CN101486094B - Oxidation-resistant micro copper powder and electroconductive slurry with the same - Google Patents
Oxidation-resistant micro copper powder and electroconductive slurry with the same Download PDFInfo
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- CN101486094B CN101486094B CN2008100520797A CN200810052079A CN101486094B CN 101486094 B CN101486094 B CN 101486094B CN 2008100520797 A CN2008100520797 A CN 2008100520797A CN 200810052079 A CN200810052079 A CN 200810052079A CN 101486094 B CN101486094 B CN 101486094B
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Abstract
The invention relates to antioxidative superfine copper powder and conductive slurry provided with the antioxidative superfine copper powder. The antioxidative superfine copper powder comprises a superfine copper powder part and an antioxidative membrane, wherein the superfine copper powder part is provided with an outside surface which is near spherical and an outside diameter which is less than 1 micron; the composition of the antioxidative membrane is ascorbic acid; and the antioxidative membrane is generally and uniformly adhered to the outside surface. The conductive slurry provided with the antioxidative superfine copper powder comprises the antioxidative superfine copper powder, glass powder, a resin solvent, bismuth powder, zinc powder and vanadic oxide. The antioxidative superfine copper powder and the conductive slurry provided with the antioxidative superfine copper powder have the advantages of antioxidation of the superfine copper powder, low firing temperature, incapability of reducing the electrical characteristics of products during soldering, and low cost.
Description
Technical field
The present invention relates to a kind of oxidation-resistant micro copper powder and have the conductive paste of oxidation-resistant micro copper powder.
Background technology
The electric capacity of existing ceramic electronic product mainly is to burn respectively on the two sides of potsherd (insulator) to pay an electrode, for example:
1. ceramic capacitor;
2. semiconductor capacitor;
3. surge absorber (varistor, for example ZnO
2);
4. thermistor (thermistor, NTC for example, PTC etc.);
5. the ceramic material of iron oxide;
6. the ignition plug of piezoelectric material (plug);
7. the ticker of piezoelectric material.
Common product adopts silver electrode mostly, and it can each burns the silver electrode of paying a film shape prior to the two sides of an insulator on making, wait to burn pay finish after, in carrying out the scolding tin process, utilize a scolder that a pair of extension pin is welded in this on the silver electrode, promptly finish.
And the shortcoming of silver electrode is:
1, cost height.The price of silver is very high, so it is also very high to adopt silver powder to burn the material cost of paying into silver electrode; Secondly, because the high temperature resistant solderability of silver electrode is poor, when carrying out the scolding tin process, silver electrode is easily corroded (being commonly called as " erosion silver ") and makes and the thickness attenuation of silver electrode if use as electric capacity, will make capacitance reduce by scolder; If want head it off, can in the tin of scolder, add the silver of 2.0wt% to 3.5wt% and the copper of 0.5wt% to 1.0wt% again, and the scolding tin temperature is controlled at 250 ℃.Yet the silver that adds 2.0wt% to 3.5wt% also must make whole cost rise, and particularly in the product of low unit price, slight cost increase promptly has a strong impact on the market competitiveness.
2, burn a pair temperature height.The burning of conventional silver electrode is paid temperature between 650 ℃ to 800 ℃, because temperature is higher, consumes energy also higher relatively (power consumption height), and the easy interior material structure that destroys original insulator of 650 ℃ to 800 ℃ high temperature, and then influence its electrical characteristic.
3, the scolding tin process reduces the electrical characteristic of product.Can find displacement phenomenon (point discharge) when traditional silver electrode is carried out the test of electrical characteristic after the scolding tin process, this moment silver electrode thickness attenuation and surface texture injustice, the situation of point discharge is arranged during test, its electrode characteristic is reduced.
4, withstand voltage bad.The conventional silver electrode can be because of producing displacement phenomenon (point discharge), and withstand voltage bad problem takes place.
If adopt copper then can reduce cost, but need to consider the density of electrode as electrode; In simple terms, general copper burns a pair temperature and is about 800 ℃, if density is not good, then scolding tin can permeate this electrode, electrical characteristic and terminal intensity are weakened, and copper is base metal, 1 micron to 10 microns copper powder and the copper powder below 1 micron, oxidized easily in burning the process of paying, in order to prevent the generation of oxidative phenomena, pay so must in neutral atmosphere air mass, burn, but copper burns in the atmosphere air mass of high temperature and pays, lure the plain cognition of electric body chinaware to be reduced, and electrical characteristic also can change.
So, the method of the anti-oxidation of traditional copper: be to mix boric acid with copper powders may, ketone is and is hydrocarbon is equal solvent, its embodiment can be: 1 micron to 5 microns copper powders may, to the boric acid of boric acid with atomic weight conversion 0.01wt% to 0.1wt%, be no more than its degree of saturation, add ketone system or hydrocarbon system or aromatic series equal solvent again, filling part with copper powder mixes, make solvent evaporates via a drying program, form one and have the copper powders may of anti-oxidation characteristics, but 0.01 to 0.1wt% boric acid, the management of its addition is not easy, and the resistance that the residual volume in the conductive paste can influence electrode rises.
In addition, if copper powder is easy to generate chemical change when preventing oxidation with boric acid, though solvent evaporates after drying, (for example: defective insulation) still can influence its electrical characteristic.
Certainly, it is 600 ℃ to 800 ℃ that the burning of the electrocondution slurry of copper is paid temperature, and uses unleaded scolding tin in recent years, can make the scolding tin temperature improve, and causes solderability and intensity not good.
Therefore, be necessary to research and develop new product, to solve above-mentioned shortcoming and problem.
Summary of the invention
Technical problem underlying to be solved by this invention is, overcome the above-mentioned defective that prior art exists, and a kind of oxidation-resistant micro copper powder is provided and has the conductive paste of oxidation-resistant micro copper powder, it has the effect that prevents the fine copper powder oxidation, and it is low to have burning pair temperature, the scolding tin process can not reduce the electrical characteristic of product, and the low advantage of cost.
Oxidation-resistant micro copper powder of the present invention is:
A kind of oxidation-resistant micro copper powder is characterized in that comprising: a fine copper powder portion, and an outer surface and an external diameter with an almost spherical, and external diameter is less than 1 micron; One oxidation barrier film, its composition are ascorbic acid (C
6H
8O
6), and be attached to uniformly on this outer surface substantially.
Aforesaid oxidation-resistant micro copper powder, wherein the composition of oxidation barrier film comprises dibutyl hydroxy toluene (C again
15H
24O).
The conductive paste that the present invention has the oxidation-resistant micro copper powder is:
A kind of conductive paste with oxidation-resistant micro copper powder is characterized in that comprising: an oxidation-resistant micro copper powder; Have a fine copper powder portion and an oxidation barrier film, this fine copper powder portion has the outer surface and an external diameter of an almost spherical, and this external diameter is less than 1 micron, and the composition of this oxidation barrier film is an ascorbic acid, and is attached to uniformly on this outer surface substantially;
One glass powder;
One resin solvent;
One bismuth meal end;
One zinc powder;
First Five-Year Plan oxygen two vanadium.
Aforesaid conductive paste with oxidation-resistant micro copper powder, wherein the composition of oxidation barrier film comprises dibutyl hydroxy toluene (C again
15H
24O).
Aforesaid conductive paste with oxidation-resistant micro copper powder, wherein resin solution is the ethyl cellulose acrylic resin.
The invention has the beneficial effects as follows that it has the effect that prevents the fine copper powder oxidation, and it is low to have burning pair temperature, the scolding tin process can not reduce the electrical characteristic of product, and the low advantage of cost.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic diagram of oxidation-resistant micro copper powder of the present invention
Fig. 2 is the schematic diagram that the anti-oxidant solution of oxidation-resistant micro copper powder of the present invention is made
Fig. 3 is the schematic diagram of the making of oxidation-resistant micro copper powder of the present invention
Fig. 4 is the making schematic diagram with conductive paste of oxidation-resistant micro copper powder of the present invention
Fig. 5 is the schematic diagram that the conductive paste with oxidation-resistant micro copper powder of the present invention is coated on this insulator
Fig. 6 is that the conductive paste with oxidation-resistant micro copper powder of the present invention burns the schematic diagram of paying into electrode
Fig. 7 is the schematic diagram of application examples of the present invention
Fig. 8 is the cross-sectional schematic of application examples shown in Figure 7
The number in the figure explanation:
10 oxidation-resistant micro copper powders
100 have the conductive paste of oxidation-resistant micro copper powder
11 fine copper powder portions, 111 outer surfaces
12 oxidation barrier films, 15 anti-oxidant solution
151 anti-oxidant powder 152 alcohol
20 glass powders, 30 resin solvents
40 bismuth meals end, 50 zinc powders
60 5 oxygen, two vanadium, 71 insulators
80 burn pair device 90 electrodes
91 scolding tin, 92 metal extension lines
The insulator W2 that W1 scribbles conductive paste has the insulator of electrode
The D external diameter
The specific embodiment
As shown in Figure 1, a kind of oxidation-resistant micro copper powder 10, it comprises: a fine copper powder portion 11, an outer surface 111 and an outer diameter D with an almost spherical, and this outer diameter D is less than 1 micron (photo in kind sees also the picture A (multiplying power is * 20000) and the photo B (multiplying power is * 10000) of annex one);
One oxidation barrier film 12, its composition are ascorbic acid (C
6H
8O
6) (claiming Vitamin C again), and be attached to uniformly substantially on this outer surface 111.
In fact, as shown in Figure 2, one anti-oxidant powder 151 and an alcohol 152 are mixed into an anti-oxidant solution 15 (this anti-oxidant powder 151 is to be dissolved in this alcohol 152), again this fine copper powder portion 11 is added in this anti-oxidant solution 15 (as shown in Figure 3), after making this alcohol 152 volatilizations (for example in heating under 55 ℃ the temperature 30 minutes) via a drying program, anti-oxidant powder 151 formation after this dissolving evenly are attached to the oxidation barrier film 12 on the outer surface 111 of this fine copper powder portion 11.
As shown in Figure 4, a kind of conductive paste 100 with oxidation-resistant micro copper powder, it comprises:
One oxidation-resistant micro copper powder 10, have a fine copper powder portion 11 and an oxidation barrier film 12 (consulting Fig. 1), this fine copper powder portion 11 has the outer surface 111 and an outer diameter D of an almost spherical, and this outer diameter D is less than 1 micron, and the composition of this oxidation barrier film 12 is an ascorbic acid, and is attached to uniformly on this outer surface 111 substantially;
One glass powder 20 is the ethyl cellulose acrylic resin;
One resin solvent 30;
One bismuth meal end 40;
One zinc powder 50;
First Five-Year Plan oxygen two vanadium 60.
In more detail, conductive paste 100 with oxidation-resistant micro copper powder is the oxidation-resistant micro copper powder 10 with 100wt%, the ethyl cellulose of 0.2wt% to 10wt%, the glass powder 20 of 2.0wt% to 20wt%, the bismuth meal end 40 of 0.1wt% to 2.0wt%, the zinc powder 50 of 0.1wt% to 2.0wt%, five oxygen, two vanadium 60 and an amount of DEGMBE (butylcarbitol of 0.1wt% to 1.0wt%, be called for short B.C. or BC) solvent, through three rollers, finish this conductive paste with oxidation-resistant micro copper powder 100.
This conductive paste 100 with oxidation-resistant micro copper powder can be applicable to electrode structure, as shown in Figure 5, this conductive paste 100 with oxidation-resistant micro copper powder (for example: on two sides pottery) is coated on an insulator 71 in the mode of screen painting, after becoming the insulator W1 that scribbles conductive paste in three minutes with 150 ℃ temperature dryings, this insulator W1 that scribbles conductive paste is burnt pair device 80 (as shown in Figure 6 with one, wherein, this burning is paid device 80 and be can be nitrogen furnace, and nitrogen about 99.9%) burn and pay that (this oxidation barrier film 12 can be decomposed in the time of 190 ℃ to 192 ℃, so can be after burn paying) because of the residual quality that influences, this conductive paste with oxidation-resistant micro copper powder 100 is attached on the two sides of this insulator 71 and forms an electrode 90 (as shown in Figures 7 and 8) respectively, and this insulator W1 that scribbles conductive paste becomes an insulator W2 with electrode, and can be respectively to two electrodes 90 (scolder is a scolding tin 91) metal extension line 92 of burn-oning respectively, promptly become an electric capacity; In addition, this electrode 90 and this scolding tin 91 can effective function, and this glass powder 20 produces total metal with copper powder and be connected with this insulator 71, and have enough adhesive strengths; And oxidized bismuth meal end 40 and zinc powder 50 (forming bismuth oxide and zinc oxide respectively), composition to this glass powder 20 is had no effect, 60 of vanadic anhydrides between copper powder and insulator 71 (its bond strength upwards) and produce the effect that links.
Certainly, because this conductive paste 100 with oxidation-resistant micro copper powder contains oxidation-resistant micro copper powder 10, its activity is very high, can (for example: ceramic) surface produces chemical bond with insulator 71, and intensity is improved, so, can carry out between 480 ℃ to 680 ℃ that low temperature burn to be paid and form electrode 90, its solderability is good, then degree strong and and 71 of insulators good tight ness rating is arranged.
Certainly, the composition of this oxidation barrier film 12 also can comprise dibutyl hydroxy toluene (Butylated hydroxytoluene, C again
15H
24O), its consumption generally is about 0.3wt% to 1wt%.In other words, aforesaid oxidation barrier film 12 (or anti-oxidant powder 151) can be:
The ascorbic acid that [a] is simple; Or
The mixture of [b] ascorbic acid and dibutyl hydroxy toluene.
About actual test of the present invention, be to represent with following three kinds of embodiment:
1, with the oxidation-resistant micro copper powder 10 (1000g) below 1 micron, ethyl cellulose 70g, B.C. solvent 70g, glass powder 20 (200g), bismuth meal end 40 (12g), zinc powder 50 (2g), and five oxygen, two vanadium 60 (0.2g), through three rollers, finish conductive paste 100 with oxidation-resistant micro copper powder, (temperature is 150 ℃ to the conductive paste 100 that will have the oxidation-resistant micro copper powder then with the printing of 8.0mm electrode diameter, drying 3 minutes) is coated on this external diameter 9.1mm, the potsherd of thick 1.44mm, insert again to burn and pay in the device 80 (nitrogen furnace), respectively with 540 ℃, 550 ℃, 560 ℃, the temperature of 570 ℃ and 580 ℃ is burnt and is paid, behind the tinned wire scolding tin of the electrode 90 of gained with diameter 0.6mm, that measures its lead adheres to (tension) intensity and electrical characteristic, and its test result is as shown in table 1.
Table 1
| A burning pair temperature (℃) | Static capacity C (PF) | Lure electric bulk diffusion tan δ (%) | Insulaion resistance IR (Ω) | Tensile strength (Kg) | Solderability |
| 540 | 4670 | 0.6 | 3×10 13 | ＞1.5 | Very |
| 550 | 4500 | 0.8 | 3×10 13 | ＞1.5 | Very |
| 560 | 4210 | 0.8 | 3×10 13 | ＞1.5 | Very |
| 570 | 4030 | 1.0 | 3×10 13 | ＞1.5 | Very |
| 580 | 3880 | 1.1 | 3×10 13 | ＞1.5 | Very |
* the scolding tin composition of lead is tin (99.5%) and copper (0.5%)
* solderability is can confirm between visualization electrode and scolding tin
2, with the oxidation-resistant micro copper powder 10 (1000g) below 1 micron, ethyl cellulose 70g, B.C. solvent 70g, glass powder 20 (200g), bismuth meal end 40 (12g), zinc powder 50 (2g), five oxygen, two vanadium 60 (0.2g), through three rollers, finish conductive paste 100 with oxidation-resistant micro copper powder, (temperature is 150 ℃ to the conductive paste 100 that then this is had an oxidation-resistant micro copper powder with the printing of 8.0mm electrode diameter, drying 3 minutes) is coated on this external diameter 9.85mm, the NTC of thick 1.9mm, insert again to burn and pay in the device 80 (nitrogen furnace), respectively with 450 ℃, the temperature of 480 ℃ and 500 ℃ is burnt and is paid, behind the tinned wire scolding tin of the electrode 90 of gained with diameter 0.6mm, that measures its lead adheres to (tension) intensity and electrical characteristic, and its test result is as shown in table 2.
Table 2
| A burning pair temperature (℃) | Opposing value (at25 ℃) | Lead intensity (kg) | Solderability |
| 450 | - | 1.0 | Can |
| 480 | 10.170 | ＞1.5 | Very |
| 500 | 10.034 | ＞1.5 | Very |
* Ag opposing value 9.341
3, with the oxidation-resistant micro copper powder 10 (1000g) below 1 micron, ethyl cellulose 70g, B.C. solvent 70g, glass powder 20 (200g), bismuth meal end 40 (12g), zinc powder 50 (2g), five oxygen, two vanadium 60 (0.5g), through three rollers, finish this copper conductive paste, (temperature is 150 ℃ with the printing of 8.0mm electrode diameter with this copper conductive paste then, drying 3 minutes) is coated on this external diameter 10.3mm, the zinc of thick 4.6mm, insert again to burn and pay in the device 80 (nitrogen furnace), respectively with 500 ℃, the temperature of 550 ℃ and 600 ℃ is burnt an electrode 90 of paying the back gained, behind the tinned wire scolding tin with diameter 0.6mm, that measures its lead adheres to (tension) intensity and electrical characteristic, and its test result is as shown in table 3.
Table 3
| A burning pair temperature (℃) | V b(1mA) | V a(10mA) | α | Lead intensity (kg) | Solderability |
| 500 | 1260 | 1320 | 56.2 | 0.8 | Can |
| 550 | 1198 | 1252 | 52.2 | ＞1.2 | Very |
| 600 | 1143 | 1199 | 48.7 | ＞2.0 | Very |
* V, the numerical value of α is the mean value of test 10 times
* the composition of lead is tin (99.5%) and copper (0.5%)
In sum, advantage of the present invention and effect can reduce:
1, prevents the fine copper powder oxidation.Because the outer surface of oxidation-resistant micro copper powder of the present invention has an oxidation barrier film, can avoid the oxidative phenomena of fine copper powder.
2, burning pair temperature is low.It is to pay the relative low temperature of temperature between 450 ℃ to 650 ℃ (compared to traditional 650 ℃ to 800 ℃) through burning to burn the process of paying and finish that the present invention adopts fine copper powder.Therefore, it is relatively low that burning is paid temperature, both saved the energy (power consumption is lower), and the interior material structure of more survivable passive component or electrical characteristic.
3, the scolding tin process can not reduce the electrical characteristic of product.The present invention does not have the situation that the thickness attenuation is taken place by scolder erosion (being commonly called as " erosion silver ") copper electrode in the scolding tin process, the hear resistance of adding copper itself is higher than silver-colored, therefore, can not reduce electrical characteristic, if product is an electric capacity, then its capacitance can not reduce.
4, cost is low.Therefore the price of copper, adopts the cost of the product of copper electrode must be lower than the conventional silver electrode far below silver.And the scolding tin composition in the scolding tin process is the noble metal of argentiferous and so on not, so whole totle drilling cost is low.
[annex one]
Picture A is that 20000 times image amplifies in fine copper powder of the present invention portion in microscopically
Photo B is that 10000 times image amplifies in fine copper powder of the present invention portion in microscopically.
Claims (3)
1. conductive paste with oxidation-resistant micro copper powder is characterized in that comprising:
One oxidation-resistant micro copper powder; Have a fine copper powder portion and an oxidation barrier film, this fine copper powder portion has the outer surface and an external diameter of an almost spherical, and this external diameter is less than 1 micron, and the composition of this oxidation barrier film is an ascorbic acid, and is attached to uniformly on this outer surface substantially;
One glass powder;
One resin solvent;
One bismuth meal end;
One zinc powder;
First Five-Year Plan oxygen two vanadium;
Wherein, this conductive paste with oxidation-resistant micro copper powder is to be used to carry out between 480 ℃ to 680 ℃ low temperature burn to pay and form an electrode.
2. the conductive paste with oxidation-resistant micro copper powder according to claim 1 is characterized in that: the composition of described oxidation barrier film comprises dibutyl hydroxy toluene (C again
15H
24O).
3. the conductive paste with oxidation-resistant micro copper powder according to claim 2 is characterized in that: described resin solvent is the ethyl cellulose acrylic resin.
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|---|---|---|---|
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| CN101486094B true CN101486094B (en) | 2010-12-29 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104021882B (en) * | 2014-06-12 | 2016-05-25 | 西安工程大学 | A kind of preparation method of low temperature copper electric slurry |
| JP6103126B1 (en) * | 2016-01-29 | 2017-03-29 | 東洋インキＳｃホールディングス株式会社 | Conductive composition, method for producing the same, and conductive material |
| CN105834418B (en) * | 2016-03-17 | 2018-01-05 | 西安工程大学 | The ethyl cellulose microcapsule processing method of copper powder in a kind of electric slurry |
| CN107088655B (en) * | 2016-07-01 | 2019-04-02 | 浏阳市科力烟花材料有限公司 | A kind of deactivating magnesium powder, passivation Al-Mg alloy powder and its wet process technique |
| CN114628162B (en) * | 2022-03-22 | 2023-11-28 | 中国科学院化学研究所 | High-performance supercapacitor based on nonporous conductive coordination polymer |
| CN114985730B (en) * | 2022-04-28 | 2024-04-30 | 中科铜都粉体新材料股份有限公司 | Preparation method of antioxidant copper powder |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049622A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | The surface treatment method of conductive copper powder |
| CN1858168A (en) * | 2005-05-08 | 2006-11-08 | 李远松 | Lipophilic nano copper powder lubricating repairing agent |
| CN1871332A (en) * | 2003-08-22 | 2006-11-29 | 维加奥尔斯有限公司 | Antioxidant and its use |
-
2008
- 2008-01-16 CN CN2008100520797A patent/CN101486094B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049622A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | The surface treatment method of conductive copper powder |
| CN1871332A (en) * | 2003-08-22 | 2006-11-29 | 维加奥尔斯有限公司 | Antioxidant and its use |
| CN1858168A (en) * | 2005-05-08 | 2006-11-08 | 李远松 | Lipophilic nano copper powder lubricating repairing agent |
Non-Patent Citations (1)
| Title |
|---|
| JP昭63-186803A 1988.08.02 |
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