CN101487091A - Leadless free-cutting magnesium silicon brass - Google Patents
Leadless free-cutting magnesium silicon brass Download PDFInfo
- Publication number
- CN101487091A CN101487091A CNA2009100427237A CN200910042723A CN101487091A CN 101487091 A CN101487091 A CN 101487091A CN A2009100427237 A CNA2009100427237 A CN A2009100427237A CN 200910042723 A CN200910042723 A CN 200910042723A CN 101487091 A CN101487091 A CN 101487091A
- Authority
- CN
- China
- Prior art keywords
- brass
- cutting
- lead
- magnesium
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Conductive Materials (AREA)
- Silicon Compounds (AREA)
Abstract
The invention discloses a lead-free easy-cutting magnesium silicon brass, belonging to the manufacturing technology field of metal materials. The components of the brass comprise alloying elements, such as copper, zinc, silicon, magnesium, aluminum and the like, and the mass fractions of the elements are as follows: 58.0 percent to 80.0 percent of copper, 0.2 percent to 3.5 percent of magnesium, 0.2 percent to 3.5 percent of silicon and 0 to 0.6 percent of aluminum. The sum of the mass fractions of silicon and magnesium is 1.2 percent to 4.0 percent, the impurity amount is not more than 0.05 percent and the balance is zinc. The lead-free easy-cutting magnesium silicon brass is developed on the basis of the existing easy-cutting lead brass and Bi brass and aiming at the demand of brass parts for cutting process and the application environment of finished products. According to the demand for products containing lead at home and abroad, the lead brass is forced to be replaced by lead-free products. The magnesium silicon brass uses silicon and magnesium to replace lead, realizing the purpose of lead-free easy-cutting lead brass. The brass has good cutting and processing properties, has no cold shortness and hot shortness phenomena, can be used in fields, such as electrics and electronics, bathroom wares, toy devices and the like and can replace the existing easy-cutting lead brass and lead-free easy-cutting Bi brass.
Description
Technical field
The present invention is a kind of metallic substance, particularly a kind of leadless free-cutting magnesium silicon brass.
Background technology
Copper alloy containing lead has the performance of easy cutting and physics, chemistry, mechanics, is a widely used class copper alloy.Annual about 2,000,000 tons of the leaded brass output of China adds that township and village enterprises and private small business exclude the part of statistics, and the leaded brass quantity that is invested in society is far above this statistics tonnage.Be widely used for industries such as the dim bathroom of water, electrotechnical, electronic, instrument, clock and watch toy.After these leaded brass devices were scrapped, part was recovered utilization, but a big chunk, especially widget, often as the rubbish abandoned.Leaded brass can cause environmental pollution, be detrimental to health in production, use, removal process, thereby it uses the restriction that is subjected to strictness day by day.The U.S. requires leaching amount plumbous in the drinking water supply system 1.1 * 10 from August 6th, 1998
-3Below the %, leaded in the Japan regulation tap water in 2003 less than 0.03mg/L.The unleaded instruction of European Union comes into force on July 1st, 2006.And China correspondingly also carries out unleaded since on March 1st, 2007.The i.e. not solid solution of lead does not form intermetallic compound with copper in copper yet, and the lead under the effect of impurity in tap water and organic acid etc. in the copper alloy containing lead can slowly be separated out, and existing copper alloy containing lead is difficult to satisfy above-mentioned environmental protection requirement.In order to reduce plumbous deleterious effect, the scientific research personnel with regard to tap water to the mechanism of corrosion of brass and add element the corrosive effects of brass has been carried out systematic research, and taked multiple measure, as add the corrosion resisting property that alloying elements such as tin, nickel improve leaded brass, or suppress plumbous leaching, or the lead of soluble surface is removed chrome-faced then etc.Owing to exist lead all the time in the brass, these methods can't fundamentally be eliminated plumbous deleterious effect.For tackling this challenge, developed country has at first developed bismuth brass, and when adding bismuth, great majority have also added tin and nickel, and minority has also been added expensive selenium and other rare earth element.Because the resource of selenium, bismuth and rare earth element is very limited, and price is higher, cause the cost of bismuth brass high, bring bigger difficulty for its marketing.On the one hand, the processing characteristics of lead-free free-cutting bismuth brass is not good enough in addition, and the yield rate of foundry goods processing is reduced.A kind of novel non-leaded easily-cutting brass product of market demand with excellent machinability, the present invention will provide a kind of rare earth and expensive element of not adding for market, and cost is low and non-leaded easily-cutting brass that performance is high.
Integrate, existing free-cutting brass has following shortcoming: 1) not environmental protection of leaded brass; 2) bismuth brass adds the high-valency metal element usually, and cost is higher; 3) processing characteristics of bismuth brass is not good enough.
The present invention optimizes the microtexture of alloy by adjusting alloying constituent, makes alloy have good cutting ability, processing characteristics, eliminates the cold and hot fragility of alloy work in-process.
Summary of the invention
Problem such as the objective of the invention is to effectively solve leaded brass problem of environment pollution caused and bismuth brass composition height, processing characteristics is not good enough can provide a kind of leadless free-cutting magnesium silicon brass cheaply for industries such as the dim bathroom of water, electrotechnical, electronic, instrument, clock and watch toys.
Content of the present invention: the composition of non-leaded easily-cutting brass, copper (Cu) 58.0%~80.0%, magnesium (Mg) 0.2%~3.5%, silicon (Si) 0.2%~3.5%, aluminium (Al) 0~0.6%, but the massfraction sum of the massfraction of silicon and magnesium is 1.2%~4.0%, and total impurities is no more than 0.05%, and surplus is a zinc.
The preparation use frequency cored induction furnace of leadless free-cutting magnesium silicon brass of the present invention or medium-frequency induction furnace, resistance furnace.At first with the copper ingot fusing, then by composition proportion and order of addition(of ingredients), add aluminium block, copper-silicon master alloy, copper-magnesium master alloy and zinc ingot metal, tapping casting is prepared the cylindrical, copper alloy pig.Alloying constituent control: copper (Cu) 58.0%~80.0%, magnesium (Mg) 0.2%~3.5%, silicon (Si) 0.2%~3.5%, aluminium (Al) 0~0.6%, but the massfraction sum of the massfraction of silicon and magnesium is 1.2%~4.0%, and total impurities is no more than 0.05%, and surplus is a zinc.
Advantage of the present invention:
1) realize the unleaded of free-cutting brass, do not contained heavy metal lead in the alloying constituent, environmentally friendly, to HUMAN HEALTH.
2) cost is lower, and is suitable with easy cutting leaded brass cost, far below lead-free free-cutting bismuth brass.The alloying element magnesium that is added and the low price of silicon, wide material sources.High price such as bismuth-containing and rare earth element has not reduced the production cost of free-cutting brass.
3) good processability of leadless free-cutting magnesium silicon brass, thermoplasticity very good (the hot extrusion ratio is up to more than 70) does not have cold short phenomenon yet and occurs.
4) production technique is simple, can utilize existing leaded brass equipment to produce, and only needs it is carried out simple clean, does not need new facility investment.
The present invention is described in further detail with embodiment below.
Embodiment 1:
The composition of non-leaded easily-cutting brass, copper (Cu) 58.0%, magnesium (Mg) 1.0%, silicon (Si) 0.2%, aluminium (Al) 0.3%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 99% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 88%, and thermoplasticity good (the hot extrusion ratio is 85) does not have cold short phenomenon and occurs.
Implement example 2:
The composition of non-leaded easily-cutting brass, copper (Cu) 58.0%, magnesium (Mg) 0.5%, silicon (Si) 3.5%, aluminium (Al) 0.6%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 99% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 85%, and thermoplasticity good (the hot extrusion ratio is 90) does not have cold short phenomenon and occurs.
Embodiment 3:
The composition of non-leaded easily-cutting brass, copper (Cu) 80.0%, magnesium (Mg) 2.4%, silicon (Si) 0.6%, aluminium (Al) 0.5%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 111% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 93%, and thermoplasticity good (the hot extrusion ratio is 95) does not have cold short phenomenon and occurs.
Embodiment 4:
The composition of non-leaded easily-cutting brass, copper (Cu) 80.0%, magnesium (Mg) 2.0%, silicon (Si) 1.2%, aluminium (Al) 0.5%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 110% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 90%, and thermoplasticity good (the hot extrusion ratio is 92) does not have cold short phenomenon and occurs.
Embodiment 5:
The composition of non-leaded easily-cutting brass, copper (Cu) 69.0%, magnesium (Mg) 0.2%, silicon (Si) 2.0%, aluminium (Al) 0.4%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 103% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 83%, and thermoplasticity good (the hot extrusion ratio is 80) does not have cold short phenomenon and occurs.
Embodiment 6:
The composition of non-leaded easily-cutting brass, copper (Cu) 69.0%, magnesium (Mg) 1.6%, silicon (Si) 2.4%, aluminium (Al) 0.4%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 104% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 85%, and thermoplasticity good (the hot extrusion ratio is 85) does not have cold short phenomenon and occurs.
Embodiment 7:
The composition of non-leaded easily-cutting brass, copper (Cu) 62.0%, magnesium (Mg) 3.5%, silicon (Si) 0.5%, aluminium (Al) 0.2%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 101% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 95%, and thermoplasticity good (the hot extrusion ratio is 100) does not have cold short phenomenon and occurs.
Embodiment 8:
The composition of non-leaded easily-cutting brass, copper (Cu) 65.0%, magnesium (Mg) 0.8%, silicon (Si) 0.4%, aluminium (Al) 0.3%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 102% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 83%, and thermoplasticity good (the hot extrusion ratio is 75) does not have cold short phenomenon and occurs.
Embodiment 9:
The composition of non-leaded easily-cutting brass, copper (Cu) 72.0%, magnesium (Mg) 1.3%, silicon (Si) 0.8%, aluminium (Al) 0.4%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 106% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 88%, and thermoplasticity good (the hot extrusion ratio is 96) does not have cold short phenomenon and occurs.
Embodiment 10:
The composition of non-leaded easily-cutting brass, copper (Cu) 62.0%, magnesium (Mg) 3.0%, silicon (Si) 1.0%, aluminium (Al) 0.6%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 101% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 94%, and thermoplasticity good (the hot extrusion ratio is 96) does not have cold short phenomenon and occurs.
Embodiment 11:
The composition of non-leaded easily-cutting brass, copper (Cu) 60.0%, magnesium (Mg) 0.2%, silicon (Si) 1.0%, aluminium (Al) 0.2%, total impurities is no more than 0.05%, and surplus is zinc (Zn).Consider that market value, the production technique of each element carry out cost keeping, the alloy price is equivalent to 100% of HPb59-1, and far below bismuth brass, cutting ability is equivalent to 83%, and thermoplasticity good (the hot extrusion ratio is 70) does not have cold short phenomenon and occurs.
Claims (3)
1, a kind of magnesium silicon non-leaded easily-cutting brass that contains, it is characterized in that: the massfraction of alloying element is respectively, copper (Cu) 58.0%~80.0%, magnesium 0.2%~3.5%, silicon 0.2%~3.5%, aluminium 0~0.6%, the total amount of impurity is no more than 0.05%, surplus is a zinc, and wherein the content sum of silicon and magnesium is 1.2%~4.0%.
2. the magnesium silicon non-leaded easily-cutting brass that contains according to claim 1 is characterized in that the massfraction of alloying element is: copper 62.0%, and magnesium 3.5%, silicon 0.5%, aluminium 0.2%, total impurities is no more than 0.05%, and surplus is a zinc.
3. the magnesium silicon non-leaded easily-cutting brass that contains according to claim 1 is characterized in that the massfraction of alloying element is: copper 62.0%, and magnesium 3.0%, silicon 1.0%, aluminium 0.6%, total impurities is no more than 0.05%, and surplus is a zinc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2009100427237A CN101487091A (en) | 2009-02-25 | 2009-02-25 | Leadless free-cutting magnesium silicon brass |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2009100427237A CN101487091A (en) | 2009-02-25 | 2009-02-25 | Leadless free-cutting magnesium silicon brass |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101487091A true CN101487091A (en) | 2009-07-22 |
Family
ID=40890151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2009100427237A Pending CN101487091A (en) | 2009-02-25 | 2009-02-25 | Leadless free-cutting magnesium silicon brass |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101487091A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2570505A1 (en) * | 2010-05-14 | 2013-03-20 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
CN107164652A (en) * | 2017-04-28 | 2017-09-15 | 华南理工大学 | A kind of leadless free-cutting silicon magnesium phosphorus brass alloys and preparation method thereof |
CN107460365A (en) * | 2017-08-21 | 2017-12-12 | 上海理工大学 | A kind of silicon brass alloy of lead-free free-cutting containing aluminium |
US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
CN110938761A (en) * | 2019-12-31 | 2020-03-31 | 九牧厨卫股份有限公司 | Low-lead free-cutting magnesium brass alloy and preparation method thereof |
CN113061777A (en) * | 2021-03-25 | 2021-07-02 | 上海五星铜业股份有限公司 | Brass alloy and preparation method thereof |
CN114959354A (en) * | 2022-05-30 | 2022-08-30 | 安顺学院 | Steel-brass bimetallic material and manufacturing process and die thereof |
-
2009
- 2009-02-25 CN CNA2009100427237A patent/CN101487091A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2570505A1 (en) * | 2010-05-14 | 2013-03-20 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
EP2570505A4 (en) * | 2010-05-14 | 2014-08-06 | Mitsubishi Materials Corp | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
CN107164652A (en) * | 2017-04-28 | 2017-09-15 | 华南理工大学 | A kind of leadless free-cutting silicon magnesium phosphorus brass alloys and preparation method thereof |
CN107164652B (en) * | 2017-04-28 | 2020-09-22 | 华南理工大学 | Lead-free-cutting silicon-magnesium-phosphorus brass alloy and preparation method thereof |
CN107460365A (en) * | 2017-08-21 | 2017-12-12 | 上海理工大学 | A kind of silicon brass alloy of lead-free free-cutting containing aluminium |
CN110938761A (en) * | 2019-12-31 | 2020-03-31 | 九牧厨卫股份有限公司 | Low-lead free-cutting magnesium brass alloy and preparation method thereof |
CN113061777A (en) * | 2021-03-25 | 2021-07-02 | 上海五星铜业股份有限公司 | Brass alloy and preparation method thereof |
CN113061777B (en) * | 2021-03-25 | 2022-01-28 | 上海五星铜业股份有限公司 | Brass alloy and preparation method thereof |
CN114959354A (en) * | 2022-05-30 | 2022-08-30 | 安顺学院 | Steel-brass bimetallic material and manufacturing process and die thereof |
CN114959354B (en) * | 2022-05-30 | 2022-11-04 | 安顺学院 | Steel-brass bimetal material and manufacturing process and die thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101487091A (en) | Leadless free-cutting magnesium silicon brass | |
CN100595301C (en) | Free-cutting copper alloy material processing technique | |
CN101619404B (en) | Easy-cutting lead-free brass alloy for forging and preparation method thereof | |
CN101285137A (en) | Leadless and free-cutting brass containing magnesium and manufacturing method for manufactures | |
TWI550106B (en) | Low lead free bismuth no silicon brass alloy | |
CN101235448B (en) | Leadless free-cutting slicon graphite brass | |
CN102618747A (en) | Free cutting brass alloy | |
CN101440443A (en) | Dezincification corrosion resistant low-stibium aluminum yellow brass alloy and manufacturing method thereof | |
CN100460538C (en) | Bismuth-contained lead-free easy-to-cut zinc-white copper alloy | |
CN104923938A (en) | Multi-silver brazing filler metal containing manganese and tin and preparation method thereof | |
CN103484710A (en) | Bismuth brass alloy drawn bar containing trace rare earth and manufacture method thereof | |
CN103484712A (en) | Bismuth brass alloy drawn pipe containing trace rare earth and manufacture method thereof | |
CN103882255A (en) | Lead-free bronze alloy and application thereof | |
CN100408255C (en) | Cadmium-free silver solder containing indium and cerium | |
CN102477496A (en) | Method for preparing unleaded free-cutting brass | |
CN103421980B (en) | A kind of high-strength elastic brass and preparation method thereof | |
CN102400010A (en) | Lead-free free-cutting phosphorus-magnesium-calcium yellow brass alloy | |
CN100364713C (en) | Ag-Al-Cu-Ni-Sn series lead-free soldering tin | |
CN101709406B (en) | Manganese dioxide unleaded cutting brass and preparation method thereof | |
CN104195365A (en) | Low-lead brass alloy and preparing method thereof | |
CN101215653B (en) | Leadless free-cutting magnesium graphite brass | |
CN100496861C (en) | A tin-zinc selenium alloy welding flux | |
CN105195922A (en) | High-adhesion wear-resisting copper base alloy brazing material | |
CN101423905A (en) | Leadless free-cutting Sb-Mg brass alloys | |
CN102220514B (en) | Special low-lead copper alloy using silicon to replace lead for bathroom |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090722 |