CN101478709A - Ultrasonic sensor and loudspeaker - Google Patents
Ultrasonic sensor and loudspeaker Download PDFInfo
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- CN101478709A CN101478709A CNA2008102300679A CN200810230067A CN101478709A CN 101478709 A CN101478709 A CN 101478709A CN A2008102300679 A CNA2008102300679 A CN A2008102300679A CN 200810230067 A CN200810230067 A CN 200810230067A CN 101478709 A CN101478709 A CN 101478709A
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Abstract
The present invention relates to an ultrasonic sensor and a loudspeaker, and especially to a piezoelectric ceramic ultrasonic sensor and a loudspeaker system which uses the sensor for realizing directional propagation of sound wave. The ultrasonic sensor comprises an upper electrode layer, a piezoelectric ceramic layer, a lower electrode layer and a substrate. The substrate comprises a plurality of substrate cavities and substrate film units. The piezoelectric ceramic and substrate film units together form an ultrasonic vibrator. Under the function of driving signal, the vibrator generates longitudinal bending movement and further generates ultrasonic through air media. The ultrasonic loudspeaker comprises a signal processing module, a driver and an ultrasonic sensor. The signal processing module modulates the audio signal to the range of ultrasonic frequency. The ultrasonic sensor adopts the ultrasonic sensor of the invention. The ultrasonic sensor of the invention has the advantages of high directivity, small distortion, low cost, high conversion efficiency and suitability for lot manufacturing.
Description
Technical field
The present invention relates to a kind of ultrasonic sensor and loud speaker, especially a kind of piezoelectric ceramic ultrasound transducer and use this class transducer to realize the loudspeaker of sound wave direction propagation.
Background technology
Traditional loudspeaker is utilized electromagnetic force to drive tapered basin usually and is produced the piston motion, directly is coupled with air and sounds, and the sound wave that this class loud speaker is sent is multidirectional propagation.According to acoustic theory, frequency has higher directive property greater than the ultrasonic wave of 20 kilo hertzs (kHz), and along with the further raising of frequency, directive property is stronger; Acoustic pressure surpasses certain thresholding, and (for example: 120 decibels) sound wave is when propagating, and (for example: generation non-linear interaction air) causes the appearance of harmonic components with communication media in meeting; In addition, two kinds of first-harmonics (for example: f
1, f
2) aerial non-linear interaction, can produce (f
1-f
2) and (f
1+ f
2) two new components.Use these theories, some set about studying sound directional technology and relevant loudspeaker, for example, Yoncyama, Kamakura, Kumamoto, Aoki and Ikegaya have delivered one piece of paper, The AudioSpotlight:An application of nonlinear interaction of sound waves to anew type of loudspeaker design, J.Acoust.Soc.Am.73 (5), May 1983:pp1532-1536.This piece paper has been described an array of ultrasonic sensors, by 547 independently commercialization piezoelectric ceramic ultrasound sensor unit form, the resonance frequency of this class unit is approximately 40 kilo hertzs, its commercial use mostly is range finding and uses; In people's such as Yoneyama paper, the amplitude-modulated signal driving sensor produces frequency mixing ultrasonic ripple (20 kilo hertzs～60 kilo hertzs), interferes to demodulate common sound wave in air; Though this ultrasonic speaker can be realized voice directional spreading to a certain degree, very big distance is arranged with the practicability target that directive property is good, conversion efficiency is high, distortion is little.Reason is: (1) independently exists phase place and amplitude difference between sensor unit, and the sound distortion is serious, electro-acoustic conversion efficiency is low; (2) manufacturing and assembly technology complexity; (3) system is extremely huge, cost is high.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of ultrasonic sensor and loud speaker.
The technical solution adopted in the present invention is: ultrasonic sensor, have incorporate block piezoceramics film structure, and comprise upper electrode layer, piezoceramics layer, lower electrode layer and matrix with certain pattern; Described matrix comprises a lot of cavitys and matrix film unit, and the matrix film unit forms ultrasonic oscillator with piezoelectric ceramic, and under the drive signal effect, oscillator produces the buckling campaign and further produces ultrasonic wave by air medium.
A kind ofly be suitable for the manufacture method that ultrasonic sensor is produced in batches, comprise base cavity and matrix film unit and shake that row form, incorporate block piezoelectric ceramic piece and bond matrix, block piezoelectric ceramic piece attenuate, transducer upper electrode layer and electrode mode formation, cavity package several links; It is characterized in that obtaining piezoceramics film by incorporate block piezoelectric ceramic bonding, chemico-mechanical polishing reduction process; Described piezoceramics film forms ultrasonic oscillator with the matrix film.
A kind of ultrasonic speaker comprises signal processing module, driver and aforesaid ultrasonic sensor; Described signal processing module is modulated to the frequency range greater than 40 kilo hertzs to audio signal (20 hertz～20 kilo hertzs); Described modulation system adopts frequency and phase place hybrid modulation.
Transducer directive property height of the present invention, distortion is little, cost is low, conversion efficiency is high, be suitable for making in batches.
Description of drawings
Fig. 1 (A) is a ultrasonic sensor schematic three dimensional views of the present invention.
Fig. 1 (B) is a ultrasonic sensor schematic cross-section of the present invention.
Among the figure: the 11st, sensor unit, the 12nd, upper electrode layer, the 13rd, piezoceramics layer, the 14th, lower electrode layer band, the 15th, matrix, the 16th, bonnet, the 17th, base cavity, the 18th, matrix film unit.
Fig. 2 is a ultrasonic sensor manufacturing process flow diagram of the present invention.
Among the figure: the 21st, block piezoelectric ceramic piece, the 22nd, its top electrode, the 23rd, its bottom electrode.
Fig. 3 is a ultrasonic wave loudspeaker of utilizing ultrasonic sensor of the present invention to form.
Among the figure: the 31st, signal processing module, the 32nd, driver, the 33rd, frequency mixing ultrasonic ripple signal.
Embodiment
As shown in Figure 1, ultrasonic sensor 1 of the present invention is an integrated array that comprises 25 sensor units 11.For the ultrasonic sensor of reality, more element number can be arranged, and the shape of unit can be circular, square and other shapes, and the arrangement of unit can be the matrix form of rule, also can be arranged in together by the cellular architecture mode of compactness.Sensor construction is made up of upper electrode layer 12, piezoceramics layer 13, lower electrode layer 14, matrix 15, bonnet 16.Each sensor unit 11 has a top electrode, and all top electrodes link together, and forms unique electrode mode, and as an input terminal of transducer, and incorporate lower electrode layer 14 is as another input terminal of transducer.Piezoceramics layer 13 is incorporate structures, and it is different from traditional array of ultrasonic sensors of being made up of independent piezoelectric ceramic unit.In addition, piezoceramics layer 13 is formed by the block piezoceramics film, it is different from the deposition or the sputter piezoceramics film of disclosed based semiconductor or MEMS technology, the shortcoming of semiconductor or MEMS deposition sputtering technology is: (1) piezoelectric membrane need just can present piezoelectric effect through Overheating Treatment (greater than 500 ℃), polarization, high like this temperature can be induced a lot of stress, thereby influences the reliability and the performance of device; (2) deposition process complexity, for the thickness (greater than 1.5 microns) that increases piezoelectric membrane, often therefore repeatedly repeated deposition, this process of heat treatment, expect that uniform, flawless piezoelectric membrane is not an easy thing.Matrix 15 comprises cavity 17, and the cavity top is a matrix film unit 18, and the bottom is sealed by bonnet 16.Piezoelectric ceramic wafer bonds on the matrix film unit 18, forms ultrasonic oscillator, and under the drive signal effect, oscillator produces the buckling campaign and further produces ultrasonic wave by air medium.The resonance frequency of transducer can be mediated by piezoelectric membrane thickness, matrix film thickness, base cavity size, forms frequency and is higher than 40 kilo hertzs, bandwidth is adjustable, electro-acoustic conversion efficiency is high all kinds of ultrasonic sensors.
Fig. 2 is ultrasonic sensor manufacture method of the present invention and technological process, and the step that mainly comprises is: (1) matrix 15 stocks are prepared.Basis material can be a metal, and preferably steel or aluminium also can be plastics or semiconductor silicon; (2) base cavity 17 forms.Can be by all kinds of cut or the punch process that is suitable for making in batches make the base cavity unit of metal species, the base cavity unit of plastics class can be made by injection mo(u)lding or gas assistant injection molding, the base cavity unit of peninsula body class can be made by the MEMS etching process; (3) bonding of block piezoelectric ceramic piece 21 and matrix.The present invention adopts commercial block piezoelectric ceramic piece 21 (thickness range: 100 microns～500 microns), these potsherd reliability height, performance good (piezoelectricity conversion coefficient height), be bonded on the matrix after, need not any material heat treatment.Commercial block piezoelectric ceramic piece 21 comprises top electrode 22 and bottom electrode 23 usually, and electrode material is generally the electric conductivity good metal, for example: platinum, copper, aluminium, titanium and alloy thereof.Tack coat is very thin, does not show here; (4) block piezoelectric ceramic piece 21 attenuates.In order to improve Oscillation Amplitude and transducer electroacoustic conversion efficiency, thick block piezoelectric ceramic need be thinned.The present invention adopts CMP (Chemical Mechanical Polishing) process accurately, effectively to control the thickness of potsherd, forms final function piezoelectric transducer film 13; (5) transducer upper electrode layer 12 and electrode mode form.The piezoceramics film surface of attenuate is formed new electrode layer and electrode mode by further sputter; (6) cavity package.In order to prevent ultrasonic wave two-way propagation and improve electro-acoustic conversion efficiency that a bonnet 16 is glued on the matrix, forms the transducer backside cavity of sealing.Cavity can comprise air, also can be vacuum.Transducer with vacuum back cavity, its electro-acoustic conversion efficiency was improved by a nearly step.
Fig. 3 is a ultrasonic speaker 3 of the present invention, mainly comprises signal processing module 31, driver 32 and foregoing ultrasonic sensor 1; Described signal processing module is modulated to ultrasonic frequency range (greater than 40 kilo hertzs) to audio signal (20 hertz～20 kilo hertzs); Described modulation system adopts frequency and phase place hybrid modulation.
Ultrasonic electrical signal is launched the frequency mixing ultrasonic ripple signal 33 that has than high directivity by high-voltage drive 32 driving sensors 1, and the audible sound that these signals demodulate in air borne gradually also therefore has directivity, realizes the sound wave direction propagation.In other disclosed ultrasonic speakers, institute's ultrasonic waves transmitted all comprises 20 kilo hertzs～40 kilo hertzs frequency content basically, so directive property is low, and they often adopt the method that increases array area to overcome this shortcoming.Loud speaker of the present invention, ultrasonic waves transmitted, frequency range is greater than 40 kilo hertzs, so directive property height, in addition, incorporate structure and manufacturing process, uniform sensor unit guarantee that transducer has higher electro-acoustic conversion efficiency, make the directional loudspeaker of development of miniaturized become possibility, the application target of this class ultrasonic speaker is to be equipped with all kinds of miniaturizations and mobile electronic product.
Claims (5)
1. a ultrasonic sensor comprises upper electrode layer (12), piezoceramics layer (13), lower electrode layer (14) and matrix (15); Described matrix comprises a lot of base cavity and matrix film unit; Described piezoelectric ceramic forms ultrasonic oscillator with the matrix film unit, and under the drive signal effect, oscillator produces the buckling campaign and further produces ultrasonic wave by air medium.
2. ultrasonic sensor as claimed in claim 1 is characterized in that: piezoceramics layer (13) is incorporate block piezoceramics film.
3. ultrasonic sensor manufacturing process flow, comprise and shake base cavity and matrix film unit row form, incorporate block piezoelectric ceramic piece forms with bond matrix, block piezoelectric ceramic piece attenuate, transducer upper electrode layer and electrode mode, the cavity package several links, it is characterized in that: by incorporate block piezoelectric ceramic bond, the chemico-mechanical polishing reduction process obtains piezoceramics film; Described piezoceramics film forms ultrasonic oscillator with the matrix film.
4. a ultrasonic speaker comprises signal processing module (31), driver (32) and ultrasonic sensor; Described signal processing module is modulated to the ultrasonic frequency scope to audio signal; Described ultrasonic sensor adopts piezoelectric ceramic ultrasound transducer as claimed in claim 1.
5. ultrasonic speaker as claimed in claim 4 is characterized in that: the mixing ultrasonic frequency of being launched is greater than 40 kilo hertzs; Used signal modulation system is frequency and phase place hybrid modulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102300679A CN101478709A (en) | 2008-12-20 | 2008-12-20 | Ultrasonic sensor and loudspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102300679A CN101478709A (en) | 2008-12-20 | 2008-12-20 | Ultrasonic sensor and loudspeaker |
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| CN101478709A true CN101478709A (en) | 2009-07-08 |
Family
ID=40839331
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|---|---|---|---|
| CNA2008102300679A Pending CN101478709A (en) | 2008-12-20 | 2008-12-20 | Ultrasonic sensor and loudspeaker |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106353404A (en) * | 2016-08-10 | 2017-01-25 | 上海交通大学 | Test specimen and method applicable to testing material constants of film by aid of ultrasonic resonance spectrum processes |
| CN106872570A (en) * | 2017-01-26 | 2017-06-20 | 华南理工大学 | A kind of method that multidirectional controllable male part detects surface of solids defect |
| CN107113510A (en) * | 2014-12-24 | 2017-08-29 | 株式会社村田制作所 | Ultrasonic sensor |
| CN107371097A (en) * | 2017-08-30 | 2017-11-21 | 京东方科技集团股份有限公司 | The method that intellectuality provides a user voice prompt |
| CN110234056A (en) * | 2019-06-21 | 2019-09-13 | 京东方科技集团股份有限公司 | Energy converter and preparation method thereof, transducing head |
| CN110830893A (en) * | 2019-09-30 | 2020-02-21 | 成都泰声科技有限公司 | Transparent screen directional ultrasonic loudspeaker |
| WO2020124558A1 (en) * | 2018-12-21 | 2020-06-25 | 深圳先进技术研究院 | Microfluidic system and operating method therefor |
| CN111346292A (en) * | 2018-12-21 | 2020-06-30 | 深圳先进技术研究院 | Microfluidic system and method of operating the same |
| CN111510819A (en) * | 2019-09-30 | 2020-08-07 | 成都泰声科技有限公司 | Ultrasonic loudspeaker system and working method thereof |
| CN112449275A (en) * | 2019-09-03 | 2021-03-05 | 贵阳清文云科技有限公司 | Directional audio system based on flexible membrane |
-
2008
- 2008-12-20 CN CNA2008102300679A patent/CN101478709A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107113510A (en) * | 2014-12-24 | 2017-08-29 | 株式会社村田制作所 | Ultrasonic sensor |
| CN107113510B (en) * | 2014-12-24 | 2019-09-24 | 株式会社村田制作所 | Ultrasonic sensor |
| CN106353404A (en) * | 2016-08-10 | 2017-01-25 | 上海交通大学 | Test specimen and method applicable to testing material constants of film by aid of ultrasonic resonance spectrum processes |
| CN106353404B (en) * | 2016-08-10 | 2019-10-08 | 上海交通大学 | The test method of the sample of thin-film material constant is surveyed suitable for ultrasonic resonance spectrometry |
| CN106872570A (en) * | 2017-01-26 | 2017-06-20 | 华南理工大学 | A kind of method that multidirectional controllable male part detects surface of solids defect |
| CN106872570B (en) * | 2017-01-26 | 2023-04-21 | 华南理工大学 | Method for detecting solid surface defects by using multidirectional controllable coupling piece |
| CN107371097A (en) * | 2017-08-30 | 2017-11-21 | 京东方科技集团股份有限公司 | The method that intellectuality provides a user voice prompt |
| GB2592450A (en) * | 2018-12-21 | 2021-09-01 | Shenzhen Institudes Of Advanced Tech | Microfluidic system and operating method therefor |
| GB2592450B (en) * | 2018-12-21 | 2023-08-02 | Shenzhen Institudes Of Advanced Tech | Microfluidic system and operating method therefor |
| WO2020124558A1 (en) * | 2018-12-21 | 2020-06-25 | 深圳先进技术研究院 | Microfluidic system and operating method therefor |
| CN111346292A (en) * | 2018-12-21 | 2020-06-30 | 深圳先进技术研究院 | Microfluidic system and method of operating the same |
| CN110234056A (en) * | 2019-06-21 | 2019-09-13 | 京东方科技集团股份有限公司 | Energy converter and preparation method thereof, transducing head |
| CN110234056B (en) * | 2019-06-21 | 2021-01-12 | 京东方科技集团股份有限公司 | Transducer, preparation method thereof and transducer device |
| CN112449275A (en) * | 2019-09-03 | 2021-03-05 | 贵阳清文云科技有限公司 | Directional audio system based on flexible membrane |
| CN112449275B (en) * | 2019-09-03 | 2022-08-02 | 贵阳清文云科技有限公司 | Directional audio system based on flexible membrane |
| CN111510819A (en) * | 2019-09-30 | 2020-08-07 | 成都泰声科技有限公司 | Ultrasonic loudspeaker system and working method thereof |
| CN110830893A (en) * | 2019-09-30 | 2020-02-21 | 成都泰声科技有限公司 | Transparent screen directional ultrasonic loudspeaker |
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Application publication date: 20090708 |