CN101489361A - Case having shielding function, manufacturing process thereof and electronic apparatus applying the same - Google Patents
Case having shielding function, manufacturing process thereof and electronic apparatus applying the same Download PDFInfo
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- CN101489361A CN101489361A CNA2008100039311A CN200810003931A CN101489361A CN 101489361 A CN101489361 A CN 101489361A CN A2008100039311 A CNA2008100039311 A CN A2008100039311A CN 200810003931 A CN200810003931 A CN 200810003931A CN 101489361 A CN101489361 A CN 101489361A
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- layer
- casing
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- shielding layer
- protective layer
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Abstract
The present invention provides a casing with shielding function, a manufacturing method thereof and an electronic device applying the casing. The electronic device is provided with at least one electronic component and one casing. The casing comprises a casing basic layer and a film. The film is formed integrated with the casing basic layer through an in-mold decorating working procedure, wherein, the film comprises a shielding layer for providing an electromagnetic protection function of electronic component.
Description
Technical field
The relevant a kind of casing of the present invention, and particularly relevant a kind of casing with electro-magnetic screen function.
Background technology
In recent years, because the progress of every mechanics of communication, manufacturer generally can pay attention to electromagnetic interference (ElectromagneticInterference, problem EMI) in research and development, when making electronic installation (for example all types of Portables or portable electric device etc.).Yet mostly the main flow electronic installation on the existing market is to emphasize to have characteristics such as light, thin, so the casing of general many these devices of plastic production with light weight of manufacturer.Because plastics are non-conducting materials, and the function of any electromagnetic protection of electronic installation can't be provided.
Traditionally, have the function of electromagnetic protection, be mostly after shell completes, the electronic building brick of one deck aluminium foil in order to protector inside is set in addition in the inner surface of casing for making electronic installation.Yet aluminium foil must therefore artificial contraposition attaches to the inner surface of casing again, makes production stage comparatively complicated and consuming time.
Summary of the invention
The purpose of this invention is to provide its electronic installation of a kind of protected type casing and manufacture method thereof and application, a shielding layer directly is integrated on the casing, so that casing itself has the function of electromagnetic protection.
The present invention proposes a kind of casing of tool function of shielding, and this casing is used for an electronic installation, and this electronic installation has at least one electronic building brick.Casing comprises a casing basic layer and a film, and wherein, film is integrally formed by an in-mold decoration operation and casing basic layer.Film comprises a shielding layer and a bonding coat, and bonding coat is in conjunction with casing basic layer and shielding layer, and shielding layer covers electronic building brick in order to provide the aforementioned electronic assembly one electromagnetic protection function.
The present invention proposes a kind of electronic installation in addition, and it comprises an at least one electronic building brick and a casing, and wherein, casing is to be covered in electronic building brick.Casing comprises a casing basic layer and a film, and wherein, film is integrally formed by in-mold decoration operation and casing basic layer.Film comprises a shielding layer and a bonding coat, and bonding coat is in conjunction with casing basic layer and shielding layer, and shielding layer covers electronic building brick in order to provide the aforementioned electronic assembly one electromagnetic protection function.
The present invention also proposes a kind of manufacture method of casing, is in order to processing a casing basic layer, and this manufacture method comprises: a film is provided, and wherein, film comprises a shielding layer and a bonding coat; And, by an in-mold decoration operation that film and casing basic layer is integrally formed, make bonding coat in conjunction with casing basic layer and shielding layer, to form a casing, wherein, shielding layer is in order to provide the electronic building brick electromagnetic protection function.
Its electronic installation of disclosed protected type casing of the embodiment of the invention and manufacture method thereof and application is integrated into shielding layer on the casing when making casing in the lump, so can make casing itself have the function of electromagnetic protection.In addition, in case the electronic building brick of protection unit inside, protected type casing of the present invention saves the step of artificial attaching aluminium foil, and is simplified manufacturing process compared to must one deck aluminium foil being set in addition at the inner surface of casing traditionally.
Description of drawings
For foregoing of the present invention can be become apparent, below conjunction with figs. is elaborated to preferred embodiment of the present invention, wherein:
Figure 1A illustrates the schematic diagram according to the electronic installation of preferred embodiment of the present invention.
Figure 1B illustrates the profile of the protected type casing part of Figure 1A.
The protected type casing that Fig. 2 illustrates Figure 1B has the profile of a dyed layer.
The protected type casing that Fig. 3 illustrates Fig. 2 has the profile of a design layer.
The protected type casing that Fig. 4 illustrates Fig. 3 has a profile from the paper tinsel layer.
Fig. 5 illustrates the flow chart according to the manufacture method of the protected type casing of preferred embodiment of the present invention.
Fig. 6 illustrates the flow chart of the film of making Figure 1B protected type casing.
Fig. 7 A to Fig. 7 B illustrates the schematic diagram that corresponding diagram 6 each step are made film.
Fig. 8 illustrates the flow chart of the film of construction drawing 2 protected type casings.
Fig. 9 A to Fig. 9 C illustrates the schematic diagram that corresponding diagram 8 each step are made film.
Figure 10 illustrates the flow chart of the film of construction drawing 3 protected type casings.
Figure 11 illustrates the flow chart of the film of construction drawing 4 protected type casings.
Figure 12 A to 12F illustrates the schematic diagram that each step of corresponding Figure 11 is made film.
Embodiment
Please refer to Figure 1A, 1B, Figure 1A illustrates the schematic diagram according to the electronic installation of preferred embodiment of the present invention, and Figure 1B illustrates the profile of the protected type casing part of Figure 1A.Electronic installation 10 comprises a protected type casing 100 and at least one electronic building brick 120, and wherein, protected type casing 100 is to be covered in electronic building brick 120.Protected type casing 100 comprises a casing basic layer 101 and a film 103, and wherein, film 103 is integrally formed by an in-mold decoration operation and casing basic layer 101.Film 103 comprises a shielding layer 105, and it can be one to have the material of conductivity or magnetic conductivity.Preferably, shielding layer 105 can be a metal level (for example being copper foil layer), in order to provide electronic building brick 120 1 electromagnetic protection functions.
Shown in Figure 1B, film 103 comprises that a bonding coat 107 is in order in conjunction with casing basic layer 101 and shielding layer 105.In addition, preferably, film 103 has a protective layer 109 in addition and is arranged on the shielding layer 105.Protective layer 109 can be with to prevent that shielding layer 105 can be with to prevent that shielding layer 105 from coming off.Protective layer 109 can be a transparent membrane.
In addition, consider the appearance design of electronic installation 10, preferably, can make protected type casing 100 present different colors or pattern design.
Please refer to Fig. 2, its protected type casing that illustrates Figure 1B has the profile of a dyed layer.Film 103 has a dyed layer 111 between shielding layer 105 and protective layer 109.Dyed layer 111 can be the printing ink with color, and making protected type casing 100 is one to have the shell of specific color.
Please refer to Fig. 3, its protected type casing that illustrates Fig. 2 has the profile of a design layer.Compared to Fig. 2, the film 103 among Fig. 3 has a design layer 113 between dyed layer 111 and protective layer 109.This design layer 113 is one to have the rete of pattern (for example be manufacturer own pictorial trademark) design, makes protected type casing 100 except having a specific background color, also has abundant and colorful outward appearance pattern design.
Though be directly design layer 113 to be arranged between dyed layer 111 and the protective layer 109 to explain in Fig. 3, yet the present invention is not limited thereto.In other embodiment, film 103 also can save the use of dyed layer 111, is to be arranged between shielding layer 105 and the protective layer 119 and only have a design layer 113.
In addition, please refer to Fig. 4, its protected type casing that illustrates Fig. 3 has a profile from the paper tinsel layer.Film 103 has one and is positioned on the protective layer 109 from paper tinsel layer 115.From paper tinsel layer 115 is a hard membrane layer (hard coat layer), and it is preferably the more outer position that is arranged at casing, makes whole protected type casing 100 have comparatively hard surface.Also can be arranged between other rete from paper tinsel layer 115, for example be between shielding layer 105 and the dyed layer 111, or between protective layer 119 and the design layer 113.In other embodiment, film 103 also can save the use of dyed layer 111 and design layer 113 on shielding layer 105, and only is provided with from paper tinsel layer 115 and protective layer 109.
The manufacture method of the following drawings explanation protected type casing.Please refer to Fig. 5, it illustrates the flow chart according to the manufacture method of the protected type casing of preferred embodiment of the present invention.The manufacture method of protected type casing comprises step S10 and S20.In step S10, a film is provided earlier, wherein, film comprises a shielding layer.Then in step S20, be by the in-mold decoration operation so that film and casing basic layer is integrally formed, to form a casing, wherein, shielding layer is in order to electromagnetic protection function to be provided.
In step S10, when making film, must determine the order that layers of material is made on the diaphragm according to the composition of film.Below the making of its film of protected type casing among explanation Figure 1B to Fig. 4 out of the ordinary.
Please refer to Fig. 6, Fig. 7 A to Fig. 7 B, Fig. 6 illustrates the flow chart of the film of making Figure 1B protected type casing, and Fig. 7 A to 7B illustrates the schematic diagram that corresponding diagram 6 each step are made film.Among Figure 1B, the film 103 of protected type casing 100 comprises bonding coat 107, shielding layer 105 and protective layer 109, when therefore making film, must on a diaphragm aforementioned each layer be formed one by one earlier.As shown in Figure 6, the making of film comprises step S61 and S62.
In step S61, shown in Fig. 7 A, form shielding layer 105 earlier on a diaphragm 300.Then enter step S62, shown in 7B figure, form again bonding coat 107 on shielding layer 105 to finish the making of film.Afterwards, be to make film and casing basic layer 101 (seeing Figure 1B) integrally formed.In this, the in-mold decoration operation can be the mould internal shaping (In-mold Forming, IMF) or in-mold transfer printing (In-mold Rolling, IMR) etc. mode is in order to make protected type casing 100.
With mould internal shaping (IMF) is example, the preferable membrane cutting that will be loaded with film earlier becomes suitable size, put into mould again, after the material (being generally plastics) for the treatment of casing basic unit 101 was sent into mould, the material of casing basic layer 101 can be shaped in mould and combine with film.The integrally formed mode of this kind is diaphragm 300 directly can be remained on the casing 100 to use as protective layer 109 (seeing Figure 1B).
In the film mode of transfer printing then with the mode of film internal shaping difference to some extent.In film during transfer printing, after film and casing basic layer 101 were integrally formed, diaphragm 300 can be peeled off and can't use as protective layer 109 from casing 100.
Please refer to Fig. 8, Fig. 9 A to Fig. 9 C, Fig. 8 illustrates the flow chart of the film of construction drawing 2 protected type casings, and Fig. 9 A to Fig. 9 C illustrates the schematic diagram that corresponding diagram 8 each step are made film.Among Fig. 2, the film 103 of protected type casing 100 comprises bonding coat 107, shielding layer 105, dyed layer 111 and protective layer 109, when therefore making film, must on diaphragm aforementioned each layer be formed one by one earlier.As shown in Figure 8, the making of film comprises step S81 to S83.
In step S81, shown in Fig. 9 A, form dyed layer 111 earlier on diaphragm 300.Then enter step S82, shown in Fig. 9 B, form shielding layer 105 again on dyed layer 111.Then, shown in step S83 and 9C figure, form bonding coat 107 on shielding layer 105, to finish the making of film.Then, be that film and casing basic layer 101 is integrally formed.Diaphragm 300 for example is directly to remain on the casing 100 as protective layer 109.
Please refer to Figure 10, it illustrates the flow chart of the film of construction drawing 3 protected type casings.Among Fig. 3, the film 103 of protected type casing 100 comprises bonding coat 107, shielding layer 105, dyed layer 111, design layer 113 and protective layer 109, when therefore making film, must on diaphragm aforementioned each layer be formed one by one earlier.In step S101, form design layer 113 earlier on a diaphragm (for example being protective layer 109), wherein, design layer 113 can be made by the mode of printing.Then shown in step S102, form dyed layer 111 on diaphragm 300.Then, enter step S103, form shielding layer 105 on dyed layer 111.Then, shown in step S104, form bonding coat 107 on shielding layer 105, to finish the making of film.Afterwards, again that film and casing basic layer 101 is integrally formed.
Please refer to Figure 11, Figure 12 A to Figure 12 F, Figure 11 illustrates the flow chart of the film of construction drawing 4 protected type casings, and Figure 12 A to Figure 12 F illustrates the schematic diagram that each step of corresponding Figure 11 is made film.Among Fig. 4, the film 103 of protected type casing 100 comprise bonding coat 107, shielding layer 105, dyed layer 111, design layer 113, protective layer 109 with from paper tinsel layer 115, when therefore making film, must first on diaphragm, aforementioned each layer be formed one by one.
Shown in step S111, form earlier and on diaphragm 300, (see Figure 12 A) from paper tinsel layer 115.Then in step S112, S113, form protective layer 109, form design layer 113 again and on protective layer 109, (see Figure 12 C) on paper tinsel layer 115, (seeing Figure 12 B).Shown in step S114 to S116, forming dyed layer 111 and (see Figure 12 D) on design layer 113 then, form shielding layer 105 again and (see Figure 12 E) on dyed layer 111, then, is to form bonding coat 107 (to see Figure 12 F) on shielding layer 105.Afterwards, be that film and casing basic layer 101 is integrally formed.Diaphragm 300 can directly remain on the casing 100 and as outermost protective layer, or peels off from casing 100.
Its electronic installation of disclosed protected type casing of the above embodiment of the present invention and manufacture method thereof and application is integrated into shielding layer on the casing when making casing in the lump, so can make casing itself have the function of electromagnetic protection.In addition, in case the electronic building brick of protection unit inside, protected type casing of the present invention saves the step of artificial attaching aluminium foil, and is simplified manufacturing process compared to must one deck aluminium foil being set in addition at the inner surface of casing traditionally.
In sum, though the present invention with the preferred embodiment exposure as above, yet it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when making various changes that are equal to or replacement, therefore, protection scope of the present invention is when looking being as the criterion that claims define.
Claims (23)
1. the casing of a tool function of shielding is used for an electronic installation, and described electronic installation has at least one electronic building brick, it is characterized in that, described casing comprises:
One casing basic layer; And
One film, integrally formed by an in-mold decoration operation and described casing basic layer, wherein said film comprises:
One shielding layer covers described electronic building brick in order to described electronic building brick electromagnetic protection function to be provided;
One bonding coat is in conjunction with described casing basic layer and described shielding layer.
2. casing according to claim 1 is characterized in that, described in-mold decoration operation is an in-molded operation.
3. casing according to claim 1 is characterized in that, described in-mold decoration operation is an in-mold transfer printing operation.
4. casing according to claim 1 is characterized in that described film also comprises a protective layer, covers described shielding layer.
5. casing according to claim 4 is characterized in that described film also comprises a dyed layer, is arranged between described shielding layer and the described protective layer, with so that described casing presents coloured silk of the same colour at least.
6. casing according to claim 4 is characterized in that described film also comprises a design layer, is arranged between described shielding layer and the described protective layer, with so that described casing presents at least one pattern.
7. casing according to claim 4 is characterized in that, described film also comprises one from the paper tinsel layer, is arranged at described protective layer surface.
8. casing according to claim 4 is characterized in that, described protective layer is a transparent film layer.
9. an electronic installation is characterized in that, comprising:
At least one electronic building brick; And
One casing covers described electronic building brick, and described casing comprises:
One casing basic layer; And
One film, integrally formed by an in-mold decoration operation and described casing basic layer, described film comprises a shielding layer and a bonding coat, shielding layer covers described electronic building brick in order to described at least one electronic building brick electromagnetic protection function to be provided, and described bonding coat is in conjunction with described casing basic layer and described shielding layer.
10. electronic installation according to claim 9 is characterized in that, described in-mold decoration operation is an in-molded operation.
11. electronic installation according to claim 9 is characterized in that, described in-mold decoration operation is an in-mold transfer printing operation.
12. electronic installation according to claim 9 is characterized in that, described film also comprises a protective layer, covers described shielding layer.
13. electronic installation according to claim 12 is characterized in that, described film also comprises a dyed layer, is arranged between described shielding layer and the described protective layer, with so that described casing presents coloured silk of the same colour at least.
14. electronic installation according to claim 12 is characterized in that, described film also comprises a design layer, is arranged between described shielding layer and the described protective layer, with so that described casing presents at least one pattern.
15. electronic installation according to claim 12 is characterized in that, described film also comprises one from the paper tinsel layer, is arranged on the described protective layer.
16. electronic installation according to claim 12 is characterized in that, described protective layer is a transparent film layer.
17. the manufacture method of a casing is characterized in that, comprising:
One film is provided, and described film comprises a shielding layer and a bonding coat; And
By an in-mold decoration operation that described film and described casing basic layer is integrally formed, make described bonding coat in conjunction with described casing basic layer and described shielding layer, to form a casing;
Wherein, described shielding layer can provide electromagnetic protection function.
18. manufacture method according to claim 17 is characterized in that, described film also comprises a protective layer.
19. manufacture method according to claim 18 is characterized in that, described film also comprises a dyed layer, and described dyed layer is located between described shielding layer and the described protective layer.
20. manufacture method according to claim 18 is characterized in that, described film also comprises a design layer, and described design layer is located between described shielding layer and the described protective layer.
21. manufacture method according to claim 18 is characterized in that, described film also comprises one from the paper tinsel layer, is arranged on the described protective layer.
22. manufacture method according to claim 17 is characterized in that, described in-mold decoration operation is an in-molded operation.
23. manufacture method according to claim 17 is characterized in that, described in-mold decoration operation is an in-mold transfer printing operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100039311A CN101489361A (en) | 2008-01-18 | 2008-01-18 | Case having shielding function, manufacturing process thereof and electronic apparatus applying the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100039311A CN101489361A (en) | 2008-01-18 | 2008-01-18 | Case having shielding function, manufacturing process thereof and electronic apparatus applying the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101489361A true CN101489361A (en) | 2009-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100039311A Pending CN101489361A (en) | 2008-01-18 | 2008-01-18 | Case having shielding function, manufacturing process thereof and electronic apparatus applying the same |
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| CN (1) | CN101489361A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683046A (en) * | 2017-10-30 | 2018-02-09 | 广东欧珀移动通信有限公司 | Method for producing shell, housing and electronic equipment |
-
2008
- 2008-01-18 CN CNA2008100039311A patent/CN101489361A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683046A (en) * | 2017-10-30 | 2018-02-09 | 广东欧珀移动通信有限公司 | Method for producing shell, housing and electronic equipment |
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Application publication date: 20090722 |