vertical view of the light-emitting diode assembly of example; And
Figure 14 shows that the present invention the 12 implements the vertical view of the light-emitting diode assembly of example.
Wherein, Reference numeral:
100: light-emitting diode assembly
102a, 102b: substrate
104: circuit pattern 106: reflector layer
108: luminescence chip 110: reflector
112a, 112b, 112c, 112d, 112e: colloid
114: phosphor powder layer 116: exiting surface
Reflecting surface 120 in 118: the first: through hole
122: microstructure optical membrane 124: gap
300,400,500: light-emitting diode assembly
502: surface 109: conductive part
600,700,800,900: light-emitting diode assembly
902: 904: the second reflectings surface of distance piece
1002: the surface
1100: light-emitting diode assembly 1102: the lamp bar
1200,1300: light-emitting diode assembly
1302: 1304: the second reflectings surface of distance piece
1400: light-emitting diode assembly 1402: distance piece
1404: the second reflectings surface
Embodiment
Fig. 1 shows that the present invention first implements the vertical view of the light-emitting diode assembly 100 of example.Fig. 2 is the profile of Fig. 1 along X1-X ' 1 hatching.The substrate 102a, one that light-emitting diode assembly 100 comprises a tool one circuit pattern 104 is arranged at the phosphor powder layer 114 that reflector layer 106 on the substrate 102a, at least one luminescence chip 108 that is arranged at this reflector layer 106, colloid 112a and that a reflector 110, around this luminescence chip 108 is covered in luminescence chip 108 are arranged at this colloid 112a top and are used for even mixed light.Luminescence chip 108 tools one conductive part 109, the circuit pattern 104 of substrate 102a is connected with this conductive part, whereby to provide luminescence chip 108 driving powers.
This reflector 110 comprises one and is positioned at the exiting surface 116 of reflector outlet and is positioned at one first reflecting surface 118 of reflector inner edge.First reflecting surface 118 is an inclined plane, utilizes first reflecting surface 118 can make the lateral light of luminescence chip 108 toward exiting surface 116 reflections.Reflector 110 is arranged on the reflector layer 106, so this non-be necessary, it also can be arranged on the substrate 102a.In present embodiment, the angle θ between this first reflecting surface 118 and substrate 102a
1Comprise between 30 ° to 80 °.The luminous ability of reflector 110 tools reflection luminescence chip 108 is so its material is a reflecting material.The material of reflector 110 can comprise metal material or non-metallic material.Metal material can comprise as composition metal of titanium, gold, aluminium, silver, platinum, palladium or aforementioned metal etc.Non-metallic material is optional from polyphthalamide, pottery, Merlon.Non-metallic material also can be the macromolecular material of the material of doping tool reflecting effect, and wherein the material of this doping comprises the nonmetallic materials or the metal material of tool reflecting effect.
At least one through hole 120 of reflector layer 106 tools, circuit pattern 104 connect the conductive part 109 of luminescence chip 108 via through hole 120.The contact that is connected with external power source is set in the circuit pattern 104, makes external power source provide luminescence chip 108 driving powers by circuit pattern 104.Reflector layer 106 tool high reflectances, it can be a metal reflective layer, and the material of metal reflective layer can comprise the composition metal of titanium, gold, aluminium, silver, platinum, palladium or aforementioned metal; The material of reflector layer 106 also can be inorganic material, comprises titanium dioxide (titaniumdioxide), aluminium oxide (aluminum oxide), zinc oxide (zinc oxide), zinc sulphide (zincsulfide), barium sulfate (barium sulfate), antimony oxide (antimony oxide), magnesium oxide (magnesium oxide), magnesium fluoride (magnesium fluoride), calcium carbonate (calciumcarbonate), boron nitride (boron nitride) or above-mentioned combination.
In the present embodiment, phosphor powder layer 114 is arranged on the colloid 112a surface, and is contained in the reflector 110.Compared to existing skill, because colloid 112a isolates phosphor powder layer 114 with substrate 102a, the heating of luminescence chip 108 is difficult for having influence on phosphor powder layer 114, and makes it can keep a stable luminous efficiency.The formation of phosphor powder layer 114 can be mixing of fluorescent material and silica gel or mixing for fluorescent material and epoxy resin.
The exiting surface 116 of reflector 110 can be provided with at least one microstructure optical membrane 122, and 114 of microstructure optical membrane 122 and phosphor powder layers can be had a gap 124 (as shown in Figure 2), perhaps are gapless driving fit shape between the two.Microstructure optical membrane 122 be provided for providing combined optical effects such as light harvesting and diffusion, the blooming that it can the single optical effect of most tools is formed, or is the single blooming of combined optical effects such as tool light harvesting and diffusion.
Colloid 112a comprises silica gel and epoxy resin, and can set the light diffusion particle among the colloid 112a, and the light that passes through can evenly be spread.Generally speaking, if use the less light diffusion particle of particle diameter, the weight ratio of the light diffusion particle of sneaking into needs higher, so just can have a mixed light effect preferably.In this case embodiment, can set weight ratio among the colloid 112a and be 0.1% to 20% light diffusion particle.Preferably, when the use particle diameter was 1 to 30 micron light diffusion particle, the weight ratio of sneaking into was 0.2% to 10%.
The material of substrate 102a can be selected from the flame resistance lamination sheet material fourth stage material (FR4) of glass, pottery, bakelite, epoxy resin, PETG, pi, hydrocyanic ester, bismaleimide/three nitrogen traps, glass fibre and glass fibre flame resistance lamination sheet material level V material (FR5) institute cohort group wherein one.
Fig. 3 shows that the present invention second implements the cutaway view of the light-emitting diode assembly 300 of example.The substrate 102a, one that light-emitting diode assembly 300 comprises a tool one circuit pattern 104 is arranged at the reflector layer 106 on this substrate 102a, at least one luminescence chip 108 of this reflector layer 106, colloid 112a that a reflector 110 and around this luminescence chip 108 is covered in luminescence chip 108 of being arranged at.Reflector 110 comprises one and is positioned at the exiting surface 116 that reflector exports, and at least one microstructure optical membrane 122 is arranged at exiting surface 116.One phosphor powder layer 114 is coated on the microstructure optical membrane 122, and is arranged at 116 of microstructure optical membrane 122 and exiting surfaces, so as to promoting even mixed light.Because phosphor powder layer 114 away from substrate 102a, makes its warming-up effect that is not subject to luminescence chip 108, and can keep a stable luminous efficiency.In present embodiment, 114 of colloid 112a and phosphor powder layers are retained a gap 124.In other embodiment, but 114 also driving fit attachings of colloid 112a and phosphor powder layer.Can set the light diffusion particle among the colloid 112a, the light that passes through can evenly be spread.
Fig. 4 shows that the present invention the 3rd implements the cutaway view of the light-emitting diode assembly 400 of example.The substrate 102a, one that light-emitting diode assembly 400 comprises a tool one circuit pattern 104 is arranged at the reflector layer 106 on this substrate 102a, at least one luminescence chip 108 of this reflector layer 106, colloid 112b that a reflector 110 and around luminescence chip 108 is covered in luminescence chip 108 of being arranged at, and wherein sneaks into fluorescent material among the colloid 112b.Can set the light diffusion particle in addition among the colloid 112b, the light that passes through can be spread more equably.Reflector 110 comprises one and is positioned at the exiting surface 116 that reflector exports, and at least one microstructure optical membrane 122 is arranged at this exiting surface 116.In present embodiment, 122 of colloid 112b and microstructure optical membranes are retained a gap 124.In other embodiment, but 122 also driving fit attachings of colloid 112b and microstructure optical membrane.
Fig. 5 shows that the present invention the 4th implements the cutaway view of the light-emitting diode assembly 500 of example.The substrate 102a, one that light-emitting diode assembly 500 comprises a tool one circuit pattern 104 is arranged at the reflector layer 106 on this substrate 102a, at least one luminescence chip 108 of reflector layer 106, colloid 112c that a reflector 110 and around this luminescence chip 108 is covered in this luminescence chip 108 of being arranged at, wherein sneak into fluorescent material among the colloid 112c, and the surperficial 502 tool micro optical structures of colloid 112c.Micro optical structure comprises prism and lenticule.Can set the light diffusion particle in addition among the colloid 112c, the light that passes through can evenly be spread.Reflector 110 comprises one and is positioned at the exiting surface 116 that reflector exports, and at least one microstructure optical membrane 122 is arranged at exiting surface 116.
Fig. 6 shows that the present invention the 5th implements the cutaway view of the light-emitting diode assembly 600 of example.The substrate 102a, one that light-emitting diode assembly 600 comprises a tool one circuit pattern 104 is arranged at luminescence chip 108 on the substrate 102a, around luminescence chip 108 and be arranged at the bottom that reflector 110, on the substrate 102a is arranged at reflector 110, be covered in the colloid 112d of luminescence chip 108 between the reflector layer 106 and of 108 of substrate 102a and luminescence chips, wherein sneak into fluorescent material among the colloid 112d, and when making, make it form the lens of a tool curved surface.Can set the light diffusion particle in addition among the colloid 112d, the light that passes through can be spread more equably.Reflector 110 comprises one and is positioned at the exiting surface 116 that reflector exports, and at least one microstructure optical membrane 122 is arranged at exiting surface 116.
Fig. 7 shows that the present invention the 6th implements the cutaway view of the light-emitting diode assembly 700 of example.The substrate 102a, one that light-emitting diode assembly 700 comprises a tool one circuit pattern 104 is arranged at luminescence chip 108 on the substrate 102a, around luminescence chip 108 and be arranged at the bottom that reflector 110, on the substrate 102a is arranged at reflector 110, be covered in the colloid 112e of this luminescence chip 108 between the reflector layer 106 and of 108 of substrate 102a and luminescence chips, wherein sneak into fluorescent material among this colloid 112e, and when making, make it form the lens shape of a surperficial tool micro optical structure.This micro optical structure can comprise prism and lenticule.Can set the light diffusion particle in addition among the colloid 112e, the light that passes through can be spread more equably.This reflector 110 comprises one and is positioned at the exiting surface 116 that reflector exports, and at least one microstructure optical membrane 122 is arranged on the exiting surface 116.
Fig. 8 shows that the present invention the 7th implements the vertical view of the light-emitting diode assembly 800 of example.Light-emitting diode assembly 800 comprises most the luminescence chips 108 that are arranged in single row or column and is contained in the reflector 110, makes light-emitting diode assembly 800 form a linear light sorurce.The colloid (embodiment is contained as described above) that covers these luminescence chips 108 can be imposed in the reflector 110, the light diffusion particle can be comprised in the colloid.Among one embodiment, sneak into fluorescent material in the colloid; And among another embodiment, on colloid, impose a phosphor powder layer.
Fig. 9 shows that the present invention the 8th implements the vertical view of the light-emitting diode assembly 900 of example.Figure 10 is the profile of Fig. 9 along X2-X ' 2 hatchings.Light-emitting diode assembly 900 comprise most linear array in single file or the luminescence chip 108 of row be contained in the reflector 110, make light-emitting diode assembly 900 form a linear light sorurce.The side of reflector 110 adjacent luminescence chips 108 forms first reflecting surface 118.Two 108 adjacent of these luminescence chips are provided with a distance piece 902, and this distance piece 902 has one second reflecting surface 904, utilize second reflecting surface 904 each luminescence chip 108 other light of penetrating can be reflexed to exiting surface 116.The height l of distance piece 902
2Can be less than the height l of reflector 110
1Second reflecting surface 904 of distance piece 902 also is an inclination angle, the angle theta between itself and substrate 102b
2Can be different from first reflecting surface 118 of reflector 110 and the angle theta between substrate 102b
1In present embodiment, the angle θ between this first reflecting surface 118 and this substrate 102b
1Comprise 30 ° to 80 °, and the angle θ between this second reflecting surface 904 and this substrate 102b
2Comprise 15 ° to 80 °.Distance piece 902 can be integral production with reflector 110, and the luminous ability of reflector 110 and distance piece 902 tools reflection luminescence chip 108 is so both materials are a reflecting material.Reflector 110 can comprise metal material or non-metallic material with the material of distance piece 902.Metal material can comprise as composition metal of titanium, gold, aluminium, silver, platinum, palladium or aforementioned metal etc.Non-metallic material is optional from polyphthalamide, pottery, Merlon.Non-metallic material also can be the macromolecular material of the material of doping tool reflecting effect, and wherein the material of this doping comprises the nonmetallic materials or the metal material of tool reflecting effect.
Colloid 112 can comprise a surface 1002, a micro optical structure can be had in this surface 1002, utilize this micro optical structure can make the luminous of luminescence chip 108, on the long side direction of light-emitting diode assembly 900, spread, and on the short side direction of light-emitting diode assembly 900 light harvesting.
At least one microstructure optical membrane 122 also can be set on the exiting surface 116, it can be the blooming piece of combined optical effects such as tool light harvesting and diffusion, utilize microstructure optical membrane 122 also can reach on the long side direction of light-emitting diode assembly 900 and spread, and on the short side direction of light-emitting diode assembly 900 effect of light harvesting.
Figure 11 shows that the present invention the 9th implements the schematic perspective view of the light-emitting diode assembly 1100 of example.Light-emitting diode assembly 1100 can be most bar lamp bars 1102 and combines a planar emission apparatus.Each lamp bar 1102 comprise most linear array in single file or the luminescence chip 108 of row be arranged at substrate 102b and be contained in the reflector 110 (structures shown in embodiment eight or nine).Colloid can be covered on each luminescence chip, the light diffusion particle can be comprised in the colloid.At least one microstructure optical membrane 122 is set on the exiting surface of reflector 110.Among one embodiment, sneak into fluorescent material in the colloid; Among another embodiment, on colloid, impose a phosphor powder layer; Among the another embodiment, phosphor powder layer is arranged at 116 of the exiting surfaces of microstructure optical membrane 122 and reflector 110.
Figure 12 shows that the present invention the tenth implements the vertical view of the light-emitting diode assembly 1200 of example.The luminescence chip 108 that light-emitting diode assembly 1200 comprises most arrayed is contained in the reflector 110, makes light-emitting diode assembly 1200 form a planar light source, and wherein row can be identical or different with luminescence chip 108 arrangement pitches in the row.
Figure 13 shows that the present invention the 11 implements the vertical view of the light-emitting diode assembly 1300 of example.The luminescence chip 108 that light-emitting diode assembly 1300 comprises most arrayed is contained in and comprises in the reflector 110 of first reflecting surface as sidewall, and 108 of those luminescence chips of wherein adjacent two column or row are provided with a distance piece 1302 of tool second reflecting surface 1304.
Figure 14 shows that the present invention the 12 implements the vertical view of the light-emitting diode assembly 1400 of example.The luminescence chip 108 that light-emitting diode assembly 1400 comprises most arrayed is contained in and comprises in the reflector 110 of first reflecting surface as sidewall, the distance piece 1402 of setting as latticed and tool one second reflecting surface 1404 in the reflector 110, this distance piece 1402 respectively this luminescence chip 108 are separated separately and are faced respectively this luminescence chip 108 with one second reflecting surface 1404.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (28)
1. a light-emitting diode assembly is characterized in that, comprises:
One substrate, tool one circuit pattern;
One reflector layer is arranged on this substrate;
At least one luminescence chip, tool one conductive part, this luminescence chip are arranged on this reflector layer, and wherein this circuit pattern connects this conductive part so that this luminescence chip driving power to be provided;
One reflector around this luminescence chip, comprises one and is positioned at the exiting surface of this reflector mouth and is positioned at one first reflecting surface of this reflector inner edge;
Colloid is covered in this luminescence chip; And
One phosphor powder layer is arranged at this colloid top, is used for even mixed light.
2. light-emitting diode assembly according to claim 1 is characterized in that, also comprises a microstructure optical membrane, and this phosphor powder layer is located at this exiting surface and is attached at this microstructure optical membrane.
3. light-emitting diode assembly according to claim 1 is characterized in that, tool one gap between this colloid and this phosphor powder layer.
4. light-emitting diode assembly according to claim 3 is characterized in that, also comprises the microstructure optical membrane of being located at this exiting surface, and this phosphor powder layer is contained in this reflector.
5. light-emitting diode assembly according to claim 4 is characterized in that, tool one gap between this microstructure optical membrane and this phosphor powder layer.
6. light-emitting diode assembly according to claim 1 is characterized in that, it comprises most the luminescence chips with arrayed.
7. light-emitting diode assembly according to claim 6 is characterized in that, those luminescence chips are linear array, and a distance piece of tool one second reflecting surface is set between two adjacent these luminescence chips.
8. light-emitting diode assembly according to claim 6 is characterized in that, this luminescence chip is provided with a distance piece of tool one second reflecting surface with arrayed between those luminescence chips of adjacent two row.
9. light-emitting diode assembly according to claim 6 is characterized in that, it also comprises as distance piece latticed and tool one second reflecting surface, and this distance piece respectively this luminescence chip is separated separately and faced respectively this luminescence chip with one second reflecting surface.
10. according to any described light-emitting diode assembly in the claim 7 to 9, it is characterized in that the angle between this first reflecting surface and this substrate comprises 30 ° to 80 °, the angle between this second reflecting surface and this substrate comprises 15 ° to 80 °.
11. light-emitting diode assembly according to claim 1 is characterized in that, sets weight ratio in this colloid and be 0.1% to 20% light diffusion particle.
12. light-emitting diode assembly according to claim 1 is characterized in that, this reflector is arranged on this reflector layer or this substrate.
13. light-emitting diode assembly according to claim 1 is characterized in that, at least one through hole of this reflector layer tool, and this circuit pattern connects this conductive part so that this luminescence chip driving power to be provided via this through hole.
14. light-emitting diode assembly according to claim 1 is characterized in that, this colloid tool one surface, this surface tool micro optical structure.
15. a light-emitting diode assembly is characterized in that, comprises:
One substrate, tool one circuit pattern;
One reflector layer is arranged on this substrate;
At least one luminescence chip, tool one conductive part, this luminescence chip are arranged on this reflector layer, and this circuit pattern connects this conductive part so that this luminescence chip driving power to be provided;
One reflector around this luminescence chip, comprises one and is positioned at the exiting surface of this reflector mouth and is positioned at one first reflecting surface of this reflector inner edge; And
One fluorescent colloid is covered in this luminescence chip, tool one surface, and wherein this fluorescent colloid is that fluorescent material and silica gel are mixed and made into.
16. light-emitting diode assembly according to claim 15 is characterized in that, this surface tool makes the micro optical structure of the luminous diffusion of this luminescence chip.
17. light-emitting diode assembly according to claim 15 is characterized in that, it also comprises the microstructure optical membrane of being located at this exiting surface.
18. light-emitting diode assembly according to claim 16 is characterized in that, this surface is a plane.
19. light-emitting diode assembly according to claim 18 is characterized in that, tool one gap between this surface and this microstructure optical membrane.
20. light-emitting diode assembly according to claim 15, it comprises most the luminescence chips with arrayed.
21. light-emitting diode assembly according to claim 20 is characterized in that, this luminescence chip is a linear array, and a distance piece of tool one second reflecting surface is set between two adjacent these luminescence chips.
22. light-emitting diode assembly according to claim 20 is characterized in that, this luminescence chip is with arrayed, and a distance piece of tool one second reflecting surface is set between those luminescence chips of adjacent two row.
23. light-emitting diode assembly according to claim 20 is characterized in that, it also comprises the distance piece of most each tool one second reflectings surface that are crisscross arranged, and respectively this luminescence chip is separated separately for those distance pieces.
24., it is characterized in that the angle between this first reflecting surface and this substrate comprises between 30 ° to 80 ° according to the described light-emitting diode assembly of claim 21 to 23, the angle between this second reflecting surface and this substrate comprises between 15 ° to 80 °.
25. light-emitting diode assembly according to claim 15 is characterized in that, sets weight ratio in this fluorescent colloid and be 0.1% to 20% light diffusion particle.
26. light-emitting diode assembly according to claim 15 is characterized in that, this surface is a curved surface.
27. light-emitting diode assembly according to claim 15 is characterized in that, this reflector is arranged on this reflector layer or this substrate.
28. light-emitting diode assembly according to claim 15 is characterized in that, at least one through hole of this reflector layer tool, and this circuit pattern connects this conductive part so that this luminescence chip driving power to be provided via this through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100003460A CN101499468B (en) | 2009-01-06 | 2009-01-06 | LED device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100003460A CN101499468B (en) | 2009-01-06 | 2009-01-06 | LED device |
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| CN101499468A true CN101499468A (en) | 2009-08-05 |
| CN101499468B CN101499468B (en) | 2010-07-07 |
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| CN2009100003460A Active CN101499468B (en) | 2009-01-06 | 2009-01-06 | LED device |
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| CN102456809A (en) * | 2010-10-26 | 2012-05-16 | 比亚迪股份有限公司 | LED assembly and preparation method thereof |
| CN103700654A (en) * | 2013-12-20 | 2014-04-02 | 纳晶科技股份有限公司 | LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof |
| CN105242456A (en) * | 2015-10-27 | 2016-01-13 | 深圳市华星光电技术有限公司 | Light source assembly and backlight module |
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| CN108227300A (en) * | 2017-12-29 | 2018-06-29 | 宁波东辉光电科技有限公司 | A kind of direct-type backlight optical texture |
| CN108254970A (en) * | 2017-12-29 | 2018-07-06 | 宁波东辉光电科技有限公司 | A kind of straight-down negative optics backlight diaphragm structure |
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