CN101486242B - Method for manufacturing card - Google Patents
Method for manufacturing card Download PDFInfo
- Publication number
- CN101486242B CN101486242B CN2009100781984A CN200910078198A CN101486242B CN 101486242 B CN101486242 B CN 101486242B CN 2009100781984 A CN2009100781984 A CN 2009100781984A CN 200910078198 A CN200910078198 A CN 200910078198A CN 101486242 B CN101486242 B CN 101486242B
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- Prior art keywords
- card
- inner casing
- mold insert
- injection
- flexible
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000002347 injection Methods 0.000 claims abstract description 48
- 239000007924 injection Substances 0.000 claims abstract description 48
- 238000001746 injection moulding Methods 0.000 claims abstract description 43
- 229920003023 plastic Polymers 0.000 claims abstract description 37
- 239000004033 plastic Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 17
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 3
- 238000010061 rubber shaping Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 4
- 230000001413 cellular effect Effects 0.000 abstract 1
- 239000004568 cement Substances 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Credit Cards Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a method for manufacturing a plastic card provided with a flexible built-in part, which comprises the following steps: manufacturing an inner shell provided with a positioning edge or a positioning post; putting the card built-in part into the inner shell, and utilizing the positioning edge or the positioning post of the inner shell to position the built-in part in the inner shell transversely; clinging the built-in part to the inner shell, and positioning the built-in part longitudinally; and putting the inner shell provided with the built-in part into an injection mold, and utilizing a plastic material to carry out injection molding so as to obtain the card. Furthermore, the injection mold adopts an exhaust steel material or a cellular part embedding structure in a thinner area of a plastic layer corresponding to the injection molding card, and has a pneumatic card push-out structure. The invention provides a method for manufacturing the card provided with the flexible built-in part by using plastic raw material injection molding and adopting the injection molding process, such as novel intelligent cards including flexible batteries, flexible displays and flexible keys, thereby guaranteeing the performance of novel card products provided with the flexible built-in parts.
Description
Technical field
The present invention relates to plastic cement card field, relate in particular to a kind of manufacture method that the plastic cement card of flexible inlaid pieces is arranged.
Background technology
The package fabrication process of tradition plastic cement card (for example smart card) adopts PVC (Polyvinylchlorid, polyvinyl chloride) or PET (polyester, polyester) the heat lamination method of plastic sheeting such as, generally be about 135 ℃, under the 5-6MPa pressure, plastic sheeting is merged securely, finish the encapsulation of card and make.But this manufacturing process that is used for traditional plastic cement card can't be directly used in the novel card series products of flexible inlaid pieces, inventor's disclosed a kind of flexible battery that comprises in patent application " smart card and smart card user identity authentication process thereof " for example, be installed in the intelligent card chip on the flexible PCB, flexible input unit, the novel smart card of flexible display apparatus etc., electronic devices and components and flexible display in this novel card can be damaged under high temperature and high pressure, and, can not be well combine with plastic material such as PVC because its material that adopts is different with the physical property of plastic material.In the prior art, making has the flexible inlaid pieces card series products of (for example comprising flexible active circuit and flexible display), particularly makes the novel smart card that flexible inlaid pieces is arranged that meets the ISO7816/ISO7810 standard, fails to break through on manufacturing process always.There is not to make the technical scheme of novel card in the prior art, the technical scheme that the volume production that does not especially have realization to have the novel smart card product of flexible inlaid pieces is made with flexible inlaid pieces.
Summary of the invention
At having the novel card series products of flexible units such as flexible active circuit, flexible display not have feasible fabrication scheme for interior in the prior art, the invention provides a kind of card manufacturing method, comprising:
1) makes inner casing;
2) described inner casing has gulde edge or reference column, and mold insert in the card is placed in the described inner casing, utilizes described gulde edge or reference column that the interior mold insert in the described inner casing is carried out located lateral; Mold insert in described is close in the described inner casing, mold insert in described is carried out longitudinal register;
3) the described inner casing that described interior mold insert is housed is placed in the injection mold, adopts plastic material to carry out injection moulding, obtain described card.
Further, adopt plastic rubber shaping to make described inner casing.Further, adopt the method for glue stickup or Electrostatic Absorption that mold insert in described is close on the described inner casing.
Further, described injection mold adopts exhaust steel material or adopts lattice mold insert structure in the plastic layer thinner region of the described card of corresponding injection moulding; The described inner casing that described interior mold insert is housed is placed in the injection mold, make the plastic layer thinner region of the described card of injection moulding be positioned at the employing exhaust steel material of described injection mold or the zone of adopting lattice mold insert structure, and described inner casing is positioned in the described injection mold.
Further, the plastic layer thinner region of described card is the battery of interior mold insert of described card and the zone at display place.Further, adopt the method for vacuum suction or Electrostatic Absorption that the described inner casing that described interior mold insert is housed is positioned in the described injection mold.
Further, described injection mold has pneumatic card ejecting structure; After injection moulding is finished, utilize described pneumatic card ejecting structure that card is ejected described injection mold, obtain described card.Further, described pneumatic card ejecting structure is to dredge air tube or funnel air blowing structure.Further, obtain card after, described card the surface directly the printing printed layers.
The invention provides a kind of card manufacturing method, adopt Shooting Technique, use plastic cement raw material injection molding technology to realize the manufacturing of the card of flexible inlaid pieces, the novel smart card that for example comprises flexible battery, flexible active circuit plate and flexible display, guaranteed to have the performance of the novel card series products of flexible inlaid pieces, for the extensive application of novel smart card provides good manufacturing technology basis.
Description of drawings
Fig. 1 is the cutaway view of injection mold of the employing lattice mold insert structure of one embodiment of the invention;
Fig. 2 is the vertical view of injection mold of the employing lattice mold insert structure of one embodiment of the invention;
Fig. 3 is the cutaway view of the injection mold with funnel air blowing structure of one embodiment of the invention;
Fig. 4 is the structural representation of the flexible inlaid pieces of one embodiment of the invention;
Fig. 5 is the inner casing structural representation with gulde edge or reference column of one embodiment of the invention;
Fig. 6 is the card injection moulding manufacturing flow chart of one embodiment of the invention.
The specific embodiment
The present invention uses plastic cement raw material injection molding technology, adopt conventional Shooting Technique to finish the manufacturing of card through transformation, the novel smart card that meets the ISO7816/7810 standard with manufacturing is an example below, reaches the specific embodiment in conjunction with the accompanying drawings technical solution of the present invention is described in further detail.
Adopt conventional injection mold, process for the sheet product injection moulding, the thinlyyest can only accomplish 0.18 millimeter, and for the interior card series products injection moulding processing that assemblies such as flexible battery and flexible display are arranged, the front of flexible display correspondence and the plastic layer of bottom surface are thinner, the thickness in thin zone can reach 0.1 millimeter (mm) or thinner, and the front of flexible battery correspondence and the plastic layer of bottom surface are also thinner.The present invention makes the injection mold that uses in the process in blocking and adopts exhaust steel material or adopt lattice mold insert structure in the above-mentioned injection moulding card of correspondence plastic layer thinner region, be beneficial to the thin injection moulding zone exhaust of corresponding card plastic layer, make framed exhaust unimpeded, plastic body resistance minimum, it is smooth and easy to flow.Fig. 1 is the cutaway view of injection mold of the employing lattice mold insert structure of one embodiment of the invention, Fig. 2 is the vertical view of injection mold of the employing lattice mold insert structure of one embodiment of the invention, as depicted in figs. 1 and 2, injection mold is 11 and 12 employing lattice mold insert structures in the zone, be beneficial to exhaust in injection moulding process, the zone at flexible battery place in the 11 corresponding injection moulding smart cards of zone, the zone at flexible display place in the 12 corresponding injection moulding smart cards of zone.
Adopt conventional injection mold, after injection moulding is finished, can produce the thimble impression when injecting products ejects mould.Card produces the thimble seal when ejecting from injection mold after the card injection moulding is finished, and on Injection Mold Design, injection mold has pneumatic ejecting structure, has dual mode can realize pneumatic ejecting structure: dredge air tube or funnel air blowing structure.Fig. 3 is the cutaway view of the injection mold with funnel air blowing structure of one embodiment of the invention, as shown in Figure 3, the 31st, funnel air blowing structure.
In injection moulding process, to having the Shooting Technique of interior mold insert (Inlay), conventional method is interior mold insert directly to be put into injection mold locate, and finishes the product manufacturing by an injection moulding.Fig. 4 is the structural representation of the flexible inlaid pieces of one embodiment of the invention, as shown in Figure 4, for interior mold insert is the injection moulding card that ultrathin flexible circuit board 43 connects flexible battery 41 and ultrathin flexible display 42, if adopt this conventional method, interior mold insert is directly put into mould locatees, finish the manufacturing of card by an injection moulding, in the injection moulding processing procedure, mould-injection is known from experience big pressure and injection moulding speed, because being the ultrathin flexible circuit board, interior mold insert connects flexible battery and ultrathin flexible display, it is the combination that flexibly connects of flexible material, can't realize longitudinal register and located lateral, under the effect of injection pressure, flexible PCB in the interior mold insert, flexible battery and flexible display all might depart from due position, after injection moulding was finished, the interior mold insert in the card can not place the card intermediate layer, the outer card face that be exposed at of mold insert even meeting in the part.
In order to solve the orientation problem of flexible inlaid pieces in the card, as shown in Figure 6, the present invention adopts following card manufacturing step:
1) adopt the plastic rubber shaping manufacturing to have the inner casing of gulde edge or reference column; Fig. 5 is the band gulde edge of one embodiment of the invention or the inner casing structural representation of reference column, as shown in Figure 5, the 51st, the gulde edge of inner casing or reference column, the 52nd, other zone of inner casing, the 53rd, the zone of placement flexible inlaid pieces in the inner casing; Inner casing is an injection moulded products, and size is very accurate;
2) interior mold insert is placed in the inner casing of above-mentioned band gulde edge or reference column, carries out located lateral by gulde edge in the inner casing or the internal mold insert of reference column; As shown in Figure 5, interior mold insert shown in Figure 4 is put in 53 places, position of inner casing.In one embodiment of the invention, corresponding area depression of placing flexible battery, flexible display and flexible PCB in inner casing, the degree of depth of depression and the thickness of flexible battery, flexible display and flexible PCB are complementary, and these relative projections in regional marginal portion, form gulde edge or reference column, when interior mold insert was placed in the inner casing, gulde edge or reference column played the effect of located lateral; In another embodiment of the present invention, inner casing has uniform thickness, at the corresponding edge of placing the zone of flexible battery, flexible display and flexible PCB of inner casing projection is arranged, form gulde edge or reference column, when interior mold insert was placed in the inner casing, gulde edge or reference column played the effect of located lateral;
3) make and fasten with glue or the method for Electrostatic Absorption is close to interior mold insert on the inner casing, finish the longitudinal register of internal mold insert;
4) inner casing of mold insert in being equipped with is put into injection mold, adopt plastic material to carry out injection moulding; As previously mentioned, in one embodiment of the invention, injection mold is in the thin zone of the plastic layer of corresponding injection moulding card, for example be placed with the zone of flexible battery and flexible display in the card, adopt exhaust steel material or adopt lattice mold insert structure, be beneficial to the thin injection moulding zone exhaust of card plastic layer in the injection moulding process, make framed exhaust unimpeded, plastic body resistance minimum, it is smooth and easy to flow, therefore when the inner casing of mold insert in being equipped with is put into above-mentioned injection mold, make the plastic layer thinner region of injection moulding card be positioned at the employing exhaust steel material of injection mold or the zone of adopting lattice mold insert structure, and the inner casing of mold insert in being equipped with is positioned in the injection mold.As depicted in figs. 1 and 2, the flexible battery assembly of interior mold insert is positioned at the zone 11 in the injection mold, and the flexible display assembly is positioned at the zone 12 in the injection mold.
Wherein, further inner casing is positioned in the injection mold in the step 4) by following two kinds of methods:
The one, the vacuum suction method utilizes negative-pressure vacuum absorption to allow inner casing be positioned in injection mold framed;
The 2nd, the Electrostatic Absorption method, when mould was handled, the generation of static electricity machine added positive Electrostatic Treatment to the injection mold of fixing inner casing framed, and inner casing is added negative Electrostatic Treatment, when inner casing is installed on the mould like this, just/to bear static to inhale mutually, inner casing firmly is positioned in the injection mold.
Make the injected plastics material of card and select PVC (Polyvinylchlorid, polyvinyl chloride), ABS (acrylonitrile-BS), PC (polycarbonate) and PE conventional plastic cement raw material such as (polyethylene) for use.
The injection molding machine that the card injection moulding is used is selected common machines, high speed machines or high speed and high pressure machine as required for use.
After injection moulding is finished; utilize the pneumatic ejecting structure of injection mold that card is ejected from injection mold; carry out the printing of injection moulding card card face then; existing conventional fabrication printed layers does not directly expose, and at card face about 0.06 millimeter transparent protective film protection printed layers to 0.08 millimeters thick is arranged all.Injection moulding card printing of the present invention and conventional fabrication are printed with difference, and injection moulding card printing layer is printed directly on card face, therefore the wearability of printed layers are had relatively high expectations.The injection moulding card printing can adopt omnipotent transfer printing, hot transfer printing, water transfer printing or silk-screen to finish.
Adopt existing ISO7816 standard technology to finish at last and fit etc., finish the manufacturing of card towards bonding, the contact IC of word, magnetic stripe.
Need to prove; the above only is the preferable specific embodiment of the present invention; rather than to the qualification of technical solution of the present invention; anyly be familiar with those of ordinary skills of this technology in the suggested technical scope of the present invention; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (9)
1. a card manufacturing method is characterized in that, comprises step:
1) makes inner casing;
2) described inner casing has gulde edge or reference column, and mold insert in the card is placed in the described inner casing, utilizes described gulde edge or reference column that the described interior mold insert in the described inner casing is carried out located lateral; Mold insert in described is close on the described inner casing, mold insert in described is carried out longitudinal register;
3) the described inner casing that described interior mold insert is housed is placed in the injection mold, adopts plastic material to carry out injection moulding, obtain described card.
2. the method for claim 1 is characterized in that, adopts plastic rubber shaping to make described inner casing.
3. the method for claim 1 is characterized in that, adopts the method for glue stickup or Electrostatic Absorption that mold insert in described is close on the described inner casing.
4. the method for claim 1 is characterized in that, described injection mold adopts exhaust steel material or adopts lattice mold insert structure in the plastic layer thinner region of the described card of corresponding injection moulding; The described inner casing that described interior mold insert is housed is placed in the injection mold, make the plastic layer thinner region of the described card of injection moulding be positioned at the employing exhaust steel material of described injection mold or the zone of adopting lattice mold insert structure, and described inner casing is positioned in the described injection mold.
5. method as claimed in claim 4 is characterized in that, the plastic layer thinner region of described card is the battery of interior mold insert of described card and the zone at display place.
6. method as claimed in claim 4 is characterized in that, adopts the method for vacuum suction or Electrostatic Absorption that the described inner casing that described interior mold insert is housed is positioned in the described injection mold.
7. as claim 1 or 4 described methods, it is characterized in that described injection mold has pneumatic card ejecting structure; After injection moulding is finished, utilize described pneumatic card ejecting structure that card is ejected described injection mold, obtain described card.
8. method as claimed in claim 7 is characterized in that, described pneumatic card ejecting structure is to dredge air tube or funnel air blowing structure.
9. the method for claim 1 is characterized in that, further comprises: after obtaining card, directly print printed layers on the surface of described card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100781984A CN101486242B (en) | 2009-02-26 | 2009-02-26 | Method for manufacturing card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100781984A CN101486242B (en) | 2009-02-26 | 2009-02-26 | Method for manufacturing card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101486242A CN101486242A (en) | 2009-07-22 |
| CN101486242B true CN101486242B (en) | 2011-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100781984A Active CN101486242B (en) | 2009-02-26 | 2009-02-26 | Method for manufacturing card |
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| Country | Link |
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| CN (1) | CN101486242B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103034885A (en) * | 2011-10-10 | 2013-04-10 | 航天信息股份有限公司 | Active card and manufacturing method thereof |
| WO2018132351A1 (en) * | 2017-01-10 | 2018-07-19 | Entrust Datacard Corporation | Card printing using thermal transfer print ribbon with radiation curable ink |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100999124A (en) * | 2006-01-09 | 2007-07-18 | 睿颖科技股份有限公司 | Method of manufacturing microstorage card and its mould device |
| CN101024301A (en) * | 2007-04-02 | 2007-08-29 | 林志祥 | In-mould-decoration-piece moulding inlaying-piece technology |
-
2009
- 2009-02-26 CN CN2009100781984A patent/CN101486242B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100999124A (en) * | 2006-01-09 | 2007-07-18 | 睿颖科技股份有限公司 | Method of manufacturing microstorage card and its mould device |
| CN101024301A (en) * | 2007-04-02 | 2007-08-29 | 林志祥 | In-mould-decoration-piece moulding inlaying-piece technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101486242A (en) | 2009-07-22 |
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Effective date of registration: 20120717 Address after: 215200, C building, 2 floor, Wujiang science and Technology Pioneer Park, 2358 Changan Road, Wujiang, Jiangsu Patentee after: HIERSTAR (SUZHOU) CO., LTD. Address before: 100102, room 2205, Jinyu international C, 48 West Road, Chaoyang District, Beijing, Wangjing Patentee before: Beijing HierStar Technology Co., Ltd. |
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