CN101499465A - Thermoelectric module and manufacturing method thereof - Google Patents
Thermoelectric module and manufacturing method thereof Download PDFInfo
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- CN101499465A CN101499465A CN 200910009738 CN200910009738A CN101499465A CN 101499465 A CN101499465 A CN 101499465A CN 200910009738 CN200910009738 CN 200910009738 CN 200910009738 A CN200910009738 A CN 200910009738A CN 101499465 A CN101499465 A CN 101499465A
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Abstract
This invention provides a thermoelectric module and a manufacturing method thereof. In recent years, there is a request of high precision temperature control to the thermoelectric module, such that the further improvement of the temperature detection precision is looked for. The thermoelectric module comprises a first substrate (11), multiple thermoelectric components arranged at a first surface (111) of the first substrate, a temperature detection component (thermistance chip (13)) arranged on the first substrate (111) or a second surface (112) of the first substrate (11) in the way of spacing with a thermal conduction component. Because of using this structure, the temperature of the first substrate (11) can be easily transmitted to the thermistanc chip (13), thereby improving the thermal conductivity, and the temperature control in high precision can be performed to the result thereof.
Description
Technical field
The present invention relates to electrothermal module.Relate to for example employed electrothermal modules such as adjustment of air conditioner, cool and hot box, semiconductor-fabricating device, optical detection device, laser diode etc. in more detail.
Background technology
The one end generates heat owing to flow through electric current to utilize the electrothermal module of peltier effect, and its other end heat absorption, therefore, is used as adjustment and uses with module.Carry out the temperature of thermoregulator parts for the temperature that detects this electrothermal module or by electrothermal module, thermistor chip equitemperature detecting element (for example with reference to patent documentation 1) is installed on the substrate of electrothermal module.
In recent years, require high-precision temperature control, thereupon, require temperature detecting precision further to improve for electrothermal module as described above.
In addition, in patent documentation 2, disclose the electrothermal module that temperature dependent form resistive element is set on a kind of substrate that is being arranged with a plurality of thermoelectric elements.According to this electrothermal module, can prevent the cause thermal damage that rises and cause owing to abnormal temperature.
Patent documentation 1:(Japan) spy opens flat 5-243621 communique
Patent documentation 2:(Japan) spy opens flat 2-170582 communique
In recent years, the temperature control that electrothermal module precision prescribed as described above is high.Therefore, require further to improve temperature detecting precision.
In addition, according to the invention of record in the patent documentation 2,, be the higher reliability of realization in recent years, and require to improve detection speed though obtained the higher electrothermal module of reliability.
Summary of the invention
The invention provides a kind of electrothermal module, it is characterized in that, possess: first substrate; A plurality of thermoelectric elements, described a plurality of thermoelectric elements are arranged in the first surface of described first substrate; And detector unit, described detector unit spaced heat conducting parts is disposed at the described first surface or the second surface of described first substrate.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, described detector unit is a thermistor.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is main component with the resin.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component engages with described first substrate and described detector unit.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, also possess electrode, described electrode is disposed at the described first surface or the described second surface of described first substrate, and described electrode gap metal bond material engages with described detector unit.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is space and the isolation of described metal bond material at interval.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is filled with between described first substrate and described detector unit.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component possesses: covering part and extension, described covering part is covered by described detector unit, and described extension extends and do not covered by described detector unit from described covering part.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, the thickness of described extension is thicker than the thickness of described covering part.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, the hardness of the described covering part of hardness ratio of described extension is higher.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is the resin of ultraviolet hardening.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is the resin of thermohardening type.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in above-mentioned each structure, described heat-conduction component is the resin of ultraviolet hardening and thermohardening type.
The present invention also provides a kind of electrothermal module, it is characterized in that, possesses: first substrate; The first surface that second substrate, described second substrate possess with described first substrate separates the predetermined distance opposing second surface; A plurality of thermoelectric elements, described a plurality of thermoelectric elements are arranged in the mode of described first surface of butt and described second surface respectively; Detector unit, described detector unit are equipped on the described first surface of described first substrate; And heat conduction layer, described heat conduction layer is provided in the position relative with described detector unit at the described second surface of described second substrate, and its heat conductivity is than the heat conductivity height of described second substrate.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, described heat conduction layer and described detector unit isolation configuration, the area of described heat conduction layer is bigger than the area on the described second substrate-side surface among the area of described detector unit.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, also possess a plurality of electrodes, described a plurality of electrode be equipped on described first surface or described second surface and with described a plurality of thermoelectric elements among be connected more than one, described heat conduction layer is as a formation among described a plurality of electrodes.
In addition, the present invention also provides a kind of electrothermal module, it is characterized in that, in said structure, described heat conduction layer possesses electrode part and extension, described electrode part be with described a plurality of thermoelectric elements among the join domain that is connected more than, described extension is beyond the zone of described electrode part and relative with described detector unit, and is longer than the length of described extension in the length of the above electrode part of length direction of described heat conduction layer.
The invention provides a kind of manufacture method of electrothermal module, it is characterized in that, comprising: the operation that forms electrode at the first surface of first substrate; The operation of configuration metal bond material on described electrode; Dispose the operation of the resin-bonded material of ultraviolet hardening at the described first surface of described first substrate; According on described metal bond material and the mode on the described resin-bonded material dispose the operation of detector unit; Operation to described resin-bonded material irradiation ultraviolet radiation; Operation to described metal bond material heating; And the operation of arranging a plurality of thermoelectric elements at the described first surface or the second surface of described first substrate.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in said structure, the operation of described metal bond material heating is carried out after the operation to described resin-bonded material irradiation ultraviolet radiation.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in said structure, described resin-bonded material is a thermohardening type.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in said structure, be the described metal bond material of heating under the state below described detector unit is positioned at described first substrate to the operation of described metal bond material heating.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in above-mentioned each structure, the operation that described metal bond material is heated makes the side flow of described metal bond material at described detector unit.
The present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, comprising: the operation that forms electrode at the first surface of first substrate; The operation of configuration metal bond material on described electrode; Dispose the operation of the resin-bonded material of thermohardening type at the described first surface of described first substrate; According on described metal bond material and the mode on the described resin-bonded material dispose the operation of detector unit; Operation to described resin-bonded material heating; Operation to described metal bond material heating; And the operation of arranging a plurality of thermoelectric elements at the described first surface or the second surface of described first substrate.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in said structure, the operation of described metal bond material heating is carried out after the operation to described resin-bonded material heating.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in above-mentioned each structure, be the described metal bond material of heating under the state below described detector unit is positioned at described first substrate to the operation of described metal bond material heating.
In addition, the present invention also provides a kind of manufacture method of electrothermal module, it is characterized in that, in above-mentioned each structure, the operation that described metal bond material is heated makes the side flow of described metal bond material at described detector unit.
According to electrothermal module of the present invention, because a plurality of thermoelectric elements, the spaced heat conducting parts of possess first substrate, arranging at the first surface of first substrate are disposed at the first surface of first substrate or the detector unit of second surface, therefore, improved the heat conductivity that the temperature of the substrate of electrothermal module is transmitted to detector unit.Thus, can improve the response for variations in temperature, its result has and can carry out high-precision temperature controlled effect.
In addition, electrothermal module of the present invention, in said structure, when detector unit was thermistor, thermistor was the element that resistance changes according to temperature, because it does not connect up etc., therefore easily use, in addition, owing to be small-sized and thermal capacity also can reduce, even, also can suppress to bring influence to inhaling heat dispersion so in the little electrothermal module of caloric receptivity, use.
In addition, electrothermal module of the present invention, in above-mentioned each structure, when heat-conduction component was main component with the resin, heat-conduction component engaged securely with first substrate and detector unit both sides, thus heat conductivity further improves.In addition, sneak into the high metallic of heat conductivity etc., can further improve heat conductivity to heat-conduction component.
In addition, electrothermal module of the present invention in above-mentioned each structure, when heat-conduction component engages with first substrate and described detector unit, has further improved the heat conductivity of the temperature of first substrate to the detector unit transmission.
In addition, electrothermal module of the present invention in above-mentioned each structure, also possesses the first surface that is disposed at first substrate or the electrode of second surface, when this electrode gap metal bond material engages with detector unit, obtain the high zygosity of detector unit with respect to first substrate.Its result, heat energy enough from first substrate via the metal bond conduct to detector unit.
In addition, electrothermal module of the present invention in said structure, when heat-conduction component space, interval and the isolation of metal bond material, has at heat-conduction component under the situation of conductivity, can prevent (input is used) electrode and (export and use) electric pole short circuit of detector unit.
In addition, electrothermal module of the present invention, in above-mentioned each structure, the heat-conduction component filling is between first substrate and detector unit the time, can further improve the heat conductivity of heat-conduction component, and can suppress the surface corrosion of electrode, metal bond material, detector unit etc.
In addition, electrothermal module of the present invention, in above-mentioned each structure, heat-conduction component possesses the covering part that covered by detector unit and extends and during the extension that do not covered by detector unit from covering part, at heat-conduction component is under the situation of ultraviolet hardening material, by forming extension from the mode that detector unit overflows, can promote the curing of extension by ultraviolet irradiation according to heat-conduction component.
In addition, electrothermal module of the present invention, in said structure, when the thickness of extension is thicker than the thickness of covering part, the moving of extension limit temperature detecting element, therefore, junction temperature detecting element stably.
In addition, electrothermal module of the present invention in said structure, when the hardness ratio covering part of extension is higher, can further improve the effect that the limit temperature detecting element moves.
In addition, electrothermal module of the present invention in above-mentioned each structure, when heat-conduction component is the resin of ultraviolet hardening, by according to making heat-conduction component form extension etc. from the mode that detector unit overflows, promotes the curing of ultraviolet irradiation.
In addition, electrothermal module of the present invention, in above-mentioned each structure, when heat-conduction component was the resin of thermohardening type, even the heat that electrothermal module when action produces imposes on heat-conduction component, heat-conduction component can easy deformation yet or is flowed, chemically stable.
In addition, electrothermal module of the present invention, in above-mentioned each structure, when heat-conduction component is the resin of ultraviolet hardening and thermohardening type, in the ultraviolet irradiation operation, under the situation of not exclusively carrying out the reaction of glue connection, and in heating process, also promote reaction, can finish the residual stress that the back reduces heat-conduction component inside in heating process, and the organic principle that comprises in the heat-conduction component is evaporated fully.
Electrothermal module of the present invention, possess: first substrate, has second substrate that separates the predetermined distance opposing second surface with the first surface of first substrate, a plurality of thermoelectric elements with first surface and the arrangement of second surface difference butt, be equipped on the detector unit of the first surface of first substrate, second surface at second substrate is provided in position relative with detector unit and the heat conductivity heat conduction layer higher than second substrate, therefore, even under the situation that the excessive temperature of electrothermal module rises, this abnormal temperature rises also can pass to detector unit by heat conduction layer easily.Thus, owing to improved the detection speed of detector unit, therefore, can improve the reliability of electrothermal module.
In addition, electrothermal module of the present invention, in said structure, heat conduction layer and detector unit isolation configuration, when the area of heat conduction layer is bigger than the area on the second substrate-side surface among the area of detector unit, further pass to detector unit easily from the heat of heat conduction layer.
In addition, electrothermal module of the present invention, in above-mentioned each structure, also possess be equipped on first surface or second surface and with a plurality of electrodes that are connected more than of a plurality of thermoelectric elements, when heat conduction layer constitutes as one of a plurality of electrodes, because heat conduction layer also has function as electrode, so, the heating cooling effectiveness of electrothermal module can be improved.
In addition, electrothermal module of the present invention, in said structure, heat conduction layer possesses: with the join domain that connects more than of a plurality of thermoelectric elements is electrode part and the electrode part extension relative with detector unit in addition, length direction at heat conduction layer, the length of electrode part is longer than the length of extension, and at this moment, the plane is seen in the both end sides position of extension and formed recess respectively.These recesses are and the regional adjacent areas that disposes P type thermoelectric element, N type thermoelectric element respectively by forming recess, this zone can be set at needed irreducible minimum.Thus, with P type thermoelectric element, when N type thermoelectric element engages with electrode part, can suppress their offset.
The manufacture method of electrothermal module of the present invention comprises: the operation that forms electrode at the first surface of first substrate; The operation of configuration metal bond material on electrode; Dispose the operation of the resin-bonded material of ultraviolet hardening at the first surface of first substrate; According on the metal bond material and the mode on the resin-bonded material dispose the operation of detector unit; Operation to resin-bonded material irradiation ultraviolet radiation; Operation with the heating of metal bond material; And the operation of arranging a plurality of thermoelectric elements at the first surface or the second surface of first substrate, therefore, can be at the pre-configured resin-bonded material in the position that detector unit is set of the first surface of first substrate, after the metal bond material has engaged detector unit at interval on first substrate, needn't inject the resin-bonded material to the gap of first substrate and detector unit.Therefore, can easily the resin-bonded material be set in the gap of first substrate and detector unit
In addition, the manufacture method of electrothermal module of the present invention, in said structure, the operation of metal bond material heating is carried out after to the operation of resin-bonded material irradiation ultraviolet radiation, at this moment, for example, first substrate is reversed up and down heat utilizing the resin-bonded material detector unit to be installed under the state of first surface of first substrate, thus, can make the side flow of metal bond material at detector unit.Thus, the bonding area on the surface of metal bond material and detector unit increases, and therefore, detector unit engages more firmly with the interarea of first substrate.
In addition, the manufacture method of electrothermal module of the present invention, in said structure, when the resin-bonded material was thermohardening type, even the hotwork that electrothermal module when action produces is used for heat-conduction component, heat-conduction component can easy deformation yet or is flowed, chemically stable.
In addition, the manufacture method of electrothermal module of the present invention above-mentioned during each constitutes, is a state heating of metal grafting material below detector unit is positioned at first substrate with the operation of metal bond material heating, at this moment, can make the side flow of metal bond material at detector unit.Thus, the bonding area on the surface of metal bond material and detector unit increases, and therefore, detector unit engages more firmly with the interarea of first substrate.
In addition, the manufacture method of electrothermal module of the present invention, in above-mentioned each formation, make the metal bond material when the side flow of detector unit the operation of metal bond material heating, because the bonding area on the surface of metal bond material and detector unit increases, therefore, detector unit engages more firmly with the interarea of first substrate.
The manufacture method of electrothermal module of the present invention comprises: the operation that forms electrode at the first surface of first substrate; The operation of configuration metal bond material on electrode; Dispose the operation of the resin-bonded material of thermohardening type at the first surface of first substrate; According on the metal bond material and the mode on the resin-bonded material dispose the operation of detector unit; Operation with the heating of resin-bonded material; Operation with the heating of metal bond material; The operation of arranging a plurality of thermoelectric elements at the first surface or the second surface of first substrate, therefore, can be at the pre-configured resin-bonded material in the position that detector unit is set of the first surface of first substrate, after the metal bond material has engaged detector unit at interval on first substrate, needn't inject the resin-bonded material to the gap of first substrate and detector unit.Therefore, can easily the resin-bonded material be set in the gap of first substrate and detector unit.
In addition, the manufacture method of electrothermal module of the present invention, in said structure, the operation of metal bond material heating is carried out after the operation of heating resin-bonded material, at this moment, for example, first substrate is reversed up and down heat utilizing the resin-bonded material detector unit to be installed under the state of first surface of first substrate, thus, can make the side flow of metal bond material at detector unit.Thus, the bonding area on the surface of metal bond material and detector unit increases, and therefore, detector unit engages more firmly with the interarea of first substrate.
In addition, the manufacture method of electrothermal module of the present invention in above-mentioned each structure, is a heating of metal grafting material under the state below detector unit is positioned at first substrate with the operation of metal bond material heating, at this moment, can make the side flow of metal bond material at detector unit.Thus, the bonding area on the surface of metal bond material and detector unit increases, and therefore, detector unit engages more firmly with the interarea of first substrate.
In addition, the manufacture method of electrothermal module of the present invention, in above-mentioned each structure, the operation that the metal bond material is heated makes the side flow of metal bond material at detector unit.Thus, the bonding area on the surface of metal bond material and detector unit increases, and therefore, detector unit engages more firmly with the interarea of first substrate.
Description of drawings
Fig. 1 is the side view of the electrothermal module of expression first embodiment of the invention;
Fig. 2 is the plane graph that takes off state behind the side group plate in the expression electrothermal module shown in Figure 1;
Fig. 3 is with near the side view after amplifying the detector unit of electrothermal module shown in Figure 1;
Fig. 4 is with near the side view after amplifying the detector unit of the electrothermal module of second embodiment of the invention;
Fig. 5 is with near the side view after amplifying the detector unit of the electrothermal module of third embodiment of the invention;
Fig. 6 is with near the side view after amplifying the detector unit of the electrothermal module of four embodiment of the invention;
Fig. 7 is the side view of the electrothermal module of expression fifth embodiment of the invention;
Fig. 8 is the plane graph when a side group plate (first substrate) of electrothermal module shown in Figure 7 and another substrate (second substrate) are decomposed;
Fig. 9 (a) is with near the side view after amplifying the detector unit of electrothermal module shown in Figure 7 and the heat conduction layer, and Fig. 9 (b) is the plane graph that is used to illustrate the position relation of detector unit and heat conduction layer;
Figure 10 is the plane graph when a side group plate (first substrate) of the electrothermal module of sixth embodiment of the invention and another substrate (second substrate) are decomposed;
Figure 11 (a)～(g) is the profile at position of detector unit of each operation of the electrothermal module manufacture method of expression embodiment of the present invention.
Description of symbols
11 substrates
11a, 11b first substrate, second substrate
13 thermistor chips
The surface of 13a thermistor chip
15a, 15b electrode
17 scolders (metal bond material)
19 heat-conduction components (resin-bonded material)
21 spaces
23,23a, 23b electrode
25a P type thermoelectric element
25b N type thermoelectric element
31 heat conduction layers
The first surface of 111 first substrates
The second surface of 112 first substrates
The first surface of 111a second substrate
The second surface of 111b second substrate
Embodiment
Below, describe with reference to the electrothermal module of accompanying drawing embodiment of the present invention.
(electrothermal module)
Fig. 1～Fig. 3 represents the electrothermal module of first embodiment of the invention.
As shown in Figures 1 and 2, the electrothermal module of first execution mode possesses: relatively a pair of substrate (first substrate and second substrate) 11, a plurality of P type thermoelectric element 25a that between two relative interareas of a pair of substrate 11, arrange and a plurality of N type thermoelectric element 25b of configuration, be arranged in a plurality of electrodes 23 of substrate 11 for P type thermoelectric element 25a and N type thermoelectric element 25b are connected in series.This electrothermal module possesses thermistor chip 13, described thermistor chip 13 spaced electrode 15a, 15b and by be engaged in the interarea of substrate 11 as the scolder 17 of metal bond material.
As shown in Figures 2 and 3, between the bottom surface of the interarea of substrate 11 and thermistor chip 13, dispose heat-conduction component 19 with they both sides' butts.
That is, the electrothermal module of present embodiment possesses: first substrate 11, a plurality of thermoelectric elements that are arranged in the first surface 111 of first substrate 11, spaced heat conducting parts 19 are disposed at the first surface 111 of first substrate 11 or the detector unit of second surface 112 (thermistor chip 13).
In addition, in the example shown in Figure 1, detector unit (thermistor chip 13) is disposed at the first surface 111 of first substrate 11, but also can be disposed at first substrate 11 with first surface 111 opposing second surface 112.But, owing to have detector unit at the near position of distance thermoelectric element, thus can carry out more high-precision temperature control, and favourable to the miniaturization of electrothermal module, therefore, preferably detector unit is disposed at the first surface 111 of first substrate 11.
Therefore, the electrothermal module of present embodiment is compared with the existing electrothermal module that has the gap between thermistor chip and substrate, because the temperature of substrate 11 passes to thermistor chip 13 easily, therefore, has improved heat conductivity.Its result can carry out high-precision temperature control.
In this case, good with respect to the sensitivity of the temperature of substrate 11 for making, preferably the area of the bearing surface that joins with substrate 11 of heat-conduction component 19 is bigger than the area of the bearing surface that joins with thermistor chip 13.In addition, the area of the area of the bearing surface that joins with substrate 11 of heat-conduction component 19 and the bearing surface that joins with thermistor chip 13 also can be roughly the same.In this case, further improve from the heat conductivity of substrate 11 to thermistor chip 13.
In addition, heat-conduction component 19 smooth surfaces preferably.In this case, because the heat conduction path on heat-conduction component 19 surfaces shortens, therefore, the heat conductivity of heat-conduction component 19 improves.In addition, because the surface area of heat-conduction component 19 diminishes, thus little from the thermal change of the surface emissivity of heat-conduction component 19, improve the heat conductivity of heat-conduction component 19.
In addition, heat-conduction component 19 can be truncated cone shape, shape such as cylindric, and in this case, the heat distribution deviation diminishes, and surface area also diminishes, and has therefore improved heat conductivity.
Have at heat-conduction component 19 under the situation of conductivity, preferably between electrode 15a, 15b and scolder 17 and heat-conduction component 19, space 21 is set.By being configured, can prevent electrode 15a and electrode 15b short circuit according to the mode of heat-conduction component 19 and scolder 17 being isolated across this space 21.
In this case, also the megohmite insulant that is made of resin, pottery etc. can be arranged in the space 21, can prevent electrode 15a and electrode 15b short circuit more reliably.In addition, owing to have megohmite insulant, thus the temperature of substrate 11 passes to thermistor chip 13 easily, and therefore, heat conductivity further improves.In addition, be to improve the insulating properties of megohmite insulant, also can comprise a plurality of emptying apertures that dielectric constant is about 1 air that contain in the megohmite insulant.
Under the situation that heat-conduction component 19 is made of the material with conductivity, this material is electroconductive resin bonding agent that is dispersed with metallic etc.
Fig. 4 represents the electrothermal module of second embodiment of the invention.
In addition, to being elaborated with the above-mentioned first execution mode difference, the repetitive description thereof will be omitted for same inscape in the present embodiment.
The electrothermal module of present embodiment, scolder 17 not only is arranged at the bottom surface of thermistor chip 13, but also is arranged at the side.Thus, the bond strength of electrode 15a, 15b and scolder 17 further improves.
Fig. 5 represents the electrothermal module of third embodiment of the invention.
In addition, to being elaborated with the above-mentioned first execution mode difference, the repetitive description thereof will be omitted for same inscape in the present embodiment.
The electrothermal module of present embodiment, heat-conduction component 19 seamlessly is fills up between substrate 11 and the thermistor chip 13.Thus, can further improve heat conductivity, and, the surface corrosion of electrode 15a, 15b, scolder 17, thermistor chip 13 etc. can be suppressed.In this case, use insulating material as heat-conduction component 19.As insulating material, epoxies, acrylic compounds, silicon class, my Lu Taite (ア ラ Le ダ イ ト (registered trade mark)) resinoid are for example arranged and in these resins, mixed the high thermal conductivity resin etc. of metallic.In addition, when heat-conduction component 19 is main component with the resin, so-called main component be meant resinous principle content at most or the content of resinous principle surpass 50 weight %.
More preferably heat-conduction component 19 is can be with the material of substrate 11 and thermistor chip 13 joints.Thus, owing to thermistor chip 13 engages with substrate 11 more firmly, so durability further improves.As such material, for example there are epoxies, acrylic compounds, silicon class, my Lu Taite (ア ラ Le ダ イ ト (registered trade mark)) resinoid etc. to have resin ultra-violet solidified, Thermocurable.
As shown in Figure 5, scolder 17 has medial surface 17a along with towards the top and the outside oblique zone of 17b inclination, side.Thus, form recess by the medial surface 17a of scolder 17 and the bottom surface 13a of thermistor chip 13.Because a part of 19a of heat-conduction component 19 enters this recess, thereby is fixed effect.Thus, thermistor chip 13 engages with substrate 11 more firmly by heat-conduction component 19.
Fig. 6 represents the electrothermal module of four embodiment of the invention.
In addition, to being elaborated with the above-mentioned first execution mode difference, the repetitive description thereof will be omitted for same inscape in the present embodiment.
The electrothermal module of present embodiment, shown in Fig. 6 (a)～(c), preferably heat-conduction component 19 possesses the covering part 19b of the bottom surface 13a that is covered by detector unit 13 and the extension 19c that extends and do not covered by detector unit 13 from covering part 19b.At heat-conduction component 19 is under the situation of ultraviolet hardening grafting material, and the mode of overflowing from thermistor chip 13 according to grafting material forms extension 19c, thus, in the above-mentioned curing process, promotes the curing of the ultraviolet irradiation of extension 19c.
In addition, shown in Fig. 6 (c), preferred extension 19c is thicker than the thickness of covering part 19b.Thus, because extension 19c can limit horizontal (left and right directions among Fig. 6 (c)) mobile of thermistor chip 13, therefore, thermistor chip 13 stably can be engaged.
In addition, preferably extension 19c than the hardness height of covering part 19b.Thus, can further improve the effect that moves of restriction thermistor chip 13.
As the high method of hardness ratio covering part 19b that makes extension 19c, for example above-mentioned, have as heat-conduction component 19 and use ultraviolet hardenings and also be the method for the grafting material of thermohardening type.According to above-mentioned manufacture method, it is many that extension 19c and covering part 19b compare the ultraviolet irradiation amount, so curing ratio covering part 19b is fast, therefore, can relatively improve hardness.
Fig. 7～Fig. 9 represents the electrothermal module of fifth embodiment of the invention.
In addition, in the present embodiment, to being elaborated with the above-mentioned first execution mode difference, the repetitive description thereof will be omitted for same inscape.
As shown in Figures 7 and 8, the electrothermal module of present embodiment possesses: a plurality of P type thermoelectric element 25a and a plurality of N type thermoelectric element 25b that arrange between two relative interareas of a pair of substrate (first substrate) 11a of relative configuration and substrate (second substrate) 11b, a pair of substrate 11a, 11b.On substrate 11a and substrate 11b, for P type thermoelectric element 25a and N type thermoelectric element 25b being connected in series and being arranged with a plurality of electrode 23a and a plurality of electrode 23b respectively.This electrothermal module possesses spaced electrode 15a, 15b and by the thermistor chip (detector unit) 13 of solder bonds in the interarea of substrate 11a.
That is, the electrothermal module of present embodiment possesses: the first substrate 11a, have with the first surface 111a of the first substrate 11a separate predetermined distance opposing second surface 111b the second substrate 11b, with first surface 111a and second surface 111b a plurality of thermoelectric elements, the detector unit (thermistor chip 13) that is equipped on the first surface 111a of the first substrate 11a arranged of butt, position relative and the heat conductivity heat conduction layer 31 higher that is equipped on the second surface 111b of the second substrate 11b respectively than the second substrate 11b with detector unit.
The electrothermal module of present embodiment adopts the structure of the heat-conduction component 19 that does not possess first execution mode, but also can be for possessing the structure of heat-conduction component 19.
The position relative with thermistor chip 13 in the interarea (second surface 111b) of substrate 11b is equipped with the heat conductivity heat conduction layer 31 higher than substrate 11b.Preferred and the thermistor chip 13 of this heat conduction layer 31 separates configuration.In the use of electrothermal module, just in case produced under the situation of excessive temperature rising substrate 11a, 11b; Electrode 23a, 23b; P type thermoelectric element 25a, N type thermoelectric element 25b equitemperature rise, and the temperature in the space between substrate 11a and the substrate 11b rises.Rise by detected this temperature by thermistor chip 13, may command can suppress abnormal temperature and rise the energising of electrothermal module.
The electrothermal module of present embodiment, because heat conduction layer 31 is equipped on the position relative with thermistor chip 13, therefore, in situation that the excessive temperature of the substrate 11b that is provided with heat conduction layer 31 rises or be disposed under the situation of excessive temperature rising of the electrode 23b the heat conduction layer 31 near, this temperature is by from the radiant heat of heat conduction layer 31, pass to thermistor chip 13 as soon as possible via the conduction heat of air, the advection heat that cross-ventilation causes etc.Thus, because the raising of the detection speed of detector unit, so the reliability of electrothermal module is improved.
The material that constitutes heat conduction layer 31 is not particularly limited if the heat conductivity material higher than substrate 11b is just passable, for example preferably uses metal such as copper, aluminium, silver, gold, platinum, nickel, zinc, tin and comprises the alloy of these metals.
Secondly, shown in Fig. 9 (a) and (b), the area that also can constitute the interarea that makes heat conduction layer 31 is bigger than the area of the surperficial 13a of the substrate 11b side of thermistor chip 13.Heat conduction layer 31 disposes according to the mode of the surperficial 13a of another substrate 11b side that covers thermistor chip 13.That is, set the size and the equipping position of heat conduction layer 31 in the following manner, that is, with the surperficial 13a of thermistor chip 13 perpendicular to the direction of the interarea of substrate 11b during with respect to substrate 11b projection, heat conduction layer 31 comprises this perspective view.Thus, transmit by thermistor chip 13 from the heat of heat conduction layer 31 is easier.
In addition, the interarea of heat conduction layer 31 can be made and have small concavo-convex matsurface, in this case, increase, can increase radiant heat from the interarea radiation of heat conduction layer 31 by the surface area that makes heat conduction layer 31 interareas.In addition, the interarea of heat conduction layer 31 can be a concave shape with respect to thermistor chip 13.In this case, the radiant heat from the interarea radiation of heat conduction layer 31 is gathered thermistor chip 13 easily.And, interarea at heat conduction layer 31 is under the situation of concave shape with respect to thermistor chip 13, if the partial rotation ellipsoid shaped of this concave surface near the surperficial 13a of thermistor chip 13, having the spherical calotte shape of focus or near surperficial 13a, having a focus, just the radiant heat from heat conduction layer 31 interarea radiation more easily can be gathered thermistor chip 13, from but preferred.
Have, the thickness of heat conduction layer 31 is not particularly limited again, but is identical thickness with electrode 23b preferably or is the thickness thicker than electrode 23b.Particularly,, therefore, can reduce manufacturing cost owing to can form electrode 23b and heat conduction layer 31 simultaneously being under identical thickness and the situation about constituting by identical materials with electrode 23b.In addition, adopt the thickness thicker than electrode 23b to make the distance of surperficial 13a of itself and thermistor chip 13 nearer by heat conduction layer 31, the heat of substrate 11b is by the heat conduction layer 31 easier thermistor chips 13 that are delivered to, and therefore, detection speed further improves.For the heat of easier transferring substrates 11b, the configuration of also the surperficial 13a of heat conduction layer 31 and thermistor chip 13 can being joined.
Figure 10 represents the electrothermal module of sixth embodiment of the invention.
In addition, present embodiment pair is carried out in detail with above-mentioned the 5th execution mode difference, and the repetitive description thereof will be omitted for same inscape.
The electrothermal module of present embodiment, thermistor chip 13 are configured in the central portion that more depends on substrate 11b.Be provided with heat conduction layer 33 in the position relative with this thermistor chip 13.
This heat conduction layer 33 also has both the function as the electrode that is used for P type thermoelectric element 25a, N type thermoelectric element 25b are electrically connected except that above-mentioned temperature conduction function.Heat conduction layer 33 possesses: be used for as the electrode part 33a of electrode performance function and be the extended extension 33b of the surperficial 13a self-electrode 33a of portion of the substrate 11b side that covers thermistor chip 13.Like this, owing to possess extension 33b, make heat conduction layer 33 guarantee to be used to cover the zone of surperficial 13a of another substrate 11b side of thermistor chip 13.
The length of the length direction of extension 33b is littler than electrode part 33a.Heat conduction layer 33 with electrode part 33a position adjacent, possess recess 33c respectively in the position of the length direction both end sides of extension 33b.These recesses 33c is and zone 35 adjacent areas that dispose P type thermoelectric element 25a, N type thermoelectric element 25b respectively.By recess 33c is set like this, the zone 35 of configuration P type thermoelectric element 25a, N type thermoelectric element 25b can be set at needed irreducible minimum.Thus, with P type thermoelectric element 25a, when N type thermoelectric element 25b engages with electrode part 33a, can suppress the offset of P type thermoelectric element 25a, N type thermoelectric element 25b.
In addition, by configuration thermistor chip 13, make that substrate 11b's is adjacent interelectrode bigger than other interelectrode distance apart from w.Like this, do not form the big position of length (area) in the zone of electrode, compare, the tendency of the intensity reduction of substrate 11b is arranged with other position.When by between this electrode, setting extension 33b, can suppress the intensity reduction of substrate 11b apart from w.
(manufacture method of electrothermal module)
For the manufacture method of the electrothermal module of embodiment of the present invention, be that example describes with the situation of the electrothermal module of making second embodiment of the invention shown in Figure 4.
At first, the interarea (first surface 111) at substrate 11 forms electrode 15a, 15b (Figure 11 (a)).Can form electrode pattern by substrate surface being carried out etching etc.
Secondly, on electrode 15a, 15b, dispose scolder 17 (Figure 11 (b)) respectively.
Secondly, measure the resin-bonded material (heat-conduction component) 19 (Figure 11 (c)) of configuration ultraviolet hardening or thermohardening type in accordance with regulations at the interarea of substrate 11.As the resin-bonded material 19 of ultraviolet hardening, epoxies ultraviolet hardening bonding agent etc. is for example arranged.
Secondly, at the interarea of substrate 11, scolder 17 and resin-bonded material 19 use configuration thermistor chips 13 (Figure 11 (d)) such as chip mounters at interval.At this moment, for curing process described later, preferred resin grafting material 19 assembles according to the mode of overflowing a little from thermistor chip.
Secondly, use 27 pairs of resin-bonded material 19 irradiation ultraviolet radiations of ultra-violet lamp (Figure 11 (e)).Among Figure 11 (e), ultra-violet lamp 27 is configured in the top of thermistor chip 13, but also it can be configured in sidepiece of thermistor chip 13 etc.By to resin-bonded material 19 irradiation ultraviolet radiations, resin-bonded material 19 is reacted, thermistor chip 13 is engaged with the interarea of substrate 11.At this moment, resin-bonded material 19 can not exclusively carry out the reaction of glue connection, also can only make reaction proceed to the degree that thermistor chip 13 is temporarily fixed on substrate 11 interareas.When resin-bonded material 19 when thermistor chip 13 overflows, ultraviolet irradiation is carried out resin solidification easily, thereby is preferred.Under the situation of using the thermohardening type resin, the temperature of selecting scolder is not impacted applies heat, and resin-bonded material 19 is solidified.
Secondly, under the state that substrate 11 is reversed up and down, (Figure 11 (f)) heated in the inside that substrate 11 is disposed at heating furnace 29.That is, be positioned at thermistor chip 13 under the state of lower position of substrate 11, scolder 17 and resin-bonded material 19 are heated.If heating-up temperature and heating time get final product according to the material of scolder 17, the suitable setting of conditions such as material of resin-bonded material 19.Like this, by the state of substrate 11 with counter-rotating up and down heated, scolder 17 is flowed effectively in the side of thermistor chip 13.Thus, because the bonding area on the surface of scolder 17 and thermistor chip 13 increases, therefore, thermistor chip 13 is engaged in the interarea of substrate 11 more firmly.
In addition, resin-bonded material 19 is preferably ultraviolet hardening, and is thermohardening type.Thus, in heating process, also promote the reaction of resin-bonded material 19, thermistor chip 13 is engaged in more firmly the interarea of substrate 11.In addition, because resin-bonded material 19 also is a thermohardening type, therefore, in the ultraviolet irradiation operation, not exclusively carry out the reaction of glue connection, and also in heating process, promote reaction, therefore, after heating process finishes, can reduce the residual stress of the inside of resin-bonded material 19, simultaneously the organic principle that contains in the grafting material is evaporated fully.
As above be made into electrothermal module (Figure 11 (g)) like that.
The invention is not restricted to the content of each execution mode of above explanation, in the scope that does not break away from its aim, can carry out various changes.The example of representing change below.
Main component as constituting scolder 17 for example has Sn-Sb alloy, Sn-Ag-Cu alloy, Au-Sn alloy, Sn-unleaded class solder materials such as Bi alloy.As substrate 11, for example can use pottery or resin substrates such as epoxy, polyimides such as aluminium oxide and aluminium nitride, perhaps use in epoxy, polyimide resin to add ceramic packing and improve heat conducting substrate etc.When using resin-bonded material 19, preferably substrate 11 uses resin substrate.Thus, bond strength is further improved.
The circumference of substrate 11 is preferably stopped up by encapsulant.The dewfall that can suppress thus, the electrothermal module circuit.As encapsulant, preferably use the bonding agent of soft, for example more preferably soft the and rubber-like silicone bonding agent of hardness.If the bonding agent that uses soft, then can relax the thermal stress that produces between the supporting substrates of the supporting substrates of high temperature side and low temperature side as encapsulant.As the encapsulant of soft, for example can enumerate with the silicone material is the material of main component, and as the encapsulant of high rigidity, for example can enumerate with the epoxies material is the material of main component.
As detector unit, except that above-mentioned thermistor chip 13, can enumerate thermocouple, resistance temperature measurement body, thermoswitch etc., wherein, thermistor chip 13 is elements that resistance changes with temperature, because it does not connect up etc., therefore easily use, in addition, owing to be small-sized and thermal capacity also can reduce, even, also can suppress to inhaling the influence that heat dispersion brings so in the little electrothermal module of caloric receptivity, use.
Only express a detector unit among each figure, but preferred detector unit is equipped with at the inner face of substrate 11 a plurality of.Thus, can detect local variations in temperature or measure average temperature.
On above-mentioned electrothermal module, exterior side by at least one substrate in substrate 11 is installed heat exchanger, it can be used as heat-exchange device, described heat exchanger for example is used to have the stream that the fluid as cold-producing medium flows and makes fluid flow and carry out heat exchange along prescribed direction.At least one substrate in substrate 11 is provided with under the situation of heat exchanger, by being cooled in another substrate 11 configurations or carrying out temperature controlled object being treated, can carry out adjustment.In addition, also can heat exchanger be set in the both sides of a pair of substrate 11.Particularly, as heat exchanger for example corrugated fin is installed,, is being produced cold wind in one side, at another side generation hot blast when when air being flow through from the side and electrothermal module power in the both sides of electrothermal module.In the system that utilizes this cold wind to cool off, if detector unit is installed, then can measure the temperature of the wind that is cooled exactly in the fluid issuing side of substrate 11, therefore, carry out the temperature control of wind easily.
The electrothermal module of each above-mentioned execution mode can be used as power facility and is loaded in the Blast Furnace Top Gas Recovery Turbine Unit (TRT).
In addition, the electrothermal module of each above-mentioned execution mode can be used as thermoregulation mechanism and is loaded in the temperature-adjusting device.As temperature-adjusting device, exemplify for example use electrothermal module as the cooling device of cooling body, and use electrothermal module as the heater of heating arrangements etc.
(embodiment)
Below, further describe the present invention according to embodiment, but the present invention is not limited by following embodiment.
At first, prepare circuit board, described circuit board has the wiring pattern (electrode) by with copper being 127 pairs of thermoelectric elements of conductor layer configuration of main component on the insulated substrate that with epoxy resin is main component.Screen printing Sn-Sb class, Sn-Ag-Cu class, Au-Sn class, Sn-lead-free solder cream such as Bi class on the electrode of this circuit board form the scolder pattern.
Secondly, while utilize matching method that coating amount is changed between the electrode of putting thermistor chip to apply various bonding agents planting with various curing characteristicss.After the coating, assemble thermistor chip, afterwards, above substrate, carry out the hot blast heating of UV irradiation and/or 80 ℃ as curing with assembler, thermistor chip is temporary fixed.
Secondly, on the scolder pattern, load P type thermoelectric element and N type thermoelectric element.Then, cover circuit board, obtain module thus according to the mode that clips element.Then, this module is reversed up and down, be configured in the heating that refluxes under the state of upside substrate at thermistor chip, make melt solder, carry out the scolder welding.
Each module is respectively made 100 respectively.Each module is measured the resistance of thermistor.In addition, thermistor is carried out drop test, the thermistor that can not measure resistance is measured rate of finished products as substandard products.In addition, the element mounting substrate that obtains is carried out exploded, observe the cross section of thermistor and resin part, the thickness of the covering part that covered by thermistor and the extension that do not covered by thermistor is compared.The thickness of extension is tried to achieve by getting the average of height that contacts with thermistor.Hardness is to use the method shown in the JISK6253 to measure Xiao's formula A hardness respectively.After the temperature cycling test of inciting somebody to action-40 ℃～125 ℃ is respectively implemented to circulate in 30 minutes, 120, measure the resistance of thermistor once more, estimate same rate of finished products.In addition, electrothermal module is applied 10V voltage, the resistance of measuring thermistor is estimated response promptly to the time of measuring till thermometer is shown fixed value.Show the result in table 1.
Table 1
A: thermohardening type resin
B: ultraviolet curing resin
C: hot curing, ultraviolet curing are also used the type resin
As shown in table 1, not utilizing the result of the temporary fixed sample No.1 of bonding agent is that rate of finished products is low, and durability is also low than other sample, and response speed is slow.
On the other hand, the sample of No.2-9, its rate of finished products height and durability are also good.In addition, response speed is faster than sample No.1 as can be seen.
Claims (26)
1, a kind of electrothermal module is characterized in that, possesses:
First substrate;
A plurality of thermoelectric elements, described a plurality of thermoelectric elements are arranged in the first surface of described first substrate; And
Detector unit, described detector unit spaced heat conducting parts is disposed at the described first surface or the second surface of described first substrate.
2, electrothermal module as claimed in claim 1 is characterized in that,
Described detector unit is a thermistor.
3, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component is main component with the resin.
4, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component engages with described first substrate and described detector unit.
5, electrothermal module as claimed in claim 1 is characterized in that,
Also possess electrode, described electrode is disposed at the described first surface or the described second surface of described first substrate,
Described electrode gap metal bond material engages with described detector unit.
6, electrothermal module as claimed in claim 5 is characterized in that,
Described heat-conduction component is space and the isolation of described metal bond material at interval.
7, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component is filled with between described first substrate and described detector unit.
8, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component possesses: covering part and extension, and described covering part is covered by described detector unit, and described extension extends and is not covered by described detector unit from described covering part.
9, electrothermal module as claimed in claim 8 is characterized in that,
The thickness of described extension is thicker than the thickness of described covering part.
10, electrothermal module as claimed in claim 8 is characterized in that,
The hardness of the described covering part of hardness ratio of described extension is higher.
11, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component is the resin of ultraviolet hardening.
12, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component is the resin of thermohardening type.
13, electrothermal module as claimed in claim 1 is characterized in that,
Described heat-conduction component is the resin of ultraviolet hardening and thermohardening type.
14, a kind of electrothermal module is characterized in that, possesses:
First substrate;
The first surface that second substrate, described second substrate possess with described first substrate separates the predetermined distance opposing second surface;
A plurality of thermoelectric elements, described a plurality of thermoelectric elements are arranged in the mode of described first surface of butt and described second surface respectively;
Detector unit, described detector unit are equipped on the described first surface of described first substrate; And
Heat conduction layer, described heat conduction layer is provided in the position relative with described detector unit at the described second surface of described second substrate, and its heat conductivity is than the heat conductivity height of described second substrate.
15, electrothermal module as claimed in claim 14 is characterized in that,
Described heat conduction layer and described detector unit isolation configuration,
The area of described heat conduction layer is bigger than the area on the described second substrate-side surface among the area of described detector unit.
16, electrothermal module as claimed in claim 15 is characterized in that,
Also possess a plurality of electrodes, described a plurality of electrodes be equipped on described first surface or described second surface and with described a plurality of thermoelectric elements among be connected more than one,
Described heat conduction layer is as a formation among described a plurality of electrodes.
17, electrothermal module as claimed in claim 16 is characterized in that,
Described heat conduction layer possesses electrode part and extension, described electrode part be with described a plurality of thermoelectric elements among the join domain that is connected more than, described extension beyond the zone of described electrode part and relative with described detector unit,
Length in the above electrode part of length direction of described heat conduction layer is longer than the length of described extension.
18, a kind of manufacture method of electrothermal module is characterized in that, comprising:
Form the operation of electrode at the first surface of first substrate;
The operation of configuration metal bond material on described electrode;
Dispose the operation of the resin-bonded material of ultraviolet hardening at the described first surface of described first substrate;
According on described metal bond material and the mode on the described resin-bonded material dispose the operation of detector unit;
Operation to described resin-bonded material irradiation ultraviolet radiation;
Operation to described metal bond material heating; And
The operation of arranging a plurality of thermoelectric elements at the described first surface or the second surface of described first substrate.
19, the manufacture method of electrothermal module as claimed in claim 18 is characterized in that,
Operation to described metal bond material heating is carried out after the operation to described resin-bonded material irradiation ultraviolet radiation.
20, the manufacture method of electrothermal module as claimed in claim 18 is characterized in that,
Described resin-bonded material is a thermohardening type.
21, the manufacture method of electrothermal module as claimed in claim 18 is characterized in that,
To the operation of described metal bond material heating is the described metal bond material of heating under the state below described detector unit is positioned at described first substrate.
22, the manufacture method of electrothermal module as claimed in claim 18 is characterized in that,
Operation to described metal bond material heating makes the side flow of described metal bond material at described detector unit.
23, a kind of manufacture method of electrothermal module is characterized in that, comprising:
Form the operation of electrode at the first surface of first substrate;
The operation of configuration metal bond material on described electrode;
Dispose the operation of the resin-bonded material of thermohardening type at the described first surface of described first substrate;
According on described metal bond material and the mode on the described resin-bonded material dispose the operation of detector unit;
Operation to described resin-bonded material heating;
Operation to described metal bond material heating; And
The operation of arranging a plurality of thermoelectric elements at the described first surface or the second surface of described first substrate.
24, the manufacture method of electrothermal module as claimed in claim 23 is characterized in that,
Operation to described metal bond material heating is carried out after the operation to described resin-bonded material heating.
25, the manufacture method of electrothermal module as claimed in claim 23 is characterized in that,
To the operation of described metal bond material heating is the described metal bond material of heating under the state below described detector unit is positioned at described first substrate.
26, the manufacture method of electrothermal module as claimed in claim 23 is characterized in that,
Operation to described metal bond material heating makes the side flow of described metal bond material at described detector unit.
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| JP2008018209 | 2008-01-29 | ||
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| JP2008044114 | 2008-02-26 | ||
| JP2008076948 | 2008-03-25 | ||
| JP2009003067 | 2009-01-09 |
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| CN102130076A (en) * | 2010-12-25 | 2011-07-20 | 紫光股份有限公司 | Thermoelectric computer chip radiator |
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| CN113614936A (en) * | 2019-03-29 | 2021-11-05 | 京瓷株式会社 | Element substrate, light-emitting element module, and light-emitting device |
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